CN118248647A - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN118248647A CN118248647A CN202211666782.3A CN202211666782A CN118248647A CN 118248647 A CN118248647 A CN 118248647A CN 202211666782 A CN202211666782 A CN 202211666782A CN 118248647 A CN118248647 A CN 118248647A
- Authority
- CN
- China
- Prior art keywords
- mounting hole
- pressing block
- radiator
- heat sink
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003825 pressing Methods 0.000 claims abstract description 63
- 230000000149 penetrating effect Effects 0.000 claims abstract description 11
- 238000009434 installation Methods 0.000 claims description 21
- 238000004806 packaging method and process Methods 0.000 abstract description 35
- 238000012360 testing method Methods 0.000 description 12
- 230000032683 aging Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000004484 Briquette Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002431 foraging effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a radiator, which comprises a radiator body and a pressing block, wherein a pressing block mounting area is arranged on the surface of the radiator body, and a first mounting hole penetrating through the radiator body is formed in the pressing block mounting area; the back of briquetting is equipped with the device indent, and the top of device indent is provided with the second mounting hole that runs through the briquetting, and wherein, the position of second mounting hole and first mounting hole corresponds. In the radiator disclosed by the invention, the first mounting hole is matched with the second mounting hole to fixedly mount the pressing block on the radiator body, so that the packaging device without the mounting hole is pressed and mounted on the radiator body through the device pressing groove, and the radiator has the advantages of simplicity and convenience in mounting and high universality. In addition, the area of the pressing block is larger than that of the packaging device without the mounting hole to be tested, so that the surface stress of the packaging device to be tested is uniform, and the packaging device to be tested cannot be damaged.
Description
Technical Field
The invention belongs to the field of integrated circuit manufacturing, and relates to a radiator.
Background
Burn-in testing of packaged devices is an essential element in the manufacture of integrated circuits. For the packaging device with the mounting holes, bolts and nuts are often adopted to mount the packaging device on a radiator through the mounting holes, and then the packaging device is inserted on an aging board for aging test. However, some packaging devices have no mounting holes, the conventional radiator is not applicable any more, and the existing method for performing aging test on the packaging devices without mounting holes is mainly two, the first method is to design a clip on the basis of the original radiator, and mount the packaging devices on the radiator through the clip, but the clip design needs to consider proper clamping force to ensure no damage to the packaging devices, but after multiple use, the clip becomes loose and needs to be replaced again, and the packaging devices are easy to fall off in the operation process, so that the stability and safety are not guaranteed; the second method is to customize a special examination aging board which is directly provided with a large-size radiator, and fix the packaging device on the large-size radiator by using heat conduction silica gel and high-temperature resistant adhesive tape, but the aging board with the large-size radiator is heavy and needs to be fixed by using the high-temperature adhesive tape, so that the examination aging board is not suitable for batch examination.
Therefore, how to provide a heat sink that can be applied to a package device without a mounting hole, does not damage the package device, and improves versatility is a technical problem to be solved by those skilled in the art.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a heat sink, which is used for solving the problems of the prior art that the heat sink is vulnerable to damage to the package device, unsuitable for batch inspection, and poor versatility when performing the burn-in test of the package device without mounting holes.
To achieve the above and other related objects, the present invention provides a heat sink comprising:
the radiator comprises a radiator body, wherein the radiator body comprises a front surface and a back surface which are oppositely arranged, the front surface of the radiator body is provided with a pressing block installation area, and the pressing block installation area is provided with a first installation hole penetrating through the radiator body;
The device pressing groove is formed in the back face of the pressing block, a second mounting hole penetrating through the pressing block is formed in the upper portion of the device pressing groove, and the second mounting hole corresponds to the first mounting hole in position.
Optionally, the back of the radiator body is provided with a clamping piece installation area, the radiator further comprises a clamping piece, a third installation hole penetrating through the clamping piece is formed in the clamping piece, and the third installation hole corresponds to the first installation hole in position.
Optionally, the third mounting hole is provided with a thread, and the radiator further includes a bolt, where the bolt penetrates through the second mounting hole and the first mounting hole and cooperates with the thread to fixedly mount the press block in the press block mounting area.
Optionally, the second mounting hole is provided with a thread, and the radiator further includes a bolt, where the bolt penetrates through the third mounting hole and the first mounting hole to cooperate with the thread to fixedly mount the press block in the press block mounting area.
Optionally, the radiator body is provided with a plurality of cooling fins, and a plurality of the cooling fins are distributed radially, wherein the cooling fins avoid the briquetting installation area and the clamping piece installation area.
Optionally, in a horizontal direction, the length of the clip does not exceed the length of the briquette; in the vertical direction, the length of the clamping piece does not exceed the length of the pressing block.
Optionally, the heat sink further includes a bolt and a nut, and the bolt penetrates through the second mounting hole and the first mounting hole to cooperate with the nut to fixedly mount the press block to the press block mounting area.
Optionally, a void-avoiding groove is arranged below the briquetting installation area, and the void-avoiding groove penetrates through the radiator body.
Optionally, the number of the first mounting holes is one or more, and the number of the second mounting holes is one or more.
Optionally, a thermally conductive gasket is further included, the thermally conductive gasket being located between the device indent and the heat sink body.
As described above, in the radiator provided by the invention, the radiator body is provided with the first mounting hole, the pressing block is provided with the second mounting hole, the back surface of the pressing block is provided with the device pressing groove, the first mounting hole is matched with the second mounting hole to fixedly mount the pressing block on the radiator body, and then the packaging device without the mounting hole is pressed and mounted on the radiator body through the device pressing groove, so that the radiator has the advantages of simplicity and convenience in mounting and high universality. In addition, the area of the pressing block is larger than the area of the packaging device without the mounting hole to be tested, so that the surface stress of the packaging device to be tested is uniform, and the packaging device to be tested cannot be damaged.
Drawings
Fig. 1 is a schematic view showing a structure of a package device with a mounting hole.
Fig. 2 is a schematic diagram showing a structure of a packaged device with a mounting hole for burn-in test.
Fig. 3 is a schematic structural view of a package device without mounting holes.
Fig. 4 is a schematic perspective view of a radiator body according to a first embodiment of the invention.
Fig. 5 is a front view of a radiator body according to a first embodiment of the invention.
Fig. 6 is a schematic view showing a back surface structure of a compact according to a first embodiment of the present invention.
Fig. 7 is a top view of a radiator body according to a first embodiment of the invention.
Fig. 8 is a schematic structural view of a clip according to a first embodiment of the present invention.
Fig. 9 is a cross-sectional view showing a package structure without mounting holes mounted on a heat sink according to a first embodiment of the present invention.
Fig. 10 is a schematic structural diagram of a package device without a mounting hole for burn-in test according to the first embodiment of the present invention.
Description of element reference numerals
01. Package device with mounting hole
011. Mounting hole
012. Pin
02. Radiator
03. Burn-in board
031. Socket for burn-in board
1. Radiator body
101. Briquetting mounting area
102. First mounting hole
103. Empty-avoiding groove
104. Clip mounting area
105. Heat sink
2. Briquetting machine
201. Device indent
202. Second mounting hole
3. Clamping piece
301. Third mounting hole
4. Heat conduction gasket
5. Package device without mounting hole
501. Pin
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
Please refer to fig. 1 to 10. It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.
As shown in fig. 1, which is a schematic view of a packaged device 01 with mounting holes, the package region of the device is provided with mounting holes 011 and the device is provided with pins 012 protruding from the package region. Fig. 2 is a schematic diagram showing a structure of a packaged device 01 with a mounting hole for burn-in test, wherein the packaged device 01 with a mounting hole is mounted on a heat sink 02 by screws and nuts through mounting holes 011, and pins 011 are inserted into burn-in board sockets 031 on a burn-in board 03 for burn-in test. The package devices such as TO247, TO220 and TO3P have mounting holes themselves, which can be adapted TO conventional heat sinks, but for some package devices such as TO247 Plus, the package device has no mounting holes, as shown in fig. 3, which shows a schematic structure of the package device 5 without mounting holes, the package area of the device has no mounting holes, and the device is provided with pins 501 protruding from the package area. As described in the background art, the conventional radiator is not suitable for the aging test by adopting the design clip or the aging board with the large-size radiator, and the problems of easy damage to packaging devices, inapplicability to batch examination, poor universality and the like exist. Therefore, an object of the present invention is to provide a heat sink which can be applied to burn-in test of a package device without a mounting hole, and which improves versatility.
The embodiment provides a radiator, which comprises a radiator body and a pressing block, wherein the pressing block is used for pressing and installing a mounting hole-free packaging structure on the radiator body.
Specifically, referring to fig. 4 and 5, which are respectively a schematic perspective view of the radiator body 1 and a front view of the radiator body 1, in this embodiment, the radiator body 1 includes a front surface and a back surface that are disposed opposite to each other, the front surface of the radiator body 1 has a press block mounting area 101, and the press block mounting area 101 is provided with a first mounting hole 102 penetrating through the radiator body 1.
Specifically, referring to fig. 6, a schematic diagram of a back structure of the pressing block 2 is shown, in this embodiment, the pressing block 2 includes a front surface and a back surface that are oppositely disposed, a device pressing groove 201 is disposed on the back surface of the pressing block 2, a second mounting hole 202 penetrating through the pressing block 2 is disposed above the device pressing groove 201, and the second mounting hole 202 corresponds to the first mounting hole 201.
As an example, the device pressing groove 201 is used for press-fitting a package device without a mounting hole to the heat sink body 1 (see subsequent fig. 9).
As an example, a clearance groove 103 is provided below the press block mounting area 101 of the radiator body 1, the clearance groove 103 penetrates through the radiator body 1, and the clearance groove 103 is used for avoiding the burn-in board socket 031, so as to improve the mounting stability (see subsequent fig. 10).
As an example, referring to fig. 7, which is a top view of the heat sink body 1, in this embodiment, a clip mounting area 104 is provided on the back surface of the heat sink body 1.
As an example, referring to fig. 8, a schematic structural diagram of the clip 3 is shown, in this embodiment, a third mounting hole 301 penetrating through the clip 3 is provided in the clip 3, and the third mounting hole 301 corresponds to the position of the first mounting hole 102.
As an example, the heat sink body 1 is provided with a plurality of heat dissipating fins 105, and the plurality of heat dissipating fins 105 are radially distributed, wherein the heat dissipating fins 105 avoid the compact mounting area 101, the void-avoiding groove 103, and the clip mounting area 104.
As an example, the third mounting hole 301 is provided with a screw thread, and the heat sink further includes a bolt penetrating through the second mounting hole 202 and the first mounting hole 102 and cooperating with the screw thread to fixedly mount the compact 2 to the compact mounting area 101. Referring to fig. 9, a schematic cross-sectional structure of a mounting hole-free packaging device 5 mounted on a heat sink is shown, a device pressing groove 201 of a pressing block 2 is used for pressing the mounting hole-free packaging device 5 onto the heat sink body 1, a heat conducting spacer 4 is arranged between the heat sink body 1 and the mounting hole-free packaging device 5, the back of the heat sink body 1 is provided with a clamping piece 3, and when the mounting hole-free packaging device is mounted, the bolt extends into the pressing block 2 and the heat sink body 1 to be connected with the clamping piece 3, so that the mounting hole-free packaging device 5 is fixed.
Similarly, threads are provided in the first mounting hole 102, and bolts extend into the clip 3 and the heat sink body 1 to be connected to the press block 2, functioning to fix the mounting hole-free package device 5.
As an example, one or more of the first mounting hole 102, the second mounting hole 202, and the third mounting hole 301 may be provided according to actual requirements. Specifically, in this embodiment, the number of the first mounting holes 102, the second mounting holes 202 and the third mounting holes 301 is two, and two bolts are used, where one bolt is installed from the direction of the pressing block 2 pointing to the radiator body 1, and the other bolt is installed from the direction of the clamping piece 3 pointing to the radiator body 1, and the pressing block 2 is fastened from two directions, so that the pressing block 2 is uniformly stressed on the mounting hole-free packaging device 5.
By way of example, the thermally conductive pad 4 comprises a silicone pad to provide more uniform heat transfer of the packaged device at high temperatures.
As an example, the area of the pressing block 2 is larger than that of the mounting hole-free packaging device 5, and the mounting hole-free packaging device 5 is pressed and mounted on the radiator body 1 through the pressing block 2 and the clamping piece 3, so that the pressing block is uniformly stressed, and the mounting hole-free packaging device 5 cannot be cracked and damaged due to the fact that the bolts are fixed during mounting.
As an example, the length of the clip 3 does not exceed the length of the briquette 2 in the horizontal direction; in the vertical direction, the length of the clamping piece 3 does not exceed the length of the pressing block 2; specifically, in the present embodiment, the lengths of the clips 3 are smaller than the length of the press block 2 in both the horizontal direction and the vertical direction, so that on one hand, more heat dissipation fins 105 can be provided on the back surface of the heat sink body 1, and heat dissipation capability is improved; on the other hand, the material can be saved.
It should be noted that, in this embodiment, for convenience of operation, bolts are used to cooperate with the clamping pieces 3 to fix the pressing blocks 2; in other examples, bolts may be used to penetrate through the first mounting holes 102 and the second mounting holes 202 and then cooperate with nuts to fixedly mount the pressing block 2 on the heat sink body 1, so that the mounting hole-free packaging device 5 is press-mounted on the heat sink body 1, and the clip 3 is not required at this time, which falls into the scope of the protection of the present invention.
As an example, as shown in fig. 10, a schematic structural diagram when the burn-in test is performed on the package device 5 without the mounting hole is shown. In the process of inserting the pins 501 of the package device 5 without mounting holes into the burn-in board sockets 031, since the heat sink body 1 is provided with the void-avoiding groove 103, the void-avoiding groove 103 can avoid the burn-in board sockets 031, so that the heat sink body 1 can fall onto the burn-in board 03, compared with the state in which the heat sink 02 is suspended in fig. 2, the heat sink body 1 of the present embodiment falls onto the burn-in board 03, thereby increasing the mounting stability.
It should be noted that, through checking and verification, the heat radiator provided by the embodiment has obvious aging test effect on the mounting hole-free packaging device, is applicable to all direct-insert mounting hole-free packaging devices, is applicable to conventional aging boards, and does not need to customize a special checking aging board.
In summary, in the radiator provided by the invention, the radiator body is provided with the first mounting hole, the pressing block is provided with the second mounting hole, the back surface of the pressing block is provided with the device pressing groove, the first mounting hole is matched with the second mounting hole to fixedly mount the pressing block on the radiator body, and then the packaging device without the mounting hole is pressed and mounted on the radiator body through the device pressing groove, so that the radiator has the advantages of simplicity and convenience in mounting and high universality. In addition, the area of the pressing block is larger than the area of the packaging device without the mounting hole to be tested, so that the surface stress of the packaging device to be tested is uniform, and the packaging device to be tested cannot be damaged. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (10)
1. A heat sink, comprising:
the radiator comprises a radiator body, wherein the radiator body comprises a front surface and a back surface which are oppositely arranged, the front surface of the radiator body is provided with a pressing block installation area, and the pressing block installation area is provided with a first installation hole penetrating through the radiator body;
The device pressing groove is formed in the back face of the pressing block, a second mounting hole penetrating through the pressing block is formed in the upper portion of the device pressing groove, and the second mounting hole corresponds to the first mounting hole in position.
2. The heat sink as recited in claim 1, wherein: the back of the radiator body is provided with a clamping piece installation area, the radiator further comprises a clamping piece, a third installation hole penetrating through the clamping piece is formed in the clamping piece, and the third installation hole corresponds to the first installation hole in position.
3. The heat sink according to claim 2, wherein: the third mounting hole is internally provided with threads, the radiator further comprises a bolt, and the bolt penetrates through the second mounting hole and the first mounting hole to be matched with the threads so as to fixedly mount the pressing block in the pressing block mounting area.
4. The heat sink according to claim 2, wherein: the second mounting hole is internally provided with threads, the radiator further comprises a bolt, and the bolt penetrates through the third mounting hole and the first mounting hole to be matched with the threads so as to fixedly mount the pressing block in the pressing block mounting area.
5. The heat sink according to claim 2, wherein: the radiator body is provided with a plurality of radiating fins, and a plurality of radiating fins are distributed in a radial mode, wherein the radiating fins avoid the press block installation area and the clamping piece installation area.
6. The heat sink according to claim 2, wherein: in the horizontal direction, the length of the clamping piece does not exceed the length of the pressing block; in the vertical direction, the length of the clamping piece does not exceed the length of the pressing block.
7. The heat sink as recited in claim 1, wherein: the radiator further comprises a bolt and a nut, wherein the bolt penetrates through the second mounting hole and the first mounting hole to be matched with the nut so as to fasten and install the pressing block in the pressing block installation area.
8. The heat sink as recited in claim 1, wherein: and an empty avoiding groove is formed below the briquetting installation area and penetrates through the radiator body.
9. The heat sink as recited in claim 1, wherein: the number of the first mounting holes is one or more, and the number of the second mounting holes is one or more.
10. The heat sink as recited in claim 1, wherein: the heat-conducting gasket is positioned between the device pressing groove and the radiator body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211666782.3A CN118248647A (en) | 2022-12-23 | 2022-12-23 | Radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211666782.3A CN118248647A (en) | 2022-12-23 | 2022-12-23 | Radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118248647A true CN118248647A (en) | 2024-06-25 |
Family
ID=91563089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211666782.3A Pending CN118248647A (en) | 2022-12-23 | 2022-12-23 | Radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118248647A (en) |
-
2022
- 2022-12-23 CN CN202211666782.3A patent/CN118248647A/en active Pending
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination |