CN1270303A - Heat radiator and its manufacture method - Google Patents
Heat radiator and its manufacture method Download PDFInfo
- Publication number
- CN1270303A CN1270303A CN 99116137 CN99116137A CN1270303A CN 1270303 A CN1270303 A CN 1270303A CN 99116137 CN99116137 CN 99116137 CN 99116137 A CN99116137 A CN 99116137A CN 1270303 A CN1270303 A CN 1270303A
- Authority
- CN
- China
- Prior art keywords
- substrate
- radiating fin
- heat
- base plate
- manufacture method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat radiator is composed of a flat bottom plate made of aluminium with many convex piles, continuous wave-shaped heat-radiating finned plates made of aluminium with fin plates at intervals and perforated bottom partition, and heat-conducting paste uniformly coated on bottom of partition. When the heat radiator is assembled, the convex piles one flate bottom plate pass through the holes on partition of heat-radiating finned plate, and then the convex piles are punched to link them firmly. The heat-conducting paste may be full of the gap between bottom plate and partition for effectively radiating the heat sucked from bottom plate by finned plate.
Description
The present invention is relevant a kind of heat abstractor and manufacture method thereof, is meant the heat abstractor and the manufacture method thereof of a kind of radiating fin and base plate combining structure especially.
Along with the consumed power increase of computer cpu (CPU), heat dissipation problem is also obvious day by day, and existing solution is to set up a heat abstractor on CPU.This heat abstractor can be divided into two types, and a kind of is by behind the aluminium block extrusion forming, forms several dissipation fins by profile groove again.The shortcoming of this technology is Heavy Weight, the processed complex of heat abstractor and produces a large amount of waste materials.
Another kind of type is after bending one aluminium sheet becomes the radiating fin of continuous wave-like, via resin (epoxy) radiating fin to be adhered on the flat base plate again.The shortcoming of this technology is that resin needs one period considerable time just can solidify (curing), makes Production Time increase, and is very uneconomical.Moreover resin cost height makes the cost of entire heat dissipation device also improve relatively, moreover resin can make radiating fin to be attached on the base plate securely because of rotten and reduce original adhesion effect in use for some time.
The object of the present invention is to provide a kind of heat abstractor, have advantages such as cost is low, in light weight, waste material is few.
Another object of the present invention is to provide a kind of heat abstractor, its radiating fin can be fast, be attached on the base plate securely.
A further object of the present invention is to provide a heat abstractor, and its radiating fin can seamlessly join with base plate, and the heat that base plate is absorbed can be distributed by radiating fin effectively.
Technical scheme of the present invention is: heat abstractor of the present invention has the flat base plate and the wavy radiating fin that is installed on the base plate that are formed with most projections.This radiating fin has the ㄇ shape heat sink of space and is formed with most bottom baffles in order to the hole of admitting projection, and this projection top is to be stamped to form the mushroom head and dividing plate and base plate are bonded together securely.Heat-conducting cream (thermalgrease) is coated between base plate and dividing plate, and radiating fin and base plate tight ground are engaged, and so, can be passed to effectively on the radiating fin and be distributed by ㄇ shape heat sink by the heat that base plate absorbed.
Other direction of the present invention is to provide a kind of manufacture method to form above-mentioned heat abstractor, and this manufacture method may further comprise the steps:
The first step forms a continuous wavy radiating fin, and it has the ㄇ shape heat sink and the bottom baffles of space;
In second step, on bottom baffles, form most holes;
The 3rd step, coated with thermally conductive cream on the bottom surface of bottom baffles (thermal grease);
In the 4th step, formation one has the base plate of most projections;
In the 5th step, the installing radiating fin and makes projection pass hole on the dividing plate to base plate;
In the 6th step, this projection of punching press links together radiating fin and base plate securely, and makes the space of heat-conducting cream filling between between base plate and dividing plate, and radiating fin and base plate tight ground are engaged.
Heat abstractor of the present invention and manufacture method thereof, can overcome shortcoming of the prior art, have advantages such as cost is low, in light weight, waste material is few, and in manufacture process, radiating fin can be attached on the base plate fast, securely, and radiating fin and base plate can seamlessly engage, and therefore, can be distributed by radiating fin effectively by the heat that base plate absorbed.
Fig. 1 is the three-dimensional exploded view of the heat abstractor of first embodiment of the invention.
Fig. 2 is the cutaway view along the 2-2 hatching line of Fig. 1, and wherein, the bottom of radiating fin is coated with heat-conducting cream.
Fig. 3 is the cutaway view that is same as Fig. 2, be installed up on the base plate in order to show this radiating fin, and drift will be to the projection punch process on the base plate.
Fig. 4 is another cutaway view that is same as Fig. 2, after being stamped in order to the projection on the display backpanel radiating fin and base plate are linked together securely, and heat-conducting cream fills up the space between between radiating fin and base plate.
Fig. 5 is the isometric exploded view of the heat abstractor of second embodiment of the invention.
Fig. 6 is a cutaway view, be installed up on the base plate in order to show radiating fin and rivet, and drift will be to the rivet punch process.
Fig. 7 is a cross section view, in order to show after rivet is stamped radiating fin and base plate are linked together securely, and heat-conducting cream fills up the space between between radiating fin and base plate.
Fig. 8 is the isometric exploded view of the heat abstractor of third embodiment of the invention.
Fig. 9 is the isometric exploded view of the heat abstractor of fourth embodiment of the invention.
The invention will be further described below in conjunction with drawings and Examples.Wherein in the present embodiment explanation, different illustrated same numerals are represented components identical.
Referring to figs. 1 to Fig. 4, be heat abstractor 1 according to first embodiment of the invention, it comprises one via a bending formed continuous wavy radiating fin 10 of metallic plate (aluminium sheet) and a flat metal base plate 20 (aluminium sheet).This heat radiation fin keel 10 has the ㄇ shape heat sink 12 and the bottom baffles 14 of space, and is formed with four holes 142 on each bottom baffles 14.This flat base plate 20 has a rectangular body 22, form number row's projection 24 (each row has four projections) on it by punching press, and main body 22 is formed with most shrinkage pools 26 on the surface with respect to projection 24.
During assembling, at first on the bottom surface 144 of radiating fin 10, evenly apply one deck heat-conducting cream 30.Then, radiating fin 10 is installed up on the base plate 20, and makes projection 24 pass corresponding perforations 142.Then, this heat abstractor 1 is through drift 40 punch process (shown in Fig. 3 arrow) of a punch press, makes projection 24 form mushroom heads 242 and radiating fin 10 and base plate 20 are linked together securely.At this moment, any existence will be filled up by heat-conducting cream 30 between the space of 20 of radiating fin 10 bottom baffles 14 and base plates, make this radiating fin 10 and base plate 20 tight ground engage.Therefore, by the heat of these base plate 20 absorptions, can absorb effectively and disperse by this ㄇ shape heat sink 12 from thermal source (for example central processor CPU).
Fig. 5 to Fig. 7 is the heat abstractor 2 according to second embodiment of the invention, and it has a radiating fin 10, a flat base plate 50 and a plurality of rivet 60 (only showing among the figure).This radiating fin 10 is identical with the structure of first embodiment, repeats no more.This flat base plate 50 has a rectangular body 52 and is formed with six row's stepped holes 54 (each row has four holes), and each stepped hole 54 has the bottom 542 of a large-size.
During assembling, at first on the bottom surface 144 of radiating fin 10, evenly apply one deck heat-conducting cream 30.Then, radiating fin 10 is installed up on the base plate 50, and rivet 60 is packed in the hole 54, this moment, manufactured head 62 was housed in the bottom 542 of large-size, and rivet bar 64 then is upward through the hole 142 on radiating fin 10 bottom baffles 14.Then, this heat abstractor 2 is through drift 40 punch process (shown in Fig. 6 arrow) of a punch press, makes rivet bar 64 form mushroom heads 642 and radiating fin 10 and base plate 50 are linked together securely.At this moment, any existence will be filled up by heat-conducting cream 30 between the space of 50 of radiating fin 10 bottom baffles 14 and base plates, make this radiating fin 10 and base plate 50 tight ground engage.Therefore, by the heat of these base plate 50 absorptions, can absorb effectively and disperse by ㄇ shape heat sink 12 from thermal source.
Fig. 8 is the heat abstractor 3 according to third embodiment of the invention, and itself and first embodiment have roughly the same structure and manufacture method.Unique not existing together is on the ㄇ shape heat sink 72 of radiating fin 70 of the 3rd embodiment, is formed with several perforates 722 to increase area of dissipation, and so the heat that is absorbed by base plate 20 can more effectively be distributed.
Fig. 9 is the heat abstractor 4 according to fourth embodiment of the invention, and it has a flat base plate 20 and six radiating fins 80 that roughly are ㄩ shape and are separated from each other, and is formed with four holes 822 on the horizontal bottom 82 of each radiating fin 80.Moreover, be formed with a plurality of perforates 842 on the setting heat sink 84 of each radiating fin 80 to increase area of dissipation.During assembling,, and then 80 1 of radiating fins are followed a ground be installed up on the base plate 20, make projection 24 on the base plate pass the hole 822 on the radiating fin 80 earlier in the bottom surface of each radiating fin 80 824 even coated with thermally conductive cream (not shown).Then, as first embodiment, this heat abstractor 4 is through the drift punch process of a punch press, makes projection 24 form the mushroom heads and radiating fin 80 and base plate 20 are linked together securely.At this moment, any existence will be filled up by heat-conducting cream between the space of 20 of radiating fin 80 bottoms 82 and base plates, make this radiating fin 80 and base plate 20 tight ground engage.
Claims (22)
1. the manufacture method of a heat abstractor is characterized in that this manufacture method may further comprise the steps:
A., a substrate that is formed with most projections is provided;
B., a radiating fin with heat sink of the horizonal base plate that forms most holes and setting is provided;
C. be installed in this radiating fin on this substrate and make projection pass relevant hole; And
D. this projection being implemented punch process links together this radiating fin and substrate securely.
2. manufacture method as claimed in claim 1 is characterized in that: further including following steps between step B and C:
On the bottom surface of the horizonal base plate of this radiating fin, apply one deck heat-conducting cream,, make to be passed to effectively on the heat sink and to be distributed by heat sink by the heat that substrate absorbed to fill the space between between horizonal base plate and substrate.
3. manufacture method as claimed in claim 2 is characterized in that: this radiating fin is continuous wavy configuration, has the ㄇ shape heat sink and the bottom baffles of space.
4. manufacture method as claimed in claim 2 is characterized in that: this radiating fin is for being ㄩ shape separately and roughly.
5. as claim 3 or 4 described manufacture methods, it is characterized in that: be formed with most perforates on the heat sink of this setting to increase area of dissipation.
6. manufacture method as claimed in claim 5 is characterized in that: this substrate is to be formed with most shrinkage pools on flat and the bottom surface with respect to projection.
7. manufacture method as claimed in claim 6 is characterized in that: the punch process to this projection is to form the mushroom head structure of cover cap in the radiating fin hole on this projection.
8. the manufacture method of a heat abstractor is characterized in that this manufacture method may further comprise the steps:
A. form a metal substrate;
B. form one and have horizonal base plate and the heat dissipation metal fin of the setting heat sink that extends from this horizonal base plate;
C. coated with thermally conductive cream on the bottom surface of this horizonal base plate; And
D. mechanically link this radiating fin to substrate, and make this heat-conducting cream fill the space between between radiating fin horizonal base plate and substrate.
9. manufacture method as claimed in claim 8 is characterized in that: step B further is included in and forms most on the heat sink of setting in order to increase the perforates of area of dissipation.
10. manufacture method as claimed in claim 8 is characterized in that: steps A is included in integrally formed most projections on the metal substrate.
11. manufacture method as claimed in claim 10 is characterized in that: the mechanically binding of step D includes and makes projection pass through base plate, and this projection is implemented punch process, makes radiating fin base plate and substrate junction lump together.
12. manufacture method as claimed in claim 8 is characterized in that: step D includes and makes rivet by substrate and radiating fin base plate, and this rivet is implemented punch process, makes radiating fin base plate and substrate junction lump together.
13. heat abstractor, include substrate, radiating fin and heat-conducting cream, it is characterized in that: this radiating fin is mechanically to be linked to substrate, and this heat-conducting cream is between substrate and radiating fin, to fill the space between between substrate and radiating fin contact surface.
14. heat abstractor as claimed in claim 13, it is characterized in that: be formed with most projections on this substrate, the ㄇ shape heat sink and the bottom baffles that is formed with most holes that have continuous space on this radiating fin, projection is to pass this hole and be stamped to be formed with the mushroom head, and radiating fin and substrate are linked together securely, this heat-conducting cream is between bottom baffles and substrate.
15. heat abstractor as claimed in claim 14 is characterized in that: be formed with most perforates on this ㄇ shape heat sink to increase area of dissipation.
16. heat abstractor as claimed in claim 14 is characterized in that: this substrate is formed with most shrinkage pools on the surface with respect to this projection.
17. heat abstractor as claimed in claim 13, it is characterized in that: this radiating fin is most the separate fins that roughly are ㄩ shape, each ㄩ shape fin has horizonal base plate that forms most holes and the setting heat sink that extends from this horizonal base plate, be formed with most projections on this substrate, extend through relevant hole and the formation mushroom head that is stamped, and the horizonal base plate and the substrate of fin combined securely.
18. heat abstractor as claimed in claim 13, it is characterized in that: be formed with most stepped holes on this substrate, the ㄇ shape heat sink and the bottom baffles that is formed with most holes that have continuous space on this radiating fin, most the rivets with big manufactured head are embedded in the stepped hole, and the rivet bar of rivet extends through the hole of bottom baffles and is stamped and forms the mushroom head, and radiating fin and substrate are linked together securely, this heat-conducting cream is to apply between bottom baffles and substrate.
19. heat abstractor, include a metal substrate and a heat dissipation metal fin, it is characterized in that: this substrate is formed with most projections, this radiating fin has the horizonal base plate that is formed with most holes and the heat sink of setting, and projection is to extend through hole and substrate and radiating fin are bonded together securely.
20. heat abstractor as claimed in claim 19 is characterized in that: the space between between substrate and radiating fin is filled with heat-conducting cream.
21. heat abstractor as claimed in claim 19 is characterized in that: be formed with most perforates on this heat sink of holding up to increase area of dissipation.
22. heat abstractor as claimed in claim 19 is characterized in that: this projection is stamped and is formed with the mushroom head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99116137 CN1133065C (en) | 1999-04-08 | 1999-04-08 | Heat radiator and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99116137 CN1133065C (en) | 1999-04-08 | 1999-04-08 | Heat radiator and its manufacture method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1270303A true CN1270303A (en) | 2000-10-18 |
| CN1133065C CN1133065C (en) | 2003-12-31 |
Family
ID=5278981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 99116137 Expired - Fee Related CN1133065C (en) | 1999-04-08 | 1999-04-08 | Heat radiator and its manufacture method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1133065C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100370210C (en) * | 2002-11-06 | 2008-02-20 | 徐惠群 | Method for filling up slots between heat conductive parts as well as structure of part |
| CN100394353C (en) * | 2006-11-16 | 2008-06-11 | 马进 | Electrical power supplier based on natural convective heat elimination |
| US7532478B2 (en) | 2005-04-06 | 2009-05-12 | Samsung Sdi Co., Ltd. | Plasma display module |
| CN1855455B (en) * | 2005-03-24 | 2010-06-16 | 三星Sdi株式会社 | Dissipating apparatus for integrated circuit chip and display module including the same |
| CN103062730A (en) * | 2012-12-17 | 2013-04-24 | 秦大春 | Radiator module of tube-on-sheet type light-emitting diode (LED) lamp |
| CN103302465A (en) * | 2012-03-13 | 2013-09-18 | 富准精密工业(深圳)有限公司 | Radiator module and manufacturing method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100455374C (en) * | 2006-01-20 | 2009-01-28 | 黄崇贤 | Equipment for automatic assembling of heat conducting tube and radiation fins |
-
1999
- 1999-04-08 CN CN 99116137 patent/CN1133065C/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100370210C (en) * | 2002-11-06 | 2008-02-20 | 徐惠群 | Method for filling up slots between heat conductive parts as well as structure of part |
| CN1855455B (en) * | 2005-03-24 | 2010-06-16 | 三星Sdi株式会社 | Dissipating apparatus for integrated circuit chip and display module including the same |
| US7817425B2 (en) | 2005-03-24 | 2010-10-19 | Samsung Sdi Co., Ltd. | Dissipating apparatus for integrated circuit chip and display module including the same |
| US7532478B2 (en) | 2005-04-06 | 2009-05-12 | Samsung Sdi Co., Ltd. | Plasma display module |
| CN100394353C (en) * | 2006-11-16 | 2008-06-11 | 马进 | Electrical power supplier based on natural convective heat elimination |
| CN103302465A (en) * | 2012-03-13 | 2013-09-18 | 富准精密工业(深圳)有限公司 | Radiator module and manufacturing method thereof |
| CN103062730A (en) * | 2012-12-17 | 2013-04-24 | 秦大春 | Radiator module of tube-on-sheet type light-emitting diode (LED) lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1133065C (en) | 2003-12-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW444158B (en) | Heat sink device and its manufacture method | |
| US5421406A (en) | Heat sinks having pin-shaped fins and process for producing same | |
| US20080283234A1 (en) | Heat sink and method of making same | |
| JP4623730B2 (en) | Light emitting diode light source using light emitting diode light source unit | |
| CN1133065C (en) | Heat radiator and its manufacture method | |
| US10781980B2 (en) | LED module housing | |
| EP0233916A1 (en) | Heat sink formed of stacked fin elements. | |
| KR101233121B1 (en) | method for manufacturing light emitting diode array substrate with surface type and the light emitting diode array substrate thereby | |
| US20150070893A1 (en) | Led grid device and a method of manufacturing a led grid device | |
| US20070131390A1 (en) | Heat dissipating module and method of fabricating the same | |
| JP2005101259A (en) | Assembled structure and assembling method of power module | |
| KR200451504Y1 (en) | Cooler module without base panel | |
| CN200966203Y (en) | Heat radiator | |
| CN2518146Y (en) | Radiator able to increase radiation efficiency | |
| CN211702870U (en) | Heat radiator | |
| CN216244096U (en) | Radiator for vehicle lamp | |
| US20050173723A1 (en) | Light-emitting diode structure and a method for manufacturing the light-emitting diode | |
| CN2543120Y (en) | Cooling device capable of promoting cooling efficiency | |
| JPH1117080A (en) | Radiator | |
| JP3033066U (en) | Radiator | |
| CN210274942U (en) | Bending type phase change heat dissipation plate and radiator | |
| US20070131389A1 (en) | Heat dissipating device and method of fabricating the same | |
| US20120160467A1 (en) | Heat sink and assembly method thereof | |
| CN2444384Y (en) | Radiator for electronic component | |
| JPH08250879A (en) | Heat sink |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |