CN118039271A - Thermistor slurry and preparation method thereof - Google Patents
Thermistor slurry and preparation method thereof Download PDFInfo
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- CN118039271A CN118039271A CN202211369301.2A CN202211369301A CN118039271A CN 118039271 A CN118039271 A CN 118039271A CN 202211369301 A CN202211369301 A CN 202211369301A CN 118039271 A CN118039271 A CN 118039271A
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- 239000002002 slurry Substances 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 238000007613 slurry method Methods 0.000 title description 2
- 239000000843 powder Substances 0.000 claims abstract description 43
- 239000011521 glass Substances 0.000 claims abstract description 26
- 239000000919 ceramic Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000000654 additive Substances 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000006259 organic additive Substances 0.000 claims description 7
- 238000005245 sintering Methods 0.000 claims description 7
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 6
- 239000002270 dispersing agent Substances 0.000 claims description 6
- 239000000314 lubricant Substances 0.000 claims description 6
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Chemical compound O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 claims description 6
- 239000013008 thixotropic agent Substances 0.000 claims description 6
- 229920002678 cellulose Polymers 0.000 claims description 5
- YEXPOXQUZXUXJW-UHFFFAOYSA-N lead(II) oxide Inorganic materials [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 claims description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid ester group Chemical group C(CCCCCCCCCCC)(=O)O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 claims description 3
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum oxide Inorganic materials [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 claims description 3
- KTUFCUMIWABKDW-UHFFFAOYSA-N oxo(oxolanthaniooxy)lanthanum Chemical compound O=[La]O[La]=O KTUFCUMIWABKDW-UHFFFAOYSA-N 0.000 claims description 3
- IIZPXYDJLKNOIY-JXPKJXOSSA-N 1-palmitoyl-2-arachidonoyl-sn-glycero-3-phosphocholine Chemical group CCCCCCCCCCCCCCCC(=O)OC[C@H](COP([O-])(=O)OCC[N+](C)(C)C)OC(=O)CCC\C=C/C\C=C/C\C=C/C\C=C/CCCCC IIZPXYDJLKNOIY-JXPKJXOSSA-N 0.000 claims description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical group O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 2
- 239000005751 Copper oxide Substances 0.000 claims description 2
- 239000005639 Lauric acid Substances 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 2
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 2
- 229910052810 boron oxide Inorganic materials 0.000 claims description 2
- 239000004359 castor oil Substances 0.000 claims description 2
- 235000019438 castor oil Nutrition 0.000 claims description 2
- 239000012461 cellulose resin Substances 0.000 claims description 2
- 229910000431 copper oxide Inorganic materials 0.000 claims description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 2
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 2
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 2
- 235000010445 lecithin Nutrition 0.000 claims description 2
- 239000000787 lecithin Substances 0.000 claims description 2
- 229940067606 lecithin Drugs 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- 239000011656 manganese carbonate Substances 0.000 claims description 2
- 229910000016 manganese(II) carbonate Inorganic materials 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- -1 polyethylene Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- LEDMRZGFZIAGGB-UHFFFAOYSA-L strontium carbonate Chemical compound [Sr+2].[O-]C([O-])=O LEDMRZGFZIAGGB-UHFFFAOYSA-L 0.000 claims description 2
- 229910000018 strontium carbonate Inorganic materials 0.000 claims description 2
- 229940116411 terpineol Drugs 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- VJFCXDHFYISGTE-UHFFFAOYSA-N O=[Co](=O)=O Chemical compound O=[Co](=O)=O VJFCXDHFYISGTE-UHFFFAOYSA-N 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000009776 industrial production Methods 0.000 abstract description 2
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000000498 ball milling Methods 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005469 granulation Methods 0.000 description 2
- 230000003179 granulation Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009702 powder compression Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical group [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- IUYLTEAJCNAMJK-UHFFFAOYSA-N cobalt(2+);oxygen(2-) Chemical compound [O-2].[Co+2] IUYLTEAJCNAMJK-UHFFFAOYSA-N 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(II) oxide Inorganic materials [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000007780 powder milling Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 235000019812 sodium carboxymethyl cellulose Nutrition 0.000 description 1
- 229920001027 sodium carboxymethylcellulose Polymers 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Abstract
The invention provides a thermistor slurry and a preparation method thereof, wherein the thermistor slurry comprises functional ceramic powder, glass powder and an organic carrier; the content of the functional ceramic powder is 15-25 wt%, the content of the glass powder is 35-45 wt% and the content of the organic carrier is 30-50 wt% based on the total weight of the thermistor slurry. The thermistor formed by the technology has the advantages of no lead, adjustable resistance, good repeatability, low cost, convenience for large-scale industrial production and the like, and has a wide application prospect.
Description
Technical Field
The invention relates to electronic paste, in particular to thermistor paste and a preparation method thereof.
Background
In the prior art, the thermistor is mainly manufactured by a granulation powder compression molding process, the production efficiency of the process is low, the production cost is high, and the target product is related to the size of a die and the tonnage of a press. Because the size of the die is fixed, the size of the obtained thermistor product is also fixed, if the size of the thermistor product needs to be adjusted, the size of the thermistor product can be only adjusted by changing the die, the larger the size of the product is, the larger the tonnage of the required press is, the higher the price is, the production cost is greatly increased due to the factors, and the application of the thermistor product in production is limited to a certain extent.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a thermistor slurry and a preparation method thereof, which are used for solving the problem of high cost caused by the limitation of a die and other factors on a product obtained by a granulation powder compression molding process in the prior art.
To achieve the above and other related objects, the present invention is achieved by the following technical means.
The invention provides a thermistor slurry, which comprises functional ceramic powder, glass powder and an organic carrier; the content of the functional ceramic powder is 15-25 wt%, the content of the glass powder is 35-45 wt% and the content of the organic carrier is 30-50 wt% based on the total weight of the thermistor slurry.
According to the technical scheme, the functional ceramic powder comprises a main material and an additive, wherein the main material comprises BaCO 3 and TiO 2, and the additive is one or more selected from SrCO3、PbO、Y2O3、Nb2O5、Sb2O3、La2O3、Bi2O3、MnCO3 and CuO.
In the technical scheme of the invention, srCO 3 and PbO are used as peak shifting agents in a system, and when the SrCO 3 and the PbO are not added, the Curie temperature Tc of the prepared thermistor is 120 ℃; the Curie temperature Tc of the thermistor can be reduced to be lower than 120 ℃ by adding SrCO 3, and the more the addition amount of SrCO 3 is, the smaller the Tc is; conversely, the greater the amount of PbO added, the higher the Tc. Proper addition of Y 2O3、Nb2O5、Sb2O3、La2O3 and Nb 2O5 can result in good PTC effect for thermistors.
According to the technical scheme of the invention, the total weight of the functional ceramic powder is taken as a reference, the weight percentage of the main material is 85-99 wt%, and the sum of the weight percentages of the additives is 1-15 wt%.
According to the technical scheme of the invention, the grain size of the main material is 1-2 mu m.
According to the technical scheme of the invention, the particle size of the additive is less than 1 mu m.
According to the technical scheme of the invention, the functional ceramic powder is obtained by a method comprising the following steps: and (3) performing curing reaction on the main material at 1100-1300 ℃ to obtain BaTiO 3 powder, and ball-milling and mixing the BaTiO 3 powder and the additive. Preferably, a drying step is also included after ball milling.
According to the technical scheme, the total mass of the glass powder is taken as a reference, the content of bismuth oxide in the glass powder is 35-68 wt%, the content of boron oxide is 8-36 wt%, the content of silicon dioxide is 0.5-6.0 wt%, the content of zinc oxide is 5.0-22.0 wt%, the content of cobaltous oxide is 0.1-3.0 wt%, and the content of titanium dioxide is 0.5-4.0 wt%. According to the technical scheme, the glass powder also contains copper oxide with the weight percent of not more than 5 percent.
According to the technical scheme, the glass powder also contains not more than 3.5 weight percent of aluminum oxide.
According to the technical scheme, the glass powder also contains not more than 0.8 weight percent of magnesium oxide.
The glass powder plays a role in dispersing a conductive phase in slurry, and plays a role in combining a substrate in a thermistor after sintering.
According to the technical scheme of the invention, the raw material components of the organic carrier comprise resin, solvent and organic additive; the resin content is 8-15 wt%, the solvent content is 80-90 wt% and the organic additive content is 1-5 wt% based on the total weight of the raw material components of the organic carrier.
The solvent in the organic carrier is usually a relatively viscous liquid organic matter, and the molecule of the solvent usually contains polar groups, so that the solvent can dissolve resin, and the solvent usually has a relatively high boiling point and is not easy to volatilize at normal temperature.
According to the technical scheme of the invention, the resin enables the electronic paste to have certain viscosity. The resin is one or more selected from modified cellulose and epoxy resin. Preferably, the modified cellulose is selected from polyanionic celluloses. Specifically, the polyanionic cellulose is sodium carboxymethyl cellulose.
According to the technical scheme, the solvent is selected from one or more of terpineol, butyl carbitol, tributyl citrate and butyl carbitol acetate.
According to the technical scheme of the invention, the organic additive comprises a dispersing agent, a lubricating agent, a thixotropic agent and a rheological agent. Preferably, the dispersing agent is lecithin. Preferably, the dispersant is 1.5 to 2.5wt%.
Preferably, the lubricant is lauric acid. Preferably, the lubricant is 1 to 2wt%.
Preferably, the thixotropic agent is a polyethylene wax or hydrogenated castor oil. Preferably, the thixotropic agent is 1 to 2wt%.
Preferably, the rheological agent is 1,4 butyrolactone. Preferably, the rheology agent is 0.1 to 0.5wt%.
According to the technical scheme of the invention, the organic carrier is obtained by uniformly mixing the raw material components. More preferably, the organic carrier is obtained by a method comprising the steps of: and completely dissolving the resin in the solvent, and then adding the organic additive to mix uniformly.
The organic carrier is used for dispersing functional ceramic powder and glass powder, providing basic rheological property of slurry, meeting the technological requirements of slurry printing, drying and the like, and no residue exists in the thermistor after firing.
For PTC thermistor slurry, the square resistance value can be controlled and regulated by regulating the proportion between the functional ceramic powder and the glass powder. But the ratio between the two is not arbitrarily adjustable. Such as: when the content of the functional ceramic powder is lower than a certain content, the prepared thick film thermistor loses the thermosensitive property; the cost can be greatly increased if the functional ceramic powder is higher than a certain content; the glass powder content is larger than a certain range, so that the resistance value of the element is large and the performance is deteriorated; the glass powder content is smaller than a certain range, so that the glass powder cannot be bonded, and the glass powder are mutually restricted and can be regulated only in a certain range.
The invention also discloses a preparation method of the thermistor slurry, which is characterized in that the functional ceramic powder, the glass powder and the organic carrier are uniformly mixed, and the thermistor slurry is obtained through rolling.
The invention also discloses a thermistor, which is obtained by adopting the thermistor slurry through molding, sintering and metallization.
The thermistor formed by the technology has the advantages of no lead, adjustable resistance, good repeatability, low cost, convenience for large-scale industrial production and the like, and has a wide application prospect.
Detailed Description
Further advantages and effects of the present invention will become apparent to those skilled in the art from the disclosure of the present invention, which is described by the following specific examples.
Before the embodiments of the invention are explained in further detail, it is to be understood that the invention is not limited in its scope to the particular embodiments described below; it is also to be understood that the terminology used in the examples of the invention is for the purpose of describing particular embodiments only, and is not intended to limit the scope of the invention. The test methods in the following examples, in which specific conditions are not noted, are generally conducted under conventional conditions or under conditions recommended by the respective manufacturers.
Where numerical ranges are provided in the examples, it is understood that unless otherwise stated herein, both endpoints of each numerical range and any number between the two endpoints are significant both in the numerical range. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In addition to the specific methods, devices, materials used in the embodiments, any methods, devices, and materials of the prior art similar or equivalent to those described in the embodiments of the present invention may be used to practice the present invention according to the knowledge of one skilled in the art and the description of the present invention.
In the thermistor slurries of specific embodiments 1 to 5 of the present application, the functional ceramic powder was 25wt%, 40wt% glass frit, and 35% organic vehicle. The formulations of the functional ceramic powder and the thermistor paste in each example are shown in table 1.
TABLE 1
The thermistor slurry formed in examples 1 to 5 was formed on the surface of the resistor substrate by a screen printing process to a thickness of 10 to 50 μm, and dried and sintered to form a thermistor. Specifically, the sintering temperature is 800-1200 ℃ and the sintering time is 10-120 min.
The results of the performance test of the thermistor are also shown in table 1.
The Tc test method is a Curie temperature experiment:
(1) The thermistor is welded on the PCB in series, and leads are connected at two ends of each thermistor;
(2) The thermistor is placed in the oven, and the leading-out end is placed outside the oven;
(3) Raising the temperature of the box body to the lower limit of the Curie temperature minus 1 ℃ and keeping for 30min, and measuring the thermistor by using a universal meter; resistance value;
(4) Raising the temperature of the box body to the upper limit of the Curie temperature and keeping the temperature for 30min, and measuring the resistance of the thermistor by using a universal meter;
(5) Judging whether the initial resistance value of 2 times is within the range of the resistance value measured at the upper limit temperature and the lower limit temperature;
Note that: the effect of air flow should be minimized during the test.
The testing method or the calculating method of the R25 change rate comprises the following steps: (R25 after sintering-R25 before sintering) ×100%/R25 before sintering.
The resistance value adjusting mode and mechanism are as follows:
1. The PTC area is fixed, and the resistance value can be flexibly adjusted by adjusting the area of the ohmic silver paste;
2. The ohmic silver paste area is fixed, and the resistance value can be adjusted by adjusting the PTC area and shape;
3. Resistance calculation formula: r=ρl/S, where ρ is the resistivity of the conductor, L is the length of the conductor, and S is the cross-sectional area of the conductor (electrode paste area).
The PTC paste printing area or the ohmic electrode area can be adjusted flexibly to adjust the resistance of the thermistor, the precision and the quality stability of the resistance are improved, the yield of preparing the target resistance is improved, the material usage amount (the thickness is reduced, the thickness is generally 10-50 micrometers, and the conventional dry pressing process is about 2 mm) required by producing the resistor is reduced, and the PTC paste is compatible with the new-era environment-friendly production concept.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (10)
1. The thermistor slurry is characterized by comprising functional ceramic powder, glass powder and an organic carrier; the content of the functional ceramic powder is 15-25 wt%, the content of the glass powder is 35-45 wt% and the content of the organic carrier is 30-50 wt% based on the total weight of the thermistor slurry.
2. The thermistor paste according to claim 1, characterized in that the functional ceramic powder comprises a main material and an additive, the main material comprises BaCO 3 and TiO 2, and the additive is one or more selected from SrCO3、PbO、Y2O3、Nb2O5、Sb2O3、La2O3、Bi2O3、MnCO3 and CuO.
3. The thermistor paste according to claim 2, characterized in that the weight percentage of the main material is 85-99 wt% and the sum of the weight percentages of the additives is 1-15 wt% based on the total weight of the functional ceramic powder.
4. The thermistor paste according to claim 1, characterized in that the content of bismuth oxide in the glass frit is 35 to 68wt%, the content of boron oxide is 8 to 36wt%, the content of silicon dioxide is 0.5 to 6.0wt%, the content of zinc oxide is 5.0 to 22.0wt%, the content of cobalt trioxide is 0.1 to 3.0wt%, and the content of titanium dioxide is 0.5 to 4.0wt%, based on the total mass of the glass frit.
5. The thermistor paste of claim 4, comprising one or more of the following features:
The glass powder also contains copper oxide with the weight percentage of not more than 5 percent;
The glass powder also contains not more than 3.5 weight percent of aluminum oxide;
the glass powder also contains not more than 0.8wt% of magnesium oxide.
6. The thermistor paste according to claim 1, characterized in that the raw material components of the organic carrier contain a resin, a solvent and an organic additive; the resin content is 8-15 wt%, the solvent content is 80-90 wt% and the organic additive content is 1-5 wt% based on the total weight of the raw material components of the organic carrier.
7. The thermistor paste of claim 6, comprising one or more of the following features:
the resin is one or more selected from modified cellulose and epoxy resin;
The solvent is selected from one or more of terpineol, butyl carbitol, tributyl citrate and butyl carbitol acetate;
the organic additives include dispersants, lubricants, thixotropic agents, and rheological agents.
8. The thermistor paste of claim 7, comprising one or more of the following features:
the dispersing agent is lecithin;
The dispersant is 1.5-2.5 wt%;
The lubricant is lauric acid;
the weight of the lubricant is 1-2wt%;
The thixotropic agent is polyethylene wax or hydrogenated castor oil;
the thixotropic agent is 1-2wt%;
the rheological agent is 1, 4-butyrolactone;
the rheological agent is 0.1 to 0.5 weight percent.
9. A method for preparing the thermistor slurry according to any one of claims 1 to 8, wherein the functional ceramic powder, the glass frit and the organic carrier are uniformly mixed, and the thermistor slurry is obtained by rolling.
10. A thermistor, characterized in that the thermistor is obtained by adopting the thermistor slurry according to any one of claims 1 to 8 through molding, sintering and metallization.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211369301.2A CN118039271A (en) | 2022-11-03 | 2022-11-03 | Thermistor slurry and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211369301.2A CN118039271A (en) | 2022-11-03 | 2022-11-03 | Thermistor slurry and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118039271A true CN118039271A (en) | 2024-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211369301.2A Pending CN118039271A (en) | 2022-11-03 | 2022-11-03 | Thermistor slurry and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118039271A (en) |
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- 2022-11-03 CN CN202211369301.2A patent/CN118039271A/en active Pending
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