CN118139297A - Back drilling depth determining method, circuit board processing method and system - Google Patents
Back drilling depth determining method, circuit board processing method and system Download PDFInfo
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- CN118139297A CN118139297A CN202410370488.0A CN202410370488A CN118139297A CN 118139297 A CN118139297 A CN 118139297A CN 202410370488 A CN202410370488 A CN 202410370488A CN 118139297 A CN118139297 A CN 118139297A
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- 238000005553 drilling Methods 0.000 title claims abstract description 193
- 238000000034 method Methods 0.000 title claims abstract description 60
- 238000003672 processing method Methods 0.000 title claims abstract description 22
- 239000010410 layer Substances 0.000 claims abstract description 181
- 239000002344 surface layer Substances 0.000 claims abstract description 75
- 238000012545 processing Methods 0.000 claims abstract description 60
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000009713 electroplating Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000020347 spindle assembly Effects 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The application discloses a back drilling depth determining method, a circuit board processing method and a circuit board processing system, which belong to the technical field of circuit board manufacturing, and the distances between a surface layer and a reference layer and the distances between the reference layer and a back drilling target layer are obtained by acquiring the position information of the surface layer, the reference layer and the back drilling target layer corresponding to the back drilling position; acquiring thickness variation of a surface layer corresponding to a back drilling position before back drilling processing; and determining the back drilling depth of the back drilling position by using the distance between the surface layer and the reference layer, the distance between the reference layer and the back drilling target layer and the thickness variation. The back drilling depth determining method can effectively avoid back drilling depth errors caused by surface layer thickness difference brought by a processing procedure before back drilling processing, accurately determine back drilling depth of a back drilling position to be accurately determined, thereby improving control precision of short column length, meeting the requirement on precision of short column length, and reducing product rejection caused by the precision problem of short column length.
Description
Technical Field
The application belongs to the technical field of circuit board manufacturing, and particularly relates to a back drilling depth determining method, a circuit board processing method and a circuit board processing system.
Background
Along with the popularization of 5G technology and the requirement of high-speed service, the back drilling Stub length is controlled more and more strictly, and the conventional mode of equidistantly controlling depth from the surface of a PCB (Printed Circuit Board printed circuit board) cannot meet the precision requirement of circuit board processing on the back drilling Stub length.
At present, the industry adopts the mode of inlayer detection to obtain the data that need accuse dark, compares in equidistant accuse dark, and inlayer detection can promote the precision of short column length to a certain extent, and the effectual inconsistent problem of whole circuit board medium thickness that causes because of inlayer gummosis homogeneity is not good in the circuit board lamination process. However, the manner of inner layer detection still does not fully meet the requirements for stub length accuracy.
Disclosure of Invention
The application aims to: the embodiment of the application provides a back drilling depth determining method, which aims to solve the technical problem that the existing inner layer detection mode still cannot fully meet the requirement on short column length precision; another object of the embodiment of the application is to provide a circuit board processing method; a third object of an embodiment of the present application is to provide a circuit board processing system.
The technical scheme is as follows: the back drilling depth determining method provided by the embodiment of the application comprises the following steps:
Acquiring position information of a surface layer, a reference layer and a back drilling target layer at a back drilling position on a circuit board, and acquiring the distance between the surface layer and the reference layer and the distance between the reference layer and the back drilling target layer according to the position information, wherein the reference layer and the back drilling target layer are positioned in the circuit board, and the reference layer is positioned between the surface layer and the back drilling target layer;
after all processing procedures before back drilling processing are completed, obtaining the thickness variation of the surface layer of the back drilling position to be drilled;
and determining the back drilling depth of the back drilling position to be backed by the surface layer, the distance between the reference layer and the back drilling target layer and the thickness variation.
In some embodiments, according to the formula: k=h 1+H2+H0 -H, determining the backdrilling depth of the position to be backdrilled;
Wherein K is a back drilling depth for determining the back drilling position, H 1 is a distance between the surface layer and the reference layer, H 2 is a distance between the reference layer and the back drilling target layer, H 0 is the thickness variation, and H is a short column length threshold.
In some embodiments, the thickness variation is the total thickness of the surface layer copper plating and/or overlay solder mask layer of the locations to be backdrilled.
In some embodiments, the position to be backdrilled is measured by a thickness gauge to obtain the thickness variation.
In some embodiments, the thickness gauge comprises a copper thickness gauge.
In some embodiments, the thickness variation is obtained by slicing the circuit board along the thickness direction thereof at the position to be backdrilled, and measuring the slice.
In some embodiments, the stub length threshold h is less than or equal to 6 mils.
Correspondingly, the circuit board processing method provided by the embodiment of the application comprises the following steps:
Drilling a circuit board for one time, acquiring position information of a surface layer, a reference layer and a back drilling target layer at a back drilling position, and obtaining the distance between the surface layer and the reference layer and the distance between the reference layer and the back drilling target layer according to the position information, wherein the reference layer and the back drilling target layer are positioned in the circuit board, and the reference layer is positioned between the surface layer and the back drilling target layer;
after all processing procedures before back drilling processing are completed, obtaining the thickness variation of the surface layer of the back drilling position to be drilled;
Determining the back drilling depth of the back drilling position to be backed up based on the distance between the surface layer and the reference layer, the distance between the reference layer and the back drilling target layer and the thickness variation;
And carrying out back drilling processing according to the back drilling depth, and forming back drilling holes at the back drilling position to be backed.
In some embodiments, the circuit board is provided with a plurality of positions to be backed-drilled, the distance between the surface layer and the reference layer, the distance between the reference layer and the backing target layer and the thickness variation of each position to be backed-drilled are respectively obtained when drilling is performed once, and the backing depth of each position to be backed-drilled is respectively determined;
and respectively forming back drilling holes at each back drilling position according to the back drilling depth of each back drilling position.
In some embodiments, at least one of the locations to be backdrilled is different from at least another one of the locations to be backdrilled by the amount of thickness variation.
In some embodiments, at least one of the positions to be backdrilled is different from at least another of the positions to be backdrilled by the backdrilling depth.
Accordingly, a circuit board processing system according to an embodiment of the present application includes a circuit board processing apparatus configured to perform the circuit board processing method as described above.
The beneficial effects are that: according to the back drilling depth determining method, the distance between the surface layer and the reference layer and the distance between the reference layer and the back drilling target layer are obtained by acquiring the position information of the surface layer, the reference layer and the back drilling target layer corresponding to the back drilling position; acquiring thickness variation of a surface layer corresponding to a back drilling position before back drilling processing; and determining the back drilling depth of the back drilling position by using the distance between the surface layer and the reference layer, the distance between the reference layer and the back drilling target layer and the thickness variation. The back drilling depth determining method can effectively avoid back drilling depth errors caused by surface layer thickness difference brought by a processing procedure before back drilling processing, accurately determine back drilling depth of a back drilling position to be accurately determined, thereby improving control precision of short column length, meeting the requirement on precision of short column length, and reducing product rejection caused by the precision problem of short column length.
According to the circuit board processing method, the position information of the surface layer, the reference layer and the back drilling target layer corresponding to the back drilling position is obtained through one-time drilling, and the distance between the surface layer and the reference layer and the distance between the reference layer and the back drilling target layer are obtained; acquiring thickness variation of a surface layer corresponding to a back drilling position before back drilling processing; determining the back drilling depth of the back drilling position by using the distance between the surface layer and the reference layer, the distance between the reference layer and the back drilling target layer and the thickness variation; and then back drilling is carried out based on the back drilling depth, and back drilling holes are formed at the back drilling positions to be back drilled. The circuit board processing method can improve the control precision of the length of the short column, meet the requirement of the precision of the length of the short column, reduce the interference caused by the short column, reduce the problems of reflection, scattering, delay and the like of signal transmission, and reduce the product rejection caused by the precision problem of the length of the short column.
The circuit board processing system of the embodiment of the application comprises a circuit board processing device, wherein the circuit board processing device is configured to execute the circuit board processing method. Therefore, the circuit board processing system can realize all technical features and beneficial effects of the circuit board processing method, and is not described herein.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of back drilling depth in a back drilling depth determining method according to an embodiment of the present application;
fig. 2 is a schematic diagram of a distance between a surface layer and a reference layer and a distance between the reference layer and a back drilling target layer in the back drilling depth determining method according to the embodiment of the present application;
fig. 3 is a schematic diagram of back drilling depths of a plurality of positions to be back drilled in the circuit board processing method according to the embodiment of the present application;
Fig. 4 is a flowchart of a circuit board processing method according to an embodiment of the present application;
reference numerals: 100-a circuit board; 110-a position to be backdrilled; 120-surface layer; 130-a reference layer; 140-backing the target layer; 150-surface variation layer.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.
In the description of the present application, it is to be understood that the meaning of "a plurality" is two or more, and at least one means one, two or more, unless explicitly defined otherwise.
The circuit board processing equipment comprises a base, a cross beam, a main shaft assembly, a workbench and the like, wherein the workbench is arranged on the base and moves along a second direction, the cross beam is arranged above the workbench, and at least one main shaft assembly is slidingly connected to the cross beam and moves along the first direction; the bottom end of each spindle assembly clamps a cutter, and the cutter moves along a third direction to process a circuit board carried on a workbench; the first direction, the second direction and the third direction are mutually perpendicular. In the context of the present invention, the circuit board processing apparatus may be implemented as a drilling apparatus, a forming apparatus, a gong machine apparatus, a gong-drilling integrated apparatus, etc., without limitation.
In circuit board processing equipment, the work table is a carrier circuit board, and the circuit board has various specifications, for example: the circuit boards are fixed on a workbench, and the circuit boards with different specifications are fixed on the workbench in different forms, for example, a bakelite plate, an air clamp assembly or a vacuum adsorption fixing circuit board is used on the workbench. In the circuit board processing equipment, the workbench is provided with at least one processing area, each processing area is used for placing one circuit board, and each spindle assembly corresponds to one circuit board of one processing area so as to process the circuit board.
Circuit boards are typically constructed of multiple layers of circuitry that are in communication with each other according to the circuit design. Vias are typically formed through a single drill from the surface layer of the circuit board to the underlying layer and copper plated to enable the layers to be connected in a circuit design. However, the copper plating portion of the via hole without the circuit connection may form a Stub (Stub) capable of generating signal radiation, causing interference to other surrounding signals, causing reflection, scattering, delay, etc. of signal transmission, and seriously affecting the normal operation of the circuit system, so that the redundant Stub needs to be drilled out from the back surface of the circuit board by back drilling.
In the related art, an inner layer detection mode is generally adopted, so that the problem of inconsistent thickness of the medium of the whole circuit board caused by poor uniformity of inner layer gummosis in the circuit board lamination process can be effectively solved. However, after one drilling and before back drilling, other processing procedures such as electroplating, solder resist and the like are required, which often causes the thickness of the surface layer of the circuit board to change, and the thickness change of the surface layer of different areas of the circuit board is different, so that the thickness change of the surface layer of the circuit board can influence the control accuracy of the final short column length.
