CN118156187A

CN118156187A - Control method of gas circuit system based on semiconductor reaction cavity

Info

Publication number: CN118156187A
Application number: CN202410572025.2A
Authority: CN
Inventors: 张露
Original assignee: Hongge Semiconductor Equipment Shanghai Co ltd
Current assignee: Hongge Semiconductor Equipment Shanghai Co ltd
Priority date: 2024-05-10
Filing date: 2024-05-10
Publication date: 2024-06-07
Anticipated expiration: 2044-05-10

Abstract

The application provides a control method of an air path system based on a semiconductor reaction cavity, wherein the method comprises the following steps: the electronic control chip acquires first temperature detection signals of a plurality of temperature sensors in at least one control equipment body to determine first actual temperature values of a plurality of positions in the at least one control equipment body according to the at least one first temperature detection signals; aiming at least one control equipment body, if the first actual temperature value is larger than a first preset value and smaller than a second preset value, and the temperature uniformity reaches a preset requirement, starting a low-temperature heating function of an outer ring gasket of the control equipment body, and closing heating functions of a middle ring gasket and an inner ring gasket; if the at least one first actual temperature value is smaller than the first preset value, determining a heating strategy of the control equipment body heating gasket according to the value of the first actual temperature value lower than the first preset value. By this method, the stability of the whole heating system is ensured.

Description

Control method of gas circuit system based on semiconductor reaction cavity

Technical Field

The application relates to the technical field of semiconductors, in particular to a control method of an air path system based on a semiconductor reaction cavity.

Background

IGS modules refer to integrated gas system (INTEGRATED GAS SYSTEM) modules in the semiconductor design field, in which Surface Mount technology is used, which is another common connection in the semiconductor industry in addition to VCR connections. The semiconductor device is widely applied to semiconductor processes such as Plasma Enhanced Chemical Vapor Deposition (PECVD), physical Vapor Deposition (PVD), chemical Vapor Deposition (CVD), low-pressure chemical vapor deposition (LPCVD), metal organic chemical deposition (MOCVD), atomic Layer Deposition (ALD), atomic Layer Etching (ALE) and the like due to the characteristics of convenient disassembly, simple assembly, space saving, reliable sealing performance and suitability for high vacuum and high temperature resistance. Wherein, PECVD (plasma enhanced chemical vapor deposition): is a method for depositing a thin film on a substrate surface by promoting a chemical reaction at a relatively low temperature using plasma. Such techniques are commonly used in the microelectronics and nanotechnology fields, especially in semiconductor manufacturing processes, for depositing insulating, semiconducting and metallic layers, etc. PVD (physical vapor deposition): is the process of transferring material from a source to the surface of a substrate by physical means, such as evaporation or sputtering. This method does not involve chemical reactions, but rather material transfer is accomplished by physical processes. PVD techniques are widely used to manufacture various thin films, such as corrosion resistant films, optical films, hard coatings, and the like.

The connection mode can ensure that gas leakage and impurities are prevented from entering the system under the conditions of high vacuum, ultrahigh vacuum, high purity, ultrahigh purity and high temperature, so that the stability and reliability of a semiconductor process are ensured.

The IGS module mainly comprises the following structures:

valves (diaphragm, one-way, pressure relief) for controlling the flow direction and pressure of the gas, ensuring that the gas flows in the correct path and is supplied to the system at the appropriate pressure. Diaphragm valves are commonly used for fine tuning, one-way valves are used to control the flow of gas, and pressure relief valves are used to reduce excessive pressure.

A pressure sensor (Pressure Transducer) for monitoring the gas pressure in the system and providing real-time data for adjustment and control, ensuring safe and stable operation of the system;

a Filter (Filter) for removing impurities from the gas to ensure that the gas supplied to the process is pure and pollution-free;

mass flow controller (Mass Flow Controller), acting: and detecting and controlling the flow of the pipeline.

Disclosure of Invention

In view of the above, an object of the present application is to provide a control method of an air path system based on a semiconductor reaction chamber, in which a heating structure of the air path system is changed, and heating is performed by using a heating pad, wherein the heating pad is disposed between a control device body and a control device base; the stability of the whole heating system is ensured, and meanwhile, the heating method provided by the application can ensure the uniformity of the temperature of the hydrogen fluoride, and avoid the problem of unstable chemical properties caused by local liquefaction.

In a first aspect, an embodiment of the present application provides a control method for an air path system based on a semiconductor reaction chamber, where the air path system includes an electronic control chip and a plurality of control devices sequentially arranged, where the plurality of control devices include a plurality of valves, sensors, and a controller; each control device consists of a control device body, a control device base and a heating gasket; each control equipment body, each heating gasket and each control equipment base are provided with an air inlet hole and an air outlet hole; the heating gasket is clamped between the control equipment body and the control equipment base, the air inlet of the control equipment body, the air inlet of the heating gasket and the air inlet of the control equipment base are sequentially communicated, and the air outlet of the control equipment body, the air outlet of the heating gasket and the air outlet of the control equipment base are sequentially communicated, so that heated air can sequentially flow through the air inlet of the control equipment base, the air inlet of the heating gasket, the air inlet of the control equipment body, the inner cavity of the control equipment body, the air outlet of the heating gasket and the air outlet of the control equipment base for each control equipment; each heating gasket is electrically connected with the electric control chip respectively; the heating gasket comprises an inner ring gasket, a middle ring gasket and an outer ring gasket, and the distances between the inner ring gasket, the middle ring gasket and the outer ring gasket and an air inlet hole of the control equipment body are sequentially increased; the distances between the inner ring gasket, the middle ring gasket and the outer ring gasket and the air outlet hole of the control equipment body are sequentially increased; a plurality of temperature sensors are sequentially arranged in the control equipment body along the airflow direction;

The plurality of valves includes: manual diaphragm valve, two-way pneumatic diaphragm valve, three-way pneumatic diaphragm valve and pressure regulating valve; the sensor includes: a pressure sensor; the controller includes: a filter, a mass flow controller;

the control method comprises the following steps:

The electronic control chip acquires first temperature detection signals of a plurality of temperature sensors in at least one control equipment body;

the electronic control chip respectively determines first actual temperature values of a plurality of positions inside at least one control equipment body according to at least one first temperature detection signal;

Aiming at least one control equipment body, if the first actual temperature values are larger than a first preset value and smaller than a second preset value and the temperature uniformity reaches a preset requirement, starting a low-temperature heating function of an outer ring gasket of the control equipment body, and closing heating functions of a middle ring gasket and an inner ring gasket; the first preset value is 55-60 degrees; the second preset value is 75-80 degrees;

for at least one control device body, if at least one first actual temperature value is smaller than a first preset value, determining a heating strategy of the control device body heating gasket according to the value of the first actual temperature value lower than the first preset value.

With reference to the first aspect, an embodiment of the present application provides a first possible implementation manner of the first aspect, where, for at least one control device body, if at least one first actual temperature value is smaller than a first preset value, determining a heating strategy of a heating pad of the control device body according to a value of the first actual temperature value that is lower than the first preset value includes:

For at least one control device body, if a plurality of first actual temperature values of the control device body are smaller than a first preset value and larger than a third preset value, and the variance of the first actual temperature values is smaller than a fourth preset value, determining the heating temperature of the heating gasket according to the average value of the first actual temperature values; the average value of the first actual temperature value and the heating temperature of the heating gasket are in negative correlation, and the average value of the first actual temperature value and the heating area of the heating gasket are in negative correlation; the third preset value is 35-40 degrees;

For at least one control equipment body, if a plurality of first actual temperature values of the control equipment body are smaller than a first preset value and larger than a third preset value, and the variance of the first actual temperature values is larger than a fifth preset value, starting a high-temperature heating function of the middle ring gasket and the outer ring gasket, and improving the air inlet flow; for at least one control equipment body, if a plurality of first actual temperature values of the control equipment body are smaller than a first preset value and larger than a third preset value, and the variance of the first actual temperature values is larger than a fourth preset value and smaller than a fifth preset value, starting a low-temperature heating function of the middle ring gasket and a high-temperature heating function of the outer ring gasket;

for at least one control device body, if at least one first actual temperature value of the control device body is smaller than a first preset value, no first actual temperature value is larger than a second preset value, and the variance of the first actual temperature value is larger than a seventh preset value, the high-temperature heating functions of the middle ring gasket and the outer ring gasket are started simultaneously.

With reference to the first possible implementation manner of the first aspect, the embodiment of the present application provides a second possible implementation manner of the first aspect, wherein the plurality of control devices includes a first temperature zone, a second temperature zone, and a third temperature zone; the first temperature zone includes: a three-way pneumatic diaphragm valve and two pneumatic diaphragm valves; the second temperature zone includes: a mass flow controller; the third temperature zone includes: the device comprises a manual diaphragm valve, two pneumatic diaphragm valves, a three-way pneumatic diaphragm valve, a pressure regulating valve, a pressure sensor, a filter and two pneumatic diaphragm valves;

The heating temperatures of the heating gaskets of the control equipment body in the first temperature zone, the second temperature zone and the third temperature zone are 60 ℃;

Or alternatively, the first and second heat exchangers may be,

The heating temperatures of the heating gaskets of the control equipment body in the first temperature zone, the second temperature zone and the third temperature zone are 30 degrees, 45 degrees and 60 degrees respectively;

Or alternatively, the first and second heat exchangers may be,

The heating temperatures of the heating gaskets of the control equipment body in the first temperature zone, the second temperature zone and the third temperature zone are respectively 30-45 degrees, 45 degrees and 60 degrees.

With reference to the second possible implementation manner of the first aspect, the embodiment of the present application provides a third possible implementation manner of the first aspect, where the method further includes:

the electronic control chip acquires pressure values detected by the pressure sensor at each time point, heating temperature of the heating gasket in the control equipment and second actual temperature values at different positions in the control equipment body of the control equipment in a plurality of continuous time points; the second actual temperature value is determined according to the signals acquired by the temperature sensor;

generating a coping relation of the second actual temperature value along with the heating strategy and time change of the heating gasket under a specific pressure value according to the pressure value detected by the pressure sensor at each time point, the heating strategy of the heating gasket and the second actual temperature value detected by each temperature sensor;

After determining a heating strategy of the control device body heating pad according to the magnitude of the first actual temperature value lower than the first preset value if the at least one first actual temperature value is smaller than the first preset value for the at least one control device body, the method further includes:

Inputting a third actual temperature value, a pressure value and a heating strategy of a heating gasket, which are obtained in real time, at different positions in the control equipment body, into the corresponding relation so as to determine temperature change conditions at different positions in the control equipment body after the preset time;

And adjusting the heating strategy of each heating gasket according to the temperature change conditions of different positions in the control equipment body after the preset time.

With reference to the third possible implementation manner of the first aspect, the embodiment of the present application provides a fourth possible implementation manner of the first aspect, wherein the second actual temperature value and the third actual temperature value are determined according to a signal acquired by the temperature sensor and an infrared image captured by an external infrared camera;

the method further comprises the steps of:

Acquiring a plurality of continuous infrared verification images of the control equipment body through an infrared camera while acquiring a continuous first temperature detection signal;

According to the difference value of the continuous multiple infrared verification images, and in the process of determining and acquiring the continuous first temperature detection signal according to the difference value, controlling the reference temperature change rule of the equipment body;

determining the credibility of the first temperature detection signal according to the reference temperature change rule;

And determining the execution mode of the heating strategy according to the credibility.

With reference to the first aspect, the embodiment of the present application provides a fifth possible implementation manner of the first aspect, where the method further includes:

Extracting a local area where a target sensor group is located from an infrared image; the temperature sensors in the target sensor group are adjacent, and the difference value of the first actual temperature values detected by the temperature sensors in the target sensor group exceeds a sixth preset value;

extracting RGB values of the position of each temperature sensor in the target sensor group from the local area;

And judging the abnormal condition of the temperature sensor in the target sensor group according to the difference value of RGB values of the positions of different temperature sensors.

With reference to the first aspect, an embodiment of the present application provides a sixth possible implementation manner of the first aspect, where, for at least one control device body, if at least one first actual temperature value is smaller than a first preset value, determining, according to a value magnitude of the first actual temperature value that is lower than the first preset value, a heating strategy of a heating pad of the control device body includes:

For at least one control equipment body, if a first actual temperature value detected by a temperature sensor close to an air inlet hole of the control equipment body is higher than a first preset value, the inner ring gasket is controlled to stop working, and the heating strategy of the middle ring gasket is controlled according to the actual magnitude of the first actual temperature value detected by other temperature sensors.

With reference to the first aspect, the embodiment of the present application provides a seventh possible implementation manner of the first aspect, where the method further includes:

determining a target time period, wherein the target time period is the moment when the first actual temperature value corresponding to the same temperature sensor is suddenly changed; or the target time period is the moment when the difference value of the first actual temperature values of the two adjacent temperature sensors is suddenly changed;

extracting an infrared image group shot in a target period;

determining a foreground image according to the difference value of the images in the infrared image group;

calculating the edge shape and the diffusion speed of the foreground image;

If the edge shape is the same as the shape prestored in the database and the diffusion speed accords with the preset speed, determining that hydrogen fluoride leakage occurs at the position corresponding to the foreground image.

With reference to the first aspect, an embodiment of the present application provides an eighth possible implementation manner of the first aspect, where the heating pad includes a first heat conducting layer, a first insulating layer, a heating layer, a second insulating layer, and a second heat conducting layer that are sequentially stacked; the heating layer is electrically connected with the electric control chip;

The heating layer is made of platinum resistance material; the first insulating layer and the second insulating layer are both made of glass fiber reinforced polyester materials; the inside of the heating gasket is fixedly connected with two adjacent layers through a thermosetting adhesive; the heating gasket is connected with the control equipment body and the control equipment base through screw connection.

With reference to the first aspect, the embodiment of the present application provides a ninth possible implementation manner of the first aspect, wherein the manual diaphragm valve, the two-way pneumatic diaphragm valve, the three-way pneumatic diaphragm valve, the pressure regulating valve, the pressure sensor, the filter, the two-way pneumatic diaphragm valve, the mass flow controller, the three-way pneumatic diaphragm valve, and the two-way pneumatic diaphragm valve are sequentially arranged along a direction from an air inlet to an air outlet of the air path system, so that the special gas can sequentially pass through the manual diaphragm valve, the two-way pneumatic diaphragm valve, the three-way pneumatic diaphragm valve, the pressure regulating valve, the pressure sensor, the filter, the two-way pneumatic diaphragm valve, the mass flow controller, the three-way pneumatic diaphragm valve, and the two-way pneumatic diaphragm valve;

The manual diaphragm valve comprises a manual diaphragm valve body, a first heating gasket and a manual diaphragm valve base; the first heating gasket is clamped between the manual diaphragm valve body and the manual diaphragm valve base in a fixed connection mode;

The two-way air-moving diaphragm valve comprises a first two-way air-moving diaphragm valve body, a second heating gasket and a first two-way air-moving diaphragm valve base; the second heating gasket is clamped between the first two-way pneumatic diaphragm valve body and the first two-way pneumatic diaphragm valve base in a fixed connection mode;

The three-way pneumatic diaphragm valve comprises a first three-way pneumatic diaphragm valve body, a third heating gasket and a first three-way pneumatic diaphragm valve base; the third heating gasket is clamped between the first three-way pneumatic diaphragm valve body and the first three-way pneumatic diaphragm valve base in a fixed connection mode;

The pressure regulating valve comprises a pressure regulating valve body, a fourth heating gasket and a pressure regulating valve base; the fourth heating gasket is clamped between the pressure regulating valve body and the pressure regulating valve base in a fixed connection mode;

The pressure sensor comprises a pressure sensor body, a fifth heating gasket and a pressure sensor base; the fifth heating gasket is clamped between the pressure sensor body and the pressure sensor base in a fixed connection mode;

the filter comprises a filter body, a sixth heating gasket and a filter base; the sixth heating gasket is clamped between the filter body and the filter base in a fixed connection mode;

The two-way air-moving diaphragm valve comprises a second two-way air-moving diaphragm valve body, a seventh heating gasket and a second two-way air-moving diaphragm valve base; the seventh heating gasket is clamped between the second two-air-movement diaphragm valve body and the second two-air-movement diaphragm valve base in a fixed connection mode;

the mass flow controller comprises a mass flow controller body, an eighth heating gasket and a mass flow controller base; the eighth heating gasket is clamped between the mass flow controller body and the mass flow controller base in a fixed connection mode;

The three-way pneumatic diaphragm valve comprises a three-way pneumatic diaphragm valve body, a ninth heating gasket and a three-way pneumatic diaphragm valve base; the ninth heating gasket is clamped between the three-way pneumatic diaphragm valve body and the three-way pneumatic diaphragm valve base in a fixed connection mode;

The two-way air-moving diaphragm valve comprises a third two-way air-moving diaphragm valve body, a tenth heating gasket and a third two-way air-moving diaphragm valve base; the tenth heating gasket is clamped between the third two-way air-moving diaphragm valve body and the third two-way air-moving diaphragm valve base in a fixed connection mode.

According to the control method of the gas circuit system based on the semiconductor reaction cavity, provided by the embodiment of the application, the heating structure of the gas circuit system is changed, and the heating gasket is particularly used for heating, and is arranged between the control equipment body and the control equipment base; the stability of the whole heating system is ensured, and meanwhile, the heating method provided by the application can ensure the uniformity of the temperature of the hydrogen fluoride, and avoid the problem of unstable chemical properties caused by local liquefaction.

In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 shows a basic structure of a gas circuit system of a semiconductor reaction chamber provided by an embodiment of the present application;

FIG. 2 shows a flow chart of a control method of a gas circuit system based on a semiconductor reaction chamber according to an embodiment of the present application;

FIG. 3 shows a schematic diagram of the flow of gas provided by an embodiment of the present application;

Fig. 4 shows a schematic structural diagram of a control device according to an embodiment of the present application;

fig. 5 shows a schematic structural diagram of a heating pad according to an embodiment of the present application.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present application.

The main function of the IGS module is to transport and control the specific gases, in this case Hydrogen Fluoride (HF). In order to meet the use requirement, a special heating device is assisted on the IGS module to realize the function of heating special gas.

In an etching (oxide etching) apparatus of an oxide semiconductor film in a semiconductor process, a special gas Hydrogen Fluoride (HF) is required. HF is colorless and has a pungent odor gas, and has a molecular weight of 20.01, a boiling point of 120 ℃ and a melting point of-83.1 ℃, and is easy to liquefy at normal temperature, so that a special heating device and a heating control technology are required to be used in the process of conveying the HF gas so as to keep the HF gas in a gaseous state.

The development of Surface Mount technology has led to higher integration and smaller package sizes for the semiconductor industry. In the IGS module, a more compact packaging structure can be realized by using a surface mount connection mode, the space utilization rate of the semiconductor device is improved, and the product can better meet the requirements of miniaturization, light weight and high performance.

The proper heating mode is selected when the Surface Mount connection is used, so that the heating effect can be improved, the product quality can be ensured, the production efficiency can be improved, the energy utilization can be optimized, and the maintenance cost can be reduced. When Surface Mount connection is performed, a proper heating mode is selected according to specific requirements and demands so as to improve production efficiency and product quality. The scheme provided by the application also uses the surface mounting technology.

As shown in fig. 1, the basic structure of the gas path system of the semiconductor reaction chamber provided by the application is shown. The air path system comprises: a manual diaphragm valve 1, two pneumatic diaphragm valves 2, 7 and 10, three-way pneumatic diaphragm valves 3 and 9, a pressure regulating valve 4, a pressure sensor 5, a filter 6 and a mass flow controller 8; the manual diaphragm valve 1, the two-way pneumatic diaphragm valve 2, the three-way pneumatic diaphragm valve 3, the pressure regulating valve 4, the pressure sensor 5, the filter 6, the two-way pneumatic diaphragm valve 7, the mass flow controller 8, the three-way pneumatic diaphragm valve 9 and the two-way pneumatic diaphragm valve 10 are sequentially arranged along the direction from the air inlet to the air outlet of the air path system, so that special gas can sequentially pass through the manual diaphragm valve 1, the two-way pneumatic diaphragm valve 2, the three-way pneumatic diaphragm valve 3, the pressure regulating valve 4, the pressure sensor 5, the filter 6, the two-way pneumatic diaphragm valve 7, the mass flow controller 8, the three-way pneumatic diaphragm valve 9 and the two-way pneumatic diaphragm valve 10.

In the specific control, after an operator needs to manually open the manual diaphragm valve 1, the CDA (dry compressed air) is controlled by the electromagnetic valve to drive the two ventilation diaphragm valves 2, 7 and 10 to be opened, and only a small amount of gas passes through the gas path at the moment; parameters of a Mass Flow Controller (MFC) can be set by Devicenet (a field bus standard used in an automation technology) or other communication, wherein the parameters can be HF 1000sccm, the MFC is in an open state at this time, and after a flow rise time t, the whole gas circuit system achieves a state of stably conveying HF. After the manual diaphragm valve 1 is opened, the air passage is kept in an opened state in a normal working state, when the air passage is provided with parts which need to be replaced or other parts which need to stop air supply, the two air passage diaphragm valves 2 are closed, and as double insurance, the manual diaphragm valve 1 can be closed, so that the closing failure of the two air passage diaphragm valves 2 is prevented, and the air passage system is ensured to stop air supply. The three-way pneumatic diaphragm valve is used for controlling the air inlet of the bottom purge air N2 (nitrogen), the air of the whole air path is replaced, the three-way pneumatic diaphragm valve 9 is used for controlling the discharge of the purge air, and after the purge air is discharged for dozens of times, the air path can be replaced after HF is not provided for the air path. The pressure regulating valve 4 is used for regulating HF pressure during normal air supply, the opening of the through-joint regulating valve reaches a proper value by observing the pressure value displayed by the pressure sensor 5 so as to ensure stable flow supply, the filter 6 uses a corrosion-resistant stainless steel filter element to filter particles with the diameter of more than 0.0015 mu m, so that the cleanliness of HF gas passing through the filter is higher, and the problems of open circuit, short circuit and the like caused by the adhesion of the particles on an integrated circuit are prevented from directly affecting the yield of a finally manufactured semiconductor product. The flow controller 8 is a key component of the gas circuit system supply, the accuracy and the efficiency of the flow control are main factors influencing the quality of the semiconductor process, and the flow requirement of the reaction cavity can be met by accurately controlling the HF flow passing through the flow controller.

In order to meet the use requirement, the special heating device is assisted on the gas path system to realize the function of heating the special gas. Because the forms of the air path system are various, the heating modes possibly applicable to the air path systems with different structures are different, and before the scheme is designed, the applicant tries and compares the various heating modes of the air path system provided by the application. The present inventors have tried several heating structures as follows: a wound Heating belt (HEATING TAPE), a Heating rod (Heating Tube) and a Heating patch (HEATING PLATE), wherein the wound Heating belt (HEATING TAPE) is mainly used for Heating a pipeline system; heating rods (Heating tubes) and Heating patches (HEATING PLATE) are mainly used in Surface Mount bases (Block, i.e., the base carrying the individual valves and sensors in fig. 1). After trial, the present inventors thought that a Heating Tube (Heating Tube) had the following problems in use:

1. the heating rod is required to be inserted into the Block, and the Block with the heating hole is required to be used, so that the structural requirement on the Block is high, and the material cost, the management cost and the like are increased;

2. The heating rod is of a tubular structure made of resistance wires or heating wires, is of an elongated rigid structure, is fragile in texture and is easy to damage or deform;

3. The assembly process of the heating rod has higher requirements, and is complex to install and disassemble, in particular to disassemble, and the whole heating rod needs to be disassembled;

4. the heating area is small, the heating is uneven, and the heating efficiency is low.

Heating patch (HEATING PLATE):

1. The adhesive is usually directly stuck on a Block, impurities or particles are generated, and the adhesive is not suitable for environments with high cleanliness requirements;

2. the heating patch needs to be fixed on the side face of the Block, and enough maintenance space needs to be reserved for installation and maintenance;

3. The fixing mode of the heating patch mainly comprises welding fixing, screw fixing, clamping fixing and pasting fixing, wherein the former three are not suitable for heating a surface-mounted base and a valve element, the pasting mode is more convenient, an adhesive can form a uniform film between the heating patch and a Block to provide reliable fixing force, and the heat conduction efficiency can be improved, but the viscosity of the self-adhesive is reduced, the connection is easy to lose efficacy and the fixing force is weaker along with the increase of time and heating temperature;

4. The heating patch is stuck on the side of the Block, is far away from the place where the fluid medium circulates, and has slower process of transmitting heat to the medium through the Block and longer heating time.

In view of the above problems, the present application adopts a heating pad to heat based on the air path system, specifically:

The application provides a control method of an air path system based on a semiconductor reaction cavity, wherein the air path system comprises an electric control chip and a plurality of control devices which are sequentially arranged, and the plurality of control devices comprise a plurality of valves, sensors and a controller; each control device consists of a control device body, a control device base and a heating gasket; each control equipment body, each heating gasket and each control equipment base are provided with an air inlet hole and an air outlet hole; the heating gasket is clamped between the control equipment body and the control equipment base, the air inlet of the control equipment body, the air inlet of the heating gasket and the air inlet of the control equipment base are sequentially communicated, and the air outlet of the control equipment body, the air outlet of the heating gasket and the air outlet of the control equipment base are sequentially communicated, so that heated air can sequentially flow through the air inlet of the control equipment base, the air inlet of the heating gasket, the air inlet of the control equipment body, the inner cavity of the control equipment body, the air outlet of the heating gasket and the air outlet of the control equipment base for each control equipment; each heating pad is electrically connected with the electric control chip respectively; the heating gasket comprises an inner ring gasket, a middle ring gasket and an outer ring gasket, and the distances between the inner ring gasket, the middle ring gasket and the outer ring gasket and the air inlet hole of the control equipment body are sequentially increased; the distances between the inner ring gasket, the middle ring gasket and the outer ring gasket and the air outlet hole of the control equipment body are sequentially increased; a plurality of temperature sensors are sequentially arranged in the control equipment body along the airflow direction;

The plurality of valves includes: a manual diaphragm valve 1, two pneumatic diaphragm valves 2, 7 and 10, three-way pneumatic diaphragm valves 3 and 9 and a pressure regulating valve 4;

The sensor comprises: a pressure sensor 5;

The controller includes: a filter 6, a mass flow controller 8;

Fig. 2 shows a flowchart of a control method of a gas path system based on a semiconductor reaction chamber according to an embodiment of the present application, as shown in fig. 2, including the following steps S201 to S204:

S101: the electronic control chip acquires first temperature detection signals of a plurality of temperature sensors in at least one control equipment body.

S102: the electronic control chip respectively determines first actual temperature values of a plurality of positions inside the at least one control equipment body according to the at least one first temperature detection signal.

S103: aiming at least one control equipment body, if the first actual temperature values are larger than a first preset value and smaller than a second preset value and the temperature uniformity reaches a preset requirement, starting a low-temperature heating function of an outer ring gasket of the control equipment body, and closing heating functions of a middle ring gasket and an inner ring gasket; the first preset value is 55-60 degrees; the second preset value is 75-80 degrees.

S104: for at least one control device body, if at least one first actual temperature value is smaller than a first preset value, determining a heating strategy of the control device body heating gasket according to the value of the first actual temperature value lower than the first preset value.

As shown in fig. 3, in the solution provided by the present application, a plurality of control devices are all arranged in parallel, and are arranged in parallel along the direction from the air inlet to the air outlet of the air path system. The number of the control devices is 10, and the heating gaskets in each control device are on a plane (the heights of the heating gaskets are identical, or the distances between each heating gasket and a target straight line are identical, and the target straight line is formed by connecting an air inlet and an air outlet of an air path system). In general, adjacent heating mats are separated, because the control strategy of different heating mats is preferably determined according to the self condition of the control device in which the heating mats are located, but in some cases, in order to reduce the control complexity and ensure the control linkage, some adjacent heating mats can be connected together, so that the heating mats connected together can be heated by adopting the same strategy (that is, the temperature change of the heating mats connected together is basically the same).

The different control equipment bodies have different functions and roles, and the hydrogen fluoride enters the control equipment body through the air inlet holes of the control equipment body and can be discharged through the air outlet holes of the control equipment body after the internal circulation is completed. As shown in fig. 4, the air inlet holes 17 and the air outlet holes 18 of the heating pad 16 are different from those of the control device body 19, which allows hydrogen fluoride to enter from the outside into the inside thereof or to be discharged from the inside to the outside; the former functions by allowing the hydrogen fluoride discharged through the air inlet hole 21 of the control device base 20 to pass through the heating pad 16 and then enter the inside of the control device body 19 through the air inlet hole of the control device, and allowing the hydrogen fluoride discharged through the air outlet hole of the control device body 19 to pass through the air outlet hole 18 of the heating pad 16 and then enter the air outlet hole 22 of the control device base 20 and further enter the air inlet hole of the next control device base.

Generally, for the same control device, the air inlet hole of the control device body 19, the air inlet hole 17 of the heating pad 16 and the air inlet hole 21 of the control device base 20 are all on the same axis, the three air inlet holes are all generally cylindrical, and the air outlet hole of the control device body, the air outlet hole 18 of the heating pad 16 and the air outlet hole 22 of the control device base 20 are all on the same axis, and the three air inlet holes are all generally cylindrical; by the arrangement, the three air inlets can form a cylindrical cavity, and the three air outlets can form a cylindrical cavity.

After entering the control equipment body 19, the hydrogen fluoride is influenced by pressure, air flow can be formed in the control equipment body 19, and finally the air flow can be discharged from the air outlet, the air flow can enter the control equipment body 19 for heating when entering the control equipment body 19, and after being heated, the air flow can also drive the hydrogen fluoride stored in the control equipment body 19 for heating when moving in the control equipment body 19, so that the aim of integral heating is achieved.

The electric control chip is usually connected to each heating pad by direct connection (such as wire connection), and generally, the electric control chip controls a battery for providing energy for the heating pad, and the electric control chip can adjust the temperature of the heating pad by controlling the current provided by the battery for the heating pad. It should be noted that the electronic control chip is an execution main body of the scheme provided by the application.

In the follow-up step, see the heating gasket in particular, the inner circle gasket, the middle circle gasket and the outer lane gasket of heating gasket are all mutual isolation in space, avoid after the heating of certain gasket, drive other gaskets together generate heat. In the aspect of electric control, the three gaskets are also separated, and the three gaskets can be selected to heat only one gasket, only two gaskets or three gaskets at the same time. The heating temperatures of the three gaskets may be different. The three gaskets are all on the same plane and are not covered (without intersecting), and the gaskets can be flat or net-shaped.

The temperature sensors are generally distributed at various positions in the control apparatus body, but in general, a plurality of temperature sensors are provided along the direction of the air flow, or in other words, along the direction from the air inlet hole to the air outlet hole. In particular, the temperature sensor can only be disposed on the side wall of the inner cavity of the control device body, but it should be noted that the detecting portion of the temperature sensor cannot be close to the side wall of the control device body, because the temperature of the outer space of the control device body is lower than that of the hydrogen fluoride, if the detecting portion is close to the side wall or the side wall, an error is caused in temperature detection, the detecting portion can be supported by the supporting structure, the side wall is far away, but the hydrogen fluoride is corrosive, so that the supporting structure should be made of a proper material, and the sensor is similar.

In step S101, the electronic control chip and the temperature sensor may be connected by a wired or wireless (such as wifi connection or wireless radio frequency connection) manner. Then, the electronic control chip can determine the actual temperatures of different positions in the control device body based on the first temperature detection signal, so that the specific temperature in the control device body under the influence of the airflow can be known. In general, hydrogen fluoride has a boiling point of 20 ℃ and a melting point of-83.1 ℃, and it is found that hydrogen fluoride is easily liquefied at room temperature, particularly at a location where a heated gas flow cannot cover, and its physical properties are unchanged once its physical form is changed, possibly causing other problems. At the same time, the temperature cannot be too high, and if the temperature is too high, the pressure of the hydrogen fluoride in the tank body is too high, so that the tank body can be deformed or other risks under high pressure can be caused. Therefore, in terms of practical situations, it is a better choice to control the temperature between 55 and 80. Therefore, in step S103, when most of the first actual temperature values (most of the temperatures in the control device body) are within this interval, it is indicated that the current state is the most reasonable, and only the control device body needs to be heated by means of low-temperature heating. In general, the number of temperature sensors in a control device body is controlled within 8-10, and the linear distances between two adjacent temperature sensors uniformly distributed in the control device body are equal, so that problems can be encountered in terms of air flow and safety if too much air flow and safety are caused, and in practical operation, the temperature values detected by more than 80% of the sensors are all between 55-80, which indicates that the current temperature is an ideal state. In an ideal state, the heating is preferably performed by the low-temperature heating mode through the outer ring gasket, the main reason is that the inner ring gasket is too close to the air inlet hole and the air outlet hole, the hydrogen fluoride is easy to pass through the air inlet hole and the air outlet hole after being heated up rapidly, and the high-temperature hydrogen fluoride is easy to cause sudden pressure increase in a small space due to the fact that the reference of the air inlet hole and the air outlet hole is small, so that danger can be caused. In the low temperature heating state, the temperature of the heating pad is generally about 55 degrees, that is, the lower limit of the ideal temperature range.

Correspondingly, if the detection result of the temperature sensor in a certain control device body shows that part of the first actual temperature value is smaller than the first preset value, the operation mode of heating should be determined according to the value of the first actual temperature value lower than the first preset value. Generally, the more the first actual temperature value is below the first preset value (the more the number of target temperature sensors, which are sensors whose detected temperature is below a reasonable range), the more aggressive the heating strategy should be, and the smaller the magnitude of the eleven actual temperature values below the preset first preset value, the more aggressive the heating strategy should be.

The hydrogen fluoride gas is transparent and colorless at normal temperature and pressure, but is easily liquefied at low temperature. The saturated vapor pressure of hydrogen fluoride refers to the pressure of the hydrogen fluoride vapor at which equilibrium is reached between hydrogen fluoride and its liquid at a certain temperature. The saturated vapor pressure of hydrogen fluoride is temperature dependent and increases with increasing temperature. Specifically, the law of variation of saturated vapor pressure of hydrogen fluoride with temperature can be described by the following formula:

lg P = A - B/T

Wherein P is the saturated vapor pressure of hydrogen fluoride, and the unit is Pa; t is temperature, and the unit is K; a and B are constants.

The saturated vapor pressure value of the hydrogen fluoride at different temperatures can be obtained according to the formula. By calculation, the saturated vapor pressure of hydrogen fluoride is about 85.11kPa at 20 ℃; at 30 ℃, the saturated vapor pressure of hydrogen fluoride is about 141.86kPa; at 40 ℃, the saturated vapor pressure of hydrogen fluoride is about 670.77kPa; at 50 ℃, the saturated vapor pressure of hydrogen fluoride is about 383.01kPa; the saturated vapor pressure of hydrogen fluoride is about 670.77kPa at 60 ℃. Therefore, it has been estimated and practiced that the temperature of hydrogen fluoride is not suitable to exceed 80 degrees.

Specifically, step S104 may be implemented as follows:

Step 1041, for at least one control device body, determining a heating temperature of the heating pad according to an average value of the first actual temperature values if all of the first actual temperature values of the control device body are smaller than a first preset value and larger than a third preset value, and a variance of the first actual temperature values is smaller than a fourth preset value; the average value of the first actual temperature values and the heating temperature of the heating gasket are in negative correlation, and the average value of the first actual temperature values and the heating area of the heating gasket are in negative correlation; the third preset value is 35-40 degrees;

Step 1042, for at least one control device body, if a plurality of first actual temperature values of the control device body are smaller than a first preset value and larger than a third preset value, and variance of the first actual temperature values is larger than a fifth preset value, starting high temperature heating function of the middle ring gasket and the outer ring gasket, and improving air intake flow; for at least one control equipment body, if a plurality of first actual temperature values of the control equipment body are smaller than a first preset value and larger than a third preset value, and the variance of the first actual temperature values is larger than a fourth preset value and smaller than a fifth preset value, starting a low-temperature heating function of the middle ring gasket and a high-temperature heating function of the outer ring gasket;

Step 1043, for at least one control device body, if at least one first actual temperature value of the control device body is smaller than a first preset value, no first actual temperature value is larger than a second preset value, and variance of the first actual temperature value is larger than a seventh preset value, starting the high-temperature heating function of the middle ring gasket and the outer ring gasket at the same time;

In step 1041, if the preset number (generally more than 30% -50%) of the first actual temperature values are smaller than the first preset value and larger than the third preset value, the temperature is too low, but the liquefaction boundary is not reached, and the temperature is uniform, and at this time, the heating can be considered to be performed in a medium-intensity manner. That is, the temperature of the heating pad increases with the decrease of the average temperature, and the heating area of the heating pad increases with the decrease of the temperature. Specifically, the heating area of the heating pad and the temperature are related, and when the average temperature is close to a first preset value, the outer ring pad is preferably used for heating; after the temperature is reduced to 45 degrees, the inner ring gasket is preferably used for heating, mainly because the pressure of the whole air flow is reduced along with the reduction of the temperature, and even if a high-temperature heating mode is adopted, dangerous conditions can not occur when the air flow passes through the air inlet hole and the air outlet hole. In the process that the air flow temperature is changed to 45 degrees from the first temperature value, the heating gaskets can be gradually started according to the sequence of the outer ring gaskets, the middle ring gaskets and the inner ring gaskets, and meanwhile, the heating function of the outer ring gaskets does not need to be stopped even if the inner ring gaskets or the middle ring gaskets are started. And, since the temperature is not yet lower than the third preset value, the heating temperature of the heating pad should not exceed 100 degrees.

In step 1042, when the temperature conditions are the same as those in step 1041, but the temperature difference between the different positions is larger (i.e. the variance is larger), the heating temperature of the heating pad can be determined according to the variance, and generally, the larger the variance is, the more the middle ring pad should be used for heating, and the higher the heating temperature should be, which mainly considers that the space corresponding to the middle ring pad is not directly led into the air outlet and the air inlet even if the space is locally overheated, and meanwhile, the outer ring pad can ensure the safety, but after the airflow is formed, the gas in the corner is not easy to flow together, and the heating can only be performed by the heat radiation mode, so the heating efficiency is lower.

Specifically, the method can be divided into two cases, wherein in the first case, the variance of the first actual temperature value is larger than a fifth preset value, then the high-temperature heating function of the middle ring gasket and the outer ring gasket is started, and the air inlet flow is improved; the purpose of providing the air inflow is to drive the intensity of the internal air flow circulation, that is, when the temperature difference is too large, the simple heating cannot meet the requirement, and the air inflow is also increased in an auxiliary manner to drive the movement of the hydrogen fluoride, but it is required to be noted that the system in the scheme is also connected to the next link subsequently, so that the amplitude of the air inflow is increased and cannot be too large. Specifically, the pressure may be adjusted by cyclic pressure adjustment, rather than simply increasing the flow, specifically, the intake air flow may be adjusted from large to small or from small to large every 2-3 seconds (generally, the upper and lower limits of the air flow should be set in combination with the downstream equipment of the air path system).

In the second case, when the variance is greater than the fourth preset value and less than the fifth preset value, it is indicated that the problem of temperature non-uniformity does exist, but is not serious, and at this time, the low-temperature heating function of the middle ring gasket and the high-temperature heating function of the outer ring gasket may be turned on. So that the overall heating safety can be ensured, and the temperature of the hydrogen fluoride can be controllably increased. Wherein the fifth preset value is greater than the fourth preset value.

When the overall temperature is low and there is no position with an excessively high temperature, the step 1043 should be performed by adopting an overall heating manner until a certain position in the control device body exceeds a second preset value, so that the execution of the step 1043 is stopped. The seventh preset value is smaller than or equal to the fourth preset value, but the seventh preset value cannot be too small, that is, the difference between the seventh preset value and the fourth preset value is small.

In addition to the several cases reflected in steps 1041-1043 above, the following cases are also illustrated:

When at least one first actual temperature value is smaller than a third preset value, and the position of the first actual temperature value lower than the third preset value is close to the air inlet hole or the air outlet hole, the high-temperature heating function of the inner gasket, the middle ring gasket and the outer ring gasket is started.

In fact, if the temperature sensors are in normal working states, the temperature part in the control equipment body can be in two states, namely upper and lower layering and air flow inner and outer partitioning; the former is because the hydrogen fluoride of lower part is close to the heating gasket, therefore the temperature is higher, also has special circumstances, for example after the heating gasket stops working, the hydrogen fluoride of high temperature can shift up, leads to the hydrogen fluoride of low temperature to sink, and in this case, more easily further cooling down and then lead to the liquefaction of hydrogen fluoride after shifting down, consequently, even under the normal condition of temperature, also can select the mode that the interval drive heating gasket worked to keep the inside temperature of controlgear body even (because the sensor has the condition of not detecting, also has the condition of detecting inhomogeneous, just be difficult to detect such as being close to the position of the control gear body axis).

The inner and outer partitions of the air flow refer to the condition that the temperature is easier to be conducted by the part carried by the air flow and the temperature is not easy to be changed by the part not carried by the sole of the air flow, and for the condition, the range of the air flow can be regulated by adopting a mode of regulating the air inlet flow, so that the condition of temperature change is regulated.

Step S104 also has the following cases:

For at least one control equipment body, if a first actual temperature value detected by a temperature sensor close to an air inlet of the control equipment body is higher than a first preset value, the inner ring gasket is controlled to stop working, and the heating strategy of the middle ring gasket is controlled according to the actual magnitude of the first actual temperature value detected by other temperature sensors.

That is, when the temperature detected by the temperature sensor near the air intake hole of the control apparatus body is too high, it is not suitable to continue heating by the inner ring gasket, which should be closed at this time, and at the same time, if the temperature is further increased, the middle ring gasket should also stop heating (when the second preset value is exceeded). It should be understood that stopping heating in this case means that the inner ring gasket or the middle ring gasket is no longer driven to operate without the temperature returning below a certain value.

Further, when the scheme provided by the application is implemented, the thought of zoning temperature control can be considered, specifically, the gas path system is wholly divided into three zones, namely a first temperature zone, a second temperature zone and a third temperature zone; the first temperature zone includes: a three-way pneumatic diaphragm valve 9 and a two-way pneumatic diaphragm valve 10; the second temperature zone includes: a mass flow controller 8; the third temperature zone includes: a manual diaphragm valve 1, a two-way pneumatic diaphragm valve 2, a three-way pneumatic diaphragm valve 3, a pressure regulating valve 4, a pressure sensor 5, a filter 6 and a two-way pneumatic diaphragm valve 7;

The corresponding three control schemes are as follows:

The first control scheme: the heating temperatures of the heating gaskets of the control equipment body in the first temperature zone, the second temperature zone and the third temperature zone are 60 ℃;

Or alternatively, the first and second heat exchangers may be,

The second control scheme: the heating temperatures of the heating gaskets of the control equipment body in the first temperature zone, the second temperature zone and the third temperature zone are 30 degrees, 45 degrees and 60 degrees respectively;

Or alternatively, the first and second heat exchangers may be,

Third control scheme: the heating temperatures of the heating gaskets of the control equipment body in the first temperature zone, the second temperature zone and the third temperature zone are respectively 30-45 degrees, 45 degrees and 60 degrees.

The scheme has higher requirements on the mass flowmeter 8, the recommended working temperature range of the common flowmeter is 15-45 ℃, if the heating temperature is set at 60 ℃, a high-temperature-resistant flowmeter needs to be used, and compared with the common flowmeter, the high-temperature-resistant flowmeter has higher cost.

The second scheme adopts a step heating mode, so that the hydrogen fluoride temperature can be gradually increased while the requirement of the device on temperature resistance is met, the heating is more stable, and the supply flow is more stable.

The scheme has the advantages that the air inlet preheating temperature range is adjustable, the heating gasket structure of the heating gasket can be adjusted, and the planar net-shaped heating gasket can be adopted.

Specifically, as the flow shown in the basic scheme (S101-S104) provided by the present application, the heating temperatures of the heating pads in the above three control schemes can be understood as low-temperature heating temperatures of the respective heating pads.

Furthermore, besides adjusting the heating strategy according to the real-time temperature condition, the future temperature can be predicted based on the historical data, so that the future temperature can be controlled in advance. The method mainly considers that the temperature of the heating gasket is difficult to quickly drop in the heating process, and when the temperature change is excessively high, the pressure is easily caused to be excessively high to cause danger, so that the future temperature change is predicted in a prediction mode, and the control strategy is adjusted in advance. Specifically, the method provided by the application further comprises the following steps:

Step 201, the electronic control chip acquires a pressure value detected by a pressure sensor at each time point, a heating temperature of a heating gasket in the control device and a second actual temperature value at different positions in a control device body of the control device in a plurality of continuous time points; the second actual temperature value is determined according to the signals acquired by the temperature sensor;

Step 202, generating a corresponding relation of the second actual temperature value along with the heating strategy and time change of the heating gasket under a specific pressure value according to the pressure value detected by the pressure sensor at each time point, the heating strategy of the heating gasket and the second actual temperature value detected by each temperature sensor;

after executing step S104, the method provided by the present application further includes:

step 203, inputting the third actual temperature values, the pressure values detected by the pressure sensor and the heating strategy of the heating pad, which are obtained in real time, at different positions in the control device body into a corresponding relation so as to determine the temperature change conditions at different positions in the control device body after the preset time;

and 204, adjusting the heating strategy of each heating gasket according to the temperature change conditions of different positions in the control equipment body after the preset time.

Steps 201 and 202 are performed in advance before step S101, and in step S201, the electronic control chip obtains a pressure value detected by the pressure sensor, where the pressure value may be roughly considered as a pressure value of the whole gas path system; the heating temperature of the heating gasket can be directly obtained through the control end, and direct measurement is not needed; the second actual temperature value reflects the temperature conditions at different locations in each control device body.

In step 202, the corresponding functional relationship can be fitted based on the values obtained in step 201, and according to practical experience, the universality of the fitted curve is not strong due to different working conditions (mainly, different temperature differences inside and outside the control device in the working environment) and different materials of the control device, so that the fitting is generally needed to be performed again after the working conditions are adjusted. After fitting, a corresponding relation of the second actual temperature along with the heating strategy and time change of the heating gasket can be determined, and the corresponding relation mainly reflects the heating strategy and the time change condition of the second actual temperature value. Among them, the heating strategy mainly includes a change in heating position (difference in inner ring pad, middle ring pad, and outer ring pad), heating temperature (temperature at different positions of the heating pad), and heating interval (time length of interval between two heating actions).

Then, the corresponding relationship is used to predict the change condition of the actual temperature detected by the sensor, that is, in step 203, the third actual temperature value at different positions, the pressure value detected by the pressure sensor and the heating strategy for heating the gasket are obtained first, and these data are input into the fitted functional relationship, so that it is possible to know the temperature value in the control device body at a predetermined time point in the future under the condition of the current heating strategy and the pressure value, and adjust the heating strategy for heating the gasket based on this. There are three main ways to adjust the heating strategy, namely, stopping heating, selecting the heating position (such as selecting the inner ring gasket, the middle ring gasket or the outer ring gasket for heating), and adjusting the heating temperature (generally, mainly, adjusting the temperature downwards, such as changing from high-temperature heating to low-temperature heating).

In addition to using a temperature sensor to directly acquire temperature, the temperature can also be determined with the aid of infrared images.

The second actual temperature value and the third actual temperature value are determined according to signals acquired by the temperature sensor and infrared images shot by an external infrared camera;

Further comprises:

step 301, acquiring a plurality of continuous infrared verification images of a control device body through an infrared camera while acquiring a continuous first temperature detection signal;

Step 302, controlling a reference temperature change rule of the equipment body in the process of acquiring continuous first temperature detection signals according to the difference values of the continuous plurality of infrared verification images and the difference values;

Step 303, determining the credibility of the first temperature detection signal according to the reference temperature change rule;

Specifically, the temperature condition of the outer surface of the control device body is displayed by the infrared image, and the temperature of the hydrogen fluoride in the control device body is not easily transmitted to the shell of the control device body due to the material problem, but through practical use, the control device body in the infrared image is found to be not directly used for extracting the temperature of the hydrogen fluoride in the control device body, but the temperature difference of the hydrogen fluoride in the control device body is large (usually between 35 and 65 degrees), so that the overall change condition of the hydrogen fluoride temperature can be reflected through the infrared image. And as mentioned before, the whole gas path system is divided into three temperature areas when in specific implementation, the heating strategy of each temperature area is different, and the hydrogen fluoride temperature control condition of each area can be determined by infrared detection when in specific implementation.

As described in the preceding paragraph, a single infrared image does not have a strong reference participation, so that in step 301, a plurality of consecutive infrared verification images are first acquired. Thereafter, in step 302, it may be determined that 1 is the temperature change rule of one control device body, 2 is the temperature change condition between different control device bodies, for example, the temperatures of the heating gaskets in the mass flow controller 8 and the three-way pneumatic diaphragm valve 9 are different, and further, in the infrared image, the temperatures reacted by the mass flow controller 8 and the three-way pneumatic diaphragm valve 9 should be different. That is, the heating strategy (control strategy) of the heating pad in each control device shown in the infrared image and the temperature value detected by the temperature sensor should be matched. Once the coincidence degree is abnormal, the problem of the credibility of the first temperature detection signal is indicated. Particularly when a large difference in fit occurs, the alarm should be considered.

Further, when abnormality occurs in the fitness, the following cases are specifically classified:

The gas leaks, when the hydrogen fluoride leaks, the temperature sensor does not need to display, but can display in an infrared image, and the leaked hydrogen fluoride is higher than the environment temperature outside the control equipment body, so that the leakage can be displayed through the infrared image; in the scheme of the application, the leak position of the hydrogen fluoride can be detected by carrying out similarity comparison on a plurality of continuous infrared images. Generally, the shape of the region with high temperature is not matched with the shape of the control equipment body pre-stored in the system, so that leakage can be considered, and the shape of the leaked high-temperature gas can be obviously seen.

That is, the method provided by the application further comprises the following steps:

extracting an infrared image group shot in a target period;

calculating the edge shape and the diffusion speed of the foreground image;

Specifically, the objective of determining the target period is to save the investigation cost, and in the process of normal operation of the gas circuit system, the time period required for investigation is very long, and in general, investigation should be performed once every several seconds, but such investigation times bring a large burden to the system, so that the determination can be completed quickly by taking the temperature sensor as a departure condition. Specifically, the first temperature detection signal detected by the temperature sensor may be used to directly perform the comparison, for example, whether the signal amplitude of the first temperature detection signal generated by the same temperature sensor is changed rapidly (in this case, the temperature value should be positively correlated with the signal amplitude), and the comparator circuit may be used to perform the automatic comparison. If the comparison is performed using an infrared image, the number of image frames to be compared is excessive, and the amount of computation is excessive. For another example, the temperature values detected by two adjacent temperature sensors are compared (in this case, the digital signals converted from the analog signals are generally compared). The jump in temperature value indicates that a leak may occur (because the outside temperature is relatively low).

The foreground image refers to a special part in different infrared images, because the temperature of the outer surface of the control equipment does not jump under normal conditions, and the temperature of the surface only changes slowly, the jump is caused, so that the high-temperature hydrogen fluoride is indicated to directly leak into the environment, at the moment, the leaked hydrogen fluoride is found through the infrared images, and the common camera cannot recognize the leaked hydrogen fluoride because the hydrogen fluoride is transparent and colorless gas. In general, the shooting time of the two images to be compared cannot exceed 1 second, otherwise the control device may be mistakenly identified as a foreground image, and when hydrogen fluoride leaks, a sufficient volume of gas can leak out in 1 second, and then be identified as the foreground image.

The diffusion speed is relatively direct, that is, the movement speed of the foreground image in unit time is calculated, the movement speed of the pixel point can be directly calculated by calculating the distance between the target pixel point (the pixel point of the foreground image, usually the pixel point corresponding to the high-temperature object) and the two images, and then the diffusion speed is obtained (generally, the average value of the distances between the pixel points and the two images can be taken as the movement distance, and then the diffusion speed can be obtained by dividing the movement distance by the shooting interval between the two images). The diffusion rate is calculated because movement of other objects (e.g., personnel) may also cause movement of the hot gas stream, but the diffusion rate is significantly different from the leakage rate.

The edge shape refers to a shape corresponding to an edge of the foreground image. The edge shape is judged by adopting the edge shape, and the edge shape of the normal air flow (such as air flow motion driven by wind blowing or pedestrians) is obviously different from the shape of the leakage of the hydrogen fluoride through the small holes. Therefore, in this embodiment, the edge shape and the diffusion rate are used together to make the judgment.

In practice, the shape of the air flow is preferably chosen to pre-store some leakage conditions in the database, so that the comparison speed is higher and the model is traversed more than the model obtained by training. However, the shape of the gas flow of the leaked hydrogen fluoride may vary slightly due to the difference in shape and material of the control device itself, and a remodelling analysis may be considered before use.

2, Failure of the temperature sensor, as described above, is likely to occur due to corrosion as the time of use increases. The malfunctioning temperature sensor can be judged by the condition displayed in the infrared image, for example, the temperatures detected by two adjacent temperature sensors are greatly different, but in the infrared image, the image RGB values of the positions corresponding to the two sensors are the same, at the moment, a certain sensor can be considered to be abnormal, and a manual detection mode can be adopted for intervention. Specifically, the method provided by the application can further comprise the following steps:

If the RGB difference values corresponding to the two temperature sensors are matched with the difference value of the first actual temperature values of the two temperature sensors and the changes with time are synchronous, the temperature sensors are indicated to have no abnormal condition, otherwise, the temperature sensors are indicated to have abnormal conditions. Typically, infrared images are inherently difficult to anomaly and therefore can function as a verification for temperature sensors operating in corrosive environments.

The air path system provided by the scheme is described in detail below.

As shown in fig. 5, the heating pad includes a first heat conduction layer 11, a first insulating layer 12, a heating layer 13, a second insulating layer 14, and a second heat conduction layer 15, which are sequentially stacked; the heating layer 13 is electrically connected with the electric control chip;

the heating layer 13 is made of platinum resistance material; the first insulating layer 12 and the second insulating layer 14 are both made of glass fiber reinforced polyester material; the inside of the heating gasket is fixedly connected with two adjacent layers through a thermosetting adhesive; the heating gasket is connected with the control equipment body and the control equipment base through screw connection.

The insulating layer is made of glass fiber reinforced polyester, has good mechanical strength and electrical insulation property, and also has good thermal conductivity, so that the connecting part and electronic equipment can be effectively protected, the safety and reliability of the connecting part are ensured, and the heat loss is reduced as much as possible. The material used for the heat conducting layer is mainly graphite, and has good heat conducting property and stable temperature characteristic. The heat conducting material can effectively conduct heat, has a low thermal expansion coefficient, and is suitable for heat conducting application in high-temperature environments. The thermosetting adhesive is adopted among the heating resistance wire (heating layer 13), the upper insulating plate (first insulating layer 12) and the lower insulating plate (second insulating layer 14), and the heating resistance wire has the advantages that the adhesive can sufficiently bond the heating resistance wire with the upper insulating plate and the lower insulating plate, gaps in the middle are eliminated, heat transfer efficiency is improved, and heat loss is reduced. The thermosetting adhesive is adopted between the upper insulating plate and the lower insulating plate as well as between the upper insulating plate and the heat conducting plate, and the heat-conducting plate has the advantages that the adhesive can be fully adhered, gaps in the middle can be eliminated, the heat transfer efficiency can be improved, and the heat loss can be reduced.

The manual diaphragm valve 1, the two-way pneumatic diaphragm valve 2, the three-way pneumatic diaphragm valve 3, the pressure regulating valve 4, the pressure sensor 5, the filter 6, the two-way pneumatic diaphragm valve 7, the mass flow controller 8, the three-way pneumatic diaphragm valve 9 and the two-way pneumatic diaphragm valve 10 are sequentially arranged along the direction from the air inlet to the air outlet of the air path system, so that special gas can sequentially pass through the manual diaphragm valve 1, the two-way pneumatic diaphragm valve 2, the three-way pneumatic diaphragm valve 3, the pressure regulating valve 4, the pressure sensor 5, the filter 6, the two-way pneumatic diaphragm valve 7, the mass flow controller 8, the three-way pneumatic diaphragm valve 9 and the two-way pneumatic diaphragm valve 10;

The manual diaphragm valve 1 comprises a manual diaphragm valve body, a first heating gasket and a manual diaphragm valve base; the first heating gasket is clamped between the manual diaphragm valve body and the manual diaphragm valve base in a fixed connection mode;

the two-way air-moving diaphragm valve 2 comprises a first two-way air-moving diaphragm valve body, a second heating gasket and a first two-way air-moving diaphragm valve base; the second heating gasket is clamped between the first two-way pneumatic diaphragm valve body and the first two-way pneumatic diaphragm valve base in a fixed connection mode;

The three-way pneumatic diaphragm valve 3 comprises a first three-way pneumatic diaphragm valve body, a third heating gasket and a first three-way pneumatic diaphragm valve base; the third heating gasket is clamped between the first three-way pneumatic diaphragm valve body and the first three-way pneumatic diaphragm valve base in a fixed connection mode;

the pressure regulating valve 4 comprises a pressure regulating valve body, a fourth heating gasket and a pressure regulating valve base; the fourth heating gasket is clamped between the pressure regulating valve body and the pressure regulating valve base in a fixed connection mode;

The pressure sensor 5 comprises a pressure sensor body, a fifth heating gasket and a pressure sensor base; the fifth heating gasket is clamped between the pressure sensor body and the pressure sensor base in a fixed connection mode;

The filter 6 includes a filter body, a sixth heating pad, and a filter base; the sixth heating gasket is clamped between the filter body and the filter base in a fixed connection mode;

The two-way air-moving diaphragm valve 7 comprises a second two-way air-moving diaphragm valve body, a seventh heating gasket and a second two-way air-moving diaphragm valve base; the seventh heating gasket is clamped between the second two-air-movement diaphragm valve body and the second two-air-movement diaphragm valve base in a fixed connection mode;

The mass flow controller 8 comprises a mass flow controller body, an eighth heating pad and a mass flow controller base; the eighth heating gasket is clamped between the mass flow controller body and the mass flow controller base in a fixed connection mode;

the three-way pneumatic diaphragm valve 9 comprises a three-way pneumatic diaphragm valve body, a ninth heating gasket and a three-way pneumatic diaphragm valve base; the ninth heating gasket is clamped between the three-way pneumatic diaphragm valve body and the three-way pneumatic diaphragm valve base in a fixed connection mode;

The two-way air-moving diaphragm valve 10 includes a third two-way air-moving diaphragm valve body, a tenth heating pad, and a third two-way air-moving diaphragm valve base; the tenth heating gasket is clamped between the third two-ventilation diaphragm valve body and the third two-ventilation diaphragm valve base in a fixed connection mode;

the gas path system provided by the application has the advantages of installation and maintenance:

The heating gasket is arranged between the valve part and the base, and the other parts are fixed by the screws, and the screws can penetrate through the reserved hole sites of the heating gasket without additional fixing modes, so that the heating gasket is simpler and more convenient to install and maintain.

The maintenance space is small, only the screws between the Block and the parts needing to be replaced can be removed and replaced, no extra transverse space is needed, and the installation of the heating gaskets of other parts is not affected.

The heating gasket can be made into a single module or a plurality of groups of integrated according to the temperature zone requirements; the structure expansibility is strong, the applicability is wide, and different block numbers, hole numbers and control points can be customized according to various working conditions.

The heating gasket adopts a quick-inserting structure, is used in series, reduces the connection of cables, and increases the reliability of equipment.

The aspect of heating effect:

The resistance material of the heating layer 13 is platinum resistance material, has higher resistivity and good stability, can stably work in a higher temperature range, and can realize stable heating effect and temperature control. The insulating layer is made of glass fiber reinforced polyester, has good mechanical strength and electrical insulation property, and also has good thermal conductivity, so that the connecting part and electronic equipment can be effectively protected, the safety and reliability of the connecting part are ensured, and the heat loss is reduced as much as possible.

The heating efficiency is high, and two faces of the heating gasket are directly contacted with the control equipment body and the control equipment base, so that the contact area is large, and the heating efficiency is high due to the fact that the heating gasket is nearest to the medium.

The controllability of the heating areas is high, and the heating temperature of each temperature area can be independently controlled;

Constant temperature control-static temperature control range is wide and dynamic temperature control precision is high. Under the constant temperature control mode, the temperature can be adjusted near the set value so as to adapt to different process requirements. Different static constant temperature intervals can be set to meet different process requirements.

Finally, it should be noted that: the above examples are only specific embodiments of the present application, and are not intended to limit the scope of the present application, but it should be understood by those skilled in the art that the present application is not limited thereto, and that the present application is described in detail with reference to the foregoing examples: any person skilled in the art may modify or easily conceive of the technical solution described in the foregoing embodiments, or perform equivalent substitution of some of the technical features, while remaining within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. The control method of the gas circuit system based on the semiconductor reaction cavity is characterized in that the gas circuit system comprises an electric control chip and a plurality of control devices which are sequentially arranged, wherein the plurality of control devices comprise a plurality of valves, sensors and a controller; each control device consists of a control device body, a control device base and a heating gasket; each control equipment body, each heating gasket and each control equipment base are provided with an air inlet hole and an air outlet hole; the heating gasket is clamped between the control equipment body and the control equipment base, the air inlet of the control equipment body, the air inlet of the heating gasket and the air inlet of the control equipment base are sequentially communicated, and the air outlet of the control equipment body, the air outlet of the heating gasket and the air outlet of the control equipment base are sequentially communicated, so that heated air can sequentially flow through the air inlet of the control equipment base, the air inlet of the heating gasket, the air inlet of the control equipment body, the inner cavity of the control equipment body, the air outlet of the heating gasket and the air outlet of the control equipment base for each control equipment; each heating gasket is electrically connected with the electric control chip respectively; the heating gasket comprises an inner ring gasket, a middle ring gasket and an outer ring gasket, and the distances between the inner ring gasket, the middle ring gasket and the outer ring gasket and an air inlet hole of the control equipment body are sequentially increased; the distances between the inner ring gasket, the middle ring gasket and the outer ring gasket and the air outlet hole of the control equipment body are sequentially increased; a plurality of temperature sensors are sequentially arranged in the control equipment body along the airflow direction;

the plurality of valves includes: a manual diaphragm valve (1), two pneumatic diaphragm valves (2, 7, 10), three-way pneumatic diaphragm valves (3, 9), and a pressure regulating valve (4); the sensor includes: a pressure sensor (5); the controller includes: a filter (6), a mass flow controller (8);

the control method comprises the following steps:

2. The method of claim 1, wherein for at least one control device body, if at least one first actual temperature value is less than a first preset value, determining a heating strategy for the control device body to heat the gasket according to a value of the first actual temperature value that is less than the first preset value, comprises:

3. The method of claim 2, wherein the plurality of control devices includes a first temperature zone, a second temperature zone, and a third temperature zone; the first temperature zone includes: a three-way pneumatic diaphragm valve (9) and two pneumatic diaphragm valves (10); the second temperature zone includes: a mass flow controller (8); the third temperature zone includes: a manual diaphragm valve (1), a two-way pneumatic diaphragm valve (2), a three-way pneumatic diaphragm valve (3), a pressure regulating valve (4), a pressure sensor (5), a filter (6) and a two-way pneumatic diaphragm valve (7);

Or alternatively, the first and second heat exchangers may be,

4. A method according to claim 3, wherein the method further comprises:

5. The method of claim 4, wherein the second actual temperature value and the third actual temperature value are each determined from a signal acquired by the temperature sensor and an infrared image captured by an external infrared camera;

the method further comprises the steps of:

6. The method according to claim 1, wherein the method further comprises:

7. The method of claim 1, wherein for at least one control device body, if at least one first actual temperature value is less than a first preset value, determining a heating strategy for the control device body to heat the gasket according to a value of the first actual temperature value that is less than the first preset value, comprises:

8. The method according to claim 1, wherein the method further comprises:

extracting an infrared image group shot in a target period;

calculating the edge shape and the diffusion speed of the foreground image;

9. The method of claim 1, wherein the heating pad comprises a first thermally conductive layer, a first insulating layer, a heating layer, a second insulating layer, and a second thermally conductive layer sequentially stacked in that order; the heating layer is electrically connected with the electric control chip;

10. The method according to claim 1, characterized in that the manual diaphragm valve (1), the two-way pneumatic diaphragm valve (2), the three-way pneumatic diaphragm valve (3), the pressure regulating valve (4), the pressure sensor (5), the filter (6), the two-way pneumatic diaphragm valve (7), the mass flow controller (8), the three-way pneumatic diaphragm valve (9) and the two-way pneumatic diaphragm valve (10) are arranged in sequence in the direction from the air inlet to the air outlet of the air circuit system, so that the special gas can sequentially pass through the manual diaphragm valve (1), the two-way pneumatic diaphragm valve (2), the three-way pneumatic diaphragm valve (3), the pressure regulating valve (4), the pressure sensor (5), the filter (6), the two-way pneumatic diaphragm valve (7), the mass flow controller (8), the three-way pneumatic diaphragm valve (9) and the two-way pneumatic diaphragm valve (10);

The manual diaphragm valve (1) comprises a manual diaphragm valve body, a first heating gasket and a manual diaphragm valve base; the first heating gasket is clamped between the manual diaphragm valve body and the manual diaphragm valve base in a fixed connection mode;

The two-way pneumatic diaphragm valve (2) comprises a first two-way pneumatic diaphragm valve body, a second heating gasket and a first two-way pneumatic diaphragm valve base; the second heating gasket is clamped between the first two-way pneumatic diaphragm valve body and the first two-way pneumatic diaphragm valve base in a fixed connection mode;

The three-way pneumatic diaphragm valve (3) comprises a first three-way pneumatic diaphragm valve body, a third heating gasket and a first three-way pneumatic diaphragm valve base; the third heating gasket is clamped between the first three-way pneumatic diaphragm valve body and the first three-way pneumatic diaphragm valve base in a fixed connection mode;

The pressure regulating valve (4) comprises a pressure regulating valve body, a fourth heating gasket and a pressure regulating valve base; the fourth heating gasket is clamped between the pressure regulating valve body and the pressure regulating valve base in a fixed connection mode;

The pressure sensor (5) comprises a pressure sensor body, a fifth heating gasket and a pressure sensor base; the fifth heating gasket is clamped between the pressure sensor body and the pressure sensor base in a fixed connection mode;

the filter (6) comprises a filter body, a sixth heating gasket and a filter base; the sixth heating gasket is clamped between the filter body and the filter base in a fixed connection mode;

the two-way air-moving diaphragm valve (7) comprises a second two-way air-moving diaphragm valve body, a seventh heating gasket and a second two-way air-moving diaphragm valve base; the seventh heating gasket is clamped between the second two-air-movement diaphragm valve body and the second two-air-movement diaphragm valve base in a fixed connection mode;

The mass flow controller (8) comprises a mass flow controller body, an eighth heating gasket and a mass flow controller base; the eighth heating gasket is clamped between the mass flow controller body and the mass flow controller base in a fixed connection mode;

The three-way pneumatic diaphragm valve (9) comprises a three-way pneumatic diaphragm valve body, a ninth heating gasket and a three-way pneumatic diaphragm valve base; the ninth heating gasket is clamped between the three-way pneumatic diaphragm valve body and the three-way pneumatic diaphragm valve base in a fixed connection mode;

The two-way air-moving diaphragm valve (10) comprises a third two-way air-moving diaphragm valve body, a tenth heating gasket and a third two-way air-moving diaphragm valve base; the tenth heating gasket is clamped between the third two-way air-moving diaphragm valve body and the third two-way air-moving diaphragm valve base in a fixed connection mode.