CN118248607A - Wafer carrying device - Google Patents

Abstract

The application provides a wafer carrying device which comprises a base, a telescopic arm rotatably arranged on the base, and a first clamping jaw and a second clamping jaw rotatably arranged at the tail end of the telescopic arm, wherein the first clamping jaw and the second clamping jaw are arranged on the base in a rotating manner; the first clamping jaw and the second clamping jaw are rotatably arranged at the tail end of the telescopic arm through the first transmission assembly, so that the first clamping jaw and the second clamping jaw have the same rotation shaft and can rotate independently; a first driving component and a second driving component which are connected with the first transmission component are arranged in the telescopic arm; the first driving component is used for independently driving the first clamping jaw to rotate, and the second driving component is used for independently driving the second clamping jaw to rotate. The application can realize a large-scale moving and carrying function, and the tail end of the telescopic arm is provided with the first clamping jaw and the second clamping jaw which can rotate independently, so that the wafer carrying device carries two wafers, and meanwhile, wafers at different stations can be flexibly taken and put, and the flexibility of the wafer carrying device is improved.

Description

Wafer carrying device

Technical Field

The application relates to the technical field of wafer carrying, in particular to a wafer carrying device.

Background

In the prior art, a wafer conveying device generally adopts a lifting type or negative pressure type suction type to take a wafer, namely, a semiconductor wafer is adsorbed on quartz or ceramic fingers by utilizing a suction cup principle, and the semiconductor wafer is conveyed through the actions of stretching, rotating, lifting and the like of a mechanical arm, so that the wafer is conveniently taken, and the working efficiency is improved.

Further, the existing wafer transmission device controls the traveling of the wafer transmission device and the actions of stretching, rotating, lifting and the like of the mechanical arm to carry the wafer through the double EEF control centers, so that the transmission time is saved, and the working efficiency is improved.

However, the control of the dual EEFs has the problem that the wire harness setting position is unreasonable for the solid line trend of the wafer transmission device, so that the early assembly difficulty is increased, the performance requirements on parts are increased, the later wire harness wear is faster, the maintenance times are increased, and the production efficiency is reduced. For solving this technical problem, patent application number CN202111601403.8 discloses a handling device, including the base that rotates in proper order and connect, lower arm and upper arm, rotate on the upper arm and set up actuating mechanism, actuating mechanism's drive module is inside to set up the pencil, avoided the reciprocating motion of pencil, reduce the wearing and tearing of device to the pencil at the in-process of handling wafer, the pencil can extend to the inner space of lower wrist and last wrist respectively simultaneously, and connect the electronic components of end effector and last end effector respectively through the pencil, the structure is simplified by a wide margin, assembly degree of difficulty and assembly time have been reduced. However, the wafer apparatus provided by this method can only provide the relative rotation angle of ±168.5° for the upper and lower wrists, which cannot meet the wafer handling requirements required by the increasingly complex semiconductor process.

To solve the above-mentioned problem, patent application CN202310491328.7 in the prior art discloses a large-angle movement end effector, comprising: a first end effector and a second end effector; the first transmission assembly comprises a first hollow rotating shaft, the second transmission assembly comprises a second hollow rotating shaft, the second hollow rotating shaft is sleeved on the first hollow rotating shaft, and the first end effector and the second end effector are respectively connected with the first hollow rotating shaft and the second hollow rotating shaft; the first limiting structure comprises a first arc limiting groove and a second arc limiting groove which are formed in the first end effector and the second end effector, and movable pins of which the two ends are movably arranged in the first arc limiting groove and the second arc limiting groove respectively. The problem that an end actuating mechanism in the prior art cannot provide a large-angle actuating wrist rotation function required by increasingly complex semiconductor manufacturing process, so that production efficiency is affected is solved.

However, the wafer device in the above manner slides in the first arc-shaped limit groove and the second arc-shaped limit groove respectively by controlling the movable pin so as to realize the relative rotation between the first end effector and the second end effector, so that the wafer device cannot be freely controlled for one end effector, the use condition of a scene is limited, and the wafer device is unfavorable for taking wafers at any positions.

Disclosure of Invention

The application aims to solve the problem that the wafer carrying device in the prior art is difficult to ensure the flexibility of the wafer carrying process while enhancing the wafer carrying efficiency. Therefore, the application provides a wafer carrying device, which comprises the telescopic arm rotatably arranged on the base, so that a large-scale moving and carrying function can be realized, and the tail end of the telescopic arm is provided with the first clamping jaw and the second clamping jaw which can be independently rotated, so that one telescopic arm of the wafer carrying device can simultaneously carry two wafers through the first clamping jaw and the second clamping jaw, and the first clamping jaw and the second clamping jaw can be independently rotated without mutual influence, thereby flexibly picking and placing wafers at different stations and improving the flexibility of the wafer carrying device.

The embodiment of the application provides a wafer carrying device, which comprises a base, a telescopic arm rotatably arranged on the base, and a first clamping jaw and a second clamping jaw rotatably arranged at the tail end of the telescopic arm, wherein the first clamping jaw is provided with a first clamping jaw and a second clamping jaw;

the first clamping jaw and the second clamping jaw are rotatably arranged at the tail end of the telescopic arm through a first transmission assembly, so that the first clamping jaw and the second clamping jaw have the same rotation shaft and can rotate independently;

a first driving component and a second driving component which are connected with the first transmission component are arranged in the telescopic arm;

The first driving assembly is used for independently driving the first clamping jaw to rotate, and the second driving assembly is used for independently driving the second clamping jaw to rotate.

By adopting the technical scheme, the first clamping jaw and the second clamping jaw can be driven to move and carry in a large range by rotating the telescopic arm, and the first clamping jaw and the second clamping jaw which are arranged on the telescopic arm can be independently rotated to take and place wafers at two different stations in one movement, so that the carrying efficiency and the flexibility of the wafer carrying device are greatly improved.

In some embodiments, the telescoping arm comprises a first rotating arm and a second rotating arm;

one end of the first rotating arm is rotatably arranged on the base, and the other end of the first rotating arm is rotatably connected with one end of the second rotating arm through a second transmission assembly;

The first clamping jaw and the second clamping jaw are arranged at the other end of the second rotating arm;

the first driving assembly and the second driving assembly are both arranged in the second rotating arm.

By adopting the technical scheme, the telescopic boom is arranged into the first rotating arm and the second rotating arm which are rotationally connected, so that on one hand, the stability and the reliability of the telescopic boom in the rotating and telescopic process can be ensured, and on the other hand, the second rotating arm is internally provided with enough space for placing the first driving assembly and the second driving assembly so as to independently drive the rotation of the first clamping jaw and the second clamping jaw.

In some embodiments, the first driving assembly further comprises a first driving member and a first speed reducing mechanism which are in transmission connection, wherein the first driving member is in transmission connection with the first transmission assembly through the first speed reducing mechanism;

the second driving component further comprises a second driving piece and a second speed reducing mechanism which are in transmission connection, and the second driving piece is in transmission connection with the first transmission component through the second speed reducing mechanism.

By adopting the technical scheme, the first driving assembly and the second driving assembly both comprise the speed reducing mechanism, on one hand, the torque of the driving piece and the rotating precision of the first clamping jaw and the second clamping jaw can be controlled through the speed reducing mechanism, and the stability of grabbing wafers by the first clamping jaw and the second clamping jaw and the carrying load are ensured; on the other hand, the power requirement of the driving piece can be reduced, so that the size and the weight of the driving piece are reduced, the integration level of the second rotating arm is improved, the second rotating arm is prevented from being overweight or overlarge, the normal rotation of the telescopic arm is prevented from being influenced, and the torque applied to the base when the telescopic arm stretches is reduced.

In some embodiments, the first driving element and the second driving element are arranged at one end of the second rotating arm, which is close to the first rotating arm, in parallel; the output shaft of the first driving piece and the output shaft of the second driving piece are vertically staggered;

the first speed reducing mechanism is arranged on the upper wall of the second rotating arm, the second speed reducing mechanism is arranged on the lower wall of the second rotating arm, and the first speed reducing mechanism and the second speed reducing mechanism are staggered.

By adopting the technical scheme, the first driving piece and the second driving piece with larger weight can be closer to the base when the telescopic arm stretches, so that the torque applied to the base when the telescopic arm stretches is reduced; meanwhile, the first speed reducing mechanism and the second speed reducing mechanism are staggered, the output shaft of the first driving piece and the output shaft of the second driving piece are vertically staggered, so that mutual interference between the first driving assembly and the second driving assembly can be avoided, meanwhile, the space inside the second rotating arm is fully utilized, and the integration level of the second rotating arm is improved.

In some embodiments, the first driving piece is fixedly arranged on the lower wall of the second rotating arm, and the output shaft of the first driving piece is in rotary abutting connection with the upper wall of the second rotating arm;

the second driving piece is fixedly arranged on the upper wall of the second rotating arm, and an output shaft of the second driving piece is rotatably abutted to the lower wall of the second rotating arm.

By adopting the technical scheme, the upper arm and the lower wall of the second rotating arm can play a role in limiting and fixing the first driving piece and the second driving piece, and the stability of the first driving piece and the second driving piece in the working process can be improved.

In some embodiments, the first driving piece and the first speed reducing mechanism are driven by a driving belt, the first speed reducing mechanism and the first driving assembly are driven by the driving belt, and the driving belt between the first speed reducing mechanism and the first driving assembly is also provided with a tensioning mechanism;

The second driving piece is connected with the second speed reducing mechanism, and the second speed reducing mechanism is connected with the first transmission assembly through a transmission belt.

In some embodiments, the first transmission assembly comprises a first transmission shaft and a second transmission shaft which are sleeved with each other, and the first transmission shaft and the second transmission shaft are in running fit;

one end of the first transmission shaft is fixedly connected with the first clamping jaw, and the other end of the first transmission shaft is in transmission connection with the first driving assembly;

one end of the second transmission shaft is fixedly connected with the second clamping jaw, and the other end of the second transmission shaft is in transmission connection with the second driving assembly.

In some embodiments, a first routing channel penetrating along the axis of the first transmission shaft is arranged inside the first transmission shaft;

A second wiring channel for connecting the second clamping jaw and the telescopic arm is arranged between the first transmission shaft and the second transmission shaft.

By adopting the technical scheme, the solid wire in the first clamping jaw can be connected to the inside of the telescopic arm through the first wiring channel, and the solid wire in the second clamping jaw can be connected to the inside of the telescopic arm through the second wiring channel; avoiding the exposure of the physical wires, and easily polluting the working environment of the wafer handling device. Further, the solid line in the first clamping jaw and the solid line in the second clamping jaw adopt different wiring channels, so that mutual interference between the solid line in the first clamping jaw and the solid line in the second clamping jaw in an independent rotation process can be avoided, and stability and reliability in the independent rotation process of the first clamping jaw and the second clamping jaw are ensured.

In some embodiments, a guiding and limiting member is disposed in the second routing channel to limit the movement of the physical wire in the second routing channel according to a preset path.

In some embodiments, the telescopic arm further comprises a rotating column fixedly connected with the first rotating arm, and the first rotating arm is rotatably arranged on the base through the rotating column;

the rotary column is connected with a driving assembly; the driving component can drive the rotary column to rotate and can drive the rotary column to move along the axial direction of the rotary column.

By adopting the technical scheme, the rotary column can stably drive the telescopic arm to rotate, and can also drive the telescopic arm to move along the axis direction of the rotary column, so that the movable range of the telescopic arm is greatly improved, and the flexibility and applicability of the wafer carrying device are improved.

In some embodiments, a containing cavity is formed inside the rotating column, a third driving piece is arranged in the containing cavity, and an output shaft of the third driving piece extends to the inside of the first rotating arm and is in transmission connection with the second transmission component through a transmission piece;

The third driving piece drives the second rotating arm to rotate relative to the first rotating arm through the second transmission assembly.

Additional features and corresponding advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention.

Drawings

Fig. 1 is a schematic structural diagram of a wafer handling apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic view of a wafer handling apparatus according to another embodiment of the present invention;

FIG. 3 is a side view illustrating the structure of the second rotating arm of the wafer handling apparatus according to the embodiment of the present invention;

FIG. 4 is a top view illustrating the structure of the second rotating arm of the wafer handling apparatus according to the embodiment of the present invention;

Fig. 5 is a schematic structural diagram of a first rotating arm of a wafer handling device according to an embodiment of the present invention connected to a second rotating arm through a second driving assembly;

Fig. 6 is a schematic structural diagram of a base of a wafer handling device according to an embodiment of the present invention connected to a first rotating arm through a rotating column;

Reference numerals illustrate:

1. A base;

2. a telescoping arm;

21. a first rotating arm;

22. A second rotating arm;

23. a spin column; 231. a third driving member;

24. a first drive assembly; 241. a first driving member; 242. a first speed reducer;

25. A second drive assembly; 251. a second driving member; 252. a second speed reducer;

3. A first jaw;

4. A second jaw;

5. A first transmission assembly;

51. A first drive shaft; 52. a second drive shaft; 53. a first routing channel; 54. a second wiring channel;

6. and a second transmission assembly.

Detailed Description

Further advantages and effects of the present invention will become apparent to those skilled in the art from the disclosure of the present specification, by describing the embodiments of the present invention with specific examples. While the description of the invention will be described in connection with the preferred embodiments, it is not intended to limit the inventive features to the implementation. Rather, the purpose of the invention described in connection with the embodiments is to cover other alternatives or modifications, which may be extended by the claims based on the invention. The following description contains many specific details for the purpose of providing a thorough understanding of the present invention. The invention may be practiced without these specific details. Furthermore, some specific details are omitted from the description in order to avoid obscuring the invention. It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other.

It should be noted that in this specification, like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

In the description of the present application, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may include one or more of the feature, either explicitly or implicitly. In the description of the application, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

As shown in fig. 1 to 6, the present application provides a wafer handling apparatus, which comprises a base 1, a telescopic arm 2 rotatably disposed on the base 1

The first clamping jaw 3 and the second clamping jaw 4 are rotatably arranged at the tail end of the telescopic arm 2; the first clamping jaw 3 and the second clamping jaw 4 are rotatably arranged at the tail end of the telescopic arm 2 through a first transmission assembly 5, so that the first clamping jaw 3 and the second clamping jaw 4 have the same rotation shaft and can rotate independently; a first driving component 24 and a second driving component 25 which are connected with the first transmission component 5 are arranged in the telescopic arm 2; the first driving component 24 is used for independently driving the first clamping jaw 3 to rotate, and the second driving component 25 is used for independently driving the second clamping jaw 4 to rotate.

Wherein, rotate and set up in flexible arm 2 can drive first clamping jaw 3 and second clamping jaw 4 and carry out removal and the transport on a large scale, the independent rotation sets up in flexible arm 2's first clamping jaw 3 and second clamping jaw 4 can realize getting the wafer of two different stations and put in moving once, need guarantee that wafer handling device can promote wafer handling device's conveying efficiency and flexibility.

In one embodiment, the telescopic arm 2 comprises a first rotary arm 21 and a second rotary arm 22; one end of the first rotating arm 21 is rotatably arranged on the base 1, and the other end of the first rotating arm 21 is rotatably connected with one end of the second rotating arm 22 through the second transmission assembly 6; and the first clamping jaw 3 and the second clamping jaw 4 are arranged at the other end of the second rotating arm 22; the first driving assembly 24 and the second driving assembly 25 are both disposed inside the second rotating arm 22.

As will be appreciated by those skilled in the art, the telescopic arm 2 is configured as a first rotary arm 21 and a second rotary arm 22 which are rotatably connected, so that on one hand, stability and reliability of the telescopic arm 2 during rotation and telescopic operation can be ensured, and on the other hand, the second rotary arm 22 has enough space inside to place the first driving assembly 24 and the second driving assembly 25, so that rotation of the first clamping jaw 3 and the second clamping jaw 4 can be ensured to be independently driven.

In other alternative embodiments, the telescopic arm 2 may also adopt a first telescopic arm and a second telescopic arm which are sleeved and slidable, and the telescopic function of the telescopic arm 2 is realized through sliding fit between the first telescopic arm and the second telescopic arm.

In one embodiment, the first driving assembly 24 further comprises a first driving member 241 and a first reduction mechanism 242 in driving connection, the first driving member 241 being in driving connection with the first transmission assembly 5 via the first reduction mechanism 242;

The second driving assembly 25 further comprises a second driving member 251 and a second speed reducing mechanism 252 which are in transmission connection, and the second driving member 251 is in transmission connection with the first transmission assembly 5 through the second speed reducing mechanism 252.

On one hand, the speed reducing mechanism can increase the torque of the driving piece and control the rotation precision of the first clamping jaw 3 and the second clamping jaw 4, so that the stability of grabbing wafers by the first clamping jaw 3 and the second clamping jaw 4 and the carrying load are ensured; on the other hand, the power requirement of the driving element can be reduced, so as to reduce the volume and weight of the driving element, improve the integration level of the second rotating arm 22, avoid the second rotating arm 22 from being too heavy or too large, influence the normal rotation of the telescopic arm 2, and reduce the torque applied to the base when the telescopic arm 2 stretches.

In one embodiment, the first driving piece 241 and the second driving piece 251 may employ motors with power of 30-50 w, and the reduction ratio of the first reduction mechanism 242 and the second reduction mechanism 252 may be 1.5-5.

In one embodiment, the first driving element 241 and the second driving element 251 are disposed in parallel at one end of the second rotating arm 22 near the first rotating arm 21; and the output shaft of the first driving piece 241 and the output shaft of the second driving piece 251 are vertically staggered; the first speed reducing mechanism 242 is disposed on the upper wall of the second rotating arm 22, the second speed reducing mechanism 252 is disposed on the lower wall of the second rotating arm 22, and the first speed reducing mechanism 242 and the second speed reducing mechanism 252 are disposed in a staggered manner.

As will be appreciated by those skilled in the art, the first and second drive members 241, 251, which are heavier when the telescoping arm 2 is extended, may be closer to the base 1, thereby reducing the torque applied to the base 1 when the telescoping arm 2 is extended; meanwhile, the first and second speed reducing mechanisms 242 and 252 are staggered with each other, and the output shaft of the first driving member 241 and the output shaft of the second driving member 251 are vertically staggered to ensure that interference between the first and second driving assemblies 24 and 25 is avoided.

In other alternative embodiments, the first driving member 241 and the second driving member 251 may be arranged in other manners, for example, the first driving assembly 24 and the second driving assembly 25 may be disposed in a top-bottom layer within the second rotating arm 22; it is only necessary to ensure that the output shaft of the first driving member 241 and the output shaft of the second driving member 251 are staggered and do not interfere with each other;

On the other hand, when the extension length of the telescopic arm 2 is short or the load is small, the torque applied to the base 1 by the first driving piece 241 and the second driving piece 251 is small, so that one driving piece 241 and the second driving piece 251 can be disposed at any position within the second rotating arm 22.

In one embodiment, the first driving element 241 is fixedly disposed on the lower wall of the second rotating arm 22, and the output shaft of the first driving element 241 is rotatably abutted against the upper wall of the second rotating arm 22; the second driving member 251 is fixedly disposed on an upper wall of the second rotating arm 22, and an output shaft of the second driving member 251 is rotatably abutted against a lower wall of the second rotating arm 22. The upper arm and the lower wall of the second rotating arm 22 can play a role in limiting and fixing the first driving piece 241 and the second driving piece 242, and the stability of the first driving piece 241 and the second driving piece 242 in the working process can be improved. The shaking of the second rotating arm 22 during rotation is reduced.

In one embodiment, the first driving piece 241 and the first speed reducing mechanism 242 are driven by a driving belt, the first speed reducing mechanism 242 and the first driving assembly 5 are driven by the driving belt, and the driving belt between the first speed reducing mechanism 242 and the first driving assembly 5 is also provided with a tensioning mechanism; the second driving member 251 and the second speed reducing mechanism 252, and the second speed reducing mechanism 252 and the first transmission assembly 5 are driven by a driving belt.

By adopting a transmission belt mode, the volumes of transmission parts in the first driving assembly 24 and the second driving assembly 25 can be greatly reduced, and the distance between the first driving part 241, the first speed reducing mechanism 242 and the first transmission assembly 5 can be conveniently increased, so that the first driving part 241 and the first speed reducing mechanism 242 with larger weight can be arranged at a position deviating from the first transmission assembly 5; similarly, the second driving assembly 25 has the same technical effect.

In one embodiment, the first transmission assembly 5 includes a first transmission shaft 51 and a second transmission shaft 52 sleeved with each other, and the first transmission shaft 51 and the second transmission shaft 52 are in running fit; one end of the first transmission shaft 51 is fixedly connected with the first clamping jaw 3, and the other end is in transmission connection with the first driving assembly 24; one end of the second transmission shaft 52 is fixedly connected with the second clamping jaw 4, and the other end is in transmission connection with the second driving assembly 25.

In a use scenario, the first driving assembly 24 may be in driving connection with the outer wall of the end of the first transmission shaft 51 through the first speed reducing mechanism 242, so as to drive the first transmission shaft 51 and drive the first clamping jaw 3 to rotate; meanwhile, the first transmission shaft 51 is in running fit with the second transmission shaft 52, so that the second transmission shaft 52 is prevented from being influenced when the first transmission shaft 51 rotates; thereby ensuring that the first jaw 3 can be rotated independently with respect to the second jaw 4 and the second rotating arm 22.

Similarly, the second jaw 4 may also be independently rotatable with respect to the first jaw 3 and the second rotary arm 22.

The wafer is a high-precision component, so that the wafer carrying device has very high requirement on the cleanliness of the environment in the process of carrying the wafer, and the wafer is prevented from being polluted by dust in the environment to generate bad wafers. Therefore, all the physical wires of the wafer handling device need to be wrapped inside the shell of the wafer handling device, so as to avoid environmental pollution caused by parts such as the physical wires.

Thus, in one embodiment, the first drive shaft 51 is internally provided with a first routing channel 53 that runs through along the axis of the first drive shaft 51; a second wiring channel 54 connecting the second clamping jaw 4 and the telescopic arm 2 is arranged between the first transmission shaft 51 and the second transmission shaft 52.

The physical wires (such as signal wires, power supply wires, air circuits and the like) in the first clamping jaw 3 can be connected to the inside of the telescopic arm 2 through the first wiring channel 53 and then communicated to the inside of the base through the telescopic arm 2;

The physical wires (such as signal wires, power supply wires, air circuits and the like) in the second clamping jaw 4 can be connected to the inside of the telescopic arm 2 through the second wiring channel 54 and then communicated to the inside of the base through the telescopic arm 2;

On the one hand, the exposure of the physical wires can be avoided, and the pollution to the working environment of the wafer carrying device is avoided. On the other hand, the solid line in the first clamping jaw 3 and the solid line in the second clamping jaw 4 adopt different wiring channels, so that mutual interference between the solid line in the first clamping jaw 3 and the solid line in the second clamping jaw 4 in the independent rotation process can be avoided, and the stability and reliability of the first clamping jaw 3 and the second clamping jaw 4 in the independent rotation process are ensured.

It should be noted that, the first routing channel 53 runs through along the axis of the first transmission shaft 51, and when the first transmission shaft 51 rotates, no torsion is caused to the physical wire in the first routing channel 53; and the second wiring channel 54 is located between the first transmission shaft 51 and the second transmission shaft 52; when the second transmission shaft 52 rotates, the solid wires in the second routing channel 54 are twisted, so that the positions of the solid wires are difficult to control;

Therefore, in one embodiment, a guiding and limiting member is disposed in the second routing channel 54 to limit the movement of the physical wire inside the second routing channel 54 according to a predetermined path. The predetermined path may be a path with minimum torsional deformation to the physical wire in the second routing channel 54 when the second transmission shaft 52 rotates.

In one embodiment, the telescopic arm 2 further includes a rotating column 23 fixedly connected to the first rotating arm 21, and the first rotating arm 21 is rotatably disposed on the base 1 through the rotating column 23; the rotary column 23 is connected with a driving assembly; the driving assembly can drive the rotary column 23 to rotate, and can drive the rotary column 23 to move along the axial direction. Not only can make the column spinner 23 drive flexible arm 2 steadily and rotate, can also drive flexible arm 2 and follow the axis direction motion of column spinner 23, greatly improved flexible arm 2's movable range, improved wafer handling device's flexibility and suitability.

In one embodiment, the rotating column 23 is internally formed with a receiving cavity through which the solid wire passes through the telescopic arm 2 to control the first jaw 3 and the second jaw 4. A third driving piece 231 is arranged in the accommodating cavity, and an output shaft of the third driving piece 231 extends into the first rotating arm 21 and is in transmission connection with the second transmission component 6 through a transmission piece; the third driving piece 231 drives the second rotating arm 22 to rotate relative to the first rotating arm 21 through the second transmission assembly 6.

In one embodiment, the second transmission assembly 6 has a third routing channel penetrating along the rotation axis thereof, at this time, the physical wires of the first clamping jaw 3 and the second clamping jaw 4 can enter the interior of the second rotating arm 22 through the first routing channel 53 and the second routing channel 54 of the first transmission assembly 5, and at the same time, all the physical wires inside the second rotating arm 22 (including the physical wires of the first clamping jaw 3, the physical wires of the second clamping jaw 4, the physical wires of the first driving assembly 24 and the second driving assembly 25, etc.) enter the interior of the first rotating arm 21 through the third routing channel of the second transmission assembly 6, and finally enter the interior of the base 1 from the first rotating arm 21, thereby avoiding the exposure of the physical wires.

In one embodiment, the base 1 is internally provided with a control system; the physical wires of the first drive assembly 24 and the second drive assembly 25 are connected to a control system to independently control and sense the independent rotation of the first jaw 3 and the second jaw 4 driven by the first drive assembly 24 and the second drive assembly 25. Further, the physical lines of the first clamping jaw 3 and the physical lines of the second clamping jaw 4 are connected to a control system so as to control the first clamping jaw 3 and the second clamping jaw 4 to grip the wafer.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.

Claims (10)

1. The wafer carrying device is characterized by comprising a base, a telescopic arm rotatably arranged on the base, and a first clamping jaw and a second clamping jaw rotatably arranged at the tail end of the telescopic arm;

the first clamping jaw and the second clamping jaw are rotatably arranged at the tail end of the telescopic arm through a first transmission assembly, so that the first clamping jaw and the second clamping jaw have the same rotation shaft and can rotate independently;

a first driving component and a second driving component which are connected with the first transmission component are arranged in the telescopic arm;

The first driving assembly is used for independently driving the first clamping jaw to rotate, and the second driving assembly is used for independently driving the second clamping jaw to rotate.

2. The wafer handling device of claim 1, wherein the telescoping arm comprises a first swivel arm and a second swivel arm;

one end of the first rotating arm is rotatably arranged on the base, and the other end of the first rotating arm is rotatably connected with one end of the second rotating arm through a second transmission assembly;

The first clamping jaw and the second clamping jaw are arranged at the other end of the second rotating arm;

the first driving assembly and the second driving assembly are both arranged in the second rotating arm.

3. The wafer handling device of claim 2, wherein:

the first driving component further comprises a first driving piece and a first speed reducing mechanism which are in transmission connection, and the first driving piece is in transmission connection with the first transmission component through the first speed reducing mechanism;

the second driving component further comprises a second driving piece and a second speed reducing mechanism which are in transmission connection, and the second driving piece is in transmission connection with the first transmission component through the second speed reducing mechanism.

4. The wafer handling device of claim 3, wherein said first drive member and said second drive member are juxtaposed at an end of said second rotating arm adjacent said first rotating arm; the output shaft of the first driving piece and the output shaft of the second driving piece are vertically staggered;

the first speed reducing mechanism is arranged on the upper wall of the second rotating arm, the second speed reducing mechanism is arranged on the lower wall of the second rotating arm, and the first speed reducing mechanism and the second speed reducing mechanism are staggered.

5. The wafer handling device of claim 4, wherein:

the first driving piece is fixedly arranged on the lower wall of the second rotating arm, and an output shaft of the first driving piece is rotatably abutted against the upper wall of the second rotating arm;

the second driving piece is fixedly arranged on the upper wall of the second rotating arm, and an output shaft of the second driving piece is rotatably abutted to the lower wall of the second rotating arm.

6. A wafer handling device according to claim 3, wherein:

The first driving piece and the first speed reducing mechanism are driven by a driving belt, the first speed reducing mechanism and the first driving assembly are driven by the driving belt, and a tensioning mechanism is further arranged on the driving belt between the first speed reducing mechanism and the first driving assembly;

The second driving piece is connected with the second speed reducing mechanism, and the second speed reducing mechanism is connected with the first transmission assembly through a transmission belt.

7. The wafer handling device of claim 1, wherein the first drive assembly comprises a first drive shaft and a second drive shaft nested with each other, and wherein the first drive shaft and the second drive shaft are in rotational engagement;

one end of the first transmission shaft is fixedly connected with the first clamping jaw, and the other end of the first transmission shaft is in transmission connection with the first driving assembly;

one end of the second transmission shaft is fixedly connected with the second clamping jaw, and the other end of the second transmission shaft is in transmission connection with the second driving assembly.

8. The wafer handling device of claim 7, wherein a first routing channel is provided inside the first drive shaft that runs through along an axis of the first drive shaft;

A second wiring channel for connecting the second clamping jaw and the telescopic arm is arranged between the first transmission shaft and the second transmission shaft.

9. The wafer handling device of claim 2, wherein the telescoping arm further comprises a swivel post fixedly connected to the first swivel arm, and the first swivel arm is rotatably disposed on the base via the swivel post;

the rotary column is connected with a driving assembly; the driving component can drive the rotary column to rotate and can drive the rotary column to move along the axial direction of the rotary column.

10. The wafer handling device of claim 9, wherein a receiving cavity is formed in the spin column, a third driving member is disposed in the receiving cavity, and an output shaft of the third driving member extends into the first rotating arm and is in transmission connection with the second transmission assembly through a transmission member;

The third driving piece drives the second rotating arm to rotate relative to the first rotating arm through the second transmission assembly.