CN1243375C - Welding tool, welding bench, front end of welding tool and bench part of welding bench - Google Patents
Welding tool, welding bench, front end of welding tool and bench part of welding bench Download PDFInfo
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- CN1243375C CN1243375C CN 02116194 CN02116194A CN1243375C CN 1243375 C CN1243375 C CN 1243375C CN 02116194 CN02116194 CN 02116194 CN 02116194 A CN02116194 A CN 02116194A CN 1243375 C CN1243375 C CN 1243375C
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Abstract
The present invention provides a bonding toll and a boding stage that have an exchangeable head. The boding toll or bonding stage for mounting semiconductor is composed of the head and a shank part or a pedestal part. The bonding tool is characterized in that a rectangle or circular substrate part to configure the head and a protrusion that protrudes from the substrate part are constructed from one material, the top of the protrusion is coated with vapor-phase synthetic diamond, and the substrate part and the shank part are mechanically fixed or fixed by vacuum suction to each other.
Description
Technical field
The soldering appliance that uses when the present invention relates to semiconductor elements such as IC, LSI are installed and/or the structure of welding bench.
Background technology
For drawing the electrical characteristics that semiconductor element has, the electrode that forms on the needs electrical connection semiconductor element and lead-in wire and this lead-in wire and the such outside terminal of circuit board of assembly.The electrode of semiconductor element side was a lead by the metal fine with formations such as gold or copper with engaging of lead-in wire originally, use is called wire bonding method that engages of instrument capillaceous, uses the soldering appliance and the welding bench that are heated to set point of temperature, to form the zinc-plated lead-in wire that is called film carrier on the Copper Foil of pattern, the method for the unified TAB mode (band is pasted automatically) that connects that leaded be called etc. is carried out on all electrodes on the semiconductor element.Here said soldering appliance and welding bench are installed on the welder and form in pairs.Usually, below the position of the lead portion of the virtual definite semiconductor element of precision, assembly, wiring basal disc etc. in accordance with regulations on the tool-face of welding bench that tool-face is fixedly installed up, by with up the soldering appliance pressurization of tool-face removable setting down being engaged.Method by engaging needs vacuum suction mechanism sometimes in soldering appliance and on welding bench.According to a joint method side or both sides needs heating arrangements all sometimes.
Recently for on semiconductor element and the film or the wiring of formation on glass directly engage, use the soldering appliance and the welding bench that are heated to set point of temperature.
On the other hand, lead-in wire is connected with circuit board, this outside terminal of lead frame, use is heated to the soldering appliance of set point of temperature and welding bench with zinc-plated lead-in wire or not zinc-plated lead-in wire and welding electrode that forms by silk screen printing etc. or gold-plated lead-in wire on circuit board, join gold-plated or silver-plated lead frame to.
Recently, have and directly be attached to lead frame on the semiconductor element through adhesive tapes such as polyamide by the IC chip, then, engage the method that the electrode that forms on the semiconductor element is engaged with lead frame by above-mentioned metal wire, but this moment, when being attached to lead frame on the semiconductor element, use the soldering appliance and the welding bench that are heated to set point of temperature.
Soldering appliance used herein and welding bench are made of shank and leading section and pedestal portion and platform portion.The metallic article that shank and pedestal portion used molybdenum, superhard alloy, nickel-base alloy, tungsten or tungsten alloy, teleoseal, stainless steel, iron-nickel alloy, titanium or titanium alloy etc. to make originally.Be the flatness, mar proof, Temperature Distribution etc. of improvement tool-face, leading section and platform portion are attached to the hardness of matter of vapor phase synthetic diamond, diamond single crystal, diamond sinter, cubic system boron nitride sintered body etc. on the leading section of above-mentioned metal manufacturing and use.The heating of soldering appliance and/or welding bench is installed in above-mentioned shank by the hot block that will insert the deck heater and/or pedestal portion carries out.The deck heater of having assembled the energising heating arrangements on the base materials such as AlN, SiC is inserted between leading section and shank and/or platform portion and the pedestal portion, fixedly carries out by modes such as machinery or vacuum suction.
The soldering appliance originally and the developing thought of welding bench are probably as follows.Lead-in wire of a great variety as goods such as semi-conductive IC, LSI, that each goods connects and wiring number, semiconductor geometries are different.Therefore, need to prepare the soldering appliance and the welding bench of each IC, the special use of LSI goods, the replacing that produces the soldering appliance installed on cost up, the equipment and welding bench needs problems such as the management of time and soldering appliance and welding bench is numerous and diverse.
For addressing this is that, the spy opens in the flat 3-191538 communique, proposes a kind of leading section by machineries such as screw installation soldering appliance and comes the method for dismounting leading section easily.But owing to use screw fashion etc., the long-time use causes screw portion scaling loss, still residual problem that can not the dismounting leading section.
In addition, the spy opens in the flat 8-107129 communique, proposes a kind of improvement that above-mentioned spy is opened flat 3-191538 communique, with the soldering appliance that uses the mode of eccentric shaft as mechanical installation method.In this mode, even if easy disassembling and long-time the use, the fixed part of leading section and shank does not have scaling loss yet.Yet recently service condition becomes harsh, and the cold cycling of repeated disassembled and assembled makes to preventing that the ceramic coating of scaling loss purpose from partly peeling off.As a result, under 500 ℃ high temperature, after about 300,000 times welding, produce scaling loss between leading section and the shank.Scaling loss makes can not be replaced by other leading section.Like this too for the welding bench this point.
In the leading section of existing soldering appliance shown in Figure 8, at first welding covers the matrix part of adamantine ceramic protuberance and metal manufacturing.Then, abrasive body reveals the diamond face of the depth of parallelism of leading section top and bottom, makes to grind holding time.The bottom surface of leading section and the depth of parallelism of tool-face owing to can not adjust, must be welded under the situation more than the adamantine thickness that covers on the tool-face again.When use had the soldering appliance of the inadequate leading section of the depth of parallelism of bottom surface and tool-face, the depth of parallelism when having welder to start was adjusted the very problem of holding time.
In the soldering appliance of structure shown in Figure 8, the protuberance that pottery is made is littler than the coefficient of thermal expansion of the matrix part that metal is made.Therefore, when these two parts passed through solder joints, the thermal stress that the composition surface produces was that the big more thermal stress of protuberance size is big more.Thus, protuberance was from the problem of the metal-stripping of matrix part during appearance was used.Even if cause under the situation about peeling off, because the influence of internal stress, the bottom surface of leading section and the flatness of tool-face change, and installation load is repeatedly accumulated thermal stress at the joint interface place, residual problem of cutting off protuberance.
Soldering appliance has the actual serviceability temperature situation different with design temperature sometimes with welding bench.The tool-face of the soldering appliance of structure shown in Figure 8 is processed into smooth under design temperature by attrition process.But when using under the temperature different with originally design temperature, the coefficient of thermal expansion of the protuberance of matrix part that the metal of leading section is made and pottery manufacturing is different, so the flatness off-design value of leading section.Therefore, evenly engage the difficulty that becomes on the entire tool face, according to circumstances, generation can not engaging portion.This tendency is especially remarkable when the protuberance of leading section increases.Nearest situation is that the size of IC and LSI increases day by day, and the precision of the flatness of the tool-face of soldering appliance and/or welding bench, the Temperature Distribution when using etc. remains on original level and becomes very difficult.
Wish replacing time, the life-saving of shortening instrument.Be the shortening replacing time, the first, there is not scaling loss, the second, the depth of parallelism modulating time between the tool-face of shortening soldering appliance and welding bench, so the precision of the bottom surface of leading section and/or platform portion and tool-face improves very important.In long lifetime, the flatness variation of the tool-face in as far as possible reducing to use and leading section and/or platform portion do not damage very important.
Recently, by the unitized hope of so-called shank of only changing the corresponding various products of leading section has especially been increased.At these nearest diversified situations, goods originally can not be dealt with again.Soldering appliance and welding bench that the present invention's proposition is made further improvement to these problems.
Summary of the invention
The present invention relates to the soldering appliance that a kind of semiconductor that leading section and shank formation are installed is used, the protuberance that it is characterized in that constituting the matrix part of leading section and give prominence to from matrix part is made of same material, the tool-face of protuberance covers with vapor phase synthetic diamond, and this leading section is fixed with this shank mechanical fixation or by vacuum suction.Shank has and in certain position and angular range leading section being fixed to the Unit Installation mechanism that welder is used, having simultaneously leading section is heated to the temperature required mechanism of welding sequence.
Another form of the present invention is the welding bench that the semiconductor of a kind of erecting bed portion and pedestal portion formation is used, the protuberance that it is characterized in that constituting the matrix part of platform portion and give prominence to from matrix part is made of same material, the tool-face of protuberance covers with vapor phase synthetic diamond, and this one is fixed with this pedestal portion mechanical fixation or by vacuum suction.Pedestal portion has in certain position and angular range platform portion being fixed to the installing mechanism that welder is used, and has simultaneously platform portion is heated to the temperature required mechanism of welding sequence.
Soldering appliance and welding bench are used in pairs.Soldering appliance of the present invention can be used in combination with original welding bench, or is used in combination with welding bench of the present invention.And welding bench of the present invention can be used in combination with original soldering appliance.
Soldering appliance of the present invention and/or welding bench, its leading section and/or platform portion are with SiC, Si
3N
4, one of AlN covers the mat gold hard rock by gas phase synthesis method on the sintered body of principal component.
This shank and/or pedestal portion be from select a kind of of molybdenum, superhard alloy, nickel-base alloy, tungsten or tungsten alloy, teleoseal, stainless steel, iron-nickel alloy, titanium or titanium alloy or more than 2 kinds metal constitute.Wherein, teleoseal, as the tungsten-copper alloy of tungsten alloy superior aspect thermal endurance and the processability.
Leading section of the present invention and/or platform portion, the matrix part of formation leading section and/or platform portion and the protuberance of giving prominence to from matrix part are made of same material, and the tool-face of protuberance is made of the vapor phase synthetic diamond cover layer, and above-mentioned leading section is with SiC, Si
3N
4, AlN is the sintered body of principal component one of at least.
The bottom surface of the leading section of soldering appliance and/or welding bench and/or platform portion and the depth of parallelism of tool-face are below 2 microns at normal temperatures.
From the side unilateral observation leading section and/or platform portion to the installation portion of shank and/or pedestal portion the time, have the installation side, this installation side mask has the cross sectional shape of the trapezoidal shape that the length of side or diameter reduce towards tool-face.According to this structure, because the inclined-plane of the side of installation portion and the wedge shape effect of press section can improve bond strength.Gradients by changing the inclined-plane etc. can be confirmed the directivity of leading section.
Front end of welding tool that the present invention obtains and/or bench part of welding bench are characterised in that between 100 ℃ to 550 ℃, the flatness of leading section changes below 1 micron or be arbitrary value, but can have the more than one vacuum suction hole that is used to adsorb semiconductor element on the leading section.Have in leading section and/or the platform portion and be used to adsorb semi-conductive vacuum suction groove and more than one vacuum suction hole.
In leading section of the present invention and/or the platform portion, the surface roughness of the contact-making surface of shank and/or pedestal portion preferably plane surface roughness Ra is below 0.1 micron.This is for guaranteeing the heat conduction between shank and/or pedestal portion and the leading section.Inserting the metal of selecting from soft metals such as gold, silver, copper, platinum, tantalum, nickel, aluminium more than 1 layer or 2 layers between leading section and shank or platform portion and the pedestal portion uses.When especially the depth of parallelism of leading section top and bottom was high, it was easy to adjust the depth of parallelism, and the adaptation of raising and shank, improved heat conduction.
Description of drawings
Fig. 1 is the oblique view of an embodiment of the leading section of expression soldering appliance of the present invention;
Fig. 2 is the oblique view that soldering appliance of the present invention is fixed on leading section shank;
Fig. 3 is the oblique view of an embodiment of expression welding bench leading section of the present invention;
Fig. 4 is the oblique view that welding bench of the present invention is fixed on platform portion pedestal portion;
Fig. 5 is the expression partial section that leading section is installed in the structure of shank of the present invention;
Fig. 6 is the action diagram that the moving component of eccentric shaft of the present invention is transmitted in explanation;
Fig. 7 is the soldering appliance that obtains of comparison the present invention and the figure of the flatness of original soldering appliance;
Fig. 8 is that original soldering appliance is with leading section and the fixing state of shank.
Description of reference numerals:
1: leading section 2: the side is installed
3: matrix part 4: protuberance
5: diamond cover layer (tool-face) 6: vacuum suction hole
10: deck heater accommodation section 11: installation portion
12: press section 14: shank
15: eccentric shaft 16: the parts that transmit eccentric shaft
17: the fulcrum 18 of eccentric shaft: the fulcrum of parts 16
19: thermocouple accommodation section 20: solder side
101: platform portion 102: the side is installed
103: matrix part 104: protuberance
105: diamond cover layer (tool-face) 106: vacuum suction hole
110: leading section 111: installation portion
112: press section 114: pedestal portion
116: the parts 119 that transmit eccentric shaft: thermocouple accommodation section
Embodiment
Making rapid progress of soldering appliance and welding bench is and the short instrument of the same life-span circulation of IC, LSI.And its using method is also as following, even if identical soldering appliance and was compared originally, keeps 2 to 3 times life-span.In addition, IC, LSI rapidly increase, but the dimensional accuracy of instrument etc. do not obtain relaxing.And, under the high temperature from 100 ℃ to hundreds of degree, require flatness at 1 micron with interior dimensional accuracy and there is not scaling loss.
At this market demands, at first select to think the nonreactive each other combination of material of leading section and/or platform portion and shank and/or pedestal portion from following various materials.That is metal and SiC, the Si of superhard alloy, molybdenum, nickel-base alloy, tungsten, tungsten alloy, teleoseal, stainless steel, iron-nickel alloy, titanium or titanium alloy etc., are discussed
3N
4, AlN etc. the various combinations of pottery.
From its result as can be known, shank and pedestal portion can not make complicated shape owing to have thermocouple accommodation section, deck heater accommodation section, and when considering its shape, metal is both economical.
Like this, preferably SiC, Si of the spendable material of matrix part of leading section and/or platform portion
3N
4, AlN etc. pottery.Material in addition is the metal of scaling loss shank in use, and after long-time the use, it is taken out need be for a long time.
Only from preventing the scaling loss consideration, the matrix part 3 of Fig. 1 and Fig. 3 and 103 is SiC, Si
3N
4, the pottery of AlN etc. or the shank 14 of Fig. 2 and the pedestal portion 114 of Fig. 4 be pottery.When shank 14 and pedestal portion 114 are pottery, hard pottery is processed as complicated shape very unfavorable aspect the cost, therefore matrix part can be made as SiC, Si
3N
4, AlN etc. pottery.
For the mechanical fixation method, the figure below using illustrates.Wish that soldering appliance of the present invention is with the leading section of Fig. 1 mounting structure as Fig. 2.Among Fig. 1, the 1st, leading section, the 2nd is installed side, the 3rd, matrix part, the 4th, protuberance, the 5th, diamond cover layer (tool-face).Among Fig. 1, as the example of soldering appliance leading section, expressing matrix part is rectangle, but as shown in Figure 3, matrix part can be circular or have the shape of curved surface.Among Fig. 2, the 14th, shank, the 16th transmits the parts, the 12nd of the motion of eccentric shaft, pressing component, the 19th, thermocouple accommodation section, the 10th, deck heater accommodation section.Welding bench of the present invention wishes it is as mounting structure shown in Figure 4 with leading section shown in Figure 3.Among Fig. 3, the 101st, side, the 103rd is installed, matrix part, the 104th, protuberance, the 105th, diamond cover layer (tool-face) by platform portion, the 102nd.In addition, express matrix part for circular as the example of welding bench leading section among Fig. 3, but as shown in Figure 1, matrix part can be rectangle or have the shape of circular curved surface in addition.Among Fig. 4, the 114th, pedestal portion, the 116th transmits the parts, the 112nd of the motion of eccentric shaft, press section, the 119th, thermocouple accommodation section, the 110th, deck heater accommodation section.
Among Fig. 2 and 4, when the direction of arrow was pushed leading section and/or platform portion, the bottom surface by press section leading section and/or platform portion and shank and/or pedestal portion closely contacted, and guarantees the heat conduction of shank and/or pedestal portion and/or platform portion.This soldering appliance and welding bench are installed on the welder at the installation portion 11 and 111 of shank 14 and pedestal portion 114.
Fig. 5 is to be the partial section that example is expressed the structure of the installation portion when leading section is fixed in shank and/or pedestal portion with the soldering appliance.Under the situation of welding bench, by following leading section being changed to platform portion, shank is changed to pedestal portion can having same mechanism.Leading section is installed on the eccentric shaft 15 of shank 14 by transmission to the fixed structure of shank the parts 16 of motion are mechanically fastened on the shank 14.At this moment, the parts 16 of the motion of transmission eccentric shaft 15 are around fulcrum 18 rotations of parts.
As shown in Figure 5, the parts 16 of the motion of leading section 1 through transmitting eccentric shaft are given as security to shank by eccentric shaft 15.Then, installation thermocouple and deck heater use on the thermocouple accommodation section 19 of shank 14 and the deck heater accommodation section 10.At this moment, leading section is installed on shank by the parts 16 of the motion of press section 12 and transmission eccentric shaft.The installation side of leading section is a wedge shape.In order that well contact with shank.The part that the parts 16 of the motion of transmission eccentric shaft contact with leading section can be the structure identical with the press section.
