CN1282981A - 湿处理装置 - Google Patents

湿处理装置 Download PDF

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Publication number
CN1282981A
CN1282981A CN00120809A CN00120809A CN1282981A CN 1282981 A CN1282981 A CN 1282981A CN 00120809 A CN00120809 A CN 00120809A CN 00120809 A CN00120809 A CN 00120809A CN 1282981 A CN1282981 A CN 1282981A
Authority
CN
China
Prior art keywords
wafer
cartridge unit
wet treater
liquid
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN00120809A
Other languages
English (en)
Chinese (zh)
Inventor
松井淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of CN1282981A publication Critical patent/CN1282981A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN00120809A 1999-07-28 2000-07-27 湿处理装置 Pending CN1282981A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP214212/1999 1999-07-28
JP21421299A JP3341727B2 (ja) 1999-07-28 1999-07-28 ウエット装置

Publications (1)

Publication Number Publication Date
CN1282981A true CN1282981A (zh) 2001-02-07

Family

ID=16652091

Family Applications (1)

Application Number Title Priority Date Filing Date
CN00120809A Pending CN1282981A (zh) 1999-07-28 2000-07-27 湿处理装置

Country Status (4)

Country Link
JP (1) JP3341727B2 (ja)
KR (1) KR20010049878A (ja)
CN (1) CN1282981A (ja)
TW (1) TW449816B (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100377799C (zh) * 2005-06-22 2008-04-02 中国科学院上海光学精密机械研究所 超声清洗夹具
CN100437218C (zh) * 2003-06-19 2008-11-26 三星电子株式会社 基底处理装置
CN101610641B (zh) * 2008-06-19 2011-06-29 富葵精密组件(深圳)有限公司 湿处理***及湿处理方法
CN101001704B (zh) * 2004-06-14 2016-01-20 Fsi国际公司 在一个或多个晶片上带出流体及随后干燥处理的***和方法
CN110813805A (zh) * 2019-11-15 2020-02-21 陈嘉斌 一种钢板表面油污清洁设备
CN113290466A (zh) * 2021-04-26 2021-08-24 高兵 一种半导体晶圆打磨清洗装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100710805B1 (ko) 2006-02-06 2007-04-23 삼성전자주식회사 반도체 소자 제조에 사용되는 기판 세정 장치 및 방법
US8580042B2 (en) 2007-12-10 2013-11-12 Acm Research (Shanghai) Inc. Methods and apparatus for cleaning semiconductor wafers
US20120189421A1 (en) * 2011-01-21 2012-07-26 Samsung Austin Semiconductor, L.P. Parallel multi wafer axial spin clean processing using spin cassette inside movable process chamber
KR101394456B1 (ko) * 2011-09-30 2014-05-15 세메스 주식회사 기판처리장치 및 기판처리방법
JP6265631B2 (ja) 2013-06-14 2018-01-24 キヤノン株式会社 情報処理装置、情報処理装置の制御方法、及びプログラム
JP2022138907A (ja) * 2021-03-11 2022-09-26 キオクシア株式会社 基板洗浄装置および基板洗浄方法
CN114789177B (zh) * 2022-04-02 2024-07-16 蚌埠高华电子股份有限公司 一种tft-lcd玻璃基板蚀刻浸泡漂洗装置及方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100437218C (zh) * 2003-06-19 2008-11-26 三星电子株式会社 基底处理装置
CN101001704B (zh) * 2004-06-14 2016-01-20 Fsi国际公司 在一个或多个晶片上带出流体及随后干燥处理的***和方法
CN100377799C (zh) * 2005-06-22 2008-04-02 中国科学院上海光学精密机械研究所 超声清洗夹具
CN101610641B (zh) * 2008-06-19 2011-06-29 富葵精密组件(深圳)有限公司 湿处理***及湿处理方法
CN110813805A (zh) * 2019-11-15 2020-02-21 陈嘉斌 一种钢板表面油污清洁设备
CN113290466A (zh) * 2021-04-26 2021-08-24 高兵 一种半导体晶圆打磨清洗装置

Also Published As

Publication number Publication date
KR20010049878A (ko) 2001-06-15
JP2001044106A (ja) 2001-02-16
JP3341727B2 (ja) 2002-11-05
TW449816B (en) 2001-08-11

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Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication