CN118201327A - Uniform temperature plate, heat dissipation structure and power module - Google Patents

Abstract

The invention provides a temperature equalizing plate, a heat dissipation structure and a power module, which can improve the heat dissipation effect. The samming plate includes: an evaporation shell and a condensation shell; the evaporation shell is connected with the condensation shell; one side of the evaporation shell, which is away from the condensation shell, is used for installing a heat source; the evaporation shell is provided with at least one thickening part, the thickening part protrudes at one side of the evaporation shell facing the condensation shell, and the thickening part corresponds to the position of the heat source.

Description

Uniform temperature plate, heat dissipation structure and power module

Technical Field

The present invention relates to the field of heat dissipation technologies, and in particular, to a temperature equalizing plate, a heat dissipation structure, and a power module.

Background

In the existing heat dissipation field, such as microelectronics, semiconductors or other electronic devices, a soaking plate or a temperature equalizing plate is generally used to perform temperature equalizing heat dissipation, so as to ensure that a chip or an electronic device meets the operating temperature requirement.

When the conventional temperature equalizing plate is applied to high-power electronic equipment such as a high-power semiconductor module, even though the temperature equalizing plate is provided with non-uniform temperature distribution, the extremely high power density easily causes the burning phenomenon of working media of the temperature equalizing plate at hot spots, so that the thermal resistance of the temperature equalizing plate is increased sharply, and even the electronic equipment is possibly damaged.

Disclosure of Invention

The invention provides a temperature equalizing plate, a heat dissipation structure and a power module, which can improve the heat dissipation effect.

A first aspect of the present invention provides a temperature uniformity plate comprising: an evaporation shell and a condensation shell; the evaporation shell is connected with the condensation shell; one side of the evaporation shell, which is away from the condensation shell, is used for installing a heat source; the evaporation shell is provided with at least one thickening part, the thickening part protrudes at one side of the evaporation shell facing the condensation shell, and the thickening part corresponds to the heat source position.

According to one embodiment of the invention, the condensation housing has a recess which corresponds in position to the thickening and which is recessed on the side of the condensation housing facing the evaporation housing for adapting the thickening.

According to one embodiment of the invention, the spacing between the concave portion and the thickened portion is greater than or equal to the spacing between the evaporation shell and other portions of the condensation shell.

According to one embodiment of the invention, the concave portion is convex on a side of the condensing housing facing away from the evaporating housing; the thickness of the concave part is consistent with the thickness of other parts of the condensation shell.

According to one embodiment of the invention, each thickening covers the orthographic projection area of a single heat source; or each thickening covers an orthographic projection area of a plurality of heat sources.

According to one embodiment of the invention, the planar cross-sectional area of the thickening decreases in a direction from the evaporation shell to the condensation shell;

the thickening part is in the shape of a round table, an elliptical table, a stair table or a stair-shaped boss.

According to one embodiment of the present invention, further comprising a capillary assembly comprising a first capillary layer, a second capillary layer, and a plurality of first capillary columns; the first capillary layer is adhered to the surface of the evaporation shell facing the condensation shell; the second capillary layer is attached to the surface of the condensing shell, which faces the evaporating shell; the plurality of first capillary column supports are disposed between the first capillary layer and the second capillary layer.

According to one embodiment of the invention, the first capillary column comprises a support column, the surface of the support column being arranged as a capillary structure surface;

or the first capillary column comprises a support column and a powder ring expressed by the support column;

Or the first capillary column comprises a powder column.

According to one embodiment of the invention, the capillary assembly further comprises a plurality of second capillary columns, the plurality of second capillary columns being supportingly arranged between the first capillary layer and the second capillary layer and being circumferentially arranged at an edge region of the thickening.

The invention also provides a heat dissipation structure, which comprises a heat dissipation assembly and the temperature equalization plate in the previous embodiment; the heat dissipation assembly is arranged on one side of the condensation shell, which is away from the evaporation shell.

According to one embodiment of the invention, the soaking plate further comprises a base, wherein the base is connected with the soaking plate to form a liquid cooling cavity; the height of a part of the space of the liquid cooling cavity corresponding to the thickening part is lower than the height of other part of the space;

And one end of the heat dissipation assembly, which is close to the base, is flush.

According to one embodiment of the invention, the heat dissipating components are arranged at a higher density in the area corresponding to the thickening than in other areas.

The invention also provides a power module which comprises a power device and the temperature equalizing plate according to the embodiment; the power device is arranged on one side of the evaporation shell, which is opposite to the condensation shell.

According to one embodiment of the invention, the power device further comprises a metallized ceramic substrate, wherein the metallized ceramic substrate is integrally formed on the side of the evaporation shell, which is opposite to the condensation shell, and the power device is mounted on the metallized ceramic substrate.

The invention has the following beneficial effects:

In the embodiment of the invention, the evaporation shell is provided with the thickening part, the thickness of the evaporation shell is not consistent any more, the thickness of the thickening part is larger than the follow-up parts of other parts of the evaporation shell, the thickening part corresponds to the position of a heat source to be installed on the evaporation shell, namely, the thickness of the evaporation shell at the position corresponding to the position of the heat source is changed, the thickness of the evaporation shell is larger at the position with larger heat flux density, in other words, the thickening part is raised towards the direction of the condensation shell, in other words, the thickening part is raised towards the phase change cavity between the evaporation shell and the condensation shell, the evaporation surface at the thickening part can be increased, the condensation reflux is more facilitated, the heat dissipation performance of the thickening part is better, the temperature equalizing plate can enable the local heat flux density to be reduced through the diffusion of the thickening part, the local overheat is avoided, the possibility of burning out of working media at the hot spot position is reduced, and the heat dissipation effect is improved.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.

FIG. 1 is a schematic cross-sectional view of a temperature uniformity plate according to an embodiment of the present invention;

FIG. 2 is a schematic view of a partial structure of the temperature uniformity plate of FIG. 1;

FIG. 3 is a schematic sectional partial structure of a temperature equalizing plate with a heat source according to an embodiment of the present invention;

FIG. 4 is a schematic view of a condensation housing and its associated capillary structure according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a heat dissipating assembly disposed on a temperature equalization plate according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of a structure in which a heat dissipating component is disposed on a temperature equalizing plate and a heat source is installed in accordance with an embodiment of the present invention;

Fig. 7 is a schematic structural diagram of a heat dissipation assembly disposed on a temperature equalization plate according to another embodiment of the present invention.

The figure indicates:

Evaporation shell 100, thickening 101, condensation shell 200, recess 201, first capillary layer 301, second capillary layer 302, first capillary column 303, second capillary column 304, heat sink 400, heat source 500, connection layer 600, ceramic substrate 601, upper copper layer 602, lower copper layer 603, solder layer 604.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

The terms "first," "second," "third," "fourth" and the like in the description and in the claims and in the above drawings, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The technical scheme of the invention is described in detail below by specific examples. The following embodiments may be combined with each other, and some embodiments may not be repeated for the same or similar concepts or processes.

Referring to fig. 1 to 3, in one embodiment, the temperature uniformity plate may include: an evaporation case 100 and a condensation case 200. The evaporation shell 100 is connected with the condensation shell 200 to form a phase change cavity between the evaporation shell 100 and the condensation shell 200, wherein the phase change cavity is in a negative pressure environment and is injected with liquid working medium. The liquid working medium is evaporated by absorbing the heat of the evaporation shell 100, phase change occurs in the phase change cavity to become a gaseous working medium, the gaseous working medium reaches the condensation shell 200 to be condensed by releasing the heat, and the phase change occurs again to become the liquid working medium, so that heat exchange is circularly realized.

The liquid working medium can be injected into the phase change cavity in advance. Before the samming board is put into operation, evaporation shell 100 and condensation shell 200 lid back, the casing edge interconnect, the phase transition cavity that forms can have annotates the liquid mouth, and through annotating the air in the liquid mouth extraction phase transition cavity in order to form negative pressure environment to inject liquid working medium into the cavity, can block up annotate the liquid mouth and weld after accomplishing the injection, in order to form sealed phase transition cavity. The sealing mode of the liquid injection port is not limited to this, and other sealing modes can be adopted to realize the sealing of the phase change cavity. The liquid injection port can be arranged at a position far away from the heat source, for example, the four corners or the edge of the shell are not limited, and the subsequent heat dissipation work is not influenced as much as possible.

A capillary component may be disposed in the phase change cavity to assist in circulating the working medium, for example, after the gaseous working medium is condensed at the condensation housing 200 to form a liquid working medium, the liquid working medium is returned to the evaporation housing 100 through the capillary component. It will be appreciated that the specific composition and configuration of the capillary assembly is not intended to be limiting.

As shown in fig. 3, a heat source 500 may be installed at a side of the evaporation shell 100 facing away from the condensation shell 200. The number and positions of the heat sources 500 are not limited and may be determined as needed. The heat source 500 may be a semiconductor device, such as a power device, although the specific type of the heat source 500 is not limited, and any device having heat dissipation needs may be used.

With continued reference to fig. 1 to 3, the evaporation shell 100 has at least one thickening 101 (only one is shown in the figures), the thickening 101 being convex on the side of the evaporation shell 100 facing the condensation shell 200, in other words, the thickening 101 being convex in the direction of the condensation shell 200, it can be seen that the thickening 101 is convex on the evaporation shell 100 on the inside of the phase change cavity, and the side of the thickening 101 facing the heat source 500 is flush with the rest of the evaporation shell 100, i.e. the surface of the side of the evaporation shell 100 facing away from the condensation shell 200 is flat.

The reason why the thickening portion 101 protrudes at the side of the evaporation shell 100 facing the condensation shell 200 is that, on one hand, the protruding at the inner side of the phase change cavity can lengthen the steam flow path of the phase change cavity at the thickening portion 101, and at the same time, increase the heat dissipation surface area, which is more beneficial to the heat dissipation of the thickening portion, on the other hand, when the surface of the evaporation shell 100 facing the heat source 500 is flat, the volume of the heat dissipation structure can be not increased as much as possible when the temperature equalization plate is applied to the heat dissipation structure, compared with the conventional temperature equalization plate, the whole volume of the heat dissipation structure can be maintained as it is, in addition, the uneven surface of the heat source 500 can not be caused, and the difficulty in assembling connection of the temperature equalization plate and the heat source 500 and the difficulty in processing and manufacturing the heat source are reduced.

The thickened portion 101 corresponds to the position of the heat source 500 mounted on the evaporation shell 100, and as shown in fig. 3, the thickened portion 101 covers an orthographic projection area of the heat source 500, which is an orthographic projection area of the heat source 500 on the evaporation shell 100. Alternatively, each thickening 101 covers the orthographic projection area of a single heat source 500, that is, the thickening 101 and the heat source 500 are in one-to-one correspondence, the number and the positions are corresponding, and the thickening 101 may cover the orthographic projection positions of the corresponding heat source 500. Or each thickening 101 covers an orthographic projection area of a plurality of heat sources 500, for example, one thickening 101 may cover an orthographic projection area of two or more heat sources 500. Preferably, when the heat sources 500 are arranged in an array on the evaporation shell 100, one thickening portion 101 may cover a front projection area of one row or one column of the heat sources 500, which is not limited in particular.

Preferably, with continued reference to fig. 1-3, the planar cross-sectional area of the thickening 101 decreases in a direction from the evaporation shell 100 to the condensation shell 200. The direction from the evaporation case 100 to the condensation case 200 is simply referred to as a first direction, and the planar cross-sectional area refers to a cross-sectional area in a planar direction perpendicular to the first direction. Preferably, the planar cross-sectional area of the thickened portion 101 gradually decreases in the first direction, and the side edges of the thickened portion 101 gradually recede toward the center in the first direction, smoothly transitioning. In this way, the gaseous working medium can rise along the tapered side of the thickening portion 101, and the liquid working medium can flow back along the tapered side of the thickening portion 101, in other words, the above-mentioned manner can reduce the vapor diffusion resistance and the backflow resistance.

As shown in fig. 1 to 4, the shape of the thickening 101 may be a truncated cone, the side with the smaller circular area faces the condensation housing 200, and the side with the larger circular area faces the heat source 500, so that the planar cross-sectional area of the thickening 101 is gradually reduced in the first direction to reduce the vapor diffusion resistance and the backflow resistance.

It will be appreciated that the shape of the thickened portion 101 may be a truncated cone, but the shape of the thickened portion 101 may also include, but is not limited to, an elliptical cone, a stepped platform, or a stepped boss, and the planar cross-sectional area of the thickened portion 101 may be reduced in the direction from the evaporation shell 100 to the condensation shell 200 to various degrees, and the present invention is not limited thereto. The upper and lower surfaces of the thickened portion 101 are preferably flat, but are not limited thereto, and in case of necessity, one or both of the upper and lower surfaces of the thickened portion 101 may have irregularities.

The evaporation shell 100 with the thickening 101 may be formed as one piece, that is, by machining a piece of material, the evaporation shell 100 with the thickening 101 is obtained, and in this case, the material of the thickening 101 is the same as that of the other parts of the evaporation shell 100.

Alternatively, the evaporation shell 100 with the thickened portion 101 may be formed by connecting different components, for example, a plate-shaped shell may be first processed to form a concave structure, then a matched boss structure is filled in the concave structure, and the concave structure and the boss structure may be connected by welding or other manners, so as to obtain the evaporation shell 100 with the thickened portion 101. The boss structure and the plate-shaped housing may be made of the same material, or may be made of a material having a higher heat conduction property, so that the boss structure has a higher heat conduction property at the thickened portion 101, which is not particularly limited.

It is understood that how the thickening portion 101 is formed is not limited, and the processing manner may be determined according to practical situations, as long as the thickness of the thickening portion 101 is greater than the thickness of other portions of the evaporation shell 100, and the protrusion of the thickening portion 101 faces the condensation shell, and the position of the thickening portion 101 corresponds to the position of the heat source.

In the embodiment, the evaporation shell is provided with the thickening portion, the thickness of the evaporation shell is not consistent any more, the thickness of the thickening portion is larger than the follow-up thickness of other parts of the evaporation shell, the thickening portion corresponds to the position of a heat source to be installed on the evaporation shell, namely, the thickness of the evaporation shell corresponding to the position of the heat source is changed, the thickness of the evaporation shell is larger at the position with larger heat flux density, in other words, the thickening portion protrudes towards the direction of the condensation shell, in other words, the thickening portion protrudes towards the phase change cavity between the evaporation shell and the condensation shell, so that the evaporation surface at the thickening portion can be increased, condensation reflux is facilitated, the heat dissipation performance of the thickening portion is better, the temperature equalizing plate can enable the local heat flux density to be reduced through the diffusion of the thickening portion, local overheating is avoided, the possibility of burning of working media at the hot spot position is reduced, and the heat dissipation effect is improved.

Optionally, a high thermal conductivity member, such as a graphite sheet, may be disposed on the thickened surface facing the heat source to further reduce the heat flux density, where the high thermal conductivity member is preferably thinner, such as thinner than the other parts of the evaporation shell, and the specific thickness is not limited.

In one embodiment, with continued reference to fig. 1-3, the condensing shell 200 has a concave portion 201, the concave portion 201 corresponds in position to the thickened portion 101, and the concave portion 201 is recessed on a side of the condensing shell 200 facing the evaporating shell 100 to accommodate the thickened portion. In other words, the side of the concave portion 201 of the condensation housing 200 facing the phase change cavity is concave, which is just opposite to the thickened portion 201, and the concave portion 201 is used to cooperate with the thickened portion 201 to ensure that the channel thickness of the phase change cavity at the thickened portion 201 is suitable, preferably not reduced, and the thickness herein refers to the space between the condensation housing 200 and the evaporation housing 100.

Preferably, the concave shape of the concave portion 201 of the condensation housing 200 is just enough to accommodate the thickened portion 101 of the evaporation housing 100. For the concave portion 201, the concave shape is matched with the convex shape of the thickened portion, and it may be completely wrapped. In other words, the concave portion 201 of the condensation housing 200 is geometrically complementary to the thickened portion 101 of the evaporation housing 100. If the shape of the thickened portion 101 of the evaporation shell 100 is a truncated cone, the concave shape of the concave portion is also a truncated cone, and the shapes and sizes are matched, and other shapes are similar, which will not be described herein.

If the evaporation shell 100 has a plurality of thickened portions 101 with different sizes and shapes, the condensation shell 200 also has a plurality of concave portions 201, each concave portion 201 corresponds to one thickened portion 101, the positions of the concave portions 201 correspond to the positions of the thickened portions 101 one by one, and the shapes and the sizes of the concave portions 201 depend on the shapes and the sizes of the thickened portions 101.

Preferably, as shown in fig. 1 to 3, the distance between the concave portion 201 and the thickened portion 101 is equal to the distance between the evaporation shell 100 and the other portion of the condensation shell 200, in other words, the distance between the evaporation shell 100 and the condensation shell 200, whether between the concave portion 201 and the thickened portion 101 or between other portions, is kept constant. Of course, the spacing between the concave portion 201 and the thickened portion 101 may be larger than the spacing between the evaporation shell 100 and other portions of the condensation shell 200. Therefore, compared with a vapor chamber without a thickening part and a concave part, the vapor chamber has the advantages that the total volume of the vapor chamber inside is kept unchanged or increased, and the heat transfer limit of the vapor chamber is kept unchanged or increased.

Alternatively, referring to fig. 1 to 3, the concave portion 201 is protruded at a side of the condensation housing 200 opposite to the evaporation housing 100, that is, the concave portion 201 is recessed at one side of the surface phase evaporation housing 100 and protruded at the other side, so that the thickness of the concave portion 201 is not too thick, and the heat exchanging effect of the condensation housing is ensured. Preferably, the thickness of the concave portion is uniform with the thickness of the other portions of the condensing housing, that is, the thickness of the condensing housing is uniform, whether concave or not. Compared with the traditional temperature equalizing plate, the concave part 201 is arranged on the condensation shell 200, so that the surface area of the position of the concave part 201 is increased, the condensation heat resistance of steam can be reduced, the circulation speed of working medium is accelerated, and the performance of the temperature equalizing plate is improved.

In addition, since the concave portion 201 protrudes from one side of the condensation housing 200 facing away from the evaporation housing 100, when the vapor chamber is applied to a heat dissipation structure, for example, when a base is mounted on one side of the condensation housing facing away from the evaporation housing 100 to form a liquid cooling cavity, the distance between the concave portion 201 and the base is smaller than the distance between other parts of the condensation housing 200 and the base, so that the local through-flow cross-sectional area of the liquid cooling cavity corresponding to the concave part can be reduced, that is, the through-flow area of the liquid cooling cavity corresponding to the heat source is smaller, the flow speed of the working medium is increased, local heat exchange is enhanced, the hot spot temperature is reduced, and the non-uniformity of the temperature can be weakened.

In one embodiment, the temperature uniformity plate may further comprise a capillary assembly, which may comprise a first capillary layer 301, a second capillary layer 302, and a plurality of first capillary columns 303, referring to fig. 1-4. The first capillary layer 301 is adhered to the surface of the evaporation shell 100 facing the condensation shell 200; the second capillary layer bonding 302 is disposed on the surface of the condensation housing 200 facing the evaporation housing 100; a plurality of first capillary columns 303 are supportingly disposed between the first capillary layer 301 and the second capillary layer 302. The plurality of first capillary columns 303 may be uniformly distributed within the phase change cavity; or the arrangement density of the plurality of first capillary columns 303 is higher at the positions of the thickening part 101 and the concave part 201, namely, the positions are provided with a plurality of first capillary columns 303 so as to enhance the reflux effect of the liquid working medium and improve the heat dissipation effect at the positions. The size of the plurality of first capillary columns 303 is not limited and may be as desired.

The first capillary columns 303 can play a supporting role, ensure the strength of the structure of the temperature equalization plate, and play an auxiliary role of gas-liquid circulation, such as a liquid return capillary channel as a liquid working medium.

Alternatively, the first capillary column 303 may include a support column whose surface is provided as a capillary structure surface, which reduces the liquid reflux resistance while securing the strength. For example, micro-channels can be processed on the surface of the support column as the surface of the capillary structure, and the specific forming mode and shape are not limited. The surface of the support column is set to be a capillary structure surface, so that an additional capillary structure outside the support column can be unnecessary.

Or the first capillary column 303 may comprise a support column to provide a ring of powder on the surface of the support column. For example, a circle of powder rings can be sintered on the surface of the support column, so that the strength is improved, and the liquid backflow resistance is reduced. The powder ring is made of high heat conduction material, preferably copper powder.

The support column has heat conducting performance, certain rigidity and certain supporting effect, for example, copper can be adopted, preferably a cylindrical copper column, and the specific shape and the material are not limited.

Alternatively, the first capillary column 303 may comprise a powder column, and the powder column is made of a high heat conduction material, preferably, the powder column is sintered by copper powder. The powder column can reduce the reflux resistance and provide a certain supporting effect.

It will be appreciated that the capillary assembly of the temperature equalization plate can be added or modified on the basis of the above, and can be reduced, depending on the actual needs.

The evaporation shell 100 and the condensation shell 200 may be made of a high thermal conductive material, which may preferably be copper. The first capillary layer 301 and the second capillary layer 302 may be mesh, powder or composite, and the material is a high heat conductive material, preferably copper. For example, the first capillary layer 301 and the second capillary layer 302 may have a copper powder sintered structure, and the first capillary layer 301 is subjected to hydrophilic surface treatment, and the second capillary layer 302 is subjected to hydrophobic surface treatment.

In operation, the liquid working medium returns to the evaporation shell 100 through the capillary assembly (sequentially passing through the second capillary layer 302, the first capillary column 303 and the first capillary layer 301), absorbs heat conducted by the evaporation shell 100, and evaporates into the phase change cavity (the phase change cavity can also be regarded as a steam channel) to become a gaseous working medium until being condensed by the condensation shell 200 to become a liquid working medium again. The liquid working medium can be any liquid capable of absorbing heat and changing phase into gaseous working medium, such as water, alcohol and the like, and is not particularly limited.

In one embodiment, with continued reference to fig. 1-4, the capillary assembly may further include a plurality of second capillary columns 304, the plurality of second capillary columns 304 being supportingly disposed between the first capillary layer 301 and the second capillary layer 302 and being circumferentially disposed at an edge region of the thickening 101, or the concave portion 201. When the thickening 101 is in the form of a truncated cone, the edge region of the thickening 101 may be a lateral surface of the truncated cone, or a stepped surface. As shown in fig. 4, the concave portion is formed as a truncated cone, and the plurality of second capillary columns 304 are circumferentially arranged on the side surface of the truncated cone.

In other words, the plurality of second capillary columns 304 corresponds to the circumferential capillary structure of the thickened portion 101 and the concave portion 201, and can shorten the liquid return path and reduce the return resistance.

The invention also provides a heat dissipation structure, which comprises a heat dissipation assembly and the temperature equalization plate in the embodiment. Referring to fig. 1-3 and 5-7, a heat sink assembly 400 is disposed on a side of the condensing housing 200 facing away from the evaporating housing 100. Alternatively, the heat dissipation assembly 400 may include pin-fin as shown in fig. 1-3 and 5-6, or the heat dissipation assembly 400 may include fins as described in fig. 7, and the specific composition and configuration of the heat dissipation assembly 400 is not limited.

Preferably, referring to fig. 1 to 3 and 5, the heat dissipating assembly 400 is arranged at a higher density in the area corresponding to the thickened portion 101 than in other areas, so that a better heat exchanging effect and better heat dissipating performance can be achieved locally.

The heat dissipation assembly 400 and the condensation housing 200 may be integrally formed or separately manufactured and connected to the condensation housing 200 by welding or the like. Another possible processing method is to process the heat dissipating assembly and the heat dissipating substrate (not shown in the figure) together, and then connect the heat dissipating substrate and the condensation housing 200 together, so as to connect the heat dissipating assembly 400 and the condensation housing 200, where the heat dissipating substrate is made of a high heat conductive material as an intermediate connection plate.

In one embodiment, the heat dissipation structure further includes a base (not shown in the figure), where the base is connected to the soaking plate to form a liquid cooling cavity, and in particular, the base is connected to the condensation housing to form a liquid cooling cavity. Of course, in some examples, if the heat dissipating component is first processed with the heat dissipating substrate (not shown in the figures) and then the heat dissipating substrate is connected with the condensation housing 200, the base may be connected with the heat dissipating substrate to form a liquid cooling cavity, which is not limited in particular.

The height of the partial space of the liquid cooling cavity corresponding to the thickening part is lower than the height of the other partial spaces. Referring to fig. 1 to 3, in one embodiment, the concave portion 201 protrudes on a side of the condensation housing 200 facing away from the evaporation housing 100, so that if the base is connected to the condensation housing 200 to form a liquid cooling cavity, a space between the base and the condensation housing is smaller than a space between other portions of the liquid cooling cavity and the base, that is, a height of a portion of the liquid cooling cavity corresponding to the thickened portion is lower than a height of another portion of the liquid cooling cavity.

The liquid cooling cavity can be provided with a liquid inlet and a liquid outlet, cooling liquid can enter from the liquid inlet and finally flow out from the liquid outlet, and heat is absorbed in the liquid cooling cavity in the middle. According to the law of flow conservation, when the through-flow sectional area becomes smaller, the flow velocity of the cooling liquid can be increased, so that the height of the partial space of the liquid cooling cavity corresponding to the thickening part is lower than that of other partial spaces, the through-flow sectional area corresponding to the heat source is smaller, the flow speed of the working medium is faster, the convection heat exchange is stronger, the local heat exchange is enhanced, the hot spot temperature is reduced, and the non-uniformity of the temperature is further weakened.

Optionally, as shown in fig. 1 to 3 and 5, the heat dissipating component 400 is flush near one end of the base, and due to the height difference in the liquid cooling cavity, the heat dissipating component 400 is also level difference, so as to ensure that the one end near the base is flush, ensure that the distance between the heat dissipating component 400 and the base is uniform, or ensure that the heat dissipating component 400 is uniformly contacted with the base, the heat dissipating component 400 is configured to have a shorter height at a portion corresponding to the thickening portion, a smaller through-flow cross-sectional area and a faster liquid flow speed, and the heat dissipating component 400 is configured to be denser and have better heat exchanging performance.

The invention also provides a power module which comprises a power device and the temperature equalizing plate in the embodiment. Of course, the power module may also incorporate the related embodiments of the heat dissipation structure, that is, the power device is mounted on the heat dissipation structure, and the heat dissipation structure also includes the temperature equalizing plate in the above embodiments, so that the mounting manners are the same and all are mounted on the temperature equalizing plate.

Referring to fig. 1-3 and 6, the power device is mounted as a heat source 500 on the side of the evaporation housing 100 facing away from the condensation housing 200. The number of power devices may be one or more, and fig. 6 shows 5 power devices as the heat source 400, and the specific number is not limited.

Although the heat source is not shown in fig. 7, in fact, a row of heat sources is arranged on the evaporation shell 100, and a thickening portion 101 may cover the orthographic projection area of the row of heat sources 500, and the thickening portion 101 may be elongated as shown in fig. 7 and may have a trapezoid cross section, and may be considered to have a trapezoid shape. Although the heat dissipation assembly 400 in fig. 7 is a fin, it may be actually changed to other types, such as a pin rib, which is not limited in particular.

In one embodiment, referring to fig. 3 and 6, the power module may further include a connection layer 600, the connection layer 600 sequentially forming a solder layer 604, a lower copper layer 603, a ceramic substrate 601, an upper copper layer 602 on the evaporation case 100, and the heat source 500 is mounted on the upper copper layer 602. However, in this method, the number of connection layers is large, and the manufacturing is complicated.

In a preferred embodiment, the connection layer may be a metallized ceramic substrate, and the metallized ceramic substrate is integrally formed on a side of the evaporation shell facing away from the condensation shell, and the power device is mounted on the metallized ceramic substrate. The ceramic and the upper shell are combined together through a surface metallization technology or an active brazing technology to form a metallized ceramic substrate, so that the use of heat conducting materials such as a solder layer, a copper layer and the like can be reduced, the manufacturing process is simplified, and the manufacturing materials are saved.

The power device can be a high-power device, such as a power device with power greater than 800W, if a traditional soaking plate is adopted, the risk of burning out exists, and the adoption of the soaking plate of the embodiment of the invention can reduce the local heat flow density at the position corresponding to the heat source, improve the heat dissipation effect at the position and avoid the risk of burning out.

The power module described above may be applied to a motor controller, and further may be applied to a vehicle, although the specific application scenario is not limited.

The invention also provides a motor controller comprising the power module in the embodiment.

The invention also provides a vehicle comprising a motor controller as in the previous embodiments.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.

Claims (14)

1. A temperature equalization plate, comprising: an evaporation shell and a condensation shell; the evaporation shell is connected with the condensation shell; one side of the evaporation shell, which is away from the condensation shell, is used for installing a heat source; the evaporation shell is provided with at least one thickening part, the thickening part protrudes at one side of the evaporation shell facing the condensation shell, and the thickening part corresponds to the heat source position.

2. The vapor lock of claim 1, wherein the condensing shell has a concave portion corresponding in position to the thickened portion and recessed on a side of the condensing shell facing the evaporating shell to accommodate the thickened portion.

3. The vapor chamber of claim 2, wherein a spacing between the concave portion and the thickened portion is greater than or equal to a spacing between the evaporation shell and other portions of the condensation shell.

4. The vapor chamber of claim 2, wherein the concave portion is convex on a side of the condensing housing facing away from the evaporating housing; the thickness of the concave part is consistent with the thickness of other parts of the condensation shell.

5. The isopipe of claim 1 wherein each thickening covers the orthographic projection area of a single heat source; or each thickening covers an orthographic projection area of a plurality of heat sources.

6. The vapor lock of claim 1, wherein the planar cross-sectional area of the thickening decreases in a direction from the evaporation shell to the condensation shell;

the thickening part is in the shape of a round table, an elliptical table, a stair table or a stair-shaped boss.

7. The temperature uniformity plate according to claim 1, further comprising a capillary assembly comprising a first capillary layer, a second capillary layer, and a plurality of first capillary columns; the first capillary layer is adhered to the surface of the evaporation shell facing the condensation shell; the second capillary layer is attached to the surface of the condensing shell, which faces the evaporating shell; the plurality of first capillary column supports are disposed between the first capillary layer and the second capillary layer.

8. The isopipe of claim 7 wherein the first capillary column comprises support columns, the surfaces of the support columns being configured as capillary structured surfaces;

or the first capillary column comprises a support column and a powder ring expressed by the support column;

Or the first capillary column comprises a powder column.

9. The temperature uniformity plate according to claim 7, wherein said capillary assembly further comprises a plurality of second capillary columns, said plurality of second capillary column supports being disposed between said first capillary layer and said second capillary layer and being circumferentially disposed at an edge region of said thickening.

10. A heat dissipation structure comprising a heat dissipation assembly and a temperature equalizing plate according to any one of claims 1 to 9; the heat dissipation assembly is arranged on one side of the condensation shell, which is away from the evaporation shell.

11. The heat dissipating structure of claim 10, further comprising a base coupled to said vapor chamber to form a liquid cooled cavity; the height of a part of the space of the liquid cooling cavity corresponding to the thickening part is lower than the height of other part of the space;

And one end of the heat dissipation assembly, which is close to the base, is flush.

12. The heat dissipating structure of claim 10, wherein an arrangement density of the heat dissipating components is higher in a region corresponding to the thickening than in other regions.

13. A power module comprising a power device and a temperature equalizing plate according to any one of claims 1-9; the power device is arranged on one side of the evaporation shell, which is opposite to the condensation shell.

14. The power module of claim 13 further comprising a metallized ceramic substrate integrally formed on a side of the evaporation housing facing away from the condensation housing, the power device being mounted on the metallized ceramic substrate.