CN1203447C - Manufacturing method of non-contact intelligent label, counter - Google Patents
Manufacturing method of non-contact intelligent label, counter Download PDFInfo
- Publication number
- CN1203447C CN1203447C CN 02111879 CN02111879A CN1203447C CN 1203447 C CN1203447 C CN 1203447C CN 02111879 CN02111879 CN 02111879 CN 02111879 A CN02111879 A CN 02111879A CN 1203447 C CN1203447 C CN 1203447C
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- module
- pcb
- chip
- cut
- die
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- Expired - Fee Related
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- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The present invention relates to a method for manufacturing non-contact intelligent labels and counters, particularly to a manufacturing technology in the field of intelligence. The stabilization and the regulation of a coil are ensured in a PCB double face etching coil mode and an MOA2 mode or an MCC2 mode; thereby, the stabilization of product quality is ensured, and consistency is improved. Meanwhile, low cost and high efficiency are realized, and the present invention is more suitable for large-scale production conditions.
Description
Technical field
The present invention relates to intelligent field manufacturing technology.
Background technology
Also there are not this type of identical manufacturing process and product in the market.
Summary of the invention
For in extensive non-contact intelligent label, chip production, be fit to different uses field, satisfy the demand in different uses field, the market of developing non-contact intelligent label, chip, the manufacture method of having invented this non-contact intelligent label, chip.
Manufacture method of the present invention has following characteristics:
1, adopt MOA2 or MCC2 module to cooperate the semi-manufacture that are combined into non-contact intelligent label, chip with the PCB of two-sided etching coil, its performance meets ISO/IEC10373﹠amp; The standard of ISO/IEC14443-1D.
2, its broken through traditional on Polyvinylchloride the mode of coiling, adopt the mode of the two-sided etching coil of PCB, guaranteed the stable, regular of coil external form, thereby guaranteed constant product quality.
3, adopt the mode of the two-sided etching coil of PCB to avoid traditional coiling on PVC to be subjected to the restriction of equipment capacity, realized low-cost high-efficiency, be more suitable for mass production conditions.
Concrete manufacturing step is as follows:
A) module package;
A-1) chip thinning cutting: the disk chip is carried out attenuate by certain specification and standard, and then cut; A-2) chips welding (D/B): use the chip after the D/B machine will cut to combine with band, reach thrust standard＞500g/mm with the silver slurry
2
A-3) gold ball bonding (W/B): the semi-manufacture after D/B finishes couple together the solder joint of chip and band with spun gold, and the intensity of gold ball bonding reaches thrust standard＞4g;
A-4) module package: the semi-manufacture of gold ball bonding are partly sealed chip and spun gold fully with the black moulding compound, and guarantee that the spun gold lead-in wire is intact, and definite package area and package thickness;
A-5) module testing: with the test machine coding electrical property of module is carried out 100% test, reject failed module, stay effective module;
A-6) module is die-cut: utilize die cutting device effective module die-cut get off stand-by;
B) the printed circuit board (pcb) coil is made;
B-1) PCB design;
B-1-1) by formula L=1/4 Л
2f
2C calculates the size of the inductance value of requirement, and calculates wire circle according to the size of inductance value, and the sectional area of definite coil, live width, line-spacing, copper
Thick, golden thick parameter, wherein, f is the modular design optimum resonant frequency; C is a module equivalent series resonant capacitance amount;
L is the size of the inductance value that requires;
B-1-2) on PCB, reserve and the corresponding mounting hole of block size;
B-2) PCB makes: choose certain thickness PCB epoxy resin plate substrate; Adopt exposure, etch process manufacturing, the inductance measurement system tests automatically;
C) combination of PCB and module processing;
C-1) print solder paste on PCB module pad;
C-2) the die-cut module pressing that gets off on PCB, the black sealing of module partly embeds the PCB tapping, module weld zone and PCB pad join;
C-3) semi-manufacture that process hot setting: at step c-2) make module and PCB through 220 degrees centigrade to 270 degrees centigrade Reflow Solderings
Weld.
The product that above-mentioned part is made can be widely used in public transport, amusement, place such as false proof.The product that utilizes this technology to make has the equal performance at existing contactless smart card, but it is simpler and more direct than the former on manufacturing process, and properties of product are more reliable and more stable than the former, and consistance is higher, and manufacturing cost is lower than the former, is more suitable for large-scale production processing.
Embodiment
According to concrete manufacturing equipment, need the concrete label of making, the specification of chip, it is as follows to make example:
One, module package
1, chip thinning cutting: the disk chip is thinned to 0.15～0.18MM by certain specification and standard, and then cuts.
2, chips welding (D/B): use the chip after the D/B machine will cut to combine with band, reach thrust standard＞500g/mm with the silver slurry
2
3, gold ball bonding (W/B): the semi-manufacture after D/B finishes couple together the solder joint of chip and band with spun gold, and gold ball bonding reaches thrust standard＞4g.
4, module package: the semi-manufacture of gold ball bonding are partly sealed chip and spun gold fully with the black moulding compound, and guarantee that the spun gold lead-in wire is intact.Reach the smooth nothing of thrust standard module external form cavity, and package area 5.0*4.8MM; Package thickness 0.4MM.
5, module testing: with the test machine coding electrical property of module is carried out 100% test, reject failed module, stayed module.
6, module is die-cut: utilize die cutting device hold module die-cut get off stand-by.
Two, the PCB coil is made
1, PCB design: according to computing formula:
L＝1/4Л
2f
2C。Press the size design wire circle of inductance value again, and the sectional area of definite coil, live width, line-spacing, parameter such as copper is thick, gold is thick.On PCB, reserve and the corresponding mounting hole of block size.
*: f is the modular design optimum resonant frequency; C is a module equivalent series resonant capacitance amount.
The about 460mm of the sectional area of coil
2Number of turns 9T; Live width 10mil; Line-spacing 8mil; Thick 1 ounce of copper, golden thick 4u.
2, PCB makes: choosing thickness is 0.13mm PCB epoxy resin plate substrate, and gross thickness requires 0.36 ± 0.06mm, just in time absorbs module thickness.Adopt exposure, etch process manufacturing, the test automatically of inductance measurement system guarantees consistency of product.
Three, the combination of PCB and module processing
1, print solder paste on PCB module pad.
2, the die-cut module pressing that gets off on PCB, the black sealing of module partly embeds the PCB tapping, module weld zone and PCB pad join.
3, hot setting: through 220 degrees centigrade to 270 degrees centigrade Reflow Solderings module and PCB are effectively welded.
Claims (2)
1, the manufacture method of a kind of non-contact intelligent label, chip is characterized in that, concrete steps are as follows:
A) MOA2 or MCC2 module package;
A-1) chip thinning cutting: the disk chip is carried out attenuate by certain specification and standard, and then cut;
A-2) chips welding (D/B): use the chip after the D/B machine will cut to combine with band, reach thrust standard＞500g/mm with the silver slurry
2
A-3) gold ball bonding (W/B): the semi-manufacture after D/B finishes couple together the solder joint of chip and band with spun gold, and the intensity of gold ball bonding reaches thrust standard＞4g;
A-4) module package: the semi-manufacture of gold ball bonding are partly sealed chip and spun gold fully with the black moulding compound, and guarantee that the spun gold lead-in wire is intact, and definite package area and package thickness;
A-5) module testing: with the test machine coding electrical property of module is carried out 100% test, reject failed module, stay effective module;
A-6) module is die-cut: utilize die cutting device effective module die-cut get off stand-by;
B) the printed circuit board (pcb) coil is made;
B-1) PCB design;
B-1-1) by formula L=1/4 Л
2f
2C calculates the size of the inductance value of requirement, and calculates wire circle according to the size of inductance value, and the sectional area of definite coil, live width, line-spacing, thick, the golden thick parameter of copper, and wherein, f is the modular design optimum resonant frequency; C is a module equivalent series resonant capacitance amount, and L is the size of the inductance value that requires;
B-1-2) on PCB, reserve and the corresponding mounting hole of block size;
B-2) PCB makes: choose certain thickness PCB epoxy resin plate substrate; Adopt exposure, etch process manufacturing, the inductance measurement system tests automatically;
C) combination of PCB and module processing;
C-1) print solder paste on PCB module pad;
C-2) the die-cut module pressing that gets off on PCB, the black sealing of module partly embeds the PCB tapping, module weld zone and PCB pad join;
C-3) semi-manufacture that process hot setting: at step c-2) weld module and PCB through Reflow Soldering.
2, the manufacture method of a kind of according to claim 1 non-contact intelligent label, chip, it is further characterized in that, described step c-3) in the temperature of Reflow Soldering be 220 degrees centigrade to 270 degrees centigrade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02111879 CN1203447C (en) | 2002-05-30 | 2002-05-30 | Manufacturing method of non-contact intelligent label, counter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02111879 CN1203447C (en) | 2002-05-30 | 2002-05-30 | Manufacturing method of non-contact intelligent label, counter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1462015A CN1462015A (en) | 2003-12-17 |
| CN1203447C true CN1203447C (en) | 2005-05-25 |
Family
ID=29741930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02111879 Expired - Fee Related CN1203447C (en) | 2002-05-30 | 2002-05-30 | Manufacturing method of non-contact intelligent label, counter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1203447C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101482937B (en) * | 2009-03-22 | 2011-04-27 | 上海伊诺尔信息技术有限公司 | Thin non-contact module production method |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101025796B (en) * | 2006-02-17 | 2010-05-12 | 上海英内电子标签有限公司 | Electronic label reverse packaging process |
| CN102254211A (en) * | 2010-05-20 | 2011-11-23 | 上海伊诺尔信息技术有限公司 | Mobile communication subscriber identity module packaged with stacked chip scale package |
| CN102820533A (en) * | 2011-06-09 | 2012-12-12 | 上海中京电子标签集成技术有限公司 | Etching antenna |
| CN102496047B (en) * | 2011-11-11 | 2014-08-27 | 郭正韦华 | Special radio frequency identification e-tag for vehicles |
-
2002
- 2002-05-30 CN CN 02111879 patent/CN1203447C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101482937B (en) * | 2009-03-22 | 2011-04-27 | 上海伊诺尔信息技术有限公司 | Thin non-contact module production method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1462015A (en) | 2003-12-17 |
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