CN1249067A - 热电变换装置 - Google Patents
热电变换装置 Download PDFInfo
- Publication number
- CN1249067A CN1249067A CN98802818A CN98802818A CN1249067A CN 1249067 A CN1249067 A CN 1249067A CN 98802818 A CN98802818 A CN 98802818A CN 98802818 A CN98802818 A CN 98802818A CN 1249067 A CN1249067 A CN 1249067A
- Authority
- CN
- China
- Prior art keywords
- heat carrier
- thermoelectric conversion
- frame
- conversion arrangement
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000006073 displacement reaction Methods 0.000 claims abstract description 10
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- 239000011230 binding agent Substances 0.000 claims description 46
- 238000006243 chemical reaction Methods 0.000 claims description 26
- 238000009413 insulation Methods 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 238000009423 ventilation Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 abstract description 10
- 239000002470 thermal conductor Substances 0.000 abstract 6
- 230000005855 radiation Effects 0.000 description 33
- 238000012986 modification Methods 0.000 description 15
- 230000004048 modification Effects 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 230000003321 amplification Effects 0.000 description 14
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- 230000002093 peripheral effect Effects 0.000 description 10
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000002528 anti-freeze Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
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- 239000012530 fluid Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35755397A JP3238114B2 (ja) | 1997-12-25 | 1997-12-25 | 熱電変換装置 |
JP357553/1997 | 1997-12-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1249067A true CN1249067A (zh) | 2000-03-29 |
CN1222053C CN1222053C (zh) | 2005-10-05 |
Family
ID=18454721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB988028182A Expired - Lifetime CN1222053C (zh) | 1997-12-25 | 1998-12-25 | 热电变换装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6185941B1 (zh) |
EP (1) | EP0967665B1 (zh) |
JP (1) | JP3238114B2 (zh) |
CN (1) | CN1222053C (zh) |
AU (1) | AU750519B2 (zh) |
DE (1) | DE69824397D1 (zh) |
HK (1) | HK1025426A1 (zh) |
WO (1) | WO1999034451A1 (zh) |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1300525C (zh) * | 2002-06-06 | 2007-02-14 | Bsst公司 | 改进的热电发电***及方法 |
CN101145595B (zh) * | 2006-09-12 | 2010-06-09 | C.R.F.阿西安尼顾问公司 | 基于热电效应的电能发生器 |
US7926293B2 (en) | 2001-02-09 | 2011-04-19 | Bsst, Llc | Thermoelectrics utilizing convective heat flow |
US7942010B2 (en) | 2001-02-09 | 2011-05-17 | Bsst, Llc | Thermoelectric power generating systems utilizing segmented thermoelectric elements |
US7946120B2 (en) | 2001-02-09 | 2011-05-24 | Bsst, Llc | High capacity thermoelectric temperature control system |
US8069674B2 (en) | 2001-08-07 | 2011-12-06 | Bsst Llc | Thermoelectric personal environment appliance |
US8079223B2 (en) | 2001-02-09 | 2011-12-20 | Bsst Llc | High power density thermoelectric systems |
US8424315B2 (en) | 2006-03-16 | 2013-04-23 | Bsst Llc | Thermoelectric device efficiency enhancement using dynamic feedback |
US8445772B2 (en) | 2005-06-28 | 2013-05-21 | Bsst, Llc | Thermoelectric power generator with intermediate loop |
US8613200B2 (en) | 2008-10-23 | 2013-12-24 | Bsst Llc | Heater-cooler with bithermal thermoelectric device |
US8640466B2 (en) | 2008-06-03 | 2014-02-04 | Bsst Llc | Thermoelectric heat pump |
US8656710B2 (en) | 2009-07-24 | 2014-02-25 | Bsst Llc | Thermoelectric-based power generation systems and methods |
WO2014084363A1 (ja) * | 2012-11-29 | 2014-06-05 | 京セラ株式会社 | 熱電モジュール |
US9006557B2 (en) | 2011-06-06 | 2015-04-14 | Gentherm Incorporated | Systems and methods for reducing current and increasing voltage in thermoelectric systems |
US9293680B2 (en) | 2011-06-06 | 2016-03-22 | Gentherm Incorporated | Cartridge-based thermoelectric systems |
US9306143B2 (en) | 2012-08-01 | 2016-04-05 | Gentherm Incorporated | High efficiency thermoelectric generation |
US9310112B2 (en) | 2007-05-25 | 2016-04-12 | Gentherm Incorporated | System and method for distributed thermoelectric heating and cooling |
US9528729B2 (en) | 2012-04-17 | 2016-12-27 | Keenusdesign Corporation | Heat transfer unit and temperature adjustment device |
CN113507810A (zh) * | 2021-09-09 | 2021-10-15 | 凯瑞电子(诸城)有限公司 | 一种组合式电子元件壳体 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004524506A (ja) * | 2001-04-24 | 2004-08-12 | トップ‐クール、ホールディング、ベスローテン、フェンノートシャップ | 電気冷却装置 |
US6826916B2 (en) * | 2001-04-24 | 2004-12-07 | The Furukawa Electric Co., Ltd. | Laser module, Peltier module, and Peltier module integrated heat spreader |
JP3795401B2 (ja) * | 2002-01-11 | 2006-07-12 | エスアイアイ・プリンテック株式会社 | 温度制御装置及び温度制御方法並びにインクジェット式記録装置 |
ITMI20040079U1 (it) * | 2004-03-02 | 2004-06-02 | Peltech Srl | Perfezionamenti alle pompe di calore termoelettriche |
US20090044549A1 (en) * | 2007-08-15 | 2009-02-19 | Sundhar Shaam P | Tabletop Quick Cooling Device |
JP5019392B2 (ja) * | 2008-02-26 | 2012-09-05 | Cbcエスト株式会社 | 電子冷却装置 |
JP2013026334A (ja) * | 2011-07-19 | 2013-02-04 | National Institute Of Advanced Industrial & Technology | 積層型熱電変換モジュール |
US9799815B2 (en) * | 2011-09-06 | 2017-10-24 | Quantum Devices, Llc | Doped boron carbides and thermoelectric applications |
JP6299520B2 (ja) * | 2014-08-13 | 2018-03-28 | 富士通株式会社 | 熱電変換モジュール及びその製造方法、センサモジュール及び情報処理システム |
JP2017069372A (ja) * | 2015-09-30 | 2017-04-06 | 積水化学工業株式会社 | 熱電変換システム |
US10845375B2 (en) * | 2016-02-19 | 2020-11-24 | Agjunction Llc | Thermal stabilization of inertial measurement units |
KR102247824B1 (ko) * | 2016-05-24 | 2021-05-04 | 엘지전자 주식회사 | 유도 가열 장치에 의해 가열되는 가열유로를 구비한 정수기 |
US11075331B2 (en) | 2018-07-30 | 2021-07-27 | Gentherm Incorporated | Thermoelectric device having circuitry with structural rigidity |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
KR102223286B1 (ko) * | 2019-08-02 | 2021-03-05 | 엘지전자 주식회사 | 정수기 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB817077A (en) * | 1956-08-22 | 1959-07-22 | Gen Electric | Improvements in or relating to thermoelectric cooling units |
JPS6181579U (zh) * | 1984-11-02 | 1986-05-30 | ||
JPS6422964U (zh) * | 1987-07-30 | 1989-02-07 | ||
DE4231702C2 (de) * | 1992-09-22 | 1995-05-24 | Litef Gmbh | Thermoelektrische, beheizbare Kühlkammer |
JPH06294560A (ja) * | 1993-04-07 | 1994-10-21 | Sharp Corp | 熱電変換モジュール |
JPH07250741A (ja) * | 1994-03-11 | 1995-10-03 | Aisin Seiki Co Ltd | 保冷庫付き暖房椅子 |
JP3560391B2 (ja) * | 1995-06-28 | 2004-09-02 | 日本政策投資銀行 | 熱電変換装置 |
JP3560392B2 (ja) * | 1995-07-19 | 2004-09-02 | 日本政策投資銀行 | 熱電変換装置 |
JP3533826B2 (ja) * | 1996-05-29 | 2004-05-31 | アイシン精機株式会社 | 熱変換装置 |
JP3241270B2 (ja) * | 1996-06-25 | 2001-12-25 | 日本政策投資銀行 | 熱電変換装置 |
JPH1084139A (ja) * | 1996-09-09 | 1998-03-31 | Technova:Kk | 熱電変換装置 |
EP0851187A3 (en) * | 1996-12-27 | 1998-08-19 | Thermovonics Co., Ltd | Storage box apparatus |
JPH1093150A (ja) * | 1997-08-29 | 1998-04-10 | Technova:Kk | 熱電変換装置 |
-
1997
- 1997-12-25 JP JP35755397A patent/JP3238114B2/ja not_active Expired - Fee Related
-
1998
- 1998-12-25 EP EP98961607A patent/EP0967665B1/en not_active Expired - Lifetime
- 1998-12-25 WO PCT/JP1998/005963 patent/WO1999034451A1/ja active IP Right Grant
- 1998-12-25 DE DE69824397T patent/DE69824397D1/de not_active Expired - Lifetime
- 1998-12-25 CN CNB988028182A patent/CN1222053C/zh not_active Expired - Lifetime
- 1998-12-25 US US09/380,060 patent/US6185941B1/en not_active Expired - Lifetime
- 1998-12-25 AU AU16909/99A patent/AU750519B2/en not_active Ceased
-
2000
- 2000-07-21 HK HK00104517A patent/HK1025426A1/xx not_active IP Right Cessation
Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7926293B2 (en) | 2001-02-09 | 2011-04-19 | Bsst, Llc | Thermoelectrics utilizing convective heat flow |
US7942010B2 (en) | 2001-02-09 | 2011-05-17 | Bsst, Llc | Thermoelectric power generating systems utilizing segmented thermoelectric elements |
US7946120B2 (en) | 2001-02-09 | 2011-05-24 | Bsst, Llc | High capacity thermoelectric temperature control system |
US8079223B2 (en) | 2001-02-09 | 2011-12-20 | Bsst Llc | High power density thermoelectric systems |
US8375728B2 (en) | 2001-02-09 | 2013-02-19 | Bsst, Llc | Thermoelectrics utilizing convective heat flow |
US8495884B2 (en) | 2001-02-09 | 2013-07-30 | Bsst, Llc | Thermoelectric power generating systems utilizing segmented thermoelectric elements |
US8069674B2 (en) | 2001-08-07 | 2011-12-06 | Bsst Llc | Thermoelectric personal environment appliance |
CN1300525C (zh) * | 2002-06-06 | 2007-02-14 | Bsst公司 | 改进的热电发电***及方法 |
US9006556B2 (en) | 2005-06-28 | 2015-04-14 | Genthem Incorporated | Thermoelectric power generator for variable thermal power source |
US8445772B2 (en) | 2005-06-28 | 2013-05-21 | Bsst, Llc | Thermoelectric power generator with intermediate loop |
US8424315B2 (en) | 2006-03-16 | 2013-04-23 | Bsst Llc | Thermoelectric device efficiency enhancement using dynamic feedback |
CN101145595B (zh) * | 2006-09-12 | 2010-06-09 | C.R.F.阿西安尼顾问公司 | 基于热电效应的电能发生器 |
US9310112B2 (en) | 2007-05-25 | 2016-04-12 | Gentherm Incorporated | System and method for distributed thermoelectric heating and cooling |
US9366461B2 (en) | 2007-05-25 | 2016-06-14 | Gentherm Incorporated | System and method for climate control within a passenger compartment of a vehicle |
US10464391B2 (en) | 2007-05-25 | 2019-11-05 | Gentherm Incorporated | System and method for distributed thermoelectric heating and cooling |
US8701422B2 (en) | 2008-06-03 | 2014-04-22 | Bsst Llc | Thermoelectric heat pump |
US10473365B2 (en) | 2008-06-03 | 2019-11-12 | Gentherm Incorporated | Thermoelectric heat pump |
US8640466B2 (en) | 2008-06-03 | 2014-02-04 | Bsst Llc | Thermoelectric heat pump |
US9719701B2 (en) | 2008-06-03 | 2017-08-01 | Gentherm Incorporated | Thermoelectric heat pump |
US8613200B2 (en) | 2008-10-23 | 2013-12-24 | Bsst Llc | Heater-cooler with bithermal thermoelectric device |
US8656710B2 (en) | 2009-07-24 | 2014-02-25 | Bsst Llc | Thermoelectric-based power generation systems and methods |
US9276188B2 (en) | 2009-07-24 | 2016-03-01 | Gentherm Incorporated | Thermoelectric-based power generation systems and methods |
US9006557B2 (en) | 2011-06-06 | 2015-04-14 | Gentherm Incorporated | Systems and methods for reducing current and increasing voltage in thermoelectric systems |
US9293680B2 (en) | 2011-06-06 | 2016-03-22 | Gentherm Incorporated | Cartridge-based thermoelectric systems |
US9528729B2 (en) | 2012-04-17 | 2016-12-27 | Keenusdesign Corporation | Heat transfer unit and temperature adjustment device |
US9306143B2 (en) | 2012-08-01 | 2016-04-05 | Gentherm Incorporated | High efficiency thermoelectric generation |
WO2014084363A1 (ja) * | 2012-11-29 | 2014-06-05 | 京セラ株式会社 | 熱電モジュール |
CN113507810A (zh) * | 2021-09-09 | 2021-10-15 | 凯瑞电子(诸城)有限公司 | 一种组合式电子元件壳体 |
Also Published As
Publication number | Publication date |
---|---|
AU1690999A (en) | 1999-07-19 |
JP3238114B2 (ja) | 2001-12-10 |
EP0967665B1 (en) | 2004-06-09 |
HK1025426A1 (en) | 2000-11-10 |
EP0967665A4 (en) | 2000-08-23 |
WO1999034451A1 (fr) | 1999-07-08 |
CN1222053C (zh) | 2005-10-05 |
US6185941B1 (en) | 2001-02-13 |
DE69824397D1 (de) | 2004-07-15 |
AU750519B2 (en) | 2002-07-18 |
JPH11186617A (ja) | 1999-07-09 |
EP0967665A1 (en) | 1999-12-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: THERMOELECTRIC DEVICES DEVELOPMENT CO. Free format text: FORMER OWNER: ECO 21, INC. Effective date: 20071214 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20071214 Address after: Tokyo, Japan Patentee after: Thermoelectric Device Develop Co., Ltd. Address before: Tokyo, Japan Patentee before: ECO 21, Inc. |
|
ASS | Succession or assignment of patent right |
Owner name: THERMOELECTRIC DEVICE INC. Free format text: FORMER OWNER: THERMOELECTRIC DEVICE DEVELOP CO., LTD. Effective date: 20150812 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150812 Address after: Hokkaido Japan Patentee after: Thermoelectric components Corp Address before: Tokyo, Japan Patentee before: Thermoelectric Device Develop Co., Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160126 Address after: Seoul, South Kerean Patentee after: IG Innotek Co., Ltd. Address before: Hokkaido Japan Patentee before: Thermoelectric components Corp |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20051005 |