CN117953766A - Display panel - Google Patents

Abstract

The invention discloses a display panel, which comprises a backlight module. The backlight module comprises a shell, a circuit board, a plurality of light-emitting elements and at least one heat conducting sheet. The shell is provided with a communicated space and at least one perforation. The circuit board is located in the space. The light-emitting element is arranged on the circuit board. The heat conducting sheet is thermally connected with the circuit board and penetrates through the perforation to be at least partially positioned outside the shell. The display panel can achieve better heat dissipation effect.

Description

Display panel

Technical Field

The present invention relates to a display panel, and more particularly, to a large-sized display panel for a vehicle.

Background

With the progress of technology today, the demand for electronic products is increasing. In addition to the design of electronic products, the durability of electronic products is a key point of consumer concern.

Taking a vehicle panel as an example, manufacturers have an important development direction in the industry to maximize the size of the vehicle panel for users to operate, and to effectively dissipate heat of the internal components that generate heat during operation.

Disclosure of Invention

One of the objectives of the present invention is to provide a display panel, which can achieve better heat dissipation effect.

According to one embodiment of the present invention, a display panel includes a backlight module. The backlight module comprises a shell, a circuit board, a plurality of light-emitting elements and at least one heat conducting sheet. The shell is provided with a communicated space and at least one perforation. The circuit board is located in the space. The light-emitting element is arranged on the circuit board. The heat conducting sheet is thermally connected with the circuit board and penetrates through the perforation to be at least partially positioned outside the shell.

In one or more embodiments of the present invention, the housing has an inner wall surface and opposite inner and outer surfaces, the inner wall surface being connected between the inner and outer surfaces and defining a perforation. The heat conductive sheet includes a first sub heat conductive sheet, a second sub heat conductive sheet, and a third sub heat conductive sheet. The first sub heat-conducting fin is abutted against the inner surface and thermally connected with the circuit board. The second sub heat-conducting fin is abutted against the outer surface. The third sub heat conducting fin is connected between the first sub heat conducting fin and the second sub heat conducting fin and is abutted against the inner wall surface.

In one or more embodiments of the present invention, the housing has at least one groove. The groove is positioned on the inner surface, and the first sub heat conducting fin is positioned on the groove.

In one or more embodiments of the present invention, the backlight module further includes a first heat-conductive adhesive. The first heat conducting glue is connected between the first sub heat conducting fin and the circuit board.

In one or more embodiments of the present invention, the backlight module further includes a sealing element. The sealing element is connected with the outer surface and seals the perforation, and the third sub-heat conducting fin is at least partially clamped between the sealing element and the outer surface.

In one or more embodiments of the present invention, the display panel further includes a display module. The display module is overlapped with the backlight module, and the outer surface of the display module is far away from the display module. The display module comprises a board body, at least one integrated circuit, a flexible circuit board and second heat-conducting glue. The plate body is provided with a first side and a second side which are opposite, and the first side faces and is connected with the shell. The integrated circuit is disposed on the second side. The flexible circuit board is provided with a first end and a second end which are opposite, wherein the first end is arranged on the second side, and the second end is connected with the outer surface. The second heat-conducting glue is connected with the integrated circuit and the first end.

In one or more embodiments of the present invention, the display panel further includes a double sided tape. The double-sided adhesive tape is adhered between the second end and the outer surface.

In one or more embodiments of the present invention, the display panel further includes a third heat-conductive adhesive. The third heat conducting glue is connected between the second end and the second sub heat conducting fin.

In one or more embodiments of the present invention, the display panel further includes a connecting element. The connecting element is connected between the plate body and the shell.

In one or more embodiments of the present invention, the circuit board has a third side and a fourth side opposite to each other, the light emitting element is located on the third side, and the heat conducting fin is located on the fourth side.

The above-described embodiments of the present invention have at least the following advantages:

(1) When the display panel operates and the light-emitting element emits light, heat generated in the backlight module can be conducted from the space of the shell to the outside of the space of the shell through the heat conducting sheet, so that the situation of overheating in the backlight module is effectively avoided.

(2) When the display panel operates, heat energy generated by the integrated circuit can be conducted to the flexible circuit board through the second heat conducting glue and conducted to the second end through the first end of the flexible circuit board, so that the heat energy generated by the integrated circuit can be dispersed at a position near the outer surface of the shell, and the integrated circuit can be effectively radiated.

Drawings

Fig. 1 is a cross-sectional view illustrating a display panel according to an embodiment of the invention.

Fig. 2 is a cross-sectional view of fig. 1 along line A-A, wherein the sealing element is omitted.

Fig. 3 is a cross-sectional view along line B-B of fig. 1.

Fig. 4 is a cross-sectional view illustrating a display panel according to another embodiment of the invention.

Wherein, the reference numerals:

100 display panel

110 Backlight module

111 Casing body

112 Circuit board

112A third side

112B fourth side

113 Luminous element

114 Heat conducting fin

1141 First sub-heat conductive sheet

1142 Second sub-heat conductive sheet

1143 Third sub-heat conductive sheet

115 First heat conductive glue

116 Sealing element

120 Display module

121 Plate body

121A first side

121B second side

122 Integrated circuit

123 Flexible Circuit Board

123A first end

123B second end

124 Second heat-conducting glue

130 Double faced adhesive tape

140, Third heat-conducting glue

150 Connecting element

160 Frame body

170 Rear shell

A-a, B-B line segment

AS (application) accommodating space

G groove

H, perforating

SI inner surface

SO outer surface

SP: space

SW inner wall surface

Detailed Description

Various embodiments of the invention are disclosed in the following drawings, in which details of the practice are set forth in the following description for the purpose of clarity. However, it should be understood that these practical details are not to be taken as limiting the invention. That is, in some embodiments of the invention, these practical details are unnecessary. Moreover, for the purposes of simplifying the drawings, some conventional structures and elements are schematically depicted in the drawings, and the same reference numerals will be used to designate the same or similar elements throughout the drawings. And features of different embodiments may be applied interactively, if implementation is possible.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have their ordinary meaning as understood by one of ordinary skill in the art. Furthermore, the definitions of the words and phrases used herein should be understood and interpreted to have a meaning consistent with the understanding of the relevant art and technology. These terms are not to be construed as idealized or overly formal meanings unless expressly so defined.

Please refer to fig. 1. Fig. 1 is a cross-sectional view illustrating a display panel 100 according to an embodiment of the invention. As shown in fig. 1, a display panel 100 includes a backlight module 110, a display module 120, a connecting element 150, a frame 160, and a rear housing 170. The frame 160 is connected to the rear housing 170 to form a receiving space AS configured to receive the backlight module 110 and the display module 120, the display module 120 is stacked on the backlight module 110, and the connection element 150 is connected between the backlight module 110 and the display module 120. In practice, the connecting element 150 comprises a sponge material.

Further, in the present embodiment, the backlight module 110 includes a housing 111, a circuit board 112, a plurality of light emitting elements 113, and at least one heat conductive sheet 114. The housing 111 has a communicating space SP and at least one through hole H. The circuit board 112 is located in the space SP of the housing 111. The light emitting element 113 is disposed on the circuit board 112. The heat conductive sheet 114 is thermally connected to the circuit board 112 and passes through the through hole H of the housing 111 to be at least partially located outside the housing 111. In practical applications, the heat conducting sheet 114 is a copper sheet, but the invention is not limited thereto.

In this way, when the display panel 100 is operated and the light emitting element 113 emits light, the heat generated in the backlight module 110 can be conducted from the space SP of the housing 111 to the outside of the space SP of the housing 111 through the heat conducting sheet 114, so as to effectively avoid the overheating in the backlight module 110.

More specifically, as shown in fig. 1, the housing 111 has an inner wall surface SW connected between the inner surface SI and the outer surface SO and defining a perforation H, and opposite inner surface SI and outer surface SO. The heat conductive sheet 114 includes a first sub heat conductive sheet 1141, a second sub heat conductive sheet 1142, and a third sub heat conductive sheet 1143. The first sub-heat conductive sheet 1141 abuts the inner surface SI and thermally connects the circuit board 112. The second sub heat conductive sheet 1142 abuts the outer surface SO of the housing 111. The third sub-heat conductive sheet 1143 is connected between the first sub-heat conductive sheet 1141 and the second sub-heat conductive sheet 1142 and abuts against the inner wall surface SW of the housing 111, and the heat generated in the backlight module 110 can be sequentially conducted from the space SP of the housing 111 to the outside of the space SP of the housing 111 through the first sub-heat conductive sheet 1141, the third sub-heat conductive sheet 1143 and the second sub-heat conductive sheet 1142.

Further, as shown in fig. 1, the backlight module 110 further includes a first heat-conductive adhesive 115. The first heat conductive adhesive 115 is connected between the first sub-heat conductive sheet 1141 and the circuit board 112, so as to facilitate heat conduction between the circuit board 112 and the first sub-heat conductive sheet 1141.

In the present embodiment, the backlight module 110 further includes a sealing member 116 to prevent dust particles from entering the space SP inside the housing 111 from outside the housing 111. As shown in fig. 1, the sealing member 116 is connected to the outer surface SO of the housing 111 and seals the through hole H, and the third sub-heat conductive sheet 1143 of the heat conductive sheet 114 is at least partially interposed between the sealing member 116 and the outer surface SO. In practical applications, the sealing element 116 is a black gel, but the invention is not limited thereto.

In addition, as shown in fig. 1, the circuit board 112 has a third side 112a and a fourth side 112b opposite to each other, the light emitting element 113 is located on the third side 112a of the circuit board 112, and the heat conductive sheet 114 is located on the fourth side 112b of the circuit board 112. That is, the light emitting element 113 and the heat conductive sheet 114 are located at opposite sides of the circuit board 112, i.e., the circuit board 112 is located between the light emitting element 113 and the heat conductive sheet 114.

Please refer to fig. 2. Fig. 2 is a cross-sectional view of fig. 1 along line A-A, wherein the sealing element 116 is omitted. In the present embodiment, as shown in fig. 2, the number of the heat conductive sheets 114 is plural, and the second sub heat conductive sheets 1142 of each heat conductive sheet 114 are respectively in a strip shape and extend from the through holes H to form a larger heat dissipation surface. However, it should be understood that the above-mentioned shapes of the second sub-heat conductive sheets 1142 are only examples, and are not intended to limit the present invention, and those skilled in the art should appropriately select the shapes of the second sub-heat conductive sheets 1142 according to the actual needs and the allowable positions on the circuit board 112, including regular shapes and irregular shapes.

In addition, as shown in fig. 2, for example, the shape of the through hole H is rectangular. However, in other embodiments, the perforations H may be other shapes, such as circular, oval, or other polygonal shapes, etc., depending on the actual situation.

Please refer to fig. 3. Fig. 3 is a cross-sectional view along line B-B of fig. 1. In the present embodiment, as shown in fig. 1 and 3, the housing 111 has at least one groove G. The recess G is located on the inner surface SI of the housing 111, and the first sub-heat-conducting strip 1141 is located at least partially in the recess G, so that the heat-conducting strip 114 can be fixed relative to the housing 111.

Please refer back to fig. 1. As shown in fig. 1, the display module 120 is located above the backlight module 110, and the outer surface SO of the backlight module 110 is far away from the display module 120. Specifically, in the present embodiment, the display module 120 includes a board 121, at least one integrated circuit 122, a flexible circuit board 123, and a second heat-conductive adhesive 124. The plate 121 has a first side 121a and a second side 121b opposite to each other, the first side 121a of the plate 121 faces and is connected to the housing 111 of the backlight module 110, the second side 121b of the plate 121 is far away from the housing 111, and the connecting element 150 is connected between the first side 121a of the plate 121 and the housing 111 of the backlight module 110. The integrated circuit 122 is disposed on the second side 121b of the board 121. The flexible circuit board 123 has a first end 123a and a second end 123b opposite to each other, the first end 123a of the flexible circuit board 123 is disposed on the second side 121b of the board body 121, and the second end 123b of the flexible circuit board 123 is connected to the outer surface SO of the housing 111. In the present embodiment, the second heat conductive adhesive 124 connects the integrated circuit 122 and the first end 123a of the flexible circuit board 123.

In this way, when the display panel 100 is in operation, the heat generated by the integrated circuit 122 can be conducted to the flexible circuit board 123 through the second heat conductive adhesive 124 and conducted to the second end 123b through the first end 123a of the flexible circuit board 123, SO that the heat generated by the integrated circuit 122 can be dispersed at the position of the housing 111 near the outer surface SO, thereby effectively dissipating the heat of the integrated circuit 122.

Furthermore, the display panel 100 further includes a double sided tape 130. The double-sided tape 130 is adhered between the second end 123b of the flexible circuit board 123 and the outer surface SO of the housing 111 to fix the relative positions of the flexible circuit board 123 and the housing 111.

Please refer to fig. 4. Fig. 4 is a cross-sectional view illustrating a display panel 100 according to another embodiment of the invention. In this embodiment, as shown in fig. 4, the display panel 100 further includes a third heat conductive adhesive 140. The third heat conductive adhesive 140 is connected between the second end 123b of the flexible circuit board 123 and the second sub heat conductive sheet 1142. In this way, after the heat energy generated by the integrated circuit 122 is transferred to the second end 123b through the first end 123a of the flexible circuit board 123, the heat energy can be further transferred to the second sub-heat-conductive sheet 1142 through the third heat-conductive adhesive 140, and the heat energy is dispersed through the second sub-heat-conductive sheet 1142, so as to improve the heat dissipation effect on the integrated circuit 122. For simplicity of the drawing, other elements in fig. 4 are not labeled one by one, and these elements may be referenced to the reference numerals of fig. 1. In addition, according to actual conditions, in other embodiments, the second end 123b of the flexible circuit board 123 and the second sub-heat conductive sheet 1142 of the heat conductive sheet 114 may be in direct contact with each other.

In summary, the technical solution disclosed in the above embodiment of the present invention has at least the following advantages:

(1) When the display panel operates and the light-emitting element emits light, heat generated in the backlight module can be conducted from the space of the shell to the outside of the space of the shell through the heat conducting sheet, so that the situation of overheating in the backlight module is effectively avoided.

(2) When the display panel operates, heat energy generated by the integrated circuit can be conducted to the flexible circuit board through the second heat conducting glue and conducted to the second end through the first end of the flexible circuit board, so that the heat energy generated by the integrated circuit can be dispersed at a position near the outer surface of the shell, and the integrated circuit can be effectively radiated.

While the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, but may be variously modified and modified by those skilled in the art without departing from the spirit and scope of the present invention, and the scope of the present invention is accordingly defined by the appended claims.

Claims (10)

1. A display panel, comprising:

A backlight module, comprising:

A shell with a space and at least one through hole which are communicated;

a circuit board located in the space;

A plurality of light emitting elements arranged on the circuit board; and

At least one heat conducting fin is thermally connected with the circuit board and passes through the through hole to be at least partially positioned outside the shell.

2. The display panel of claim 1, wherein the housing has an inner wall surface and an opposite inner surface and an outer surface, the inner wall surface being connected between the inner surface and the outer surface and defining the through hole, the thermally conductive sheet comprising:

a first sub-heat-conducting fin abutting against the inner surface and thermally connected to the circuit board;

A second sub-heat-conducting fin abutting against the outer surface; and

And the third sub heat conducting fin is connected between the first sub heat conducting fin and the second sub heat conducting fin and is abutted against the inner wall surface.

3. The display panel of claim 2, wherein the housing has at least one recess in the inner surface, and the first sub-heat conductive sheet is in the recess.

4. The display panel of claim 2, wherein the backlight module further comprises:

the first heat conducting glue is connected between the first sub heat conducting fin and the circuit board.

5. The display panel of claim 2, wherein the backlight module further comprises:

and a sealing element connected to the outer surface and sealing the through hole, wherein the third sub-heat-conducting fin is at least partially sandwiched between the sealing element and the outer surface.

6. The display panel of claim 2, further comprising:

A display module, which is stacked on the backlight module, the outer surface is far away from the display module, the display module comprises:

a plate body having a first side and a second side opposite to each other, the first side facing and being connected to the housing;

At least one integrated circuit disposed on the second side;

The flexible circuit board is provided with a first end and a second end which are opposite to each other, the first end is arranged on the second side, and the second end is connected with the outer surface; and

And the second heat-conducting adhesive is connected with the integrated circuit and the first end.

7. The display panel of claim 6, further comprising:

A double-sided adhesive tape adhered between the second end and the outer surface.

8. The display panel of claim 6, further comprising:

and the third heat conducting glue is connected between the second end and the second sub heat conducting fin.

9. The display panel of claim 6, further comprising:

And the connecting element is connected between the plate body and the shell.

10. The display panel of claim 1, wherein the circuit board has a third side and a fourth side opposite to each other, the light emitting elements are located on the third side, and the heat conducting sheet is located on the fourth side.