CN118175789A - Power module, motor controller, power assembly and vehicle - Google Patents

Abstract

The invention discloses a power module, a motor controller, a power assembly and a vehicle, wherein the power module comprises: the circuit assembly comprises a first circuit assembly and a second circuit assembly which are electrically connected; the first radiating plate is arranged between the first circuit component and the second circuit component; the second cooling plate and the third cooling plate, the second cooling plate is located one side of keeping away from first heating plate of first circuit subassembly, and the third cooling plate is located one side of keeping away from first heating plate of second circuit subassembly, and first heating plate and second cooling plate are used for the heat dissipation of first circuit subassembly, and first heating plate and third cooling plate are used for the heat dissipation of second circuit subassembly. According to the power module, three layers of heat dissipation can be realized, the heat dissipation effect is better, the heat dissipation efficiency is improved, and the compact structure is ensured.

Description

Power module, motor controller, power assembly and vehicle

Technical Field

The invention relates to the technical field of automobiles, in particular to a power module, a motor controller, a power assembly and a vehicle.

Background

In the related art, a power module is used for converting direct current into three-phase alternating current, and when the power module works, the power module can generate a large amount of heat, so that the temperature is increased, the performance of the power module can be limited, and even the power module fails.

Disclosure of Invention

The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present invention is to provide a power module, which can realize three-layer heat dissipation, has a better heat dissipation effect, improves heat dissipation efficiency, and ensures compact structure.

Another object of the present invention is to provide a motor controller having the above power module.

It is still another object of the present invention to provide a powertrain having the above motor controller.

It is a further object of the present invention to provide a vehicle having the above powertrain.

According to an embodiment of the invention, a power module includes: a circuit assembly including a first circuit assembly and a second circuit assembly electrically connected; the first radiating plate is arranged between the first circuit component and the second circuit component; the second cooling plate is arranged on one side, far away from the first cooling plate, of the first circuit component, the third cooling plate is arranged on one side, far away from the first cooling plate, of the second circuit component, the first cooling plate and the second cooling plate are used for cooling the first circuit component, and the first cooling plate and the third cooling plate are used for cooling the second circuit component.

According to the power module provided by the embodiment of the invention, the first radiating plate is arranged between the first circuit component and the second circuit component, the second radiating plate is arranged on one side, far away from the first radiating plate, of the first circuit component, the third radiating plate is arranged on one side, far away from the first radiating plate, of the second circuit component, the first radiating plate and the second radiating plate are used for radiating the first circuit component, and the first radiating plate and the third radiating plate are used for radiating the second circuit component, so that the temperature of the power module is effectively reduced in a three-layer radiating mode, the structure that the power module for realizing double-sided radiating in the related technology needs to be increased, the influence of the heightening is eliminated, the structure is compact, the radiating efficiency of the power module is improved, and the normal work of the power module is ensured.

In addition, the power module according to the above embodiment of the present invention may further have the following additional technical features:

According to some embodiments of the invention, the first circuit assembly and the second circuit assembly each comprise: a chip layer; the first circuit board and the second circuit board are respectively arranged on two opposite sides of the chip layer, the first circuit board is positioned on one side of the chip layer, which is close to the first heat dissipation plate, and the first circuit board and the second circuit board are used for providing functions of supporting and electric connection for the chip layer.

According to some embodiments of the invention, the chip layer of the first circuit assembly is used for placing an upper bridge chip and the chip layer of the second circuit assembly is used for placing a lower bridge chip.

According to some embodiments of the invention, the first circuit board and the second circuit board each comprise: a substrate; the first copper layer is arranged on one side of the substrate, which is close to the chip layer, the first copper layer of the second circuit board in the first circuit component is electrically connected with the first copper layer of the first circuit board in the second circuit component, an alternating current signal output terminal is led out, a direct current input positive terminal is led out from one end of the first copper layer of the first circuit board in the first circuit component, and a direct current input negative terminal is led out from one end of the first copper layer of the second circuit board in the second circuit component.

According to some embodiments of the invention, the first circuit board and the second circuit board each comprise: and the second copper layer is arranged on one side of the substrate far away from the chip layer.

According to some embodiments of the invention, the power module further comprises: and the two ends of the copper strip in the length direction are respectively connected with the first copper layer of the second circuit board in the first circuit assembly and the first copper layer of the first circuit board in the second circuit assembly.

According to some embodiments of the invention, an insulating layer is provided between the copper strip and the first heat sink.

According to some embodiments of the invention, the ac signal output terminal, the dc input positive terminal, and the dc input negative terminal are all located on the same side of the first heat sink.

According to some embodiments of the invention, the ac signal output terminal, the dc input positive terminal and the dc input negative terminal are all plural and staggered.

According to some embodiments of the invention, a trench is etched on the first copper layer of the second circuit board of the first circuit assembly to form an upper bridge gate via and an upper gate signal terminal is led out, and a trench is etched on the first copper layer of the second circuit board of the second circuit assembly to form a lower bridge gate via and a lower gate signal terminal is led out.

According to some embodiments of the invention, the upper gate signal terminal and the lower gate signal terminal are located on the same side of the first heat dissipation plate, and the upper gate signal terminal and the lower gate signal terminal are all multiple and staggered.

According to some embodiments of the invention, a welding layer is arranged between the chip layer and the first circuit board and the second circuit board; and/or a welding layer is arranged between the second circuit board of the first circuit component and the second heat dissipation plate; and/or a welding layer is arranged between the first circuit board of the first circuit component and the first heat dissipation plate; and/or a welding layer is arranged between the second circuit board of the second circuit assembly and the third heat dissipation plate; and/or a welding layer is arranged between the first circuit board and the first heat dissipation plate of the second circuit component.

According to some embodiments of the invention, the circuit assembly is one or a plurality of circuit assemblies spaced along the length direction of the first heat dissipation plate, and when the circuit assembly is a plurality of circuit assemblies, the circuit assemblies are not connected with each other.

According to some embodiments of the invention, the first heat spreader plate, the second heat spreader plate, and the third heat spreader plate are each provided with a plurality of spaced apart pin fins; or, a plurality of fins are arranged on the first heat dissipation plate, the second heat dissipation plate and the third heat dissipation plate.

According to some embodiments of the invention, the power module further comprises: the circuit assembly, first heating panel to the third heating panel all is located on the support, first cooling channel has in the first heating panel, the both sides of support have intercommunication first import and the first export of first cooling channel.

The motor controller according to an embodiment of the present invention includes: according to the power module disclosed by the embodiment of the invention; the power module is arranged in the shell, a second cooling channel is defined between the second radiating plate and the shell, and a third cooling channel is defined between the third radiating plate and the shell.

According to the motor controller disclosed by the embodiment of the invention, the first radiating plate is arranged between the first circuit component and the second circuit component, the second radiating plate is arranged on one side, far away from the first radiating plate, of the first circuit component, the third radiating plate is arranged on one side, far away from the first radiating plate, of the second circuit component, the first radiating plate and the second radiating plate are used for radiating the first circuit component, and the first radiating plate and the third radiating plate are used for radiating the second circuit component, so that the temperature of the power module is effectively reduced in a three-layer radiating mode, the structure that the power module for realizing double-sided radiating in the related art needs to be increased, the influence of the heightening is eliminated, the structure is compact, the radiating efficiency of the power module is improved, and the normal work of the power module is ensured.

A powertrain according to an embodiment of the present invention includes: a motor; according to the motor controller provided by the embodiment of the invention, the motor controller is connected with the motor and is used for controlling the motor.

According to the power assembly provided by the embodiment of the invention, the first radiating plate is arranged between the first circuit component and the second circuit component, the second radiating plate is arranged on one side, far away from the first radiating plate, of the first circuit component, the third radiating plate is arranged on one side, far away from the first radiating plate, of the second circuit component, the first radiating plate and the second radiating plate are used for radiating the first circuit component, and the first radiating plate and the third radiating plate are used for radiating the second circuit component, so that the temperature of the power module is effectively reduced in a three-layer radiating mode, the structure that the power module for realizing double-sided radiating in the related art needs to be increased, the influence of the heightening is eliminated, the structure is compact, the radiating efficiency of the power module is improved, and the normal work of the power module is ensured.

A vehicle according to an embodiment of the invention comprises a powertrain according to an embodiment of the invention.

According to the vehicle provided by the embodiment of the invention, the first radiating plate is arranged between the first circuit component and the second circuit component, the second radiating plate is arranged on one side, far away from the first radiating plate, of the first circuit component, the third radiating plate is arranged on one side, far away from the first radiating plate, of the second circuit component, the first radiating plate and the second radiating plate are used for radiating the first circuit component, and the first radiating plate and the third radiating plate are used for radiating the second circuit component, so that the temperature of the power module is effectively reduced in a three-layer radiating mode, the structure that the power module for realizing double-sided radiating in the related technology needs to be increased in a heightening structure for supporting the circuit component is omitted, the influence of heightening is eliminated, the structure is ensured to be compact, the radiating efficiency of the power module is favorably improved, and the normal work of the power module is ensured.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

fig. 1 is a schematic view showing a partial structure of a power module according to a first embodiment of the present invention;

fig. 2 is a top view of a power module according to a first embodiment of the invention;

fig. 3 is a left side view of a power module according to a first embodiment of the present invention;

fig. 4 is a front view of a power module according to a first embodiment of the present invention;

fig. 5 is a front view of a power module according to a first embodiment of the present invention (wherein the housing and bracket are not shown);

Fig. 6 is a front view of a power module according to a second embodiment of the present invention (wherein the housing and bracket are not shown);

Fig. 7 is a front view of a power module according to a third embodiment of the present invention (wherein the housing and bracket are not shown);

FIG. 8 is a schematic diagram of an angle configuration of a circuit assembly of a power module according to an embodiment of the invention;

FIG. 9 is a schematic diagram of another angle of circuit assembly of a power module according to an embodiment of the invention;

FIG. 10 is a schematic diagram of a further angle of circuit assembly of a power module according to an embodiment of the invention;

FIG. 11 is a schematic diagram of a further angle of circuit assembly of a power module according to an embodiment of the invention;

fig. 12 is a schematic structural view of a first circuit component of a power module according to an embodiment of the present invention;

fig. 13 is a schematic structural view of a second circuit component of the power module according to an embodiment of the present invention;

Fig. 14 is a schematic structural view of circuit components of a power module according to an embodiment of the present invention (wherein a second circuit board of the first circuit component is not shown);

fig. 15 is a schematic view of a structure of a current path of a power module according to an embodiment of the present invention;

Fig. 16 is a partial structural schematic diagram of a power module according to a fourth embodiment of the present invention;

Fig. 17 is a partial structural schematic diagram of a power module according to a fifth embodiment of the present invention;

fig. 18 is a partial structural schematic diagram of a motor controller according to an embodiment of the present invention;

FIG. 19 is a partial perspective view of a motor controller according to an embodiment of the present invention;

FIG. 20 is a schematic diagram of a structure in which a first cooling channel, a second cooling channel, and a third cooling channel of a power module flow according to an embodiment of the present invention;

fig. 21 is a schematic structural view of a power module implementing single-phase ac power output according to an embodiment of the present invention;

fig. 22 is a schematic diagram of a power module implementing three-phase ac power output according to an embodiment of the present invention;

FIG. 23 is a schematic diagram of a motor controller according to some embodiments of the invention;

fig. 24 is a schematic structural view of a motor controller according to other embodiments of the present invention.

Reference numerals:

100. A power module; 200. a motor controller;

10. a circuit assembly; 11. a first circuit assembly; 12. a second circuit assembly;

21. A first heat dissipation plate; 22. a second heat dissipation plate; 23. a third heat dissipation plate; 24. pin fins; 25. fins; 211. a first cooling channel; 221. a second cooling channel; 231. a third cooling channel;

30. a chip layer; 31. a first circuit board; 32. a second circuit board; 301. a bridge chip is arranged; 302. a lower bridge chip;

40. A substrate; 41. a first copper layer; 42. a second copper layer; 411. an upper bridge gate via; 412. an upper gate signal terminal; 413. a lower bridge gate via; 414. a lower gate signal terminal;

51. an alternating current signal output terminal; 52. a direct current input positive terminal; 53. a direct current input negative terminal; 54. a terminal;

60. copper strips; 61. an insulating layer;

70. a welding layer;

80. a housing; 81. a second inlet; 82. a second outlet; 83. a housing;

90. A bracket; 91. a first inlet; 92. a first outlet.

Detailed Description

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

In the description of the invention, "a first feature" may include one or more such features, and "a plurality" may mean two or more, and that a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, or may include both the first and second features not being in direct contact but being in contact with each other through additional features therebetween, with the first feature "above", "over" and "above" the second feature including both the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature.

A power module 100 according to an embodiment of the present invention is described below with reference to the accompanying drawings.

Referring to fig. 1 to 7, a power module 100 according to an embodiment of the present invention may include: the circuit assembly 10 and the first heat dissipation plate 21.

