CN118031866A - Flexible ultrasonic sensing receiving device and system - Google Patents
Flexible ultrasonic sensing receiving device and system Download PDFInfo
- Publication number
- CN118031866A CN118031866A CN202410431650.5A CN202410431650A CN118031866A CN 118031866 A CN118031866 A CN 118031866A CN 202410431650 A CN202410431650 A CN 202410431650A CN 118031866 A CN118031866 A CN 118031866A
- Authority
- CN
- China
- Prior art keywords
- sensing
- switch
- flexible
- matching
- array element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000013016 damping Methods 0.000 claims description 12
- 238000002604 ultrasonography Methods 0.000 claims description 11
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 7
- 238000004458 analytical method Methods 0.000 claims description 7
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 6
- 230000035945 sensitivity Effects 0.000 abstract description 13
- 238000001514 detection method Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 10
- 238000010586 diagram Methods 0.000 description 28
- 239000000523 sample Substances 0.000 description 13
- 230000008569 process Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 3
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 3
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000002592 echocardiography Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009659 non-destructive testing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention provides a flexible ultrasonic sensing receiving device and a system, which relate to the technical field of sensors, wherein the device comprises: the device comprises a microcontroller, a switch control module and a plurality of sensing matching circuits; each sensing matching circuit includes: the sensing array element, the matching resistor, the voltage-controlled resistor and the initialization switch are connected in the same way as the circuits of the microcontroller and the switch control module, and all the sensing array elements form a flexible ultrasonic array sensor. When a plurality of sensors are required to work simultaneously, only one flexible ultrasonic array sensor is required to be arranged, so that the method is simple and quick; the microcontroller adjusts the output voltage of the first control end according to the voltage value of the first feedback end and the power supply voltage value so as to adjust the resistance value of the voltage-controlled resistor, and the difference between the voltage value of the first feedback end and the power supply voltage value is smaller than a preset threshold value. The sensor reaches the optimal state of sensitivity through automatic impedance matching, so that the ultrasonic signal detection efficiency is effectively improved.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a flexible ultrasonic sensing receiving device and a system.
Background
Strain sensors play an extremely important role in the field of ultrasonic non-destructive testing. Conventional metal or semiconductor strain sensors are well known for their wide application, but have inherent hardness and brittleness limitations when attached to complex surface structures. To solve this problem, researchers have recently developed a high-sensitivity flexible resistive strain sensor based on composite materials that can be flexibly attached to complex surfaces or embedded inside structures to detect internal damage. However, when a plurality of sensors are operated at the same time, they are required to be arranged one by one on the surface or inside the structure to be measured. In addition, the sensing array element can bend when being matched with the surface of the structure, so that the resistance of the sensing array element is changed, the size of the sensor matching resistance is always required to be adjusted one by one manually to be equal to the resistance value of the array element in order to ensure the optimal sensitivity, and the detection efficiency is obviously reduced.
In summary, the flexible ultrasonic sensing receiving device in the prior art has the technical problem of low ultrasonic signal detection efficiency in the use process.
Disclosure of Invention
The invention aims to provide a flexible ultrasonic sensing receiving device and a system, which are used for solving the technical problem of low ultrasonic signal detection efficiency in the process of using the conventional flexible ultrasonic sensing receiving device.
In a first aspect, the present invention provides a flexible ultrasound sensing reception device comprising: the device comprises a microcontroller, a switch control module and a plurality of sensing matching circuits; each of the sensing matching circuits includes: the sensing array element, the matching resistor, the voltage-controlled resistor and the initializing switch; each sensing matching circuit is connected with the microcontroller and the switch control module in the same circuit mode; all the sensing array elements form a flexible ultrasonic array sensor; the driving end of the microcontroller is connected with the controlled end of the switch control module, and the first control end of the switch control module is connected with the controlled end of the initialization switch; the first end of the sensing array element is connected with a power supply, and the second end of the sensing array element is respectively connected with the first end of the matching resistor, the first end of the initializing switch and the signal receiving end of an external signal analyzing device; the second end of the matching resistor is connected with the first end of the voltage-controlled resistor, and the second end of the voltage-controlled resistor is connected with the grounding end; the second end of the initialization switch is connected with the first feedback end of the microcontroller, and the first control end of the microcontroller is connected with the controlled end of the voltage-controlled resistor; after the flexible ultrasonic array sensor is paved in a region to be detected, the microcontroller controls the initialization switch to be closed through the switch control module, and the microcontroller adjusts the output voltage of the first control end of the microcontroller according to the voltage value of the first feedback end and the voltage value of the power supply so as to adjust the resistance value of the voltage-controlled resistor, and under the condition that the difference value between the voltage value of the first feedback end and the voltage value of the power supply is smaller than a preset threshold value, the microcontroller controls the initialization switch to be opened through the switch control module.
In an alternative embodiment, the sensing matching circuit further includes: a first switch; the first end of the first switch is connected with the power supply, and the second end of the first switch is connected with the first end of the sensing array element; the controlled end of the first switch is connected with the second control end of the switch control module.
In an alternative embodiment, the sensing matching circuit further includes: a second switch and a third switch; the flexible ultrasonic sensing receiving device further comprises: a plurality of fourth switches and a plurality of fifth switches, the number of the fourth switches and the number of the fifth switches being equal and equal to the number of the sensing matching circuits minus one; the first end of the second switch is connected with the second end of the sensing array element, and the second end of the second switch is connected with the first end of the matching resistor; the first end of the third switch is connected with the second end of the matching resistor, and the second end of the third switch is connected with the first end of the voltage-controlled resistor; the fourth switch and the fifth switch are arranged between the adjacent sensing matching circuits, the first end of the fourth switch is connected with the second end of the sensing array element in the first sensing matching circuit, and the second end of the fourth switch is connected with the first end of the sensing array element in the second sensing matching circuit; the first sensing matching circuit and the second sensing matching circuit are adjacent sensing matching circuits; the first end of the fifth switch is connected with the first end of the matching resistor in the first sensing matching circuit, and the second end of the fifth switch is connected with the second end of the matching resistor in the second sensing matching circuit; the on-off of the second switch, the third switch, the fourth switch and the fifth switch are controlled by the switch control module.
In an alternative embodiment, the operation modes of the flexible ultrasonic sensing receiving device at least include: a conventional phased array mode, an equivalent array element phased array mode and a single channel mode.
In an alternative embodiment, in the case that the voltage value of the first feedback terminal is determined to be twice smaller than the voltage value of the power supply, the microcontroller adjusts the voltage value of the first control terminal upwards so as to increase the resistance value of the voltage-controlled resistor; and under the condition that the voltage value of the first feedback end is twice larger than the voltage value of the power supply, the microcontroller downwards adjusts the voltage value of the first control end of the microcontroller so as to reduce the resistance value of the voltage-controlled resistor.
In an optional embodiment, the flexible ultrasonic array sensor includes at least one sensing array element layer, a flexible insulating layer is laid between adjacent sensing array element layers, each sensing array element layer includes a plurality of sensing array elements, and all sensing array elements in each sensing array element layer have the same size, and the intervals between adjacent sensing array elements are the same.
In an alternative embodiment, the flexible ultrasound array sensor further comprises: the device comprises an acoustic matching layer, a flexible insulating layer, a flexible wire and an acoustic damping layer; the acoustic matching layer is used for bearing the sensing array element; covering the flexible insulating layer on the acoustic matching layer carrying the sensing array element, and reserving through holes with the diameter equal to the width of the sensing array element for the two ends of the sensing array element; the two ends of each sensing array element are connected with flexible wires, the flexible wires are positioned on the flexible insulating layer, and joints of all the flexible wires are converged on an external joint of the flexible ultrasonic array sensor; the acoustic damping layer is covered on the flexible insulating layer.
In an alternative embodiment, the sensing array element is attached to the acoustic matching layer by spraying.
In an alternative embodiment, the flexible insulating layer is made of polyvinyl alcohol PVA.
In a second aspect, the present invention provides a flexible ultrasonic sensing reception system comprising the flexible ultrasonic sensing reception device according to any one of the preceding embodiments, further comprising: a signal analysis device; the signal analysis device is connected with the flexible ultrasonic sensing receiving device and is used for receiving and analyzing the output signal of the flexible ultrasonic sensing receiving device.
The invention provides a flexible ultrasonic sensing receiving device, which comprises: the device comprises a microcontroller, a switch control module and a plurality of sensing matching circuits; each sensing matching circuit includes: the sensing array element, the matching resistor, the voltage-controlled resistor and the initialization switch are connected in the same way as the circuits of the microcontroller and the switch control module, and all the sensing array elements form a flexible ultrasonic array sensor. Therefore, when a plurality of sensors are required to work simultaneously, only one flexible ultrasonic array sensor is required to scan the area to be detected, the method is simple and quick, and the microcontroller can adjust the output voltage of the first control end of the microcontroller according to the voltage value of the first feedback end and the power supply voltage value of the microcontroller so as to adjust the resistance value of the voltage-controlled resistor, so that the difference value between the voltage value of the first feedback end and the power supply voltage value is smaller than a preset threshold value. That is, the device can complete automatic impedance matching through voltage feedback, so that the flexible ultrasonic array sensor reaches the optimal sensitivity state.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic circuit diagram of a flexible ultrasonic sensing receiving device according to an embodiment of the present invention;
FIG. 2 is a diagram of an equivalent circuit of voltage division of resistors in a sensing matching circuit according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a microcontroller according to an embodiment of the present invention for adjusting a voltage-controlled resistor;
FIG. 4 is a schematic circuit diagram of an alternative flexible ultrasonic sensing receiving device according to an embodiment of the present invention;
FIG. 5 is a schematic circuit diagram of another flexible ultrasonic sensing receiving device according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of an alternative circuit of an equivalent array element mode according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of an alternative circuit of a single channel mode according to an embodiment of the present invention;
FIG. 8 (a) is a schematic diagram of a sensor array element fabrication mold;
FIG. 8 (b) is a schematic diagram of a sensor array element fabrication mold covering an acoustic matching layer;
FIG. 9 (a) is a schematic diagram of a process for preparing a stable acoustic matching layer with array elements attached;
Fig. 9 (b) is a schematic diagram of a molded array element;
fig. 10 (a) is a front view showing the molding result of the insulating layer;
fig. 10 (b) is a top view showing the molding result of the insulating layer;
FIG. 11 is a schematic view of the flexible conductor after placement;
FIG. 12 (a) is a front view of a finished flexible ultrasonic array sensor with only one layer of sensing elements;
FIG. 12 (b) is a top view of a finished flexible ultrasonic array sensor with only one layer of sensing elements;
FIG. 13 is a schematic diagram of an interface of a flexible ultrasound array sensor;
FIG. 14 is a schematic diagram of an interface of all matching resistors;
FIG. 15 is a front view of a flexible ultrasonic array sensor having two layers of sensing elements disposed perpendicular to each other;
FIG. 16 is a side view in the X direction of a flexible ultrasound array sensor having two layers of sensing elements disposed perpendicular to each other;
FIG. 17 is a side view in the Y direction of a flexible ultrasonic array sensor having two layers of sensing elements disposed perpendicular to each other;
fig. 18 is a simplified schematic diagram of a flexible ultrasound array sensor provided with three layers of sensing elements.
Icon: 100-a microcontroller; 200-a switch control module; 300-sense matching circuit.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.
Example 1
Fig. 1 is a schematic circuit diagram of a flexible ultrasonic sensing receiving device according to an embodiment of the present invention, as shown in fig. 1, the device includes: a microcontroller 100, a switch control module 200, and a plurality of sensing matching circuits 300; each sensing matching circuit includes: the sensing array element Rs, the matching resistor Rx, the voltage-controlled resistor Rv and the initializing switch SWo.
Each sensing matching circuit is connected with the microcontroller and the switch control module in the same circuit mode; all the sensing array elements form a flexible ultrasonic array sensor.
The driving end of the microcontroller is connected with the controlled end of the switch control module, and the first control end of the switch control module is connected with the controlled end of the initialization switch.
The first end of the sensing array element is connected with a power supply, and the second end of the sensing array element is respectively connected with the first end of the matching resistor, the first end of the initializing switch and the signal receiving end of the external signal analyzing device.
The second end of the matching resistor is connected with the first end of the voltage-controlled resistor, and the second end of the voltage-controlled resistor is connected with the grounding end.
The second end of the initialization switch is connected with the first feedback end of the microcontroller, and the first control end of the microcontroller is connected with the controlled end of the voltage-controlled resistor.
After the flexible ultrasonic array sensor is paved in the area to be detected, the microcontroller controls the initialization switch to be closed through the switch control module, the microcontroller adjusts the output voltage of the first control end of the microcontroller according to the voltage value of the first feedback end and the voltage value of the power supply so as to adjust the resistance value of the voltage-controlled resistor, and under the condition that the difference value between the two times of the voltage value of the first feedback end and the voltage value of the power supply is smaller than a preset threshold value, the microcontroller controls the initialization switch to be opened through the switch control module.
The sensing array element has a static resistance value when no signal is received, so based on the circuit structure of the flexible ultrasonic sensing receiving device described above, the embodiment of the invention converts the resistance change of the sensing array element caused by deformation into a changed voltage signal output by using the sensing array element, the matching resistor and the voltage-controlled resistor voltage division mode.
Fig. 2 is a diagram of an equivalent circuit of resistor voltage division in a sensing matching circuit according to an embodiment of the present invention, as can be seen from fig. 2,Wherein/>Representing the equivalent resistance, i.e. the matching resistance/>And voltage controlled resistance/>Sum,/>Representing the resistance of the sensing array element Rs/>Representing the output voltage of the second end of the sensing element, i.e. the output signal of the sensing element. The sensitivity of the circuit structure is defined as the ratio of the amount of change in the voltage output Vo caused by the change in the resistance of the sense element Rs to the amount of change in the resistance of the sense element Rs. Deducing the rate of change of the sensitivity of the circuit with respect to the equivalent resistance Re: /(I)，. It can be seen that when/>The sensitivity of the flexible ultrasound array sensor is optimized when in use.
When the flexible ultrasonic array sensor is laid in a region to be detected, the sensing array element on the flexible ultrasonic array sensor may deform, so that the resistance value of the sensing array element changes, the sensitivity of the sensor (or the probe) is reduced, and therefore, the sensor needs to be initialized before starting a test. The microcontroller sends a control signal to the switch control module through the driving end of the microcontroller so that the switch control module controls the initialization switch to be closed. If N sensing matching circuits exist, the microcontroller can control N initializing switches to be simultaneously closed, and at the moment, the N sensing matching circuits are simultaneously and automatically initialized, so that the sensor is shorter in initializing time and more convenient to operate, and the detection efficiency is improved. The following describes the initialization process in detail by taking one of the sensing matching circuits as an example.
Specifically, when the initialization switch is turned on, the microcontroller receives the voltage value of Vo through the first feedback end, if the difference between the voltage value of the first feedback end and the voltage value of the power supply is not smaller than the preset threshold, it indicates that the resistance value of the sensing array element and the equivalent resistance cannot be approximately equal, and the microcontroller adjusts the resistance value of the voltage-controlled resistor by adjusting the output voltage of the first control end, so thatAt this time, the difference between the voltage value of the first feedback end and the voltage value of the power supply is smaller than the preset threshold. When the difference between the voltage value of the first feedback end and the voltage value of the power supply is smaller than a preset threshold value, the sensitivity of the sensor is determined to be in an optimal state, the initializing switch is disconnected without adjusting the resistance value of the voltage-controlled resistor, the initialization of the sensor is completed, and the ultrasonic signal detection can be started. The embodiment of the invention does not limit the implementation mode of the voltage-controlled resistor, and a user can select according to actual requirements, for example, the voltage-controlled resistor can be implemented by using a field effect transistor.
For easy understanding, fig. 1 only shows the circuit connection relationship between one sensing matching circuit and the microcontroller and the switch control module, the flexible ultrasonic sensing receiving device includes a plurality of sensing matching circuits, and the circuit connection relationship between each sensing matching circuit and the microcontroller and the switch control module is completely consistent, and assuming that the flexible ultrasonic array sensor includes 64 sensing array elements, the flexible ultrasonic array sensor has 64 output channels, and the output signal of each output channel is the voltage of the second end of the sensing array element。
The invention provides a flexible ultrasonic sensing receiving device, which comprises: the device comprises a microcontroller, a switch control module and a plurality of sensing matching circuits; each sensing matching circuit includes: the sensing array element, the matching resistor, the voltage-controlled resistor and the initialization switch are connected in the same way as the circuits of the microcontroller and the switch control module, and all the sensing array elements form a flexible ultrasonic array sensor. Therefore, when a plurality of sensors are required to work simultaneously, only one flexible ultrasonic array sensor is required to scan the area to be detected, the method is simple and quick, and the microcontroller can adjust the output voltage of the first control end of the microcontroller according to the voltage value of the first feedback end and the power supply voltage value of the microcontroller so as to adjust the resistance value of the voltage-controlled resistor, so that the difference value between the voltage value of the first feedback end and the power supply voltage value is smaller than a preset threshold value. That is, the device can complete automatic impedance matching through voltage feedback, so that the flexible ultrasonic array sensor reaches the optimal sensitivity state.
In an alternative embodiment, in case that it is determined that the voltage value of the first feedback terminal is twice smaller than the voltage value of the power supply, the microcontroller adjusts the voltage value of its first control terminal upward so as to increase the resistance value of the voltage-controlled resistor.
And under the condition that the voltage value of the first feedback end is twice larger than the voltage value of the power supply, the microcontroller downwards adjusts the voltage value of the first control end of the microcontroller so as to reduce the resistance value of the voltage-controlled resistor.
Specifically, fig. 3 is a schematic diagram of a principle of adjusting a voltage-controlled resistor by a microcontroller according to an embodiment of the present invention, and is shown in fig. 3, in which a circuit in which one sensing array element is located is taken as an example, a probe needs to be initialized before the probe is put into use, that is, after the probe is placed at a measured position, an initialization switch is closed, vo is obtained to adjust the voltage-controlled resistor, so that the static output of Vo is approximately equal to Vcc/2, where a parameter a represents a preset threshold, and the magnitude of the parameter a represents an acceptable error that can be preset.
When Vcc/2> vo, namely, 2 times of the voltage value of the first feedback end is smaller than the voltage value of the power supply, the microcontroller upwardly adjusts the voltage value Vomcu of the first control end of the microcontroller so as to increase the voltage-controlled resistor Rv; when Vcc/2 < Vo, i.e. the voltage value of the first feedback terminal is twice larger than the voltage value of the power supply, the microcontroller downwards adjusts the voltage value Vomcu of the first control terminal of the microcontroller so as to reduce the voltage-controlled resistor Rv.
In an alternative embodiment, the sensing matching circuit further includes: a first switch SW1.
The first end of the first switch is connected with a power supply, and the second end of the first switch is connected with the first end of the sensing array element; the controlled end of the first switch is connected with the second control end of the switch control module.
Specifically, the sensor can be internally provided with enough sensing array elements according to actual requirements so as to be compatible with various detection scenes, but when the area to be detected is smaller, the detection requirements can be realized by outputting a small amount of sensing array elements, so that a first switch is arranged between each sensing array element and a power supply, the first switch is controlled by a switch control module, when only part of sensing array elements are required to work, a microcontroller controls the corresponding first switch to be closed through the switch control module, so that the sensing array elements connected with the sensor array elements in series work, and meanwhile, the first switch of a circuit in which the rest sensing array elements are positioned is controlled to be opened.
The sensors of the prior art are typically disposable and have a fixed size and response sensitivity, which limits their applicability in different application scenarios. Their mode of operation is relatively single and difficult to recycle. To solve the above problem, in an alternative embodiment, the sensing matching circuit further includes: a second switch SW2 and a third switch SW3; the flexible ultrasonic sensing receiving device further comprises: the number of the fourth switches SW4 and the number of the fifth switches SW5 are equal and equal to the number of the sensing matching circuits minus one. That is, if the number of sensing matching circuits is N, then the number of fourth and fifth switches are both N-1.
The first end of the second switch is connected with the second end of the sensing array element, and the second end of the second switch is connected with the first end of the matching resistor.
The first end of the third switch is connected with the second end of the matching resistor, and the second end of the third switch is connected with the first end of the voltage-controlled resistor.
A fourth switch and a fifth switch are arranged between the adjacent sensing matching circuits, a first end of the fourth switch is connected with a second end of the sensing array element in the first sensing matching circuit, and a second end of the fourth switch is connected with a first end of the sensing array element in the second sensing matching circuit; the first sensing matching circuit and the second sensing matching circuit are adjacent sensing matching circuits.
The first end of the fifth switch is connected with the first end of the matching resistor in the first sensing matching circuit, and the second end of the fifth switch is connected with the second end of the matching resistor in the second sensing matching circuit.
The on-off of the second switch, the third switch, the fourth switch and the fifth switch are controlled by the switch control module.
Fig. 4 is a schematic circuit diagram of an alternative flexible ultrasonic sensing receiving device according to an embodiment of the present invention, in which an initialization switch and a switch control module in each sensing matching circuit are not shown in fig. 4, according to fig. 4, in the embodiment of the present invention, a first switch is connected in series between a power source and a sensing array element, a second switch is connected in series between the sensing array element and a matching resistor, a third switch is connected in series between the matching resistor and a voltage-controlled resistor, a fourth switch is connected in series between the sensing array element end to end, a fifth switch is connected in series between the matching resistors end to end, and the switches are controlled by the switch control module. Based on the above principle design, reference may be made to the schematic diagram of fig. 5, and fig. 5 is a schematic circuit diagram of another flexible ultrasonic sensing receiving device provided by the embodiment of the present invention, and by adjusting the on-off of a part of the switch, the flexible ultrasonic sensing receiving device may be made to work in different modes.
In an embodiment of the present invention, the working modes of the flexible ultrasonic sensing receiving device at least include: a conventional phased array mode, an equivalent array element phased array mode and a single channel mode.
The conventional phased array mode refers to that all sensing array elements are mutually independent, the on-off state of a switch in the mode can refer to the above figure 4, if N sensing array elements are arranged in the sensor, the whole probe is equivalent to a sensing array of N sensing array elements, in the embodiment of the invention, the flexible ultrasonic array sensor comprises at least one sensing array element layer, flexible insulating layers are paved between adjacent sensing array element layers, each sensing array element layer comprises a plurality of sensing array elements, the sizes of all sensing array elements in each sensing array element layer are the same, and the distances between adjacent sensing array elements are the same. The flexible ultrasonic array sensor prepared based on the above limiting conditions can ensure imaging effects in various working modes. Conventional phased array modes can expand the imaging area. In the conventional phased array mode, the flexible ultrasonic sensing reception device has N independent outputs Vo n, n=1, 2,3.
Where accuracy permits, the sensitivity of the sensor may be increased by decreasing the accuracy. The equivalent array element phased array mode is suitable for the application scene, and by closing or opening the corresponding switch, every x (x is more than or equal to 2) adjacent sensing array elements in the same sensing array element layer are equivalent to be a new array element in series, every x adjacent matching resistors are equivalent to be a new matching resistor in series, and the N array element phased array can be converted into an N/x array element phased array.
Fig. 6 is a schematic diagram of an alternative circuit of the equivalent array element mode, in which every 2 adjacent sensing array elements in the same sensing array element layer are serially equivalent to a new array element by closing or opening the corresponding switch, every 2 adjacent and corresponding matching resistors are serially equivalent to a new matching resistor, and if N is an even number, the N array element phased array can be converted into an N/2 array element phased array by the circuit connection mode of fig. 6. In the equivalent array element phased array mode shown in fig. 6, the flexible ultrasonic sensing receiving device has N/2 outputs, which are Vo 2,Vo4,…,VoN/2 respectively.
In the circuit connection mode of the equivalent array element phased array mode, the sizes of all the equivalent array elements in the same sensing array element layer are the same, and the distances between the adjacent equivalent array elements are the same, so that the final imaging effect can be ensured. However, in the practical application process, the user can also connect different adjacent sensing array elements in series according to the practical requirement, that is, the equivalent array elements in the circuit can not be obtained by connecting the same number of sensing array elements in series, for example, 2 sensing array elements, 4 sensing array elements, 5 sensing array elements and the like can be connected in series in sequence.
The single channel mode means that all sensing array element layers have only one output, namely, the probe is equivalent to a single strain sensor, and the single channel mode can remarkably enhance the sensitivity of the sensor, so that the single channel mode can be applied to detecting sound waves with weaker energy, but can cause precision loss to a certain extent. The single channel mode may also be applied to measure macroscopic strains such as pulse, heart beat, etc. Fig. 7 is a schematic diagram of an alternative circuit of a single channel mode provided by the embodiment of the present invention, in which a sensing array element of a required area in a sensing array element layer is connected in series with a corresponding matching resistor, and after the resistance value of an initialized voltage-controlled resistor reaches an optimum value, measurement of a single array element can be primarily realized. This mode has only one output, the output voltage position depends on the selection of the equivalent single array element, and the output voltage of the example in fig. 7 is Vo 40.
In an alternative embodiment, the flexible ultrasound array sensor further comprises: the device comprises an acoustic matching layer, a flexible insulating layer, a flexible wire and an acoustic damping layer.
The acoustic matching layer is used for bearing sensing array elements.
And covering a flexible insulating layer on the acoustic matching layer bearing the sensing array element, and reserving through holes with the diameter equal to the width of the sensing array element at two ends of the sensing array element.
The two ends of each sensing array element are connected with flexible wires, the flexible wires are positioned on the flexible insulating layer, and the joints of all the flexible wires are converged on the external joint of the flexible ultrasonic array sensor.
An acoustic damping layer is coated on the flexible insulating layer.
The sensing array elements are attached to the acoustic matching layer in a spraying mode, and the flexible insulating layer is made of polyvinyl alcohol PVA.
Specifically, an ultrasonic array sensor with high flexibility is used in the flexible ultrasonic sensing receiving device provided by the embodiment of the invention, and the sensor comprises an acoustic matching layer, a flexible insulating layer, an acoustic damping layer, and a plurality of sensing array elements and flexible wires which are arranged between layers.
Acoustic matching layer: in order to improve the sound wave conduction performance, the embodiment of the invention adopts a polyimide film (PI film) as a main material of the sound matching layer, and the polyimide film not only carries the sensing array element, but also can effectively receive sound wave signals.
Sensing array elements: n sensing array elements are arranged on the acoustic matching layer, each array element being composed of a flexible polymer matrix, e.g. polyvinylpyrrolidone (PVP), and nano-conductive particles, e.g. Graphene. The size of the array element can be adjusted according to the wavelength of the sound wave in the measuring target so as to ensure good performance of the sensor in different modes.
Flexible insulating layer: the embodiment of the invention introduces a flexible insulating layer which is mainly used for protecting and isolating the sensing array elements. Taking 64 sensing array elements as an example, 128 through holes are formed in the insulating layer, and wires are arranged for two poles of the array elements through the through holes so as to complete electrical connection of the sensor.
If a plurality of sensing array element layers are arranged in the flexible ultrasonic array sensor, flexible insulating layers laid between adjacent sensing array element layers are processed in the same way in the last natural section, namely corresponding numbers of through holes and wires are arranged for the sensing array element layers covered by the flexible insulating layers.
A flexible wire: 128 through holes are formed in the flexible insulating layer and distributed on two sides of the 64 array elements and are used for connecting flexible wires to two ends of the array elements. And flexible wires are paved on the surface of the insulating layer by adopting a printing technology and led out to a wiring port through a cable so as to realize reliable electrical connection.
Acoustic damping layer: rubber is used as the material of the acoustic damping layer in order to absorb sound waves and reduce the interference of echoes on the signal. The layer also has a protection function, and the influence on the service life of the probe caused by friction damage is effectively reduced. If a plurality of sensing array element layers are arranged in the flexible ultrasonic array sensor, only the last flexible insulating layer is covered with the acoustic damping layer.
Referring to the following description of the process flow of the flexible ultrasonic array sensor, fig. 8 (a) is a schematic diagram of a sensor array element manufacturing mold, and fig. 8 (b) is a schematic diagram of a sensor array element manufacturing mold covering an acoustic matching layer, and a Polyimide (PI) film with a thickness of 0.02mm is first cut into a rectangular substrate with a length of 60mm and a width of 20mm, and is used as the acoustic matching layer. Ensuring that the array element is tightly attached to a heating table, controlling the temperature of the heating table to be 80 ℃, and covering an acoustic matching layer by using a corresponding die to assist in forming the array element.
And then covering the die on the acoustic matching layer, adjusting the angle of a spray gun, and selecting absolute ethyl alcohol ink added with Graphene and PVP for spraying. After the spraying is completed, the mold is stripped, the manufactured structure is placed in a vacuum box for drying for 24 hours, so that a stable acoustic matching layer attached with array elements is obtained, the preparation process is shown in fig. 9 (a), and fig. 9 (b) is a schematic diagram of the array elements after forming.
Further, the lower layer shell attached with the array elements is placed on a heating table again, and the PVA with the thickness of 0.5mm is uniformly covered on the middle layer by using a method of uniformly spraying PVA-absolute ethyl alcohol ink, so that through holes with the diameter equal to the width of the array elements are reserved at two ends of each array element. Fig. 10 (a) is a front view of the insulating layer molding result, and fig. 10 (b) is a top view of the insulating layer molding result.
Then, the wires are printed on the insulating layer by using a 3D printing technology, led out from two ends of each array element, converged on the right side of the probe and connected to the adapter, and fig. 11 is a schematic diagram after the flexible wires are arranged.
If the flexible ultrasonic array sensor is provided with only one sensing array element layer, the upper layer of the flexible insulating layer after the flexible wires are arranged is directly covered with an acoustic damping layer formed by rubber; if a plurality of sensing array element layers are required to be arranged on the flexible ultrasonic array sensor, a row of new array elements with preset included angles (for example, included angles of 90 degrees) with the lower array elements are paved above the flexible insulating layer, then the flexible insulating layer is paved above the new array element layers, and the like, after the required number of sensing array element layers are obtained, an acoustic damping layer formed by rubber is covered on the upper layer of the flexible insulating layer which covers the last sensing array element layer, so that influence of echoes on signals is reduced, and finally a prepared flexible ultrasonic sensor part is obtained, wherein fig. 12 (a) is a front view of the prepared flexible ultrasonic array sensor with only one sensing array element layer, and fig. 12 (b) is a top view of the prepared flexible ultrasonic array sensor with only one sensing array element layer.
Fig. 13 is a schematic diagram of the interface of the flexible ultrasonic array sensor, and fig. 14 is a schematic diagram of the interface of all the matching resistors, where as can be seen from the above description, there is a first switch between the a-terminal of the nth array element and the power source Vcc; a second switch is arranged between the B joint of the nth array element and the C joint of the matching resistor; a third switch is present between the D-connection of the matching resistor n and the voltage-controlled resistor.
The probe with array elements laid in a single direction (i.e. the probe with only one sensing array element layer) has good imaging effect only on a plane perpendicular to the array element direction due to the angle limitation, and the orthogonal array element arrangement can obtain sound field information orthogonal to the original plane direction on the original basis. Fig. 15 is a front view of a flexible ultrasonic array sensor with two sensing element layers perpendicular to each other, as shown in fig. 15, where the probe with two sensing element layers perpendicular to each other can increase the data acquisition angle by laying a thin insulating layer over the original element, and then laying a new array element perpendicular to the underlying element over the insulating layer. Fig. 16 is a side view in the X direction of a flexible ultrasonic array sensor provided with two sensing element layers perpendicular to each other, and fig. 17 is a side view in the Y direction of a flexible ultrasonic array sensor provided with two sensing element layers perpendicular to each other.
In addition to the optional embodiments described above, the user may also acquire ultrasonic information of the sample under test from multiple angles by optimizing the size and/or the laying manner of the sensing array elements, thereby improving the accuracy of imaging. As shown in fig. 18, three layers of array elements, i.e., an upper layer, a middle layer and a lower layer, which are equally spaced and respectively form included angles of 60 degrees, -60 degrees and 180 degrees with the x-axis, can be laid, and in fig. 18, the sensing array elements are replaced by straight line simplification.
In summary, compared with the sensor working independently, the sensor provided by the invention is more flexible in the use process, and ensures that the sensor is not easy to crack or damage even when large bending deformation occurs in the direction perpendicular to the array element, thus prolonging the service life of the sensor and enhancing the working stability of the sensor. And in the diversified detection scenes, the flexible ultrasonic sensing receiving device can be matched with proper resistance values in a feedback adjustment mode, so that the detection efficiency can be remarkably improved when multiple array elements are simultaneously operated, and at least three operation modes can support flexible adjustment of the working state of the probe, so that balance between sensitivity and precision is realized, and various detection requirements of users are met.
Example two
The embodiment of the invention also provides a flexible ultrasonic sensing and receiving system, which comprises the flexible ultrasonic sensing and receiving device provided by the first embodiment, and further comprises: and a signal analysis device.
The signal analysis device is connected with the flexible ultrasonic sensing receiving device and is used for receiving and analyzing the output signal of the flexible ultrasonic sensing receiving device. The embodiment of the invention does not improve the signal analysis device, and the related structure can refer to the existing equipment.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal," "vertical," "overhang," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (10)
1. A flexible ultrasonic sensing reception device, comprising: the device comprises a microcontroller, a switch control module and a plurality of sensing matching circuits; each of the sensing matching circuits includes: the sensing array element, the matching resistor, the voltage-controlled resistor and the initializing switch;
Each sensing matching circuit is connected with the microcontroller and the switch control module in the same circuit mode; all the sensing array elements form a flexible ultrasonic array sensor;
the driving end of the microcontroller is connected with the controlled end of the switch control module, and the first control end of the switch control module is connected with the controlled end of the initialization switch;
the first end of the sensing array element is connected with a power supply, and the second end of the sensing array element is respectively connected with the first end of the matching resistor, the first end of the initializing switch and the signal receiving end of an external signal analyzing device;
The second end of the matching resistor is connected with the first end of the voltage-controlled resistor, and the second end of the voltage-controlled resistor is connected with the grounding end;
The second end of the initialization switch is connected with the first feedback end of the microcontroller, and the first control end of the microcontroller is connected with the controlled end of the voltage-controlled resistor;
After the flexible ultrasonic array sensor is paved in a region to be detected, the microcontroller controls the initialization switch to be closed through the switch control module, and the microcontroller adjusts the output voltage of the first control end of the microcontroller according to the voltage value of the first feedback end and the voltage value of the power supply so as to adjust the resistance value of the voltage-controlled resistor, and under the condition that the difference value between the voltage value of the first feedback end and the voltage value of the power supply is smaller than a preset threshold value, the microcontroller controls the initialization switch to be opened through the switch control module.
2. The flexible ultrasonic sensing reception device of claim 1, wherein the sensing matching circuit further comprises: a first switch;
The first end of the first switch is connected with the power supply, and the second end of the first switch is connected with the first end of the sensing array element; the controlled end of the first switch is connected with the second control end of the switch control module.
3. The flexible ultrasonic sensing reception device of claim 2, wherein the sensing matching circuit further comprises: a second switch and a third switch; the flexible ultrasonic sensing receiving device further comprises: a plurality of fourth switches and a plurality of fifth switches, the number of the fourth switches and the number of the fifth switches being equal and equal to the number of the sensing matching circuits minus one;
the first end of the second switch is connected with the second end of the sensing array element, and the second end of the second switch is connected with the first end of the matching resistor;
The first end of the third switch is connected with the second end of the matching resistor, and the second end of the third switch is connected with the first end of the voltage-controlled resistor;
The fourth switch and the fifth switch are arranged between the adjacent sensing matching circuits, the first end of the fourth switch is connected with the second end of the sensing array element in the first sensing matching circuit, and the second end of the fourth switch is connected with the first end of the sensing array element in the second sensing matching circuit; the first sensing matching circuit and the second sensing matching circuit are adjacent sensing matching circuits;
the first end of the fifth switch is connected with the first end of the matching resistor in the first sensing matching circuit, and the second end of the fifth switch is connected with the second end of the matching resistor in the second sensing matching circuit;
the on-off of the second switch, the third switch, the fourth switch and the fifth switch are controlled by the switch control module.
4. A flexible ultrasound sensing reception device according to claim 3, where the operation modes of the flexible ultrasound sensing reception device at least comprise: a conventional phased array mode, an equivalent array element phased array mode and a single channel mode.
5. The flexible ultrasonic sensor receiver of claim 1,
Under the condition that the voltage value of the first feedback end is twice smaller than the voltage value of the power supply, the microcontroller upwardly adjusts the voltage value of the first control end of the microcontroller so as to increase the resistance value of the voltage-controlled resistor;
And under the condition that the voltage value of the first feedback end is twice larger than the voltage value of the power supply, the microcontroller downwards adjusts the voltage value of the first control end of the microcontroller so as to reduce the resistance value of the voltage-controlled resistor.
6. The flexible ultrasonic sensing and receiving device according to claim 1, wherein the flexible ultrasonic array sensor comprises at least one sensing array element layer, a flexible insulating layer is paved between adjacent sensing array element layers, each sensing array element layer comprises a plurality of sensing array elements, all sensing array elements in each sensing array element layer are identical in size, and the intervals between adjacent sensing array elements are identical.
7. The flexible ultrasonic sensor receiving device of claim 1, wherein the flexible ultrasonic array sensor further comprises: the device comprises an acoustic matching layer, a flexible insulating layer, a flexible wire and an acoustic damping layer;
the acoustic matching layer is used for bearing the sensing array element;
covering the flexible insulating layer on the acoustic matching layer carrying the sensing array element, and reserving through holes with the diameter equal to the width of the sensing array element for the two ends of the sensing array element;
the two ends of each sensing array element are connected with flexible wires, the flexible wires are positioned on the flexible insulating layer, and joints of all the flexible wires are converged on an external joint of the flexible ultrasonic array sensor;
The acoustic damping layer is covered on the flexible insulating layer.
8. The flexible ultrasonic sensing reception device of claim 7, wherein the sensing array elements are attached to the acoustic matching layer by spraying.
9. The flexible ultrasonic sensing device of claim 7, wherein the flexible insulating layer is made of polyvinyl alcohol PVA.
10. A flexible ultrasound sensing reception system, characterized in that it comprises the flexible ultrasound sensing reception device of any one of claims 1 to 9, further comprising: a signal analysis device;
the signal analysis device is connected with the flexible ultrasonic sensing receiving device and is used for receiving and analyzing the output signal of the flexible ultrasonic sensing receiving device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410431650.5A CN118031866B (en) | 2024-04-11 | 2024-04-11 | Flexible ultrasonic sensing receiving device and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410431650.5A CN118031866B (en) | 2024-04-11 | 2024-04-11 | Flexible ultrasonic sensing receiving device and system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN118031866A true CN118031866A (en) | 2024-05-14 |
| CN118031866B CN118031866B (en) | 2024-06-14 |
Family
ID=90998901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410431650.5A Active CN118031866B (en) | 2024-04-11 | 2024-04-11 | Flexible ultrasonic sensing receiving device and system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118031866B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113092595A (en) * | 2021-03-24 | 2021-07-09 | 中国科学院空天信息创新研究院 | Flexible ultrasonic transduction array and device of composite flexible three-dimensional pressure monitoring array |
| CN113108734A (en) * | 2021-04-27 | 2021-07-13 | 河北稳控科技有限公司 | Two-wire vibrating wire sensor with temperature detection function and working method thereof |
| US20210315544A1 (en) * | 2020-04-09 | 2021-10-14 | Shanghai Soundwise Technology Co., Ltd. | Ultrasonic system of contact type flexible conformal ultrasonic probe and method for the same |
| WO2021227261A1 (en) * | 2020-05-15 | 2021-11-18 | 苏州希声科技有限公司 | Flexible ultrasonic probe, ultrasonic imaging measurement system, and measurement method |
| CN116718102A (en) * | 2023-05-30 | 2023-09-08 | 中国特种设备检测研究院 | Far-field passive wireless strain sensor and system for metal pipeline strain detection |
-
2024
- 2024-04-11 CN CN202410431650.5A patent/CN118031866B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210315544A1 (en) * | 2020-04-09 | 2021-10-14 | Shanghai Soundwise Technology Co., Ltd. | Ultrasonic system of contact type flexible conformal ultrasonic probe and method for the same |
| WO2021227261A1 (en) * | 2020-05-15 | 2021-11-18 | 苏州希声科技有限公司 | Flexible ultrasonic probe, ultrasonic imaging measurement system, and measurement method |
| CN113092595A (en) * | 2021-03-24 | 2021-07-09 | 中国科学院空天信息创新研究院 | Flexible ultrasonic transduction array and device of composite flexible three-dimensional pressure monitoring array |
| CN113108734A (en) * | 2021-04-27 | 2021-07-13 | 河北稳控科技有限公司 | Two-wire vibrating wire sensor with temperature detection function and working method thereof |
| CN116718102A (en) * | 2023-05-30 | 2023-09-08 | 中国特种设备检测研究院 | Far-field passive wireless strain sensor and system for metal pipeline strain detection |
Non-Patent Citations (1)
| Title |
|---|
| 张雷 等: "阵列式水声传感器在水下通信中的应用", 仪表技术与传感器, no. 11, 15 November 2014 (2014-11-15) * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118031866B (en) | 2024-06-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3128931B1 (en) | Needle with piezoelectric polymer sensors | |
| US7092539B2 (en) | MEMS based acoustic array | |
| US7940603B2 (en) | Ultrasonic transducer cell | |
| US4265117A (en) | Surface temperature detecting apparatus | |
| CN103635264B (en) | Ultrasonic transduction assembly and manufacture method thereof | |
| US6994674B2 (en) | Multi-dimensional transducer arrays and method of manufacture | |
| US5732706A (en) | Ultrasonic array with attenuating electrical interconnects | |
| JP6763113B2 (en) | Sensor-based percussion device | |
| US4366714A (en) | Pressure/temperature probe | |
| US20040002435A1 (en) | Transmit and receive isolation for ultrasound scanning and methods of use | |
| CN111458409A (en) | Flexible ultrasonic probe, ultrasonic imaging detection system and detection method | |
| CN105340026A (en) | Conductor assembly | |
| EP2596548B1 (en) | Field probe | |
| EP3130040B1 (en) | Connector for needle with piezoelectric polymer sensors | |
| CN106163410B (en) | Probe with multiple sensors | |
| CN103654850A (en) | Attachment for ultrasonic probe, ultrasonic probe and ultrasonic diagnostic apparatus | |
| CN105657626A (en) | Capacitive micromachined ultrasonic transducer and test object information acquiring apparatus including the same | |
| CN118031866B (en) | Flexible ultrasonic sensing receiving device and system | |
| CN109492504A (en) | Ultrasonic wave biological identification device and preparation method thereof and electronic equipment | |
| EP0955550B1 (en) | Method of detecting electrical discharges | |
| US7091503B2 (en) | Measuring plasma uniformity in-situ at wafer level | |
| US20040249285A1 (en) | Micro ultrasonic transducer building on flexible base substrate | |
| WO2003088349A1 (en) | Signal detection contactor and signal correcting system | |
| CN109375012A (en) | A kind of test device and test method of extendible array Multi-functional base plate | |
| CN109470365A (en) | A kind of device and calibration method for calibrating thermal microscope |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |