CN1223720A - Pressure sensor for mounting on the components side of a printed circuit board - Google Patents
Pressure sensor for mounting on the components side of a printed circuit board Download PDFInfo
- Publication number
- CN1223720A CN1223720A CN 97195918 CN97195918A CN1223720A CN 1223720 A CN1223720 A CN 1223720A CN 97195918 CN97195918 CN 97195918 CN 97195918 A CN97195918 A CN 97195918A CN 1223720 A CN1223720 A CN 1223720A
- Authority
- CN
- China
- Prior art keywords
- chip carrier
- pressure sensor
- contiguous block
- sensor apparatus
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The present invention relates to a pressure sensor for mounting on the components side (2) of a printed circuit board (3) has a chip-carrier (5) made of electro-insulating material and having an approximately flat chip-carrying surface (4) to which a semiconductor chip (6) with a pressure sensor is secured, and electrode terminals (7) which extend through the chip-carrier (5) and are electrically connected to the semiconductor chip (6). The chip-carrier (5) is open at the side (22) opposite to the components side (2) of the printed circuit board (3) and has at its edges (24, 25) that delimit the opening (23) supporting means (26) that form-fittingly and mechanically engage, without play, holding means (27) for an adapter (28) that can be set on the chip-carrier (5), so that when the adapter (28) is set on the chip-carrier (5) the holding means (27) and the supporting means (26) engage each other.
Description
The present invention relates to a kind of pressure sensor apparatus of assembling usefulness on the printed circuit board plugging surface, this pressure sensor apparatus is by having one especially near a chip carrier of planar chip carrier side, and by run through chip carrier and form with each electrode contact that semi-conductor chip is electrically connected, this chip carrier is especially made by the material of electrical isolation, on the chip carrier face of pressure sensor apparatus is fixing a semi-conductor chip that has a pressure transducer.
Shift near on the sensor in order to measure the medium that various pressure must will survey, perhaps the pressure that will be present in the medium is delivered on the sensor.This require a kind of can simple and easy manufacturing with sealing, between the connection that will survey between medium and the sensor, so that avoid distorting the inflow of tonometric outside air.The medium that will measure of requirement and each metal ingredient of sensor and separate with semi-conductor chip in addition in many cases are to avoid by medium danger corrosion or destroying infection of each responsive ingredient of sensor.
Task of the present invention is, a kind of pressure sensor apparatus that assembles usefulness on the printed circuit board plugging surface is provided, this pressure sensor apparatus has a semiconductor pressure sensor, and this pressure sensor apparatus ensures the error free pressure survey that shifts near medium on the sensor.
Solve this task by a kind of pressure sensor apparatus by claim 1.
Considered that by the present invention this chip carrier constitutes a side and opens wide on the opposing face of itself and printed circuit board plugging surface, and this chip carrier on each fringe region of this opening in the boundary of chip carrier, has a kind of profile convolution machinery, the fulcrum arrangement that seamless connectivity is used, this connection has a kind of locating device that is placed to the contiguous block on the chip carrier, these supportings are preferentially so to constitute with locating device, and fulcrum arrangement and locating device alternatively enter engagement when being placed to contiguous block on the chip carrier.The face towards chip carrier of contiguous block is to seal with a kind of diaphragm suitable with wanting various conditions in the measuring media.Can be with this with simple mode and method, by the adaptive medium that makes pressure sensor component adapt to and will measure of the diaphragm in the coupling part, and be complementary with the pressure limit that is present in wherein.
Having reached by the present invention provides a kind of purpose of assembling draft flexibly, assemble draft by being provided for being connected on this pressure transducer itself with this, the form of hose adapter or grafting joint can satisfy far-ranging user's hope with this arbitrarily.Can ensure that by plug connection will survey medium shifts near on the sensor by contiguous block of the present invention, the pressure that maybe will be present in the medium is delivered on the sensor, can simply advantageously make this plug with expense is connected, at this by between surveying profile convolution machinery between medium and the sensor, gapless connection can be stopped the inflow of outside air, and therefore can carry out free from error pressure survey.