Specifically, the circuit assembly 10 includes a first circuit assembly 11 and a second circuit assembly 12, the first circuit assembly 11 and the second circuit assembly 12 are electrically connected, the first heat dissipation plate 21 is disposed between the first circuit assembly 11 and the second circuit assembly 12, and the first heat dissipation plate 21 can dissipate heat of the first circuit assembly 11 and the second circuit assembly 12, so as to reduce the temperature of the power module 100.

In addition, as shown in fig. 1 to 7, the power module 100 further includes a second heat dissipation plate 22 and a third heat dissipation plate 23, the second heat dissipation plate 22 is disposed on a side of the first circuit assembly 11 away from the first heat dissipation plate 21 (e.g., an upper side as shown in fig. 5), the third heat dissipation plate 23 is disposed on a side of the second circuit assembly 12 away from the first heat dissipation plate 21 (e.g., a lower side as shown in fig. 5), the first heat dissipation plate 21 and the second heat dissipation plate 22 may dissipate heat for the first circuit assembly 11, and the first heat dissipation plate 21 and the third heat dissipation plate 23 may dissipate heat for the second circuit assembly 12.

Therefore, the heat generated by the first circuit component 11 can be dissipated through the first heat dissipating plate 21 and the second heat dissipating plate 22, so that the first circuit component 11 is ensured to have a better heat dissipating effect, and the heat generated by the second circuit component 12 can be dissipated through the first heat dissipating plate 21 and the third heat dissipating plate 23, so that the second circuit component 12 is ensured to have a better heat dissipating effect. The power module 100 effectively reduces the temperature of the power module 100 and improves the heat dissipation efficiency of the power module 100 by adopting a three-layer heat dissipation mode, thereby avoiding the influence of the temperature rise on the switching speed of the power module 100, being beneficial to improving the switching speed of the power module 100, effectively reducing the loss and ensuring the normal operation of the power module 100.

Meanwhile, the first circuit component 11 and the second circuit component 12 are separated through the first heat dissipation plate 21, so that the structure that the heightening and the like for supporting the circuit components is needed to be added for realizing the double-sided heat dissipation of the power module in the related technology is omitted, the influence of the heightening is eliminated, the compact structure is ensured, the first heat dissipation plate 21 can dissipate heat of the first circuit component 11 and the second circuit component 12, the good heat dissipation effect is ensured, and the heat dissipation efficiency is improved.

For example, in some embodiments, when the power module 100 is disposed on a vehicle, the power module 100 can convert direct current of a battery on the vehicle into three-phase alternating current to be output for driving a motor, so as to meet driving requirements of the motor, and the power module 100 has the characteristics of high switching speed, high power density, high voltage-withstanding capability, high load current and the like, so as to ensure reliable operation of the power module 100. For example, the vehicle is an electric car. The power module 100 is an inverter power module.

It should be noted that, for convenience of description, the orientations of "upper", "lower", "front", "rear", "left" and "right" in the present invention are based on the orientation relationships shown in the drawings, and are not limited to the orientations in the practical application process.

According to the power module 100 of the embodiment of the invention, the first heat dissipation plate 21 is arranged between the first circuit component 11 and the second circuit component 12, the second heat dissipation plate 22 is arranged on one side of the first circuit component 11 far away from the first heat dissipation plate 21, the third heat dissipation plate 23 is arranged on one side of the second circuit component 12 far away from the first heat dissipation plate 21, the first heat dissipation plate 21 and the second heat dissipation plate 22 are used for dissipating heat for the first circuit component 11, and the first heat dissipation plate 21 and the third heat dissipation plate 23 are used for dissipating heat for the second circuit component 12, so that the temperature of the power module 100 is effectively reduced in a three-layer heat dissipation manner, a heightening structure for supporting the circuit component is omitted for realizing the power module with double-sided heat dissipation in the related art, the influence of heightening is eliminated, the structure is compact, the heat dissipation efficiency of the power module 100 is facilitated to be improved, and the power module 100 is ensured to work normally.

In some embodiments of the present invention, as shown in fig. 5-7, each of the first circuit assembly 11 and the second circuit assembly 12 includes a chip layer 30, a first circuit board 31 and a second circuit board 32, where the first circuit board 31 and the second circuit board 32 are respectively disposed on opposite sides of the chip layer 30, and the first circuit board 31 is located on a side of the chip layer 30 near the first heat dissipation plate 21, and the first circuit board 31 and the second circuit board 32 are used to provide a supporting and electrical connection function for the chip layer 30, so that the first circuit board 31 and the second circuit board 32 are reliably supported by the chip layer 30, and the first circuit board 31 and the second circuit board 32 are electrically connected with the chip layer 30, so that the bonding wires are avoided to enable the chips of the chip layer 30 to be connected with each other, thereby eliminating the influence of the bonding wires, facilitating the assembly of the power module 100, ensuring the reliable connection, and facilitating the extension of the service life.

Meanwhile, the two opposite sides of the chip layer 30 are electrically connected with the first circuit board 31 and the second circuit board 32, so that the structure that the power module for realizing double-sided heat dissipation in the related art needs to be increased to raise the insulation of the circuit assembly is omitted, the influence of raising is eliminated, the structure is compact, and the heat dissipation efficiency is improved.

According to some embodiments of the present invention, as shown in fig. 5-7, 12 and 13, the chip layer 30 of the first circuit component 11 is used for placing the upper bridge chip 301, the chip layer 30 of the second circuit component 12 is used for placing the lower bridge chip 302, so that the placing requirements of the upper bridge chip 301 and the lower bridge chip 302 can be met, the upper bridge chip 301 is ensured to be electrically connected with the first circuit board 31 and the second circuit board 32 of the first circuit component 11, the lower bridge chip 302 is electrically connected with the first circuit board 31 and the second circuit board 32 of the second circuit component 12, and the connection between the upper bridge chip 301 and the lower bridge chip 302 can realize that the power module 100 converts direct current into three-phase alternating current, so as to meet the working requirements of the power module 100. For example, the upper bridge chip 301 and the lower bridge chip 302 may be Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) chips or a combination of insulated gate bipolar transistor (Insulated Gate Bipolar Transistor, IGBT) chips and Fast Recovery Diode (FRD) chips, which can meet the working requirements of the power module 100.

It will be appreciated that the "upper bridge" and "lower bridge" of the "upper bridge chip 301" and "lower bridge chip 302" are defined according to the actual location of the chips.

In some embodiments of the present invention, as shown in fig. 12 and 13, each of the first circuit board 31 and the second circuit board 32 includes a substrate 40 and a first copper layer 41, the first copper layer 41 is disposed on a side of the substrate 40 near the chip layer 30, and the first copper layer 41 and the chip layer 30 can be electrically connected, so that the first circuit board 31 and the second circuit board 32 can provide an electrical connection function for the chip layer 30.

In the related art, the dc input end and the dc output end of the power module are on the same plane, so that the power module generates a larger stray inductance, for example, the stray inductance of the power module can reach 8nH, and the stray inductance can affect the on-off speed of the power module, thereby reducing the working efficiency of the power module.

Therefore, in the present invention, as shown in fig. 8-11 and 14, a dc input positive terminal 52 is led out from one end of the first copper layer 41 of the first circuit board 31 in the first circuit assembly 11, so that the dc positive electrode can be input to the first copper layer 41 of the first circuit board 31 in the first circuit assembly 11 through the dc input positive terminal 52, and the first copper layer 41 of the first circuit board 31 in the first circuit assembly 11 performs the function of dc positive electrode input. A dc input negative terminal 53 is led out from one end of the first copper layer 41 of the second circuit board 32 in the second circuit assembly 12, so that the dc negative electrode can be input to the first copper layer 41 of the second circuit board 32 in the second circuit assembly 12 through the dc input negative terminal 53, and the first copper layer 41 of the second circuit board 32 in the second circuit assembly 12 performs the function of dc negative output.

The first heat dissipation plate 21 is located between the first circuit component 11 and the second circuit component 12, so that the first copper layer 41 of the first circuit board 31 in the first circuit component 11 and the first copper layer 41 of the second circuit board 32 in the second circuit component 12 are located at two sides of the first heat dissipation plate 21, namely, the direct current input end and the direct current output end of the power module 100 are located at two sides of the first heat dissipation plate 21, and the stray inductance of the power module 100 can be greatly reduced due to the fact that the distance between the first circuit component 11 and the second circuit component 12 is far and is placed separately, the on-off speed of the power module 100 is improved, and the working efficiency of the power module 100 is improved. For example, at 1MHz, the stray inductance between the first circuit assembly 11 and the second circuit assembly 12 of the power module 100 of the present invention is 1.44234nH.

Meanwhile, as shown in fig. 8-11 and 14, the first copper layer 41 of the second circuit board 32 in the first circuit component 11 is electrically connected with the first copper layer 41 of the first circuit board 31 in the second circuit component 12, and the first copper layer 41 of the second circuit board 32 in the first circuit component 11 and the first copper layer 41 of the first circuit board 31 in the second circuit component 12 are led out with the ac signal output terminal 51, so that the ac converted by the power module 100 can be output through the ac signal output terminal 51, and the first copper layer 41 of the second circuit board 32 in the first circuit component 11 bears the ac output function, thereby satisfying the function of the power module 100 for converting the dc into the ac.

For example, as shown in fig. 15, when the power module 100 is connected to a dc circuit and an ac circuit, the dc input positive terminal 52 is connected to the positive electrode of the dc circuit, the dc input negative terminal 53 is connected to the negative electrode of the dc circuit, and the ac signal output terminal 51 is connected to the ac circuit.

The current in the direct current circuit flows into the first copper layer 41 of the first circuit board 31 in the first circuit assembly 11 through the direct current input positive electrode terminal 52, the first copper layer 41 of the first circuit board 31 in the first circuit assembly 11 is electrically connected with the chip layer 30 of the first circuit assembly 11 so that the current is transferred onto the chip, the chip layer 30 of the first circuit assembly 11 is electrically connected with the first copper layer 41 of the second circuit board 32 in the first circuit assembly 11 so that the current converted by the chip into alternating current is output through the alternating current signal output terminal 51, meanwhile, the current is transferred to the first copper layer 41 of the first circuit board 31 in the second circuit assembly 12 through the first copper layer 41 of the second circuit board 32 in the first circuit assembly 11, the first copper layer 41 of the first circuit board 31 in the second circuit assembly 12 is electrically connected with the chip layer 30 of the second circuit assembly 12 so that the current is transferred onto the chip, and the chip layer 30 of the second circuit assembly 12 is electrically connected with the first copper layer 41 of the second circuit board 32 in the second circuit assembly 12 so that the current is converted into the direct current through the direct current signal output terminal 51, and the direct current is converted into the direct current through the direct current output terminal 100 is realized.

In some embodiments, different current paths can be realized by etching grooves on the first copper layer 41, so as to meet different current flowing requirements.

In some embodiments of the present invention, as shown in fig. 12 and 13, the first circuit board 31 and the second circuit board 32 each include a second copper layer 42, where the second copper layer 42 is disposed on a side of the substrate 40 away from the chip layer 30, and the first copper layer 41 and the second copper layer 42 can ensure that two sides of the first circuit board 31 and the second circuit board 32 are consistent, avoid deformation of the substrate 40 towards one side, and are beneficial to improving structural strength of the first circuit board 31 and the second circuit board 32, ensuring reliable electrical connection between the first circuit board 31 and the second circuit board 32 and the chip layer 30, and prolonging service life.

In some embodiments, the substrate 40 may be an insulating heat conducting member, which can ensure an insulating effect on the chip layer 30, and the insulating heat conducting member has a better heat conducting effect, so that heat on the first circuit board 31 and the second circuit board 32 is conveniently transferred to the first heat dissipation plate 21, the second heat dissipation plate 22 and the third heat dissipation plate 23, and a better heat dissipation effect is ensured. For example, the substrate 40 may be a ceramic piece.

In some embodiments, the first circuit board 31 and the second circuit board 32 may be copper-clad ceramic boards, which have better rigidity and reliability, and can meet the requirements of supporting and electrically connecting the chip layer 30, and the copper-clad ceramic boards have good thermal cycle performance, high thermal conductivity, better insulation effect, and are convenient for heat dissipation. For example, copper clad ceramic plates may be formed by direct copper clad (DBC) fabrication, or by an Active Metal Brazing (AMB) process.

According to some embodiments of the present invention, as shown in fig. 5-11, the power module 100 further includes a copper strip 60, and both ends of the copper strip 60 in the length direction are respectively connected to the first copper layer 41 of the second circuit board 32 in the first circuit assembly 11 and the first copper layer 41 of the first circuit board 31 in the second circuit assembly 12. Therefore, the first copper layer 41 of the second circuit board 32 in the first circuit component 11 and the first copper layer 41 of the first circuit board 31 in the second circuit component 12 are connected, the complexity of adopting bonding wires for connection is avoided, connection reliability is ensured, assembly efficiency is improved, service life is prolonged, the influence of the bonding wires is eliminated, and heat dissipation performance is improved.

In some embodiments, as shown in fig. 8-11 and 14, the first copper layer 41 of the first circuit board 31 in the first circuit assembly 11 draws the dc input positive terminal 52 through the copper strip 60, the first copper layer 41 of the second circuit board 32 in the second circuit assembly 12 draws the dc input negative terminal 53 through the copper strip 60, and the first copper layer 41 of the second circuit board 32 in the first circuit assembly 11 draws the ac signal output terminal 51 through the copper strip 60, so that the connection between the dc input positive terminal 52 and the dc input negative terminal 53 and the ac signal output terminal 51 is ensured to be reliable, and the structure is simple.

In some embodiments of the present invention, as shown in fig. 5 to 7, an insulating layer 61 is disposed between the copper strip 60 and the first heat dissipation plate 21, and the copper strip 60 and the first heat dissipation plate 21 can be insulated by the insulating layer 61, so that current on the copper strip 60 is prevented from being transferred to the first heat dissipation plate 21, and use safety of the power module 100 is ensured.

According to some embodiments of the present invention, as shown in fig. 8-11 and fig. 14-18, the ac signal output terminal 51, the dc input positive terminal 52 and the dc input negative terminal 53 are all located on the same side of the first heat dissipation plate 21, so that the power module 100 is convenient to connect with an external circuit, reliable connection is ensured, complexity of line connection is avoided, better current sharing effect is ensured, and working performance of the power module 100 is improved.

In some embodiments of the present invention, as shown in fig. 8-11 and fig. 14-17, the ac signal output terminal 51, the dc input positive electrode terminal 52 and the dc input negative electrode terminal 53 are all plural, so that plural (greater than or equal to two) chips on the chip layer 30 can be located near the ac signal output terminal 51, the dc input positive electrode terminal 52 and the dc input negative electrode terminal 53 respectively, which reduces the influence of the ac signal output terminal 51, the dc input positive electrode terminal 52 and the dc input negative electrode terminal 53 on the chip arrangement, ensures better current sharing performance, and is beneficial to improving the service performance of the power module 100. Meanwhile, the problems of time difference and the like when different power chips are turned on or off due to different lengths of cables connected by a plurality of chips in the related art can be avoided, the switching efficiency of the power module 100 is ensured, and the work efficiency of the power module 100 is improved.

In addition, as shown in fig. 8 to 11 and fig. 14 to 17, the plurality of ac signal output terminals 51, the plurality of dc input positive terminals 52 and the plurality of dc input negative terminals 53 are arranged in a staggered manner, so that the plurality of chips are conveniently connected with the plurality of ac signal output terminals 51, the plurality of dc input positive terminals 52 and the plurality of dc input negative terminals 53, the connection paths can be ensured to be short, the length consistency can be ensured, the better current sharing performance is ensured, and the current distribution is uniform.

In the embodiment of the present invention, the number of the ac signal output terminals 51, the dc input positive electrode terminals 52 and the dc input negative electrode terminals 53 may be flexibly set according to the actual situation, for example, three, two, four, five, six or more ac signal output terminals 51, dc input positive electrode terminals 52 and dc input negative electrode terminals 53 may be shown in fig. 8, which is within the scope of the present invention.

According to some embodiments of the present invention, as shown in fig. 8-11 and 14, a trench is etched on the first copper layer 41 of the second circuit board 32 of the first circuit component 11 to form an upper bridge gate via 411, and the upper bridge gate via 411 is led out with an upper gate signal terminal 412, a trench is etched on the first copper layer 41 of the second circuit board 32 of the second circuit component 12 to form a lower bridge gate via 413, and the lower bridge gate via 413 is led out with a lower gate signal terminal 414, so that connection between the upper gate signal terminal 412 and the lower gate signal terminal 414 is realized, the influence of a bonding wire is eliminated, the heat dissipation performance is improved, the power module 100 is convenient to assemble, the connection reliability is ensured, and the service life is prolonged. Meanwhile, the external control device is connected with the upper gate signal terminal 412 and the lower gate signal terminal 414, so that the operation of the power module 100 can be controlled or detected, different control requirements can be met, and the power module 100 is more convenient to use.

In some embodiments where the power module 100 includes copper tape 60, as shown in fig. 8-11 and 14, the upper bridge gate via 411 leads to the upper gate signal terminal 412 through the copper tape 60, and the lower bridge gate via 413 leads to the lower gate signal terminal 414 through the copper tape 60, ensuring that the upper gate signal terminal 412 is reliably connected to the lower gate signal terminal 414 and is simple in structure.

In some embodiments of the present invention, as shown in fig. 8-11 and 14, the upper gate signal terminal 412 and the lower gate signal terminal 414 are located on the same side of the first heat dissipation plate 21, so that the power module 100 is convenient to connect with an external circuit, reliable connection is ensured, complexity of line connection is avoided, better current sharing effect is ensured, and working performance of the power module 100 is improved.

In addition, as shown in fig. 8-11 and 14, the upper gate signal terminal 412 and the lower gate signal terminal 414 are multiple, so that multiple chips on the chip layer 30 can be located near the upper gate signal terminal 412 and the lower gate signal terminal 414 respectively, the influence of the upper gate signal terminal 412 and the lower gate signal terminal 414 on chip arrangement is reduced, better current sharing performance is ensured, and the use performance of the power module 100 is improved. Meanwhile, the problems of time difference and the like when different power chips are turned on or off due to different lengths of cables connected by a plurality of chips in the related art can be avoided, the switching efficiency of the power module 100 is ensured, and the work efficiency of the power module 100 is improved.

Meanwhile, as shown in fig. 8-11 and 14, the plurality of upper gate signal terminals 412 and the plurality of lower gate signal terminals 414 are staggered, so that a plurality of chips are conveniently connected with the plurality of upper gate signal terminals 412 and the plurality of lower gate signal terminals 414, the connection paths can be ensured to be short, the length consistency can be ensured, the better current sharing performance is ensured, and the current distribution is uniform.

In the embodiment of the present invention, the number of the plurality of upper gate signal terminals 412 and the plurality of lower gate signal terminals 414 may be flexibly set according to the actual situation, for example, the number of the ac signal output terminals 51, the dc input positive electrode terminals 52 and the dc input negative electrode terminals 53 may be four as shown in fig. 9, or may be two, three, five, six or more, which is within the scope of the present invention.

In some embodiments, the ac signal output terminal 51, the dc input positive terminal 52, and the dc input negative terminal 53 and the upper gate signal terminal 412 and the lower gate signal terminal 414 may be located at opposite sides of the first heat dissipation plate 21, respectively, for example, the ac signal output terminal 51, the dc input positive terminal 52, and the dc input negative terminal 53 may be located at the left side of the first heat dissipation plate 21, and the upper gate signal terminal 412 and the lower gate signal terminal 414 may be located at the right side of the first heat dissipation plate 21, so that the power module 100 may be connected with external circuits.

In some embodiments, as shown in fig. 1-4, 21 and 22, the power module 100 may be provided with a plurality of (greater than or equal to two) terminals 54, and the plurality of terminals 54 may be respectively formed into an ac signal output terminal 51, a dc input positive terminal 52, a dc input negative terminal 53, an upper gate signal terminal 412, a lower gate signal terminal 414, etc. through different circuit connections of the first copper layer 41, which may be set according to the use requirements, so as to satisfy different use situations.

In some embodiments, as shown in fig. 1-3, 21 and 22, the number and positions of the ac signal output terminals 51, the dc input positive electrode terminals 52, the dc input negative electrode terminals 53, the upper gate signal terminals 412 and the lower gate signal terminals 414 can be flexibly arranged according to the number of chips or the use requirement, so as to meet different use situations. For example, a plurality of terminals 54 may be combined into one terminal 54 for use, or the like, depending on actual use requirements.

According to some embodiments of the present invention, as shown in fig. 12 and 13, a solder layer 70 is disposed between the chip layer 30 and the first circuit board 31 and the second circuit board 32, so as to ensure that the chip layer 30 is reliably connected to the first circuit board 31 and the second circuit board 32, and ensure that the chip layer 30 is reliably electrically connected to the first circuit board 31 and the second circuit board 32; and/or, the welding layer 70 is arranged between the second circuit board 32 of the first circuit assembly 11 and the second heat dissipation plate 22, so that the connection reliability between the second circuit board 32 of the first circuit assembly 11 and the second heat dissipation plate 22 can be ensured, and the movement is avoided; and/or, the welding layer 70 is arranged between the first circuit board 31 of the first circuit assembly 11 and the first heat dissipation plate 21, so that the first circuit board 31 of the first circuit assembly 11 can be reliably connected with the first heat dissipation plate 21, and movement is avoided; and/or, the welding layer 70 is arranged between the second circuit board 32 of the second circuit assembly 12 and the third heat dissipation plate 23, so that the connection reliability of the second circuit board 32 of the second circuit assembly 12 and the third heat dissipation plate 23 can be ensured, and the movement is avoided; and/or be equipped with the welding layer 70 between the first circuit board 31 of second circuit subassembly 12 and the first heating panel 21, can ensure that the first circuit board 31 of second circuit subassembly 12 is connected reliably with first heating panel 21, avoid taking place to remove, all can set up according to different user demands, ensure interconnect reliable, be favorable to reduction in production cost.

In some embodiments, as shown in fig. 12 and 13, a solder layer 70 is disposed between the chip layer 30 and the first circuit board 31 and the second circuit board 32, a solder layer 70 is disposed between the second circuit board 32 of the first circuit assembly 11 and the second heat dissipation plate 22, a solder layer 70 is disposed between the first circuit board 31 of the first circuit assembly 11 and the first heat dissipation plate 21, a solder layer 70 is disposed between the second circuit board 32 of the second circuit assembly 12 and the third heat dissipation plate 23, and a solder layer 70 is disposed between the first circuit board 31 of the second circuit assembly 12 and the first heat dissipation plate 21, so that reliable interconnection can be ensured, the structural strength of the power module 100 is high, and the electrical connection requirement of the chip layer 30 and the first circuit board 31 and the second circuit board 32 is satisfied, which is beneficial to reducing the production cost.

In the related art, the power module has two designs of a three-phase output power module and a single-phase output power module, which cannot be used commonly, and two different modules need to be designed for use respectively.

In some embodiments of the present invention, as shown in fig. 21, the circuit assembly 10 may be one, that is, the first circuit assembly 11 is one, the second circuit assembly 12 is one, and the first circuit assembly 11 and the second circuit assembly 12 are connected, so as to enable single-phase ac power output of the power module 100. When two-phase alternating current output or three-phase alternating current output is required, the two-phase alternating current output or three-phase alternating current output requirement can be met by using two or three power modules 100.

Or the circuit components 10 may be plural, the plural circuit components 10 are spaced apart along the length direction (for example, the front-rear direction shown in fig. 22) of the first heat dissipation plate 21, when the circuit components 10 are plural, the plural circuit components 10 are not connected to each other, that is, when the circuit components 10 are plural, the first circuit components 11 are plural spaced apart along the length direction of the first heat dissipation plate 21, the second circuit components 12 are plural spaced apart along the length direction of the first heat dissipation plate 21, the plural first circuit components 11 and the plural second circuit components 12 are connected in one-to-one correspondence, the plural first circuit components 11 are not connected to each other, and the plural second circuit components 12 are not connected to each other, so that the multiphase ac power output of the power module 100 can be realized, and different use requirements of the power module 100 can be satisfied.

For example, as shown in fig. 22, when the number of the circuit assemblies 10 is two, the number of the first circuit assemblies 11 is two which are spaced apart along the length direction of the first heat dissipation plate 21, the number of the second circuit assemblies 12 is two which are spaced apart along the length direction of the first heat dissipation plate 21, the two first circuit assemblies 11 and the two second circuit assemblies 12 are connected in one-to-one correspondence, the two first circuit assemblies 11 are not connected to each other, and the two second circuit assemblies 12 are not connected to each other, so that two-phase ac power output of the power module 100 can be realized; or when the circuit assemblies 10 are three, the first circuit assemblies 11 are three spaced apart along the length direction of the first heat dissipation plate 21, the second circuit assemblies 12 are three spaced apart along the length direction of the first heat dissipation plate 21, the three first circuit assemblies 11 and the three second circuit assemblies 12 are connected in one-to-one correspondence, the three first circuit assemblies 11 are not connected with each other, the three second circuit assemblies 12 are not connected with each other, and three-phase alternating current output of the power module 100 can be achieved.

Therefore, when single-phase alternating current output is required, only one circuit assembly 10 is adopted to meet the requirement, so that the power module 100 can be realized by using a shorter length, and the occupied space is reduced; when multi-phase (e.g., two-phase or three-phase) alternating current output is needed, the power module 100 is not required to be redesigned, the length of the power module 100 is only prolonged, and the required circuit assembly 10 is correspondingly arranged, so that the requirement of multi-phase alternating current output can be met, the development efficiency of the power module 100 is effectively improved, the heat dissipation performance is better, the overall heat dissipation performance of the power module 100 is not affected when the length of the power module 100 is prolonged and the number of the circuit assemblies 10 is increased, and the heat dissipation requirement is met.

In the embodiment of the present invention, the number of the circuit assemblies 10 may be flexibly set according to the actual situation, for example, the number of the circuit assemblies 10 may be three as shown in fig. 22, or may be two, four, five, six or more, which is within the scope of the present invention.

According to some embodiments of the present invention, as shown in fig. 1-5, 7 and 16, a plurality of (two or more) spaced pin fins 24 are disposed on each of the first heat dissipation plate 21, the second heat dissipation plate 22 and the third heat dissipation plate 23, and the plurality of pin fins 24 can effectively dissipate heat of the first heat dissipation plate 21, the second heat dissipation plate 22 and the third heat dissipation plate 23, so that a better heat dissipation performance is ensured, and a heat dissipation effect of the power module 100 is good.

Or as shown in fig. 6 and 17, the first heat dissipation plate 21, the second heat dissipation plate 22 and the third heat dissipation plate 23 are respectively provided with a plurality of (more than or equal to two) fins 25 spaced apart, and the plurality of fins 25 can effectively dissipate heat of the first heat dissipation plate 21, the second heat dissipation plate 22 and the third heat dissipation plate 23, so that good heat dissipation performance is ensured, and the heat dissipation effect of the power module 100 is good.

According to some embodiments of the present invention, as shown in fig. 1-4, 18 and 19, the power module 100 further includes a bracket 90, and the circuit assembly 10, the first heat dissipation plate 21, the second heat dissipation plate 22 and the third heat dissipation plate 23 are all disposed on the bracket 90, so that the circuit assembly 10 can be protected by the bracket 90, damage caused by exposure of the circuit assembly 10 is avoided, and short-circuit problem caused by contact of the circuit assembly 10 with liquid is avoided, thereby ensuring use safety of the power module 100.

In addition, as shown in fig. 1, 4 and 19, the first cooling channel 211 is provided in the first cooling plate 21, the first inlet 91 and the first outlet 92 are provided at two sides of the bracket 90, and the first inlet 91 and the first outlet 92 are both communicated with the first cooling channel 211, so that the liquid can enter the first cooling channel 211 through the first inlet 91 and flow out through the first outlet 92, which is convenient for the liquid to dissipate heat of the first cooling plate 21, ensures reliable flow of the liquid, has good heat dissipation effect, and has simple structure, and is convenient for processing and manufacturing.

The motor controller 200 according to the embodiment of the invention includes the power module 100 and the housing 80 according to the embodiment of the invention, the power module 100 is disposed in the housing 80, the second cooling channel 221 is defined between the second heat dissipation plate 22 and the housing 80, and the third cooling channel 231 is defined between the third heat dissipation plate 23 and the housing 80. The liquid can flow in the second cooling channel 221 and can take away the heat on the second heat dissipation plate 22, so that the heat dissipation of the first circuit assembly 11 is facilitated, and the liquid can flow in the third cooling channel 231 and can take away the heat on the third heat dissipation plate 23, so that the heat dissipation of the second circuit assembly 12 is facilitated, and the good heat dissipation effect of the power module 100 is ensured.

In some embodiments having the first cooling passage 211 in the first heat dissipation plate 21, as shown in fig. 18 to 20, both ends of the case 80 have the second inlet 81 and the second outlet 82, and the second inlet 81 and the second outlet 82 communicate with the first cooling passage 211, the second cooling passage 221, and the third cooling passage 231.

Liquid can flow in from the second inlet 81 and respectively enter the first cooling channel 211, the second cooling channel 221 and the third cooling channel 231 and flow out through the second outlet 82, the liquid flows in the first cooling channel 211 and can take away the heat on the first heat dissipation plate 21, the heat dissipation of the first circuit component 11 and the second circuit component 12 is facilitated, the liquid flows in the second cooling channel 221 and can take away the heat on the second heat dissipation plate 22, the heat dissipation of the first circuit component 11 is facilitated, the liquid flows in the third cooling channel 231 and can take away the heat on the third heat dissipation plate 23, and the heat dissipation of the second circuit component 12 is facilitated. The three layers of heat dissipation channels are used for cooling heat, so that the power module 100 has a good heat dissipation effect, and normal operation of the power module 100 is ensured. For example, the flow paths of the first cooling passage 211, the second cooling passage 221, and the third cooling passage 231 are shown in fig. 20.

Since the power module 100 according to the embodiment of the invention has the above beneficial technical effects, according to the motor controller 200 of the embodiment of the invention, the first heat dissipation plate 21 is arranged between the first circuit component 11 and the second circuit component 12, the second heat dissipation plate 22 is arranged on one side of the first circuit component 11 far away from the first heat dissipation plate 21, the third heat dissipation plate 23 is arranged on one side of the second circuit component 12 far away from the first heat dissipation plate 21, the first heat dissipation plate 21 and the second heat dissipation plate 22 are used for dissipating heat of the first circuit component 11, and the first heat dissipation plate 21 and the third heat dissipation plate 23 are used for dissipating heat of the second circuit component 12, so that the temperature of the power module 100 is effectively reduced in a three-layer heat dissipation manner, the heightening structure for supporting the circuit components is omitted for realizing the power module with double-sided heat dissipation in the related art, the influence of heightening is eliminated, the compact structure is ensured, the heat dissipation efficiency of the power module 100 is improved, and the normal operation of the power module 100 is ensured.

In some embodiments, as shown in fig. 23 and 24, the motor controller 200 further includes a housing 83, and the power module 100 and the housing 80 are both located in the housing 83, and the housing 83 can protect the power module 100 and the housing 80 from damage caused by exposure of the power module 100 and the housing 80, which is beneficial to improving the service life of the motor controller 200.

In some embodiments, as shown in fig. 24, the housing 80 and the outer shell 83 may be an integrally formed piece, which has a simple structure, is convenient for manufacturing, and is compact in structure, thereby being beneficial to reducing the occupied space.

The power assembly according to the embodiment of the invention comprises a motor and a motor controller 200 according to the embodiment of the invention, wherein the motor controller 200 is connected with the motor, and the motor controller 200 is used for controlling the motor, so that reliable control over the motor is ensured, and the control requirement on the motor is met.

Since the motor controller 200 according to the embodiment of the invention has the above beneficial technical effects, according to the power assembly of the embodiment of the invention, the first heat dissipation plate 21 is arranged between the first circuit component 11 and the second circuit component 12, the second heat dissipation plate 22 is arranged on one side of the first circuit component 11 far away from the first heat dissipation plate 21, the third heat dissipation plate 23 is arranged on one side of the second circuit component 12 far away from the first heat dissipation plate 21, the first heat dissipation plate 21 and the second heat dissipation plate 22 are used for dissipating heat of the first circuit component 11, and the first heat dissipation plate 21 and the third heat dissipation plate 23 are used for dissipating heat of the second circuit component 12, so that the temperature of the power module 100 is effectively reduced in a three-layer heat dissipation manner, the heightening structure for supporting the circuit components is omitted for realizing the power module with double-sided heat dissipation in the related art, the influence of heightening is eliminated, the compact structure is ensured, the heat dissipation efficiency of the power module 100 is improved, and the normal operation of the power module 100 is ensured.

A vehicle according to an embodiment of the invention includes a powertrain according to an embodiment of the invention. Since the power assembly according to the embodiment of the invention has the beneficial effects described above, according to the vehicle of the embodiment of the invention, the first heat dissipation plate 21 is arranged between the first circuit assembly 11 and the second circuit assembly 12, the second heat dissipation plate 22 is arranged on one side of the first circuit assembly 11 far away from the first heat dissipation plate 21, the third heat dissipation plate 23 is arranged on one side of the second circuit assembly 12 far away from the first heat dissipation plate 21, the first heat dissipation plate 21 and the second heat dissipation plate 22 are used for dissipating heat of the first circuit assembly 11, and the first heat dissipation plate 21 and the third heat dissipation plate 23 are used for dissipating heat of the second circuit assembly 12, so that the temperature of the power module 100 is effectively reduced in a three-layer heat dissipation manner, and the structure of raising the circuit assembly is omitted, such as to increase the support of the power module in the related art, the effect of raising the power module is eliminated, the structure is compact, the heat dissipation efficiency of the power module 100 is favorably improved, and the normal operation of the power module 100 is ensured.

Other configurations and operations of the power module 100, the motor controller 200, the powertrain, and the vehicle according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.

In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

In the description herein, reference to the terms "embodiment," "specific embodiment," "example," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.

Claims (18)

1. A power module, comprising:

A circuit assembly including a first circuit assembly and a second circuit assembly electrically connected;

The first radiating plate is arranged between the first circuit component and the second circuit component;

The second cooling plate is arranged on one side, far away from the first cooling plate, of the first circuit component, the third cooling plate is arranged on one side, far away from the first cooling plate, of the second circuit component, the first cooling plate and the second cooling plate are used for cooling the first circuit component, and the first cooling plate and the third cooling plate are used for cooling the second circuit component.

2. The power module of claim 1, wherein the first circuit assembly and the second circuit assembly each comprise:

A chip layer;

the first circuit board and the second circuit board are respectively arranged on two opposite sides of the chip layer, the first circuit board is positioned on one side of the chip layer, which is close to the first heat dissipation plate, and the first circuit board and the second circuit board are used for providing functions of supporting and electric connection for the chip layer.

3. The power module of claim 2, wherein the chip layer of the first circuit assembly is for placement of an upper bridge chip and the chip layer of the second circuit assembly is for placement of a lower bridge chip.

4. The power module of claim 2, wherein the first circuit board and the second circuit board each comprise:

A substrate;

The first copper layer is arranged on one side of the substrate, which is close to the chip layer, the first copper layer of the second circuit board in the first circuit component is electrically connected with the first copper layer of the first circuit board in the second circuit component, an alternating current signal output terminal is led out, a direct current input positive terminal is led out from one end of the first copper layer of the first circuit board in the first circuit component, and a direct current input negative terminal is led out from one end of the first copper layer of the second circuit board in the second circuit component.

5. The power module of claim 4, wherein the first circuit board and the second circuit board each comprise:

and the second copper layer is arranged on one side of the substrate far away from the chip layer.

6. The power module of claim 4, further comprising:

And the two ends of the copper strip in the length direction are respectively connected with the first copper layer of the second circuit board in the first circuit assembly and the first copper layer of the first circuit board in the second circuit assembly.

7. The power module of claim 6, wherein an insulating layer is disposed between the copper strap and the first heat spreader plate.

8. The power module of claim 4, wherein the ac signal output terminal, the dc input positive terminal, and the dc input negative terminal are all located on the same side of the first heat sink.

9. The power module of claim 8, wherein the ac signal output terminals, the dc input positive terminals, and the dc input negative terminals are all multiple and staggered.

10. The power module of claim 4 wherein the first copper layer of the second circuit board of the first circuit assembly is grooved to form upper bridge gate vias and to which upper gate signal terminals are routed, and the first copper layer of the second circuit board of the second circuit assembly is grooved to form lower bridge gate vias and to which lower gate signal terminals are routed.

11. The power module of claim 10, wherein the upper gate signal terminal and the lower gate signal terminal are located on a same side of the first heat sink, the upper gate signal terminal and the lower gate signal terminal being both multiple and staggered.

12. The power module of claim 2, wherein a solder layer is disposed between the chip layer and the first and second circuit boards;

And/or a welding layer is arranged between the second circuit board of the first circuit component and the second heat dissipation plate;

and/or a welding layer is arranged between the first circuit board of the first circuit component and the first heat dissipation plate;

and/or a welding layer is arranged between the second circuit board of the second circuit assembly and the third heat dissipation plate;

and/or a welding layer is arranged between the first circuit board and the first heat dissipation plate of the second circuit component.

13. The power module of claim 1, wherein the circuit assembly is one or a plurality of the circuit assemblies spaced apart along the length of the first heat sink, and when the circuit assembly is a plurality of the circuit assemblies, the plurality of the circuit assemblies are not connected to each other.

14. The power module of claim 1, wherein the first heat spreader plate, the second heat spreader plate, and the third heat spreader plate are each provided with a plurality of spaced apart pin fins;

Or, a plurality of fins are arranged on the first heat dissipation plate, the second heat dissipation plate and the third heat dissipation plate.

15. The power module of claim 1, further comprising:

The circuit assembly, first heating panel to the third heating panel all is located on the support, first cooling channel has in the first heating panel, the both sides of support have intercommunication first import and the first export of first cooling channel.

16. A motor controller, comprising:

The power module of any one of claims 1-15;

The power module is arranged in the shell, a second cooling channel is defined between the second radiating plate and the shell, and a third cooling channel is defined between the third radiating plate and the shell.

17. A powertrain, comprising:

A motor;

The motor controller of claim 16, connected to the motor and for controlling the motor.

18. A vehicle comprising a powertrain according to claim 17.