Fig. 6 presentation graphs 2 is to the details of the fixed structure of soldering appliance shown in Figure 4 and welding bench, and shown in Fig. 6 (A), eccentric shaft 15 is the center rotation in the hope of supporting axis 17, transmits the parts 16 of the motion of eccentric shaft and gives as security to eccentric shaft 15 and with 18 center rotations of indication axle.Like this, fix to shank 14 through this parts 16 instrument leading sections 1 signature.Therefore, in the side view of matrix part, it is the inclined-plane that the side is installed at least, also can be trapezoidal shape.Certainly the installation side of the two can all be the inclined-plane.Shown in Fig. 6 (B), if repercussion rotation eccentric axis 15, then parts 16 break away from from leading section, can take out leading section 1.
When the present invention exceeds 15mm in the maximum length of soldering appliance and welding bench protuberance, when especially exceeding 20mm, show big effect.Because when maximum length is big, do not eliminate the protuberance device different of leading section and/or platform portion with the thermal expansion of matrix part.And, among the present invention, the bottom surface of leading section and/or platform portion, promptly the surface roughness of the part that contacts with shank and/or pedestal portion is little better.The surface roughness of bottom surface is below 0.1 micron for average surface roughness Ra, and then the heat conduction between shank and/or pedestal portion and leading section and/or the platform portion does not have problem in actual use.
Among the present invention, the bottom surface of the matrix part of leading section and/or platform portion and the depth of parallelism of tool-face are better below 2 microns.The bottom surface before this covers by the diamond with leading section and/or platform portion easily and the depth of parallelism of tool-face are located at 5 microns with the realization of getting off.When exceeding 5 microns, after diamond covered, processing accomplished that than the more unmanageable diamond of pottery the processing charges of the depth of parallelism below 2 microns are too high.The effect of the leading section before the raising diamond covers and/or the precision of platform portion is that but attenuate covers diamond layer except that above-mentioned.Can shorten the diamond cover time or usually the diamond particle diameter after synthetic is little, and level and smooth, therefore can shorten milling time in short-term the diamond cover time.Because when generated time was long, particle was grown up.At this, the boundary of the depth of parallelism after welds types originally will be welded is made as about 11 microns.
It is even that additional features of the present invention is that whole of part that cover the thin and effect of diamond layer goes up adamantine thickness.Its thickness range height to 7 micron.The mensuration of the bottom surface of matrix part and the depth of parallelism of tool-face is by placing leading section and/or platform portion and make the contact pilotage mensuration of coming on diamond layer on the price fixing.
Describe the present invention in detail below by embodiment.
At first, below the SiC piece of 36mm * 36mm * 11mm processes the matrix part of shape shown in Figure 1, be 5.4mm * 30.4mm, highly be that 6mm, whole height are the leading section of 10mm for 35mm * 35mm, protuberance width.To get out 3 apertures from the tool-face side of protuberance the hole of diameter 6mm, degree of depth 2.5mm be 0.5mm, hole depth 0.5mm, begin the aperture from bottom surface side is 1.8mm, deeply for the vacuum suction hole of 7mm, as through hole.Vacuum suction semiconductors etc., the limit is moved side weld and is connect.0.2mm width, miter angle degree are pressed to each seamed edge enforcement face processing in the tool-face edge, and the effective dimensions of protuberance is processed as 5mm * 30mm.
As filament (filament), the known CVD method of the tungsten line by using diameter 0.5mm, long 100mm, the thick 50 microns polycrystalline diamond of covering on the tool-face of above-mentioned leading section.Coverage condition is as follows.
Unstrpped gas (flow): CH4/H2=1%
Total flow: 500CC/min
Air pressure: 1000Pa
Filament temperature: 2200 ℃
Filament and protuberance coverage rate spacing: 5mm
SiC temperature: 920 ℃
The diamond cover layer 5 usefulness diamond sand paper that obtain grind, and the effective dimensions of making protuberance is the leading section of 5mm * 30mm.On the shank that teleoseal shown in Figure 2 forms, on the eccentric shaft that same material forms, fix the leading section 1 of the soldering appliance that obtains like this through clamp lever.Shank processing shown in Figure 2 is by the hole (not occurring among the figure) in vacuum suction hole 6.Therefore the vacuum suction hole that is arranged on before the covering on the protuberance does not cover diamond, and being provided with behind the diamond cover layer also is through hole.
Equally, as a comparative example, make the soldering appliance of original structure shown in Figure 8.Protuberance is by behind the polycrystalline diamond of 50 microns of coverings on the SiC substrate of (length) 60mm * (wide) 60mm * (height) 3mm, and the size that is cut into 5.4mm * 30.4mm is made.Matrix part is by shape machining teleoseal making in accordance with regulations.Then protuberance and matrix part are used as leading section with silver soldering agent joint.Among this figure, the 20th, the matrix part that protuberance that the SiC of covering polycrystalline diamond constitutes and cobalt constitute is by the product of solder bonding.Other identical samples of making comparative example with present embodiment.
In the soldering appliance that obtains like this, relatively the tool-face surface temperature distribution of 500 ℃ of the temperature of the top and bottom depth of parallelism of leading section, thermocouple portion, the burn-out test, the persistence that the load that applies 20kg under normal temperature is heated to the temperature of the persistence of joint interface of 600 ℃ and matrix part when cooling off repeatedly and protuberance and 600 ℃ carries out 2,000,000 times of leading section and shank when being heated to 500 ℃.The result is as shown in table 1.
Table 1
| Content of the test | The present invention | Original product |
| The leading section top and bottom depth of | 1 micron | 11 microns |
| The tool-face surface temperature distribution | 6℃ | 10℃ |
| The leading section burn-out test | Not unusual | Confirm scaling loss after 300,000 times |
| Thermal cycling test | Not unusual | Cut off in the protuberance generation after 24 times |
| 600 ℃ of soldering tests | Not unusual | Cut off in the leading section generation after 1,200,000 times |
Experimental condition is as follows.
Tool-face surface temperature distribution: high, the minimum temperature difference of the tool-face the when temperature of thermocouple portion is 500 ℃.
The leading section burn-out test: behind 500 ℃, load 20kg, 1,000,000 soldering tests, per 100,000 affirmations can be taken out leading section.
Thermal cycling test: be heated to 600 ℃ and kept 2 hours or the circulation of returning normal temperature is carried out 100 times from normal temperature.
600 ℃ of soldering tests: 600 ℃, increase the weight of 20kg, 2,000,000 soldering tests.
Originally in the product, the depth of parallelism of the leading section top and bottom after matrix part and the protuberance welding worsens.Tilt to grind by the diamond sand paper that it is used #170, adjust and be worked into 11 microns of the depth of parallelisms.This is owing to be for adjusting the depth of parallelism grinding of tilting, can not be ground to diamond film and partly disappear, because can not carry out the adjustment more than this value.At this, among the present invention, by directly covering the welded structure that do not have of polycrystalline diamond,, realize that the depth of parallelism is 1 micron precision because the depth of parallelism that produces of welding worsens to protuberance.The flatness of leading section top and bottom is below 5 microns before covering diamond, realizes the precision after the above-mentioned covering easily.Among the present invention, leading section does not have weld part, and therefore all items is more superior than comparative example in the above-mentioned test.
Embodiment 2
Below the SiC piece of 32mm * 12mm processes the matrix part of shape shown in Figure 3, be 5.4mm * 30.4mm, highly be that 6mm, whole height are the platform portion of 110mm for φ 31mm, protuberance width.To get out 3 apertures from the tool-face side of protuberance the hole of diameter 6mm, degree of depth 2.5mm be 0.5mm, hole depth 0.5mm, begin the aperture from bottom surface side is 1.8mm, deeply for the vacuum suction hole of 7mm, as through hole.Vacuum suction semiconductors etc., the limit is moved side weld and is connect.0.2mm width, miter angle degree are pressed to each seamed edge enforcement face processing in the tool-face edge, and the effective dimensions of protuberance is processed as 5mm * 30mm.
As filament, the known CVD method of the tungsten line by using diameter 0.5mm, long 100mm, the thick 50 microns polycrystalline diamond of covering on the protuberance that SiC makes.Coverage condition is as follows.
Unstrpped gas (flow): CH4/H2=1%
Total flow: 500CC/min
Air pressure: 1000Pa
Filament temperature: 2200 ℃
Filament and protuberance coverage rate spacing: 5mm
SiC temperature: 920 ℃
The diamond cover layer 5 usefulness diamond sand paper that obtain grind, and the effective dimensions of making protuberance is the platform portion of 5mm * 30mm.In the pedestal portion that teleoseal shown in Figure 4 forms, on the eccentric shaft that same material forms, fix the platform portion 1 of the welding bench that obtains like this through clamp lever.The processing of pedestal shown in Figure 4 portion is by the hole (occurring among the figure) in vacuum suction hole 6.Therefore the vacuum suction hole that is arranged on before the covering on the protuberance does not cover diamond, and being provided with behind the diamond cover layer also is through hole.
Equally, as a comparative example, make the welding bench of the original structure of same spline structure shown in Figure 8.Protuberance is by behind the polycrystalline diamond of 50 microns of coverings on the SiC substrate of (length) 60mm * (wide) 60mm * (height) 3mm, and the size that is cut into 5.4mm * 30.4mm is made.Matrix part is by shape machining teleoseal making in accordance with regulations.Then protuberance and matrix part are engaged with the silver soldering agent.
In the welding bench that obtains like this, relatively the tool-face surface temperature distribution of 500 ℃ of the temperature of the depth of parallelism of the bottom surface of platform portion and tool-face, thermocouple portion, the burn-out test, the persistence that the load that applies 20kg under normal temperature is heated to the temperature of the persistence of joint interface of 600 ℃ and matrix part when cooling off repeatedly and protuberance and 600 ℃ carries out 2,000,000 times of platform portion and pedestal portion when being heated to 500 ℃.The result is as shown in table 2.
Table 2
| Content of the test | The present invention | Original product |
| The platform portion top and bottom depth of parallelism | 0.8 | 15 microns |
| The tool-face surface temperature distribution | 6℃ | 10℃ |
| Platform portion burn-out test | Not unusual | Confirm scaling loss after 300,000 times |
| Thermal cycling test | Not unusual | Cut off in the protuberance generation after 24 times |
| 600 ℃ of soldering tests | Not unusual | Cut off in the leading section generation after 1,200,000 times |
Experimental condition is as follows.
Tool-face surface temperature distribution: high, the minimum temperature difference of the tool-face the when temperature of thermocouple portion is 500 ℃.
Platform portion burn-out test: behind 500 ℃, load 20kg, 1,000,000 soldering tests, per 100,000 affirmations can be taken out leading section.
Thermal cycling test: be heated to 600 ℃ and kept 2 hours or the circulation of returning normal temperature is carried out 100 times from normal temperature.
600 ℃ of soldering tests: 600 ℃, increase the weight of 20kg, 2,000,000 soldering tests.
Originally in the product, the depth of parallelism of the platform portion top and bottom after matrix part and the protuberance welding worsens.Tilt to grind by the diamond sand paper that it is used #170, adjust and be worked into 15 microns of the depth of parallelisms.This is owing to be for adjusting the depth of parallelism grinding of tilting, can not be ground to diamond film and partly disappear, because can not carry out the adjustment more than this value.To this, among the present invention, by directly covering the welded structure that do not have of polycrystalline diamond,, realize that the depth of parallelism is 0.8 micron precision because the depth of parallelism that produces of welding worsens to protuberance.The flatness of platform portion top and bottom is below 5 microns before covering diamond, realizes the precision after the above-mentioned covering easily.
Among the present invention, platform portion does not have weld part, and therefore all items is more superior than comparative example in the above-mentioned test.
Soldering appliance of the present invention and the soldering appliance investigation temperature of comparative example and the relation of flatness of using embodiment 1 to make.It is installed in respectively on the shank shown in Figure 2, by the surface temperature of deck heater heats tools for measurement face and the flatness of the tool-face under this temperature.Its result as shown in Figure 7.The mensuration of flatness is documented in the spy and opens in the flat 5-326642 communique.Push gold thread etc. on the tool-face of soldering appliance, the flatness of measuring the gold thread after this transcription is used as the flatness of tool-face.
The measurement result of welds types originally represents that with Δ measurement result of the present invention is represented with black circle.As shown in Figure 7, under the situation of the present invention, in 100 ℃ to 550 ℃ scope, almost do not change.At this, originally product be temperature more high flat degree change towards recessed direction more.This is because the pottery of the protuberance of matrix part welding is littler than the thermal expansion metal rate of matrix part.Opposite with it, a body component does not have difference because of coefficient of thermal expansion, and not welding, has not had the thermal expansion difference of weld part yet.
Welding bench of the present invention is also measured equally, obtains the result identical with present embodiment.
As mentioned above, the soldering appliance that obtains according to the present invention and/or welding bench have a large feature of changing as far as possible leading section for various tool shape, and fixed part can scaling loss yet in long-time the use. In addition, owing to there is not the junction surface of the generations such as the such welding of original soldering appliance, therefore has as welder and generally keep the processing charges of the depth of parallelism, the feature that the adjustment expense also becomes cheap.
Claims (11)
1. one kind the soldering appliance that semiconductor that leading section and shank (shank) constitute is used is installed, it is characterized in that: the matrix part of formation leading section and the protuberance of giving prominence to from matrix part are made of same material, the tool-face of protuberance covers with vapor phase synthetic diamond, and this leading section is fixed with this shank mechanical fixation or by vacuum suction.
2. the welding bench used of the semiconductor that constitutes of erecting bed portion and pedestal portion, it is characterized in that: the matrix part of formation platform portion and the protuberance of giving prominence to from matrix part are made of same material, the tool-face of protuberance covers with vapor phase synthetic diamond, and this one is fixed with this pedestal portion mechanical fixation or by vacuum suction.
3. soldering appliance as claimed in claim 1 or 2 and/or welding bench is characterized in that: leading section and/or platform portion are by with SiC, Si
3N
4, one of AlN is that the sintered body of principal component constitutes, and covers the mat gold hard rock by gas phase synthesis method on this tool-face.
4. soldering appliance as claimed in claim 1 or 2 and/or welding bench is characterized in that: shank and/or pedestal portion are from a kind of of molybdenum, superhard alloy, nickel-base alloy, tungsten or tungsten alloy, teleoseal, stainless steel, iron-nickel alloy, titanium or titanium alloy selection or more than 2 kinds.
5. front end of welding tool and/or bench part of welding bench is characterized in that: constitute the matrix part of leading section and/or platform portion and constitute by same material from the outstanding protuberance of matrix part, by this same material with SiC, Si
3N
4, AlN one of at least is that the sintered body of principal component constitutes, the tool-face of protuberance is made of the vapor phase synthetic diamond cover layer.
6. front end of welding tool as claimed in claim 5 and/or bench part of welding bench is characterized in that: the bottom surface of above-mentioned leading section and/or platform portion and the depth of parallelism of tool-face are below 2 microns at normal temperatures.
7. as claim 5 or 6 described front end of welding tool and/or bench part of welding bench, it is characterized in that: unilateral observation from the side is during to the installation portion of shank and/or pedestal portion, have the installation side, this installation side mask has the cross sectional shape of the trapezoidal shape that the length of side or diameter reduce towards tool-face.
8. as described front end of welding tool in one of claim 5 or 6 and/or bench part of welding bench, it is characterized in that: between 100 ℃ to 550 ℃, the flatness of tool-face changes in 1 micron.
9. as described front end of welding tool in one of claim 5 or 6 and/or bench part of welding bench, it is characterized in that: have the more than one vacuum suction hole that is used to adsorb semiconductor element on the tool-face of leading section and/or platform portion.
10. as described front end of welding tool in one of claim 5 or 6 and/or bench part of welding bench, it is characterized in that: have on the tool-face of leading section and/or platform portion and be used to adsorb semi-conductive vacuum suction groove and more than one vacuum suction hole.
11., it is characterized in that: insert the metal of selecting from gold, silver, copper, platinum, tantalum, nickel, aluminium soft metal more than 1 layer or 2 layers between leading section and shank or platform portion and the pedestal portion as claim 1,2, one of 5 or 6 described soldering appliance and/or welding benches.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-127511 | 2001-04-25 | ||
| JP2001127511 | 2001-04-25 | ||
| JP2001127511 | 2001-04-25 | ||
| JP2002056989 | 2002-03-04 | ||
| JP2002-056989 | 2002-03-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1383196A CN1383196A (en) | 2002-12-04 |
| CN1243375C true CN1243375C (en) | 2006-02-22 |
Family
ID=36096133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02116194 Expired - Fee Related CN1243375C (en) | 2001-04-25 | 2002-04-23 | Welding tool, welding bench, front end of welding tool and bench part of welding bench |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1243375C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117790344A (en) * | 2023-12-28 | 2024-03-29 | 北京寰宇晶科科技有限公司 | Ceramic riving knife with composite CVD diamond coating and preparation method thereof |
-
2002
- 2002-04-23 CN CN 02116194 patent/CN1243375C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1383196A (en) | 2002-12-04 |
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