The fulcrum arrangement that can consider this chip carrier by principle of the present invention on its periphery, have around a kind of with the carrying plane that is supporting the contiguous block locating device.
The locating device that can consider contiguous block in a favourable enforcement of the present invention has been equipped with a kind of flexible bead, this bead is to have added a kind of draw-in groove in the chip carrier fulcrum arrangement of being arranged in, and this draw-in groove is used at fixedly connected voluntarily of position of assembling and chip carrier.
For the medium that will measure and semi-conductor chip and with other, especially each metal ingredient of pressure sensor apparatus separates, because the corrosion danger of medium, can consider that chip carrier is with a kind of flowed filler filling that covers semi-conductor chip fully to avoid in an advantageous manner.At especially a kind of gel of this this flowable filler, this gel does not almost have and lags behind and error free the pressure that transmits.This gel is simultaneously as filler, so that the so-called dead space maintenance of being laid between the contiguous block in sensor and institute is as best one can little.Distortion in the time of can avoiding gaging pressure thus or temporal hysteresis.
For the medium that will measure separates further from semi-conductor chip or from each ingredient that pressure sensor apparatus is corroded threat, can consider face in addition towards chip carrier with a kind of flexible sheet sealing contiguous block.This diaphragm can have important distortion or time lag ground and transmits the pressure pulse that shifts near on the sensor, but this diaphragm prevents to be infected with the danger of the ingredient that is subjected to medium ion or other each harmful part danger side of body.Can be formed in the contiguous block at this this diaphragm integratedly, make this contiguous block make a monoblock by corresponding instrument design with diaphragm, perhaps this diaphragm also can be to constitute by a kind of embedded part that adds, and makes that this contiguous block is a multi-piece type.
Each sidewall that can advantageously consider the chip carrier that a side is opened wide in other development of the present invention in addition is to equip with a kind of fluid stopping limit of arranging that connects on medial surface.Therefore be formed in each capillary force that the fluid stopping limit in the pressure sensor apparatus housing can stop the tack gel integratedly with specifying, and prevent that based on each capillary force the unwelcome gel that runs off each shell rim from climbing.Prevent unwelcome gel traction and the danger that prevents to be infected with fabrication tool in follow-up each manufacture process simultaneously by gel.By arranging a kind of fluid stopping limit the mode of gel with accurate appointment can be positioned within chip carrier or the housing, even also avoid the outflow of gel during at the chip carrier that ground assembling one side of standing upside down is opened wide reliably at this.
The present invention relates to a kind of pressure sensor apparatus in printed circuit board plugging surface upper surface assembling usefulness in especially favourable mode.No longer in the various holes of the plug-in type fit on, inserting printed circuit board, respectively connect on the macular area on the printed circuit board and soldering there in various component connection joints on this assembling form but be placed to.The element of surface-mounted usefulness is littler than plug-in type assembling, because the lead spacing that determines these joints by the aperture and the welded eye diameter of printed circuit board no longer.Having cancelled on this external printed circuit board only is the required various holes of pegging graft, and can implement those at this as technology is possible littlely and only also be used for the required hole of the deposited plating of through hole.Because it is possible also having the double-side plug-in of printed circuit board in addition, descend by this surface-mounted very big position saving and considerable expense of can realizing.If run through chip carrier be to constitute the various lead-in wire forms that are connected of drawing with electrode contact that semi-conductor chip is electrically connected at least two sides of chip carrier.Then produce the especially little structure height of pressure sensor apparatus at this, these connect lead-in wire is to bend to and be cut into short fork shape and be connected end.
From the explanation of embodiment, draw each other feature, advantage and rationality of the present invention by figure.Following:
Fig. 1 shows a schematic sectional view by a kind of pressure sensor apparatus of one embodiment of the invention; And
Fig. 2 shows a total view of signal by a kind of pressure sensor apparatus chip carrier of this embodiment.
These illustrate in printed circuit board 3 plugging surface 2 upper surfaces assemblings usefulness, by an embodiment of pressure sensor apparatus 1 of the present invention.This pressure sensor apparatus 1 has the chip carrier 5 by electrical isolation synthetic material system, this chip carrier has the chip carrier face 4 of an almost plane, on the chip carrier face 4 of pressure sensor apparatus, fixed a semi-conductor chip 6, this semi-conductor chip has the pressure transducer of an integrated formation and is subordinated to the electronic circuit of this pressure transducer, at this not detailed pressure transducer and circuit of showing in these figure, and this pressure sensor apparatus 1 has each electrode contact 7, these electrode contacts run through chip carrier 5 and are electrically connected with semi-conductor chip 6, the end 8 of these electrode contacts is placed in respectively connecting on the macular area on printed circuit board 3 plugging surface 2 (not detailed showing), and soldering there.This particularly integrally, comprise one with respect to the base 9 of plugging surface 2 projectioies and be arranged in each lateral parts 10 on base 9 each side by the chip carrier 5 of original known synthetic material casting method manufacturing, 10a and 11,11a, semi-conductor chip 6 is bearing on the base, and these lateral parts form the housing wall of each lateral seal of pressure transducer housing.This chip carrier 5 is to constitute by the mode of expression is like this in proportion basically among Fig. 1, these of chip carrier 5 are towards the outer boundary face 12 of printed circuit board 3 plugging surface 2,13 have a kind of distance of leading to printed circuit board 3 plugging surface 2, this distance constantly increases to central area 16 from each lower edge zone 14,15 of chip carrier 5.The outer boundary face 12 of these of chip carrier 5,13 especially to have a kind of seeing on the cross section be the trend of anti-V-type or the trend of ceiling shape moulding basically, this trend is a mode like this, the tip of anti-V is that middle heart is arranged, has the value that is about 0.1mm to 0.5mm to the ultimate range of printed circuit board herein at this.Considered in addition these run through chip carrier 5 with are the various lead-in wire forms that are connected of drawing that constitute with electrode contact 7 that semi-conductor chip 6 is electrically connected to 5 at least two sides of chip carrier, these connect lead-in wire is to bend to and be cut into short fork shape and be connected end 17.Such layout guarantees the structure height of a kind of minimum of sensor element.These bending sections 18 that connect lead-in wire in addition are each lateral parts 10 that is contained in chip carrier 5 fully, within 11, this advantage that has is, again dwindled housing on its each size, reduced the leakage distance of the size of lead frame and each Korrosionsmedium that significantly extended in addition and therefore reduced infiltration with each chemicals.So in addition layout makes lead frame and each electrode contact 7 can mechanically retouch admittedly within component housing and raising mechanical stability that can be total extraly.Various in addition connection lead-in wires stretch out chip carrier 5 each lateral parts 10, each end 8 of 11 has a kind of such slight draft with respect to the plugging surface 2 of printed circuit board 3, each connects lead terminal 8 and has dotted line towards the seamed edge 19 of plugging surface 2 ragged edges and represent auxiliary plane 20, is about the distance of 0.1mm.Guaranteed by this layout, only produced contacting of element and printed circuit board 3 plugging surface 2 by each end 8 that connects these ragged edges of lead-in wire, this arranges with represented favourable housing and has considered printed circuit board 3 various possible amounts of deflection, and variety of issue when in addition having avoided on printed circuit board 3 plug connector elements and when using printed circuit board 3 afterwards, the base of printed circuit board constitutes projection on this element, and housing as shown in constitute ceiling shape.Required when this can cancel in the past in grafting in an advantageous manner, with the adjustment of so-called fine setting instrument and forming tool, and considered simultaneously keeping every regulation requirement of base plate distance.Can more advantageously peg graft, because ensured the good adhesion of grafting cementing agent, and in addition compensate the various possible tolerance of printed circuit board 3 from each amount of deflection aspect, and overcome the internal stress of heat and/or engineering properties, produce and the contacting of printed circuit board 3 because only connect lead-in wire by these.
As shown wire joining is connected method and can be applied to integratedly be formed in the pressure transducer on the semi-conductor chip 6 or be subordinated to the electronic circuit of this pressure transducer and being electrically connected of these electrode contacts 7, on this wire joining connection method each the pressure welding silk 21 on each metal chip tie point 21a is being fixed on the chip, and each pressure welding silk 21 is being moved on each contact conductor that correspondingly will connect.In addition a kind of so-called star contact is connected and also can be used in this being electrically connected, and a kind of system's carrier board or a kind of so-called lead frame of conduction replace each pressure welding silk to be applied on this star contact is connected.
Integrated pressure transducer on silicon system semi-conductor chip 6 is a kind of sensor of so-called withstand voltage electricity, at the thin silicon diaphragm of having arranged on this sensor in chip 6 surfaces, to make according to the micromechanics the whole bag of tricks, this silicon diaphragm is with each the resistance electrical couplings that depends on pressure, these resistance are formed in the silicon chip equally, and are to connect in a kind of bridge circuit in original known mode.Circuit that is subordinated to sensor is integrated in semi-conductor chip 6 equally, and this circuit is used for signal Processing (amplify and revise), but also is used for balance and compensation sensor.With respect to other various versions, like this mainly be applicable to such various uses based on various semiconductor pressure sensors of the present invention, on these purposes, depend on minimum physical dimension, just for example in the various pressure surveys of automotive field, for example at brake pressure, tire pressure is in chamber pressure and the similar measurement.Except various semiconductor pressure sensors, in addition, also be adoptable with the pressure transducer of each capacitive measuring principle work by the pressure survey principle work of withstand voltage electricity.
In the embodiment shown in Fig. 1, chip carrier 5 constitutes a side on the face 22 of printed circuit board 3 plugging surface 2 dorsad at it and opens wide, and each top edge zone 24 of this opening 23 in boundary, have a kind of profile convolution machinery on 25, the fulcrum arrangement 26 that seamless connectivity is used, this connection so has a kind of locating device 27 that is placed to the contiguous block (28) on the chip carrier (5), and locating device 27 and fulcrum arrangement 26 alternatively enter engagement when being placed to contiguous block 28 on the chip carrier 5.The fulcrum arrangement 26 that is used for this purposes chip carrier 5 on its neighboring, have a border with the carrying plane 29 that is supporting contiguous block 28 locating devices 27.Like that this carrying plane can constitute in the enclosed the land last week form of the ditch 30 that forms of the fringe region of chip carrier 5 as represented, and a spring 31 that is formed on contiguous block 28 peripheries affacts in this ditch at least in part.
These sidewalls 24,25 of the chip carrier 5 that one side is opened wide can be fluid stopping limit 36 equipments that are arranged on the medial surface with a kind of in addition with connecting.In the case, the medial surface of chip carrier 5 is the height that only are fills up to fluid stopping limit 36 with gel 32.Therefore this fluid stopping limit 36 makes each capillary force of stopping tack gel 32 definitely become possibility, and prevents that based on each capillary force the unwelcome gel that runs off each shell rim from climbing.
Relevant number inventory
1 pressure sensor apparatus
2 plugging surface
3 printed circuit boards
4 chip carrier faces
5 chip carriers
6 semi-conductor chips
7 each electrode contact
8 each end
9 bases
10,10a, 11, each lateral parts of 11a
12,13 each outer boundary face
14,15 each lower edge zone
16 central areas
17 each connection are terminal
18 each bending section
The limit of 19 ragged edges
20 auxiliary planes
21 each pressure welding silk
21a chip tie point
22 dorsad faces
23 openings
24,25 each top edge zone
26 fulcrum arrangements
27 locating devices
28 contiguous blocks
29 carrying planes
30 ditches
31 springs
32 fillers
33 media
34 dead spaces
35 diaphragms
36 fluid stopping limits
Claims (12)
1. go up the pressure sensor apparatus of assembling usefulness in printed circuit board (3) plugging surface (2), that this pressure sensor apparatus has the chip carrier (5) of a chip carrier face (4) by one and runs through this chip carrier (5) and form with each electrode contact (7) that semi-conductor chip (6) is electrically connected, semi-conductor chip (6) that has a kind of pressure transducer is to be fixed on the chip carrier face (4) of chip carrier, it is characterized in that, this chip carrier (5) is to constitute a side on the face (22) of printed circuit board (3) plugging surface (2) dorsad at it to open wide, and these marginariums (24 at this opening of boundary (23) of chip carrier (5), 25) has a kind of profile convolution machinery on, the fulcrum arrangement that seamless connectivity is used (26), this connection has a kind of locating device (27) that is placed to the contiguous block (28) on the chip carrier (5), and contiguous block (28) seals with a kind of flexible sheet (35) towards the face of chip carrier (5).
2. press the pressure sensor apparatus of claim 1, it is characterized in that, fulcrum arrangement (26) and locating device (27) mode like this constitute, and locating device (27) and fulcrum arrangement (26) alternatively enter engagement in the time of on contiguous block (28) being placed to chip carrier (5).
3. by claim 1 or 2 pressure sensor apparatus, it is characterized in that the fulcrum arrangement (26) of chip carrier (5) has a border and the carrying planes locating device that is supporting contiguous block (28) (27) (29) on its periphery.
4. press the pressure sensor apparatus of one of claim 1 or 3, it is characterized in that, the locating device (27) of contiguous block (28) is to be equipped with a kind of elasticity bead, this bead is to have added a kind of draw-in groove in chip carrier (5) fulcrum arrangement (26) of being arranged in, and this draw-in groove is used at rigging position fixedly connected voluntarily (28) and chip carrier (5).
5. by the pressure sensor apparatus of one of claim 1 to 4, it is characterized in that chip carrier (5) and contiguous block (28) are made by a kind of synthetic material.
6. by the pressure sensor apparatus of one of claim 1 to 5, it is characterized in that chip carrier (5) is with a kind of flowed filler (32) filling that covers semi-conductor chip (6) fully.
7. by the pressure sensor apparatus of claim 6, it is characterized in that these sidewalls of the chip carrier (5) that a side is opened wide are to equip with a kind of fluid stopping limit of arranging (36) that connects on medial surface.
8. by the pressure sensor apparatus of claim 6 or 7, it is characterized in that flowable filler (32) is a kind of gel.
9. by the pressure sensor apparatus of one of claim 1 to 8, it is characterized in that contiguous block (28) constitutes and can take off from chip carrier (5).
10. by the pressure sensor apparatus of one of claim 1 to 9, it is characterized in that contiguous block (28) is connected with an input channel, this input channel contain a kind of can stressed medium (33).
11. be used for but a kind of input channel that contains plus-pressure medium (33) is coupled to contiguous block on the pressure sensor apparatus (1), especially press the contiguous block of one of claim 1 to 10, it is characterized in that, this contiguous block (28) is to constitute a side at it on the face of pressure sensor apparatus (1) to open wide, and these fringe regions (14 at contiguous block (28) this opening of boundary (23), 15) has a kind of profile convolution machinery on, the locating device that seamless connectivity is used (27), this connection has a kind of fulcrum arrangement (26) of pressure sensor apparatus (1), contiguous block is such, and locating device (27) and fulcrum arrangement (26) alternatively enter engagement in the time of consequently on contiguous block (28) being placed to pressure sensor apparatus (1).
12. the contiguous block by claim 11 is characterized in that contiguous block (28) seals with a kind of flexible sheet (35) towards the face of chip carrier (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97195918 CN1223720A (en) | 1996-06-28 | 1997-06-27 | Pressure sensor for mounting on the components side of a printed circuit board |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19626084.1 | 1996-06-28 | ||
| CN 97195918 CN1223720A (en) | 1996-06-28 | 1997-06-27 | Pressure sensor for mounting on the components side of a printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1223720A true CN1223720A (en) | 1999-07-21 |
Family
ID=5179453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 97195918 Pending CN1223720A (en) | 1996-06-28 | 1997-06-27 | Pressure sensor for mounting on the components side of a printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1223720A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102439408A (en) * | 2009-05-25 | 2012-05-02 | 罗伯特·博世有限公司 | Control device having a pressure sensor |
| CN102486425A (en) * | 2010-12-06 | 2012-06-06 | 飞思卡尔半导体公司 | Pressure sensor and method of assembling same |
| CN103063357A (en) * | 2011-10-20 | 2013-04-24 | 刘胜 | Gas pressure transmitter based on ceramic packaging |
| CN103688006A (en) * | 2011-07-19 | 2014-03-26 | 多玛两合有限公司 | Door opener with means for detecting positions of movable components of the door opener |
| CN105588680A (en) * | 2015-12-14 | 2016-05-18 | 中国北方发动机研究所(天津) | Air circuit isolation device for built-in atmosphere pressure sensor of diesel engine controller |
| CN105849506A (en) * | 2013-12-19 | 2016-08-10 | 空中客车运营简化股份公司 | Measurement device comprising sensors arranged in recesses covered by single film |
| CN107290096A (en) * | 2016-04-11 | 2017-10-24 | 飞思卡尔半导体公司 | Have chaffy pressure-sensing IC-components |
| CN107782352A (en) * | 2016-08-25 | 2018-03-09 | 罗伯特·博世有限公司 | Circuit carrier, corresponding sensor unit for sensor unit and the method for assembling this sensor unit |
| US10136531B2 (en) | 2013-12-19 | 2018-11-20 | Airbus Operations S.A.S. | Measurement device with single control circuit |
| CN109307567A (en) * | 2018-10-25 | 2019-02-05 | 中国科学院合肥物质科学研究院 | A kind of comprehensive overload protecting mechanism of hook conjunction plug-in and its design method for six-dimension force sensor |
| US10352739B2 (en) | 2013-12-19 | 2019-07-16 | Airbus Operation S.A.S. | Simplified measurement device and method and tool for manufacturing such a device |
| CN112113699A (en) * | 2019-06-21 | 2020-12-22 | 霍尼韦尔国际公司 | Micro-molded fluid pressure sensor housing |
-
1997
- 1997-06-27 CN CN 97195918 patent/CN1223720A/en active Pending
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102439408B (en) * | 2009-05-25 | 2015-05-13 | 罗伯特·博世有限公司 | Control device having a pressure sensor |
| CN102439408A (en) * | 2009-05-25 | 2012-05-02 | 罗伯特·博世有限公司 | Control device having a pressure sensor |
| CN102486425A (en) * | 2010-12-06 | 2012-06-06 | 飞思卡尔半导体公司 | Pressure sensor and method of assembling same |
| CN102486425B (en) * | 2010-12-06 | 2016-03-16 | 飞思卡尔半导体公司 | Pressure transducer and assemble method thereof |
| CN103688006B (en) * | 2011-07-19 | 2016-09-14 | 多玛德国有限公司 | There is the door opener of the device of the position of movable-component for detecting door opener |
| CN103688006A (en) * | 2011-07-19 | 2014-03-26 | 多玛两合有限公司 | Door opener with means for detecting positions of movable components of the door opener |
| CN103063357A (en) * | 2011-10-20 | 2013-04-24 | 刘胜 | Gas pressure transmitter based on ceramic packaging |
| US10136531B2 (en) | 2013-12-19 | 2018-11-20 | Airbus Operations S.A.S. | Measurement device with single control circuit |
| CN105849506A (en) * | 2013-12-19 | 2016-08-10 | 空中客车运营简化股份公司 | Measurement device comprising sensors arranged in recesses covered by single film |
| US10330503B2 (en) | 2013-12-19 | 2019-06-25 | Airbus Operations S.A.S. | Measurement device comprising sensors arranged in recesses covered by a single film |
| US10352739B2 (en) | 2013-12-19 | 2019-07-16 | Airbus Operation S.A.S. | Simplified measurement device and method and tool for manufacturing such a device |
| CN105588680A (en) * | 2015-12-14 | 2016-05-18 | 中国北方发动机研究所(天津) | Air circuit isolation device for built-in atmosphere pressure sensor of diesel engine controller |
| CN107290096A (en) * | 2016-04-11 | 2017-10-24 | 飞思卡尔半导体公司 | Have chaffy pressure-sensing IC-components |
| CN107782352A (en) * | 2016-08-25 | 2018-03-09 | 罗伯特·博世有限公司 | Circuit carrier, corresponding sensor unit for sensor unit and the method for assembling this sensor unit |
| CN107782352B (en) * | 2016-08-25 | 2021-06-18 | 罗伯特·博世有限公司 | Circuit carrier for a sensor unit, corresponding sensor unit and method for assembling such a sensor unit |
| CN109307567A (en) * | 2018-10-25 | 2019-02-05 | 中国科学院合肥物质科学研究院 | A kind of comprehensive overload protecting mechanism of hook conjunction plug-in and its design method for six-dimension force sensor |
| CN109307567B (en) * | 2018-10-25 | 2020-12-11 | 中国科学院合肥物质科学研究院 | Omnibearing overload protection mechanism and design method |
| CN112113699A (en) * | 2019-06-21 | 2020-12-22 | 霍尼韦尔国际公司 | Micro-molded fluid pressure sensor housing |
| US11630011B2 (en) | 2019-06-21 | 2023-04-18 | Honeywell International Inc. | Micro-molded fluid pressure sensor housing |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1223720A (en) | Pressure sensor for mounting on the components side of a printed circuit board | |
| US6339255B1 (en) | Stacked semiconductor chips in a single semiconductor package | |
| US6694818B2 (en) | Pressure sensor having semiconductor sensor chip | |
| US6393922B1 (en) | Pressure sensor component with hose connection | |
| CN1841020B (en) | Angular velocity sensor | |
| KR101034773B1 (en) | Controller, in particular for motor vehicle transmissions | |
| CN100521738C (en) | Optical device module, optical path fixing device, and method for manufacturing optical device module | |
| CN103308218B (en) | Semiconductor sensor arrangement and the electronic installation using semiconductor sensor arrangement | |
| JP3546059B2 (en) | Pressure sensor components that can be assembled on the mounting surface of a printed wiring board | |
| CN107432093A (en) | Electronic control unit with shell stability element and the housing for electronic control unit | |
| CN1726385A (en) | A pressure sensor | |
| CN102167277A (en) | Sensor system | |
| US6058020A (en) | Component housing for surface mounting of a semiconductor component | |
| WO2022188524A1 (en) | Packaging module, packaging process, and electronic device | |
| KR20000022327A (en) | Pressure sensor for mounting on the components side of a printed circuit board | |
| US6019932A (en) | Method of sealing electronic parts with a resin | |
| CN105720019B (en) | Image sensering device with block and correlation technique | |
| CN100470847C (en) | Image sensing chip packaging device | |
| EP1519310A2 (en) | Portable electronic device | |
| CN207637777U (en) | A kind of semiconductor package, SAW filter and terminal device | |
| JPS61276353A (en) | Hybrid integrated circuit | |
| JP2001118868A (en) | Surface-mounting part and manufacturing method thereof | |
| CN1897646A (en) | Camera module | |
| CN210089897U (en) | Sealed MSG pressure sensor | |
| JPH0660156U (en) | Printed board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |