CN1276804C - Improvements in drying and cleaning objects using controlled aerosols and gases - Google Patents
Improvements in drying and cleaning objects using controlled aerosols and gases Download PDFInfo
- Publication number
- CN1276804C CN1276804C CNB998170127A CN99817012A CN1276804C CN 1276804 C CN1276804 C CN 1276804C CN B998170127 A CNB998170127 A CN B998170127A CN 99817012 A CN99817012 A CN 99817012A CN 1276804 C CN1276804 C CN 1276804C
- Authority
- CN
- China
- Prior art keywords
- sealing chamber
- selected liquid
- liquid
- further characterized
- flushing liquor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000443 aerosol Substances 0.000 title claims abstract description 87
- 238000001035 drying Methods 0.000 title claims abstract description 18
- 238000004140 cleaning Methods 0.000 title claims abstract description 17
- 239000007789 gas Substances 0.000 title claims description 30
- 230000006872 improvement Effects 0.000 title description 8
- 239000007788 liquid Substances 0.000 claims abstract description 196
- 238000011010 flushing procedure Methods 0.000 claims abstract description 90
- 239000002245 particle Substances 0.000 claims abstract description 66
- 239000011261 inert gas Substances 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 40
- 238000001914 filtration Methods 0.000 claims abstract description 12
- 230000008569 process Effects 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 claims description 48
- 239000000356 contaminant Substances 0.000 claims description 18
- 239000012530 fluid Substances 0.000 claims description 12
- 230000008859 change Effects 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 5
- 238000005265 energy consumption Methods 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 230000008676 import Effects 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- PFTIVKCRALCOLB-UHFFFAOYSA-N [SiH4].[N] Chemical compound [SiH4].[N] PFTIVKCRALCOLB-UHFFFAOYSA-N 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 239000011343 solid material Substances 0.000 claims 4
- 230000036962 time dependent Effects 0.000 claims 4
- 238000006243 chemical reaction Methods 0.000 claims 2
- 239000000126 substance Substances 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 9
- 239000012535 impurity Substances 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000008187 granular material Substances 0.000 abstract 4
- 239000006185 dispersion Substances 0.000 abstract 1
- 238000007790 scraping Methods 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 238000012545 processing Methods 0.000 description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 8
- 238000009834 vaporization Methods 0.000 description 7
- 230000008016 vaporization Effects 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 229910002091 carbon monoxide Inorganic materials 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000010926 purge Methods 0.000 description 4
- 235000013339 cereals Nutrition 0.000 description 3
- 239000008263 liquid aerosol Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 229960004624 perflexane Drugs 0.000 description 2
- ZJIJAJXFLBMLCK-UHFFFAOYSA-N perfluorohexane Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F ZJIJAJXFLBMLCK-UHFFFAOYSA-N 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000002000 scavenging effect Effects 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 229920000544 Gore-Tex Polymers 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000009469 supplementation Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/002—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being a degassed liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Coating Apparatus (AREA)
- Drying Of Solid Materials (AREA)
- Special Spraying Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Nozzles (AREA)
Abstract
Description
Particle size | Before the chemical squeegeeing | Behind the chemical squeegeeing |
0.329-0.517μm 0.518-0.810 0.811-1.270 1.271-1.990 1.991-3.130 3.131-4.910 | 8 7 7 3 6 6 | 7 2 2 1 1 0 |
Claims (41)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US1999/023749 WO2001026830A1 (en) | 1999-10-12 | 1999-10-12 | Improvements in drying and cleaning objects using controlled aerosols and gases |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1398206A CN1398206A (en) | 2003-02-19 |
CN1276804C true CN1276804C (en) | 2006-09-27 |
Family
ID=22273794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB998170127A Expired - Fee Related CN1276804C (en) | 1999-10-12 | 1999-10-12 | Improvements in drying and cleaning objects using controlled aerosols and gases |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1235653A1 (en) |
JP (1) | JP2003517917A (en) |
KR (1) | KR100604458B1 (en) |
CN (1) | CN1276804C (en) |
AU (1) | AU1110400A (en) |
WO (1) | WO2001026830A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7051743B2 (en) * | 2002-10-29 | 2006-05-30 | Yong Bae Kim | Apparatus and method for cleaning surfaces of semiconductor wafers using ozone |
JP4007980B2 (en) * | 2004-07-15 | 2007-11-14 | エス・イー・エス株式会社 | Substrate drying method and substrate drying apparatus |
TWI286796B (en) * | 2004-12-14 | 2007-09-11 | Sez Ag | Apparatus and method for drying disk-shaped substrates |
JP4807045B2 (en) * | 2005-11-21 | 2011-11-02 | パナソニック電工株式会社 | Range hood with mist cleaning device |
DE102006037087A1 (en) * | 2006-08-07 | 2008-02-14 | Accel Instruments Gmbh | Cleaning inner surfaces of high frequency resonators, employs surface tension-reducing drying fluid, in which cleaning fluid is soluble |
JP5261077B2 (en) | 2008-08-29 | 2013-08-14 | 大日本スクリーン製造株式会社 | Substrate cleaning method and substrate cleaning apparatus |
CN102233310A (en) * | 2010-04-20 | 2011-11-09 | 鸿富锦精密工业(深圳)有限公司 | Immersion type coating device |
US9174249B2 (en) * | 2012-12-12 | 2015-11-03 | Lam Research Corporation | Ultrasonic cleaning method and apparatus therefore |
JP5680699B2 (en) * | 2013-04-25 | 2015-03-04 | 株式会社Screenホールディングス | Substrate cleaning method and substrate cleaning apparatus |
JP2020203269A (en) * | 2019-06-18 | 2020-12-24 | 合同会社アイル・Mtt | Bubble scattering inhibitor and method for using the same |
CN117153713B (en) * | 2023-10-25 | 2024-02-02 | 江苏惠达电子科技有限责任公司 | Method, system and equipment control method for detecting residual pollutants of frequency components |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4982753A (en) * | 1983-07-26 | 1991-01-08 | National Semiconductor Corporation | Wafer etching, cleaning and stripping apparatus |
US4850534A (en) * | 1987-05-30 | 1989-07-25 | Tdk Corporation | Ultrasonic wave nebulizer |
US5186192A (en) * | 1990-12-14 | 1993-02-16 | Shin-Etsu Handotai Co., Ltd. | Apparatus for cleaning silicon wafer |
JP3347814B2 (en) * | 1993-05-17 | 2002-11-20 | 大日本スクリーン製造株式会社 | Substrate cleaning / drying processing method and processing apparatus |
US5571337A (en) * | 1994-11-14 | 1996-11-05 | Yieldup International | Method for cleaning and drying a semiconductor wafer |
JP3464843B2 (en) * | 1995-03-30 | 2003-11-10 | 大日本スクリーン製造株式会社 | Substrate processing method and substrate processing apparatus in substrate processing apparatus |
JP3504023B2 (en) * | 1995-05-26 | 2004-03-08 | 株式会社ルネサステクノロジ | Cleaning device and cleaning method |
US5685086A (en) * | 1995-06-07 | 1997-11-11 | Ferrell; Gary W. | Method and apparatus for drying objects using aerosols |
JPH0969509A (en) * | 1995-09-01 | 1997-03-11 | Matsushita Electron Corp | Cleaning/etching/drying system for semiconductor wafer and using method thereof |
US5954911A (en) * | 1995-10-12 | 1999-09-21 | Semitool, Inc. | Semiconductor processing using vapor mixtures |
JP3369418B2 (en) * | 1996-11-25 | 2003-01-20 | 大日本スクリーン製造株式会社 | Ultrasonic vibrator, ultrasonic cleaning nozzle, ultrasonic cleaning device, substrate cleaning device, substrate cleaning processing system, and ultrasonic cleaning nozzle manufacturing method |
-
1999
- 1999-10-12 EP EP99954861A patent/EP1235653A1/en not_active Withdrawn
- 1999-10-12 AU AU11104/00A patent/AU1110400A/en not_active Abandoned
- 1999-10-12 KR KR1020027004730A patent/KR100604458B1/en not_active IP Right Cessation
- 1999-10-12 WO PCT/US1999/023749 patent/WO2001026830A1/en active IP Right Grant
- 1999-10-12 JP JP2001529882A patent/JP2003517917A/en active Pending
- 1999-10-12 CN CNB998170127A patent/CN1276804C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2003517917A (en) | 2003-06-03 |
CN1398206A (en) | 2003-02-19 |
EP1235653A1 (en) | 2002-09-04 |
KR100604458B1 (en) | 2006-07-26 |
KR20020068034A (en) | 2002-08-24 |
WO2001026830A1 (en) | 2001-04-19 |
AU1110400A (en) | 2001-04-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SEZ AMERICA CO.,LTD. Free format text: FORMER OWNER: FERRELL GARY W. Effective date: 20041001 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20041001 Address after: Arizona, USA Applicant after: Gary W. Ferrell Address before: American California Applicant before: Gary W. Ferrell |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEZ STOCK CO., LTD. Free format text: FORMER OWNER: SEZ AMERICA CO.,LTD. Effective date: 20071109 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20071109 Address after: Villach Patentee after: SEZ AG Address before: Arizona, USA Patentee before: Gary W. Ferrell |
|
C56 | Change in the name or address of the patentee |
Owner name: LAM RESEARCH CO., LTD. Free format text: FORMER NAME: SEZ CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Villach Patentee after: Sez AG Address before: Villach Patentee before: SEZ AG |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060927 Termination date: 20131012 |