CN1241088C - Separate low-noise heat dissipating system of great-power very thin computer system unit - Google Patents
Separate low-noise heat dissipating system of great-power very thin computer system unit Download PDFInfo
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- CN1241088C CN1241088C CN 02103588 CN02103588A CN1241088C CN 1241088 C CN1241088 C CN 1241088C CN 02103588 CN02103588 CN 02103588 CN 02103588 A CN02103588 A CN 02103588A CN 1241088 C CN1241088 C CN 1241088C
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- power supply
- cabinet
- radiator
- power
- heating radiator
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Abstract
The present invention relates to a separate low noise heat dissipating system of a high power ultrathin computer host, which comprises a cabinet. The cabinet is provided with a front panel, a back plate, two side plates, a top plate and a bottom plate. A power supply, a radiator, an optical drive and a hard disk are fixedly arranged in the cabinet. A front air inlet is arranged on the front panel. The power supply is arranged on the bottom of the cabinet. An expansion card and a display card are arranged above the power supply. An upper air outlet is arranged on the top plate of the cabinet. The radiator is arranged below the upper air outlet. A main board and a central processing unit are arranged at one side of the radiator. Side air inlets are arranged on the side plates of the cabinet corresponding to the other side of the radiator. The back part of the power supply is provided with a back air outlet. A second radiator fan is arranged on the power supply. A system radiator fan is arranged above the radiator. A third radiator fan is arranged below the radiator. The present invention can reduce the temperature of the inlet of the radiator, causes hot air passing through the radiator to be directly discharged outside the system without passing through the power supply and thereby, enhances heat dissipating efficiency and can reduce noise.
Description
[technical field]
The present invention relates to a kind of cooling system of host computer, refer to a kind of separate low-noise cooling system of high-power very thin computer main frame especially.
[background technology]
At present, the radiating mode of computer equipment is based on air-cooled, and total heat dissipation capacity of system is directly proportional with the temperature rise of the air of ventilation and turnover system.Growth along with computer CPU power, heat dissipation technology is had higher requirement, especially for ultrathin computing machine, because the finite volume of system, the volume of cabinet is less, can't meet the requirements of ventilation, the radiating layout of common overhead power supply can't solve the heat radiation requirement of Intel Northwood-FMB2 CPU among the ultrathin PC of new generation.
Existing ultrathin PC on the market, its cooling system uses the heating radiator of side-blown mostly, this heating radiator is provided in a side of position on the upper side, cabinet rear portion, expansion card, video card are located at heating radiator below, cabinet rear portion, and mainboard and central processing unit are located at heating radiator one side, and system fan is located at the heating radiator top, CD-ROM drive, hard disk are located at the cabinet front portion, power supply is located at above the heating radiator at cabinet rear portion, the power supply rear portion is provided with air outlet, and the cabinet front portion then is provided with fresh air inlet.Cold air enters from the fresh air inlet of cabinet front portion, by discharging outside the cabinet through power supply rear portion air outlet by power supply after CD-ROM drive, hard disk, the heating radiator cooling CPU again.Though the wind path of this cooling system is more smooth and easy, but hot-air by heating radiator, with hot-air in the cabinet system all is to discharge outside the cabinet by power supply, make and enter the cold wind temperature drift that heating radiator enters the mouth, less with the temperature difference of heating radiator, the cold wind temperature that enters power supply is just higher, so radiating efficiency is lower.When the power of the power of CPU and each parts of system was low, this cooling system can also satisfy the requirement of system radiating; But raising gradually along with cpu power, just can only be by power that improves system fan and the requirement that rotating speed satisfies system radiating, this will cause exceeding standard of noise again, if the heat radiation power of CPU and system further improves, this cooling system just far can not reach the required ventilation of each parts of CPU and system and the requirement of heat radiation.
In addition, expansion card, video card are located at heating radiator below, cabinet rear portion dead angle area, and it is not smooth to ventilate, and is unfavorable for heat radiation.
[summary of the invention]
The separate low-noise cooling system that the purpose of this invention is to provide a kind of high-power very thin computer main frame, can solve the problems referred to above of the cooling system existence of present host computer, optimize the wind path of cooling system, to separate by the wind path that heating radiator reaches by power supply, can reduce the temperature of heating radiator inlet, make hot-air by heating radiator outside directly discharge system of power supply, thereby raising radiating efficiency, reaching the required ventilation of high-power very thin computer host CPU and each parts of system and the requirement of heat radiation, and can reduce noise.
In order to achieve the above object, the invention provides a kind of separate low-noise cooling system of high-power very thin computer main frame, comprise cabinet, this cabinet has front panel, postnotum, two side plates, top board, base plate, be provided with power supply, central processing unit and mainboard, heating radiator, CD-ROM drive, hard disk at the cabinet internal fixation, plate is provided with preceding fresh air inlet in front, it is characterized in that:
This power supply is located at the cabinet bottom, the power supply top is provided with expansion card, video card, this cabinet top board is provided with air outlet opening, heating radiator is located at the air outlet opening below, mainboard and central processing unit are located at this heating radiator one side, are provided with the side fresh air inlet on the cabinet side board of heating radiator opposite side correspondence, are provided with the back air outlet opening at the power supply rear portion, be provided with first radiator fan in the power supply inboard, above heating radiator, be provided with the system radiating fan.
Purpose of the present invention can also following mode reach:
This hard disk can be arranged on power supply the place ahead, cabinet bottom towards preceding fresh air inlet place, and CD-ROM drive is arranged on the hard disk top.
This first radiator fan can be located at the top of power supply inboard.Can be provided with second radiator fan under heating radiator, this side fresh air inlet is towards the side on the lower side of second radiator fan.
This first radiator fan also can be located at the front portion of power supply inboard.
Also can be provided with a dividing plate above this power supply, this dividing plate is separated into upper and lower two accommodation spaces with cabinet inside, and this first radiator fan that makes power supply and be located at the power supply front portion is closed in the accommodation space of bottom.
Advantage of the present invention is:
1. the CPU heating nucleus of power supply and system is separated, do not interacted; Be provided with the side fresh air inlet by cabinet side board, directly cold air is introduced the heating radiator air intake vent, pass through outside the directly discharge system of hot-air of heating radiator by the last air outlet opening handle on the cabinet top board, the fin of heating radiator is in the very low environment of temperature, increased heat transfer temperature difference, fin efficiency increases, and improves the radiating efficiency of heating radiator, reduces to minimum to the influence of the air themperature in the cabinet main pyrotoxin central processing unit.
2. the using system radiator fan and second radiator fan are connected and are improved radiating effect, use first radiator fan that is located at power supply top to optimize wind path; The inlet of cpu heat is operated under the low-down temperature, and the radiating effect that makes complete machine of system layout improves, and can select more slow-revving radiator fan for use and reduce noise.
3. hard disk is placed between the air intake vent of the preceding fresh air inlet of cabinet and power supply, strengthen the radiating effect of hard disk;
4. can effectively avoid of the influence of the hot blast of process heating radiator, reduce the manufacturing cost of power supply power supply;
5. the video card of system and expansion card are in lower environment temperature, the internal system dead angle of not dispelling the heat.Among the present invention, the length of power supply can change, and heating radiator can use aluminium extruded, slotting wing and welding etc. to make mode.
[description of drawings]
Fig. 1 is the three-dimensional appearance synoptic diagram of a kind of preferred embodiment of the present invention.
Fig. 2 is the structural representation of a kind of preferred embodiment of the present invention.
Fig. 3 is the structural representation of another kind of preferred embodiment of the present invention.
[embodiment]
With reference to Fig. 1,2, the separate low-noise cooling system of a kind of high-power very thin computer main frame of the present invention, comprise cabinet 10, this cabinet has front panel 11, postnotum 12, two side plates 13, top board 14, base plate 15, be provided with power supply 20, central processor CPU and mainboard (figure does not show), heating radiator 50, CD-ROM drive 40, hard disk 30 at cabinet 10 internal fixation, fresh air inlet 111 before plate 11 is provided with in front.
As Fig. 2, shown in 3, this power supply 20 is located at cabinet 10 bottoms, power supply 20 tops are provided with expansion card and video card 80, these cabinet 10 top boards 14 are provided with air outlet opening 141, heating radiator 50 is located at air outlet opening 141 belows, mainboard and CPU are located at this heating radiator 50 1 sides, on the cabinet side board 13 of heating radiator 50 opposite side correspondences, be provided with side fresh air inlet 131, be provided with back air outlet opening 201 at power supply 20 rear portions, be provided with first radiator fan 202 on the top of power supply inboard, be provided with system radiating fan 51 above heating radiator 50, also be provided with second radiator fan 52 below heating radiator 50, this side fresh air inlet 131 is towards the side on the lower side of second radiator fan 52.Second radiator fan 52 and the layout that system radiating fan 51 is in series can obviously improve the radiating effect of heating radiator, and can select more slow-revving radiator fan for use and reduce noise.By side fresh air inlet 131, directly cold air is introduced heating radiator 50 air intake vents, by the last air outlet opening on the cabinet top board 14 141 hot-air through heating radiator 50 is directly derived, can improve radiating efficiency greatly.
This hard disk 30 is arranged on cabinet 10 bottom power supplys 20 the place aheads towards preceding fresh air inlet 111 places, and the air draught effect of first radiator fan 202 by power supply 20 is strengthened the cooling of hard disk 30.CD-ROM drive 40 is arranged on hard disk 30 tops.As shown in Figure 3, this first radiator fan 202 also can be located at the front portion of power supply 20 inboards, also can be provided with a dividing plate 203 above this power supply 20, because power supply 20 thermal values are big, the temperature of power supply wall will make the space air themperature of power supply top raise, and the heat radiation of video card is caused bad influence.This dividing plate 203 is separated into upper and lower two accommodation spaces with cabinet inside, and this first radiator fan 202 that makes power supply 20 and be located at power supply 20 front portions is closed in the accommodation space of bottom, forms relatively independent ventilation wind path, separates with the CPU heat dissipation region.
Claims (6)
1, a kind of separate low-noise cooling system of high-power very thin computer main frame, comprise cabinet, this cabinet has front panel, postnotum, two side plates, top board, base plate, be provided with power supply, central processing unit and mainboard, heating radiator, CD-ROM drive, hard disk at the cabinet internal fixation, plate is provided with preceding fresh air inlet in front, it is characterized in that:
This power supply is located at the cabinet bottom, the power supply top is provided with expansion card, video card, this cabinet top board is provided with air outlet opening, heating radiator is located at the air outlet opening below, mainboard and central processing unit are located at this heating radiator one side, are provided with the side fresh air inlet on the cabinet side board of heating radiator opposite side correspondence, are provided with the back air outlet opening at the power supply rear portion, be provided with first radiator fan in the power supply inboard, above heating radiator, be provided with the system radiating fan.
2, the separate low-noise cooling system of high-power very thin computer main frame as claimed in claim 1 is characterized in that: this hard disk is arranged on power supply the place ahead, cabinet bottom towards preceding fresh air inlet place, and CD-ROM drive is arranged on the hard disk top.
3, the separate low-noise cooling system of high-power very thin computer main frame as claimed in claim 1 or 2, it is characterized in that: this first radiator fan is located at the top of power supply inboard.
4, the separate low-noise cooling system of high-power very thin computer main frame as claimed in claim 3 is characterized in that: be provided with second radiator fan below heating radiator, this side fresh air inlet is towards the side on the lower side of second radiator fan.
5, the separate low-noise cooling system of high-power very thin computer main frame as claimed in claim 1 or 2, it is characterized in that: this first radiator fan is located at the front portion of power supply inboard.
6, the separate low-noise cooling system of high-power very thin computer main frame as claimed in claim 5, it is characterized in that: this power supply top is provided with a dividing plate, this dividing plate is separated into upper and lower two accommodation spaces with cabinet inside, and power supply and this first radiator fan are closed in the accommodation space of bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02103588 CN1241088C (en) | 2002-02-07 | 2002-02-07 | Separate low-noise heat dissipating system of great-power very thin computer system unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02103588 CN1241088C (en) | 2002-02-07 | 2002-02-07 | Separate low-noise heat dissipating system of great-power very thin computer system unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1437088A CN1437088A (en) | 2003-08-20 |
| CN1241088C true CN1241088C (en) | 2006-02-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02103588 Expired - Fee Related CN1241088C (en) | 2002-02-07 | 2002-02-07 | Separate low-noise heat dissipating system of great-power very thin computer system unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1241088C (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100372023C (en) * | 2004-09-27 | 2008-02-27 | 明基电通股份有限公司 | Cd-rom |
| CN100351737C (en) * | 2005-06-15 | 2007-11-28 | 娄晓洲 | Centralized heat dissipation type heat pipe cabinet apparatus |
| CN102012728A (en) * | 2010-11-26 | 2011-04-13 | 中山市锐盈电子有限公司 | Centralized radiation type computer case |
| CN102629153B (en) * | 2012-03-15 | 2014-07-16 | 深圳市七彩虹科技发展有限公司 | Heat dissipation system for main case |
| CN103123534B (en) * | 2012-12-31 | 2016-08-03 | 联宝(合肥)电子科技有限公司 | The separate type heat dissipating method of cooling system and cooling system |
| CN105759923A (en) * | 2014-12-18 | 2016-07-13 | 研祥智能科技股份有限公司 | Separating type radiating device and method for closed industrial computer |
| CN105373195A (en) * | 2015-11-19 | 2016-03-02 | 天津市中企九胜科技有限公司 | Computer host |
| CN109669519A (en) * | 2017-10-16 | 2019-04-23 | 鸿富锦精密工业(武汉)有限公司 | Mainboard structure and cabinet including the mainboard structure |
| CN107943254B (en) * | 2017-12-15 | 2019-10-25 | 商洛学院 | A kind of portable computer device and its radiating module |
| CN114637379A (en) * | 2022-03-24 | 2022-06-17 | 深圳华大智造科技股份有限公司 | Biological information analysis device |
-
2002
- 2002-02-07 CN CN 02103588 patent/CN1241088C/en not_active Expired - Fee Related
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| CN1437088A (en) | 2003-08-20 |
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