CN117998807A - Heat dissipation system and electronic equipment using same - Google Patents
Heat dissipation system and electronic equipment using same Download PDFInfo
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- CN117998807A CN117998807A CN202211351845.6A CN202211351845A CN117998807A CN 117998807 A CN117998807 A CN 117998807A CN 202211351845 A CN202211351845 A CN 202211351845A CN 117998807 A CN117998807 A CN 117998807A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 79
- 238000004891 communication Methods 0.000 claims abstract description 17
- 230000002265 prevention Effects 0.000 claims description 37
- 239000007787 solid Substances 0.000 claims description 3
- 230000000712 assembly Effects 0.000 description 28
- 238000000429 assembly Methods 0.000 description 28
- 238000010586 diagram Methods 0.000 description 12
- 238000009434 installation Methods 0.000 description 9
- 238000001816 cooling Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a heat dissipation system and electronic equipment, wherein the heat dissipation system comprises a fan assembly and a mounting box, wherein the mounting box is used for accommodating a circuit board; the fan assembly comprises a first fan assembly and a second fan assembly, the first fan assembly and the second fan assembly are adjacent, the first fan assembly is used for radiating heat of a first circuit board in the first mounting box, and the second fan assembly is used for radiating heat of a second circuit board in the second mounting box; a first distance is arranged between the first circuit board and the first fan assembly; the first circuit board is in gas communication with the second fan assembly; when the first fan assembly fails and is in place, the first circuit board is correspondingly provided with a first backflow preventing device, and the first backflow preventing device is in a closed second working state; when the first fan assembly fails and is out of position, the first circuit board is correspondingly provided with a second backflow preventing device, and the second backflow preventing device is in a closed second working state; the second fan assembly is also used for radiating heat of the first circuit board.
Description
Technical Field
The present invention relates to the field of heat dissipation technologies of electronic devices, and in particular, to a heat dissipation system and an electronic device using the same.
Background
With the rapid development of ethernet technology, the requirements on the port rate of a communication device (such as a switch or a router) are higher and higher, and the use of a single board component with an orthogonal architecture in the communication device is becoming a trend of current communication device products. The orthogonal architecture is to realize one-to-one connection of two groups of single boards by horizontally inserting one group of single boards and vertically inserting the other group of single boards. In the orthogonal architecture, the service board card and the switching board card are directly in butt joint, so that data can directly reach the switching board card, transmission loss is greatly reduced, switching transmission efficiency is improved, and larger switching capacity and processing expansion capacity are provided.
But the design of the duct becomes difficult for communication devices employing orthogonal architectures. Usually, a plurality of fans are arranged in parallel on the rear side of the vertically inserted single board to perform air cooling heat dissipation on two groups of single boards, and when the multi-fan parallel heat dissipation mode is adopted, the risk of failure of a single fan is faced. The fan executes air supply modes including air supply and air suction, and taking an air supply mode as an example, once a single fan fails, a single board corresponding to the failed fan cannot obtain enough cooling air, so that heat dissipation of the single board is problematic; more seriously, because the air flow resistance of the single board area corresponding to the fan in normal operation is larger, after the fan fails and stops running, the air sent by the adjacent fan can select to reversely pass through the failed fan with smaller air flow resistance, thereby causing air flow short circuit between the failed fan and the adjacent fan, further causing the reduction of the air flow of cooling down of the single board area corresponding to the fan, and causing the problem of larger area heat dissipation.
Accordingly, there is a need for a heat dissipation system that is adaptable to communication devices of orthogonal configuration and that dissipates heat well in the event of a single fan failure.
Disclosure of Invention
In order to solve the technical problem, the invention provides a heat dissipation system, which is characterized in that the circuit board assembly comprises a first circuit board group and a second circuit board group, wherein the first circuit board group comprises a first circuit board and a second circuit board; the heat dissipation system comprises a fan assembly and mounting boxes corresponding to each circuit board in the first circuit board group one by one, wherein the mounting boxes are used for accommodating the circuit boards in the first circuit board group, the first circuit board corresponds to the first mounting boxes, and the second circuit board corresponds to the second mounting boxes; the fan assembly comprises a first fan assembly and a second fan assembly, the first fan assembly is adjacent to the second fan assembly, the first fan assembly corresponds to the first mounting box and is used for radiating the first circuit board in the first mounting box, and the second fan assembly corresponds to the second mounting box and is used for radiating the second circuit board in the second mounting box; a first distance is arranged between the first circuit board and the first fan assembly; the first circuit board is in gas communication with the second fan assembly; when the first fan assembly fails and is in place, the first circuit board is correspondingly provided with a first backflow prevention device, and the first backflow prevention device is in a closed second working state; the second fan assembly is also used for radiating heat of the first circuit board; when the first fan assembly fails and is out of position, the first circuit board is correspondingly provided with a second backflow prevention device, and the second backflow prevention device is in a closed second working state; the second fan assembly is also used for radiating heat of the first circuit board.
The heat dissipation system provided by the invention has the following advantages: (1) When the failed fan assembly is in place or out of place, the purpose of radiating the circuit board corresponding to the failed fan assembly can be achieved, and the situations that the circuit board cannot radiate heat or an air duct is short-circuited and the like can not occur; (2) The heat dissipation system is simple in design, and can achieve a good heat dissipation effect only by arranging the backflow preventing device without additionally arranging a complex mechanical structure.
Preferably, the second backflow preventing means is the same as or different from the first backflow preventing means.
Preferably, the first backflow preventing device is disposed on the first mounting box, on the first fan assembly, or connected with the first mounting box through a first connecting piece.
Preferably, the second backflow preventing device is connected with the first mounting box through a second connecting piece.
Preferably, the first mounting box comprises a first panel opposite to the first fan assembly, and a second panel and a third panel which are connected with the first panel and are arranged in parallel with the first circuit board, wherein a first backflow preventing device is arranged on the first panel, and through holes are formed in the second panel and the third panel.
Preferably, the first mounting box comprises a first panel opposite to the first fan assembly, and a second panel and a third panel which are connected with the first panel and are arranged in parallel with the first circuit board, wherein a through hole is formed in the first panel, and a second distance is formed between the first panel and the first fan assembly.
Preferably, the first and second backflow preventing means include a frame and a plurality of backflow preventing pieces rotatably connected with the frame.
Preferably, the plurality of backflow preventing sheets are arranged in a vertical direction or in a horizontal direction.
Preferably, the second backflow prevention device is a solid panel without holes.
In a second aspect of the present invention, an electronic device is provided, where the electronic device includes a first circuit board set and a second circuit board set, and a heat dissipation system as set forth in any one of the preceding claims, where the circuit boards in the first circuit board set are arranged orthogonal to the circuit boards in the second circuit board set.
Drawings
Fig. 1 is a schematic diagram of an orthogonal structure of an electronic device according to the present invention.
Fig. 2 is a schematic perspective view of a partial structure of the electronic device of the present invention.
FIG. 3 is a top view of a heat dissipation system for an electronic device; FIG. 3a is a schematic diagram of a fan assembly in normal operation; FIG. 3b is a schematic view of a failed fan assembly in place; FIG. 3c is a schematic diagram of a failed fan when not in place.
FIG. 4 is a top view of another electronic device heat dissipation system; FIG. 4a is a schematic diagram of a fan assembly in normal operation; FIG. 4b is a schematic view of a failed fan assembly in place; fig. 4c is a schematic diagram of a failed fan when not in place.
FIG. 5 is a top view of a novel electronic device heat dissipation system; FIG. 5a is a schematic diagram of a fan assembly in normal operation; FIG. 5b is a schematic view of a failed fan assembly in place; fig. 5c is a schematic diagram of a failed fan when not in place.
FIG. 6 is a top view of another novel electronic device heat dissipation system; FIG. 6a is a schematic diagram of a fan assembly in normal operation; FIG. 6b is a schematic view of a failed fan assembly in place; FIG. 6c is a schematic diagram of a failed fan when not in place.
FIG. 7 is a top view of another novel electronic device heat dissipation system; FIG. 7a is a schematic diagram of a fan assembly in normal operation; FIG. 7b is a schematic view of a failed fan assembly in place; fig. 7c is a schematic diagram of a failed fan when not in place.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings, it being apparent that the described embodiments are only some, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Fig. 1 is a schematic diagram of an orthogonal structure of an electronic device according to the present invention. The electronic equipment comprises a circuit board assembly with an orthogonal framework, wherein the circuit board assembly comprises a first circuit board group and a second circuit board group, the first circuit board group at least comprises a first circuit board and a second circuit board, the first circuit board and the second circuit board can be exchange modules such as exchange net boards, the second circuit board group at least comprises a third circuit board and a fourth circuit board, and the third circuit board and the fourth circuit board can be business modules such as line cards or main control boards. In fig. 1, the circuit boards in the first circuit board group are switching modules, the circuit boards in the second circuit board group are service modules, wherein the service modules are horizontally inserted single boards, and the switching modules are vertically inserted single boards, so that each service module and each switching module can be electrically connected through a connector, and data exchange is realized. And a plurality of parallel fan assemblies are arranged on one side, which is close to the side of the exchange module and is away from the service module, and in the working process, the fan assemblies drive cold air to flow from the transversely inserted service module to the vertically inserted exchange module so as to realize heat dissipation of each single board.
Fig. 2 is a schematic perspective view of a partial structure of an electronic device according to the present invention, where the electronic device includes a chassis, a first circuit board group area, a second circuit board group area, and a fan assembly area disposed in the chassis, a plurality of service modules are layered and horizontally inserted in a layer set in the second circuit board group area, a plurality of switch modules are vertically inserted in a region set in the first circuit board group area, and the fan assembly area is disposed on the other side of the first circuit board group area facing away from the second circuit board group area, where the fan assembly area includes a plurality of fan frames, and each fan frame includes a plurality of fans. In the working engineering, the flow direction of the wind direction is shown in fig. 2, and the fan assembly drives cold air to flow from the horizontally inserted service module to the vertically inserted exchange module, so that heat dissipation of each veneer is realized. In the electronic device shown in fig. 2, the first circuit board group includes six switch modules, and the fan assembly area includes three fan assemblies, where each two switch modules corresponds to one fan assembly, which is not limited in the present invention, each switch module is provided with a corresponding fan frame, and one fan frame may correspond to one or more switch modules.
Fig. 3 is a top view of a heat dissipation system of an electronic device. The electronic equipment heat dissipation system is used for dissipating heat of a circuit board assembly, wherein the circuit board assembly comprises a first circuit board group and a second circuit board group. In fig. 3, the first circuit board group includes at least a first circuit board and a second circuit board, which are switching modules; the second circuit board group at least comprises a third circuit board and a fourth circuit board, and the third circuit board and the fourth circuit board are service modules. The heat dissipation system comprises a fan assembly and a mounting box corresponding to each circuit board in the first circuit board group one by one, wherein the mounting box is used for accommodating the circuit boards in the first circuit board group, the first circuit board corresponds to the first mounting box, and the second circuit board corresponds to the second mounting box. Each mounting box comprises a first panel arranged opposite to the fan assembly, and a second panel and a third panel which are adjacent to the first panel and are arranged in parallel with the circuit board in the mounting box. Wherein, be provided with a plurality of through-hole on the first panel, the hot-blast through-hole that produces of circuit board in the first mounting box can be discharged.
Each of the fan assemblies includes a plurality of fans for dissipating heat from the circuit board. The fan assembly and the mounting box in the electronic equipment are tightly arranged, and no gap exists between the fan assembly and the mounting box. Referring to fig. 3a, when all the fan assemblies are working normally, the hot air generated by the circuit boards in the first circuit board set and the second circuit board set will be pumped away by the fan assemblies correspondingly arranged, and the heat dissipation system works normally.
It is assumed that a first fan assembly corresponds to a first mounting box and a second fan assembly adjacent to the first fan assembly corresponds to a second mounting box. Referring to fig. 3b, when the first fan assembly located in the middle fails and the first fan assembly is still in place, the hot air generated by the first circuit board can only flow to the connection between the first circuit board set and the second circuit board set and is pumped away by the second fan assembly adjacent to the first fan assembly when the first circuit board corresponding to the first fan assembly dissipates heat. At this time, there will be the following problems: (1) The heat dissipation path of the first circuit board is lengthened, and the generated hot air needs to flow back to the joint of the first circuit board group and the second circuit board group to be pumped away, so that the heat dissipation of the first circuit board is affected; the hot air generated by the first circuit board needs to be pumped away through the second fan assembly, and the hot air generated by the first circuit board passes through the second circuit board corresponding to the second fan assembly and flows onto the second circuit board, so that the heat dissipation effect of the second circuit board is also deteriorated; (2) When the first fan assembly fails and remains in place, the flow resistance will become very large, further affecting the heat dissipation of the first exchange module, as the failed first fan assembly will block the flow of hot air.
Referring to fig. 3c, when the first fan assembly located in the middle fails but the first fan assembly is not located, similar to the situation that the first fan is located, when the first circuit board corresponding to the first fan assembly is dissipating heat, the hot air generated by the first circuit board can only flow to the connection between the first circuit board group and the second circuit board group and is drawn away by the second fan assembly adjacent to the first fan assembly, and at this time, the heat dissipation path of the first circuit board will be long, and the heat dissipation of the first circuit board is affected; and because the hot air generated by the first circuit board needs to be pumped away through the second fan assembly, the hot air passes through the second circuit board corresponding to the second fan assembly, and the hot air flows onto the second circuit board through the cross flow, so that the heat dissipation effect of the second circuit board is also poor. In contrast, because there is no blocking of the failed fan assembly, the heat dissipation effect is slightly better than the case where the failed fan assembly is in place, but the heat dissipation effect is still poor as a whole.
Fig. 4 is a top view of another electronic device heat dissipation system. Similar to fig. 3, the heat dissipation system of the electronic device is configured to dissipate heat of a circuit board assembly, where the circuit board assembly includes a first circuit board group and a second circuit board group, the first circuit board group includes at least a first circuit board and a second circuit board, and the first circuit board and the second circuit board are exchange modules; the second circuit board group at least comprises a third circuit board and a fourth circuit board, the third circuit board and the fourth circuit board are service modules, the heat dissipation system comprises a fan assembly and installation boxes corresponding to the circuit boards in the first circuit board group one by one, the installation boxes are used for accommodating the circuit boards in the first circuit board group, the first circuit board corresponds to the first installation boxes, and the second circuit board corresponds to the second installation boxes. Each mounting box comprises a first panel arranged opposite to the fan assembly, and a second panel and a third panel which are adjacent to the first panel and are arranged in parallel with the circuit board in the mounting box. Wherein, be provided with a plurality of through-hole on the first panel, the hot-blast through-hole that produces of circuit board in the first mounting box can be discharged.
In addition, in fig. 4, the backflow prevention device is disposed on the other surface of the fan assembly opposite to the first circuit board set, which is far away from the first circuit board set, and of course, the backflow prevention device may also be disposed on the surface of the fan assembly opposite to the first circuit board set, which is near the first circuit board set, and the invention is not limited thereto. The backflow prevention device is used for preventing the air duct from being short-circuited when the fan assembly fails. When the fan assembly works normally, the backflow prevention devices are in a first working state, namely the backflow prevention devices are in an open state, and hot air can normally pass through the backflow prevention devices; when the first fan assembly fails, the first backflow preventing device arranged on the first fan assembly is in a second working state, namely the first backflow preventing device is in a closed state, hot air cannot pass through the backflow preventing device, and the second fan assembly adjacent to the first backflow preventing device cannot exhaust air from the failed first fan assembly, so that the air duct short circuit cannot be caused.
A certain gap is arranged between the fan assembly and the mounting box in the electronic equipment, and the gap can be used as a mixed flow cavity. Referring to fig. 4a, when all the fan assemblies are working normally, the backflow preventing devices on the fan assemblies are in the first working state, and hot air generated by the circuit boards in the first circuit board group and the second circuit board group is pumped away by the correspondingly arranged fan assemblies, so that the heat dissipation system works normally.
It is assumed that a first fan assembly corresponds to a first mounting box and a second fan assembly adjacent to the first fan assembly corresponds to a second mounting box. Referring to fig. 4b, when the first fan assembly located in the middle fails and the first fan assembly is still in place, the first backflow device on the first fan assembly is in the second working state. At this time, because in the heat dissipation system, a certain gap exists between the fan assembly and the installation box, hot air generated by the first circuit board can be pumped away by the second fan assembly adjacent to the first fan assembly through the mixed flow cavity. And because the first fan assembly is still in place and the first backflow prevention device is in the second working state, the second fan assembly cannot exhaust air from the first fan assembly due to the failure of the first fan assembly, and therefore the heat dissipation system can still work normally.
Referring to fig. 4c, when the first fan assembly located in the middle fails and the first fan assembly is not located, the second fan assembly adjacent to the first fan assembly draws less wind from the first fan assembly because the first fan assembly is not located, so that the second fan assembly draws less wind from the empty fan slot, and the hot wind drawn from the corresponding second circuit board is reduced; in addition, since the first fan assembly is not in place and a gap exists between the fan assembly and the first circuit board, the second fan assembly cannot draw air from the first circuit board, and the system cannot run for a long time without wind on the first circuit board.
As can be seen from the heat dissipation systems in fig. 3 and fig. 4, the two heat dissipation systems cannot be satisfied in the orthogonal architecture, and after a certain fan assembly fails, the heat dissipation of the corresponding exchange module can be realized no matter the failed fan assembly is in place or out of place.
In order to solve the problems in fig. 3 and 4, the present application provides a novel heat dissipation system, as shown in fig. 5, fig. 5 is a top view of a novel heat dissipation system for electronic equipment. The heat dissipation system is used for dissipating heat of a circuit board assembly, wherein the circuit board assembly comprises a first circuit board group and a second circuit board group, the first circuit board group at least comprises a first circuit board and a second circuit board, and the first circuit board and the second circuit board are exchange modules; the second circuit board group at least comprises a third circuit board and a fourth circuit board, and the third circuit board and the fourth circuit board are service modules. The heat dissipation system comprises a fan assembly and a mounting box corresponding to each circuit board in the first circuit board group one by one, wherein the mounting box is used for accommodating the circuit boards in the first circuit board group, the first circuit board corresponds to the first mounting box, and the second circuit board corresponds to the second mounting box. Each mounting box comprises a first panel arranged opposite to the fan assembly, and a second panel and a third panel which are adjacent to the first panel and are arranged in the parallel direction with the circuit board.
The first panel is provided with a backflow prevention device, the backflow prevention device comprises a frame and a plurality of backflow prevention pieces, and the backflow prevention pieces are rotatably connected with the frame. The backflow prevention sheet can be a shutter structure arranged in the vertical direction or a blade structure arranged in the horizontal direction. In addition, the backflow preventing device can be of an electric structure, and can be manually set to be in a first working state of an open state or set to be in a second working state of a closed state according to actual use conditions, and a corresponding control circuit can also be designed to control the working state of the backflow preventing device; of course, the backflow prevention device can also be correspondingly designed, and is in a first opened working state when the corresponding fan assembly works normally; when the corresponding fan assembly fails, the backflow preventing device is automatically in a closed second working state. The invention is not limited to the structural type and the working mode of the backflow prevention device, as long as the backflow prevention device can achieve the purpose of backflow prevention.
The second and third panels of the mounting box are parallel to the first circuit board, and the second and third panels are longer than the circuit boards in the first circuit board group. When the circuit boards in the first circuit board group are placed in the mounting box, a gap exists between the circuit boards and the first panel, the gap space can be used as a mixed flow cavity, and through the arrangement of the gap space, gas communication is realized between the circuit boards of the first circuit board group and other fan assemblies. Through holes are formed in the second panel and the third panel, and when the first fan assembly fails, hot air generated on the first circuit board corresponding to the first fan assembly can be discharged through the through holes in the second panel and the third panel of the first mounting box and the second fan assembly adjacent to the first fan assembly. Of course, in some cases, for example, in the case that one fan assembly corresponds to only one circuit board, through holes may be formed only on a panel closer to the circuit board, for example, through holes may be formed only on the second panel or the third panel, so that the purpose of exhausting hot air generated by the first circuit board corresponding to the failed first fan assembly can be achieved; in other cases, for example, in the case that one fan assembly corresponds to two circuit boards, only the through holes may be provided on the panel closer to the second fan assembly, so that the hot air generated by the circuit boards may be discharged through the fan assembly closer to the second fan assembly. In the application, the number of the panels provided with the through holes is not limited, so long as the purpose that when the fan assembly fails, the hot air generated by the circuit board corresponding to the failed fan assembly can be discharged can be achieved. When the through holes are formed in the second panel or the third panel, the through holes may be formed only in the position where the circuit board is spaced from the first panel, or may be formed in the front half section close to the first panel, or may be formed in the whole panel. The shape and size of the through hole are not limited in the present application, and the shape of the through hole may be circular, square, rectangular, diamond, etc., and the size of the through hole may be set as required, and preferably, the area capable of ventilation should be increased as much as possible.
In this cooling system, closely set up between fan subassembly and the mounting box, do not have the space, when there is the space, when probably can lead to first fan subassembly inefficacy, the second fan subassembly that is adjacent directly follows the air extraction of space department, influences the condition of heat dispersion. When one fan assembly fails, other fan assemblies adjacent to the failed fan assembly can pump away hot air generated by the circuit board corresponding to the failed fan assembly through the gap between the circuit board and the fan assembly.
Referring to fig. 5a, when all the fan assemblies are working normally, the backflow preventing devices on the fan assemblies are in the first working state, and hot air generated by the circuit boards in the first circuit board group and the second circuit board group is pumped away by the fan assemblies correspondingly arranged, so that the heat dissipation system works normally.
It is assumed that a first fan assembly corresponds to a first mounting box and a second fan assembly adjacent to the first fan assembly corresponds to a second mounting box. Referring to fig. 5b and 5c, when the first fan assembly located in the middle fails, the first backflow preventing device on the first mounting box corresponding to the first fan assembly is in the second working state, regardless of whether the first fan assembly is in place or out of place. At this time, because in the heat dissipation system, a certain gap exists between the first circuit board and the first panel, that is, a certain gap exists between the first circuit board and the fan assembly, and through holes are formed in the second panel and/or the third panel, a mixed flow cavity is formed between the mounting boxes of the first circuit board group, the circuit boards in the first circuit board group can be in gas communication with other fan assemblies, and hot air generated by the first circuit board corresponding to the first fan assembly is pumped away by the second fan assembly adjacent to the failed first fan assembly through the mixed flow cavity. And because the first backflow preventing device corresponding to the first fan assembly is in the second working state, the second fan assembly cannot exhaust air from the first fan assembly due to the failure of the first fan assembly, and therefore the heat dissipation system can still work normally.
In summary, the heat dissipation system in fig. 5 has the following advantages: (1) When the failed fan assembly is in place or out of place, the purpose of radiating the circuit board corresponding to the failed fan assembly can be achieved, and the situations that the circuit board cannot radiate heat or an air duct is short-circuited and the like can not occur; (2) The heat dissipation system is simple in design, only the corresponding installation box is required to be provided with the backflow preventing device on the panel close to the fan assembly, and through holes are arranged on the second panel and the third panel which are parallel to the first circuit board, so that other structural assemblies are not required to be additionally added.
Referring to fig. 6, fig. 6 is a top view of another novel heat dissipation system for electronic devices according to the present invention. The heat dissipation system is used for dissipating heat of a circuit board assembly, wherein the circuit board assembly comprises a first circuit board group and a second circuit board group, the first circuit board group at least comprises a first circuit board and a second circuit board, and the first circuit board and the second circuit board are exchange modules; the second circuit board group at least comprises a third circuit board and a fourth circuit board, and the third circuit board and the fourth circuit board are service modules. The heat dissipation system comprises a fan assembly and a mounting box corresponding to each circuit board in the first circuit board group one by one, wherein the mounting box is used for accommodating the circuit boards in the first circuit board group, the first circuit board corresponds to the first mounting box, and the second circuit board corresponds to the second mounting box. Each mounting box comprises a first panel arranged opposite to the fan assembly, and a second panel and a third panel which are adjacent to the first panel and are arranged in the parallel direction with the circuit board.
The second and third panels of the mounting box are parallel to the first circuit board, and the second and third panels are equal to the circuit board in length or slightly larger than the circuit board. When the circuit board is placed in the mounting box, no or little clearance exists between the circuit board and the first panel. The first panel is provided with a through hole, and hot air generated by the first circuit board can be discharged through the through hole on the first panel. The mounting box is correspondingly provided with a first backflow preventing device, the first backflow preventing device is connected with the mounting box through a first connecting piece, wherein the first connecting piece can be a plurality of hard strips with buckles, the hard strips can be made of plastics or metals, the mounting box is not limited by the application, and the hard strips can fixedly connect the first backflow preventing device to a first panel of the mounting box. The first connecting member may also be a plurality of narrow strips, where the plurality of narrow strips may be connected to the second panel and the third panel of the mounting box, so that the first backflow preventing device is fixedly connected to the first mounting box, and the connection between the narrow strips and the first backflow preventing device and the connection between the second panel and the third panel may be connected by using screws and nuts, or may be glued, or may be connected by other connection methods, which are not limited by the present application. The narrow strip-shaped object can be provided with a plurality of through holes or not provided with through holes, and the purpose of enabling the circuit board in the installation box to be in gas communication with other fan components can be achieved. The first connecting piece can also be two oppositely arranged panels, through holes are formed in the panels, and when the first fan assembly corresponding to the first installation box fails, hot air generated by the first circuit board can be discharged through the through holes through the second fan assembly adjacent to the first fan assembly. The shape and material of the first connector are not limited in the present application, and the first mounting box may be in gas communication with other fan assemblies after being connected by the first connector. Also, in this embodiment, the first backflow preventing device may have a first operating state that is an on state or a second operating state that is an off state, and the present application is not limited to the structural type and the operating manner of the first backflow preventing device, as long as it can achieve the purpose of backflow prevention.
In this cooling system, closely set up between fan subassembly and the anti-return device, do not have the space, when there is the space, when probably can lead to first fan subassembly inefficacy, the second fan subassembly that is adjacent directly follows the air extraction of space department, influences the condition of heat dispersion. When one fan assembly fails, other fan assemblies adjacent to the failed fan assembly can pump away hot air generated by the circuit board corresponding to the failed fan assembly through the gap between the circuit board and the fan assembly.
Referring to fig. 6a, when all the fan assemblies are working normally, the backflow preventing devices on the fan assemblies are in the first working state, and hot air generated by the circuit boards in the first circuit board group and the second circuit board group is pumped away by the fan assemblies correspondingly arranged, so that the heat dissipation system works normally.
It is assumed that a first fan assembly corresponds to a first mounting box and a second fan assembly adjacent to the first fan assembly corresponds to a second mounting box. Referring to fig. 6b and 6c, when the first fan assembly located in the middle fails, the first backflow device corresponding to the first mounting box is in the second working state, regardless of whether the first fan assembly is in place or out of place. At this time, because in the heat dissipation system, a certain gap exists between the first mounting box and the first backflow preventing device, and the first connecting piece enables the first mounting box to be in gas communication with other fan assemblies, hot air generated by the first circuit board is pumped away by the adjacent second fan assemblies. And because the first backflow preventing device corresponding to the first mounting box is in the second working state, the second fan assembly cannot exhaust air from the first fan assembly due to the failure of the first fan assembly, and therefore the heat dissipation system can still work normally.
In summary, the heat dissipation system in fig. 6 has the following advantages: (1) When the failed fan assembly is in place or out of place, the purpose of radiating the circuit board corresponding to the failed fan assembly can be achieved, and the situations that the circuit board cannot radiate heat or an air duct is short-circuited and the like can not occur; (2) The heat radiation system is simple in design, the backflow preventing device is arranged separately from the mounting box and is connected through the connecting piece, and when the fan fails, the heat radiation system can work normally without adding other structural components; in the heat radiation system, when the backflow preventing device fails, the backflow preventing device can be directly replaced, and maintenance is convenient.
Referring to fig. 7, fig. 7 is a top view of another heat dissipation system for electronic devices according to the present invention. The heat dissipation system is used for dissipating heat of a circuit board assembly, wherein the circuit board assembly comprises a first circuit board group and a second circuit board group, the first circuit board group at least comprises a first circuit board and a second circuit board, and the first circuit board and the second circuit board are exchange modules; the second circuit board group at least comprises a third circuit board and a fourth circuit board, and the third circuit board and the fourth circuit board are service modules. The heat dissipation system comprises a fan assembly and a mounting box corresponding to each circuit board in the first circuit board group one by one, wherein the mounting box is used for accommodating the circuit boards in the first circuit board group, the first circuit board corresponds to the first mounting box, and the second circuit board corresponds to the second mounting box. Each mounting box comprises a first panel arranged opposite to the fan assembly, and a second panel and a third panel which are adjacent to the first panel and are arranged in the parallel direction with the circuit board. The second and third panels of the mounting box are parallel to the circuit board, and the lengths of the second and third panels are equal to or slightly greater than the circuit board. When the circuit board is placed in the mounting box, no or little clearance exists between the circuit board and the first panel. The first panel is provided with a through hole, and hot air generated by the first circuit board can be discharged through the through hole on the first panel.
A gap is provided between the mounting box and the fan assembly, and the gap space can be used as a mixed flow cavity. When the first fan assembly corresponding to the first mounting box fails, other communication can be realized between the first mounting box and other mounting boxes. The fan assembly is provided with a first backflow prevention device, the first backflow prevention device can have a first working state which is an open state or a second working state which is a closed state, and the structure type and the working mode of the first backflow prevention device are not limited, so long as the backflow prevention purpose can be achieved. In fig. 7, the first backflow preventing device is disposed on the first surface of the first panel, which is parallel to the first panel, and is not limited in the present application, and the first backflow preventing device may also be disposed on the second surface of the first panel, which is parallel to the first panel and faces away from the first panel, where both the two arrangements can meet the condition.
Referring to fig. 7a, when all the fan assemblies are working normally, the first backflow preventing device on the fan assemblies is in the first working state, and the hot air generated by the circuit boards in the first circuit board group and the second circuit board group is pumped away by the correspondingly arranged fan assemblies, so that the heat dissipation system works normally.
It is assumed that a first fan assembly corresponds to a first mounting box and a second fan assembly adjacent to the first fan assembly corresponds to a second mounting box. Referring to fig. 7c, when the first fan assembly located in the middle fails and the first fan assembly is still in place, the first backflow device on the first fan assembly is in the second working state. At this time, because in the heat dissipation system, a certain gap exists between the first fan assembly and the first installation box, hot air generated by the first circuit board can pass through the mixed flow cavity and be pumped away by the second fan assembly adjacent to the first fan assembly. Because the first fan assembly is still in place and the first backflow prevention device is in the second working state, the second fan assembly cannot draw air from the first fan assembly due to the failure of the first fan assembly, and therefore the heat dissipation system can still work normally.
Referring to fig. 7c, when the first fan assembly located in the middle fails and the first fan assembly is out of position, the second backflow preventing device is connected to the first mounting box when the first fan assembly is removed for maintenance. The second backflow preventing device comprises a panel and a second connecting piece. The panel on the second backflow device may include only the second operating state in the closed state, and the panel may be a solid panel without holes or may be a backflow device in the closed state, which is not limited in this application. The second connecting piece is used for fixedly connecting the second backflow preventing device to the first mounting box. The second connector may comprise various shapes and materials similar to the first connector, and the shape and the material of the second connector are not limited in the present application, as long as the first mounting box can be in gas communication with other fan assemblies after being connected by the second connector. At this time, because in the heat dissipation system, a certain gap exists between the first mounting box and the second backflow preventing device, and the second connecting piece enables the first mounting box to be in gas communication with other fan assemblies, hot air generated by the first circuit board is pumped away by the second fan assembly adjacent to the first fan assembly. And because the first backflow preventing device corresponding to the first fan assembly is in the second working state, the second fan assembly cannot exhaust air from the first fan assembly due to the failure of the first fan assembly, and therefore the heat dissipation system can still work normally.
Through the heat dissipation system in fig. 5, 6 and 7, when the failed fan assembly is in place or out of place, the purpose of heat dissipation of the circuit board corresponding to the failed fan assembly can be achieved, the situations that the circuit board cannot dissipate heat or an air duct is short-circuited and the like can not occur, and the electronic equipment using the heat dissipation system can work stably.
The embodiment of the invention also provides electronic equipment which can be communication equipment, a server, a supercomputer or equipment such as a router, a switch and the like in the prior art, and comprises a circuit board assembly and the heat dissipation system in any embodiment, wherein the heat dissipation system can be used for dissipating heat of the circuit board assembly. Because the heat radiation system can radiate the circuit board corresponding to the failed fan assembly when the failed fan assembly is in place or out of place, the condition that the circuit board cannot radiate heat or an air duct is short-circuited can not occur, and the electronic equipment can stably work under any condition.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. A heat dissipation system for dissipating heat from a circuit board assembly, the heat dissipation system comprising,
The circuit board assembly comprises a first circuit board group and a second circuit board group, and the first circuit board group comprises a first circuit board and a second circuit board;
The heat dissipation system comprises a fan assembly and mounting boxes corresponding to each circuit board in the first circuit board group one by one, wherein the mounting boxes are used for accommodating the circuit boards in the first circuit board group, the first circuit board corresponds to the first mounting boxes, and the second circuit board corresponds to the second mounting boxes;
The fan assembly comprises a first fan assembly and a second fan assembly, the first fan assembly is adjacent to the second fan assembly, the first fan assembly corresponds to the first mounting box and is used for radiating the first circuit board in the first mounting box, and the second fan assembly corresponds to the second mounting box and is used for radiating the second circuit board in the second mounting box;
a first distance is arranged between the first circuit board and the first fan assembly; the first circuit board is in gas communication with the second fan assembly;
When the first fan assembly fails and is in place, the first circuit board is correspondingly provided with a first backflow prevention device, and the first backflow prevention device is in a closed second working state; the second fan assembly is also used for radiating heat of the first circuit board;
When the first fan assembly fails and is out of position, the first circuit board is correspondingly provided with a second backflow prevention device, and the second backflow prevention device is in a closed second working state; the second fan assembly is also used for radiating heat of the first circuit board.
2. The heat dissipating system of claim 1, wherein the second backflow prevention device is the same as or different from the first backflow prevention device.
3. The heat dissipating system of claim 1, wherein the first backflow prevention device is disposed on the first mounting box, on the first fan assembly, or connected to the first mounting box by a first connector.
4. The heat dissipating system of claim 1, wherein the second backflow device is coupled to the first mounting box via a second connector.
5. The heat dissipating system of claim 1, wherein said first mounting box comprises a first panel facing said first fan assembly, and second and third panels connected to said first panel and disposed parallel to said first circuit board, said first panel having first backflow preventing means disposed thereon, and said second and third panels having through holes disposed thereon.
6. The heat dissipating system of claim 1 wherein said first mounting box comprises a first panel facing said first fan assembly, and second and third panels connected to said first panel and disposed parallel to said first circuit board, said first panel having a through hole disposed therein, said first panel being disposed a second distance from said first fan assembly.
7. The heat dissipating system of claim 1, wherein said first and second backflow prevention devices comprise a frame and a plurality of backflow prevention tabs rotatably coupled to said frame.
8. The heat dissipating system of claim 7, wherein the plurality of backflow preventing fins are arranged in a vertical direction or in a horizontal direction.
9. The heat dissipating system of claim 1 wherein said second backflow prevention device is a solid panel that is non-porous.
10. An electronic device comprising a first set of circuit boards and a second set of circuit boards, wherein the circuit boards in the first set of circuit boards are arranged orthogonal to the circuit boards in the second set of circuit boards, and a heat dissipation system according to any one of claims 1-9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211351845.6A CN117998807A (en) | 2022-10-31 | 2022-10-31 | Heat dissipation system and electronic equipment using same |
| PCT/CN2023/128782 WO2024094026A1 (en) | 2022-10-31 | 2023-10-31 | Heat dissipation system, and electronic device using heat dissipation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211351845.6A CN117998807A (en) | 2022-10-31 | 2022-10-31 | Heat dissipation system and electronic equipment using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117998807A true CN117998807A (en) | 2024-05-07 |
Family
ID=90901655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211351845.6A Pending CN117998807A (en) | 2022-10-31 | 2022-10-31 | Heat dissipation system and electronic equipment using same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN117998807A (en) |
| WO (1) | WO2024094026A1 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM247912U (en) * | 2003-10-23 | 2004-10-21 | Tatung Co | Fan module with reflow prevention |
| US7983039B1 (en) * | 2009-06-25 | 2011-07-19 | Juniper Networks, Inc. | Reversible airflow fan tray design for electronic device in a data center |
| WO2012092904A2 (en) * | 2012-02-15 | 2012-07-12 | 华为技术有限公司 | Device case and communication equipment |
| CN203590649U (en) * | 2013-09-30 | 2014-05-07 | 杭州华三通信技术有限公司 | Back-flow preventer |
| CN211210277U (en) * | 2019-09-29 | 2020-08-07 | 华为技术有限公司 | Heat dissipation system and electronic equipment |
| CN113365481B (en) * | 2021-06-29 | 2023-04-28 | 西安易朴通讯技术有限公司 | Backflow prevention method and device applied to heat dissipation equipment and heat dissipation system |
-
2022
- 2022-10-31 CN CN202211351845.6A patent/CN117998807A/en active Pending
-
2023
- 2023-10-31 WO PCT/CN2023/128782 patent/WO2024094026A1/en unknown
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| Publication number | Publication date |
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| WO2024094026A1 (en) | 2024-05-10 |
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