CN1193762A - Apparatus for liquid cooling of specific computer components - Google Patents
Apparatus for liquid cooling of specific computer components Download PDFInfo
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- CN1193762A CN1193762A CN97107266A CN97107266A CN1193762A CN 1193762 A CN1193762 A CN 1193762A CN 97107266 A CN97107266 A CN 97107266A CN 97107266 A CN97107266 A CN 97107266A CN 1193762 A CN1193762 A CN 1193762A
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Abstract
Apparatus is provided for a heat transfer assembly for direct attachment to a high heat generating chip, which assembly includes a pump, air side heat exchanger mounted adjacent to a fan and a heat transfer plate which is attached to the high heat generating component for dissipating heat from such component under operating conditions. In another embodiment, apparatus is provided for dissipating heat from a hard disk drive including a U-shaped heat exchange clip resiliently mounted on opposite surfaces of a hard disk drive. In another embodiment, apparatus for dissipating heat from a hard disk drive includes a generally rectangular plate for mounting on the top or bottom of the hard disk drive. And, in another embodiment, apparatus is provided transferring heat from a vertical array of hard disk drives, which apparatus includes one or more panels interposed between adjacent vertically disposed hard disk drives.
Description
What the present invention relates to is to utilize the heat conduction of each particular device of computing machine to carry out the device of liquid cooling, and described these devices are contained in the housing of computing machine, so that reduce the working temperature of these devices.
When some device of computing machine, for example the power of microprocessor or hard disk drive is big more, when structure is complicated more, and in order to keep being of compact construction, thus just need more effective heat control, to keep required working temperature.As everyone knows, according to the Arrhennius equation, failure rate increases with the increase exponentially ground of working temperature.For example suppose that activation energy is 1.0eV, then the every increase of working temperature is 10 ℃, and failure rate just doubles.So, unfavorable rising appears in order to prevent working temperature, and for example increasing, the power of the computer chip of Pentium class has just required more effective heat control.
Known having directly used air-cooled fan component on each electron device, so that utilize the heat conduction of finned type heat exchanger and dispel the heat with the convection heat transfer' heat-transfer by convection of this heat exchanger, described heat exchanger is cooled off by airflow.For example cool off Intel's 486 computing machines, and extend beyond the chip of the finned type heat exchanger cooling intel pentium machine of Pentium computer real contact area (thinking the heat exchanger of extended surface sometimes) with the surface with suitable finned type heat exchanger.The operate power of some device (for example new edition intel pentium machine chip) has reached the degree that need force cold wind to dispel the heat in a large number, but the limitation of forcing cold wind of cooling fins assembly is because noise or other factor that need increase power are restricted the upper limit of cooling air delivery.
In the prior art, except the fin surface heat exchanger, usefulness is cooling system usually.For example known peltier cooler and heat pipe.But because efficient own is not high, the needs of the potential energy height of peltier cooler and extra cooling load just may reduce the continuous cooling to the high heat load device.In addition, the reason that the Heat Transfer of Heat Pipe on Heat Pipe ability is restricted mainly is the loss that the heating power container with cold of heat causes in connection procedure, but also because the limited heat transfer that the limitation of indoor design causes.
People also know with coldplate circulates liquid coolant, and this coldplate contacts with each (PCC) power, and (PCC) power for example is triode, diode and rectifier.EG﹠amp for example; G ComponentsDivision ofWakefild Engineering of Wakefild, Massachusetts is with the thin plate bending that produces, that is to say around cooling tube and the solid copper coin of water-cooled makes thin plate wrinkling, the rectifier that the solid copper coin of cooling tube and water-cooled is used to cold pressing and installs, and the heat radiation of the SCR of each equipment is up to 2kw.The shortcoming of Wakefild coldplate is: having very big thermal resistance, another shortcoming on all interfaces between copper pipe and the aluminium sheet is to cause the cooling up to 50 percent to change after making pipe wrinkling in this way.
Present many patents are devoted to utilize liquid coolant to come cooling electronic device, particularly are used for cooling off the electron device in the super-huge computing machine.On the inner-cooled plastics chipware that U.S. Pat 5159529 is used one or more cooled copper is housed, various electron devices are installed on the copper coin.But, because each material and mismatching can cause leakage problem when being fixed to copper coin on the plastics chipware.U.S. Pat 5,144,532 two blocks of used liquid cooling plates are arranged on two opposite sides, and these plates contact with printed wire on the multilayer printed circuit board two opposite sides.U.S. Pat 4748495 discloses a kind of liquid cooling assembly that is used for the uneven chip of some height that fit together, cooling fluid or flow through one group of hot chain wherein, or flow through each hot chain indirectly.In addition, the U.S. Pat 4758926 disclosed hot chains that are to use with minitype channel, cooling fluid flows through these passage cooled wafers.
Though prior art is normally come cooling electronic device with cooling fluid or cooling medium, but still need the jumbo cooling system of exploitation, this cooling system be contained in the housing of desk-top computer and the housing of service scale computing machine in, in this housing, cooling system directly contacts the Pentium processor of for example nearest more high-power version and hard disk drive with power is maximum with the electron device of thermal value maximum.Therefore the object of the present invention is to provide a kind of cooling system that is exclusively used in these devices.
Different embodiment according to the subject invention, the device that is provided are used for the heat that the high electron device of the thermal value of above-mentioned for example giant scale integration chip and hard disk drive class produces is distributed.In one embodiment, this device comprises a chassis that is roughly rectangle, and there are some devices that comprise motherboard on this chassis, and is installed in the processor chips in one of them processor notch on the motherboard.Heat exchanger assemblies comprises a power supply that is installed on one jiao on the chassis, near power supply a fan is arranged.Heat exchanger assemblies is used for the heat that chip produces is dispersed in the air-liquid heat exchanger, this air-liquid heat exchanger is arranged on the fan next door on the chassis, a pump is installed in the correct position place on chassis, and the shape of a heat transfer plate is identical with the bottom surface of the high chip of thermal value substantially.By a suitable pipeline heat transfer plate is linked to each other with the air side heat exchanger, so that make liquid coolant can be sent on the heat transfer plate, remove heat from the chip that thermal value is high, cooling medium after the heating obtains cooling in the air side heat exchanger simultaneously, is returned on the heat transfer plate continuously by pump again.
In another embodiment of the present invention, the device that is provided is used for cooling off the hard disk drive that is moving, and this device comprises a heat interchange folder that can flexibly be installed in the U type that is roughly on hard disk drive container one side.U type folder comprises the outside liquid coolant flow path that is fixed on this folder outside, so that be the hard disk drive heat radiation.Be used for cooling off the embodiment of single hard disk drive at another, this device comprises a heat transfer plate that is roughly rectangle, and the size of this plate is basic identical with the surface size of hard disk drive container, is used to this box heat radiation.
Another device that is provided is used for being a vertically disposed row or group hard disc driver element heat radiation.This device comprises one or more panels that are arranged between the vertically adjacent hard disk drive element, so that remove the heat on the adjacent driven device element simultaneously.
Summary of the present invention is used for describing on the whole the present invention, and below than describing the present invention in greater detail, simultaneously, claims are used to narrate the subject matter that needs protection.
Fig. 1 is the synoptic diagram that is used to illustrate the computing machine of first preferred embodiment of the present invention, and this embodiment is used for providing liquid cooling medium to the high processor of thermal value;
Fig. 2 is mounted in the synoptic diagram of the heat exchanger plate on the high processor of thermal value;
Fig. 3 is a side view, and the expression cooling is from the air-liquid heat exchanger of the liquid of Fig. 2 heat exchanger plate outflow;
Fig. 4 is the skeleton view that the heat exchanger fluid cooling medium is offered the folder of hard disk drive on the heat exchanger;
Fig. 5 is the backside perspective view that is contained in the folder on the hard disk drive heat exchanger;
Fig. 6 is the skeleton view that is contained in the lip-deep heat transfer plate of hard disk drive; With
Fig. 7 is to use the skeleton view of heat interchange panel, and these panels are inserted between the vertical adjacent stacked-up type hard disk drive.
With reference now to accompanying drawing,, mainly referring to Fig. 1 to 3, the device of representing with A is used for cooling off continuously the high device P of thermal value, and the Pentium computer of being produced by Intel company for example is so this machine is because its power needs to produce very big heat.When originally Intel developed Pentium chip, Intel cooled off Pentium chip with regard to proposing with the method that heat radiator and air-flow combine, and the size of hot chain is relevant with airshed.The specification of previous disclosed Pentium chip version comprises that peak power is the 66MHZ plug-in type PGA Pentium processor of 16W, and processor is of a size of 2.16 " * 2.16 ", and the maximum temperature of box body is 70 ℃.For this Pentium processor, Intel has also proposed equipment in regulation maximum junction temperature is 90 ℃.
In common computer case, the known environment temperature is between 40 ℃ to 45 ℃, and the definition environment air themperature is the not ambient air temperature of diffusion around the Pentium plug-in unit.Through test, for Intel's machine, usually in the plug-in unit upstream 12 inches locate measures ambient temperature, and around system, the definition environment temperature is the temperature of the air of plug-in unit upstream and its vicinity.
Continual renovation along with the high chip of Pentium processor and other working temperature height or thermal value, so only the array mode with heat radiator or finned airflow heat-exchanger becomes bigger with the difficulty that operation processor remains in the desired operating temperature range, the chip that above-mentioned working temperature is high for example is special IC (ASICS), and the back is called this circuit " processor that thermal value is high " or " chip that working temperature is high ".Device A of the present invention is that the temperature that this cooling system is exclusively used in processor that working temperature is high or chip remains in the scope of producer's regulation with the cooling system of liquid as cooling medium.Know that in addition chip producer generally will throw away or make a price reduction sale above the chip of regulation working temperature.Can utilize the chip that discards that can buy at low prices in the past with device A of the present invention.
Referring now to Fig. 1,, label 10 expression computer cases.Housing 10 is the known rectangular box of prior art.Housing 10 as an example comprises 11, the first groups of both sides 14a and 14b that relative both sides 12a is relative with 12b and second group at the bottom of, and all these sidepieces all interconnect or combine with the end 11.The chassis of label 13 being represented with known method is contained in the housing 10.Chassis 13 is generally rectangle, just there is each relative sidepiece (not shown, but each sidepiece is all parallel with each sidepiece of computer case, its undersized is in computer case) on the chassis like this, the chassis can be cooperated with each sidepiece 12a-b and 14a-b with the end 11 of computer case, and the chassis also has motherboard 15.
As known in the art, motherboard 15 is arranged on housing 10 the end 11 near so that each used computer device of prior art is installed.Do not introduce herein and make computing machine normally move all required devices, but the technician in the Computer Design field extremely understands this.Here the special device of introducing is and the maximally related device of the present invention.
Motherboard 15 comprises series installation groove (not shown, but those skilled in the art will know that), is equipped with " son " plate, daughter board a series of and comprises the microprocessor board 16 of the high processor of actual installation Pentium computer for example or other thermal values on these mounting grooves.The benefit that the Main Processor Unit P that thermal value is high is installed on the portable plate 16 is and can changes plate 16 into the high chip of new improved thermal value plate.Other daughter boards also have been installed in addition, peripheral devices interface board or video interface plate are for example arranged, these plates are represented with label 17 and 18.Known also have processor chips are installed to (ZIF) or (LIF) in the inserted block.As known technology, housing door or opening 19 are installed one or more frames that are used to place floppy disk or compact disc driver.The rectangular configuration of representing with label 20 is the installation region of one or more this peripheral devices unit.
Power supply 21 is arranged on the angle that the sidepiece 14a of housing and 12b constitute, and like this, under any ruuning situation, cooling medium can not leak into the master of power supply because of the transmission of the gravity of air-flow or air-flow.With computer cooling fan 22 be installed in power supply 21 near.On a side or one side 14b, have a series of notches 23, so that allow circulating air flow into or the outflow housing.
Apparatus of the present invention A provides liquid coolant to the chip P of hot operation continuously, and this device comprises 30, one air side heat exchangers 32 of a pump and a heat transfer plate 34.The pump 30 that can be contained in any correct position place in 13 zones, chassis has an enclosed cooling-fluid loop, and this system is used for the cooling medium between pumped air side heat exchanger 32 and the heat-exchangers of the plate type 34.Air side heat exchanger 32 is described in detail in Fig. 3.Air side heat exchanger 32 can be any heat exchanger in a large amount of suitable heat exchangers of supplying on the market.In this preferred embodiment, the heat exchanger 32 of Fig. 3 can be similar to 720 series of heat interchangers, and this heat exchanger is EG﹠amp; The heat transfer capacity that G Division of Wakefild Engineering of WakefildMassachusetts sells is the heat exchanger of 18kw.The copper pipe 32a that 720 series of heat interchangers 32 use extends from inlet 32c, and copper pipe is made spirally coiled, and draws from outlet 32b.The framework 33 of the tubular copper pipe 32a of mounting disc is a rectangle, and framework is made of aluminum.Air side fins 32d is contained in the aluminium chassis 33, and is fixed on the spirally coiled copper pipe with known method.This unit becomes effective RotronMuffin standard fan (model is the tm XL fan of No.MX2A3) maybe can use fan unit well known by persons skilled in the art.In a word, require air side heat exchanger 32 is nestled up fan unit,, reduce the temperature of the liquid coolant that flows through it so that make the heat transfer efficiency maximum.The diameter of used pump 30 is not more than 2.5 inches, length is not more than 5 inches.The flammable specification of pump 30 is that the specification of tm UL9494V-2 and UL overload motor and synchronous rotor is UL1950.As an illustration, pump 30 has low pressure inlet 30a and high-pressure outlet 30b.
Fig. 2 schematically illustrates coldplate 34.Coldplate 34 is the rectangular solid copper billet, and 34b is equipped with brass pipeline 35 in its outlet, and 34c is equipped with brass pipeline 36 at its inlet.Because pump can be installed in all correct positions in 13 zones, chassis, brass pipeline 35 and 36 dots in Fig. 1.Shown copper billet 34 is drilled with U type hole 34a, and this hole penetrates piece, and also available additive method is made this hole.But also the stream of available other shapes increases heat transfer effectively, and this stream comprises the stream that has along a plurality of holes of the elongated lengthwise of piece.The length of copper billet and wide all sizes all with at the bottom of the alloy material of Pentium chip or the length and the width of ceramic lower surface cooperate, or match with other bottom surfaces of the high chip of working temperature.Can the bottom surface of this chip be cooperated, to avoid air pocket with the gap binding face of hot grease or with the gap binding face of the equivalent that those skilled in the art will know that to carrying out machine work with the shape on the high contacted copper billet of the die bottom surface surface of thermal value.Except with the solid copper billet, with hollow block also within the scope of the invention, this hollow block has the end, top and four limits, this hollow block is made by copper or brass, it has one or more dividing plates that partly extend along the lengthwise of shell length, and this dividing plate will stick up body and be divided into a plurality of chambers, makes inlet pipeline 36 and outlet conduit 35 carry out fluid and is communicated with.Pipe should be brass or plastic refractory, and the regulation pipe satisfies required working temperature, and its flammable specification should be UL62VW-1.
Liquid coolant can be a water, also can be to have 50% ethylene glycol of known antiseptic property and the potpourri of water.Liquid system will obtain airtight coolant system with connector well known in the art, and this system is in office, and when the marquis seals, but is not suitable for using at all occasions.
The known environment temperature of each electron device in computer case 10 that is installed on the chassis can raise about 10 ℃ usually.The working temperature of also knowing the chip that the thermal value that resembles the Pentium class is high in addition is greatly in 60-70 ℃ scope.It is of the present invention that to be used for the device that chip P is cooled to 55 ℃ of following working temperatures be in order to use the current chip that does not meet some chip factory man regulation.This can be by the size of design heat exchanger 32 and the flow of pump 30, effective heat transfer of considering coldplate simultaneously is accomplished, will from working chip P, spread out of enough heats like this, even under the worst condition of work, also working temperature can be dropped to about 55 ℃, can drop to than the operating temperature range of integrated package bottom and hang down 5 ℃.The environment temperature of 55 ℃ of working temperature supposition is 40 ℃.Needed flow changes according to concrete processor, and promptly ASIC and/or the hard disk drive according to cooling changes, but believes that flow can be less than the flow of the used liquid coolant of prior art.
Now referring to Fig. 4-6.Device B-1 and B-2 are provided for reducing the liquid coolant of hard disk drive working temperature.The mounting means of hard disk drive D-2 among hard disk drive D-1 among Fig. 4 and Fig. 6 and shell all conform to normal component on the market.Driver D-1 and D-2 are installed in the computer case separately or with the method for dense laminated arrangement (this will discuss in Fig. 7).Because be stacked, so hard disk drive is cooled off without heat radiator by the air-flow cooling usually.Hard disk drive D-1 and D-2 divide two kinds of basic sizes, i.e. " half height " and " full-height ".Unique difference between them is that the height of half height hard disk drive is about 1 inch, and the height of full-height hard disk drive is about 1.63 inches.Hard disk driver system is made of the steel container substantially, and the monolithic printed-wiring board (PWB) of representing with label 50 in a Fig. 4 and 6 (PWB) is arranged, and printed-wiring board (PWB) directly is screwed on the bottom 51a of hard disk drive housing 51.Other faces of hard disk drive housing 51 comprise top 51b, front and back side 51c and 51d and opposite both sides 51e and 51f.As known in the art, hard disk drive container 51 has one group to be installed in a hardware driving dish on the axle, and the rotating speed of axle is per minute several thousand commentaries on classics.The result of turning effort makes the environment temperature of internal hard disk drive container reach uniform temperature, or it is called " fully stirring container ".Hard disk drive D-1 and D-2 comprise some temperature measuring equipments, and temperature measuring equipment includes but not limited to motor bearings.
Known technology is partly to cool off hard disk drive by the heat conduction of attachment rail, and this technology is owing to the heat conduction loss on interface heat conduction loss on the track and the whole length of track is restricted efficient.
Referring now to Fig. 4,, device B-1 is a kind of heat exchanger that gets on clip, and this heat exchanger flexibly is installed in the relative two sides of hard disk drive D-1 unit housings 51.The folder that clips heat exchanger 60 is a U type spring clamp 60, and spring clamp is by copper beryllium alloy, and phosphor bronze or other suitable metals constitute.U type spring clamp 60 comprises first and second jig arm 60a and the 60b, and flexible circle that these two jig arm constitute by two integral body or arcuate member 60d and 60e and holder or clip back 60c combine.So U type heat exchanger folder 60 comprises side 60a and the 60b of being convenient to flexibly expand, these two sides are inserted on the side 51e and 51f of hard disk drive housing 51, because the elastic pressure that spring action had of folder, this folder is just fixing to be gone up in position.
Referring now to Figure 4 and 5,, U type spring clamp comprises opening 60f and the 60g that is on the arcuate member.The inlet 62 of pipe and the outlet 63 of pipe are installed on the back 60c and sidepiece 60a and 60b of heat interchange folder, so that heat of cooling exchange folder itself utilizes thermal conductance to absorb the heat that hard disk drive housing 51 sends thus.Source line 62 is by having the joint 64 of Y shape web member (not shown), so that source line is divided into first and second source line part 62a and the 62b.With Y shape web member discharge pipe 63 is divided into discharge pipe part 63a and 63b.Source line part 62a and 62b extend through the opening 60f and the 60g of heat interchange folder respectively, and along the length longitudinal extension of the outside surface of each side 60b and 60a.By solder joint 65 pipeline is fixed on sidepiece 60a and the 60b.Source line part 62a makes the U type at position 62c place, and returns coolant lines 63a and links to each other, and this coolant lines extends rearward to coolant outlet pipeline 63.The coolant entrance pipeline 62 of heat interchange folder extends to the pump discharge place of pump shown in Figure 1 30, the coolant outlet pipeline 63 of heat interchange folder extends to the porch of air side heat exchanger 32, heat exchanger 32 in the pump 30 just becomes the part of the DISK to Image driver coolant system of Fig. 4-5 like this, so that remove the heat on the operation hard disk drive continuously.
Referring now to Fig. 6,, introduces hard disk drive D-2.The housing of the housing of driver D-1 and driver D-2 is the same substantially, different just driver D-2 being fixed on the fixture of a side or many sides (for example 51e), fixture is in computer case, so must cool off hard disk drive by generator B-2.Device B-2 comprises a copper coin 70, and copper coin is a rectangle, and it is long and wide to cooperate with the end face 51b of hard disk drive D-2.Coolant entrance pipeline part 71a extends from the discharge pipe (rather than suitable pump) of pump 30 (Fig. 1), and be fixed on the top of coldplate 70 by each solder joint 65 shown in Figure 6, this source line part is extended according to rectangular pattern at the periphery of coldplate 70, its terminal point is at exit portion 71b place, exit portion and intake section form one, this exit portion 71b extends to the porch of air side heat exchanger 32 or other suitable air side heat exchangers, so the pump 30 of Fig. 1 and air side heat exchanger have constituted the part of Fig. 6 heat-exchange system B-2.One or more locating clips 72 are installed to a side or the many sides 51c of hard disk drive D-2, and 51e and/or 51f go up so that cold drawing or coldplate 70 are fixed on the end face 51b of hard disk drive 51.
Referring now to Fig. 7,, device B-3 is used to cool off vertical row's hard disk drive D-3, D-4, D-5 and D-6, these drivers vertically one be layered in above another, these drivers are fixed on the suitable fixture of computing machine for example known rail mounted fixture (not shown) with screw 80.The hard disk drive D-3 to D-6 of homeotropic alignment can produce a large amount of heat, uses conventional heat radiator and cooling air mode they can not be cooled to required working temperature.Hard disk drive D-3 to D-6 is box rectangular case or container, and they comprise an end face, and bottom surface and relative side are so each container of actuator unit D-3 to D-6 can use identical shaped housing.Owing to need a large amount of air of cooling, so the air cooling is not desirable technology, cool off the danger that a large amount of air might cause poor stability, because this might damage fan, but also can produce noise.Cooling system B-3 is assigned or is clipped between two adjacent hard disk drives (for example D-3 and D-4), so that conduct heat to a series of flexible thermal exchange mechanisms or plate 81 from adjacent hard disk drive.
Each flexible heat exchange component 81 constitutes by very thin sheet hollow, rectangular plate, and the inside has been full of coolant liquid, and what for example fill is the potpourri of 50% water and 50% ethylene glycol.Flexible heat exchange component 81 has perimeter seal 81a, and seal extends around rectangle perimeter, and the inside has just constituted a chamber or chamber like this.Comprise five layers of flexible body in the flexible heat exchange component, these five layers comprise from top to bottom: the top layer of polyamide film material, two insert layers of middle layer and bottom and FEP fluorocarbon membraneous material, the polyamide film material mainly is the material of being produced by Dupont company that is named as KAPTON, and insert layer mainly is the material of being produced by Dupont company that is named as TEFLON.Central area behind the compartment of terrain configuration ring interconnect spare 81b between two fluorocarbon membraneous materials forms some passages, a U type stream 82 is so just arranged by flexible thermal power board or member 81.Each point of fixity of film 81b also is used for fixing outer plate, and to prevent unnecessary expansion or protuberance, this expansion or protuberance can produce the unnecessary power that affacts on the driver printed-wiring board (PWB) 50.The substitute is, can control this power,, increase heat transfer contact with the hard disk drive surface so that only provide the pressure that is beneficial to heat transfer.The position of ring interconnect spare can change, and so that different streams to be provided, but in an illustrated embodiment, cross tie part 81b is along three line settings, and on 4 an of line, these three lines are along the longitudinal extension of dish 81.
In order to further describe the manufacture method of this flexible thermal power board, the applicant is that (the invention people is Messr.Daniel N.Donahoe and MichaelT.Gill for 08/674081 U.S. Patent application in conjunction with application number, the applying date is on July 17th, 1996, awards allow the people first applies for same and awards and allow the people: Compaq Computer Company) describe.When doing complete explanation with reference to instructions, claims and accompanying drawing; so that can make the content of describing and asking for protection clearer; the applicant pays special attention to the description for the stream xsect of the description of Fig. 3-7 and 9-12 page or leaf, but still Fig. 3 and 4 of main reference.Certainly also available simpler slab structure, the periphery of the suitable flexible plastic material of the two-layer adjacency of this structure is sealed, and some solder joints are arranged, and welds together internally at these solder joint place sheet materials and sealing the margin.
Each flexible thermal exchange plate 81 all has a coolant inlet or inlet 81c and a coolant outlet 81d.Because plate 81 is positioned at or is clipped between the adjacent stacked hard disk drive (for example D-3 and D-4), so the mobile coolant outlet 81d of each plate 81 passes through web member 85a, 85b links to each other with total recirculatory pipe 85 with 85c.The flexible coldplate 81 that the house steward 87 that similarly enters the mouth will respectively assign or clamp links together.The house steward 87 that will enter the mouth then is fixed to the exit of pump 30 shown in Figure 1.Outlet header 85 and air side heat exchanger for example link to each other with the inlet of the air side heat exchanger 32 shown in 3 with Fig. 1.
At run duration, the plate expansion that is caused by hydrodynamic pressure has other favourable characteristics: at run duration, each driver is close together more tightly; When exitting, than being easier to pull down driver to plate.
Description above the present invention is explanation as an example, under the prerequisite that does not exceed the scope of the invention, can do various changes to the details of said apparatus and structure and operation method.For example, within the scope of the invention, can combine various heat transfer embodiment of the present invention is used in the single computing machine.The device of Fig. 1-3 is adopting pump 30 suitably, and the size of fan 22 and air side heat exchanger 32 just can be cooled off a plurality of chips later, provides suitable cold liquid cooling medium to polylith heat transfer plate 34 simultaneously.In addition, can adopt pump 30 suitably, the size of fan 22 and air side heat exchanger 32 is cooled off hard disk drive housing 51, the heat transfer plate 70 of the U type folder 60 of the device B-1 of this housing employing Fig. 4-5 or the device B-2 of employing Fig. 6, and the system with Fig. 1-3 combines simultaneously.Perhaps the homeotropic alignment hard disk drive D-3 of cooling Fig. 7 can be combined to the system B-3 of D-6 and the cooling system of Fig. 1-3.In addition, hard disk cooling device B-1 and B-2 can use with air side heat exchanger 32 and the pump 30 of Fig. 1-2.The device A, B-1, any other combination of one of B-2 and/or B-3 can with single pump, the air side heat-exchange system is used together.
Claims (24)
1. electronic installation comprises:
A chassis that is roughly rectangle, this chassis have first and second groups of relative sidepieces;
Some electron devices, these electron devices are installed on the described chassis that comprises a motherboard;
Described motherboard has some expansion notches, and a processor plate is installed in the described processor notch, and a chip that thermal value is high also is housed on this processor plate;
A power supply, this power supply are installed in the joint of arbitrary sidepiece of arbitrary sidepiece of first group of sidepiece on described chassis and second group of sidepiece, near described power supply a fan have been installed also;
A heat-exchange system, this heat-exchange system are used for the heat that the chip that described thermal value is high sends and dissipate, and described heat-exchange system comprises:
An air-liquid heat exchanger that is arranged on the fan next door on the described chassis, described air-liquid heat exchanger has an inlet and an outlet, entrance and exit communicates with some liquid coolant via fluid that separate, to receive the airflow that fan produces, thereby reduce the temperature of the cooling medium that flows through described path, cooling medium flows to described outlet from described inlet;
A pump that is installed on the described chassis, this pump have a low pressure inlet and a high-pressure outlet;
A heat transfer plate, it is identical with the bottom surface of the chip that thermal value is high that the shape of this heat transfer plate is basic, heat transfer plate is fixed on the bottom surface of chip when operation, described heat transfer plate has a liquid coolant inlet and a liquid coolant outlet, and a path is arranged in inside, thereby make cooling medium flow to described outlet from described inlet; With
At pipe fitting that extends between the inlet of the outlet of described heat transfer plate and described air liquid heat exchanger and the pipe fitting that between the inlet of described heat transfer plate and described delivery side of pump, extends.
2. electronic installation according to claim 1 comprises:
Described pump, heat transfer plate, pipe fitting and air side heat exchanger constitute makes liquid coolant round-robin loop system.
3. electronic installation according to claim 2 comprises:
Described cooling medium is the potpourri of about 50% water and about 50% ethylene glycol.
4. electronic installation according to claim 1 comprises:
Described fan is a rectangle, and described air side heat exchanger also has substantially similarly shape.
5. electronic installation according to claim 1 comprises:
Described electronic chassis raises 10 ℃ ambient air temperature when being contained in the computer case, the design effort temperature of the chip that described thermal value is high is 60-70 ℃, described air-liquid heat exchanger provides enough temperature variation for the described described outlet that enters the mouth, so that the working temperature of the high chip of described thermal value is remained on about 55 ℃.
6. a computing machine comprises:
A box rectangular case, this housing have a rectangle chassis, and the chassis comprises first and second groups of relative sidepieces, and the rectangle chassis is installed in the described housing;
Some electron devices, these electron devices are installed on the described chassis that comprises a motherboard;
Described motherboard has some expansion notches;
A processor plate that is installed in the described processor notch also is equipped with a chip that thermal value is high on this processor plate;
A power supply, this power supply are installed in the joint of arbitrary sidepiece of arbitrary sidepiece of first group of sidepiece on described chassis and second group of sidepiece, near described power supply a fan have been installed also;
A heat-exchange system, this heat-exchange system are used for the heat that the chip that described thermal value is high sends and dissipate, and described heat-exchange system comprises:
An air-liquid heat exchanger that is arranged on the fan next door on the described chassis, described air-liquid heat exchanger has an inlet and an outlet, entrance and exit communicates with some liquid coolant via fluid that separate, to receive the airflow that fan produces, thereby reduce the temperature of the cooling medium that flows through described path, cooling medium flows to described outlet from described inlet;
A pump that is installed on the described chassis, this pump have a low pressure inlet and a high-pressure outlet;
A heat transfer plate, it is identical with the bottom surface of the chip that thermal value is high that the shape of this heat transfer plate is basic, heat transfer plate is fixed on the bottom surface of chip when operation, described heat transfer plate has a liquid coolant inlet and a liquid coolant outlet, and a path is arranged in inside, thereby make cooling medium flow to described outlet from described inlet; With
At pipe fitting that extends between the inlet of the outlet of described heat transfer plate and described air liquid heat exchanger and the pipe fitting that between the inlet of described heat transfer plate and described delivery side of pump, extends.
7. computing machine according to claim 6 comprises:
Described pump, heat transfer plate, pipe fitting and air side heat exchanger constitute makes liquid coolant round-robin loop system.
8. computing machine according to claim 7 comprises:
Described cooling medium is the potpourri of about 50% water and about 50% ethylene glycol.
9. computing machine according to claim 6 comprises:
Described fan is a rectangle, and described air side heat exchanger also has substantially similarly shape.
10. computing machine according to claim 6 comprises:
The ambient air temperature of described counter body raises 10 ℃, the design effort temperature of the chip that described thermal value is high is 60-70 ℃, described air-liquid heat exchanger provides enough temperature variation for the described described outlet that enters the mouth, so that the working temperature of the high chip of described thermal value is remained on about 55 ℃.
11. electronic installation comprises:
A chassis that is roughly rectangle, this chassis have first and second groups of relative sidepieces;
Some electron devices, these electron devices are installed on the described chassis that comprises a hard disk drive, and described hard disk drive has one to be roughly box container;
A heat-exchange system of described hard disk drive, this system comprises:
A heat interchange folder that is roughly the U type, this folder comprises first and second jig arm, jig arm and formation one at the bottom of;
Coolant circuit with the installation of described U type heat interchange folder, described coolant circuit comprises first loop sections on first jig arm that is fixed to heat interchange folder and is fixed to second loop sections on second jig arm of heat interchange folder, so that liquid coolant circulates, thereby absorb heat on first and second jig arm that described hard disk drive container is sent to described heat interchange folder;
The jig arm and the elasticity of the described end of described U type folder constitute one, and jig arm and described hard disk drive are inserted into to Elastic Meshing on this hard disk drive container each other; With
A closed circulation system, this system is recycled in the described loop liquid coolant, and this loop is installed on the described U type folder, and making described circulate coolant before described cooling circuit, reduces the cooling medium that flows out from described coolant circuit.
12. electronic installation according to claim 11 comprises:
First and second loop sections of described coolant circuit are made up of the pipeline of guiding liquids cooling medium stream, described coolant circuit comprise the first and second inlet pipeline sections on first and second jig arm that are respectively fixed to the described end and described U type folder and be fixed to the described end and first and second jig arm of described U type folder on first and second outlet pipe sections, described entrance and exit section utilizes described arbitrary jig arm to interconnect, so that make liquid coolant flow to described first and second outlet sections, thereby absorb the heat that the container of described hard disk drive sends from described first and second entrances.
13. electronic installation according to claim 11 comprises:
First and second jig arm of described U type folder all have an opening, and described first loop sections and described second loop sections extend through the opening on described first jig arm and the described jig arm, so that be fixed on the outside surface of each jig arm.
14. electronic installation comprises:
A chassis that is roughly rectangle, this chassis have first and second groups of relative sidepieces;
Some electron devices, these electron devices are installed on the described chassis that comprises described hard disk drive, and described hard disk drive has one to be roughly box container, and container has an end face, bottom surface and two groups of relative sides; With
A heat-exchange device that is used to control described hard disk drive working temperature, this device comprises:
A rectangle heat transfer plate, the size on the box rectangular vessel surface of the size of this plate and described hard disk drive is basic identical, and described heat transfer plate is contained on one of them surface of box rectangular vessel of described hard disk drive;
A cooling pipeline section, this pipeline section is contained on the described heat transfer plate and extends through the heat transfer plate that is roughly rectangle, and this pipeline section has an outlet section and an entrance; With
Recycle unit, this equipment linked to each other with cooling pipeline section on being installed in described heat transfer plate in when operation, so that reduce the temperature of the cooling medium that described cooling tube exit section flows out, and described temperature coolant is recycled to be installed in the entrance of the described cooling pipeline section on the described heat transfer plate.
15. electronic installation comprises:
A chassis that is roughly rectangle, this chassis is used to install electron device;
The hard disk drive units of some homeotropic alignments, described hard disk drive units all have and are roughly box housing, and housing has a rectangular top and a rectangular bottom surface;
A cooling system that is used for the hard disk drive units of described homeotropic alignment, this system comprises:
A heat transfer plate that is installed between a described hard disk drive housing bottom surface and another hard disk drive housing top surface, described plate has one to make liquid coolant round-robin liquid coolant circulating path, so that absorb the heat that described hard disk drive units is sent when operation; With
A coolant circulating system, heat is removed continuously by this system from the cooling medium of the plate that heated by described hard disk drive units, reduce the temperature of described cooling medium, and described cooling medium is turned back on the described plate, so that the heat that described hard disk drive units is sent dissipates.
16. electronic installation according to claim 15, wherein:
Described heat transfer plate is flexible.
17. electronic installation according to claim 15 comprises:
Described heat transfer plate is a hollow, and it is made of at least two relative flexible materials parallel to each other.
18. electronic installation according to claim 17, wherein:
Described hollow heat transfer plate has an ingate and an outlet opening; With
Described coolant circulating system has a pump that is communicated with described ingate and an air side heat exchanger that is communicated with described outlet opening.
19. electronic installation according to claim 15, wherein:
Described cooling medium is the potpourri of water and ethylene glycol.
20. electronic installation according to claim 19, wherein:
Described liquid is the potpourri of the ethylene glycol of the water of about 50% volume and about 50% volume.
21. electronic installation according to claim 15 comprises:
Described heat exchanger plate is made of relative flexible sheet material; With
Described heat exchanger plate is airtight periphery, forms the hollow chamber that receives described cooling medium in this model.
22. electronic installation according to claim 21 comprises:
Several interconnected point in described hollow chamber, wherein said each relative flexibility plate links together.
23. electronic installation according to claim 18, wherein:
Described cooling system comprises two or more described heat transfer plates;
An inlet air flow house steward carries out fluid with the ingate of described two or more heat transfer plates and links to each other, and an exit flow house steward carries out fluid with arbitrary outlet opening of described two or more heat transfer plates and links to each other; With
Described inlet air flow house steward and exit flow house steward are communicated with described coolant circulating system fluid.
24. electronic installation according to claim 16 comprises:
Described heat transfer plate expands out-of-date the obtaining of liquid coolant flow, and this heat transfer plate is easy to described hard disk drive units is removed when shrinking.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US77514396A | 1996-12-31 | 1996-12-31 | |
| US775,143 | 1996-12-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1193762A true CN1193762A (en) | 1998-09-23 |
Family
ID=25103453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97107266A Pending CN1193762A (en) | 1996-12-31 | 1997-12-31 | Apparatus for liquid cooling of specific computer components |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH10213370A (en) |
| CN (1) | CN1193762A (en) |
| TW (1) | TW422946B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1658744B (en) * | 2004-02-16 | 2010-07-21 | 株式会社日立制作所 | Liquid cooling system and an electronic apparatus |
| CN101115373B (en) * | 2006-07-25 | 2010-08-11 | 富士通株式会社 | Electronic apparatus including liquid cooling unit |
| CN101471308B (en) * | 2007-12-26 | 2011-03-23 | 中强光电股份有限公司 | Radiating module |
| CN102089726A (en) * | 2008-04-17 | 2011-06-08 | 泰拉丁公司 | Temperature control within storage device testing systems |
| CN105698460A (en) * | 2014-11-28 | 2016-06-22 | 青岛海尔智能技术研发有限公司 | Refrigerator and cooling capacity compensation method applied to refrigerator |
| CN106165556A (en) * | 2014-04-11 | 2016-11-23 | 慧与发展有限责任合伙企业 | Liquid coolant is supplied |
| CN109491463A (en) * | 2018-11-01 | 2019-03-19 | 合肥享淘科技有限公司 | A kind of novel computer device for fixing hard disk |
| CN111725655A (en) * | 2019-03-22 | 2020-09-29 | 泰连公司 | Terminal heat exchanger for electric connector |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2000052401A1 (en) * | 1999-02-26 | 2000-09-08 | Nippon Thermostat Co., Ltd. | Cooling device of electronic device |
| WO2000075763A1 (en) * | 1999-06-02 | 2000-12-14 | Guangji Dong | A computer heat-radiation system |
| JP2002189535A (en) | 2000-12-20 | 2002-07-05 | Hitachi Ltd | Liquid cooling system and personal computer using the same |
| TWI234063B (en) | 2002-05-15 | 2005-06-11 | Matsushita Electric Ind Co Ltd | Cooling apparatus for electronic equipment |
| JP3757200B2 (en) | 2002-09-25 | 2006-03-22 | 株式会社日立製作所 | Electronic equipment with cooling mechanism |
| KR100498276B1 (en) * | 2002-11-19 | 2005-06-29 | 월드이노텍(주) | Cooling Device |
| JP4126046B2 (en) | 2003-03-12 | 2008-07-30 | 富士通株式会社 | Electronic equipment cooling structure |
| JP2005158101A (en) | 2003-11-21 | 2005-06-16 | Hitachi Ltd | Disk array apparatus |
| JP4272503B2 (en) | 2003-12-17 | 2009-06-03 | 株式会社日立製作所 | Liquid cooling system |
| JP2006057920A (en) | 2004-08-20 | 2006-03-02 | Hitachi Ltd | Liquid cooling system for electronic equipment, and electronic equipment using it |
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| JP4637734B2 (en) | 2005-11-30 | 2011-02-23 | 富士通株式会社 | Electronic device cooling device |
| US20070153414A1 (en) * | 2005-12-30 | 2007-07-05 | Michael Sullivan | External cover for controlling the temperature of an internal thermal zone of a hard disk drive |
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| JP2015082950A (en) * | 2013-10-24 | 2015-04-27 | トヨタ自動車株式会社 | Cooling unit and power converter |
| CN115951768A (en) * | 2023-02-21 | 2023-04-11 | 西安翎飞鸾信息科技有限公司 | Computer water-cooling heat abstractor |
-
1997
- 1997-12-30 TW TW86119975A patent/TW422946B/en active
- 1997-12-31 CN CN97107266A patent/CN1193762A/en active Pending
-
1998
- 1998-01-05 JP JP10000293A patent/JPH10213370A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1658744B (en) * | 2004-02-16 | 2010-07-21 | 株式会社日立制作所 | Liquid cooling system and an electronic apparatus |
| CN101115373B (en) * | 2006-07-25 | 2010-08-11 | 富士通株式会社 | Electronic apparatus including liquid cooling unit |
| CN101471308B (en) * | 2007-12-26 | 2011-03-23 | 中强光电股份有限公司 | Radiating module |
| CN102089726A (en) * | 2008-04-17 | 2011-06-08 | 泰拉丁公司 | Temperature control within storage device testing systems |
| CN102089726B (en) * | 2008-04-17 | 2014-05-21 | 泰拉丁公司 | Temperature control within storage device testing systems |
| CN106165556A (en) * | 2014-04-11 | 2016-11-23 | 慧与发展有限责任合伙企业 | Liquid coolant is supplied |
| CN105698460A (en) * | 2014-11-28 | 2016-06-22 | 青岛海尔智能技术研发有限公司 | Refrigerator and cooling capacity compensation method applied to refrigerator |
| CN105698460B (en) * | 2014-11-28 | 2019-11-05 | 青岛海尔智能技术研发有限公司 | Refrigerator and cooling capacity compensation method applied to refrigerator |
| CN109491463A (en) * | 2018-11-01 | 2019-03-19 | 合肥享淘科技有限公司 | A kind of novel computer device for fixing hard disk |
| CN111725655A (en) * | 2019-03-22 | 2020-09-29 | 泰连公司 | Terminal heat exchanger for electric connector |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10213370A (en) | 1998-08-11 |
| TW422946B (en) | 2001-02-21 |
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