CN118131415A - Optical module - Google Patents

Abstract

The invention discloses an optical module. The light module includes a circuit board and at least one light emitting assembly; the circuit board comprises a first surface, wherein the first surface comprises a mounting forbidden area; the circuit board further comprises a first mounting hole and a second mounting hole which penetrate through the circuit board, and the first mounting hole and the second mounting hole are positioned at two sides of the mounting forbidden cloth area which are oppositely arranged; the emission component comprises a laser emission unit, a laser wave combining unit and a laser emission unit, wherein the laser wave combining unit is positioned between the laser emission unit and the laser emission unit; at least part of the laser emergent units are positioned in the first mounting holes, at least part of the laser multiplexing units are positioned in the mounting forbidden area, and at least part of the laser emitting units are positioned in the second mounting holes. According to the invention, the light emitting component is installed by arranging the installation forbidden cloth area on the first surface of the circuit board, so that the circuit board can be prevented from being hollowed out in a large area, and the structural strength of the circuit board is further ensured.

Description

Optical module

Technical Field

The invention relates to the technical field of optical communication, in particular to an optical module.

Background

With the continuous expansion of technical applications of cloud computing, artificial intelligence and the like, traffic data is explosive growth, and a data center becomes an indispensable infrastructure for communication. In order to meet the requirement of high-speed transmission of mass data, an optical communication technology is indispensable, and an optical module is a tool for realizing photoelectric signal mutual conversion and is a key device for realizing optical communication. With the rapid increase of data traffic, the transmission rate requirements of the optical module are also increasing.

Currently, the high-speed transmission market has iterated from 100G, 400G updates to 800G. To achieve 800G transmission rates, multiple optics are required, and placement of more optics often requires large area hollowing out of the circuit board, resulting in insufficient strength of the circuit board.

Disclosure of Invention

The invention provides an optical module, which aims to solve the problem of insufficient strength of a circuit board of the existing optical module.

The embodiment of the invention provides an optical module, which comprises a circuit board and at least one light emitting component;

The circuit board comprises a first surface, wherein the first surface comprises a mounting forbidden area; the circuit board further comprises a first mounting hole and a second mounting hole which penetrate through the circuit board, and the first mounting hole and the second mounting hole are positioned at two sides of the mounting forbidden cloth area which are oppositely arranged;

The light emitting assembly comprises a laser emitting unit, a laser wave synthesizing unit and a laser emitting unit, wherein the laser wave synthesizing unit is positioned between the laser emitting unit and the laser emitting unit;

At least part of the laser emergent units are positioned in the first mounting holes, at least part of the laser multiplexing units are positioned in the mounting forbidden area, and at least part of the laser emitting units are positioned in the second mounting holes.

Optionally, the laser wave combining unit includes an optical waveguide chip, and at least part of the optical waveguide chip is fixed in the installation forbidden area.

Optionally, the laser emitting unit includes at least two lasers;

the optical waveguide chip comprises a waveguide surface, wherein the waveguide surface comprises at least two waveguide paths;

An entrance port of the waveguide path is optically coupled with the laser, and an exit port of the waveguide path is optically coupled with the laser emitting unit; the waveguide surface is used for receiving optical signals generated by at least two lasers, coupling at least two paths of optical signals into a path of multiplexed optical signals and transmitting the multiplexed optical signals to the laser transmitting unit.

Optionally, the waveguide surface includes a first waveguide path, a second waveguide path, a third waveguide path, and a fourth waveguide path that are sequentially arranged;

a first coupling section is arranged between the first waveguide path and the second waveguide path; the first coupling section is used for coupling the optical signal transmitted by the first waveguide path into the second waveguide path;

A second coupling section is arranged between the third waveguide path and the fourth waveguide path; the second coupling section is used for coupling the optical signal transmitted by the third waveguide path into the fourth waveguide path;

A third coupling section is arranged between the second waveguide path and the fourth waveguide path; the third coupling section is used for coupling two paths of optical signals transmitted by the second waveguide path into the fourth waveguide path;

the fourth waveguide path includes the exit port.

Optionally, the laser emitting unit includes a first laser, a second laser, a third laser and a fourth laser;

The first laser is used for generating an optical signal with a wavelength lambda, the second laser is used for generating an optical signal with a wavelength lambda+λ0, the third laser is used for generating an optical signal with a wavelength lambda+2λ0, and the fourth laser is used for generating an optical signal with a wavelength lambda+3λ0;

the first waveguide path is optically coupled to the second laser;

the second waveguide path is optically coupled to the fourth laser;

the third waveguide path is optically coupled to the first laser;

The fourth waveguide path is optically coupled to the third laser.

Optionally, the laser wave combining unit further comprises an incident mounting block and an emergent fixing block; the laser emission unit comprises an emission adapter and an emission end optical fiber jumper;

The incident mounting block and the emergent fixing block are positioned at two sides of the waveguide surface which are oppositely arranged; the incident mounting block is positioned in the first mounting hole; the emergent fixed block is positioned in the second mounting hole;

The laser is arranged on the incidence mounting block;

The emission adapter is fixed on the emission fixed block and the optical waveguide chip, is respectively optically coupled with the emission port and the emission end optical fiber jumper, and is used for transmitting the multiplexed optical signal to the emission end optical fiber jumper;

and the transmitting-end optical fiber jumper is used for transmitting the multiplexing optical signal to the outside of the optical module.

Optionally, the optical module further comprises at least one light receiving component; the circuit board also comprises a second surface which is arranged opposite to the first surface;

the light receiving component is positioned on the second surface;

The optical receiving assembly is used for receiving the external multiplexing optical signals and decomposing the external multiplexing optical signals into multiple paths of external optical signals with different wavelengths.

Optionally, the optical module further comprises a semiconductor refrigerator;

The semiconductor refrigerator is thermally coupled with the laser emergent unit and is used for adjusting the temperature of the laser emergent unit;

the semiconductor refrigerator comprises positive and negative electrodes, and the positive and negative electrodes are arranged on one side, far away from the light receiving component, of the semiconductor refrigerator.

Optionally, the circuit board further comprises at least two light receivers, a transimpedance amplifier and a golden finger;

The optical receiver is optically coupled with the optical receiving assembly, corresponds to multiple paths of external optical signals emitted by the optical receiving assembly one by one, and is used for receiving the external optical signals and converting the external optical signals into external electrical signals;

The transimpedance amplifier is electrically connected with the optical receiver and is used for receiving the external electrical signal and amplifying the external electrical signal to obtain an amplified external electrical signal;

The golden finger is respectively and electrically connected with the transimpedance amplifier and the external equipment, and is used for receiving the amplified external electrical signal and transmitting the amplified external electrical signal to the external equipment.

Optionally, the optical module further comprises a housing; the shell comprises an upper shell and a lower shell;

the upper shell and the lower shell are covered to form a cavity with two open ends;

the circuit board is at least partially located in the cavity; the light emitting assembly is at least partially located in the cavity;

The upper housing includes a heat sink for increasing a heat dissipation area of the light module.

The technical scheme of the embodiment of the invention provides an optical module, which comprises a circuit board and at least one optical emission component, wherein the first surface of the circuit board comprises a mounting forbidden cloth area, a first mounting hole and a second mounting hole penetrating the circuit board are positioned on two sides opposite to the mounting forbidden cloth area, the optical emission component comprises a laser emitting unit, a laser wave combining unit and a laser emitting unit, the laser wave combining unit is positioned between the laser emitting unit and the laser emitting unit, at least part of the laser emitting unit is positioned in the first mounting hole, at least part of the laser wave combining unit is positioned in the mounting forbidden cloth area, and at least part of the laser emitting unit is positioned in the second mounting hole. According to the embodiment of the invention, the light emitting component is installed by arranging the installation forbidden area on the first surface of the circuit board, so that the problem of insufficient strength of the circuit board of the existing optical module is solved, the circuit board can be prevented from being hollowed out in a large area, and the structural strength of the circuit board is further ensured.

It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the invention or to delineate the scope of the invention. Other features of the present invention will become apparent from the description that follows.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a top view of an optical module according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a light emitting component and a semiconductor refrigerator according to an embodiment of the present invention;

Fig. 4 is a schematic structural diagram of a laser wave synthesizing unit according to an embodiment of the present invention;

FIG. 5 is a schematic view of a waveguide surface according to an embodiment of the present invention;

Fig. 6 is a bottom view of an optical module according to an embodiment of the present invention;

FIG. 7 is a partial view of the light module provided in FIG. 6;

fig. 8 is a perspective assembly view of an optical module according to an embodiment of the present invention.

Detailed Description

In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus. The terms "upper", "lower", "left", "right", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, and are merely used to explain the relative positional relationship between the respective components or portions, and do not particularly limit the specific mounting azimuth of the respective components or portions.

Fig. 1 is a top view of an optical module provided by an embodiment of the present invention, fig. 2 is a schematic structural diagram of a circuit board provided by an embodiment of the present invention, fig. 3 is a schematic structural diagram of an optical emission component and a semiconductor refrigerator provided by an embodiment of the present invention, and referring to fig. 1, fig. 2 and fig. 3, an embodiment of the present invention provides an optical module, which includes a circuit board 10 and at least one optical emission component 20. The circuit board 10 includes a first surface 11, the first surface 11 including a mounting exclusion area 111. The circuit board 10 further includes a first mounting hole 12 and a second mounting hole 13 penetrating the circuit board 10, and the first mounting hole 12 and the second mounting hole 13 are located at two sides of the mounting forbidden region 111 that are oppositely disposed. The light emitting assembly 20 includes a laser emitting unit 21, a laser combining unit 22, and a laser emitting unit 23, the laser combining unit 22 being located between the laser emitting unit 21 and the laser emitting unit 23. At least part of the laser emitting units 21 are located in the first mounting holes 12, at least part of the laser combining units 22 are located in the mounting forbidden region 111, and at least part of the laser emitting units 23 are located in the second mounting holes 13.

It will be appreciated that the circuit board 10 is provided with a plurality of electronic devices and a plurality of metal wires, and that the electronic devices may be electrically connected by the metal wires. In the embodiment of the present invention, a mounting forbidden region 111 is disposed on the first surface 11 of the circuit board 10, and the mounting forbidden region 111 is not provided with any electronic device and can be used for fixing the light emitting component. The first mounting hole 12 and the second mounting hole 13 adapted to the light emitting assembly 20 are provided at both sides of the mounting forbidden coverage area 111 along the length direction of the circuit board 10, respectively, and may be used to place a portion of the light emitting assembly 20. Specifically, the laser multiplexing unit 22 of the light emitting assembly 20 may be fixed on the installation forbidding area 111 through an optical cement. The laser emitting unit 21 of the light emitting assembly 20 may be fixed to an end of the laser combining unit 22 near the first mounting hole 12 by means of adhesion, and located in the first mounting hole 12. The laser emitting unit 23 of the light emitting assembly 20 may be fixed at one end of the laser combining unit 22 near the second mounting hole 13 by an optical cement and located in the second mounting hole 13.

Compared with the prior art that a large-area mounting hole is dug in the circuit board to place the light emitting component, the embodiment of the invention installs the light emitting component 20 by arranging the installation forbidden cloth region 111 on the first surface 11 of the circuit board 10, so that the large-area dug circuit board 10 can be avoided, and the structural strength of the circuit board 10 is further ensured.

It can be appreciated that, in order to fix the light emitting component on the circuit board, a metal heat sink, a tungsten copper block or a base fixedly connected with the circuit board is further disposed below the mounting hole in the prior art, and the light emitting component is fixed on the circuit board by fixing the light emitting component on the metal heat sink, the tungsten copper block or the base. The light emitting component 20 is fixed on the circuit board 10 by directly arranging the mounting forbidden area 111 on the circuit board 10, so that the mounting is simple and the cost is low.

It should be noted that the number of the light emitting assemblies 20 included in the light module according to the embodiment of the present invention is not limited, and may be one, two, three or more, and may be set by a person skilled in the art according to actual needs. The embodiment of the present invention is described by taking an example in which the optical module includes two light emitting components 20, and the two light emitting components 20 are identical.

Fig. 4 is a schematic structural diagram of a laser combining unit according to an embodiment of the present invention, and referring to fig. 1, 2,3 and 4, a laser combining unit 22 includes an optical waveguide chip 221, and at least a portion of the optical waveguide chip 221 is fixed in an installation forbidden region 111.

It should be noted that, the laser emitting unit 21 may be used to generate an optical signal, the laser combining unit 22 may be used to transmit the optical signal generated by the laser emitting unit 21, and the laser emitting unit 23 may be used to emit the optical signal transmitted by the laser combining unit 22 to the laser emitting unit 23. The waveguide chip 221 is fixed in the installation forbidden area 111, the installation forbidden area 111 can provide a relatively flat supporting surface for the light emitting component 20, so that not only can the stability of the optical waveguide chip 221 for transmitting light signals be ensured, but also the laser emitting unit 21 can be tightly abutted against the edge of the circuit board and keep the relative position between the two stable, gold wire connection between the laser emitting unit 21 and the circuit board 10 is facilitated, and the electric connection between the laser emitting unit 21 and the circuit board 10 is realized.

As a possible embodiment, the waveguide chip 221 may be fixed on the mounting forbidden region 111 by filling an optical adhesive between the surface of the side of the optical waveguide chip 221 near the mounting forbidden region 111 and the mounting forbidden region 111. It should be noted that an optical adhesive having a refractive index lower than 1.2 is preferable, and thus, it is advantageous to reduce leakage of the optical signal transmitted from the laser optical multiplexing unit 22.

Fig. 5 is a schematic structural diagram of a waveguide surface according to an embodiment of the present invention, and referring to fig. 3,4 and 5, the laser emitting unit 21 includes at least two lasers 211. The optical waveguide chip 221 includes a waveguide surface 2210, and the waveguide surface 2210 includes at least two waveguide paths 2211. The entrance of the waveguide path 2211 is optically coupled to the laser 211, and the exit of the waveguide path 2211 is optically coupled to the laser emitting unit 23. The waveguide surface 2210 is configured to receive optical signals generated by at least two lasers 211, and couple at least two optical signals into a multiplexed optical signal, and transmit the multiplexed optical signal to the laser emitting unit 23.

The schematic structure of the waveguide surface shown in fig. 5 is substantially a bottom view of the optical waveguide chip 221 shown in fig. 3, and the waveguide surface 2210 is a surface of the optical waveguide chip 221 near the mounting forbidden region 111.

Illustratively, referring to fig. 3, the laser light emitting unit 21 of each light emitting assembly 20 includes four lasers 211, the lasers 211 being electrically connected to the circuit board 10, the four lasers 211 generating optical signals having different wavelengths. Referring to fig. 5, the waveguide surface 2210 of the optical waveguide chip 221 includes four waveguide paths 2211, each waveguide path 2211 having an entrance. It should be noted that, the four lasers 211 shown in fig. 3 are in one-to-one correspondence with the four waveguide paths 2211 shown in fig. 5. Specifically, the laser 211 is optically coupled to the entrance port of the waveguide path 2211, and the generated optical signal may be transmitted to the waveguide path 2211 corresponding to the laser 211. The entire waveguide surface has four waveguide paths for transmitting four optical signals, respectively, and the waveguide surface 2210 can couple the four optical signals into one multiplexed optical signal and transmit the multiplexed optical signal to the laser emitting unit 23. It should be noted that, only the exit of one waveguide path 2211 of the four waveguide paths 2211 may be optically coupled to the laser emitting unit 23, and the multiplexed optical signal coupled to the waveguide surface 2210 is transmitted to the laser emitting unit 23 through the exit.

It should be noted that, in the embodiment of the present invention, the number of the lasers 211 corresponding to each light emitting component 20 is not limited, and may be two, six, or eight, etc., which can be set by a person skilled in the art according to actual needs.

Referring to fig. 1, 3 and 4, the laser light combining unit 22 further includes an incident mounting block 222 and an exit fixing block 223. The laser emitting unit 23 includes an emitting adapter 231 and an emitting-end optical fiber jumper 232. The incident mounting block 222 and the exit fixing block 223 are located on opposite sides of the waveguide surface 2210. The incident mounting block 222 is located at the first mounting hole 12. The exit fixing block 223 is located at the second mounting hole 13. The laser 211 is mounted on the incidence mounting block 222. The emission adapter 231 is fixed on the emission fixing block 223 and the optical waveguide chip 221, and is optically coupled with the emission port and the emission-end optical fiber jumper 232, respectively, for transmitting the multiplexed optical signal to the emission-end optical fiber jumper 232. The transmitting-end optical fiber jumper 232 is used for transmitting the multiplexed optical signal to the outside of the optical module.

Illustratively, the incident mounting block 222 is disposed on a side of the waveguide surface 2210 near the first mounting hole 12, the laser 211 of the laser light emitting unit 21 is mounted on the incident mounting block 222, and both the laser 211 and the incident mounting block 222 are disposed in the first mounting hole 12. The incident mounting block 222 is disposed in the first mounting hole 12, so that the laser 211 can be ensured to be as close to the circuit board 10 as possible, the side of the first mounting hole 12 far away from the mounting forbidden region 111 is provided with a laser pad, and the laser 211 and the laser pad can be electrically connected by a gold wire, so as to ensure that the circuit board 10 can output a control electric signal to the laser 211 to control the laser 211 to generate an optical signal.

The emission fixing block 223 is disposed on a side of the waveguide surface 2210 near the second mounting hole 13, and the emission adapter 231 is fixed on the emission fixing block 223 and the optical waveguide chip 221 and is optically coupled to the emission port of the optical waveguide chip 221, where the emission fixing block 223, the emission adapter 231 and a part of the emission-end optical fiber jumper 232 are all located in the second mounting hole 13. Specifically, a U-shaped opening is formed at an end of the emission adapter 231 facing the laser multiplexing unit 22, a coupling lens is disposed in the emission adapter 231, and after the exit port of the optical waveguide chip 221 is optically aligned with the coupling lens in the emission adapter 231, the emission adapter 231 is fixed on the exit fixing block 223 and the optical waveguide chip 221 by filling optical cement between the optical waveguide chip 221 and the inner side of the opening of the emission adapter 231 and between the exit fixing block 223 and the inner side of the opening of the emission adapter 231. The exit port of the optical waveguide chip 221 is optically aligned with the coupling lens, so that optical coupling between the exit port of the optical waveguide chip 221 and the emission adapter 231 can be achieved, and the multiplexed optical signal can be transmitted to the emission adapter 231. The transmitting adapter 231 is optically coupled to the transmitting-end optical fiber jumper 232, and can transmit the multiplexed optical signal to the transmitting-end optical fiber jumper 232. The transmitting-side optical fiber jumper 232 may transmit the multiplexed optical signal to the outside of the optical module (e.g., the optical receiving assembly of another optical module) through the extended optical fiber.

Referring to fig. 5, the waveguide surface 2210 includes a first waveguide path 2211A, a second waveguide path 2211B, a third waveguide path 2211C, and a fourth waveguide path 2211D, which are sequentially arranged. A first coupling section E1 is provided between the first waveguide path 2211A and the second waveguide path 2211B. The first coupling segment E1 is used to couple the optical signal transmitted by the first waveguide path 2211A into the second waveguide path 2211B. A second coupling section E2 is provided between the third waveguide path 2211C and the fourth waveguide path 2211D. The second coupling segment E2 is used to couple the optical signal transmitted by the third waveguide path 2211C into the fourth waveguide path 2211D. A third coupling section E3 is provided between the second waveguide path 2211B and the fourth waveguide path 2211D. The third coupling segment E3 is used to couple the two optical signals transmitted by the second waveguide path 2211B into the fourth waveguide path 2211D. The fourth waveguide path 2211D includes an exit port.

Compared with the technical scheme that only one coupling section is arranged to couple four optical signals into one multiplexing optical signal at a time, the embodiment of the invention is provided with three coupling sections which are coupled in pairs, thereby being beneficial to improving the accuracy of coupling and avoiding the situation that the optical signals of one waveguide path are not coupled in due to the coupling of the multiple waveguide paths together.

Illustratively, referring to fig. 1 and 5, an optical signal propagating through the first waveguide path 2211A can be coupled into the second waveguide path 2211B when passing through the first coupling segment E1, and two optical signals will propagate in the second waveguide path 2211B after passing through the first coupling segment E1. The optical signal propagating through the third waveguide path 2211C can be coupled into the fourth waveguide path 2211D when passing through the second coupling segment E2, and the fourth waveguide path 2211D after passing through the second coupling segment E2 propagates two optical signals. The two optical signals propagating through the second waveguide path 2211B can be coupled into the fourth waveguide path 2211D when passing through the third coupling section E3, and all the four optical signals are transmitted in the fourth waveguide path 2211D and are emitted from the exit of the fourth waveguide path 2211D to enter the emission adapter 231 of the laser emission unit 23, and finally are transmitted to the outside of the optical module (for example, the optical receiving component of another optical module) by the emission end optical fiber jumper 232 of the laser emission unit 23.

Referring to fig. 1,3, 4, and 5, the laser light emitting unit 21 includes a first laser 211A, a second laser 211B, a third laser 211C, and a fourth laser 211D. The first laser 211A is used to generate an optical signal having a wavelength λ, the second laser 211B is used to generate an optical signal having a wavelength λ+λ0, the third laser 211C is used to generate an optical signal having a wavelength λ+2λ0, and the fourth laser 211D is used to generate an optical signal having a wavelength λ+3λ0. The first waveguide path 2211A is optically coupled to the second laser 211B. The second waveguide path 2211B is optically coupled to the fourth laser 211D. The third waveguide path 2211C is optically coupled to the first laser 211A. The fourth waveguide path 2211D is optically coupled to the third laser 211C.

Illustratively, the first waveguide path 2211A transmits an optical signal having a wavelength of λ+λ0 generated by the second laser 211B, the second waveguide path 2211B transmits an optical signal having a wavelength of λ+3λ0 generated by the fourth laser 211D, the third waveguide path 2211C transmits an optical signal having a wavelength of λ generated by the first laser 211A, and the fourth waveguide path 2211D transmits an optical signal having a wavelength of λ+2λ0 generated by the third laser 211C.

Compared with the technical scheme that lasers are sequentially arranged in an increasing manner according to the wavelength of the optical signal (the wavelength of the optical signal of the adjacent waveguide path is different by λ0), the embodiment of the invention is beneficial to reducing the signal crosstalk of the adjacent lasers 211 and improving the coupling efficiency of the adjacent waveguide path 2211 by making the wavelength of the optical signal of the adjacent waveguide path different by 2λ0 or 3λ0.

Fig. 6 is a bottom view of an optical module according to an embodiment of the present invention, and referring to fig. 1 and 6, the optical module further includes at least one light receiving component 30. The circuit board 10 further comprises a second surface 14 arranged opposite to the first surface 11. The light receiving element 30 is located on the second surface 14. The optical receiving assembly 30 is for receiving the external multiplexed optical signal and decomposing the external multiplexed optical signal into multiple external optical signals having different wavelengths.

Specifically, referring to fig. 6, the optical receiving assembly 30 includes a receiving-end optical fiber jumper 31 and a demultiplexer 32. The demultiplexer 32 includes an optical input end and an optical output end, and the optical input end of the demultiplexer 32 is optically coupled to the optical fiber jumper 31 at the receiving end. The receiving-end optical fiber jumper 31 may receive external multiplexed signal light input from the outside of the optical module (the optical transmitting assembly of another optical module), and transmit the received external multiplexed signal light to the light-in end of the demultiplexer 32. The demultiplexer 32 may demultiplex the received external multiplexed signal light into a plurality of external optical signals having different wavelengths, and emit the plurality of external optical signals from the light emitting end of the demultiplexer 32. As one possible implementation, the demultiplexer 32 may be an Arrayed Waveguide Grating (AWG).

Compared with the technical scheme that the light emitting component and the light receiving component are arranged on the same surface of the circuit board, the embodiment of the invention has the advantages that the light emitting component 20 and the light receiving component 30 are respectively arranged on the two surfaces (the first surface 11 and the second surface 14) of the circuit board 10 which are oppositely arranged, so that the space utilization rate of the light module is improved.

It should be noted that the number of the light receiving assemblies 30 included in the light module according to the embodiment of the present invention is not limited, and may be one, two, three or more, and may be set by a person skilled in the art according to actual needs. The embodiment of the present invention is described by taking an example in which the optical module includes two light receiving elements 30, and the two light receiving elements 30 are identical.

Fig. 7 is a partial view of the optical module provided in fig. 6, and referring to fig. 3 and 7, the circuit board 10 further includes at least two optical receivers 15, a transimpedance amplifier 16, and a gold finger 17. The optical receiver 15 is optically coupled to the optical receiving assembly 30, and is in one-to-one correspondence with the multiple external optical signals emitted from the optical receiving assembly 30, and is configured to receive the external optical signals and convert the external optical signals into external electrical signals. The transimpedance amplifier 16 is electrically connected to the optical receiver 15 for receiving an external electrical signal and amplifying the external electrical signal to obtain an amplified external electrical signal. The golden finger 17 is electrically connected with the transimpedance amplifier 16 and the external device, respectively, for receiving the amplified external electrical signal and transmitting the amplified external electrical signal to the external device.

Illustratively, referring to fig. 7, the circuit board 10 includes eight light receivers 15, four light receivers 15 for each light receiving assembly. The optical receiver 15 and the transimpedance amplifier 16 are both attached to the second surface 14 of the circuit board 10, and the receiver 15 is disposed below the light emitting end of the demultiplexer 332. The optical receiver 15 may be electrically connected to the transimpedance amplifier 16 by way of wire bonding, and the transimpedance amplifier 16 may be electrically connected to a signal pad on the circuit board 10 by way of wire bonding, the signal pad further being electrically connected to the gold finger 17 by way of a circuit trace.

The optical receiver 15 is optically coupled to the light output end of the demultiplexer 332, and multiple external optical signals with different wavelengths emitted from the light output end of the demultiplexer 332 are respectively incident on the corresponding optical receiver 15. The optical receiver 15 receives an external optical signal and converts the received external optical signal into an external electrical signal. The transimpedance amplifier 16 is electrically connected to the optical receiver 15, and is capable of receiving an external electrical signal output from the optical receiver 15, and amplifying the received external electrical signal to obtain an amplified external electrical signal (high-frequency signal). The gold finger 17 is electrically connected to the transimpedance amplifier 16 and the external device, respectively, and is capable of receiving the amplified external electrical signal output from the transimpedance amplifier 16 and transmitting the received amplified external electrical signal to the external device. The external device is provided with a socket corresponding to the golden finger 17, and the golden finger 17 is directly plugged into the socket of the external device, so that the golden finger 17 and the external device can be electrically connected.

It should be noted that, in the embodiment of the present invention, the number of the light receivers 15 corresponding to each light receiving assembly 30 is not limited, and may be two, six, or eight, etc., which can be set by a person skilled in the art according to actual needs.

Referring to fig. 3 and 6, the optical module further includes a semiconductor refrigerator 40. The semiconductor refrigerator 40 is thermally coupled to the laser light emitting unit 21 for adjusting the temperature of the laser light emitting unit 21. The semiconductor refrigerator 40 includes positive and negative electrodes 41, and the positive and negative electrodes 41 are disposed at a side of the semiconductor refrigerator 40 remote from the light receiving assembly 30.

Illustratively, the semiconductor refrigerator 40 is disposed below the laser emitting unit 21 (i.e., on the second surface 14 side of the circuit board), the plurality of lasers 211 are thermally coupled to the semiconductor refrigerator 40 through a heat-conducting adhesive, and the semiconductor refrigerator 40 can adjust the temperature of the lasers 211 to ensure that the wavelength of the optical signal output by the lasers 211 is stable.

The positive and negative electrodes 41 of the semiconductor refrigerator 40 are disposed at a side of the semiconductor refrigerator 40 remote from the light receiving assembly 30. The circuit board 20 is provided with power supply pads at the sides of the first mounting holes 12 adjacent to the positive and negative electrodes 41, and the positive and negative electrodes 41 of the semiconductor refrigerator and the power supply pads may be electrically connected by gold bonding wires. The circuit board 20 further includes a power chip for powering the semiconductor refrigerator 40, the power chip is disposed on the second surface 14 of the circuit board 10, and an area where the power chip is disposed further corresponds to the mounting forbidden zone 111 of the first surface 11. The power supply pad may be electrically connected to the power supply chip through a circuit trace.

The embodiment of the invention can avoid the interference of the power supply signal of the semiconductor refrigerator 40 on the amplified external electric signal (high-frequency signal) output by the transimpedance amplifier 16 by arranging the positive and negative electrodes 41 of the semiconductor refrigerator 40 on the side far away from the light receiving component 30.

Fig. 8 is a perspective assembly view of an optical module according to an embodiment of the present invention, and referring to fig. 8, the optical module further includes a housing 50. The housing 50 includes an upper housing 51 and a lower housing 52. The upper case 51 and the lower case 52 are covered to form a cavity with both ends open. The circuit board 10 is at least partially located in the cavity. The light emitting assembly 20 is at least partially located in the cavity. The upper case 51 includes a heat sink 511, and the heat sink 511 is used to increase a heat dissipation area of the optical module.

Referring to fig. 8, the heat sink 511 is composed of a plurality of heat sink fins, and the housing 50 further includes a cover plate 53, wherein the cover plate 53 is disposed on the heat sink 511. It should be noted that the heat sink 511 on the upper housing 51 may also be directly exposed.

Alternatively, referring to fig. 8, a transmitting shield 60 may be provided above the light emitting assembly 20, and a receiving shield (not shown) may be provided above the light receiving assembly 30. The transmit shield 60 and the receive shield both reduce electromagnetic interference and also act as dust shields.

The above embodiments do not limit the scope of the present invention. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of the present invention.

Claims (10)

1. An optical module comprising a circuit board and at least one light emitting assembly;

The circuit board comprises a first surface, wherein the first surface comprises a mounting forbidden area; the circuit board further comprises a first mounting hole and a second mounting hole which penetrate through the circuit board, and the first mounting hole and the second mounting hole are positioned at two sides of the mounting forbidden cloth area which are oppositely arranged;

The light emitting assembly comprises a laser emitting unit, a laser wave synthesizing unit and a laser emitting unit, wherein the laser wave synthesizing unit is positioned between the laser emitting unit and the laser emitting unit;

At least part of the laser emergent units are positioned in the first mounting holes, at least part of the laser multiplexing units are positioned in the mounting forbidden area, and at least part of the laser emitting units are positioned in the second mounting holes.

2. The optical module of claim 1, wherein the laser multiplexing unit comprises an optical waveguide chip, at least a portion of the optical waveguide chip being secured to the mounting exclusion zone.

3. The optical module of claim 2, wherein the laser light exit unit comprises at least two lasers;

the optical waveguide chip comprises a waveguide surface, wherein the waveguide surface comprises at least two waveguide paths;

An entrance port of the waveguide path is optically coupled with the laser, and an exit port of the waveguide path is optically coupled with the laser emitting unit; the waveguide surface is used for receiving optical signals generated by at least two lasers, coupling at least two paths of optical signals into a path of multiplexed optical signals and transmitting the multiplexed optical signals to the laser transmitting unit.

4. An optical module as claimed in claim 3, wherein the waveguide surface comprises a first waveguide path, a second waveguide path, a third waveguide path and a fourth waveguide path arranged in sequence;

a first coupling section is arranged between the first waveguide path and the second waveguide path; the first coupling section is used for coupling the optical signal transmitted by the first waveguide path into the second waveguide path;

A second coupling section is arranged between the third waveguide path and the fourth waveguide path; the second coupling section is used for coupling the optical signal transmitted by the third waveguide path into the fourth waveguide path;

A third coupling section is arranged between the second waveguide path and the fourth waveguide path; the third coupling section is used for coupling two paths of optical signals transmitted by the second waveguide path into the fourth waveguide path;

the fourth waveguide path includes the exit port.

5. The optical module of claim 4, wherein the laser light exit unit comprises a first laser, a second laser, a third laser, and a fourth laser;

The first laser is used for generating an optical signal with a wavelength lambda, the second laser is used for generating an optical signal with a wavelength lambda+λ0, the third laser is used for generating an optical signal with a wavelength lambda+2λ0, and the fourth laser is used for generating an optical signal with a wavelength lambda+3λ0;

the first waveguide path is optically coupled to the second laser;

the second waveguide path is optically coupled to the fourth laser;

the third waveguide path is optically coupled to the first laser;

The fourth waveguide path is optically coupled to the third laser.

6. The optical module of claim 3, wherein the laser multiplexing unit further comprises an incident mounting block and an exit fixing block; the laser emission unit comprises an emission adapter and an emission end optical fiber jumper;

The incident mounting block and the emergent fixing block are positioned at two sides of the waveguide surface which are oppositely arranged; the incident mounting block is positioned in the first mounting hole; the emergent fixed block is positioned in the second mounting hole;

The laser is arranged on the incidence mounting block;

The emission adapter is fixed on the emission fixed block and the optical waveguide chip, is respectively optically coupled with the emission port and the emission end optical fiber jumper, and is used for transmitting the multiplexed optical signal to the emission end optical fiber jumper;

and the transmitting-end optical fiber jumper is used for transmitting the multiplexing optical signal to the outside of the optical module.

7. The light module of claim 1, further comprising at least one light receiving component; the circuit board also comprises a second surface which is arranged opposite to the first surface;

the light receiving component is positioned on the second surface;

The optical receiving assembly is used for receiving the external multiplexing optical signals and decomposing the external multiplexing optical signals into multiple paths of external optical signals with different wavelengths.

8. The light module of claim 7, wherein the light module further comprises a semiconductor refrigerator;

The semiconductor refrigerator is thermally coupled with the laser emergent unit and is used for adjusting the temperature of the laser emergent unit;

the semiconductor refrigerator comprises positive and negative electrodes, and the positive and negative electrodes are arranged on one side, far away from the light receiving component, of the semiconductor refrigerator.

9. The optical module of claim 7, wherein the circuit board further comprises at least two optical receivers, a transimpedance amplifier, and a gold finger;

The optical receiver is optically coupled with the optical receiving assembly, corresponds to multiple paths of external optical signals emitted by the optical receiving assembly one by one, and is used for receiving the external optical signals and converting the external optical signals into external electrical signals;

The transimpedance amplifier is electrically connected with the optical receiver and is used for receiving the external electrical signal and amplifying the external electrical signal to obtain an amplified external electrical signal;

The golden finger is respectively and electrically connected with the transimpedance amplifier and the external equipment, and is used for receiving the amplified external electrical signal and transmitting the amplified external electrical signal to the external equipment.

10. The light module of claim 1, wherein the light module further comprises a housing; the shell comprises an upper shell and a lower shell;

the upper shell and the lower shell are covered to form a cavity with two open ends;

the circuit board is at least partially located in the cavity; the light emitting assembly is at least partially located in the cavity;

The upper housing includes a heat sink for increasing a heat dissipation area of the light module.