In order to improve the control accuracy of the length of the back drill short column, an embodiment of the present application provides a back drill depth determining method, please refer to fig. 1 and fig. 2 together, which includes:
Acquiring position information of the surface layer 120, the reference layer 130 and the back drilling target layer 140 of the position 110 to be back drilled on the circuit board 100, and acquiring the distance between the surface layer 120 and the reference layer 130 and the distance between the reference layer 130 and the back drilling target layer 140 according to the position information; the reference layer 130 and the back drilling target layer 140 are positioned inside the circuit board 100, and the reference layer 130 is positioned between the surface layer 120 and the back drilling target layer 140;
after all the processing procedures before back drilling are completed, the thickness variation of the surface layer 120 of the position 110 to be back drilled is obtained;
the backdrilling depth of the position to be backdrilled 110 is determined based on the distance of the surface layer 120 and the reference layer 130, the distance of the reference layer 130 and the backdrilled target layer 140, and the thickness variation.
It can be appreciated that before determining the back drilling depth, the method firstly obtains the distance between the surface layer 120 and the reference layer 130 of the position 110 to be backed by the circuit board 100, the distance between the reference layer 130 and the back drilling target layer 140, and the accurate thickness variation of the surface layer 120, and uses the distance between the surface layer 120 and the reference layer 130, the distance between the reference layer 130 and the back drilling target layer 140, and the thickness variation as three elements for determining the back drilling depth, so that the accurate back drilling depth can be obtained, and further, the circuit board processing can be guided by the accurate back drilling depth, the back drilling precision in the circuit board processing process can be improved, the product yield can be improved, and the service performance of the circuit board 100 can be ensured.
The position information is the coordinate information of the surface layer 120, the reference layer 130 and the backing target layer 140 of the backing drill position 110 in the processing process of the circuit board processing device, and the distance H 1 between the surface layer 120 and the reference layer 130 and the distance H 2 between the reference layer 130 and the backing target layer 140 can be calculated by detecting and collecting the Z-axis position information of the surface layer 120, the reference layer 130 and the backing target layer 140 at the backing drill position 110, so as to obtain the accurate depth of the backing target layer 140 at the backing drill position 110.
In addition, after the processing procedure before the back drilling process is completed, the surface layer 120 of the circuit board 100 may be thickened due to electroplating, solder resist, and other procedures, the thickened portion is a surface variation layer 150, and the surface variation layer 150 may be specifically electroplated copper and/or solder resist ink. The thickness of the surface variation layer 150 is obtained, that is, the thickness variation H 0 of the surface layer 120 can be accurately obtained, so that the depth of the backing to be drilled at the corresponding position 110 to be backed up can be determined by using H 0、H1、H2.
It should be further noted that, the backdrilling target layer 140 refers to a specific layer that is connected to other layers or performs internal circuit connection in the circuit design, for example, in some embodiments, it is assumed that the circuit board 100 has a six-layer structure (although the circuit board 100 may have other layers in other embodiments), the circuit design requires the first layer and the third layer to be connected, and in the backdrilling process, the third layer is the backdrilling target layer 140, at least part of copper plating at the backdrilling target layer 140 needs to be reserved, so as to ensure circuit connection of the circuit board 100. The reference layer 130 is located between the surface layer 120 and the backdrilling target layer 140, and in the above embodiment, the reference layer 130 may be a fourth layer.
In some embodiments, according to the formula: k=h 1+H2+H0 -H, determining the backdrilling depth of the to-be-backdrilled position 110; where K is the back drilling depth for determining the back drilling position 110, H 1 is the distance between the surface layer 120 and the reference layer 130, H 2 is the distance between the reference layer 130 and the back drilling target layer 140, H 0 is the thickness variation, and H is the stub length threshold.
Where the backdrilling depth corresponds exactly to the backdrilling target layer 140 when the stub length threshold h is 0, the backdrilling depth may generally be calculated as the median bands for stub length management given the possible tolerances of drilling. For example, in some embodiments, the stub length needs to be controlled at 4±2 mils, and the stub length threshold h may be set at 4 mils when determining the backdrilling depth, depending on regulatory requirements.
Optionally, the length threshold h of the short column is less than or equal to 6 mils, for example, h can be any value of 0, 1mil, 2 mils, 3 mils, 4 mils, 5 mils, 6 mils or a range value between any two values, and by controlling the length threshold h of the short column within the above range, the control requirement of most circuit boards 100 on the length of the short column can be met, and the yield of products can be ensured.
In some embodiments, the thickness variation is the total thickness of the surface layer 120 copper plating and/or the overlay solder mask layer of the locations to be backdrilled 110. The thickness of the copper plating is the copper thickness generated by the electroplating process performed after one drilling process and before back drilling process, and the thickness of the solder mask layer is the thickness of ink or other solder resist materials generated by the solder resist process performed after one drilling process and before back drilling process. When the surface variation layer 150 has only electroplated copper, the thickness variation is copper thickness; when the surface variation layer 150 has only a solder mask layer, the thickness variation is the thickness of the solder mask layer; when the surface variation layer 150 includes both electroplated copper and a solder resist layer, the thickness variation is the sum of the thicknesses of both.
In some embodiments, the backdrilling location 110 is measured by a thickness gauge to obtain the thickness variation. The thickness variation data is obtained through direct measurement of the thickness measuring instrument, so that the operation difficulty of the method is reduced, and the efficiency is improved. Optionally, the thickness gauge includes a copper thickness gauge, so that copper thickness data at the position 110 to be backdrilled can be obtained by direct measurement, and accurate thickness variation can be obtained.
In some embodiments, the cut surface is measured to obtain the thickness variation by slicing the circuit board 100 along its thickness direction at the location to be backdrilled 110. It should be noted that, for the same circuit board, the different areas may have different thickness variations due to different distances from the electrodes of the electroplating process or different wiring thicknesses, and thus the thickness variations may be different, that is, the thickness variations of the different positions 110 to be backed by may be different. And for two circuit boards 100 with the same design, the same processing procedure and the same parameter processing are adopted, so that the thickness variation of the same area of the two circuit boards 100 is basically consistent, the circuit board 100 for testing can be sliced at the position 110 to be backdrilled, the tangent plane is directly measured, the acquired thickness variation is more accurate, and the accuracy of the backdrilling depth is further improved.
Correspondingly, referring to fig. 4, the embodiment of the application further provides a circuit board processing method, which includes:
Drilling the circuit board 100 once, acquiring position information of the surface layer 120, the reference layer 130 and the back drilling target layer 140 of the position 110 to be back drilled, and acquiring the distance between the surface layer 120 and the reference layer 130 and the distance between the reference layer 130 and the back drilling target layer 140 according to the position information, wherein the reference layer 130 and the back drilling target layer 140 are positioned in the circuit board 100, and the reference layer 130 is positioned between the surface layer 120 and the back drilling target layer 140;
after all the processing procedures before back drilling are completed, the thickness variation of the surface layer 120 of the position 110 to be back drilled is obtained;
Determining the backdrilling depth of the position to be backdrilled 110 based on the distance between the surface layer 120 and the reference layer 130, the distance between the reference layer 130 and the backdrilling target layer 140, and the thickness variation;
Back drilling is performed according to the back drilling depth, and back drilling holes are formed at the back drilling positions 110 to be back drilled.
The circuit board processing method comprises the steps of obtaining position information of a surface layer 120, a reference layer 130 and a back drilling target layer 140 corresponding to a back drilling position 110 through one-time drilling, and obtaining the distance between the surface layer 120 and the reference layer 130 and the distance between the reference layer 130 and the back drilling target layer 140; acquiring the thickness variation of the surface layer 120 corresponding to the back drilling position 110 before back drilling; determining the back drilling depth of the back drilling position by using the distance between the surface layer 120 and the reference layer 130, the distance between the reference layer 130 and the back drilling target layer 140 and the thickness variation; and then back drilling is carried out based on the back drilling depth, and back drilling holes are formed at the back drilling positions to be back drilled. The control precision to the short column length can be improved, the requirement on the precision of the short column length is met, the interference caused by the short column is reduced, the problems of reflection, scattering, delay and the like of signal transmission are reduced, the product rejection caused by the precision problem of the short column length is reduced, and the product yield of the circuit board 100 is improved.
It can be appreciated that the circuit board processing method may include all the technical features and advantages of the foregoing back drilling depth determination method, and the back drilling depth determination method is described in detail in the foregoing, and will not be described in detail herein.
Wherein, the processing procedures before back drilling processing comprise the procedures of primary drilling processing, electroplating processing, welding resistance processing and the like. Through vias are processed in the circuit board 100 by a single process, copper is deposited on the circuit board 100 by electroplating, and the copper attached to the inner walls of the vias is used to effect the conduction of the designed circuit. The solder mask, which may be typically a solder mask ink, is formed by a solder mask process to protect the copper conductors and component surfaces on the circuit board from the environment and to provide an additional insulating layer.
Referring to fig. 3, in some embodiments, the processed circuit board 100 has a plurality of positions to be backed up 110, the distances between the surface layer 120 and the reference layer 130 of each position to be backed up 110, the distances between the reference layer 130 and the backing target layer 140, and the thickness variation are obtained respectively during one drilling, and the backing depth of each position to be backed up 110 is determined respectively; back drilling holes are respectively formed at each back drilling position 110 according to the back drilling depth of each back drilling position 110. By respectively acquiring the distance between the surface layer 120 and the reference layer 130, the distance between the reference layer 130 and the backing drill target layer 140, and the thickness variation for each backing drill position 110, the backing drill depth corresponding to each backing drill position 110 can be obtained, so that each backing drill hole can meet the requirement of the corresponding short column length.
Optionally, at least one of the back-drilling locations 110 is different from at least another one of the back-drilling locations 110 in terms of the amount of thickness variation. As described above, for the same circuit board, the different regions have different thicknesses due to the difference in distance from the electrode in the electroplating process or the difference in thickness of the wiring, and thus the thickness variation is different, that is, the thickness variation H 0 of the different positions 110 to be backed with the drill is different.
Optionally, at least one of the positions to be backdrilled 110 is different from at least one other of the positions to be backdrilled 110 in backdrilling depth. The distance between the surface layer 120 and the reference layer 130 and the distance between the reference layer 130 and the backing drilling target layer 140 corresponding to each backing drilling position 110 can be accurately obtained through the detection of the position information by one-time drilling; by combining the thickness variation of the surface layer 120 corresponding to each back drilling position 110, the back drilling depth corresponding to each back drilling position 110 can be obtained, so that each back drilling hole can meet the requirement of the corresponding short column length.
Correspondingly, the embodiment of the application also provides a circuit board processing system, which comprises circuit board processing equipment, wherein the circuit board processing equipment is configured to execute the circuit board processing method of any embodiment. The circuit board processing equipment can be drilling equipment and is specially used for drilling holes in the circuit board. When the circuit board is manufactured, the parts to be connected in the circuit design are perforated by adopting circuit board processing equipment in a drilling mode so as to mount components and connect the circuits. In the embodiment of the application, the working procedures of primary drilling, back drilling and the like in the circuit board processing method can be executed through the circuit board processing equipment.
It can be appreciated that the circuit board processing system can realize all technical features and beneficial effects of the above circuit board processing method, and will not be described herein.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to the related descriptions of other embodiments.
The method for determining the back drilling depth, the method for processing the circuit board and the system provided by the embodiment of the application are described in detail, and specific examples are applied to illustrate the principle and the implementation mode of the application, and the description of the above embodiments is only used for helping to understand the technical scheme and the core idea of the application; those of ordinary skill in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.
Claims (12)
1. A method of backdrilling depth determination, comprising:
Acquiring position information of a surface layer, a reference layer and a back drilling target layer at a back drilling position on a circuit board, and acquiring the distance between the surface layer and the reference layer and the distance between the reference layer and the back drilling target layer according to the position information, wherein the reference layer and the back drilling target layer are positioned in the circuit board, and the reference layer is positioned between the surface layer and the back drilling target layer;
after all processing procedures before back drilling processing are completed, obtaining the thickness variation of the surface layer of the back drilling position to be drilled;
and determining the back drilling depth of the back drilling position to be backed by the surface layer, the distance between the reference layer and the back drilling target layer and the thickness variation.
2. The backdrilling depth determination method of claim 1, wherein the formula is: k=h 1+H2+H0 -H, determining the backdrilling depth of the position to be backdrilled;
Wherein K is a back drilling depth for determining the back drilling position, H 1 is a distance between the surface layer and the reference layer, H 2 is a distance between the reference layer and the back drilling target layer, H 0 is the thickness variation, and H is a short column length threshold.
3. The backdrilling depth determination method according to claim 1, wherein the thickness variation is a total thickness of the surface layer copper plating and/or the covering solder resist layer of the position to be backdrilled.
4. A backdrilling depth determination method according to any one of claims 1 to 3, wherein the position to be backdrilled is measured by a thickness gauge to obtain the thickness variation.
5. The backdrilling depth determination method of claim 4, wherein the thickness gauge comprises a copper thickness gauge.
6. A backdrilling depth determination method according to any one of claims 1 to 3, wherein the thickness variation is obtained by slicing the circuit board in the thickness direction thereof at the position to be backdrilled, and measuring a cut surface.
7. The backdrilling depth determination method of claim 2, wherein the stub length threshold h is 6mil or less.
8. A method of processing a circuit board, comprising:
Drilling a circuit board for one time, acquiring position information of a surface layer, a reference layer and a back drilling target layer at a back drilling position, and obtaining the distance between the surface layer and the reference layer and the distance between the reference layer and the back drilling target layer according to the position information, wherein the reference layer and the back drilling target layer are positioned in the circuit board, and the reference layer is positioned between the surface layer and the back drilling target layer;
after all processing procedures before back drilling processing are completed, obtaining the thickness variation of the surface layer of the back drilling position to be drilled;
Determining the back drilling depth of the back drilling position to be backed up based on the distance between the surface layer and the reference layer, the distance between the reference layer and the back drilling target layer and the thickness variation;
And carrying out back drilling processing according to the back drilling depth, and forming back drilling holes at the back drilling position to be backed.
9. The method according to claim 8, wherein the circuit board has a plurality of the positions to be backed-drilled, the distances between the surface layer and the reference layer, the distances between the reference layer and the backing target layer, and the thickness variation of each of the positions to be backed-drilled are obtained at one drilling, and the backing depth of each of the positions to be backed-drilled is determined;
and respectively forming back drilling holes at each back drilling position according to the back drilling depth of each back drilling position.
10. The circuit board processing method according to claim 9, wherein at least one of the positions to be backed up is different from at least another one of the positions to be backed up in the thickness variation amount.
11. The circuit board processing method of claim 9, wherein at least one of the positions to be backed up is different from at least another one of the positions to be backed up by the back drilling depth.
12. A circuit board processing system, characterized by comprising a circuit board processing apparatus configured to perform the circuit board processing method according to any one of claims 8 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410370488.0A CN118139297A (en) | 2024-03-28 | 2024-03-28 | Back drilling depth determining method, circuit board processing method and system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410370488.0A CN118139297A (en) | 2024-03-28 | 2024-03-28 | Back drilling depth determining method, circuit board processing method and system |
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| CN118139297A true CN118139297A (en) | 2024-06-04 |
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| CN202410370488.0A Pending CN118139297A (en) | 2024-03-28 | 2024-03-28 | Back drilling depth determining method, circuit board processing method and system |
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- 2024-03-28 CN CN202410370488.0A patent/CN118139297A/en active Pending
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