CN118248586A

CN118248586A - Substrate processing apparatus and substrate processing method

Info

Publication number: CN118248586A
Application number: CN202311778452.8A
Authority: CN
Inventors: 冈田吉文; 冲田展彬; 中村一树
Original assignee: Screen Holdings Co Ltd
Current assignee: Screen Holdings Co Ltd
Priority date: 2022-12-23
Filing date: 2023-12-22
Publication date: 2024-06-25
Also published as: JP2024103364A; CN118248585A; CN118248589A; CN118248588A

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method. The substrate is carried into the unit case with the carry-in/out port opened by the shutter. In a state in which the substrate has been carried into the unit case, the shutter performs a shutter closing operation of switching from an open state to a closed state. The lower surface of the carried substrate is cleaned by a lower surface brush in the unit case. The lower surface brush is in a standby position before the substrate is carried in. Therefore, before the lower surface of the substrate is cleaned, the lower surface brush performs a brush preparation operation of moving from the standby position to the cleaning position where the lower surface brush contacts the substrate. The shutter closing operation and the brush preparation operation are started so that at least a part of the operation periods overlap.

Description

Substrate processing apparatus and substrate processing method

Technical Field

The present invention relates to a substrate processing apparatus and a substrate processing method for cleaning a substrate.

Background

A substrate processing apparatus is used for performing various processes on various substrates such as a substrate for FPD (FLATPANELDISPLAY ), a semiconductor substrate, a substrate for optical disk, a substrate for magnetic disk, a substrate for magneto-optical disk, a substrate for photomask, a ceramic substrate, and a substrate for solar cell, which are used for a liquid crystal display device, an organic EL (Electro Luminescence ) display device, and the like. In order to clean the substrate, a substrate cleaning apparatus is used.

For example, the substrate cleaning apparatus described in japanese patent No. 5904169 includes: 2 adsorption pads for holding the periphery of the back surface of the wafer; a spin chuck for holding a rear center portion of the wafer; and brushing the back surface of the wafer. The 2 suction pads hold the wafer in motion in the lateral direction. In this state, the center portion of the back surface of the wafer is cleaned. Then, the spin chuck receives the wafer from the suction pad, and rotates while holding the center portion of the back surface of the wafer. In this state, the peripheral edge of the back surface of the wafer is cleaned.

Disclosure of Invention

In the above-described substrate cleaning apparatus, a plurality of substrates are sequentially carried in and out, and each substrate is subjected to cleaning treatment. Therefore, if the time required for processing one substrate can be shortened, the processing efficiency of a plurality of substrates can be greatly improved. Therefore, in the substrate cleaning apparatus, further improvement in the throughput of the substrate processing is demanded.

The invention provides a substrate processing apparatus and a substrate processing method capable of improving the processing amount of substrate processing.

The substrate processing apparatus according to an aspect of the present invention includes: a processing chamber having an opening for loading and unloading a substrate; a shutter configured to be capable of opening and closing the opening of the processing chamber; an opening/closing drive unit that switches the shutter between a closed state in which the opening of the processing chamber is closed and an open state in which the opening of the processing chamber is opened; a substrate holding unit provided in the processing chamber and configured to hold a substrate; a brush provided in the processing chamber, the brush being in contact with a lower surface of a substrate to clean the lower surface; a brush moving portion provided in the processing chamber and configured to be capable of moving the brush between a cleaning position in contact with the lower surface of the substrate held by the substrate holding portion and a standby position below the substrate holding portion and spaced apart from the substrate held by the substrate holding portion; and a control unit that, when the shutter is in the open state and the brush is in the standby position, controls the opening/closing drive unit and the brush moving unit to start a shutter closing operation in which the shutter is switched from the open state to the closed state and a brush preparation operation in which the brush is moved from the standby position to the cleaning position so that at least a part of the shutter closing operation overlaps with the brush preparation operation.

Another aspect of the present invention provides a substrate processing apparatus comprising: a processing chamber having an opening for loading and unloading a substrate; a shutter configured to be capable of opening and closing the opening of the processing chamber; an opening/closing drive unit that switches the shutter between a closed state in which the opening of the processing chamber is closed and an open state in which the opening of the processing chamber is opened; a substrate holding unit provided in the processing chamber and configured to hold a substrate; a holding drive unit configured to switch the substrate holding unit between a holding state in which the substrate is held and a mountable state in which the substrate is not held and the substrate is mountable; a brush cleaning section provided in the processing chamber, the brush cleaning section being configured to be capable of bringing the brush into contact with the substrate held by the substrate holding section in the held state and cleaning a lower surface of the substrate; and a control unit configured to control the opening/closing drive unit and the holding drive unit so that the shutter closing operation of the shutter from the open state to the closed state and the holding switching operation of the substrate holding unit from the mountable state to the holding state are started so that the shutter closing operation overlaps at least a part of the holding switching operation period when the shutter is in the open state and the substrate holding unit is in the mountable state.

A substrate processing apparatus according to still another aspect of the present invention includes: a substrate holding portion configured to be capable of holding a substrate; a holding drive unit configured to switch the substrate holding unit between a holding state in which the substrate is held and a mountable state in which the substrate is not held and the substrate is mountable; a brush for cleaning a lower surface of a substrate by contacting the lower surface; a brush moving portion configured to be capable of moving the brush between a cleaning position in contact with the lower surface of the substrate held by the substrate holding portion in the held state, and a standby position below the substrate holding portion and spaced apart from the substrate held by the substrate holding portion; and a control unit that, when the substrate holding unit is in the mountable state and the brush is in the standby position, controls the holding drive unit and the brush moving unit to start a holding switching operation in which the substrate holding unit is switched from the mountable state to the holding state and a brush preparation operation in which the brush is moved from the standby position to the cleaning position so that at least a part of the holding switching operation overlaps with at least a part of the brush preparation operation.

A substrate processing apparatus according to still another aspect of the present invention includes: a processing chamber having an opening for loading and unloading a substrate; a shutter configured to be capable of opening and closing the opening of the processing chamber; an opening/closing drive unit that switches the shutter between a closed state in which the opening of the processing chamber is closed and an open state in which the opening of the processing chamber is opened; a substrate holding unit provided in the processing chamber and configured to hold a substrate; a holding driving section that switches the substrate holding section between: a holding state in which a substrate is held at a predetermined holding position, a mountable state in which the substrate is not held at the holding position but is mountable, and a retracted state in which the substrate is standby at a position spaced from the holding position; a brush cleaning section provided in the processing chamber, the brush cleaning section being configured to be capable of bringing the brush into contact with the substrate held by the substrate holding section in the held state and cleaning a lower surface of the substrate; and a control unit configured to control the opening/closing drive unit and the holding drive unit so that the shutter opening operation of the shutter from the closed state to the open state and the mounting preparation operation of the substrate holding unit from the retracted state to the mounting ready state overlap at least a part of the mounting preparation operation period when the shutter is in the closed state and the substrate holding unit is in the retracted state.

A substrate processing method according to still another aspect of the present invention uses a substrate processing apparatus including: a processing chamber having an opening for loading and unloading a substrate; a shutter configured to be capable of opening and closing the opening of the processing chamber; and a brush provided in the processing chamber, the brush being in contact with a lower surface of the substrate to clean the lower surface; and the substrate processing method includes the steps of: switching the shutter between a closed state in which the opening of the processing chamber is closed and an open state in which the opening of the processing chamber is opened; holding a substrate by a substrate holding portion in the processing chamber; and moving the brush between a cleaning position in contact with the lower surface of the substrate held by the substrate holding portion and a standby position below the substrate holding portion and spaced apart from the substrate held by the substrate holding portion in the processing chamber; and the step of switching the shutter includes causing the shutter to perform a shutter closing operation of switching the shutter from the open state to the closed state; the step of moving the brush includes a brush preparation operation of moving the brush from the standby position to the washing position; when the shutter is in the open state and the brush is in the standby position, the shutter switching step and the brush moving step are started so that at least a part of the shutter closing operation period overlaps with at least a part of the brush preparation operation period.

A substrate processing method according to still another aspect of the present invention uses a substrate processing apparatus including: a processing chamber having an opening for loading and unloading a substrate; a shutter configured to be capable of opening and closing the opening of the processing chamber; and a substrate holding unit provided in the processing chamber and configured to hold a substrate; and the substrate processing method includes the steps of: switching the shutter between a closed state in which the opening of the processing chamber is closed and an open state in which the opening of the processing chamber is opened; switching the substrate holding portion between a holding state in which the substrate is held and a mountable state in which the substrate is not held and the substrate is mountable in the processing chamber; and a brush is brought into contact with the substrate held by the substrate holding portion in the held state in the processing chamber, and a lower surface of the substrate is cleaned; and the step of switching the shutter includes causing the shutter to perform a shutter closing operation of switching the shutter from the open state to the closed state; the step of switching the substrate holding portion includes the steps of: a holding switching operation for switching the substrate holding section from the mountable state to the holding state; when the shutter is in the open state and the substrate holding portion is in the mountable state, the shutter switching step and the substrate holding portion switching step are started so that at least a part of the shutter closing operation period overlaps with at least a part of the holding switching operation period.

A substrate processing method according to still another aspect of the present invention uses a substrate processing apparatus including: a substrate holding portion configured to be capable of holding a substrate; and a brush for cleaning the lower surface of the substrate by contacting the lower surface; and the substrate processing method includes the steps of: switching the substrate holding portion between a holding state in which the substrate is held and a mountable state in which the substrate is not held and the substrate is mountable; and moving the brush between a cleaning position in contact with the lower surface of the substrate held by the substrate holding portion and a standby position below the substrate holding portion and spaced apart from the substrate held by the substrate holding portion; and the step of switching the substrate holding portion includes the steps of: a holding switching operation for switching the substrate holding section from the mountable state to the holding state; the step of moving the brush includes a brush preparation operation of moving the brush from the standby position to the washing position; when the substrate holding unit is in the mountable state and the brush is in the standby position, the step of switching the substrate holding unit and the step of moving the brush are started so that at least a part of the holding switching operation period overlaps with at least a part of the brush preparation operation period.

A substrate processing method according to still another aspect of the present invention uses a substrate processing apparatus including: a processing chamber having an opening for loading and unloading a substrate; a shutter configured to be capable of opening and closing the opening of the processing chamber; and a substrate holding unit provided in the processing chamber and configured to hold a substrate; the substrate processing method includes the steps of: switching the shutter between a closed state in which the opening of the processing chamber is closed and an open state in which the opening of the processing chamber is opened; in the processing chamber, the substrate holding portion is switched between the following states: a holding state in which a substrate is held at a predetermined holding position, a mountable state in which the substrate is not held at the holding position but is mountable, and a retracted state in which the substrate is standby at a position spaced from the holding position; and a brush is brought into contact with the substrate held by the substrate holding portion in the held state in the processing chamber, and a lower surface of the substrate is cleaned; and the step of switching the shutter includes causing the shutter to perform a shutter opening operation of switching the shutter from the closed state to the open state; the step of switching the substrate holding portion includes a mounting preparation operation of switching the substrate holding portion from the retracted state to the mounting state; when the shutter is in the closed state and the substrate holding portion is in the retracted state, the shutter switching step and the substrate holding portion switching step are started so that at least a part of the shutter opening period overlaps with at least a part of the mounting preparation period.

According to the present invention, the throughput of substrate processing can be improved.

Drawings

Fig. 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention.

Fig. 2 is an external perspective view showing an internal configuration of the substrate cleaning apparatus of fig. 1.

Fig. 3 is an external perspective view of the lower jaw of fig. 1 and 2.

Fig. 4 is an external perspective view of the upper chuck of fig. 1 and 2.

Fig. 5 is a block diagram showing a configuration of a control system of the substrate cleaning apparatus of fig. 1.

Fig. 6 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of fig. 1.

Fig. 7 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of fig. 1.

Fig. 8 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of fig. 1.

Fig. 9 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of fig. 1.

Fig. 10 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of fig. 1.

Fig. 11 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of fig. 1.

Fig. 12 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of fig. 1.

Fig. 13 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of fig. 1.

Fig. 14 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of fig. 1.

Fig. 15 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of fig. 1.

Fig. 16 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of fig. 1.

Fig. 17 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of fig. 1.

Fig. 18 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of fig. 1.

Fig. 19 is a schematic plan view of a substrate cleaning apparatus according to another embodiment.

Fig. 20 is a block diagram showing a configuration of a control system of the substrate cleaning apparatus of fig. 19.

Detailed Description

A substrate processing apparatus and a substrate processing method according to an embodiment of the present invention will be described below with reference to the drawings. The substrate processing apparatus and the substrate processing method according to the present embodiment are a substrate cleaning apparatus and a substrate cleaning method. In the following description, the substrate refers to a substrate for FPD (Flat Panel Display) such as a semiconductor substrate (wafer), a liquid crystal display device, or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell, or the like. In this embodiment, the upper surface of the substrate is a circuit formation surface (front surface), and the lower surface of the substrate is a surface opposite to the circuit formation surface (back surface). Further, the substrate used in this embodiment mode has an outer peripheral portion at least a part of which is circular. For example, the substrate used in the present embodiment has a circular outer peripheral end portion outside the recess.

1. Structure of substrate cleaning device

Fig. 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention. Fig. 2 is an external perspective view showing an internal configuration of the substrate cleaning apparatus 1 of fig. 1. In the substrate cleaning apparatus 1 of the present embodiment, the X direction, the Y direction, and the Z direction orthogonal to each other are defined for the purpose of specifying the positional relationship. In the predetermined diagrams shown in fig. 1 and 2, the X direction, the Y direction, and the Z direction are appropriately indicated by arrows. The X direction and the Y direction are orthogonal to each other in a horizontal plane, and the Z direction corresponds to a vertical direction (up-down direction).

As shown in fig. 1, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a base device 30, a delivery device 40, a lower surface cleaning device 50, a cover device 60, an upper surface cleaning device 70, an end cleaning device 80, and an opening/closing device 90. These constituent elements are provided in the unit case 2. In fig. 2, the unit housing 2 is shown in broken lines.

The unit case 2 has a rectangular bottom surface portion 2a, and 4 side wall portions 2b, 2c, 2d, 2e extending upward from 4 sides of the bottom surface portion 2 a. The side wall portions 2b, 2c are opposed to each other, and the side wall portions 2d, 2e are opposed to each other. A rectangular opening is formed in the center of the side wall 2 b. The opening is a carry-in/out port 2x for the substrate W, and is used when the substrate W is carried in and carried out of the unit case 2. In fig. 2, the carry-in/carry-out port 2x is shown by a thick dotted line. In the following description, a direction from the inside of the unit case 2 toward the outside of the unit case 2 through the carry-in/out port 2x (a direction from the side wall portion 2c toward the side wall portion 2 b) in the Y direction is referred to as a front direction, and a direction opposite thereto (a direction from the side wall portion 2b toward the side wall portion 2 c) is referred to as a rear direction.

An opening/closing device 90 is provided in a region of the sidewall portion 2b in which the carry-in/out port 2x is formed and the vicinity thereof. The opening/closing device 90 includes a shutter 91 that is openable and closable to form the carry-in/out port 2x, and a shutter driving section 92 that drives the shutter 91. In fig. 2, the shutter 91 is shown in thick two-dot chain lines. The shutter driving section 92 drives the shutter 91 so as to open the carry-in/out port 2x when the substrate W is carried in and out of the substrate cleaning apparatus 1. Thereby, the shutter 91 is opened. The shutter driving section 92 drives the shutter 91 so as to close the carry-in/carry-out port 2x at the time of cleaning the substrate W in the substrate cleaning apparatus 1. Thereby, the shutter 91 is closed.

A base device 30 is provided in the center of the bottom surface portion 2 a. The base device 30 includes a linear guide 31, a movable base 32, and a base driving unit 33. The linear guide 31 includes 2 rails and is provided so as to extend from the vicinity of the side wall portion 2b to the vicinity of the side wall portion 2c in the Y direction in a plan view. The movable base 32 is provided so as to be movable in the Y direction on 2 tracks of the linear guide 31. The base driving unit 33 includes, for example, a pulse motor, and moves the movable base 32 in the Y direction on the linear guide 31.

The movable base 32 is provided with the lower holding device 20 and the lower surface cleaning device 50 so as to be aligned in the Y direction. The lower holding device 20 includes a suction holding portion 21 and a suction holding driving portion 22. The suction holding portion 21 is a so-called spin chuck, and has a circular suction surface capable of sucking and holding the lower surface of the substrate W, and is configured to be rotatable about an axis extending in the up-down direction (axis in the Z direction). In the following description, when the substrate W is suctioned and held by the suction holding portion 21, a region of the lower surface of the substrate W to be suctioned by the suction surface of the suction holding portion 21 is referred to as a lower surface center region. On the other hand, a region of the lower surface of the substrate W surrounding the lower surface center region is referred to as a lower surface outer region.

The suction holding driving section 22 includes a motor. The motor of the suction holding driving unit 22 is provided on the movable base 32 such that the rotation shaft protrudes upward. The suction holding portion 21 is attached to an upper end portion of the rotation shaft of the suction holding driving portion 22. In addition, a suction path for suction-holding the substrate W in the suction-holding portion 21 is formed on the rotation shaft of the suction-holding driving portion 22. The suction path is connected to an intake device, not shown. The suction holding driving unit 22 rotates the suction holding unit 21 about the rotation axis.

The movable base 32 is further provided with a delivery device 40 near the lower holding device 20. The delivery device 40 includes a plurality (3 in this example) of support pins 4l, pin coupling members 42, and pin lift driving units 43. The pin connecting member 42 is formed so as to surround the suction holding portion 21 in a plan view, and connects the plurality of support pins 41. The plurality of support pins 41 extend upward from the pin coupling member 42 by a predetermined length in a state of being coupled to each other by the pin coupling member 42. The pin lifting drive unit 43 lifts and lowers the pin connecting member 42 on the movable base 32. Thereby, the plurality of support pins 41 are lifted and lowered relative to the suction holding portion 21.

The lower surface cleaning apparatus 50 includes a lower surface brush 51, 2 substrate nozzles 52, 2 brush nozzles 52a, 52b, a gas ejection section 53, a lifting support section 54, a lower surface brush rotation driving section 55a, and a lower surface brush lifting driving section 55b. As shown in fig. 2, the elevation support 54 is provided on the movable base 32 so as to be able to elevate. The lifting support portion 54 has an upper surface 54u inclined obliquely downward in a direction away from the suction holding portion 21 (rearward in this example).

As shown in fig. 1, the lower surface brush 51 has a circular outer shape in a plan view, and is formed relatively large in the present embodiment. Specifically, the diameter of the lower surface brush 51 is larger than the diameter of the suction surface of the suction holding portion 21, for example, 1.3 times the diameter of the suction surface of the suction holding portion 21. In addition, the diameter of the lower surface brush 51 is larger than 1/3 of the diameter of the substrate W and smaller than 1/2 of the diameter of the substrate W. The diameter of the substrate W is 300mm, for example.

The lower surface brush 51 is a sponge brush, and is preferably made of a material having relatively low wettability such as a fluororesin. In this case, the adhesion of contaminants to the lower surface brush 51 is reduced. Thus, the lower surface brush 51 is less likely to be contaminated. In this example, the lower surface brush 51 is formed of PTFE (polytetrafluoroethylene), but the embodiment is not limited thereto. The lower surface brush 51 may be formed of a relatively soft resin material such as PVA (polyvinyl alcohol).

The lower surface brush 51 has a cleaning surface capable of contacting the lower surface of the substrate W. The lower surface brush 51 is attached to the upper surface 54u of the lifting support 54 so that the cleaning surface faces upward and so that the cleaning surface can rotate about an axis extending in the up-down direction through the center of the cleaning surface.

Each of the 2 substrate nozzles 52 is mounted on the upper surface 54u of the elevation support 54 so as to be positioned near the lower surface brush 51 with the liquid ejection port facing upward. The substrate nozzle 52 is connected to a lower surface cleaning liquid supply unit 56 (fig. 5). The lower surface cleaning liquid supply unit 56 supplies a cleaning liquid for cleaning a substrate to the substrate nozzle 52. When the substrate W is cleaned by the lower surface brush 51, the substrate nozzle 52 ejects the cleaning liquid supplied from the lower surface cleaning liquid supply unit 56 onto the lower surface of the substrate W. In the present embodiment, pure water is used as the cleaning liquid supplied to the substrate nozzle 52.

The 2 brush nozzles 52a and 52b are used to wash the lower surface brush 51. Each of the 2 brush nozzles 52a, 52b is mounted on the upper surface 54u of the elevating support 54 so as to be located in the vicinity of the lower surface brush 51. The brush nozzles 52a and 52b are connected to a brush cleaning liquid supply portion 57 (fig. 5). The brush cleaning liquid supply unit 57 supplies the brush cleaning liquid to the brush nozzles 52a and 52 b. Thus, the cleaning liquid supplied from the cleaning liquid supply unit 57 is discharged from the brush nozzles 52a and 52b toward the lower surface brush 51. The cleaning liquid supplied to the 2 substrate nozzles 52 is the same as the cleaning liquid supplied to the 2 brush nozzles 52a, 52 b. Therefore, in the present embodiment, pure water is used as the cleaning liquid supplied to the brush nozzles 52a and 52 b.

A brush nozzle 52a is provided at a position laterally to the lower surface brush 51 in such a manner that a front end portion (liquid ejection port) thereof faces the position above the lower surface brush 51. Therefore, the cleaning liquid discharged from the brush nozzle 52a is guided to the center portion of the cleaning surface of the lower surface brush 51 so as to draw a parabola from a position laterally of the lower surface brush 51. The other brush nozzle 52b is provided at a position laterally to the lower surface brush 51 such that a front end portion (liquid ejection port) thereof faces a side portion (outer peripheral end portion) of the lower surface brush 51. Therefore, the cleaning liquid discharged from the brush nozzle 52b is guided from a position laterally to the lower surface brush 51 to a side portion (outer peripheral end portion) of the lower surface brush 51.

As described below, the lower surface brush 51 basically rotates during the power-on of the substrate cleaning apparatus 1. Therefore, when the cleaning liquid is ejected from the brush nozzles 52a, 52b toward the lower surface brush 51, the entire lower surface brush 51 is smoothly rinsed by the cleaning liquid. In addition, the cleaning surface of the lower surface brush 51 is uniformly wetted. Thereby, the lower surface brush 51 is prevented from being locally hardened.

The gas ejection portion 53 is a slit-shaped gas ejection nozzle having a gas ejection port extending in one direction. The gas ejection section 53 is provided on the movable base 32 so as to be capable of being lifted and lowered independently of other components of the lower surface cleaning apparatus 50. A description of a driving unit for elevating and lowering the gas discharge unit 53 is omitted. The gas injection port of the gas injection part 53 is located between the lower surface brush 51 and the adsorption holding part 21 in a plan view and faces upward. The gas discharge unit 53 is connected to a discharge gas supply unit 58 (fig. 5).

The ejected gas supply unit 58 supplies gas to the gas ejection unit 53. In the present embodiment, an inert gas such as nitrogen is used as the gas supplied to the gas ejection section 53. The gas ejection unit 53 ejects the gas supplied from the ejected gas supply unit 58 onto the lower surface of the substrate W when the substrate W is cleaned by the lower surface brush 51 and when the lower surface of the substrate W is dried, which will be described later. In this case, a belt-like air curtain extending in the X direction is formed between the lower surface brush 51 and the suction holding portion 21.

The lower surface brush rotation driving section 55a of fig. 1 includes a motor, and basically rotates the lower surface brush 51 during the power-on period of the substrate cleaning apparatus 1. The lower brush lifting/lowering driving unit 55b includes a stepping motor or a cylinder, and lifts and lowers the lifting/lowering support unit 54 on the movable base 32.

A shield device 60 is further provided in the central portion of the bottom surface portion 2 a. The shroud device 60 includes a shroud 61 and a shroud driving portion 62. The cover 61 is provided so as to surround the lower holder 20 and the base device 30 in a plan view and is capable of being lifted and lowered. In fig. 2, the shield 61 is shown in broken lines. The shield driving unit 62 moves the shield 61 between the lower shield position and the upper shield position according to which portion of the lower surface of the substrate W is washed by the lower surface brush 51. The lower shield position is a height position where the upper end of the shield 61 is located below the substrate W suctioned and held by the suction holding portion 21. The upper shroud position is a height position above the suction holding portion 21 of the upper end portion of the shroud 61. In a state where the cover 61 is positioned at the upper cover position, the cover 61 and the suction holding portion 21 overlap each other in a side view. Therefore, the upper shield position can be said to be a height position of the shield 61 corresponding to the height position of the substrate W suctioned and held by the suction holding portion 21.

A pair of upper holding devices 10A and 10B are provided above the cover 61 so as to face each other across the base device 30 in a plan view. The upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck driving section 13A, and an upper chuck driving section 14A. The upper holding device 10B includes a lower chuck 1iB, an upper chuck 12B, a lower chuck driving section 13B, and an upper chuck driving section 14B.

Fig. 3 is an external perspective view of the lower chucks 11A, 11B of fig. 1 and 2. In fig. 3, the lower chucks 11A, 11B are shown in bold solid lines. The upper chucks 12A, 12B are shown in phantom. In the perspective view of the external view of fig. 3, in order to easily understand the shape of the lower chucks 11A, 11B, the expansion/contraction ratio of each portion is changed with respect to the perspective view of the external view of fig. 2.

As shown in fig. 3, the lower chucks 11A and 11B are symmetrically arranged with respect to a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holding portion 21 in a plan view, and are provided so as to be movable in the X direction in a common horizontal plane. The lower chucks 11A, 11B each have 2 support tabs 200. Each support piece 200 is provided with an inclined support surface 201 and a movement limiting surface 202.

In the lower chuck l1A, the inclined support surface 201 of each support piece 200 can support the outer peripheral end portion of the substrate W from below and is formed to extend obliquely downward toward the lower chuck 11B. The movement restricting surface 202 extends upward from the upper end of the inclined support surface 201 by a predetermined distance, and forms a step at the upper end of the lower chuck 11A. On the other hand, in the lower chuck 11B, the inclined support surface 201 of each support piece 200 can support the outer peripheral end portion of the substrate W from below and is formed so as to extend obliquely downward toward the lower chuck 11A. The movement restricting surface 202 extends upward from the upper end of the inclined support surface 201 by a predetermined distance, and forms a step at the upper end of the lower chuck 11B.

The lower chuck driving sections 13A, 13B of fig. 1 include an air cylinder or a motor as an actuator. The lower chuck driving sections 13A and 13B move the lower chucks 11A and 11B so that the lower chucks 11A and 11B are close to each other or so that the lower chucks 11A and 11B are distant from each other. Here, when the target positions of the lower chucks 11A, 11B in the X direction are set in advance, the lower chuck driving sections 13A, 13B can individually adjust the positions of the lower chucks 11A, 11B in the X direction based on the information of the target positions. For example, the distance between the lower chucks 11A, 11B can be made smaller than the outer diameter of the substrate W. In this case, the substrate W can be placed on the plurality of inclined support surfaces 201 of the lower chucks 11A and 11B.

Fig. 4 is an external perspective view of the upper chucks 12A, 12B of fig. 1 and 2. In fig. 4, the upper chucks 12A, 12B are shown in bold solid lines. The lower chucks 11A, 11B are shown in broken lines. In the perspective view of the external view of fig. 4, in order to easily understand the shape of the upper chucks 12A, 12B, the expansion/contraction ratio of each portion is changed with respect to the perspective view of the external view of fig. 2.

As shown in fig. 4, the upper chucks 12A and 12B are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holding portion 21 in a plan view, and are provided so as to be movable in the X direction in a common horizontal plane, as are the lower chucks 11A and 11B. The upper collets 12A, 12B each have 2 retention tabs 300. Each holding piece 300 has an abutment surface 301 and a protruding portion 302.

In the upper chuck 12A, the contact surface 301 of each holding piece 300 is formed at the lower portion of the front end of the holding piece 300 so as to face the upper chuck 12B, and is orthogonal to the X direction. The protruding portion 302 is formed so as to protrude from the upper end of the abutment surface 301 toward the upper chuck 12B by a predetermined distance. On the other hand, in the upper chuck 12B, the contact surface 301 of each holding piece 300 is formed at the lower portion of the tip end of the holding piece 300 so as to face the upper chuck 12A, and is orthogonal to the X direction. The protruding portion 302 is formed so as to protrude from the upper end of the abutment surface 301 toward the upper chuck 12A by a predetermined distance.

The upper chuck driving sections 14A, 14B of fig. 1 include an air cylinder or a motor as an actuator. The upper chuck driving units 14A and 14B move the upper chucks 12A and 12B so that the upper chucks 12A and 12B are close to each other or so that the upper chucks 12A and 12B are distant from each other. Here, when the target positions of the upper chucks 12A, 12B in the X direction are set in advance, the upper chuck driving sections 14A, 14B can individually adjust the positions of the upper chucks 12A, 12B in the X direction based on the information of the target positions.

In the upper holding devices 10A and 10B, for example, the upper chucks 12A and 12B move toward the outer peripheral end portions of the substrates W placed on the lower chucks 11A and 11B. The 2 abutment surfaces 301 of the upper chuck 12A and the 2 abutment surfaces 301 of the upper chuck 12B are brought into contact with portions of the outer peripheral end portion of the substrate W, whereby the outer peripheral end portion of the substrate W is held, and the substrate W is firmly fixed.

The upper holding devices 10A and 10B are switched to three states, i.e., a retracted state, a mountable state, and a holding state, by adjusting the distance between the lower chucks 11A and 11B and the distance between the upper chucks 12A and 12B in a predetermined combination.

The retracted state of the upper holding devices 10A, 10B is a state in which the distance between the lower chucks 11A, 11B is larger than the outer diameter of the substrate W and the distance between the upper chucks 12A, 12B is larger than the outer diameter of the substrate W. In this case, the substrate W in the horizontal posture can be moved in the up-down direction (Z direction) between the lower chucks 11A and 11B and between the upper chucks 12A and 12B.

The upper holding devices 10A and 10B are placed in a state in which the distance between the lower chucks 11A and 11B is smaller than the outer diameter of the substrate W and the distance between the upper chucks 12A and 12B is larger than the outer diameter of the substrate W. In this case, the substrate W can be placed on the plurality of inclined support surfaces 201 of the lower chucks 11A and 11B in a horizontal posture while preventing interference between the substrate W and the upper chucks 12A and 12B. The substrate W placed on the lower chucks 11A and 11B can be lifted.

The holding state of the upper holding devices 10A and 10B is switchable only when the upper holding devices 10A and 10B are in a state where they can be placed and the substrates W are placed on the lower chucks 11A and 11B. Specifically, the upper holding devices 10A and 10B are held by the lower chucks 11A and 11B at a distance smaller than the outer diameter of the substrate W, and the upper chucks 12A and 12B are brought into contact with the outer peripheral ends of the substrate W on the lower chucks 11A and 11B to fix the substrate W.

Here, in the upper holding devices 10A and 10B, when switching from the mountable state to the holding state, the upper chucks 12A and 12B move in the X direction so as to approach each other with the substrate W interposed therebetween. At this time, the upper chucks 12A, 12B are moved specifically as follows.

First, one upper chuck moves toward the other upper chuck, stopping at a predetermined target position. Thereafter, the other upper chuck is moved toward one upper chuck to be in contact with a portion of the peripheral end of the substrate W. Further, the other upper chuck is moved toward an upper chuck until another portion of the peripheral end portion of the substrate W is in contact with the upper chuck. When the state is switched from the mountable state to the holding state in this way, the substrate W is positioned on the lower chucks 11A, 11B with the target position as a reference. Therefore, in the case where the size of the substrate W is known, by determining the target position based on the size, the center of the substrate W can be easily positioned at a planar reference position rp (fig. 6) described later.

In the upper holding devices 10A and 10B, when switching from the holding state to the mountable state, the upper chucks 12A and 12B move away from each other with the substrate W interposed therebetween in the X direction. At this time, the upper chucks 12A, 12B are moved specifically as follows.

First, in a state where one upper chuck is located at a predetermined target position, the other upper chuck is moved away from the one upper chuck. After the other upper chuck is spaced apart from the substrate W, one upper chuck moves away from the other upper chuck. When the state is switched from the holding state to the mountable state in this way, the substrate W is positioned on the lower chucks 11A, 11B with the target position as a reference. Therefore, in the case where the size of the substrate W is known, by determining the target position based on the size, the center of the substrate W can be easily positioned at a planar reference position rp (fig. 6) described later.

As shown in fig. 1, 2 side wall portions 2c and 2b facing each other in the Y direction are provided with a light projecting portion 19a and a light receiving portion 19b, respectively. The light projecting section 19a includes a light projecting element. The light receiving unit 19b includes a light receiving element. The light projecting section 19a and the light receiving section 19b constitute a transmission-type photoelectric sensor 19 (fig. 5).

The light projecting section 19a and the light receiving section 19b are arranged such that the light projecting section 19a is positioned below the light receiving section 19 b. The light projecting section 19a and the light receiving section 19b are arranged as follows: when the substrate W is held by the upper holding devices 10A and 10B, a straight line connecting the light projecting portion 19a and the light receiving portion 19B traverses the substrate W.

In the substrate cleaning apparatus 1, when the substrate W is placed on the upper holding devices 10A and 10B in the placeable state, light is emitted from the light emitting portion 19a toward the light receiving portion 19B (see the arrow of the one-dot chain line in fig. 2). When the substrates W are normally placed on the upper holding devices 10A and 10B, the light emitted from the light projecting portion 19a is blocked by the substrates W. Therefore, the light receiving unit 19b does not receive the light emitted from the light projecting unit 19 a. On the other hand, when the substrate W is not normally placed on the upper holding devices 10A and 10B, the light emitted from the light emitting section 19a is incident on the light receiving section 19B without being blocked by the substrate W. Therefore, it can be determined whether or not the substrate W is normally placed on the upper holding devices 10A and 10B based on the light receiving signal output from the light receiving element of the light receiving portion 19B. In the following description, this determination is referred to as a substrate placement state determination.

In the substrate cleaning apparatus 1, light is emitted from the light emitting section 19a toward the light receiving section 19B also when the upper holding devices 10A, 10B are switched from the mountable state to the holding state. Accordingly, for the same reason as described above, it can be determined whether or not the substrate W is normally held by the upper holding devices 10A and 10B based on the light receiving signal output from the light receiving element of the light receiving unit 19B. In the following description, this determination is referred to as a substrate holding state determination.

As shown in fig. 1, the upper surface cleaning device 70 is provided on one side of the cover 61 so as to be located near the upper holding device 10B in a plan view. The upper surface cleaning apparatus 70 includes a rotation support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive section 74.

The rotation support shaft 71 is supported by the upper surface cleaning drive section 74 so as to be vertically movable and rotatable on the bottom surface section 2a so as to extend in the vertical direction. As shown in fig. 2, the arm 72 is provided above the upper holding device 10B so as to extend in the horizontal direction from the upper end portion of the rotation support shaft 71. A spray nozzle 73 is attached to the distal end portion of the arm 72.

The spray nozzle 73 is connected to an upper surface cleaning fluid supply unit 75 (fig. 5). The upper surface cleaning fluid supply unit 75 supplies cleaning liquid and gas to the spray nozzle 73. In the present embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and an inert gas such as nitrogen is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid supplied from the upper surface cleaning fluid supply unit 75 with the gas to generate a mixed fluid, and sprays the generated mixed fluid downward.

The upper surface cleaning driving unit 74 includes one or more pulse motors, air cylinders, and the like, and lifts and lowers the rotation support shaft 71 and rotates the rotation support shaft 71. According to the above configuration, the spray nozzle 73 is moved in an arc shape on the upper surface of the substrate W sucked and held and rotated by the suction holding portion 21, whereby the entire upper surface of the substrate W can be cleaned.

As shown in fig. 1, an end washing device 80 is provided on the other side of the cover 61 so as to be located near the upper holding device 10A in a plan view. The end washing apparatus 80 includes a rotation support shaft 81, an arm 82, a bevel brush (bevelbrush) 83, and a bevel brush driving unit 84.

The rotation support shaft 81 is supported by the inclined brush driving unit 84 so as to be vertically movable and rotatable on the bottom surface 2a so as to extend in the vertical direction. As shown in fig. 2, the arm 82 is provided above the upper holding device 10A so as to extend in the horizontal direction from the upper end portion of the rotation support shaft 81. A bevel brush 83 is provided at the tip of the arm 82 so as to protrude downward and be rotatable about an axis in the up-down direction.

The upper half of the bevel brush 83 has an inverted truncated cone shape and the lower half has a truncated cone shape. According to the bevel brush 83, the peripheral end portion of the substrate W can be cleaned by the central portion of the peripheral surface in the up-down direction.

The bevel brush driving unit 84 includes one or more pulse motors, air cylinders, and the like, and lifts and lowers the rotation support shaft 81 and rotates the rotation support shaft 81. According to the above configuration, the central portion of the outer peripheral surface of the bevel brush 83 is brought into contact with the outer peripheral end portion of the substrate W sucked and held and rotated by the suction holding portion 21, whereby the entire outer peripheral end portion of the substrate W can be cleaned.

Here, the bevel brush driving part 84 further includes a motor built in the arm 82. The motor rotates the bevel brush 83 provided at the front end portion of the arm 82 about an axis in the up-down direction. Therefore, when the peripheral end portion of the substrate W is cleaned, the cleaning force of the bevel brush 83 against the peripheral end portion of the substrate W is improved by rotating the bevel brush 83.

2. Control system of substrate cleaning apparatus 1

Fig. 5 is a block diagram showing a configuration of a control system of the substrate cleaning apparatus 1 of fig. 1. The substrate cleaning apparatus 1 includes a control device 170. The control device 170 includes a CPU (central processing unit), a RAM (random access memory), a ROM (read only memory), and a storage device. The RAM is used as a work area of the CPU. The ROM stores a system program. The storage device stores a substrate cleaning program.

As shown in fig. 5, the control device 170 includes a chuck control unit 9A, a suction control unit 9B, a base control unit 9C, a delivery control unit 9D, a lower surface cleaning control unit 9E, a shield control unit 9F, an upper surface cleaning control unit 9G, a bevel cleaning control unit 9H, and a carry-in/out control unit 9I as functional units for controlling the operations of the respective plurality of substrate cleaning apparatuses 1. The functional unit of the control device 170 is realized by the CPU executing the substrate cleaning program stored in the storage device on the RAM. Part or all of the functional units of the control device 170 may be realized by hardware such as an electronic circuit.

The chuck control section 9A controls the lower chuck driving sections 13A and 13B and the upper chuck driving sections 14A and 14B to receive the substrate W carried into the substrate cleaning apparatus 1 and hold it at a position above the suction holding section 21. The chuck control unit 9A controls the photosensor 19 to determine the substrate placement state and the substrate holding state. The suction control section 9B controls the suction holding driving section 22 to suction-hold the substrate W by the suction holding section 21 and rotate the suction-held substrate W.

The susceptor control unit 9C controls the susceptor driving unit 33 so that the movable susceptor 32 moves with respect to the substrates W held by the upper holding devices 10A and 10B. The transfer control unit 9D controls the pin lift driving unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the suction holding unit 21.

The lower surface cleaning control unit 9E controls the lower surface brush rotation driving unit 55a, the lower surface brush lifting driving unit 55b, the lower surface cleaning liquid supply unit 56, and the ejection gas supply unit 58 to clean the lower surface of the substrate W. In addition, the lower surface cleaning control section 9E controls the brush cleaning liquid supply section 57 to clean the lower surface brush 51. The shield control unit 9F controls the shield driving unit 62 so that the cleaning liquid scattered from the substrate W is caught by the shield 61 when cleaning the substrate W suctioned and held by the suction holding unit 21.

The upper surface cleaning control unit 9G controls the upper surface cleaning driving unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W suctioned and held by the suction holding unit 21. The bevel cleaning control section 9H controls the bevel brush driving section 84 to clean the peripheral end portion of the substrate W suctioned and held by the suction holding section 21. The carry-in/carry-out control section 9I controls the barrier driving section 92 to open and close the carry-in/carry-out port 2x of the unit case 2 when the substrate W is carried in and carried out of the substrate cleaning apparatus 1.

3. Operation of the substrate cleaning apparatus 1

Fig. 6 to 18 are schematic diagrams for explaining an example of the operation of the substrate cleaning apparatus 1 of fig. 1. In each of fig. 6 to 18, the upper stage shows a plan view of the substrate cleaning apparatus 1. The middle section shows a side view of the lower holding device 20 and its peripheral portion as viewed along the Y direction, and the lower section shows a side view of the lower holding device 20 and its peripheral portion as viewed along the X direction. The side view of the middle section corresponds to the side view of line A-A of fig. 1, and the side view of the lower section corresponds to the side view of line B-B of fig. 1. In order to easily understand the shape and the operation state of each constituent element of the substrate cleaning apparatus 1, the expansion/contraction ratio of a part of the constituent elements is different between the top view of the upper stage and the side views of the middle and lower stages. In fig. 6 to 18, the shield 61 is shown by a two-dot chain line, and the outline of the substrate W is shown by a thick one-dot chain line. Further, in the top view of the upper stage of fig. 6 to 18, the state of the shutter 91 or the change in the state thereof is shown in a character line, and the state of the upper holding devices 10A, 10B or the change in the state thereof is shown in a character line.

First, as shown in fig. 6, a state in which the substrate W is not present in the unit case 2 is assumed as an initial state (standby state). In an initial state before the substrate W is carried into the substrate cleaning apparatus 1, the shutter 91 of the opening/closing device 90 is in a closed state. Therefore, the carry-in/carry-out port 2x is closed by the shutter 91. The upper holding devices 10A and 10B are in a retracted state. Accordingly, the lower chucks 11A, 11B are maintained in a state where the distance from each other is sufficiently larger than the diameter of the substrate W. The upper chucks 12A and 12B are also maintained at a distance from each other sufficiently greater than the diameter of the substrate W.

In the initial state, the movable base 32 of the base device 30 is disposed such that the center of the suction holding portion 21 is located at the center of the shield 61 in a plan view. At this time, the lower surface cleaning apparatus 50 is located on the movable base 32 at a position spaced apart from the suction holding portion 21 in the Y direction by a predetermined distance. Further, the cleaning surface (upper end portion) of the lower surface brush 51 of the lower surface cleaning apparatus 50 is located below the suction holding portion 21. The position of the lower surface brush 51 in the up-down direction (Z direction) in the initial state is referred to as a brush standby position. In the case where the substrate W is held by the suction holding portion 21, the brush standby position is located below the substrate W. In particular, in the present embodiment, the brush standby position corresponds to the lowest position in the vertical direction range in which the lower surface brush 51 can be lifted by the lifting support portion 54.

In the initial state, the delivery device 40 is positioned with the plurality of support pins 41 positioned below the suction holding portion 21. Further, the shield 61 of the shield arrangement 60 is in the lower shield position. In the following description, the center position of the shroud 61 in a plan view is referred to as a planar reference position rp. The position of the movable base 32 on the bottom surface 2a when the center of the suction holding portion 21 is at the planar reference position rp in plan view is referred to as a reference horizontal position.

As shown in fig. 7, when the substrate W is carried into the substrate cleaning apparatus 1, the shutter 91 is switched from the closed state to the open state at a point immediately before the substrate W enters the unit case 2. As indicated by a thick solid arrow a1 in fig. 7, the upper holding devices 10A and 10B are switched from the retracted state to the mountable state by bringing the lower chucks 11A and 11B closer to each other.

As described above, the operation of switching the shutter 91 from the closed state to the open state is referred to as a shutter opening operation. The operation of switching the upper holding devices 10A and 10B from the retracted state to the mountable state is referred to as a mounting preparation operation. In this case, the chuck control unit 9A and the carry-in/out control unit 9I in fig. 5 start respective operations so that at least a part of the shutter opening operation period overlaps with at least a part of the mounting preparation operation period.

Next, as shown by a thick solid arrow a2 in fig. 8, a hand (substrate holding portion) Ma of a substrate transfer robot, not shown, enters the inside of the unit case 2 through the carry-in/carry-out port 2x, and moves the substrate W to a substantially central position in the unit case 2. At this time, the substrate W held by the hand Ma is located between the upper chuck 12A and the upper chuck 12B.

Next, the hand Ma descends. At this time, the upper holding devices 10A and 10B are in a mountable state. Therefore, the hand Ma is moved to a position lower than the upper holding devices 10A and 10B, and the substrate W held by the hand Ma is placed on the pair of lower chucks 11A and 11B. Thus, the plurality of portions of the peripheral edge portion of the lower surface of the substrate W are supported by the plurality of support pieces 200 (fig. 3) of the lower chucks 11A, 11B, respectively. Then, the empty hand Ma is withdrawn from the carry-in/out port 2 x.

Next, after the hand Ma is withdrawn, as shown in fig. 9, the shutter 91 is switched from the open state to the closed state. Further, the substrate placement state determination is performed by the photoelectric sensor 19 (fig. 5). Specifically, light is emitted from the light projecting section 19a toward the light receiving section 19B, and it is determined whether or not the substrate W is normally mounted on the upper holding devices 10A, 10B based on the light receiving signal of the light receiving section 19B. Here, when it is determined that the substrate W is not normally placed, the processing of the substrate W is stopped.

After the hand Ma is withdrawn, the upper chucks 12A and 12B are brought close to each other as indicated by a thick solid arrow a3 in fig. 9, whereby the plurality of holding pieces 300 of the upper chucks 12A and 12B are brought into contact with the outer peripheral end portion of the substrate W. Thereby, the upper holding devices 10A and 10B are switched from the mountable state to the holding state, and the substrates W are held by the upper holding devices 10A and 10B. At the time of this switching, after one of the upper chucks 12A, 12B is moved to the target position as described above, the other upper chuck is moved toward the one upper chuck, thereby accurately positioning the substrate W in the X direction.

At this time, further, a substrate holding state determination is performed by the photosensor 19 (fig. 5). Specifically, light is emitted from the light projecting section 19a toward the light receiving section 19B, and it is determined whether or not the substrate W is normally held by the upper holding devices 10A, 10B based on the light receiving signal of the light receiving section 19B. Here, in the case where it is determined that the substrate W is not normally held, the processing of the substrate W is stopped.

In the substrate cleaning apparatus 1 of the present embodiment, the central area of the lower surface of the substrate W is cleaned by the lower surface brush 51 in a state where the substrate W is held by the upper holding devices 10A, 10B. Therefore, after the hand Ma is withdrawn, the lower surface brush 51 is moved to a position facing a predetermined area (initial contact area) to be initially contacted on the lower surface of the substrate W in order to prepare for cleaning the central area of the lower surface of the substrate W. In this example, the initial contact area is a central area of the lower surface of the substrate W.

In this case, specifically, the movable base 32 moves in the Y direction so that the lower surface brush 51 overlaps the initial contact area of the substrate W in a plan view. The elevation support 54 is elevated so that the lower surface brush 51 approaches a height position close to the lower surface of the substrate W. More specifically, in the example of fig. 9, as indicated by a thick solid arrow a4, the movable base 32 is moved forward from the reference horizontal position until the center of the lower surface brush 51 overlaps the planar reference position rp in a plan view. As indicated by a thick solid arrow a5 in fig. 9, the elevation support 54 is elevated so that the lower surface brush 51 is moved closer to the vicinity of the substrate W from the brush standby position (a position spaced apart from the substrate W by about 5 mm). The elevation support 54 may be elevated to a position where the lower surface brush 51 contacts the lower surface of the substrate W.

As described above, the operation of switching the shutter 91 from the open state to the closed state is referred to as a shutter closing operation. The operation of switching the upper holding devices 10A and 10B from the mountable state to the holding state is referred to as a holding switching operation. Further, the operation of moving the lower surface brush 51 so as to overlap with the initial contact area of the substrate W in a plan view and the operation of moving the lower surface brush 51 from the brush standby position toward the lower surface of the substrate W in the up-down direction are referred to as a brush preparation operation. In this case, the chuck control unit 9A, the base control unit 9C, the lower surface cleaning control unit 9E, and the carry-in/out control unit 9I in fig. 5 start respective operations so that at least a part of the shutter closing operation period, the holding switching operation period, and the brush preparation operation period overlap.

Next, the lower surface brush 51 is pressed against an initial contact area (lower surface center area in this example) of the substrate W. As shown by a thick solid arrow a6 in fig. 10, the lower surface brush 51 rotates (rotates) about an axis in the up-down direction. Thereby, the contaminant adhering to the central area of the lower surface of the substrate W is physically peeled off by the lower surface brush 51.

In the lower stage of fig. 10, an enlarged side view of a portion of the lower surface brush 51 in contact with the lower surface of the substrate W is shown in the bubble frame. As shown in the bubble frame, the substrate nozzle 52 and the gas discharge portion 53 are held at positions close to the lower surface of the substrate W in a state where the lower surface brush 51 is in contact with the substrate W. At this time, as indicated by the outline arrow a51, the substrate nozzle 52 ejects the cleaning liquid toward the lower surface of the substrate W at a position near the lower surface brush 51. Thereby, the cleaning liquid supplied from the substrate nozzle 52 to the lower surface of the substrate W is guided to the contact portion of the lower surface brush 51 and the substrate W, and the contaminant removed from the back surface of the substrate W by the lower surface brush 51 is rinsed away by the cleaning liquid.

Here, the upper surface 54u of the elevation support portion 54 is inclined obliquely downward in a direction away from the suction holding portion 21. In this case, when the cleaning liquid containing the contaminant is dropped from the lower surface of the substrate W onto the lifting support portion 54, the cleaning liquid caught by the upper surface 54u is guided in a direction away from the suction holding portion 21.

When the lower surface of the substrate W is cleaned by the lower surface brush 51, the gas ejection portion 53 ejects the gas toward the lower surface of the substrate W at a position between the lower surface brush 51 and the suction holding portion 21 as indicated by a hollow arrow a52 in the bubble frame in fig. 10. In the present embodiment, the gas ejection portion 53 is attached to the movable base 32 so that the gas ejection port extends in the X direction. In this case, when the gas is injected from the gas injection part 53 toward the lower surface of the substrate W, a band-like gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holding part 21. This prevents the cleaning liquid containing the contaminant from scattering toward the adsorption holding portion 21 when the lower surface of the substrate W is cleaned by the lower surface brush 51. Therefore, the cleaning liquid containing the contaminant is prevented from adhering to the suction holding portion 21 when the lower surface of the substrate W is cleaned by the lower surface brush 51, and the suction surface of the suction holding portion 21 is kept clean.

In the example of fig. 10, the gas discharge portion 53 discharges the gas obliquely upward from the gas discharge portion 53 toward the lower surface brush 51 as indicated by the hollow arrow a52, but the present invention is not limited thereto. The gas ejection portion 53 may eject the gas from the gas ejection portion 53 toward the lower surface of the substrate W along the Z direction.

Next, in the state of fig. 10, after the cleaning of the central area of the lower surface of the substrate W is completed, the elevating support 54 is lowered so that the cleaning surface of the lower surface brush 51 is spaced apart from the substrate W by a predetermined distance. In addition, the ejection of the cleaning liquid from the substrate nozzle 52 to the substrate W is stopped. At this time, the gas ejection portion 53 continues to eject the gas onto the substrate W.

Then, as shown by a thick solid arrow a7 in fig. 11, the movable base 32 is moved rearward so that the center of the suction holding portion 21 is located at the planar reference position rp in a plan view. That is, the movable base 32 moves toward the reference horizontal position. At this time, by continuing to spray the gas from the gas spraying portion 53 toward the substrate W, the central region of the lower surface of the substrate W is sequentially dried by the gas curtain.

Next, as shown by a thick solid arrow a8 in fig. 12, the lifting support portion 54 is lowered so that the cleaning surface of the lower surface brush 51 is positioned below the suction surface (upper end portion) of the suction holding portion 21. Thereby, the lower surface brush 51 is moved to the brush standby position. The lower surface brush 51 may be moved from a position contacting the lower surface of the substrate W to a brush standby position after cleaning the central region of the lower surface of the substrate W and before drying by the gas ejection section 53.

As shown by a thick solid arrow a9 in fig. 12, the upper chucks 12A and 12B are spaced apart from the outer peripheral end of the substrate W so that the upper chucks 12A and 12B are spaced apart from each other. Thereby, the upper holding devices 10A and 10B are switched from the holding state to the mountable state, and the substrate W is supported by the lower chucks 11A and 11B so as to be lifted. At the time of this switching, in a state where one of the upper chucks 12A, 12B is at the target position as described above, the other upper chuck is moved away from the one upper chuck. Thereby, the substrate W on the lower chucks 11A, 11B is accurately positioned in the X direction.

Thereafter, as shown by a thick solid arrow a10 in fig. 12, the pin coupling member 42 is raised so that the upper end portions of the plurality of support pins 41 are located slightly above the lower chucks 11A, 11B. Thereby, the substrate W supported by the lower chucks 11A, 11B is received by the plurality of support pins 41.

Next, as shown by a thick solid arrow a11 in fig. 13, the lower chucks 11A, 11B are moved away from each other. Thereby, the upper holding devices 10A and 10B are switched from the mountable state to the retracted state. At this time, the lower chucks 11A and 11B are positioned so as not to overlap the substrate W supported by the plurality of support pins 41 in a plan view. Thereby, the substrate W supported by the plurality of support pins 41 in the horizontal posture can be moved in the up-down direction (Z direction) between the upper holding devices 10A, 10B.

Next, as shown by a thick solid arrow a12 in fig. 14, the pin coupling member 42 is lowered so that the upper end portions of the plurality of support pins 41 are positioned below the suction holding portion 21. Thereby, the substrate W supported on the plurality of support pins 41 is received by the suction holding portion 21. In this state, the suction holding portion 21 suctions and holds the lower surface central region of the substrate W. Simultaneously with the lowering of the pin coupling member 42 or after the lowering of the pin coupling member 42 is completed, the shield 61 is raised from the lower shield position to the upper shield position as indicated by a thick solid arrow a13 in fig. 14.

Next, as shown by a thick solid arrow a14 in fig. 15, the suction holding portion 21 rotates about an axis in the up-down direction (the axial center of the rotation shaft of the suction holding driving portion 22). Thereby, the substrate W sucked and held by the suction holding portion 21 rotates in a horizontal posture.

Next, the rotation support shaft 71 of the upper surface washing apparatus 70 rotates and descends. Thereby, as shown by a thick solid arrow a15 in fig. 15, the spray nozzle 73 is moved to a position above the substrate W. The nozzle 73 is lowered so that the distance between the nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixed fluid of the cleaning liquid and the gas onto the upper surface of the substrate W. In addition, the rotation support shaft 71 rotates. Thereby, as shown by a thick solid arrow a16 in fig. 15, the spray nozzle 73 moves in a position above the substrate W that rotates. The entire upper surface of the substrate W is cleaned by spraying the mixed fluid to the entire upper surface of the substrate W.

When the upper surface of the substrate W is cleaned by the spray nozzle 73, the rotation support shaft 81 of the end cleaning device 80 is also rotated and lowered. Thereby, as shown by a thick solid arrow a17 in fig. 15, the bevel brush 83 moves to a position above the outer peripheral end portion of the substrate W. Further, the peripheral surface of the bevel brush 83 is lowered so that the central portion thereof contacts the peripheral end portion of the substrate W. In this state, the bevel brush 83 rotates (rotates) about an axis in the up-down direction. Thereby, the contaminant adhering to the outer peripheral end portion of the substrate W is physically peeled off by the bevel brush 83. The contaminant peeled off from the peripheral end portion of the substrate W is rinsed out by the cleaning liquid of the mixed fluid sprayed from the spray nozzle 73 to the substrate W.

When the upper surface of the substrate W is cleaned by the spray nozzle 73, the lifting support 54 is lifted so that the cleaning surface of the lower surface brush 51 contacts the outer region of the lower surface of the substrate W. As shown by a thick solid arrow a18 in fig. 15, the lower surface brush 51 rotates (rotates) about an axis in the up-down direction. Further, the substrate nozzle 52 ejects the cleaning liquid toward the lower surface of the substrate W, and the gas ejection portion 53 ejects the gas toward the lower surface of the substrate W. Accordingly, the entire outer region of the lower surface of the substrate W sucked and held by the suction holding portion 21 and rotated can be cleaned by the lower surface brush 51. The rotation direction of the lower surface brush 51 may be opposite to the rotation direction of the suction holding portion 21. In this case, the outer region of the lower surface of the substrate W can be efficiently cleaned.

The lifting support 54 may be configured to be movable relative to the lower holding device 20 in the Y direction on the movable base 32. In this case, as shown by a thick solid arrow a19 in fig. 15, the elevation support 54 is moved in the Y direction on the movable base 32. Thus, the range in which cleaning can be performed by the lower surface brush 51 is widened in a state where the movable base 32 is fixed to the predetermined position.

After the cleaning of the upper surface, the peripheral end portion, and the outer region of the lower surface of the substrate W is completed, the spraying of the mixed fluid from the spray nozzle 73 onto the substrate W is stopped. As indicated by a thick solid arrow a20 in fig. 16, the spray nozzle 73 is moved to a position on one side of the shroud 61 (a position in the initial state). As indicated by a thick solid arrow a21 in fig. 16, the bevel brush 83 is moved to a position on the other side of the shield 61 (a position in the initial state). Further, the elevation support 54 descends. Thereby, the lower surface brush 51 moves from a position in contact with the lower surface of the substrate W to the brush standby position. Further, the ejection of the cleaning liquid from the substrate nozzle 52 to the substrate W and the ejection of the gas from the gas ejection portion 53 to the substrate W are stopped. In this state, the suction holding portion 21 rotates at a high speed, so that the cleaning solution adhering to the substrate W is thrown off, and the entire substrate W is dried.

Next, as shown by a thick solid arrow a22 in fig. 17, the shroud 61 is lowered from the upper shroud position to the lower shroud position. Thereafter, the substrate W is carried out from the unit case 2 of the substrate cleaning apparatus 1. When the substrate W is carried out from the unit case 2, the shutter 91 is switched from the closed state to the open state (shutter opening operation) at a point immediately before a hand (substrate holding portion) Ma of a substrate carrying robot (not shown) enters the unit case 2.

Then, as shown by a thick solid arrow a23 in fig. 18, a hand (substrate holding portion) Ma of the substrate transfer robot enters the unit case 2 through the carry-in/out port 2 x. Then, the hand Ma receives the substrate W on the suction holding portion 21 and withdraws from the carry-in/out port 2 x. After the hand Ma is withdrawn, the shutter 91 is switched from the open state to the closed state (shutter closing operation).

After the substrate W is carried out, a new substrate W that has not been processed may be carried into the unit case 2 (the substrate W may be replaced). In this case, the chuck control unit 9A and the carry-in/out control unit 9I in fig. 5 start respective operations so that at least a part of the shutter-open operation period for carrying out the processed substrate W overlaps with at least a part of the mounting preparation operation period for receiving the unprocessed substrate W by the upper holding devices 10A and 10B.

As described above, the lower surface brush 51 rotates substantially continuously during the power-on of the substrate cleaning apparatus 1. The lower surface cleaning control unit 9E in fig. 5 controls the brush cleaning liquid supply unit 57 so that the brush cleaning liquid is supplied from the brush cleaning liquid supply unit 57 to the brush nozzles 52a and 52b in fig. 1 during a predetermined brushing period. In this case, the cleaning period may include a period in which the substrate W is not present in the unit case 2. The brushing period may include a period in which the lower surface brush 51 is located at the brush standby position in the up-down direction.

4. Effects of

(A) In the substrate cleaning apparatus 1, after the shutter 91 is switched from the closed state to the open state, the substrates W carried into the substrate cleaning apparatus 1 are placed on the upper holding devices 10A and 10B in the mountable state. Thereafter, the chuck control unit 9A, the base control unit 9C, the lower surface cleaning control unit 9E, and the carry-in/out control unit 9I in fig. 5 start respective operations so that at least a part of the shutter closing operation period, the holding switching operation period, and the brush preparation operation period overlap.

In this case, the period required for processing one substrate W is shortened by the amount of overlapping period of the period, compared with the case where each operation is performed such that the shutter closing operation period, the holding switching operation period, and the brush preparation operation period do not overlap. Therefore, the throughput of the substrate processing increases. The shutter closing operation after the substrate W is carried in, the holding switching operation of the upper holding devices 10A and 10B, and the brush preparation operation of the lower surface brush 51 are preferably started simultaneously. In this case, the overlapping period can be further increased.

(B) In the substrate cleaning apparatus 1, the upper holding devices 10A and 10B are in a retracted state in a state in which the substrate W is not present in the unit case 2 and the carry-in/out port 2x is closed by the shutter 91. In addition, the upper holding devices 10A, 10B are in a retracted state during a period after the substrate W is present in the unit case 2 and the substrate W is handed over from the upper holding devices 10A, 10B to the lower holding device 20.

When an unprocessed substrate W is carried into the substrate cleaning apparatus 1, the upper holding devices 10A and 10B must be placed in a mountable state in order to receive the carried-in substrate W. Therefore, the chuck control unit 9A and the carry-in/out control unit 9I in fig. 5 start respective operations so that the shutter-open operation period for carrying in the substrate W overlaps at least a part of the mounting preparation operation period of the upper holding devices 10A and 10B.

In this case, the period required for processing one substrate W is shortened by the amount of the overlapping period of the period, compared with the case where the respective operation periods are performed such that the barrier opening operation period does not overlap with the mounting preparation operation period of the upper holding devices 10A, 10B. Therefore, the throughput of the substrate processing increases. The shutter opening operation for loading the substrate W and the mounting preparation operation of the upper holding devices 10A and 10B are preferably performed simultaneously. In this case, the overlapping period can be further increased.

5. Other embodiments

(A) In the above embodiment, when the substrate W is carried into the substrate cleaning apparatus 1, at least a part of the shutter-open operation period for carrying in the substrate W overlaps with at least a part of the mounting preparation operation period. In addition, at least a part of the shutter closing operation period and the holding switching operation period after the substrate W is carried in overlaps with at least a part of the brush preparation operation period. However, the present invention is not limited to the examples.

When the shutter opening operation period for loading the substrate W overlaps at least a part of the loading preparation operation period, at least 2 periods among the shutter closing operation period, the holding switching operation period, and the brush preparation operation period after loading the substrate W may not overlap each other. In the case where at least a part of the shutter closing operation period, the holding switching operation period, and the brush preparation operation period after the substrate W is carried in is overlapped, the shutter opening operation period for carrying in the substrate W and the placement preparation operation period may not be overlapped. In these cases, by overlapping at least a part of 2 or more of the plurality of periods, the period required for processing one substrate W is also shortened by the amount of the overlapping period. Therefore, the throughput of the substrate processing increases.

As described above, 2 or more operations in which at least a part of the operation periods overlap each other are preferably started at the same time. In this case, since the overlapping period of these operation periods can be further increased, the throughput of the substrate processing can be further increased.

(B) In the substrate cleaning apparatus 1 of the above embodiment, the upper holding devices 10A and 10B are in the retracted state in a state where the substrate W is not present in the unit case 2 and the carry-in/carry-out port 2x is closed by the shutter 91, but the present invention is not limited thereto.

The upper holding devices 10A and 10B can be kept in a mountable state to receive unprocessed substrates W even when no substrates W are present in the unit case 2 and the carry-in/out port 2x is closed by the shutter 91. In this case, for example, when a single substrate W is carried out from the substrate cleaning apparatus 1 after processing the substrate W, the upper holding devices 10A and 10B must be switched from the retracted state to the mountable state.

Therefore, each operation may be performed so that at least a part of the mounting preparation operation period of the upper holding devices 10A and 10B overlaps with the shutter opening operation (or shutter closing operation) period for carrying out the substrate W. In this case, the period required for processing one substrate W is shortened by the amount of overlapping period of the period, compared to the case where each operation is performed so that the period of the shutter opening operation (or shutter closing operation) and the period of the mounting preparation operation do not overlap. Therefore, the throughput of the substrate processing increases.

(C) In the substrate cleaning apparatus 1 of the embodiment, after cleaning of the central region of the lower surface of the substrate W held by the upper holding devices 10A, 10B is performed, cleaning of the outer region of the lower surface of the substrate W held by the lower holding device 20 is performed, but the present invention is not limited thereto. After cleaning of the outer region of the lower surface of the substrate W is performed in the lower holding device 20, cleaning of the central region of the lower surface of the substrate W may be performed in the upper holding devices 10A and 10B. In this case, the substrate W carried into the substrate cleaning apparatus 1 is placed on the suction holding portion 21 of the holding device 20 above or below the plurality of support pins 41 of the transfer device 40. Therefore, for example, the shutter closing operation after the substrate W is carried in and the brush preparation operation for cleaning the outer region of the lower surface of the substrate W held by the lower holding device 20 are performed so that at least a part of the shutter closing operation period overlaps with at least a part of the brush preparation operation period. Thereby, the throughput of the substrate processing is improved.

(D) The substrate cleaning apparatus 1 of the embodiment includes the upper holding devices 10A and 10B and the lower holding device 20, but the present invention is not limited thereto. The substrate cleaning apparatus 1 may be provided with the upper holding devices 10A and 10B, and may not be provided with the lower holding device 20. In this case, the processing performed in the state of being held by the lower holding device 20 is omitted.

(E) In the above embodiment, the predetermined area (initial contact area) where the lower surface brush 51 should first contact the lower surface of the substrate W is set in the central area of the lower surface of the substrate W with respect to the substrate W held by the upper holding devices 10A and 10B, but the present invention is not limited thereto. The initial contact area may also be set at a position offset from the lower surface center area by a prescribed distance in the Y direction. In this case, when cleaning the central region of the lower surface of the substrate W, after the lower surface brush 51 comes into contact with the initial contact region, the movable base 32 moves so that the lower surface brush 51 moves from the initial contact region to the central region of the lower surface on the lower surface.

(F) The substrate cleaning apparatus 1 according to the above embodiment may further include a backwash nozzle for supplying a rinse liquid to an outer region of the lower surface of the substrate W suctioned and held by the lower holding device 20. Further, the substrate cleaning apparatus 1 may have a rinse nozzle for supplying a rinse solution to the upper surface of the substrate W suctioned and held by the lower holding device 20.

Fig. 19 is a schematic plan view of a substrate cleaning apparatus 1 according to another embodiment. Fig. 20 is a block diagram showing a configuration of a control system of the substrate cleaning apparatus 1 of fig. 19. The schematic top view of fig. 19 corresponds to the schematic top view of fig. 1. The block diagram of fig. 20 corresponds to the block diagram of fig. 5. Regarding the substrate cleaning apparatus 1 of fig. 19, different aspects from those of the substrate cleaning apparatus 1 of the embodiment will be described.

As shown in fig. 19, the substrate cleaning apparatus 1 of the present example includes an upper surface cleaning apparatus 210 in addition to upper holding apparatuses 10A and 10B, a lower holding apparatus 20, a base apparatus 30, a delivery apparatus 40, a lower surface cleaning apparatus 50, a shroud apparatus 60, an upper surface cleaning apparatus 70, an end cleaning apparatus 80, and an opening/closing apparatus 90.

The upper surface washing device 210 is provided adjacent to the end washing device 80 at a position lateral to the shroud 61 in the X direction. The upper surface rinsing device 210 includes a rotation support shaft 211, an arm 212, a rinsing nozzle 213, and a rinsing drive section 214.

The rotation support shaft 211 is supported by the flushing drive unit 214 so as to be vertically movable and rotatable on the bottom surface 2a so as to extend in the vertical direction. The arm 212 is provided above the upper holding device 10A so as to extend in the horizontal direction from the upper end portion of the rotation support shaft 211. A rinse nozzle 213 is attached to the distal end of the arm 212.

The rinse liquid supply unit 215 (fig. 20) is connected to the rinse nozzle 213. The rinse liquid supply unit 215 supplies rinse liquid to the rinse nozzle 213. In this example, pure water is used as the cleaning liquid supplied to the rinse nozzle 213. The rinse nozzle 213 ejects the rinse liquid supplied from the rinse liquid supply unit 215 onto the upper surface of the substrate W during or after the cleaning of the upper surface of the substrate W by the spray nozzle 73 and before the drying of the substrate W.

The flushing drive unit 214 includes one or a plurality of pulse motors, air cylinders, and the like, and lifts and lowers the rotation support shaft 211 and rotates the rotation support shaft 211. According to the above configuration, as shown by the thick dotted arrow in fig. 19, the rinse liquid can be supplied to the entire upper surface of the substrate W by moving the rinse nozzle 213 in an arc shape over the upper surface of the substrate W suctioned and held and rotated by the suction holding portion 21.

In addition, as described above, even when the substrate cleaning apparatus 1 further includes a backwash nozzle, the rinse liquid can be supplied to the lower surface of the substrate W suctioned and held and rotated by the suction holding portion 21. As described above, according to the substrate cleaning apparatus 1 of fig. 19, the upper and lower surfaces of the substrate W after or during cleaning can be rinsed.

As shown in fig. 20, the control device 170 of the present example includes a flushing control unit 9J in addition to the various control units described in fig. 5 as functional units. The function of the rinse control unit 9J is realized by the CPU executing the substrate cleaning program stored in the storage device on the RAM, as in the other control units. Part or all of the flushing control unit 9J may be realized by hardware such as an electronic circuit. The rinse control unit 9J controls the rinse drive unit 214 and the rinse liquid supply unit 215 to perform a rinse process on the upper surface of the substrate W suctioned and held by the suction holding unit 21.

(G) In the substrate cleaning apparatus 1 of the above embodiment, the transfer device 40 is provided to switch between a state in which the substrate W is held by the upper holding devices 10A and 10B and a state in which the substrate W is held by the lower holding device 20. The transfer device 40 moves up and down the substrates W relative to the upper holding devices 10A and 10B and the lower holding device 20 by lifting and lowering the plurality of support pins 41, thereby transferring the substrates W. The invention is not limited to the examples described.

The substrate cleaning apparatus 1 may be provided with a lift drive unit for lifting and lowering the lower holding device 20 relative to the upper holding devices 10A and 10B. Alternatively, a lifting drive unit may be provided to lift the upper holding devices 10A and 10B relative to the lower holding device 20. By performing the lifting operation of at least one of the lower holding device 20 and the upper holding devices 10A and 10B relative to the other, the transfer of the substrate W between the 2 holding devices can be performed without using the plurality of support pins 41. In this case, the delivery device 40 is not required.

(H) As in the above embodiment, in the case where the substrate cleaning liquid is the same as the cleaning liquid, 2 substrate nozzles 52 may not be provided. In this case, the cleaning liquid discharged from the brush nozzles 52a and 52b to the lower surface brush 51 can be used as the cleaning liquid for cleaning the substrate when cleaning the central region of the lower surface of the substrate W and when cleaning the outer region of the lower surface of the substrate W.

(I) In the substrate cleaning apparatus 1 of the above embodiment, the cleaning liquid is supplied from the 2 substrate nozzles 52 to the substrate W in the process of cleaning the lower surface central region of the substrate W by the lower surface brush 51, but the present invention is not limited to this.

In the substrate cleaning apparatus 1, the lower surface brush 51 may be cleaned in advance before the lower surface of the substrate W is cleaned by the lower surface brush 51, so that the cleaning liquid may be immersed in the lower surface brush 51. In this case, by bringing the lower surface brush 51 immersed in the cleaning liquid into contact with the lower surface of the substrate W, the lower surface of the substrate W can be cleaned in a state where the lower surface brush 51 is in contact with the substrate W, without supplying a new cleaning liquid.

6. Correspondence between each constituent element of the embodiment and each part of the embodiment

Hereinafter, examples of the correspondence between each constituent element of the present invention and each element of the embodiment will be described, but the present invention is not limited to the following examples. As each constituent element of the present invention, other various elements having the constitution or function described in the present invention may be used.

In the above embodiment, the substrate cleaning apparatus 1 is an example of a substrate processing apparatus, the carry-in/out port 2x is an example of an opening, the unit housing 2 is an example of a processing chamber, the shutter 91 is an example of a shutter, the shutter driving section 92 is an example of an opening/closing driving section, and the upper holding devices 10A and 10B are examples of substrate holding sections.

The lower surface brush 51 is an example of a brush, the base device 30, the lifting support portion 54, and the lower surface brush lifting drive portion 55B are examples of brush moving portions, the control device 170 is an example of a control portion, the lower chuck drive portions 13A and 13B and the upper chuck drive portions 14A and 14B are examples of holding drive portions, and the lower surface cleaning device 50 is an example of a cleaning portion.

7. Summary of the embodiments

The substrate processing apparatus according to item 1 (1) includes:

A processing chamber having an opening for loading and unloading a substrate;

a shutter configured to be capable of opening and closing the opening of the processing chamber;

An opening/closing drive unit that switches the shutter between a closed state in which the opening of the processing chamber is closed and an open state in which the opening of the processing chamber is opened;

a substrate holding unit provided in the processing chamber and configured to hold a substrate;

a brush provided in the processing chamber, the brush being in contact with a lower surface of a substrate to clean the lower surface;

A brush moving portion provided in the processing chamber and configured to be capable of moving the brush between a cleaning position in contact with the lower surface of the substrate held by the substrate holding portion and a standby position below the substrate holding portion and spaced apart from the substrate held by the substrate holding portion; and

And a control unit configured to control the opening/closing drive unit and the brush moving unit so as to start a shutter closing operation for switching the shutter from the open state to the closed state and a brush preparation operation for moving the brush from the standby position to the cleaning position so that the shutter closing operation overlaps at least a part of the brush preparation operation period when the shutter is in the open state and the brush is in the standby position.

In this substrate processing apparatus, for example, a plurality of substrates are sequentially subjected to cleaning processing. When a plurality of substrates are cleaned, the shutter in a closed state is switched to an open state, and the substrates are carried into the processing chamber through the opening. The carried-in substrate is held by the substrate holding portion. In addition, the shutter is switched from the open state to the closed state. The lower surface of the substrate held by the substrate holding portion is cleaned by a brush in the processing chamber in which the opening portion is closed. After the washing treatment, the shutter is switched from the closed state to the open state. The cleaned substrate is carried out from the processing chamber, and the next substrate is carried into the processing chamber. The series of actions is repeatedly performed on the next substrate.

The brush is held at a standby position, for example, while the substrate is not cleaned. Therefore, when cleaning the substrate, the brush must be moved from the standby position to the cleaning position. According to the substrate processing apparatus, the shutter closing operation period accompanying the substrate loading overlaps at least a part of the brush preparation operation period for cleaning the loaded substrate. The period in which these periods overlap is referred to as an overlapping period.

This shortens the period required for processing one substrate by the amount of overlapping period, compared with the case where the opening is closed by the shutter closing operation after the substrate is carried into the processing chamber, and the brush preparation operation is started. Therefore, the throughput of the substrate processing increases.

The substrate processing apparatus according to item (2) 2 includes:

A processing chamber having an opening for loading and unloading a substrate;

a holding drive unit configured to switch the substrate holding unit between a holding state in which the substrate is held and a mountable state in which the substrate is not held and the substrate is mountable;

a brush cleaning section provided in the processing chamber, the brush cleaning section being configured to be capable of bringing the brush into contact with the substrate held by the substrate holding section in the held state and cleaning a lower surface of the substrate; and

And a control unit configured to control the opening/closing drive unit and the holding drive unit so that the shutter closing operation of the shutter from the open state to the closed state and the holding switching operation of the substrate holding unit from the mountable state to the holding state are started so that the shutter closing operation overlaps at least a part of the holding switching operation period when the shutter is in the open state and the substrate holding unit is in the mountable state.

The substrate holding portion holds the substrate while in a holding state. The substrate holding unit is capable of receiving a substrate when in a mountable state and supporting the received substrate so as to be removable. Therefore, the substrate holding portion is in a state of being placed when receiving the substrate carried into the processing chamber. Then, the substrate holding unit is switched from the mountable state to the holding state by receiving the substrate, and holds the received substrate. According to the substrate processing apparatus, at least a part of the shutter closing operation period accompanying the substrate loading and the holding switching operation period for holding the loaded substrate by the substrate holding section overlap each other. The period in which these periods overlap is referred to as an overlapping period.

This shortens the period required for processing one substrate by the amount of overlapping period, compared with the case where the switching operation is started after the substrate is carried into the processing chamber and the opening is closed by the shutter closing operation. Therefore, the throughput of the substrate processing increases.

The substrate processing apparatus according to item (3) above includes:

A substrate holding portion configured to be capable of holding a substrate;

a brush for cleaning a lower surface of a substrate by contacting the lower surface;

a brush moving portion configured to be capable of moving the brush between a cleaning position in contact with the lower surface of the substrate held by the substrate holding portion in the held state, and a standby position below the substrate holding portion and spaced apart from the substrate held by the substrate holding portion; and

And a control unit configured to control the holding drive unit and the brush moving unit to start a holding switching operation for switching the substrate holding unit from the mountable state to the holding state and a brush preparation operation for moving the brush from the standby position to the cleaning position so that at least a part of the holding switching operation overlaps with at least a part of the brush preparation operation when the substrate holding unit is in the mountable state and the brush is in the standby position.

In this substrate processing apparatus, for example, a plurality of substrates are sequentially subjected to cleaning processing. When a plurality of substrates are washed, the substrates are held by the substrate holding portion. In addition, the lower surface of the substrate held by the substrate holding portion is cleaned by a brush. The series of actions is repeatedly performed on the next substrate.

The substrate holding portion holds the substrate while in a holding state. The substrate holding unit is capable of receiving a substrate when in a mountable state and supporting the received substrate so as to be removable. Therefore, the substrate holding portion is in a mountable state when receiving an unwashed substrate. Then, the substrate holding unit receives the substrate, and switches from the mountable state to the holding state, thereby holding the received substrate.

The brush is held at a standby position, for example, while the substrate is not cleaned. Therefore, when cleaning the substrate, the brush must be moved from the standby position to the cleaning position. According to the substrate processing apparatus, at least a part of a holding switching operation period for holding an uncleaned substrate and a brush preparation operation period for cleaning an uncleaned substrate overlap. The period in which these periods overlap is referred to as an overlapping period.

Thus, the period required for processing one substrate is shortened by the amount of the overlapping period, compared with the case where the brush preparation operation is started for one substrate which is not cleaned after the switching operation is maintained. Therefore, the throughput of the substrate processing increases.

The substrate processing apparatus according to item 4 (4) includes:

A processing chamber having an opening for loading and unloading a substrate;

A holding driving section that switches the substrate holding section between: a holding state in which a substrate is held at a predetermined holding position, a mountable state in which the substrate is not held at the holding position but is mountable, and a retracted state in which the substrate is standby at a position spaced from the holding position;

A control unit configured to control the opening/closing drive unit and the holding drive unit so that the shutter opening period overlaps at least a part of the mounting preparation period when the shutter is in the closed state and the substrate holding unit is in the retracted state, and a shutter opening operation for switching the shutter from the closed state to the open state, and a mounting preparation operation for switching the substrate holding unit from the retracted state to the mounting state.

The substrate holding portion holds the substrate while in a holding state. The substrate holding unit is capable of receiving a substrate when in a mountable state and supporting the received substrate so as to be removable. Therefore, the substrate holding portion is in a state of being placed when receiving the substrate carried into the processing chamber. Then, the substrate holding unit is switched from the mountable state to the holding state by receiving the substrate, and holds the received substrate. After the substrate is cleaned, the substrate holding portion is switched from the holding state to the mountable state. Thus, the cleaned substrate is transferred from the substrate holding portion to other constituent elements.

Here, the substrate holding unit is in a retracted state after the substrate is cleaned, for example. In this case, the substrate holding portion is prevented from interfering with the substrate or other constituent element at the holding position and the peripheral portion thereof. Therefore, when the next substrate is carried into the processing chamber after the substrate is cleaned and carried out, the substrate holding unit must be switched from the retracted state to the mountable state to receive the substrate.

According to the substrate processing apparatus, the shutter opening operation period accompanying the substrate loading overlaps at least a part of the loading preparation operation period for receiving the loaded substrate. The period in which these periods overlap is referred to as an overlapping period.

Thus, compared with the case where the shutter opening operation accompanying the substrate carrying-in is performed so that the operation periods do not overlap with each other, the period required for processing one substrate is shortened by the amount of overlapping period as compared with the case where the mounting preparation operation of the substrate holding section is performed. Therefore, the throughput of the substrate processing increases.

The substrate processing apparatus according to item 1, wherein the substrate processing apparatus according to item 5 is

The substrate processing apparatus further includes:

The control unit controls the holding drive unit in addition to the opening/closing drive unit and the brush moving unit so that the shutter closing operation, the brush preparation operation, and the holding switching operation in which the substrate holding unit is switched from the mountable state to the holding state are started so that at least a part of the shutter closing operation period, at least a part of the brush preparation operation period, and at least a part of the holding switching operation period overlap each other when the shutter is in the open state and the brush is in the standby position.

The substrate holding portion holds the substrate while in a holding state. The substrate holding unit is capable of receiving a substrate when in a mountable state and supporting the received substrate so as to be removable. Therefore, the substrate holding portion is in a state of being placed when receiving the substrate carried into the processing chamber. Then, the substrate holding unit is switched from the mountable state to the holding state by receiving the substrate, and holds the received substrate. According to the substrate processing apparatus, at least a part of the shutter closing operation period, at least a part of the brush preparation operation period, and at least a part of the hold switching operation period overlap each other. The period in which these periods overlap is referred to as an overlapping period.

Thus, compared with the case where the shutter closing operation, the brush preparation operation, and the holding switching operation are performed so that the operation periods do not overlap, the period required for processing one substrate is shortened by the amount of the overlapping period. Therefore, the throughput of the substrate processing is further improved.

(6) The substrate-treating method of 6

A substrate processing apparatus is used and,

The substrate processing apparatus includes:

A processing chamber having an opening for loading and unloading a substrate;

A shutter configured to be capable of opening and closing the opening of the processing chamber; and

A brush provided in the processing chamber, the brush being in contact with a lower surface of a substrate to clean the lower surface; and is also provided with

The substrate processing method includes the steps of:

Switching the shutter between a closed state in which the opening of the processing chamber is closed and an open state in which the opening of the processing chamber is opened;

Holding a substrate by a substrate holding portion in the processing chamber; and

Moving the brush between a cleaning position in contact with the lower surface of the substrate held by the substrate holding portion and a standby position below the substrate holding portion and spaced apart from the substrate held by the substrate holding portion in the processing chamber; and is also provided with

The step of switching the shutter includes causing the shutter to perform a shutter closing operation of switching the shutter from the open state to the closed state;

The step of moving the brush includes a brush preparation operation of moving the brush from the standby position to the washing position;

When the shutter is in the open state and the brush is in the standby position, the shutter switching step and the brush moving step are started so that at least a part of the shutter closing operation period overlaps with at least a part of the brush preparation operation period.

The brush is held at a standby position, for example, while the substrate is not cleaned. Therefore, when cleaning the substrate, the brush must be moved from the standby position to the cleaning position. According to the substrate processing method, the shutter closing operation period accompanying the substrate loading overlaps at least a part of the brush preparation operation period for cleaning the loaded substrate. The period in which these periods overlap is referred to as an overlapping period.

(7) The substrate processing method of 7]

A substrate processing apparatus is used and,

The substrate processing apparatus includes:

A processing chamber having an opening for loading and unloading a substrate;

A substrate holding unit provided in the processing chamber and configured to hold a substrate; and is also provided with

The substrate processing method includes the steps of:

Switching the substrate holding portion between a holding state in which the substrate is held and a mountable state in which the substrate is not held and the substrate is mountable in the processing chamber; and

In the processing chamber, the brush is contacted with the substrate held by the substrate holding part in the holding state, and the lower surface of the substrate is cleaned; and is also provided with

The step of switching the substrate holding portion includes the steps of: a holding switching operation for switching the substrate holding section from the mountable state to the holding state;

When the shutter is in the open state and the substrate holding portion is in the mountable state, the shutter switching step and the substrate holding portion switching step are started so that at least a part of the shutter closing operation period overlaps with at least a part of the holding switching operation period.

The substrate holding portion holds the substrate while in a holding state. The substrate holding unit is capable of receiving a substrate when in a mountable state and supporting the received substrate so as to be removable. Therefore, the substrate holding portion is in a state of being placed when receiving the substrate carried into the processing chamber. Then, the substrate holding unit is switched from the mountable state to the holding state by receiving the substrate, and holds the received substrate. According to the above substrate processing method, the shutter closing operation period accompanying the substrate loading overlaps at least a part of the holding switching operation period for holding the loaded substrate by the substrate holding section. The period in which these periods overlap is referred to as an overlapping period.

(8) The substrate processing method of 8

A substrate processing apparatus is used and,

The substrate processing apparatus includes:

A substrate holding portion configured to be capable of holding a substrate; and

A brush for cleaning a lower surface of a substrate by contacting the lower surface; and is also provided with

The substrate processing method includes the steps of:

switching the substrate holding portion between a holding state in which the substrate is held and a mountable state in which the substrate is not held and the substrate is mountable; and

Moving the brush between a cleaning position in contact with the lower surface of the substrate held by the substrate holding portion and a standby position below the substrate holding portion and spaced apart from the substrate held by the substrate holding portion; and is also provided with

When the substrate holding unit is in the mountable state and the brush is in the standby position, the step of switching the substrate holding unit and the step of moving the brush are started so that at least a part of the holding switching operation period overlaps with at least a part of the brush preparation operation period.

The brush is held at a standby position, for example, while the substrate is not cleaned. Therefore, when cleaning the substrate, the brush must be moved from the standby position to the cleaning position. According to the substrate processing method, at least a part of a holding switching operation period for holding an uncleaned substrate and a brush preparation operation period for cleaning an uncleaned substrate overlap. The period in which these periods overlap is referred to as an overlapping period.

(9) The substrate processing method of 9%

A substrate processing apparatus is used and,

The substrate processing apparatus includes:

A processing chamber having an opening for loading and unloading a substrate;

The substrate processing method includes the steps of:

in the processing chamber, the substrate holding portion is switched between the following states: a holding state in which a substrate is held at a predetermined holding position, a mountable state in which the substrate is not held at the holding position but is mountable, and a retracted state in which the substrate is standby at a position spaced from the holding position; and

The step of switching the shutter includes causing the shutter to perform a shutter opening operation of switching the shutter from the closed state to the open state;

The step of switching the substrate holding portion includes a mounting preparation operation of switching the substrate holding portion from the retracted state to the mounting state;

When the shutter is in the closed state and the substrate holding portion is in the retracted state, the shutter switching step and the substrate holding portion switching step are started so that at least a part of the shutter opening period overlaps with at least a part of the mounting preparation period.

According to the substrate processing method, the shutter opening operation period accompanying the substrate loading overlaps at least a part of the loading preparation operation period for receiving the loaded substrate. The period in which these periods overlap is referred to as an overlapping period.

Thus, compared with the case where the shutter opening operation accompanying the substrate loading and the mounting preparation operation of the substrate holding section are performed so that the operation periods do not overlap, the period required for processing one substrate is shortened by the amount of the overlapping period. Therefore, the throughput of the substrate processing increases.

The substrate processing method according to item (10) above, wherein the substrate processing method according to item 6 is

The substrate processing apparatus further includes the substrate holding portion,

The substrate processing method further comprises the steps of: the substrate holding part performs a holding switching operation for switching from a state in which the substrate is not held but can be placed to a state in which the substrate is held,

When the shutter is in the open state and the brush is in the standby position, the shutter switching step, the brush moving step, and the substrate holding portion switching step are started so that at least a part of the shutter closing operation period, at least a part of the brush preparation operation period, and at least a part of the holding switching operation period overlap each other.

According to the substrate processing apparatus and the substrate processing method of the embodiment, the throughput of substrate processing is improved, and the processing efficiency of the substrate is improved, so that the energy saving of substrate processing can be realized. In addition, when a chemical solution is used for processing the substrate, the use of an excessive chemical solution can be reduced with an increase in yield, and thus the global environmental pollution can be reduced.

Claims

1. A substrate processing apparatus includes:

A processing chamber having an opening for loading and unloading a substrate;

2. The substrate processing apparatus according to claim 1, further comprising: a holding drive unit configured to switch the substrate holding unit between a holding state in which the substrate is held and a mountable state in which the substrate is not held and the substrate is mountable;

3. A substrate processing apparatus includes:

A processing chamber having an opening for loading and unloading a substrate;

4. A substrate processing apparatus includes:

A substrate holding portion configured to be capable of holding a substrate;

5. A substrate processing apparatus includes:

A processing chamber having an opening for loading and unloading a substrate;

6. A substrate processing method using a substrate processing apparatus,

The substrate processing apparatus includes:

A processing chamber having an opening for loading and unloading a substrate;

The substrate processing method includes the steps of:

7. The substrate processing method according to claim 6, wherein

8. A substrate processing method using a substrate processing apparatus,

The substrate processing apparatus includes:

A processing chamber having an opening for loading and unloading a substrate;

The substrate processing method includes the steps of:

9. A substrate processing method using a substrate processing apparatus,

The substrate processing apparatus includes:

The substrate processing method includes the steps of:

10. A substrate processing method using a substrate processing apparatus,

The substrate processing apparatus includes:

A processing chamber having an opening for loading and unloading a substrate;

The substrate processing method includes the steps of: