CN1267710C - Pressure sensing device with temp. sensor - Google Patents
Pressure sensing device with temp. sensor Download PDFInfo
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- CN1267710C CN1267710C CN 200310102515 CN200310102515A CN1267710C CN 1267710 C CN1267710 C CN 1267710C CN 200310102515 CN200310102515 CN 200310102515 CN 200310102515 A CN200310102515 A CN 200310102515A CN 1267710 C CN1267710 C CN 1267710C
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Abstract
A pressure sensor device having a temperature sensor includes a pressure sensor, a temperature sensor, a sensor casing for accommodating the pressure sensor and a connector pin for electrically connecting the pressure sensor and an outside circuit, and a port mounted on the sensor casing and having a pressure introduction port for introducing a measuring object to the pressure sensor. The temperature sensor is disposed in the pressure introduction port, and electrically connects to the connector pin through a lead wire. The lead wire with the temperature sensor is supported by a connection portion disposed between the connector pin and the lead wire. The lead wire has a buffer disposed between the lead wire and a part of the pressure introduction port for reducing a vibration of both the temperature sensor and the lead wire.
Description
Technical field
The present invention relates to a kind of pressure sensor device that is used to detect tested object pressure, particularly a kind of pressure sensor device that is used for detecting simultaneously the pressure and temperature of tested object with temperature sensor.
Background technology
A kind of pressure sensor device with temperature sensor, i.e. the pressure sensor device that integrates with temperature sensor for example is used in the automobile.This device is used for detecting simultaneously the pressure and temperature of suction air of the tested object of conduct of automobile inlet manifold, and to controller output measuring-signal.Controller calculates and exports control signal to the engine of automobile, with the control engine.
This pressure sensor device comprises a sensor housing, a wiring pin, a pressure transducer and a temperature sensor.Wiring pin is connecting as the external circuit of automobile controller electronic control unit (being ECU) for example.Pressure transducer is being connected described wiring pin respectively with temperature sensor.Say that especially temperature sensor is connecting a connecting portion of wiring pin by a lead-in wire.Lead-in wire stretches out from this connecting portion.Temperature sensor is located at an end of lead-in wire, and connecting portion is located at the other end of lead-in wire.Like this, temperature sensor is contained in the temperature sensor chamber, is supporting so that temperature sensor is connected the position by means of lead-in wire.In other words, temperature sensor will go between and float in the temperature sensor chamber as the support portion.
Yet, because connecting portion is as the support portion of temperature sensor, therefore when vibration is applied on the sensor device, temperature sensor can with the connecting portion synchronous vibration as the strong point.Therefore, stress can be applied on the connecting portion repeatedly, thereby causes lead-in wire to disconnect at the connecting portion place.In addition, the inwall that lead-in wire or temperature sensor may the impact temperature sensor cavities, thus cause lead-in wire or temperature sensor fracture.
Summary of the invention
Consider the problems referred to above, an object of the present invention is to provide a kind of pressure sensor device with temperature sensor, wherein the vibration of this temperature sensor is restricted.
A kind of pressure sensor device with temperature sensor comprises: pressure transducer, and it is used to detect the pressure of tested object; Temperature sensor, it is used to detect the temperature of tested object attached on the lead-in wire; Sensor housing, it is used to hold wiring pin and described pressure transducer, and this wiring pin is electrically connected and follows described pressure transducer and external circuit; Import, it is installed on the sensor housing, and has the pressure intake, and this pressure intake is used for tested object is guided to the pressure receiving surface of the pressure transducer that is located at sensor housing; And vibration absorber, it is used to reduce the vibration of temperature sensor and lead-in wire.Described temperature sensor is arranged in the described pressure intake, and is electrically connected by described lead-in wire and follows described wiring pin.Described temperature sensor and lead-in wire are being supported by a connecting portion that is located between wiring pin and the lead-in wire.
In said apparatus, even there is vibration to be applied on the device, the vibration of lead-in wire and temperature sensor also can be reduced by vibration absorber.Therefore, the durability of device is improved.
Preferably, vibration absorber is made of the bolster between the part that is located at lead-in wire and pressure intake.In this case, the incomplete confining pressure intake of bolster.Like this, the tested object bolster of can flowing through, the new tested object of introducing thereby temperature sensor can detect through the pressure intake.In addition, even there is impurity to enter in the pressure intake, this impurity also can be discharged through bolster with the tested object of the pressure intake of flowing through.
Preferably, the pressure intake comprises that at least a portion with the pressure intake is divided into the dividing plate at two positions.Described dividing plate is along the incoming direction setting of tested object.Wherein, the pressure intake position is the temperature sensor chamber that is used to hold temperature sensor.In this case, bolster is inserted between the part of lead-in wire and pressure intake easily.
Preferably, vibration absorber is so constructed, promptly at least one in the two of temperature sensor and lead-in wire by embedding mould in import, to reduce vibration.More preferably, provide a pressure chamber that is used to introduce tested object between sensor housing and the import, lead-in wire links to each other at a connecting portion place that is located at the pressure chamber outside with wiring pin.In this case, at least one in the two of lead-in wire and temperature sensor is integrated in the import, and be pre-aligned on the precalculated position with temperature sensor going between.Like this, lead-in wire can link to each other in the pressure chamber outside with wiring pin, thereby connecting portion can be not contaminated.Therefore, can form connecting portion by epoxy resin or silicones, the chemical resistance of these materials is lower, but price is also lower.
In addition, a kind of pressure sensor device with temperature sensor comprises: pressure transducer; Temperature sensor, it is attached on the lead-in wire; Housing, it is used for hold pressure unit and a wiring pin, and described wiring pin is used for pressure transducer and temperature sensor are connected to external circuit; Import, it is installed on the housing, and has passage, and this passage is used for tested object is guided to the pressure receiving surface of pressure transducer; And vibration absorber, it is used to reduce the vibration of lead-in wire and temperature sensor.Described lead-in wire is being supported by a connecting portion that is located between wiring pin and the lead-in wire, so that lead-in wire is projected in the described passage.
In said apparatus, even there is vibration to be applied on the device, the vibration of lead-in wire and temperature sensor also can be reduced by vibration absorber.Therefore, the durability of device is improved.
Description of drawings
By the detailed description of doing below in conjunction with accompanying drawing, above-mentioned and other purpose of the present invention, feature and advantage can clearly show.
Fig. 1 is the schematic cross sectional views according to the pressure sensor device with temperature sensor of first embodiment of the invention;
Fig. 2 A is the partial sectional view according to the pressure sensor device of first embodiment, Fig. 2 B is the cut-open view of being done along the line II-II among Fig. 2 A according to the pressure sensor device of first embodiment, Fig. 2 C is the cut-open view of being done along the line II-II among Fig. 2 A according to the remodeling example of first embodiment
Fig. 3 is the schematic cross sectional views according to the pressure sensor device of second embodiment of the invention;
Fig. 4 is the schematic cross sectional views according to the pressure sensor device of third embodiment of the invention;
Fig. 5 A and 5B are the schematic cross sectional views according to the pressure sensor device of fourth embodiment of the invention;
Fig. 6 is the schematic cross sectional views according to the pressure sensor device of fifth embodiment of the invention;
Fig. 7 is the schematic cross sectional views of the comparative example of first embodiment.
Embodiment
(first embodiment)
The pressure sensor device with temperature sensor 1 according to first embodiment of the invention is shown among Fig. 1.Pressure sensor device 1 is used for for example detecting simultaneously the pressure and temperature of suction air of the tested object of conduct of automobile inlet manifold.Device 1 comprises sensor housing 3.The molded IC (being integrated circuit) 2 as pressure detecting element with pressure sensor chip 5 is arranged in the sensor housing 3.Molded IC 2 comprises a fixed part 4 with cavity, and pressure sensor chip 5 is installed in this cavity.Pressure sensor chip 5 is used to detect the pressure of tested object.Molded IC 2 also comprises a signal processing IC 6 and a lead frame 7.
For example make by polybutylene terephthalate (being PBT) or polyphenylene sulfide (being PPS) by heat stable resin for sensor housing 3.A guard member 9 is covered with fixed part 4, thereby utilizes protection part 9 protection pressure sensor chips 5.Like this, pressure sensor chip 5 can be with the capability operation of excellence.
The pressure receiving surface of pressure sensor chip 5 is towards the opening portion of fixed part 4, so that pressure is via on this pressure receiving surface.Pressure sensor chip 5 and lead frame 7 utilize lead connecting method by electric wire 10 for example gold thread be electrically connected to each other.Pressure sensor chip 5 comprises one by monocrystalline silicon diaphragm of making and a plurality of diffusion resistances that are arranged on this diaphragm.These diffusion resistances are connected with each other by a bridge circuit.As example, pressure sensor chip 5 is by glassy bond method etc. and attached on the base portion 11.This base portion is made by glass.11 of base portions utilize silicones etc. and on the basal surface attached to fixed part 4.
An import 14 is installed on the sensor housing 3 by cementing agent 16, thereby forms a pressure chamber 15 between sensor housing 3 and import 14.Import 14 is made by having corrosive resin material of high resistance to chemicals such as PBT or PPS.Cementing agent 16 is to have high resiliency and corrosive material of high resistance to chemicals such as hard epoxy etc.
An O shape circle 20 is arranged in the outside of import 14.Pressure sensor device 1 hermetic is installed on the mounting portion (not shown) of automobile by this O shape circle 20.Pressure is introduced passage 18a and temperature sensor chamber 18b is separated by dividing plate 17 in the outshot of import 14.Yet they also can be integrated in the pressure chamber 15 in import 14.Dividing plate 17 and import 14 whole formation.
For example Co, Mn, Ni make by metal material to be arranged in temperature sensor chip 19 among the 18b of temperature sensor chamber.Temperature sensor chip 19 is electrically connected and then goes between 22, and this protected pipe 21 that goes between is covered with.Lead-in wire 22 is fixed on the wiring pin 12 by welding method at connecting portion 23 places.Wiring pin 12 is formed in the sensor housing 23 by embedding mould.Except connecting portion 23 and peripheral part thereof, the 22 protected pipes 21 that go between are covered with.Protection tube 21 is made by polyimide etc.
Like this, 24 of temperature sensors that are made of lead-in wire 22 and temperature sensor chip 19 have a tie point, and promptly connecting portion 23.Temperature sensor 24 stretches among the temperature sensor chamber 18b of import 14, and the connecting portion 23 that is used as the support portion is supporting.Here, packed 13 of connecting portion 23 and peripheral part thereof cover, and do not contact environment for use to protect them.The coating 25 that temperature sensor chip 19 and peripheral part thereof are used to protect for example polyimide is covered with.
When the direction of arrow of pressure in Fig. 1 was applied on the pressure sensor device 1, tested object was introduced on the pressure receiving surface of the pressure sensor chip 5 that is arranged in sensor housing 3 by the pressure introducing passage 18a of import 14.The diaphragm of pressure transducer 5 is out of shape with respect to the pressure of tested object with being directly proportional.The value of the diffusion resistance (not shown) on the pressure sensor chip 5 changes with respect to the direct ratio that is deformed into of diaphragm.Value after this change is measured by a bridgt circuit, makes this bridgt circuit output signal voltage.Then, signal voltage is amplified by signal processing IC 6, and the signal voltage after the amplification outputs to external circuit by lead frame 7 and wiring pin 12.Near the temperature sensor 25 that the temperature of tested object is disposed in one tested object detects.Temperature signal outputs to external circuit by wiring pin 12.
Here, the pressure sensor device 100 that has a temperature sensor as the another kind of the comparative example of above-mentioned pressure sensor device 1 is shown among Fig. 7.In pressure sensor device 100, temperature sensor 24 has the connecting portion 23 that is used to be connected the single support portion of conduct between temperature sensor 24 and the wiring pin 12.When vibration was applied on the pressure sensor device 1, temperature sensor 24 will be with connecting portion as fulcrum and synchronous vibration.Like this, lead-in wire 22 connecting portion 23 is by stress application repeatedly.In addition, the inwall that the lead-in wire 22 of temperature sensor 24 may impact temperature sensor cavity 18b, thus cause going between 22 or temperature sensor 24 fractures.
In other words, 100 of temperature sensors are that connecting portion 23 is supporting by a support portion, so temperature sensor 24 is suspended from connecting portion 23 in the 18b of temperature sensor chamber.
Yet, comprise the bolster 26 that is used to prevent temperature sensor 24 vibrations according to the pressure sensor device 1 of first embodiment, therefore can prevent to go between 22 or temperature sensor 24 fractures.Bolster 26 is made by resin material, and is arranged between the part of inwall of lead-in wire 22 and temperature sensor chamber 18b.
The resin material that is used to form bolster 26 is the staybelite resin of gel state, for example epoxy resin.Preferably, this resin material is a hot-melt adhesive, for example not with the thermoplastic resin binder of any solvent.In this, hot-melt adhesive has low viscosity under molten state.Therefore, the hot-melt adhesive under the molten state can be filled in the predetermined position, thereby can be reduced in the stress that produces in lead-in wire 22 when charging into hot-melt adhesive.In addition, therefore hot-melt adhesive sclerosis immediately after by the inwall of atmosphere, import 14 and 22 the surface in contact cooling that goes between can prevent that hot-melt adhesive from flowing out import 14.Hot-melt adhesive can be for example polyurethane, polyester, polyamide.Other material also can be used to form bolster 26, as long as this material is enough to bear the vibration that environment for use also can suppress temperature sensor 24.
The resin material that is used to form bolster 26 can be entered from the temperature sensor chamber 18b filling of import 14.Yet, when the top of import 14 and the distance between the bolster 26 is long and temperature sensor chip 19 when being arranged between them, be difficult to charge into resin material from temperature sensor chamber 18b.In this case, pressure sensor device 1 can also comprise an intake 27 that is located in import 14 parts, shown in Fig. 2 A and 2B.Resin material is filled between the inwall of lead-in wire 22 and temperature sensor chamber 18b by intake 27.
Here, the outshot of import 14 inserts in the mounting portion (not shown) of automobile.Pressure sensor device 1 hermetic is installed on the mounting portion by the O shape circle 20 that is located at import 14 outsides.Therefore, intake 27 need be located at pressure with respect to O shape circle 20 and introduce oral-lateral, with the pressure in the pressure chamber 15 of the sensing device 1 that keep-ups pressure.In other words, intake 27 is located at the downside of O shape circle 20 in Fig. 2 A.
Preferably, bolster 26 is arranged in between 14 the temperature sensor chamber 18b and lead-in wire 22.In other words, the xsect of temperature sensor chamber 18b is not a complete closed, thereby bolster 26 has and is used to through hole 28 that tested object is therefrom passed through.If the xsect of temperature sensor chamber 18b is a complete closed, then after oil or impurities from fuel entered in the pressure chamber 15, impurity can deposit on bolster 26.The protection tube 21 of bolster 26 and lead-in wire 22 can be by contaminating impurity.Like this, the protection tube 21 of bolster 26 and lead-in wire 22 can be impaired, thereby temperature sensor 24 can vibrate or lost efficacy because of this damage.Yet bolster 26 has through hole 28, so that impurity can be discharged by through hole 28.Therefore, can prevent that bolster 26 is impaired with the protection tube 21 of lead-in wire 22.In addition, tested object can be by the through hole 28 temperature sensor chamber 18b that flows through, thereby temperature sensor 24 can detect the tested object among the new introducing temperature sensor chamber 18b.In other words, temperature sensor 24 can detect tested object, and the state that this tested object always keeps the tested object that detected with pressure sensor chip 5 much at one.
Like this, in pressure sensor device 1 with temperature sensor, bolster 26 is located between the inwall of temperature sensor chamber 18b of the lead-in wire 22 of temperature sensor 24 and import 14, so the vibration of temperature sensor 24 reduced, and the durability of temperature sensor 24 improves.
Here, in order to reduce manufacturing cost, intake 27 forms simultaneously with import 14 by the resin global formation.Yet intake 27 also can form after import 14 forms.
In addition, although intake 27 is located on the ad-hoc location shown in Fig. 2 B, it also can be located on other position, can charge among the 18b of temperature sensor chamber as long as constitute the resin of bolster 26.Although pressure is introduced passage 18a with dividing plate 17 and temperature sensor chamber 18b separates fully, dividing plate 17 also can partly be separated pressure intake 18 shown in Fig. 2 C.In this case, pressure is introduced the part that passage 18a is being communicated with temperature sensor chamber 18b.
In the present embodiment, dividing plate 17 is introduced chamber 18 with pressure and is divided into two zones.One of them zone is the temperature sensor chamber 18b that is used to hold temperature sensor 24.Yet import 14 also can have at least one pressure intake 18.In this case, the temperature sensor 24 that has a bolster 26 is located between pressure transducer 5 and the pressure intake 18.Like this, be used to make tested object data stream to be had temperature sensor 24 blockings of bolster 26 to the path of pressure sensor chip 5.Therefore, must utilize through hole 28 that tested object is guided on the pressure receiving surface of pressure sensor chip 5.
(second embodiment)
The pressure sensor device with temperature sensor 200 according to second embodiment of the invention is shown among Fig. 3.The lead-in wire 22 of temperature sensor 24 extends along the inwall of temperature sensor chamber 18b.Spherical elastomeric element 29 is arranged among the 18b of temperature sensor chamber, and 22 vibration is used to suppress to go between.Elastomeric element 29 inserts among the temperature sensor chamber 18b by intake 27.At this moment, elastomeric element 29 distortion are so that can insert among the 18b of temperature sensor chamber.Elastomeric element 29 is arranged between the medial extremity of lead-in wire 22 and intake 27, so that the inwall of the 22 pressure contact temperature sensor chamber 18b that go between.Like this, the vibration of temperature sensor 24 is lowered.Elastomeric element 29 has flowability unlike resin material etc., therefore when elastomeric element 29 was inserted by intake 27, elastomeric element 29 can not flow out from the 18b of temperature sensor chamber.Intake 27 is arranged in the downside of O shape circle 20 as shown in Figure 3, so that the pressure stabilityization in the pressure chamber 15.
For example make by nitrile rubber (being NBR), hydrogenated nitrile-butadiene rubber (being H-NBR), fluororubber, silicon rubber, acrylic rubber by rubber for elastomeric element 29.Yet elastomeric element 29 also can be made by other material, as long as this material has enough elasticity.
Like this, elastomeric element 29 can suppress the vibration of temperature sensor 24, therefore can improve the durability of temperature sensor 24.
Although elastomeric element 29 has spherical form, elastomeric element 29 also can have other shape, is used for lead-in wire 22 is fixed on enough elasticity required on the inwall of temperature sensor chamber 18b as long as elastomeric element 29 has.Preferably, the xsect of elastomeric element 29 incomplete closure temperature sensor cavity 18b.
Although elastomeric element 29 inserts among the 18d of temperature sensor chamber by intake 27, if elastomeric element is annular, it also can be embedded on the lead-in wire 22 in advance.Then, again import 14 is fixed on the sensor housing 3.
(the 3rd embodiment)
The pressure sensor device with temperature sensor 300 according to third embodiment of the invention is shown among Fig. 4.At least one in the two of temperature sensor chip 19 and lead-in wire 22 by embedding mould in import 14.Like this, temperature sensor 24 is being supported by import 14 and connecting portion 23, to reduce the vibration of temperature sensor 24.Like this, the durability of temperature sensor 24 is improved.
Although the lead-in wire 22 of temperature sensor 24 embeds in the import 14 in this example, also temperature sensor chip 19 and lead-in wire 22 all can be embedded in the import 14.In this case, owing to the inwall detected temperatures of temperature sensor chip 19 by import 14, so the reaction capacity of temperature sensor chip 19 has reduced.Therefore, preferably temperature sensor 24 is embedded in the import 14, so that utilize temperature sensor chip 19 direct detected temperatures.
As shown in Figure 4, be used to be connected the outside that connecting portion 23 between lead-in wire 22 and the wiring pin 12 is located at pressure chamber 15.In pressure sensor device shown in Figure 11, connecting portion 23 is located in the pressure chamber 15.In this case, packaging part 13 is made by having the corrosive fluororesin of high resistance to chemicals, is not introduced passage 18a by pressure with protection connecting portion 23 and is not entered pollutions such as oil in the pressure chamber 15 or moisture.
Yet in pressure sensor device 300, temperature sensor 24 embedding moulds are in import 14.Therefore, do not need to determine the position of temperature sensor 24 in the 18b of temperature sensor chamber.Like this, the lead-in wire 22 of temperature sensor 24 passes cementing agent 16 in the outside of pressure chamber 15 and stretches in the holding portion 30, and described cementing agent 16 is used for import 14 is fixed on sensor housing 3.Holding portion 30 is located in the sensor housing 3.Lead-in wire 22 can easily be connected on the wiring pin 12 at holding portion 30 places.Like this, connecting portion 23 separates with pressure chamber 15 by cementing agent 16, so that connecting portion 23 can be by impurity for example oil or moisture contamination.Therefore, packaging part 13 can be formed by epoxy resin or silicones, and the chemical resistance of these materials is lower than fluororesin, and price is lower than fluororesin.
22 pass cementing agent 16 and connecting wiring pin 12 in holding portions 30 although go between, and go between 22 also can directly connect wiring pin 12 and do not pass cementing agent 16.Here, lead-in wire 22 extends to holding portion 30 from import 14.
(the 4th embodiment)
The pressure sensor device with temperature sensor 400 according to fourth embodiment of the invention is shown among Fig. 5.The lead-in wire 22 of temperature sensor 24 has projection 31, is used to suppress the vibration of temperature sensor 24.Especially, projection 31 is located on the protection tube 32 of lead-in wire 22, and along extending with the vertical perpendicular direction of lead-in wire 22.Projection 31 is by constituting with protection tube 21 identical materials, so that projection and protection tube 21 can be by forming such as resins such as polyimide are whole.
Projection length in vertical direction equal to go between 22 and the inwall of temperature sensor chamber 18b between distance.Preferably, the length of projection is slightly less than the distance between lead-in wire 22 and the inwall.This is because when temperature sensor 24 was set among the 18b of temperature sensor chamber, the lead-in wire 22 that has projection 31 was installed easily.In this case, the vibration amplitude of temperature sensor 24 is essentially 0, thereby can reduce the vibration of temperature sensor 24.
Preferably, projection 31 has a plurality of teats.If projection 31 has only a teat, then stress can be applied on the teat when temperature sensor 24 vibrations.Therefore, projection 31 ruptures easily.More preferably, a plurality of teats be located at and 22 the vertical perpendicular same plane of going between in.More preferably, all teats in the described same plane arrange that with uniform angular spacing promptly these teats are symmetrical arranged.In this case, no matter temperature sensor 24 in which direction vibrates, projection 31 all can suppress the vibration of temperature sensor 24.
Shown in Fig. 5 A, when adjoining temperature sensor chamber 18b that projection 31 settles and have constant diameter and projection 31 and have a plurality of teat in the Different Plane of being arranged in, preferably, projection is reduced gradually from 22 length of stretching out that go between pointing on the direction of lead-in wire 22 lower ends back to connecting portion 23.In this case, stress can be applied on a plurality of teats that are arranged in the Different Plane when temperature sensor 24 vibrations.Like this, the inwall of a plurality of teats meeting impact temperature sensor cavity 18b is so that stress is dispersed on a plurality of teats.
Like this, lead-in wire 22 comprises projection 31, to reduce the vibration of temperature sensor 24.Therefore, the durability of temp sensor device 400 is improved.
Although projection 31 has needle-like shape, projection 31 also can have for example dish type of other shape, and it is arranged between the inwall of lead-in wire 22 and temperature sensor chamber 18b, to reduce the vibration of temperature sensor 24.
In the present embodiment, projection 31 is along stretching out from 22 the protection tube 21 of going between with lead-in wire 22 vertical perpendicular direction.Projection 31 is by constituting with protection tube 21 identical materials, and projection 31 and protection tube 21 whole formation.Yet except vertical direction, projection 31 also can be stretched out along any direction, and can be made of the material different with protection tube 21.In addition, projection 31 can be with respect to protection tube 21 independent formation.
Shown in Fig. 5 b, sheath 32 replaces the vibration that projection 31 is used to reduce temperature sensor 24.Protection tube 21 passes sheath 32, and promptly sheath 32 is covered with protection tube 21.In this case, sheath is 22 outstanding from going between, to reduce the vibration of temperature sensor 24.Therefore, the durability of temperature sensor 24 is improved.
(the 5th embodiment)
The pressure sensor device with temperature sensor 500 according to fifth embodiment of the invention is shown among Fig. 5.Pressure sensor device 500 comprises a clamping part 33 that is used for clamping lead-in wire 22.Clamping part 33 and import 14 form by resin is whole.Lead-in wire 22 is held in the following manner.Clamping part 33 is heated, and clamps lead-in wire 22 so that clamping part 33 melts.Like this, the vibration of temperature sensor 24 can reduce.In addition, clamping part 33 can be constructed to respect to import 14 another parts independently.In other words, this another arrangements of components is between the bottom of lead-in wire 22 top and import 14.These another parts are heated and melt, thereby adhere on import 14 and the lead-in wire 22,22 are clamped in the import 14 going between.Like this, the vibration of temperature sensor 24 can reduce.
Be appreciated that such change and modification drop in the scope of determining in claims of the present invention.
Claims (22)
1. pressure sensor device with temperature sensor comprises:
Pressure transducer, it is used to detect the pressure of tested object;
Temperature sensor, it is used to detect the temperature of tested object attached on the lead-in wire;
Sensor housing, it is used to hold wiring pin and described pressure transducer, and this wiring pin is electrically connected and follows described pressure transducer and external circuit;
Import, it is installed on the sensor housing, and has the pressure intake, and this pressure intake is used for tested object is guided to the pressure receiving surface of the pressure transducer that is located at sensor housing; And
Vibration absorber, it is used to reduce the vibration of temperature sensor and lead-in wire;
Described temperature sensor is arranged in the described pressure intake, and is electrically connected by described lead-in wire and follows described wiring pin;
Described temperature sensor and lead-in wire are being supported by a connecting portion that is located between wiring pin and the lead-in wire.
2. pressure sensor device as claimed in claim 1 is characterized in that,
Described vibration absorber is made of the bolster between the part that is located at lead-in wire and pressure intake.
3. pressure sensor device as claimed in claim 1 or 2 is characterized in that,
Described pressure intake comprises that at least a portion with the pressure intake is divided into the dividing plate in two zones, and described dividing plate is along the incoming direction setting of tested object;
A zone of described pressure intake is the temperature sensor chamber that is used to hold temperature sensor.
4. pressure sensor device as claimed in claim 3 is characterized in that,
Described bolster is located between the inwall in lead-in wire and temperature sensor chamber.
5. pressure sensor device as claimed in claim 2 is characterized in that,
Described bolster is made of the resin material between the part that is arranged in lead-in wire and pressure intake.
6. pressure sensor device as claimed in claim 5 is characterized in that,
Described resin material is a hot-melt adhesive.
7. pressure sensor device as claimed in claim 2 is characterized in that,
Described bolster is made of the elastomeric element that is used for fixing lead-in wire.
8. pressure sensor device as claimed in claim 2 is characterized in that,
Described import comprises an intake, and this intake is used for bolster is therefrom inserted.
9. pressure sensor device as claimed in claim 1 is characterized in that,
Described vibration absorber is so constructed, promptly at least one in the two of temperature sensor and lead-in wire by embedding mould in import, to reduce vibration.
10. pressure sensor device as claimed in claim 9 is characterized in that,
A pressure chamber that is used to introduce tested object is provided between sensor housing and the import;
Lead-in wire links to each other at a connecting portion place that is located at the pressure chamber outside with wiring pin.
11. pressure sensor device as claimed in claim 10 is characterized in that,
Described connecting portion is covered by epoxy resin or silicones.
12. pressure sensor device as claimed in claim 1 is characterized in that,
Described vibration absorber is made of the projection that is located on the wire surface.
13. pressure sensor device as claimed in claim 1 is characterized in that,
Described vibration absorber is so constructed, and promptly goes between to be fixed in the import by resin material, and described resin material is held in cable guide in the import by heating.
14. as arbitrary described pressure sensor device in the claim 9,12 and 13, it is characterized in that,
Described pressure intake comprises that at least a portion with the pressure intake is divided into the dividing plate in two zones, and described dividing plate is along the incoming direction setting of tested object;
A zone of described pressure intake is the temperature sensor chamber that is used to hold temperature sensor.
15. the pressure sensor device with temperature sensor comprises:
Pressure transducer;
Temperature sensor, it is attached on the lead-in wire;
Housing, it is used for hold pressure unit and a wiring pin, and described wiring pin is used for pressure transducer and temperature sensor are connected to external circuit;
Import, it is installed on the housing, and has passage, and this passage is used for tested object is guided to the pressure receiving surface of pressure transducer; And
Vibration absorber, it is used to reduce the vibration of lead-in wire and temperature sensor;
Described lead-in wire is being supported by a connecting portion that is located between wiring pin and the lead-in wire, so that lead-in wire is projected in the described passage.
16. pressure sensor device as claimed in claim 15 is characterized in that,
Described vibration absorber is made of the bolster between the part that is located at lead-in wire and described passage.
17. pressure sensor device as claimed in claim 16 is characterized in that,
Described passage is separated into two zones by a dividing plate;
A zone of passage is to be used for the pressure that tested object is guided on the pressure receiving surface of pressure transducer is introduced passage;
Another zone of passage is the temperature sensor chamber that is used to hold temperature sensor;
Described bolster is located in the temperature sensor chamber.
18. pressure sensor device as claimed in claim 17 is characterized in that,
Described bolster is the xsect of closure temperature sensor cavity partly, the bolster so that tested object can be flowed through.
19. as arbitrary described pressure sensor device among the claim 16-18, it is characterized in that,
Described bolster is made by resin material;
Described import also comprises the intake that is used for introducing resin material when forming bolster.
20. pressure sensor device as claimed in claim 19 is characterized in that,
Described resin material is a hot-melt adhesive.
21. as arbitrary described pressure sensor device among the claim 16-18, it is characterized in that,
Described bolster is made of a spherical elastomeric element;
Described import also comprises the intake that is used for inserting elastomeric element when forming bolster.
22. pressure sensor device as claimed in claim 15 is characterized in that,
Described vibration absorber is so constructed, promptly at least one in the two of temperature sensor and lead-in wire by embedding mould in import, to reduce vibration.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002308982 | 2002-10-23 | ||
| JP308982/2002 | 2002-10-23 | ||
| JP075019/2003 | 2003-03-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1497245A CN1497245A (en) | 2004-05-19 |
| CN1267710C true CN1267710C (en) | 2006-08-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200310102515 Expired - Fee Related CN1267710C (en) | 2002-10-23 | 2003-10-22 | Pressure sensing device with temp. sensor |
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| CN (1) | CN1267710C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106233095A (en) * | 2013-12-12 | 2016-12-14 | Sc2N公司 | Device including the sensor protected by resin |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ITTO20080483A1 (en) * | 2008-06-19 | 2009-12-20 | Eltek Spa | PRESSURE SENSOR DEVICE |
| CN101498612B (en) * | 2009-03-13 | 2011-01-12 | 上海海华传感器有限公司 | Partially sealed pressure-temperature sensor and its manufacturing process |
| FR2970076B1 (en) * | 2010-12-30 | 2012-12-21 | Sc2N Sa | TEMPERATURE MEASURING DEVICE FOR GAS PIPING CONNECTED TO A THERMAL MOTOR OF A MOTOR VEHICLE, THERMAL MOTOR AND VEHICLE EQUIPPED WITH SAID DEVICE. |
| US8935961B2 (en) * | 2011-08-18 | 2015-01-20 | Sensata Technologies, Inc. | Combination pressure/temperature in a compact sensor assembly |
| KR101483278B1 (en) * | 2012-06-11 | 2015-01-14 | 가부시키가이샤 사기노미야세이사쿠쇼 | Pressure sensor and manufacturing method thereof |
| DE102012223014A1 (en) * | 2012-12-13 | 2014-06-18 | Robert Bosch Gmbh | Device for detecting the pressure and the temperature of a medium |
| DE102015223850A1 (en) * | 2015-12-01 | 2017-06-01 | Robert Bosch Gmbh | Method for producing a device for detecting at least one property of a fluid medium in a measuring space |
| JP6517709B2 (en) * | 2016-01-29 | 2019-05-22 | 株式会社鷺宮製作所 | Refrigerant circuit components |
| JP6489081B2 (en) * | 2016-08-05 | 2019-03-27 | 株式会社デンソー | Sensor device |
| JP6786606B2 (en) * | 2016-08-22 | 2020-11-18 | 日立オートモティブシステムズ株式会社 | Physical quantity detector |
| JP6891862B2 (en) * | 2018-07-19 | 2021-06-18 | 株式会社デンソー | Pressure temperature sensor |
| TWI728735B (en) * | 2020-03-10 | 2021-05-21 | 高爾科技股份有限公司 | Thermal reactive pressure detector |
| CN113899493A (en) * | 2021-11-02 | 2022-01-07 | 西安交通大学苏州研究院 | Pressure sensor applied to ultralow temperature environment |
-
2003
- 2003-10-22 CN CN 200310102515 patent/CN1267710C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106233095A (en) * | 2013-12-12 | 2016-12-14 | Sc2N公司 | Device including the sensor protected by resin |
| CN106233095B (en) * | 2013-12-12 | 2019-08-20 | Sc2N公司 | Device including the sensor protected by resin |
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| CN1497245A (en) | 2004-05-19 |
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