CN1282981A - 湿处理装置 - Google Patents
湿处理装置 Download PDFInfo
- Publication number
- CN1282981A CN1282981A CN00120809A CN00120809A CN1282981A CN 1282981 A CN1282981 A CN 1282981A CN 00120809 A CN00120809 A CN 00120809A CN 00120809 A CN00120809 A CN 00120809A CN 1282981 A CN1282981 A CN 1282981A
- Authority
- CN
- China
- Prior art keywords
- wafer
- cartridge unit
- wet treater
- liquid
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP214212/1999 | 1999-07-28 | ||
JP21421299A JP3341727B2 (ja) | 1999-07-28 | 1999-07-28 | ウエット装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1282981A true CN1282981A (zh) | 2001-02-07 |
Family
ID=16652091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN00120809A Pending CN1282981A (zh) | 1999-07-28 | 2000-07-27 | 湿处理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3341727B2 (ja) |
KR (1) | KR20010049878A (ja) |
CN (1) | CN1282981A (ja) |
TW (1) | TW449816B (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100377799C (zh) * | 2005-06-22 | 2008-04-02 | 中国科学院上海光学精密机械研究所 | 超声清洗夹具 |
CN100437218C (zh) * | 2003-06-19 | 2008-11-26 | 三星电子株式会社 | 基底处理装置 |
CN101610641B (zh) * | 2008-06-19 | 2011-06-29 | 富葵精密组件(深圳)有限公司 | 湿处理***及湿处理方法 |
CN101001704B (zh) * | 2004-06-14 | 2016-01-20 | Fsi国际公司 | 在一个或多个晶片上带出流体及随后干燥处理的***和方法 |
CN110813805A (zh) * | 2019-11-15 | 2020-02-21 | 陈嘉斌 | 一种钢板表面油污清洁设备 |
CN113290466A (zh) * | 2021-04-26 | 2021-08-24 | 高兵 | 一种半导体晶圆打磨清洗装置 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100710805B1 (ko) | 2006-02-06 | 2007-04-23 | 삼성전자주식회사 | 반도체 소자 제조에 사용되는 기판 세정 장치 및 방법 |
US8580042B2 (en) | 2007-12-10 | 2013-11-12 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
US20120189421A1 (en) * | 2011-01-21 | 2012-07-26 | Samsung Austin Semiconductor, L.P. | Parallel multi wafer axial spin clean processing using spin cassette inside movable process chamber |
KR101394456B1 (ko) * | 2011-09-30 | 2014-05-15 | 세메스 주식회사 | 기판처리장치 및 기판처리방법 |
JP6265631B2 (ja) | 2013-06-14 | 2018-01-24 | キヤノン株式会社 | 情報処理装置、情報処理装置の制御方法、及びプログラム |
JP2022138907A (ja) * | 2021-03-11 | 2022-09-26 | キオクシア株式会社 | 基板洗浄装置および基板洗浄方法 |
CN114789177B (zh) * | 2022-04-02 | 2024-07-16 | 蚌埠高华电子股份有限公司 | 一种tft-lcd玻璃基板蚀刻浸泡漂洗装置及方法 |
-
1999
- 1999-07-28 JP JP21421299A patent/JP3341727B2/ja not_active Expired - Fee Related
-
2000
- 2000-07-25 KR KR1020000042838A patent/KR20010049878A/ko active IP Right Grant
- 2000-07-27 CN CN00120809A patent/CN1282981A/zh active Pending
- 2000-07-28 TW TW089115208A patent/TW449816B/zh not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100437218C (zh) * | 2003-06-19 | 2008-11-26 | 三星电子株式会社 | 基底处理装置 |
CN101001704B (zh) * | 2004-06-14 | 2016-01-20 | Fsi国际公司 | 在一个或多个晶片上带出流体及随后干燥处理的***和方法 |
CN100377799C (zh) * | 2005-06-22 | 2008-04-02 | 中国科学院上海光学精密机械研究所 | 超声清洗夹具 |
CN101610641B (zh) * | 2008-06-19 | 2011-06-29 | 富葵精密组件(深圳)有限公司 | 湿处理***及湿处理方法 |
CN110813805A (zh) * | 2019-11-15 | 2020-02-21 | 陈嘉斌 | 一种钢板表面油污清洁设备 |
CN113290466A (zh) * | 2021-04-26 | 2021-08-24 | 高兵 | 一种半导体晶圆打磨清洗装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20010049878A (ko) | 2001-06-15 |
JP2001044106A (ja) | 2001-02-16 |
JP3341727B2 (ja) | 2002-11-05 |
TW449816B (en) | 2001-08-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |