CN118016497A - Wafer carrying device and semiconductor process equipment - Google Patents
Wafer carrying device and semiconductor process equipment Download PDFInfo
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- CN118016497A CN118016497A CN202211399286.6A CN202211399286A CN118016497A CN 118016497 A CN118016497 A CN 118016497A CN 202211399286 A CN202211399286 A CN 202211399286A CN 118016497 A CN118016497 A CN 118016497A
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- base
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- refrigerant
- electrical connection
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title abstract description 18
- 239000003507 refrigerant Substances 0.000 claims description 142
- 239000010410 layer Substances 0.000 claims description 45
- 239000002826 coolant Substances 0.000 claims description 20
- 238000005485 electric heating Methods 0.000 claims description 12
- 239000002346 layers by function Substances 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims 2
- 238000005516 engineering process Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 55
- 238000009434 installation Methods 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses a wafer carrying device, which comprises a base (100), a feed part (210) and a first adapter (300), wherein: the first adapter piece (300) is positioned below the base (100), the first adapter piece (300) is provided with a central hole (311) and an annular electric connection surface (312), and the annular electric connection surface (312) is arranged around the central hole (311); the end of the power feeding part (210) is inserted into the central hole (311) and is electrically connected with the first adapter (300), and the base (100) is electrically connected with the annular electrical connection surface (312). The application also discloses semiconductor process equipment. The problem that the wafer bearing device in the related technology is poor in temperature uniformity in the circumferential direction can be solved.
Description
Technical Field
The application belongs to the technical field of semiconductor process equipment design, and particularly relates to a wafer bearing device and semiconductor process equipment.
Background
Wafer carriers are a relatively important component of semiconductor processing equipment to support wafers as the semiconductor processing equipment performs processes. The base of the wafer carrying device is provided with a cooling medium channel. In a specific working process, a refrigerant (such as cooling water) is introduced into the refrigerant channel to adjust the temperature uniformity of the wafer carrying device.
The base also functions to receive radio frequency current. In the wafer carrying device related to the related art, the feeding part is inserted in the center of the base, and the modulated radio frequency current is finally input to the center of the base through the feeding part, so that the radio frequency guiding quality is ensured. In this case, in order to avoid the feeding portion, the wafer carrying device related to the related art opens the coolant inlet and the coolant outlet at the edge of the base. When the wafer carrying device is used, the temperature of the wafer carrying device in the circumferential direction is required to be consistent, and when the refrigerant enters the refrigerant channel from the refrigerant inlet, the pressure of the wafer carrying device can impact the inner wall of the refrigerant channel, so that the heat transfer efficiency of the refrigerant inlet is obviously higher, and a local low-temperature area is formed. Because the refrigerant inlet is positioned on the circumference with larger radial dimension, heat in other areas on the same circumference cannot be timely transferred due to longer distance, and a larger temperature gradient is easier to form, so that the temperature consistency in the circumferential direction cannot be met finally.
Disclosure of Invention
The invention discloses a wafer bearing device, which is used for solving the problem that the wafer bearing device in the related technology has poor temperature uniformity in the circumferential direction.
In order to solve the technical problems, the invention provides the following technical scheme:
In a first aspect, an embodiment of the present application discloses a wafer carrier, including a base, a feeding portion, and a first adaptor, wherein:
The first adapter is provided with a central hole and an annular electric connection surface, and the annular electric connection surface is arranged around the central hole; the end part of the feed part is inserted into the central hole and is electrically connected with the first transfer piece, and the base is electrically connected with the annular electric connection surface.
In a second aspect, an embodiment of the present application discloses a wafer carrier, including a base, a first adapter, a coolant input pipe, and a coolant output pipe, wherein:
The base is provided with a refrigerant channel, the refrigerant channel is provided with a refrigerant inlet and a refrigerant outlet, and the refrigerant inlet and the refrigerant outlet are arranged on the surface of the base facing the first adapter and are adjacent to the center of the base;
The first adapter is provided with a first connecting channel and a second connecting channel, the first connecting channel is communicated with the refrigerant inlet and the refrigerant input pipeline, and the second connecting channel is communicated with the refrigerant outlet and the refrigerant output pipeline;
the port of the first connecting channel connected with the refrigerant input pipeline is adjacent to the edge of the first adapter, and the port of the first connecting channel connected with the refrigerant inlet is adjacent to the center of the first adapter and opposite to the refrigerant inlet;
The port of the second connecting channel connected with the refrigerant output pipeline is adjacent to the edge of the first adapter, and the port of the second connecting channel connected with the refrigerant outlet is adjacent to the center of the first adapter and opposite to the refrigerant outlet.
In a third aspect, embodiments of the present application disclose a semiconductor processing apparatus comprising a wafer carrier as described above.
The technical scheme adopted by the invention can achieve the following technical effects:
According to the wafer carrying device disclosed by the embodiment of the application, through improving the structure of the wafer carrying device related to the related technology, the mode of inputting the radio frequency from the center of the base is changed, so that the radio frequency can be input into the base from the annular electric connection surface surrounding the center hole on the first adapter. Under the condition, the radio frequency is input from the part of the base around the center of the base, so that the radio frequency is not required to be input into the base from the center of the base, the occupation of the center of the base can be avoided, the center of the base is provided with an idle area, and then the refrigerant inlet and the refrigerant outlet can be arranged adjacent to the center of the base, so that the defect that the refrigerant inlet and the refrigerant outlet cannot be arranged adjacent to the center of the base due to the fact that the center of the base is cooled to be connected with the feed part in the related art can be relieved, and the temperature uniformity of the wafer bearing device in the circumferential direction can be improved.
Drawings
FIG. 1 is a schematic view of a wafer carrier according to an embodiment of the present application;
FIG. 2 is a schematic structural view of a first adapter according to an embodiment of the present application;
FIG. 3 is a top view of FIG. 2;
FIG. 4 is a bottom view of FIG. 2;
FIG. 5 is a cross-sectional view taken along A-A of FIG. 2;
FIG. 6 is a schematic diagram of a portion of the structure of FIG. 1;
FIG. 7 is a schematic diagram of a second adapter according to an embodiment of the present application;
Fig. 8 is a B-B cross-sectional view of fig. 7.
Reference numerals illustrate:
100-base, 110-coolant channel, 111-coolant inlet, 112-coolant outlet,
210-A power feeding part,
300-First adapter, 310-adapter base, 311-central hole, 312-annular electrical connection face, 313-first engagement channel, 314-second engagement channel, 315-overlap step face, 320-annular protrusion,
410-Refrigerant input pipeline, 420-refrigerant output pipeline,
510-A power-on layer, 511-an electric heating layer, 512-an electric adsorption layer, 520-a power-supply cable,
600-Second adapter, 610-first electric connection part, 620-second electric connection part, 630-insulating board, 640-line, 700-insulating ring, 710-annular sinking platform.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to specific embodiments of the present invention and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The technical scheme disclosed by each embodiment of the invention is described in detail below with reference to the accompanying drawings.
Referring to fig. 1 to 8, an embodiment of the application discloses a wafer carrier. The disclosed wafer carrier includes a susceptor 100, a power supply portion 210, and a first adapter 300.
The susceptor 100 is a component of the wafer carrier that assists in temperature regulation by cooling. The base 100 is provided with a refrigerant channel 110, and the refrigerant channel 110 is used for allowing a refrigerant (such as cooling water, cooling oil, etc.) to pass through, and the refrigerant exchanges heat with the base 100 in the process of flowing through the refrigerant channel 110, so that the temperature uniformity of the base 100 is adjusted. The refrigerant passage 110 has a refrigerant inlet 111 and a refrigerant outlet 112. In a specific operation, the refrigerant enters the refrigerant channel 110 from the refrigerant inlet 111, and flows out from the refrigerant outlet 112 after flowing through other areas of the refrigerant channel 110. Of course, as described in the background, the base 100 also functions to receive rf current to perform a predetermined function.
The first adapter 300 is a conductive member and is at least used for performing a power feeding adapter function. The first adaptor 300 is provided with a central hole 311 and an annular electric connection surface 312, the annular electric connection surface 312 is disposed around the central hole 311, and an end portion of the feeding portion 210 is inserted into the central hole 311 and electrically connected with the first adaptor 300, thereby realizing input of radio frequency.
The base 100 is electrically connected to the annular electrical connection surface 312 to receive the radio frequency input from the feeding portion 210, thereby completing the input of the radio frequency to the base 100.
It should be noted that, the central axis of the base 100 is closer to the central axis of the first adapter 300, and may even coincide. The annular electrical connection surface 312 is disposed around the central hole 311, and thus the annular electrical connection surface 312 may be considered to be disposed around the central axis of the first adapter 300, and further the annular electrical connection surface 312 may be considered to be disposed around the central axis of the base 100. Of course, it is at least possible to say that the position of the base 100 electrically connected to the annular electrical connection surface 312 is not the center of the base 100.
During the feeding transmission, the radio frequency is input from the end of the feeding portion 210 to the hole wall of the central hole 311 of the first adaptor 300, then is conveyed from the hole wall of the central hole 311 to the annular electrical connection surface 312 of the first adaptor 300, and finally is input to the edge of the base 100 through the annular electrical connection surface 312. That is, the wafer carrier disclosed in the embodiments of the present application inputs rf from a non-center position of the susceptor 100.
It should be noted that the rf is essentially a high-frequency alternating current (sine wave), and there is a phase difference at different positions within a wavelength, so there is often a phase difference at different positions of the rf circuit, and thus there are currents and voltages of different magnitudes. In the embodiment of the present application, the positions on the base 100 with different distances from the rf feed-in position have different currents and voltages after the rf is turned on, so that the electric field strength is different, and the plasma attraction capability in the process cavity of the semiconductor process equipment is also different, so that the plasma energy above the wafer supporting device is different, and the etching uniformity is further affected. In the field of semiconductor processing, the frequency of the radio frequency used in semiconductor processing equipment is 12.65MHz or 2MHz, corresponding to wavelengths of about 22m and 150m. Whether the radio frequency is input from the center of the pedestal 100 or from the edge of the pedestal 100, its travel distance on the pedestal 100 is about the length of the radius of the pedestal 100. The radius of the susceptor 100 is typically 0.15m-0.17m, and for example, the 13.56MHz rf with a shorter wavelength, the ratio of the radius of the susceptor 100 to the wavelength is about 0.007, so that the maximum electric field strength of the susceptor 100 is within 1%, and it can be concluded that the influence of the rf input point (feed point) on the susceptor 100 on the plasma in the process chamber of the semiconductor process equipment is negligible, although the rf input point (feed point) is changed. It can be seen that the wafer carrier disclosed in the embodiments of the present application is improved over the wafer carrier of the related art, in which the rf feed-in portion is transferred from the center of the susceptor 100 to other portions of the susceptor 100, and the influence on the process parameters of the semiconductor process equipment is negligible.
In a preferred embodiment, the annular electrical connection surface 312 is disposed at an edge of the first adapter 300. The edge of the base 100 is opposite to the annular electrical connection surface 312 and is electrically connected. In this case, the rf feed-in portion of the base 100 is an edge far from the center of the base 100, so that the influence of the rf feed-in portion on the center area of the base 100 can be better avoided.
The wafer carrier disclosed in the embodiments of the present application changes the manner of inputting the radio frequency from the center of the base 100 by improving the structure of the wafer carrier related to the related art, so that the radio frequency can be input into the base 100 from the annular electrical connection surface 312 surrounding the center hole 311 on the first adapter 300. In this case, the radio frequency is input from the portion of the base 100 around the center thereof, so that the radio frequency is not required to be input into the base 100 from the center of the base 100, thus the occupation of the center of the base 100 can be avoided, the center of the base 100 has an idle area, and the refrigerant inlet 111 and the refrigerant outlet 112 can be arranged adjacent to the center of the base 100, so that the defect that the refrigerant inlet 111 and the refrigerant outlet 112 cannot be arranged adjacent to the center of the base 100 due to the connection of the center of the base 100 in the related art can be alleviated, and the temperature uniformity of the wafer carrying device in the circumferential direction can be improved.
In the embodiment of the present application, the structure of the feeding part 210 may be various. In a preferred embodiment, the power supply portion 210 may include a power supply tube. Of course, the feeding portion 210 may also have a non-tubular structure, and the embodiment of the present application is not limited to the specific structure of the feeding portion 210. The feeding portion 210 is preferably made of a metal material, such as copper.
In a further technical solution, the wafer carrying device disclosed in the embodiment of the present application may further include a power-on layer 510 and a power-supply cable 520, where the power-on layer 510 is disposed on a surface of the base 100 opposite to the first adaptor 300, the power-supply cable 520 is threaded through the power-supply tube, and an end portion of the power-supply cable 520 extends out of the power-supply tube and is electrically connected to the power-on layer 510. In this case, the feeder tube not only can play a role of feeding, but also can be used as a penetration passage of the power supply cable 520, thereby facilitating the layout of the power supply cable 520, and of course, the feeder tube can also protect the power supply cable 520 from damage. In the alternative, the power supply cable 520 may be directly electrically connected to the energizing layer 510.
In the embodiment of the present application, the power-on layer 510 is a layer structure capable of performing a predetermined function after power-on. In particular, the power-on layer 510 may include at least one functional layer overlying the base 100.
The wafer carrier disclosed in the embodiments of the present application may further include a second adaptor 600, where the second adaptor 600 includes a first electrical connection portion 610 facing the base 100 and a second electrical connection portion 620 facing away from the base 100. The base 100 is provided with a third electrical connection. The second electrical connection 620 is electrically connected with the power supply cable 520 via the center hole 311. The first electrical connection portion 610 is electrically connected to the third electrical connection portion to be electrically connected to the functional layer, so as to supply power to the functional layer. In this case, it is essentially the power supply cable 520 that makes an indirect power supply connection with the functional layer via the second adapter 600. The second adaptor 600 is an intermediate electrical adaptor, and the second adaptor 600 may be designed in advance, so that the first electrical connection portion 610 and the second electrical connection portion 620 are preset, and thus the second adaptor is used as an intermediate electrical adaptor, so as to facilitate electrical connection between the power supply cable 520 and the functional layer.
The at least one functional layer described above may include at least one of an electric heating layer 511 and an electric adsorbing layer 512. The electric heating layer 511 heats the susceptor 100 by means of electric heating, so that the wafer supporting device can reach a preset temperature, and further, the temperature required by the wafer in the subsequent process can be ensured. The electro-adsorption layer 512 is a structural layer for realizing electro-adsorption after being electrified, and can adsorb the wafer supported by the wafer supporting device, so that the wafer can be stably placed on the wafer supporting device.
In an alternative, at least one of the functional layers described above may include an electrically heated layer 511 and an electrically adsorbed layer 512 that are sequentially stacked on the susceptor 100. The power supply cable 520 may include a first sub-cable electrically connected with the electric heating layer 511 and a second sub-cable electrically connected with the electric adsorbing layer 512. The electrical heating layer 511 is powered by the first sub-cable, and the electrical heating layer 511 is capable of performing heating to heat a wafer on the wafer carrier. The electro-absorption layer 512 is powered by the second sub-cable, and the electro-absorption layer 512 is capable of absorbing the wafer on the wafer carrier.
In the case of the conductive layer 510, the surface of the conductive layer 510 facing away from the base 100 is a carrying surface capable of carrying a wafer. Of course, in the case of including the electric heating layer 511 and the electric adsorbing layer 512, the surface of the electric adsorbing layer 512 facing away from the electric heating layer 511 is a carrying surface capable of carrying a wafer.
Specifically, the first sub-cable may be directly electrically connected to the electric heating layer 511, and the second sub-cable may be directly electrically connected to the electric adsorbing layer 512.
In a preferred embodiment, the first sub-cable is electrically connected to the electric heating layer 511 through a part of the second electrical connection portion 620, a part of the first electrical connection portion 610 and a corresponding third electrical connection portion that pass through the base 100 in sequence. Specifically, the first sub-cable is directly electrically connected to a portion of the second electrical connection 620. The second sub-cable is electrically connected to the electro-absorption layer 512 through another part of the second electrical connection 620, which is electrically connected in turn, another part of the first electrical connection 610, which is electrically connected in turn through the base 100 and the electric heating layer 511, and a corresponding third electrical connection. This way, it is possible to conveniently realize the electrical connection of the first sub-cable and the second sub-cable with the electric heating layer 511 and the electric adsorbing layer 512, respectively.
In an embodiment of the present application, the first electrical connection portion 610 and the second electrical connection portion 620 may be electrical connection terminals, and the third electrical connection portion may be a socket. The second electrical connection 620 extends into the central hole 311 to be electrically connected with the power supply cable 520. The first electrical connection 610 is in plug electrical connection with the third electrical connection.
Specifically, the first electrical connection portion 610 is a first electrical connection terminal, and the second electrical connection portion 620 is a second electrical connection terminal. In an alternative, one of the first electrical connection portion 610 and the third electrical connection portion may comprise an electrical plug protrusion, the other one being provided with an electrical plug hole, the electrical connection being made between the electrical plug protrusion and the electrical plug hole by plugging. Specifically, one of the first and third electrical connection portions 610 and 610 may be a plug, and the other may be a socket. The plug and the socket are electrically connected through plug-in fit. The spliced electric connection structure has the advantage of convenient disassembly and assembly.
Of course, the first electrical connection portion 610, the second electrical connection portion 620, and the third electrical connection portion may also be electrical connection portions of other structures, such as a common electrical connection lug. The embodiments of the present application are not limited.
The second adaptor 600 according to the embodiment of the present application may further include an insulating plate 630 to be buried in the circuit 640 inside the insulating plate 630, and the first electrical connection portion 610 is electrically connected to the corresponding second electrical connection portion 620 through the circuit 640 buried in the insulating plate 630. The insulating plate 630 serves as a mounting base of the first electrical connection portion 610 and the second electrical connection portion 620, so that the first electrical connection portion 610 and the second electrical connection portion 620 can be stably and electrically connected, and meanwhile, the second adaptor 600 can be assembled through the assembly of the insulating plate 630, and the purpose of conveniently mounting the second adaptor 600 is achieved. The circuit 640 may be gold wires, conductive adhesive, etc., and the embodiment of the present application does not limit the specific structure of the circuit 640.
In the wafer carrier disclosed in the embodiments of the present application, the second adaptor 600 may be a circuit board. Of course, other electrical connectors capable of performing the predetermined function are also possible, and the present application is not limited to the specific type of the second connector 600.
In a preferred embodiment, the first adaptor 300 may be provided with a groove, the surface of the notch of the first adaptor 300 with the groove is an annular electrical connection surface 312, the central hole 311 is disposed on the bottom wall of the groove opposite to the notch, and the insulating plate 630 is disposed in the groove. In this case, the groove formed in the first adapter 300 can provide the installation space for the insulating plate 630, thereby achieving the installation of the second adapter 600. Of course, the arrangement manner can enable the first adaptor 300 and the second adaptor 600 to be assembled compactly, which is beneficial to the miniaturization design of the whole wafer carrying device. Specifically, the insulating plate 630 may be mounted in the groove by bonding, clamping, or the like.
In a further technical solution, the insulating plate 630 is matched with the groove in a positioning manner, in this case, the groove not only can accommodate the insulating plate 630, but also can position the insulating plate 630, so that the second adaptor 600 can be stably installed.
The wafer carrying device disclosed in the embodiment of the application further comprises an insulating ring 700, wherein an annular sinking table 710 is arranged at the inner edge of the end part of the insulating ring 700 adjacent to the base 100, and an overlap step surface 315 is arranged at the edge of the first adapter 300, and the overlap step surface 315 is in overlap fit with the annular sinking table 710. And the first adapter 300 is positioned in the annular counter-sunk table 710 for a more stable installation.
In a further technical solution, the end face of the insulating ring 700 adjacent to the end of the base 100 and the annular electrical connection surface 312 are both in supporting fit with the base 100, in which case the insulating ring 700 and the annular electrical connection surface 312 together support the base 100, which is beneficial to improving the stability of supporting the base 100. Since the insulating ring 700 is made of an insulating material, the support of the insulating ring 700 to the base 100 does not affect the input of the radio frequency into the base 100 by the annular electrical connection surface 312.
Referring again to fig. 1 to 4, in an alternative, the first adaptor 300 may include an adaptor base 310 and an annular protrusion 320, the annular protrusion 320 being provided at an edge of the adaptor base 310. The annular protrusion 320 is disposed around the central hole 311, the central hole 311 is disposed on the adaptor base 310, and an annular end surface of the annular protrusion 320 facing away from the adaptor base 310 is an annular electrical connection surface 312. In this structure, the central hole 311 is formed on the adaptor base 310 and surrounded by the annular protrusion 320, and the annular end surface of the annular protrusion 320 facing away from the adaptor base 310 protrudes from the adaptor base 310, so that the adaptor base 310 can be prevented from contacting the base 100, and thus the annular electrical connection surface 312 electrically connected to the base 100 is easier to form, and it is easier to ensure that other areas of the first adaptor 300 except for the annular electrical connection surface 312 are not electrically connected to the base 100, so that the more accurate feeding position is determined, and meanwhile, the occurrence of shorting between other areas of the first adaptor 300 except for the annular electrical connection surface 312 and the base 100 can be better avoided.
In a further preferred embodiment, the adaptor base 310 and the annular protrusion 320 may enclose the recess described above. In this case, the groove formed by the annular protrusion 320 and the adaptor base 310 can provide the installation space for the insulating plate 630, thereby making full use of the space on the first adaptor 300.
As described above, the base 100 is provided with the refrigerant passage 110, and the refrigerant passage 110 has the refrigerant inlet 111 and the refrigerant outlet 112. Specifically, the refrigerant inlet 111 and the refrigerant outlet 112 are disposed on a surface of the base 100 facing the first adapter 300, and are disposed adjacent to the center of the base 100.
The wafer carrier disclosed in the embodiments of the present application may further include a coolant input pipe 410 and a coolant output pipe 420. The refrigerant input pipe 410 communicates with the refrigerant inlet 111, and the refrigerant output pipe 420 communicates with the refrigerant outlet 112. In a specific operation process, the refrigerant is input to the refrigerant inlet 111 from the refrigerant input pipe 410, further enters the refrigerant channel 110, flows through the refrigerant channel 110, and then flows out from the refrigerant outlet 112 to the refrigerant output pipe 420, and finally flows away.
The refrigerant input pipe 410 communicates with the refrigerant inlet 111, and the refrigerant output pipe 420 communicates with the refrigerant outlet 112. Specifically, the refrigerant input pipe 410 may be directly connected to the refrigerant inlet 111, and the refrigerant output pipe 420 is directly connected to the refrigerant outlet 112. Of course, the first adapter 300 and/or the second adapter 600 may be provided with a bypass hole through which the refrigerant input pipe 410 and the refrigerant output pipe 420 pass, so as not to affect the direct communication between the refrigerant input pipe 410 and the refrigerant inlet 111 and between the refrigerant output pipe 420 and the refrigerant outlet 112.
In a further preferred embodiment, the first adapter 300 may be provided with a first connection channel 313 and a second connection channel 314, the first connection channel 313 communicates with the refrigerant inlet 111 and the refrigerant inlet pipe 410, the second connection channel 314 communicates with the refrigerant outlet 112 and the refrigerant outlet pipe 420, a port of the first connection channel 313 connected with the refrigerant inlet pipe 410 is adjacent to an edge of the first adapter 300, and a port of the first connection channel 313 connected with the refrigerant inlet 111 is adjacent to the central hole 311; the port of the second connecting channel 314 connected to the refrigerant output pipe 420 is adjacent to the edge of the first adapter 300; the port of the second connection passage 314 connected to the refrigerant outlet 112 is adjacent to the center hole 311. In this case, the transition between the first connection channel 313 and the second connection channel 314 can ensure that the refrigerant input pipe 410 is communicated with the refrigerant inlet 111 and the refrigerant output pipe 420 is communicated with the refrigerant outlet 112, so that the connection position of the refrigerant input pipe 410 and the refrigerant output pipe 420 is far away from the center of the base 100, and thus the problem of space limitation caused by too close distance to the feeding portion 210 can be avoided, and the refrigerant output pipe 420 and the refrigerant input pipe 410 are adjacent to the edge of the first adapter 300, so that a larger space is provided, and the connection operation by an operator is facilitated.
In a further embodiment, the ports of the first connection channel 313 and the refrigerant input pipe 410, and the ports of the second connection channel 314 and the refrigerant output pipe 420 are all opened on the surface of the first adapter 300 facing away from the base 100; the port of the first connection channel 313 connected to the refrigerant inlet 111 and the port of the second connection channel 314 connected to the refrigerant outlet 112 are both formed on the surface of the first adapter 300 facing the base 100. The structure can enable the refrigerant input pipeline 410 and the refrigerant output pipeline 420 to be arranged below the first adapter 300, and the first adapter 300 is arranged below the base 100, so that reasonable arrangement of the components in the space below the base 100 is easier to realize, meanwhile, the existing space below the base 100 can be fully utilized, and the structure miniaturization of the whole wafer supporting device is facilitated.
Another wafer carrier is disclosed in the present embodiment, and the disclosed wafer carrier includes a base 100, a first adapter 300, a coolant input pipe 410 and a coolant output pipe 420.
The base 100 is provided with a refrigerant channel 110, the refrigerant channel 110 is provided with a refrigerant inlet 111 and a refrigerant outlet 112, and the refrigerant inlet 111 and the refrigerant outlet 112 are arranged on the surface of the base 100 facing the first adapter 300 and are adjacent to the center of the base 100.
The first adapter 300 is provided with a first connecting channel 313 and a second connecting channel 314, the first connecting channel 313 is communicated with the refrigerant inlet 111 and the refrigerant input pipeline 410, and the second connecting channel 314 is communicated with the refrigerant outlet 112 and the refrigerant output pipeline 420.
The port of the first connection channel 313 connected to the refrigerant input pipe 410 is adjacent to the edge of the first adapter 300, and the port of the first connection channel 313 connected to the refrigerant inlet 111 is adjacent to the center of the first adapter 300 and opposite to the refrigerant inlet 111; the port of the second connecting channel 314 connected to the refrigerant output pipe 420 is adjacent to the edge of the first adapter 300, and the port of the second connecting channel 314 connected to the refrigerant outlet 112 is adjacent to the center of the first adapter 300 and opposite to the refrigerant outlet 112.
In an alternative, the ports of the first connection channel 313 connected to the refrigerant input pipe 410 and the ports of the second connection channel 314 connected to the refrigerant output pipe 420 are all opened on the surface of the first adapter 300 facing away from the cooling base 100.
In another alternative, the first adaptor 300 is provided with a central hole 311 and an annular electrical connection surface 312, the annular electrical connection surface 312 being disposed around the central hole 311; the wafer carrier may further include a power supply 210; the end of the power feeding portion 210 is inserted into the center hole 311 and electrically connected to the first adapter 300, and the base 100 is electrically connected to the annular electrical connection surface 312.
It should be noted that, the components included in the other wafer carrying apparatus disclosed in the present application have been explained in the above embodiments, and the corresponding portions may be referred to the content in the above embodiments, however, the beneficial effects generated by the corresponding structures or components may also be referred to the content in the above embodiments, and in view of brevity, details are not repeated herein.
Based on the wafer carrying device disclosed in the embodiment of the application, the embodiment of the application further discloses a semiconductor process device, and the disclosed semiconductor process device comprises the wafer carrying device disclosed in the embodiment.
In the embodiments of the present invention, the different embodiments are mainly described, and as long as the different optimization features of the embodiments are not contradictory, the different optimization features can be combined to form a better embodiment, and in consideration of brevity of line text, the description is omitted here.
The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the claims, which are to be protected by the present invention.
Claims (14)
1. Wafer carrier, characterized by comprising a base (100), a feed (210) and a first adapter (300), wherein:
The first adapter piece (300) is positioned below the base (100), the first adapter piece (300) is provided with a central hole (311) and an annular electric connection surface (312), and the annular electric connection surface (312) is arranged around the central hole (311); the end of the power feeding part (210) is inserted into the central hole (311) and is electrically connected with the first adapter (300), and the base (100) is electrically connected with the annular electrical connection surface (312).
2. The wafer carrier of claim 1, wherein the power supply portion (210) includes a power supply tube, the wafer carrier further includes an energizing layer (510) and a power supply cable (520), the energizing layer (510) is disposed on a surface of the base (100) facing away from the first adapter (300), the power supply cable (520) is threaded into the power supply tube, and an end portion of the power supply cable (520) extends out of the power supply tube and is electrically connected to the energizing layer (510).
3. The wafer carrier of claim 2, wherein the energizing layer (510) comprises at least one functional layer overlying the base (100);
The wafer carrying device further comprises a second adapter (600), the second adapter (600) comprises a first electric connection part (610) facing towards the base (100) and a second electric connection part (620) facing away from the base (100), the base (100) is provided with a third electric connection part, the second electric connection part (620) is electrically connected with the power supply cable (520) through the central hole (311), and the first electric connection part (610) is electrically connected with the third electric connection part so as to be electrically connected with the functional layer.
4. A wafer carrier as claimed in claim 3, wherein the first electrical connection (610) and the second electrical connection (620) are electrical connection terminals, the third electrical connection is a socket, and the second electrical connection (620) extends into the central hole (311) to be electrically connected to the power supply cable (520).
5. The wafer carrier of claim 3, wherein the at least one functional layer comprises an electrically heated layer (511) and an electrically adsorbed layer (512) sequentially stacked on the susceptor (100), the power supply cable (520) comprises a first sub-cable and a second sub-cable,
The first sub-cable is electrically connected with the electric heating layer (511) through a part of the second electric connection part (620), a part of the first electric connection part (610) penetrating through the base (100) and the corresponding third electric connection part which are electrically connected in sequence;
The second sub-cable is electrically connected with the electro-absorption layer (512) through another part of the second electrical connection part (620) and another part of the first electrical connection part (610) sequentially penetrating through the base (100) and the electrical heating layer (511) and the corresponding third electrical connection part.
6. The wafer carrier of claim 3, wherein the second adapter (600) further comprises an insulating plate (630) and a circuit (640) embedded within the insulating plate (630), and the first electrical connection (610) is electrically connected to the second electrical connection (620) through the circuit (640).
7. The wafer carrier of claim 6, wherein the first adapter (300) is provided with a groove, and a surface of the first adapter (300) where a notch of the groove is formed is the annular electrical connection surface (312); the central hole (311) is arranged on the bottom wall of the groove opposite to the notch, and the insulating plate (630) is arranged in the groove.
8. The wafer carrier of claim 1, further comprising an insulating ring (700), wherein an annular countersink (710) is disposed at an inner edge of an end of the insulating ring (700) adjacent to the base (100), a lap joint step surface (315) is disposed at an edge of the first adaptor (300), the lap joint step surface (315) and the annular countersink (710) are in lap joint, and an end surface of the insulating ring (700) adjacent to the end of the base (100) and the annular electrical connection surface (312) are in supporting cooperation with the base (100).
9. The wafer carrier of claim 1, wherein the first adapter (300) comprises an adapter base (310) and an annular protrusion (320), the annular protrusion (320) is disposed at an edge of the adapter base (310), the central hole (311) is disposed at the adapter base (310), the annular protrusion (320) is disposed around the central hole (311), and an annular end surface of the annular protrusion (320) facing away from the adapter base (310) is the annular electrical connection surface (312).
10. The wafer carrier according to any one of claims 1 to 9, wherein the susceptor (100) is provided with a coolant channel (110), the coolant channel (110) having a coolant inlet (111) and a coolant outlet (112), the coolant inlet (111) and the coolant outlet (112) being provided at a surface of the susceptor (100) facing the first adapter (300) and being provided adjacent to a center of the susceptor (100); the wafer carrying device also comprises a refrigerant input pipeline (410) and a refrigerant output pipeline (420);
The refrigerant input pipeline (410) is communicated with the refrigerant inlet (111), and the refrigerant output pipeline (420) is communicated with the refrigerant outlet (112).
11. The wafer carrying device is characterized by comprising a base (100), a first adapter (300), a refrigerant input pipeline (410) and a refrigerant output pipeline (420), wherein:
the base (100) is provided with a refrigerant channel (110), the refrigerant channel (110) is provided with a refrigerant inlet (111) and a refrigerant outlet (112), and the refrigerant inlet (111) and the refrigerant outlet (112) are arranged on the surface of the base (100) facing the first adapter (300) and are adjacent to the center of the base (100);
The first adapter (300) is provided with a first connecting channel (313) and a second connecting channel (314), the first connecting channel (313) is communicated with the refrigerant inlet (111) and the refrigerant input pipeline (410), and the second connecting channel (314) is communicated with the refrigerant outlet (112) and the refrigerant output pipeline (420);
The port of the first connecting channel (313) connected with the refrigerant input pipeline (410) is adjacent to the edge of the first adapter (300), and the port of the first connecting channel (313) connected with the refrigerant inlet (111) is adjacent to the center of the first adapter (300) and opposite to the refrigerant inlet (111);
the port of the second connecting channel (314) connected with the refrigerant output pipeline (420) is adjacent to the edge of the first adapter (300), and the port of the second connecting channel (314) connected with the refrigerant outlet (112) is adjacent to the center of the first adapter (300) and opposite to the refrigerant outlet (112).
12. The wafer carrier of claim 11, wherein the ports of the first engagement channel (313) connected to the coolant input conduit (410) and the ports of the second engagement channel (314) connected to the coolant output conduit (420) are all open on a surface of the first engagement member (300) facing away from the cooling susceptor (100).
13. The wafer carrier of claim 11, wherein the first adapter (300) is provided with a central hole (311) and an annular electrical connection surface (312), the annular electrical connection surface (312) being disposed around the central hole (311); the wafer carrying device further comprises a power feeding part (210);
The end of the power feeding part (210) is inserted into the central hole (311) and is electrically connected with the first adapter (300), and the base (100) is electrically connected with the annular electrical connection surface (312).
14. A semiconductor processing apparatus comprising a wafer carrier as claimed in any one of claims 1 to 10 or a wafer carrier as claimed in any one of claims 11 to 13.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211399286.6A CN118016497A (en) | 2022-11-09 | 2022-11-09 | Wafer carrying device and semiconductor process equipment |
| PCT/CN2023/130514 WO2024099369A1 (en) | 2022-11-09 | 2023-11-08 | Wafer carrying apparatus and semiconductor process device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211399286.6A CN118016497A (en) | 2022-11-09 | 2022-11-09 | Wafer carrying device and semiconductor process equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118016497A true CN118016497A (en) | 2024-05-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211399286.6A Pending CN118016497A (en) | 2022-11-09 | 2022-11-09 | Wafer carrying device and semiconductor process equipment |
Country Status (2)
| Country | Link |
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| CN (1) | CN118016497A (en) |
| WO (1) | WO2024099369A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060090855A1 (en) * | 2004-10-29 | 2006-05-04 | Tokyo Electron Limited | Substrate mounting table, substrate processing apparatus and substrate temperature control method |
| US8822876B2 (en) * | 2010-10-15 | 2014-09-02 | Applied Materials, Inc. | Multi-zoned plasma processing electrostatic chuck with improved temperature uniformity |
| US20150083042A1 (en) * | 2013-09-26 | 2015-03-26 | Applied Materials, Inc. | Rotatable substrate support having radio frequency applicator |
| CN109148251B (en) * | 2017-06-19 | 2022-09-16 | 北京北方华创微电子装备有限公司 | Lower electrode mechanism of reaction chamber and reaction chamber |
| CN114695041A (en) * | 2020-12-25 | 2022-07-01 | 中微半导体设备(上海)股份有限公司 | Plasma reactor |
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2022
- 2022-11-09 CN CN202211399286.6A patent/CN118016497A/en active Pending
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| WO2024099369A1 (en) | 2024-05-16 |
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