CN1226436C - Lowmelting intermadiate alloy of copper and phosphor base and preparation method - Google Patents
Lowmelting intermadiate alloy of copper and phosphor base and preparation method Download PDFInfo
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- CN1226436C CN1226436C CN 200310105444 CN200310105444A CN1226436C CN 1226436 C CN1226436 C CN 1226436C CN 200310105444 CN200310105444 CN 200310105444 CN 200310105444 A CN200310105444 A CN 200310105444A CN 1226436 C CN1226436 C CN 1226436C
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Abstract
The present invention relates to low melting point copper-phosphorus master alloy used for thinning primary crystal silicon in aluminum-silicon alloy, and a preparation method thereof. The master alloy comprises the chemical constitutions of copper, phosphorus, silicon, nickel, antimony, bismuth, manganese and silver. The present invention comprises the preparation procedures of proportionally preparing industrial pure copper, red phosphorus, crystal silicon, electrolytic nickel, pure antimony, pure bismuth, electrolytic manganese and silver, pulverizing the crystal silicon into particles, evenly mixing the crystal silicon and red phosphorus powder, packing up by copper foil, melting electrolytic pure copper in a smelting furnace, orderly adding weighed nickel, antimony, bismuth, manganese and silver, rapidly stirring to complete reaction, and directly pouring into ingots or preparing into minute granules. The master alloy has the advantages of no pollution during use, low density, low melting point, high melting speed, stable deterioration effect and long effect, and can replace copper-phosphorus master alloy.
Description
Technical field
The invention belongs to metal material field, particularly relate to a kind of low melting-point coper-phosphorus base master alloy that is used for refinement aluminum-silicon alloy primary silicon and preparation method thereof.
Background technology
Primary silicon in the aluminum-silicon alloy has only through after the refinement just can make this type of alloy have using value.The general method that adds phosphorus that adopts is come refinement primary silicon (also claiming rotten the processing) in the industrial production, mainly is to add with red phosphorus, microcosmic salt or copper-forms such as phosphorus master alloy.But these methods all exist many shortcomings: the burning-point of red phosphorus low (240 ℃), transport dangerously, and and rotten time reaction is violent, produces a large amount of deleterious P
2O
5Gas, seriously contaminate environment; Also there is problem of environmental pollution in microcosmic salt effect instability in the use; Copper-phosphorus master alloy fusing point height joins back infusibilityization in the aluminium alloy, easily segregation, effect instability.For this reason, carry out long-term exploration both at home and abroad, attempted to seek the copper-phosphorus base master alloy of a kind of ideal low melting point, refinement primary silicon.The patent No. is that the Chinese patent of ZL 01 1 07704.2 has been reported Solder for Al-Cu Joint Welding-phosphorus master alloy and preparation method thereof, by 90.0-97.0% aluminium, and 2.0-6.0% phosphorus, 0.5-5.0% copper is formed, and prepares by fusion casting.When aluminum-silicon alloy go bad processing, solved pollution problem preferably, but phosphorus content is lower with the Solder for Al-Cu Joint Welding-phosphorus master alloy of this inventive method preparation, is 0.5-5%, add-on is bigger in use.
Summary of the invention
The objective of the invention is to overcome above-mentioned the deficiencies in the prior art, a kind of pollution-free, phosphorus content is high, fusing point is low and easy to use copper-phosphorus base master alloy and preparation method thereof is provided.
The present invention realizes in the following manner:
Copper-phosphorus base master alloy, comprise copper and phosphorus, it is characterized in that it also comprises nickel, silicon, antimony, bismuth, manganese and silver, the mass percent of each component is: copper 70.00-90.00, phosphorus 6.00-18.00, silicon 0.01-10.00, nickel 0.01-5.00, antimony 0.01-5.00, bismuth 0.01-2.00, manganese 0.01-2.00 or silver-colored 0.001-0.02.
The preparation method of above-mentioned copper-phosphorus base master alloy, realize by following steps:
(1) mass percent by tough cathode 70.0～90.0%, red phosphorus 6.0～18.0%, silicon metal 0.01～10.0%, electrolytic nickel 0.01～5.00%, star antimony 0.01～5.0%, pure bismuth 0.01～2.00%, pure manganese 0.01～2.0% or silver 0.001～0.02% takes by weighing raw material;
(2) silicon metal being ground into diameter is particle below 1 millimeter, and mixes with the red phosphorus powder, wraps with Copper Foil then;
(3) in smelting furnace, tough cathode is melted to 1100 ℃～1400 ℃, at first the silicon metal wrapped and the powder mix of red phosphorus is pressed in the copper melts, add nickel, antimony, bismuth, manganese and the silver material that has taken by weighing then successively, be stirred to rapidly and react completely;
(4) direct casting ingot-forming or make tiny particulate state with atomising unit etc.
This master alloy has fusing point low (640 ℃～700 ℃), density than copper-the phosphorus master alloy is little, phosphorus content is than advantages such as copper-phosphorus master alloy height (can reach 18%) and modification effect are stable.Be that the size that can make primary silicon in the aluminum-silicon alloy is a kind of new and effective aluminum-silicon alloy alterant by refineing to below the 50 μ m more than the 150 μ m under 0.3% the situation in add-on.
Embodiment
Provide a most preferred embodiment of the present invention below:
Embodiment 1
(1) at first takes by weighing raw material by the mass ratio of tough cathode 80.00%, red phosphorus 11.00%, silicon metal 5.00%, electrolytic nickel 2.00%, star antimony 2.00%, pure bismuth 0.60%, pure manganese 0.40%;
(2) silicon metal is ground into diameter and is being particle below 1 millimeter, and mix, wrap with Copper Foil then with the red phosphorus powder;
(3) with industrial pure copper fusing and be warming up to 1250 ℃, at first be pressed into the powder mix of the silicon metal wrapped and red phosphorus in the copper melts and until reacting completely, the electrolytic nickel, star antimony and the pure manganese raw material that have taken by weighing of adding successively then is stirred to rapidly and reacts completely;
(4) direct casting ingot-forming or make tiny particulate state with atomising unit etc.
Obtain a kind of copper-phosphorus base master alloy of optimal components according to said ratio, its chemical ingredients (mass percent) is: phosphorus 10, silicon 5%, nickel 2, antimony 2, bismuth 0.60, manganese 0.40%, Yu Weitong.
Embodiment 2
(1) at first takes by weighing raw material by the mass ratio of tough cathode 79.00%, red phosphorus 10.00%, silicon metal 4.00%, star antimony 4.00%, electrolytic nickel 3.00%, pure bismuth 0.98%, silver 0.02%;
(2) silicon metal is ground into diameter and is being particle below 1 millimeter, and mix, wrap with Copper Foil then with the red phosphorus powder;
(3) with industrial pure copper fusing and be warming up to 1250 ℃, at first be pressed into the powder mix of the silicon metal wrapped and red phosphorus in the copper melts and until reacting completely, add electrolytic nickel, star antimony, pure bismuth and the silver material taken by weighing then successively, be stirred to rapidly and react completely;
(4) direct casting ingot-forming or make tiny particulate state with atomising unit etc.
Obtain a kind of copper-phosphorus base master alloy of optimal components according to said ratio, its chemical ingredients (mass percent) is: phosphorus 9, silicon 4, antimony 4, nickel 3, bismuth 0.98, silver 0.02%, Yu Weitong.
Claims (2)
1. low melting-point coper-phosphorus base master alloy, it is characterized in that it is by copper, phosphorus, nickel, antimony, bismuth, silicon, manganese and silver-colored the composition, the mass percent of each component is: copper 70.00-90.00, phosphorus 6.00-18.00, silicon 0.01-10.00, nickel 0.01-5.00, antimony 0.01-5.00, bismuth 0.01-2.00, manganese 0.01-2.00 or silver-colored 0.001-0.02.
2. prepare the method for the described low melting-point coper of claim 1-phosphorus base master alloy, it is characterized in that may further comprise the steps:
(1) mass percent by tough cathode 70.0～90.0%, red phosphorus 6.0～18.0%, silicon metal 0.01～10.00%, electrolytic nickel 0.01～5.00%, star antimony 0.01～5.0%, pure bismuth 0.01～2.00%, pure manganese 0.01～2.0% or silver 0.001～0.02% takes by weighing raw material;
(2) silicon metal is ground into diameter and is being particle below 1 millimeter, and mix, wrap with Copper Foil then with the red phosphorus powder;
(3) in smelting furnace, fine copper is melted to 1100 ℃～1400 ℃, at first be pressed into the powder mix of the silicon metal wrapped and red phosphorus in the copper melts and until reacting completely, add nickel, antimony, bismuth, manganese and the silver taken by weighing then successively, be stirred to rapidly and react completely;
(4) direct casting ingot-forming or make tiny particulate state with atomising unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN 200310105444 CN1226436C (en) | 2003-10-27 | 2003-10-27 | Lowmelting intermadiate alloy of copper and phosphor base and preparation method |
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| CN 200310105444 CN1226436C (en) | 2003-10-27 | 2003-10-27 | Lowmelting intermadiate alloy of copper and phosphor base and preparation method |
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| CN1540011A CN1540011A (en) | 2004-10-27 |
| CN1226436C true CN1226436C (en) | 2005-11-09 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100348761C (en) * | 2006-02-17 | 2007-11-14 | 刘相法 | P-si intermediate alloy and preparing method |
| CN100389216C (en) * | 2006-06-22 | 2008-05-21 | 山东大学 | Copper-silicon-boron intermediate alloy and process for preparing same |
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| CN103131915B (en) * | 2011-12-05 | 2016-02-10 | 贵州华科铝材料工程技术研究有限公司 | High performance aluminium materials that osmium carbonyl-complexes is rotten and preparation method thereof |
| CN102888524B (en) * | 2012-10-24 | 2015-01-21 | 中国矿业大学 | Copper-strontium-phosphorus alloy modifier for aluminum-silicon alloy and production technique thereof |
| CN103436757B (en) * | 2013-08-06 | 2016-03-16 | 沈阳工业大学 | The preparation method of magnesium-phosphorus master alloy |
| CN103740969B (en) * | 2013-12-31 | 2016-06-15 | 金华市信诚金属制造有限公司 | The preparation method of a kind of copper-phosphorus alloy |
| CN103757463B (en) * | 2013-12-31 | 2017-01-11 | 镇江市锶达合金材料有限公司 | copper-phosphorus alloy and preparation method thereof |
| CN105296790A (en) * | 2014-08-04 | 2016-02-03 | 丁义存 | Rare earth nano phosphor-copper alloy and preparation method thereof |
| CN104878242A (en) * | 2015-06-25 | 2015-09-02 | 潘应生 | Copper aluminum alloy and preparation method thereof |
| CN104878243A (en) * | 2015-06-25 | 2015-09-02 | 潘应生 | Copper aluminum alloy and preparation method thereof |
| CN110923497B (en) * | 2019-10-29 | 2021-03-16 | 福建工程学院 | Intermediate alloy for refining crystalline structure of copper and copper alloy, preparation method and application process thereof |
-
2003
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100348761C (en) * | 2006-02-17 | 2007-11-14 | 刘相法 | P-si intermediate alloy and preparing method |
| CN100389216C (en) * | 2006-06-22 | 2008-05-21 | 山东大学 | Copper-silicon-boron intermediate alloy and process for preparing same |
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| CN1540011A (en) | 2004-10-27 |
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