CN118023738A - Laser processing method of conical hole precious stone element - Google Patents
Laser processing method of conical hole precious stone element Download PDFInfo
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- CN118023738A CN118023738A CN202311292928.7A CN202311292928A CN118023738A CN 118023738 A CN118023738 A CN 118023738A CN 202311292928 A CN202311292928 A CN 202311292928A CN 118023738 A CN118023738 A CN 118023738A
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- laser
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- drilling machine
- rotary base
- conical hole
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- 239000010437 gem Substances 0.000 title claims abstract description 50
- 229910001751 gemstone Inorganic materials 0.000 title claims abstract description 50
- 238000003672 processing method Methods 0.000 title claims abstract description 15
- 238000005553 drilling Methods 0.000 claims abstract description 37
- 238000003754 machining Methods 0.000 claims abstract description 20
- 238000006073 displacement reaction Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 29
- 239000000835 fiber Substances 0.000 claims description 8
- 239000002585 base Substances 0.000 description 35
- 239000010432 diamond Substances 0.000 description 12
- 229910003460 diamond Inorganic materials 0.000 description 12
- 238000004080 punching Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Laser Beam Processing (AREA)
Abstract
A laser processing method of a tapered hole gemstone element, comprising the steps of: 1) Fixing the gem grain blank, adjusting the Z-direction height distance of the light outlet from the gem grain blank and the focal length of laser, and adjusting the rotary base to enable the center of the laser outlet to coincide with the rotary center of the gem grain blank; 2) Setting processing parameters according to the depth and angle of the conical hole, wherein the processing parameters comprise the vertical displacement step distance of a laser focus and the gradually reduced horizontal displacement distance of the rotary base from the center of the conical hole to the circumference of the conical hole; setting processing parameters according to the depth and the aperture of the straight hole section; 3) The rotary base rotates at a high speed, the laser drilling machine firstly emits laser pulses, the rotary base moves back and forth along the radius of the circumference of the tapered hole in the horizontal direction until the light outlet of the laser drilling machine moves downwards after the first layer of the blank is broken, meanwhile, the moving distance of the rotary base along the radius of the circumference is shortened until the tapered hole is machined, and then the laser focus of the laser drilling machine machines a straight hole section according to machining parameters.
Description
Technical Field
The invention relates to the field of conical hole precious stone processing, in particular to a laser processing method of a conical hole precious stone element.
Background
The artificial gem crystal has excellent physical and chemical properties due to the unique crystal structure, and has the characteristics of high hardness, wear resistance, acid and alkali corrosion resistance and the like, and is widely applied to a plurality of fields of medical treatment, microfluidics, semiconductors and the like. But the hardness is high (Mohs 9 grade is inferior to natural diamond), brittleness is large, axial difference of crystals is large, and the production and processing difficulties are large.
The current technology for processing the conical groove section and the cylindrical straight hole section of the precious stone element is as follows:
1) Perforating once: grinding and forming the diamond bit according to the angle and depth to be processed, and rough machining the diamond bit on one end face of the grain blank by using the grinded diamond bit to obtain a rudiment of the conical groove with the corresponding angle and depth;
2) Laser drilling: the YAG laser emits laser pulses, and the bottom of the conical groove obtained in the step 1) continues to extend to form a straight hole, and penetrates out of the other end face;
3) Reaming: reaming the conical groove to ensure that the aperture and the opening angle of the conical groove meet the requirements;
4) Perforating twice: in the process of 'one-time drilling', the tip part and the conical surface of the diamond bit become blunt rapidly due to abrasion, so that the bottom of the conical groove is of an arc-shaped 'pocket-shaped' structure after one-time drilling, and the diamond bit is replaced at the moment to continuously process the bottom of the groove until the requirement is met;
5) Grinding: and finally, grinding the inner wall of the conical groove by adopting a diamond grinding tool to finish the processing.
Namely, the process steps are as follows: hole punching once, laser drilling, reaming processing, hole punching twice and grinding.
The above process has the following drawbacks:
1. two "shots" are required, resulting in low yields.
2. Because the YAG laser can only punch straight hole micropores, and the diamond bit is required to process taper holes, the diamond bit blank is required to be clamped twice, so that the coaxiality of the taper holes and the straight hole sections is low, the working procedure is complicated, time and labor are wasted, and the production cost is increased.
Disclosure of Invention
The invention aims at solving the problems existing in the prior art and provides a laser processing method of a conical hole precious stone element, which utilizes laser pulses of a laser machine to process and shape conical holes and straight hole sections at one time, and the laser machine firstly processes the conical holes and then processes the straight holes according to parameters set by the laser machine, so that the coaxiality of the conical holes and the straight hole sections is high, the working procedure is simple, and the processing efficiency is high.
In order to achieve the above purpose, the present invention provides the following technical solutions:
A laser processing method of a tapered hole gemstone element, comprising the steps of:
1) Fixing the gem grain blank on a clamp of a rotary base, adjusting the Z-direction height distance between a light outlet of a laser drilling machine and the gem grain blank and the focal length of laser through a computer, and adjusting the rotary base to enable the center of a laser outlet to coincide with the rotation center of the gem grain blank;
2) Setting processing parameters of the laser drilling machine according to the depth and the angle of the conical hole, wherein the processing parameters comprise the vertical displacement step distance of a laser focus and the gradually reduced horizontal displacement distance of a rotary base from the center of the conical hole to the circumference of the conical hole; setting processing parameters of a laser drilling machine according to the depth and the aperture of the straight hole section;
3) The rotary base rotates at a high speed, firstly, the laser drilling machine emits laser pulses, the rotary base moves back and forth along the radius of the circumference of the tapered hole along the horizontal direction until the light outlet of the laser drilling machine moves downwards after the first layer of the broken blank is broken, meanwhile, the moving distance of the rotary base along the radius of the circumference is shortened, each layer of the broken blank is broken by the laser pulses, the moving distance of the rotary base along the radius of the circumference is shortened until the tapered hole is machined, and then, the laser focus of the laser drilling machine machines straight hole sections according to machining parameters.
Further, the software for adjusting the laser drilling machine in the computer in the step 1) is CNC.
Further, the laser drilling machine in the step 1) is a fiber laser machine.
Further, the depth of the conical hole in the step 2) is 0.1 mm-3.0 mm, the angle of the conical hole is 10 degrees-170 degrees, the depth of the straight hole section is 0.03 mm-0.30 mm, and the aperture is 0.01 mm-0.06 mm.
Further, the vertical displacement step of the laser focus in the step 2) is 0.0001 mm-0.01 mm.
Further, the parameters of the laser drilling machine in the step 2) for machining the conical hole and the straight hole section further comprise the moving speed of the rotating base, the laser frequency, the laser pulse width, the laser pause time and the laser power.
Further, the speed of movement of the rotating base when machining the conical hole is 8mm/s, and the speed of movement of the rotating base when machining the straight hole section is 6mm/s.
Further, the frequency of the laser is 1500 Hz-1700 Hz, the pulse width of the laser is 34950 ns-35050 ns, and the power of the laser is 2 w-4 w when the conical hole is machined; the laser frequency is 950 Hz-1050 Hz, the laser pulse width is 950 ns-1050 ns, the laser power is 10 w-12 w, and the laser pause time is 30ms when the straight hole section is processed.
Further, the rotational speed of the rotating base in the step 3) is 11500r/min to the upper
12500r/min。
The invention has the beneficial effects that:
1. The method for processing the jewel grain blank firstly processes the conical hole and then processes the straight hole section, and the whole process is formed at one time, so that the processing efficiency is high; by adopting the method, the precious stone grain blank is clamped once before machining, the clamping is not required for the second time, the coaxiality of the conical hole and the straight hole section is high, and the problem of low coaxiality caused by the clamping twice in the prior art is solved.
2. The method is adopted to process the gem grain blank, the rotary base rotates at a high speed, the rotary base moves back and forth along the radius of the circumference of the conical hole in the horizontal direction until the light outlet of the laser drilling machine moves downwards after the first layer of blank is broken, the moving distance of the rotary base along the radius of the circumference is shortened every time one layer of blank is broken by laser pulse, the conical hole is processed until the conical hole is processed, and the wall of the conical hole processed by the method is smooth and even.
3. The method uses the fiber laser machine for punching, and the fiber laser machine has the advantages of high laser pulse stability, slender light beam, small damage layer, high precision of straight hole section, fast heat dissipation and low loss.
The invention is further described below with reference to the drawings and detailed description.
Drawings
FIG. 1 is a schematic diagram of the structure of a gemstone blank according to the present invention after processing.
Fig. 2 is a schematic view of the installation of a gemstone blank according to the present invention.
Reference numerals illustrate: the diamond particle blank comprises a diamond particle blank 1, a conical hole 2, a straight hole section 3, an adjusting screw 4, a spring chuck 5, laser pulses 6, a rotating base 7, a suspension motorized spindle 8 and a limiting step 9.
Detailed Description
Referring to fig. 1 to 2, in the present embodiment, the direction perpendicular to the upper end face of the gemstone blank 1 is the Z direction, and the direction parallel to the upper end face of the gemstone blank 1 is the horizontal direction.
A laser processing method of a tapered hole gemstone element, comprising the steps of:
Step 1), fixing a gem grain blank 1 on a clamp of a rotary base 7 by hands or forceps, wherein the rotary base 7 is fixedly connected with a suspension electric spindle 8, in the embodiment, the gem grain blank 1 is sapphire with an aluminum oxide component, the clamp is a collet chuck 5, a limit step 9 is arranged in the collet chuck 5, after the gem grain blank 1 is placed, the periphery of the collet chuck 5 is tightened and fixed, and meanwhile, the upper surface of the gem grain blank 1 is lightly pressed to ensure that the lower end surface of the gem grain blank 1 contacts with the limit step 9, so that the gem grain blank 1 is placed flatly; the Z-direction height distance of the light outlet of the laser puncher from the gem grain blank 1 and the focal length of laser are adjusted through a computer, so that the upper end face of the gem grain blank 1 is clearly displayed in a video microscope, the adjusting screw 4 is screwed for adjusting the position of the rotating base 7 in the horizontal direction, the rotating base 7 is manually rotated, the video microscope is observed at the same time, the center of the laser outlet is overlapped with the rotating center of the gem grain blank 1, and the two centers are combined into one, so that the machining precision is improved.
In this embodiment, the software for adjusting the laser drilling machine in the computer in step 1) is CNC.
In this embodiment, the laser drilling machine in the step 1) is a 1064nm fiber laser, and the fiber laser has a slender beam, and compared with a YAG laser, the laser drilling machine has higher stability, faster heat dissipation, lower loss, and is more suitable for the gem grain blank 1 processed by the present invention.
Step 2), setting machining parameters of the laser drilling machine according to the depth and the angle of the conical hole 2, wherein the machining parameters comprise the vertical displacement step distance of a laser focus, namely the Z-direction displacement step distance, and the gradually reduced horizontal displacement distance of the circle center of the conical hole 2 from the circumference of the conical hole 2 of the rotating base 7; and setting processing parameters of the laser drilling machine according to the depth and the aperture of the straight hole section 3.
By adopting the method, the processable depth of the conical hole 2 in the step 2) is 0.1-3.0 mm, the angle of the conical hole is 10-170 degrees, the depth of the straight hole section 3 is 0.03-0.30 mm, the aperture is 0.01-0.06 mm, in the embodiment, the depth of the conical hole 2 processed by the gem grain blank 1 is 0.34mm, the angle of the conical hole is 98 degrees, the depth of the straight hole section 3 processed by the gem grain blank 1 is 0.20mm, and the aperture is 0.04mm.
The vertical displacement step distance of the laser focus in the step 2) is 0.0001 mm-0.01 mm. In the present embodiment, the vertical displacement step distance of the laser focus at the tapered hole 2 is 0.005mm, the vertical displacement step distance of the laser focus at the straight hole section 3 is 0.003mm, the processing effect is best, and the inner walls of the tapered hole 2 and the straight hole section 3 are flat and smooth.
The parameters of the laser drilling machine in the step 2) for machining the conical hole 2 and the straight hole section 3 also comprise the moving speed of the rotary base 7, the laser frequency, the laser pulse width, the laser pause time and the laser power.
In this embodiment, the speed at which the rotary base 7 moves when the tapered hole 2 is machined is 8mm/s, the speed at which the rotary base 7 moves when the straight hole section 3 is machined is 6mm/s, the diameter of the straight hole section 3 is smaller than the diameter of the tapered section of the tapered hole 2, and the speed at which the straight hole section 3 moves is smaller than the speed at which the tapered hole 2 is machined.
The frequency of the laser is 1500 Hz-1700 Hz when the conical hole 2 is processed, the pulse width of the laser is 34950 ns-35050 ns, and the power of the laser is 2 w-4 w; the laser frequency is 950 Hz-1050 Hz, the laser pulse width is 950 ns-1050 ns, and the laser power is 10 w-12 w when the straight hole section 3 is processed. In this embodiment, the frequency of the laser is 1600Hz, the pulse width of the laser is 35000ns, and the power of the laser is 3w, so that the effect is best; the laser frequency is 1000Hz, the pulse width of the laser is 1000ns, the power of the laser is 11w, and the effect is best when the straight hole section 3 is processed; when the straight hole section 3 is machined, the laser pause time is 30ms, machining is continued after the laser pause time is stopped, and the Z-direction consistency of the straight hole section can be improved.
Step 3), rotating the rotating base 7 at a high speed, firstly, emitting laser pulse 6 by the laser drilling machine, irradiating the laser pulse 6 at the circle center of the conical hole 2, reciprocating the rotating base 7 along the horizontal direction and along the radius of the circumference of the conical hole 2 until the light outlet of the laser drilling machine moves downwards after the first layer of the broken blank is broken, simultaneously shortening the moving distance of the rotating base 7 along the radius direction of the circumference, shortening the moving distance of the rotating base 7 along the radius direction of the circumference every time each layer of the broken blank of the laser pulse 6 until the conical hole 2 is machined, then, machining the straight hole section 3 by the laser focus of the laser drilling machine according to machining parameters, irradiating the laser pulse 6 at the circle center of the straight hole section 3, reciprocating the rotating base 7 along the radius of the circumference of the straight hole section 3 until the light outlet of the laser drilling machine moves downwards after the first layer of the broken blank is broken, and descending once every layer of the light outlet of the laser pulse 6 until the moving distance of the radius of the rotating base 7 along the circumference is unchanged until the straight hole section 3 is the straight hole.
The rotation speed of the rotation base 7 in the step 3) is 11500r/min to 12500r/min, and in the present embodiment, the rotation speed of the rotation base 7 is 12000r/min.
The method for processing the jewel grain blank 1 firstly processes the conical hole 2 and then processes the straight hole section 3, and the whole process is formed at one time, so that the processing efficiency is high; by adopting the method, the precious stone grain blank 1 is clamped once before machining, the clamping is not required for the second time, the coaxiality of the conical hole 2 and the straight hole section 3 is high, and the problem of low coaxiality caused by the clamping twice in the prior art is solved. According to the method disclosed by the invention, the gem grain blank 1 is processed, the rotary base 7 rotates at a high speed, meanwhile, the rotary base 7 moves back and forth along the radius of the circumference of the conical hole 2 in the horizontal direction until the light outlet of the laser drilling machine moves downwards after the first layer of blank is broken, meanwhile, the moving distance of the rotary base 7 along the radius of the circumference is shortened, each layer of blank is broken by the laser pulse 6, the moving distance of the rotary base 7 along the radius of the circumference is shortened until the conical hole 2 is processed, the inner wall of the conical hole 2 processed by the method is smooth and flat, and the problem that the inner wall of the conical hole 2 is uneven due to rapid abrasion of a diamond bit in the prior art is solved; the method uses the fiber laser machine for punching, the laser pulse of the fiber laser machine has high stability, long and thin beam, small damage layer, high precision of the straight hole section 3, quick heat dissipation and low loss.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the invention, and those skilled in the art will appreciate that the modifications made to the invention fall within the scope of the invention without departing from the spirit of the invention.
Claims (9)
1. A method of laser machining a tapered hole gemstone element, comprising the steps of:
1) Fixing the gem grain blank (1) on a clamp of a rotary base (7), adjusting the Z-direction height distance of a light outlet of a laser drilling machine from the gem grain blank (1) and the focal length of laser through a computer, and adjusting the rotary base (7) to enable the center of the laser outlet to coincide with the rotation center of the gem grain blank (1);
2) Setting machining parameters of the laser drilling machine according to the depth and the angle of the conical hole (2), wherein the machining parameters comprise the vertical displacement step distance of a laser focus and the gradually reduced horizontal displacement distance of the circle center of the conical hole (2) from the circumference of the conical hole (2) of the rotating base (7); setting processing parameters of a laser drilling machine according to the depth and the aperture of the straight hole section (3);
3) The rotary base (7) rotates at a high speed, firstly, the laser drilling machine emits laser pulses (6), the rotary base (7) moves back and forth along the radius of the circumference of the conical hole (2) until the light outlet of the laser drilling machine moves downwards after the first layer of the broken blank is broken, meanwhile, the moving distance of the rotary base (7) along the radius of the circumference is shortened, each layer of broken blank of the laser pulses (6), the moving distance of the rotary base (7) along the radius of the circumference is shortened until the conical hole (2) is machined, and then the laser focus of the laser drilling machine machines the straight hole section (3) according to machining parameters.
2. The laser processing method of a tapered-hole precious stone element according to claim 1, characterized in that: and the software for adjusting the laser drilling machine in the computer in the step 1) is CNC.
3. The laser processing method of a tapered-hole precious stone element according to claim 1, characterized in that: the laser drilling machine in the step 1) is a fiber laser machine.
4. The laser processing method of a tapered-hole precious stone element according to claim 1, characterized in that: the depth of the conical hole (2) in the step 2) is 0.1-3.0 mm, the angle of the conical hole is 10-170 degrees, the depth of the straight hole section (3) is 0.03-0.30 mm, and the aperture is 0.01-0.06 mm.
5. The laser processing method of a tapered-hole precious stone element according to claim 1, characterized in that: the vertical displacement step distance of the laser focus in the step 2) is 0.0001 mm-0.01 mm.
6. The laser processing method of a tapered-hole precious stone element according to claim 1, characterized in that: the parameters of the laser drilling machine in the step 2) for machining the conical hole (2) and the straight hole section (3) further comprise the moving speed of the rotary base (7), the laser frequency, the laser pulse width, the laser pause time and the laser power.
7. The laser processing method of a tapered-hole precious stone element according to claim 6, characterized in that: the moving speed of the rotating base (7) when the conical hole (2) is machined is 8mm/s, and the moving speed of the rotating base (7) when the straight hole section (3) is machined is 6mm/s.
8. The laser processing method of a tapered-hole precious stone element according to claim 6, characterized in that:
the frequency of the laser is 1500 Hz-1700 Hz when the conical hole (2) is processed, the pulse width of the laser is 34950 ns-35050 ns, and the power of the laser is 2 w-4 w;
the laser frequency is 950 Hz-1050 Hz, the laser pulse width is 950 ns-1050 ns, the laser power is 10 w-12 w, and the laser pause time is 30ms when the straight hole section (3) is processed.
9. The laser processing method of a tapered-hole precious stone element according to claim 1, characterized in that: the rotating speed of the rotating base (7) in the step 3) is 11500 r/min-12500 r/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311292928.7A CN118023738A (en) | 2023-10-08 | 2023-10-08 | Laser processing method of conical hole precious stone element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311292928.7A CN118023738A (en) | 2023-10-08 | 2023-10-08 | Laser processing method of conical hole precious stone element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118023738A true CN118023738A (en) | 2024-05-14 |
Family
ID=90993865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311292928.7A Pending CN118023738A (en) | 2023-10-08 | 2023-10-08 | Laser processing method of conical hole precious stone element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118023738A (en) |
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2023
- 2023-10-08 CN CN202311292928.7A patent/CN118023738A/en active Pending
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