CN1204798C - Integrated heat dissipation module - Google Patents
Integrated heat dissipation module Download PDFInfo
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- CN1204798C CN1204798C CN 01135805 CN01135805A CN1204798C CN 1204798 C CN1204798 C CN 1204798C CN 01135805 CN01135805 CN 01135805 CN 01135805 A CN01135805 A CN 01135805A CN 1204798 C CN1204798 C CN 1204798C
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- heat dissipation
- dissipation module
- integrated heat
- conducting base
- heat conducting
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Abstract
The present invention relates to an integrated type heat dissipation module for removing heat generated by a heat source, which comprises a heat conducting base, a cover body, a fan and a circuit board, wherein the heat conducting base is made of material with high heat conductivity, an air inlet and an air outlet are defined by the cover body when the cover body is clamped with the heat conducting base, the fan is positioned between the heat conducting base and the cover body, the fan comprises a blade part, a magnet part and a rotor part, a plurality of opposite first and second magnets are respectively arranged between the magnet part and the rotor part, a permanent magnetic field is formed between the first magnets and the second magnets, the circuit board is positioned between the first magnets and the second magnets, and the circuit board is provided with a plurality of coils. In this way, the coils generate an induced magnetic field to repel the permanent magnetic field after energized. Consequently, the induced magnetic field prompts the fan to rotate so as to make cold air sucked from the air inlet and hot air exhausted from the air outlet.
Description
Technical field
The present invention relates to a kind of integrated heat dissipation module, relate in particular to a kind of radiating module of integrating active heat radiation and passive heat radiation mechanism.
Background technology
The surface-mounted technology of the most of employing of electronic building brick now (Surface Mounting Technology, SMT) be welded on the printed circuit board (PCB) (PCB), the main electronic building brick that is disposed on the circuit board comprises capacitor, resistor, inductance, transformer, diode, MOSFET (metal oxide semiconductor field effect transistor), chip etc., electronic building brick in the running can produce the heat that power does not wait, if fail heat is moved to the external world effectively, then excessive heat can cause the electronic building brick fault, make system work as machine, even cause whole system to lose function fully.
For the main mechanism that removes the heat that the electronic building brick in the running sends mainly contains two kinds, comprise (1) active radiating module and (2) passive heat radiation module in the prior art.
Fig. 1 (a) has shown a kind of decomposing schematic representation of existing active radiating module, is mainly used in the electronic building brick that running produces high heat, and for example CPU (CPU) chip 11.Active radiating module mainly comprises a radiator 12 and a fan 13, radiator 12 is made and mainly be made of a heat-conducting substrate 121 and a plurality of radiating fin 122 by the material of tool high thermal conductivity (for example aluminium, copper, aluminium alloy, copper alloy), radiating fin 122 is that the opposite side of heat-conducting substrate 121 then is flattened on the top of cpu chip 11 perpendicular to heat-conducting substrate 121 tops.Radiator 12 tops further are provided with a fan 13 (utilizing screw 16 to be positioned on the radiating fin 122), suck surrounding airs and contact by fan 13, move to surrounding air by radiating fin 122 and reach the effect of cooling with forced convertion mode accelerated heat with radiating fin 122.
The advantage of active radiating module is its double mode of adopting conduction and forced convertion, so radiating effect is very good; Its shortcoming is that wheel hub 131 belows of fan 13 are difficult for producing significant convection effects, so the heat that part is transmitted by conductive sole plate 121 is accumulated in the radiating fin 122 of wheel hub below then, so will cause this regional temperature to increase, the conduction of the heat of unfavorable chip 11 is used between long-term and may be caused failure of chip.
Fig. 1 (b) has shown a kind of schematic diagram of existing passive heat radiation module, and it mainly is to utilize a blower fan (blower fan) 23 to reach heat sinking function.The body of blower fan 23 is that plastics are made, and it comprises an air intake vent 231, a flabellum 232 and an air outlet 233, and energising is rotated flabellum 232, so that the heat that electronic building brick 21 produces is sucked by air intake vent 231, and discharge by air outlet 233, to reach radiating effect.The advantage of this kind passive heat radiation module is to promote near the convection effects the blower fan 23, prevents the heat localized accumulated, and direction system 233 blows out from air intake vent 231 towards air outlet, so have the water conservancy diversion effect; But its shortcoming is only to utilize convection type (not using radiator) and can't reaches splendid radiating effect, therefore, must arrange several blower fans 23 usually in casing, the side gets efficiently radiates heat, too much blower fan 23 not only takies more enclosure space, and cost is also high.
Therefore, the present invention proposes a kind of integrated heat dissipation module, uses and improves the problem that is faced in the above-mentioned known technology.
Summary of the invention
The object of the present invention is to provide a kind of integrated heat dissipation module, is the function of integrating active radiating module and passive heat radiation module, to promote its range of application.
Another object of the present invention provides a kind of integrated heat dissipation module, and it is double adopts convection current and conduction pattern heat radiation, to promote radiating effect.
A further object of the present invention is to provide a kind of integrated heat dissipation module, and it has splendid water conservancy diversion effect, to promote radiating efficiency.
An aspect of of the present present invention is to propose a kind of integrated heat dissipation module, and in order to remove the heat that a thermal source is sent out, it comprises:
One heat conducting base, made by the material of high heat conduction;
One covers body, and this covers body and engages with this heat conducting base, forms a cavity with air intake vent and air outlet;
One fan, at this heat conducting base and cover between the body, and comprise a flabellum portion, be connected in the magnetite portion on this flabellum portion and be positioned at a rotor portions on the magnetite portion, wherein this magnetite portion comprises a plurality of first magnetites, and this rotor portions below is provided with a plurality of second magnetites with respect to this first magnetite; And
One circuit board, between this magnetite portion and this second magnetite, and this circuit board is provided with a plurality of coils;
Use, behind this coil electricity, produce an induced field, repelling this permanent-magnetic field, and then impel this fan to rotate, to suck cold air by this air intake vent and to discharge hot-air by this air outlet.
Aforesaid integrated heat dissipation module, wherein the bottom surface of this heat conducting base system contacts with the surface of this thermal source.
Aforesaid integrated heat dissipation module, wherein this thermal source is CPU (CPU) chip in the operation.
Aforesaid integrated heat dissipation module wherein is coating one heat-conducting glue between this heat conducting base bottom surface system and this thermal source surface.
Aforesaid integrated heat dissipation module, wherein the central authorities of this heat conducting base upside are provided with a plurality of fins.
Aforesaid integrated heat dissipation module, wherein these a plurality of fins are needle-like.
Aforesaid integrated heat dissipation module, wherein the material material of this high thermal conductivity is selected from the combination that comprises aluminium, copper, aluminium alloy and copper alloy.
Aforesaid integrated heat dissipation module, wherein this flabellum portion comprises an annular frame and a plurality of blade, and these a plurality of blades are to be connected in this framework below.
Aforesaid integrated heat dissipation module, wherein the inner edge of this framework projects upwards and forms a tab.
Aforesaid integrated heat dissipation module, wherein this tab links to each other with this rotor portions.
Aforesaid integrated heat dissipation module, wherein this rotor portions comprises a ringwise rotor frame, a rotating shaft and at least one rib.
Aforesaid integrated heat dissipation module, wherein this each bar rib system links to each other with top and this rotor frame of this rotating shaft.
Aforesaid integrated heat dissipation module, wherein this at least one rib is that three ribs and its position are symmetrical in this rotating shaft.
Aforesaid integrated heat dissipation module, wherein this rib is laminar, and the space that makes this cold air flow into is arranged between this at least one rib.
Aforesaid integrated heat dissipation module, wherein this coil is a few circuit of the winding of drawing on this circuit board.
Aforesaid integrated heat dissipation module, wherein the bottom of this rotating shaft is inserted in the sleeve on this heat conducting base.
Another aspect of the present invention is to be to propose a kind of integrated heat dissipation module, and in order to remove the heat that a thermal source is sent, it comprises:
One heat conducting base, made by the material of high heat conduction, the bottom surface system of this heat conducting base contacts with the surface of this thermal source, and its top is provided with a plurality of fins;
One covers body, when it engages with this heat conducting base, is defined an air intake vent and an air outlet;
One fan, at this heat conducting base and cover between the body, and comprise a flabellum portion, a magnetite portion and a rotor portions, wherein have a plurality of first relative magnetites and second magnetite respectively between this magnetite portion and this rotor portions, form a permanent-magnetic field between this first magnetite and second magnetite; And
One circuit board, between this first magnetite and this second magnetite, and this circuit board is provided with a plurality of coils;
Use, behind this coil electricity, produce an induced field, repelling this permanent-magnetic field, and then impel this fan to rotate, to suck cold air by this air intake vent and to discharge hot-air by this air outlet.
The present invention will get a more deep understanding by following accompanying drawing and detailed description:
Description of drawings
Fig. 1 (a) is a kind of decomposing schematic representation of known active radiating module;
Fig. 2 (b) is a kind of schematic diagram of known passive heat radiation module;
Fig. 2 is the exploded view of the integrated heat dissipation module of the preferable example of the present invention;
Fig. 3 (a) is the number of assembling steps of the integrated heat dissipation module of preferred embodiment of the present invention to (d).
Embodiment
Fig. 2 is the exploded view of the integrated heat dissipation module of preferable example, and it mainly covers body 4, a circuit board 5 and a fan (comprising a flabellum portion 61, a magnetite portion 62 and a rotor portions 63) by a heat conducting base 3, and is constituted.
Required electronic building brick and the coil (not shown) of control circuit that circuit board 5 configuration air feed fans rotate, wherein coil is used as stator (stator), itself maintains static, when switching on, it can produce induced field, use with the permanent-magnetic field of rotor (rotor) and repel mutually, causing rotor rotation, is known about fan utilizes the magnetic field of stator and rotor to repel the principle that causes rotation mutually, does not repeat them here.Certainly, in order to save the shared space of coil, can on circuit board 5, draw highdensity circuit (twining a few).
Fan is made up of a flabellum portion 61, a magnetite portion 62 and a rotor portions 63.Wherein flabellum portion 61 comprises a framework 611 and a plurality of blade 612.Framework 611 is ringwise, and its inner rim projects upwards and forms tab 613, and these a plurality of blades 612 are to be connected in framework 611 belows.Magnetite portion 62 is made of a plurality of first magnetites 620.63 of rotor portions comprise a ringwise rotor frame 631, a rotating shaft 632 and at least one rib 633.Its shaft 632 is shaft-like, and its top then links to each other with rotor frame 631 with bar rib 633.The number of bar rib 633 is preferably three and its position and is symmetrical in rotating shaft 632, and using can be more smooth-going when rotor portions 63 is rotated, and the shape of bar rib 633 is preferably laminar, and is too big to avoid weight, and the space that makes cold air flow into is arranged between the bar rib 633.The below of rotor frame 631 then also is provided with the second magnetite (not shown) with respect to first magnetite 620, uses each to forming a permanent-magnetic field between first magnetite 620 and second magnetite.
The outward appearance that covers body 4 is similar to heat conducting base 3 substantially, but the central authorities that cover body form a port 41.The material that covers body 4 can optionally be selected for use, for example can be high heat-conducting or heat-resisting plastics all can.
Fig. 3 (a) to (d) is the preferable assembling mode of integrated heat dissipation module of the present invention.Please see Figure among 3 (a), a plurality of first magnetites 620 of magnetite portion 62 are connected on the framework 611 of flabellum portion 61; In Fig. 3 (b), then make tab 613 pass the central opening 51 of circuit board 5, and link to each other with rotor frame 631 bottoms, can finish the assembling of fan of the present invention; Then, shown in Fig. 3 (c), make the bottom of rotating shaft 632 be inserted in a sleeve (not shown) that is placed on heat conducting base 3 upsides, and making circuit board 5 give suitable location (does not show, for example in heat conducting base 3 upsides with cover body 4 inboards and can establish relative protruded stigma, make heat conducting base 3 upsides with cover just can prop up circuit board 5 when body 4 combines), in order to avoid fan causes circuit board 5 to move when rotating.At last, shown in Fig. 3 (d), make to cover body 4 and combine, use defining an air intake vent 71 and an air outlet 72 with heat conducting base 3.
The operation principle of integrated heat dissipation module of the present invention is as follows:
(1) bottom surface of heat conducting base 3 is covered on for example surface of thermal source such as cpu chip, so that its heat that sends is conducted to fin 31 via heat conducting base 3;
(2) coil array of configuration is used as stator (stator) on the circuit board 5, form a permanent-magnetic field between first magnetite 620 and second magnetite, when coil electricity, can produce induced field, use with permanent-magnetic field and repel mutually, cause rotor portions 63 and flabellum portion 61 to rotate, this moment, cold air can suck from air intake vent 71, and contacted with fin 31 (scope that fin 31 disposed is air intake vent 71 lower positions haply), and hot-air is discharged by air outlet 72.
(3), can reach splendid radiating effect by supplements cold continuously and discharge hot-air.
In sum, the main difference and the progressive of integrated heat dissipation module of the present invention and prior art are:
(1) shortcoming of existing active radiating module is that wheel hub 131 belows of fan 13 are difficult for producing significant convection effects, so the heat that part is transmitted by conductive sole plate 121 is accumulated in the radiating fin 122 of wheel hub below then, so will cause this regional temperature to increase.In integrated heat dissipation module of the present invention, cold air system is entered by 633 defined air intake vents 71 of bar rib of rotor portions 63, so fin 31 can be fully and the capable heat exchange action of cold air of suction, so can significantly promote radiating efficiency.
(2) existing active radiating module is that the cold air that fan 13 sucks is passed through 122 formed channels of radiating fin, discharges hot-air to two sides, and this kind diversion mode is not good.In integrated heat dissipation module of the present invention, cold air can suck from air intake vent 71, and contact with fin 31, thermal air current is through heat conducting base 3 and cover the air-flow channel that become between the body 4, discharge by air outlet 72 more at last, this kind radiating mode has splendid water conservancy diversion effect, so can promote radiating efficiency.
(3) it is made that the fan body that existing passive heat radiation module adopted is mainly the material of poor thermal conductivity such as plastics, directly discharge so only can utilize convection type that the heat that electronic building brick sent in the certain distance is sucked the back, this kind radiating effect is quite not good.In integrated heat dissipation module of the present invention, then double adopting conducted and the convection type heat transfer, so can promote radiating effect.
When (four) when existing two thermals source to be respectively cpu chip 11 (as Fig. 1 (a)), reaching the electronic building brick 21 (as Fig. 1 (b)) of low heating power, in known technology, must adopt active radiating module (being fan 13 and radiator 12) and passive heat radiation module (being blower fan 23) simultaneously, cost height so not only, and also take too big space.The heat that only need use one group of integrated heat dissipation module of the present invention to reach to derive simultaneously cpu chip 11 and electronic building brick 21 to be sent this moment is so on space utilization and installation cost, an advantage is very had in the present invention.
(5) when existing thermal source to be respectively cpu chip 11 (as Fig. 1 (a)) or during the electronic building brick 21 (as Fig. 1 (b)) of low heating power, in known technology, must select active radiating module (being fan 13 and radiator 12) or passive heat radiation module for use, so handling of goods and materials cost height.When adopting integrated heat dissipation module of the present invention so the present invention has the potential market price that develops into standard items, can replace existing active radiating module and passive heat radiation module in response to these two kinds of heats that thermal source sent.
Integrated heat dissipation module provided by the present invention has the effect of conduction and convection current concurrently, has the advantage of active radiating module and passive heat radiation module simultaneously concurrently, and exempts the shortcoming that runs in the known technology, is a novelty, progress and practical invention in fact.
The present invention can be undertaken modifying as all by being familiar with present technique field person, but does not break away from the desired protection range of claim.
Claims (11)
1. integrated heat dissipation module, in order to remove the heat that a thermal source is sent, it comprises:
One heat conducting base, made by the material of high heat conduction;
One covers body, and this covers body and engages with this heat conducting base, forms a cavity with air intake vent and air outlet;
One fan, at this heat conducting base and cover between the body, and comprise a flabellum portion, be connected in the magnetite portion on this flabellum portion and be positioned at a rotor portions on the magnetite portion, wherein this magnetite portion comprises a plurality of first magnetites, and this rotor portions below is provided with a plurality of second magnetites with respect to this first magnetite; And
One circuit board, between this magnetite portion and this second magnetite, and this circuit board is provided with a plurality of coils;
Use, behind this coil electricity, produce an induced field, repelling this permanent-magnetic field, and then impel this fan to rotate, to suck cold air by this air intake vent and to discharge hot-air by this air outlet.
2. integrated heat dissipation module as claimed in claim 1 is characterized in that, the bottom surface of this heat conducting base contacts with the surface of this thermal source.
3. integrated heat dissipation module as claimed in claim 2 is characterized in that, this thermal source is the CPU chip in the operation, and coating one heat-conducting glue between this heat conducting base bottom surface and this thermal source surface.
4. integrated heat dissipation module as claimed in claim 1 is characterized in that the central authorities of this heat conducting base upside are provided with a plurality of fins, and these a plurality of fins are needle-like.
5. integrated heat dissipation module as claimed in claim 1, it is characterized in that, the material of this high thermal conductivity is selected from the combination that comprises aluminium, copper, aluminium alloy and copper alloy, and this flabellum portion comprises an annular frame and a plurality of blade, and these a plurality of blades are connected in this framework below.
6. integrated heat dissipation module as claimed in claim 5 is characterized in that, this rotor portions comprises a ringwise rotor frame, a rotating shaft and at least one rib.
7. integrated heat dissipation module as claimed in claim 6 is characterized in that, the inner edge of this annular frame projects upwards and forms a tab, and this tab passes the central opening of this circuit board and links to each other with the bottom of this rotor frame.
8. integrated heat dissipation module as claimed in claim 7 is characterized in that, this each bar rib system links to each other with top and this rotor frame of this rotating shaft.
9. integrated heat dissipation module as claimed in claim 7 is characterized in that, this at least one rib is that three ribs and its position are symmetrical in this rotating shaft.
10. integrated heat dissipation module as claimed in claim 7 is characterized in that this rib is laminar, and the space that makes this cold air flow into is arranged between this at least one rib.
11. integrated heat dissipation module as claimed in claim 1 is characterized in that, this coil is a few circuit of the winding of drawing on this circuit board, and the bottom of this rotating shaft is inserted in the sleeve on this heat conducting base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01135805 CN1204798C (en) | 2001-10-22 | 2001-10-22 | Integrated heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01135805 CN1204798C (en) | 2001-10-22 | 2001-10-22 | Integrated heat dissipation module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1414825A CN1414825A (en) | 2003-04-30 |
| CN1204798C true CN1204798C (en) | 2005-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01135805 Expired - Fee Related CN1204798C (en) | 2001-10-22 | 2001-10-22 | Integrated heat dissipation module |
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| Country | Link |
|---|---|
| CN (1) | CN1204798C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100363629C (en) * | 2004-08-27 | 2008-01-23 | 鸿富锦精密工业（深圳）有限公司 | Thin fan |
| CN101123861B (en) * | 2006-08-10 | 2010-09-01 | 华硕电脑股份有限公司 | Liquid supply module and its applied electronic device |
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2001
- 2001-10-22 CN CN 01135805 patent/CN1204798C/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN1414825A (en) | 2003-04-30 |
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Granted publication date: 20050601 Termination date: 20151022 |
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