CN117917652B

CN117917652B - Wafer cross-factory wafer flow method and device

Info

Publication number: CN117917652B
Application number: CN202410317611.2A
Authority: CN
Inventors: 王景皓; 焦劼; 谢明宏
Original assignee: Shenzhen Shengweixu Technology Co ltd
Current assignee: Shenzhen Shengweixu Technology Co ltd
Priority date: 2024-03-20
Filing date: 2024-03-20
Publication date: 2024-05-28
Anticipated expiration: 2044-03-20
Also published as: CN117917652A

Abstract

The application belongs to the technical field of semiconductors, and discloses a wafer cross-factory wafer method and device. The application realizes the automatic offline of all wafer batches in the same first wafer box, reduces the participation of manpower and can improve the overall wafer-flowing efficiency.

Description

Wafer cross-factory wafer flow method and device

Technical Field

The application relates to the technical field of semiconductors, in particular to a wafer cross-factory wafer flow method and device.

Background

With the development of the semiconductor industry, more and more wafer Factories (FAB) are being established, and a scenario that wafers are transferred between different FAB and are being processed down line for processing, which involves data transfer and processing between manufacturing execution systems (MES systems) of different FAB.

The MES systems of different FABs are different, the logic definitions in the different MES systems and the name definitions of the same object are also different, when wafers are mutually transmitted between the different FABs and are taken off line to carry out process flow, in the prior art, the data transmitted between the different FABs are decrypted and converted manually by engineers, and when the wafers are taken off line, the corresponding relation between the wafer batch and the target wafer box and the transmission work order are manually created by the engineers, so that a great amount of time is required for the engineers, and human errors are easy to occur.

Disclosure of Invention

In order to solve the above problems, the present application provides a wafer cross-factory flow method, a wafer cross-factory flow device, an electronic apparatus and a computer readable storage medium.

According to an aspect of the embodiment of the application, a wafer cross-factory flow method is disclosed, which comprises the following steps:

acquiring a wafer lot ID of a wafer lot in the first wafer cassette;

Creating a virtual wafer cassette ID, wherein the virtual wafer cassette ID and a wafer batch ID of a wafer batch in the first wafer cassette have a first mapping relation;

Converting the first account data corresponding to the wafer lot ID into second account data;

When a wafer offline instruction is received, determining the wafer lot ID corresponding to an offline wafer lot ID in the wafer offline instruction, determining a corresponding virtual wafer box ID based on the first mapping relation and the wafer lot ID corresponding to the offline wafer lot ID, and taking all the wafer lot IDs corresponding to the determined virtual wafer box ID based on the first mapping relation as target offline wafer lot IDs;

And determining second account material data corresponding to the target offline wafer lot ID, constructing a second mapping relation between the target offline wafer lot ID and a second wafer cassette based on the target offline wafer lot ID and the second account material data corresponding to the target offline wafer lot ID, and outputting the target offline wafer lot ID and the second mapping relation to a manufacturing execution system, so that the manufacturing execution system can control execution equipment to transmit the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer cassette based on the second mapping relation, and execute a processing procedure based on the second account material data corresponding to the target offline wafer lot ID.

In some embodiments, the virtual pod ID comprises a plurality of code bits comprising a first pod code and a deposit address code, wherein the deposit address code has a third mapping relationship with a physical deposit location of the first pod at a warehouse when the first pod is deposited to the warehouse.

In some embodiments, the plurality of code bits further comprise an incoming lot number and a lot number identification, wherein the incoming lot number represents a lot providing the first pod and the lot number identification represents a lot number of wafers within the first pod.

In some embodiments, after creating the virtual cassette ID, the method further comprises:

Transmitting the virtual wafer cassette ID to a warehouse system, so that the warehouse system determines a physical storage position corresponding to the storage address code, and stores the first wafer cassette to a physical storage position corresponding to the storage address code in a warehouse;

After the target offline wafer lot ID is determined, the target offline wafer lot ID is transmitted to the warehouse system, so that the warehouse system searches for a virtual wafer box ID corresponding to the target offline wafer lot ID, and determines the physical storage position of the first wafer box in the warehouse, corresponding to the target offline wafer lot ID, based on the virtual wafer box ID.

Writing the virtual pod ID to the corresponding first pod, wherein the virtual pod ID written to the corresponding first pod is readable from the first pod by the manufacturing execution system.

In some embodiments, the converting the first accounting data corresponding to the wafer lot ID to the second accounting data includes:

Acquiring a generation rule of a manufacturing execution system on a wafer batch ID and a wafer ID;

And based on the generation rule, converting the first wafer ID in the first account material data corresponding to the wafer lot ID into a second wafer ID, and converting the first wafer lot ID in the first account material data corresponding to the wafer lot ID into the second wafer lot ID.

In some embodiments, after converting the first wafer ID in the first accounting data corresponding to the wafer lot ID to the second wafer ID and converting the first wafer lot ID in the first accounting data corresponding to the wafer lot ID to the second wafer lot ID, the method further comprises the steps of:

s1.1, acquiring a wafer ID and a wafer batch ID stored in the manufacturing execution system;

s1.2, determining whether the stored wafer ID and the second wafer ID are repeated, and whether the stored wafer lot ID and the second wafer lot ID are repeated;

S1.3, if the wafer ID which is repeated with the second wafer ID exists in the stored wafer IDs, modifying the generation rule, and converting the first wafer ID in the first account material data into the second wafer ID again;

If the wafer lot ID which is repeated with the second wafer lot ID exists in the stored wafer lot IDs, modifying the generation rule, and converting the first wafer lot ID in the first account material data into the second wafer lot ID again;

Repeating steps S1.2-S1.3 until no wafer ID which is repeated with the second wafer ID exists in the stored wafer IDs, and no wafer batch ID which is repeated with the second wafer batch ID exists in the stored wafer batch IDs.

In some embodiments, the converting the first accounting data corresponding to the wafer lot ID to the second accounting data further includes:

Based on a preset mapping relation table, converting a first product ID in the first account material data corresponding to the wafer batch ID into a second product ID, and converting a first final step ID in the first account material data corresponding to the wafer batch ID into a second final step ID.

Generating a final contamination level and a photoresist label based on the second final step ID;

verifying whether the final pollution level and the photoresist label generated based on the second final step ID and the final pollution level and the photoresist label in the first account material data accord with a preset consistency relation;

And if the preset consistency relation is not met, generating alarm information.

In some embodiments, the constructing a second mapping relationship between the target offline lot ID and a second wafer cassette based on the target offline lot ID and second accounting data corresponding to the target offline lot ID includes:

Determining a final pollution level corresponding to the target offline wafer lot ID based on second account data corresponding to the target offline wafer lot ID;

And constructing a second mapping relation between the target offline wafer lot ID and a second wafer cassette based on the final pollution level corresponding to the target offline wafer lot ID.

In some embodiments, the wafer cross-factory flow method further comprises the following steps:

S2.1, when a wafer shipment instruction is received, determining shipment wafer lot IDs in the wafer shipment instruction, the wafer quantity of each shipment wafer lot ID and final pollution level data corresponding to the shipment wafer lot IDs;

S2.2, determining a batch combination scheme with the least number of third wafer cassettes according to a pollution matching rule based on the shipment wafer batch ID, the wafer number of shipment batch wafers corresponding to each shipment wafer batch ID and final pollution level data corresponding to the shipment wafer batch ID, wherein the final pollution level data corresponding to different shipment wafer batch IDs in the same batch combination in the batch combination scheme are matched;

S2.3, based on the batch combination scheme, constructing a fourth mapping relation between the shipment wafer batch ID and a third wafer cassette, and outputting the shipment wafer batch ID and the fourth mapping relation to the manufacturing execution system, so that the manufacturing execution system can control execution equipment to transmit the shipment wafer batch corresponding to the shipment wafer batch ID to the corresponding third wafer cassette based on the fourth mapping relation.

In some embodiments, after determining the lot combination scheme that uses the least number of third cassettes, before transferring the shipment lot corresponding to the shipment lot ID to the corresponding third cassette, the method further comprises:

Generating a batch combination scheme confirmation window;

receiving the batch combination scheme confirmation information input in the batch combination scheme confirmation window, or when receiving the batch combination scheme confirmation information input in the batch combination scheme confirmation window, executing step S2.3;

When a lot combination scheme change instruction input in the lot combination scheme confirmation window is received, changing a lot combination scheme based on the lot combination scheme change instruction, and executing or re-executing step S2.3 based on the changed lot combination scheme.

acquiring a wafer lot ID of a wafer lot in the first wafer cassette;

Determining second account material data corresponding to the target offline wafer lot ID, constructing a second mapping relation between the target offline wafer lot ID and a second wafer cassette based on the target offline wafer lot ID and the second account material data corresponding to the target offline wafer lot ID, and outputting the target offline wafer lot ID and the second mapping relation to a manufacturing execution system;

And configuring the manufacturing execution system to control execution equipment to transmit the target offline wafer lot corresponding to the target offline wafer lot ID to a corresponding second wafer box based on the second mapping relation and execute a processing procedure based on second account data corresponding to the target offline wafer lot ID.

In some embodiments, the configuring the manufacturing execution system to control an execution device to transfer the target offline lot corresponding to the target offline lot ID to a corresponding second wafer cassette based on the second mapping relationship includes:

Configuring the manufacturing execution system to check first information of the target offline wafer lot corresponding to the target offline wafer lot ID in the first wafer box based on second accounting data corresponding to the target offline wafer lot ID;

And if the verification result is that the first information of the target offline wafer lot corresponding to the target offline wafer lot ID in the first wafer box is wrong, controlling the execution equipment to stop transmitting the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer box and generating an alarm signal.

In some embodiments, the first information includes at least one of a placement position of the target offline lot corresponding to the target offline lot ID within the first cassette, a number of wafers included in the target offline lot corresponding to the target offline lot ID, and a wafer back-etching code of each wafer in the target offline lot corresponding to the target offline lot ID;

if any one of the wafer cassettes is wrong, the verification result is that the first information of the target offline wafer lot corresponding to the target offline wafer lot ID in the first wafer cassette is wrong.

In some embodiments, the virtual pod ID comprises a plurality of code bits comprising a first pod code and a deposit address code, wherein the deposit address code has a third mapping relationship with a physical deposit location of the first pod at a warehouse when the first pod is deposited to the warehouse, and after creating the virtual pod ID, the method further comprises:

transmitting the virtual wafer cassette ID to a warehouse system;

Configuring the warehouse system to determine a physical storage position corresponding to the storage address code based on the virtual wafer cassette ID so as to store the first wafer cassette to the physical storage position corresponding to the storage address code in the warehouse;

After determining the target offline wafer lot ID, transmitting the target offline wafer lot ID to the warehouse system;

And configuring the warehouse system to search a virtual wafer box ID corresponding to the target offline wafer lot ID, and determining the physical storage position of the first wafer box in the warehouse corresponding to the target offline wafer lot ID based on the virtual wafer box ID.

Writing the virtual pod ID to the corresponding first pod, wherein the virtual pod ID written to the first pod is readable from a first pod by the manufacturing execution system;

outputting a virtual wafer cassette ID corresponding to the target offline wafer lot ID to a manufacturing execution system when outputting the target offline wafer lot ID and the second mapping relation to the manufacturing execution system;

And before the execution equipment is controlled to transmit the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer box based on the second mapping relation, the manufacturing execution system is configured to read the virtual wafer box ID written to the first wafer box, and if the virtual wafer box ID written to the first wafer box is consistent with the virtual wafer box ID corresponding to the target offline wafer lot ID, the step of transmitting the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer box based on the second mapping relation is executed.

According to an aspect of an embodiment of the present application, a wafer cross-factory flow sheet apparatus is disclosed, the wafer cross-factory flow sheet apparatus includes:

The data receiving module is used for obtaining the wafer lot ID of the wafer lot in the first wafer box and creating a virtual wafer box ID, and the virtual wafer box ID and the wafer lot ID of the wafer lot in the first wafer box have a first mapping relation;

the data conversion module is used for converting the first account material data corresponding to the wafer batch ID into second account material data;

And the wafer offline module is used for determining the wafer batch ID corresponding to the offline wafer batch ID in the wafer offline instruction when receiving the wafer offline instruction, determining a corresponding virtual wafer box ID based on the first mapping relation and the wafer batch ID corresponding to the offline wafer batch ID, taking all the determined virtual wafer box IDs corresponding to the first mapping relation as target offline wafer batch IDs, determining second account data corresponding to the target offline wafer batch ID, constructing a second mapping relation between the target offline wafer batch ID and the second wafer box based on the second account data corresponding to the target offline wafer batch ID and outputting the target offline wafer batch ID and the second mapping relation to a manufacturing execution system, so that the manufacturing execution system can control an execution device to transmit the target offline wafer batch ID to the corresponding target offline wafer batch based on the second account data based on the second mapping relation.

According to an aspect of an embodiment of the present application, an electronic device is disclosed that includes one or more processors and a memory for storing one or more computer programs that, when executed by the one or more processors, cause the processors to implement the wafer cross-factory flow method as described above.

According to an aspect of an embodiment of the present application, a computer-readable storage medium storing computer-readable instructions that, when executed by a processor of a computer, cause the computer to perform a wafer cross-factory flow method as described above is disclosed.

The technical scheme provided by the embodiment of the application at least comprises the following beneficial effects:

According to the scheme disclosed by the application, firstly, a virtual wafer box ID is created for the acquired wafer lot ID of the wafer lot in the first wafer box, and first account material data corresponding to the wafer lot ID is automatically converted into second account material data. The account data conversion step and the wafer offline step both reduce manual participation, can improve the overall wafer-feeding efficiency, reduce human errors, simultaneously realize the automatic offline of all wafer batches in the same first wafer box in the offline step, and further reduce manual participation and improve the overall wafer-feeding efficiency without manually checking whether the wafer which is not offline exists in the first wafer box again and performing the offline of all wafer batches in the first wafer box for the second time.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application as claimed.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.

FIG. 1 shows an overall flow diagram of a wafer cross-factory flow wafer in the prior art;

FIG. 2 shows an overall flow chart of the wafer cross-factory flow sheet of the present application;

FIG. 3 is a flow chart of a wafer cross-factory flow method according to an embodiment of the application;

FIG. 4 is a flow chart illustrating the wafer ID and wafer lot ID conversion steps according to one embodiment of the present application;

FIG. 5 is a flow chart showing the product ID, final step ID, and final contamination level and photoresist label switching steps according to one embodiment of the present application;

FIG. 6 shows a data table at different FAB factories before and after data conversion;

FIG. 7 is a flow chart illustrating a process for offline targeting offline wafer lot IDs according to one embodiment of the present application;

FIG. 8 illustrates a wafer lot assembly recipe determination embodiment;

FIG. 9 is a flow chart illustrating a wafer shipment step according to one embodiment of the present application;

FIG. 10 is a block diagram of a wafer cross-factory flow apparatus according to one embodiment of the present application;

FIG. 11 shows a block diagram of the components of an electronic device in accordance with an embodiment of the application;

FIG. 12 illustrates a block diagram of a computer system used to implement some embodiments of the application;

FIG. 13 is a flow chart of a wafer cross-factory flow method according to another embodiment of the application;

FIG. 14 is a flowchart illustrating a wafer offline step according to an embodiment of the present application;

FIG. 15 is a flowchart showing a wafer loading step according to an embodiment of the present application;

FIG. 16 is a flow chart showing a wafer ex-warehouse step according to an embodiment of the present application.

The reference numerals are explained as follows:

1000. Wafer cross-factory wafer flow device; 1001. a data receiving module; 1002. a data conversion module; 1003. a wafer offline module; 1004. a wafer shipment module; 1100. an electronic device; 1101. a processor; 1102. a memory; 1200. a computer system; 1201. a CPU; 1202. a ROM; 1203. a RAM; 1204. a bus; 1205. an I/O interface; 1206. an input section; 1207. an output section; 1208. a storage section; 1209. a communication section; 1210. a driver; 1211. removable media.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments may be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art.

Wherein the terms "first," "second," "third," "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first", "second", "third", "fourth" may include one or more features, either explicitly or implicitly.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the application. One skilled in the relevant art will recognize, however, that the application may be practiced without one or more of the specific details, or with other methods, components, devices, steps, etc. In other instances, well-known methods, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the application.

The flow diagrams depicted in the figures are exemplary only, and do not necessarily include all of the elements and operations/steps, nor must they be performed in the order described. For example, some operations/steps may be decomposed, and some operations/steps may be combined or partially combined, so that the order of actual execution may be changed according to actual situations.

When wafers are transferred between different FABs (FAB) and are taken off-line for processing, for example, hundreds of steps before the completion of the FAB and hundreds of steps after the completion of the FAB, data transfer and processing between MES (Manufacturing Execution System ) of the different FABs are required, the MES system of the FAB is often different from the MES system of the FAB a, and data cannot be directly input into the MES system of the FAB. In the FAB, the wafer provided by FAB a cannot be processed directly after being sliced from the first station of the assembly line, like a normal sliced wafer.

In the prior art, as shown in fig. 1, a lot (lot) is processed by a FAB a and then stored in a first pod, which may be a FOSB (Front Opening Shipping Box, front opening unified pod), and provided to the FAB, which is not limited herein. Firstly, a first wafer box is stored in a warehouse of a FAB after code scanning; the data packet of the related account data of the wafer batch processed in the FAB A in the first wafer box is stored in the ERP (ENTERPRISE RESOURCE PLANNING ) of the FAB, and in addition, the readable account data of the FAB MES system is obtained through manual conversion after the data packet is transmitted to the FAB; and then manually importing the readable account data to a FAB MES system, manually creating converted wafer lot (lot) data, and storing the converted wafer lot (lot) data into the ERP of the FAB. When the wafers are offline, an engineer manually creates a wafer lot transfer work order, then obtains FAB A lot information through manual inspection according to the converted wafer lot data, so that after the actual storage position of the wafer lot to be offline is obtained, the wafers are transferred from the first wafer box to the corresponding second wafer box by using an execution device, wherein the execution device can be a sorting machine (sorter), the second wafer box can be a FOUP (Front Opening Unified Pod, a front opening wafer transfer box), no limitation is made here, and in the transfer process, the real object account checking is performed by a manually created check operator. When the station is jumped, the station is manually jumped to the corresponding station through manually applying for the station-jumped sheet, so that the lot enters the next processing procedure of the lot in the final step of the FAB A in the FAB.

As described above, in the prior art, many processes need to be manually participated, manual account making and checking of the material objects are easy to generate human errors, and the related processes have more steps.

Therefore, the application provides a wafer cross-factory wafer-flowing method, which is used for reducing the participation of manpower, improving the overall wafer-flowing efficiency and reducing human errors. As shown in fig. 2, after scanning the code, the first wafer cassette provided by the FAB a to the FAB is stored in the warehouse of the FAB, and through scanning the code, the FAB a lot information may be obtained, including the lot IDs of the wafer lots in the first wafer cassette, the data receiving module creates a virtual wafer cassette ID for the lot IDs of the wafer lots in the same first wafer cassette, creates a storage location corresponding to the virtual wafer cassette ID in the warehouse, and stores the data packet of the related accounting data of the wafer lot in the first wafer cassette processed by the FAB into the ERP of the FAB and leads to the data receiving module; and then converting the account data corresponding to the wafer lot ID by a data conversion module, namely converting the account data such as flow records, test data and the like of the wafer lot corresponding to the wafer lot ID in the FAB A into readable account data of the FAB MES system, and optionally encrypting and storing the converted readable account data. When the wafer is in offline, after the information of the lot needing to be in offline is manually input, a transmission work order is automatically created through the wafer offline module according to the acquired converted lot information, account information and the like, and the execution equipment is enabled to automatically perform real object account verification in the transmission process. After the Lot is off line, entering the FAB for continuous processing.

The wafer cross-factory wafer flow method provided by the application is described in detail below with reference to the specific embodiments.

Fig. 3 is a flowchart of a wafer cross-factory flow method according to an embodiment of the application, and referring to fig. 3, the wafer cross-factory flow method at least includes steps S310 to S350, which are described in detail below.

In step S310, a lot ID of a lot in the first cassette is obtained.

The first wafer box is a wafer box provided from a first wafer factory (FAB A) to a second wafer Factory (FAB), one or more wafer lots are arranged in the first wafer box, each wafer lot has a corresponding wafer lot ID, and each wafer lot can have one or more wafers.

In an embodiment, an identifier is provided on the outer package of the first wafer cassette, optionally, the identifier is a unique identifier on the outer package of the first wafer cassette, and the identifier may be an identifier code, for example, a two-dimensional code, a bar code, or the like, where the identifier has a mapping relationship with a wafer lot ID of a wafer lot in the first wafer cassette, and by reading the identifier, the wafer lot ID of the wafer lot in the first wafer cassette may be obtained. Specifically, the identifier may be read by a code scanning device, and the wafer lot ID corresponding to the identifier is obtained according to the mapping relationship between the identifier and the wafer lot ID, so as to obtain the wafer lot ID of the wafer lot in the first wafer box.

In step S310, the obtained lot ID information may be directly received, so as to obtain the lot ID of the lot in the first wafer cassette, or the lot ID of the lot in the first wafer cassette may be obtained according to an identifier on the outer package of the first wafer cassette and a mapping relationship between the identifier and the lot ID.

In step S320, a virtual pod ID is created, where the virtual pod ID has a first mapping relationship with a lot ID of a lot within the first pod.

That is, a virtual cassette ID is created for the lot ID of the lot within the same first cassette, and the lot ID of the lot within the first cassette is bound with the virtual cassette ID.

The virtual pod ID includes a plurality of code bits, which in one embodiment include a lot code, an incoming lot number, a storage address code, and a lot number identification. The material code, that is, the first wafer box code, may correspond to one or more code bits. The lot number indicates the lot that provides the first pod to the FAB, e.g., FAB a, FAB C, FAB D, etc., and may correspond to one or more code bits. The storage address code has a third mapping relationship with the physical storage position of the first wafer cassette in the warehouse when the first wafer cassette is stored in the warehouse of the FAB, that is, the storage address corresponds to the physical storage position of the first wafer cassette in the warehouse of the FAB, and the storage address code may correspond to one or more code bits. The lot number identifier indicates a lot number of wafers within the first cassette, and the lot number identifier may correspond to one or more code bits.

In the embodiment shown in table one below, the virtual pod ID contains 9 code bits, wherein the first code bit represents the material code, i.e., the first pod code, the second and third code bits represent the incoming lot number, which may be 01-99, the fourth through seventh code bits represent the storage address, which may be 0001-9999, and the eighth and ninth code bits represent the number of lots in the first pod, which may be 1-25.

List one

For example, a virtual cassette ID of F01222202, which indicates that the first cassette is coded as F, the lot number is 01, the storage address is 2222, and the number of lots in the first cassette is 2.

Of course, the virtual wafer box ID is not limited to include 9 code bits, where the arrangement order of the codes corresponding to the information of the material code, the incoming material factory number, the storage address, the number of batches in the first wafer box in the virtual wafer box ID and the number of the corresponding code bits can be adjusted according to the actual requirement, for example, the fourth to eighth code bits represent the storage address, the storage address code can be 00001 to 99999 at this time, the ninth code bit represents the number of batches in the first wafer box, and the number of batches can be 1 to 9 at this time.

In the foregoing embodiment, the virtual pod ID includes a material code, an incoming material factory number, a storage address code, and a lot number identifier, so that the virtual pod ID can be used to obtain the first pod, the wafer factory providing the first pod, the physical storage location of the first pod in the warehouse of the FAB, and the lot number of the first pod, so as to track and verify the related condition of the first pod, for example, track the storage location of the first pod in the warehouse of the FAB, confirm the incoming material factory of the first pod, verify the lot number of the first pod, and so on. And, the virtual wafer box ID contains a storage address code, and when the FAB warehouse receives the first wafer box, the physical storage position of the first wafer box can be determined directly based on the storage address code in the virtual wafer box ID without redefining the physical storage position of the first wafer box.

Of course, in some embodiments, the composition of the virtual pod ID may be simplified, e.g., the virtual pod ID contains only the material code, the deposit address code, and the incoming material factory number; for another example, the virtual wafer cassette ID contains only material codes, storage address codes, and lot number identifiers; for another example, the virtual wafer cassette ID contains only material codes, lot numbers, and lot number identifications; for another example, the virtual wafer cassette ID contains only the material code and the storage address code; for another example, the virtual cassette ID contains only the lot code and the lot number; for another example, the virtual cassette ID contains only material codes and lot number identifications; even further, the virtual pod ID may contain only material codes.

In step S330, the first accounting data corresponding to the wafer lot ID is converted into the second accounting data.

The first accounting data corresponding to the wafer lot ID may include a wafer lot ID, a wafer ID, a product ID, a final step ID, a final contamination level, a photoresist tag, a wafer back-etching code, and the like. In step S330, the first account data corresponding to the wafer lot ID is converted into the second account data, that is, the data that cannot be recognized by the MES system of the FAB in the first account data is converted into the data that can be recognized by the MES system of the FAB, including, but not limited to, the wafer lot ID (hereinafter referred to as the first wafer lot ID), the wafer ID (hereinafter referred to as the first wafer ID), the product ID (hereinafter referred to as the first product ID), the final step ID (hereinafter referred to as the first final step ID), the final contamination level (hereinafter referred to as the first final contamination level), the photoresist label (hereinafter referred to as the first photoresist label), the wafer lot ID (hereinafter referred to as the second wafer lot ID) that can be recognized by the MES system of the FAB in the first account data, the product ID (hereinafter referred to as the second product ID), the final step ID (hereinafter referred to as the second final step ID), the final contamination level (hereinafter referred to as the second final contamination level), the second photoresist label, and the like.

The wafer lot ID and the wafer ID carry information such as a serial number, and the MES systems of different FAB factories have different generation rules for the wafer lot ID and the wafer ID, and the wafer lot ID and the wafer ID need to be converted based on the generation rules defined by the MES systems of FAB. Thus, in one embodiment, converting the first wafer lot ID to the second wafer lot ID includes: and acquiring a generation rule of the MES system of the FAB on the wafer lot ID, and converting the first wafer lot ID into the second wafer lot ID based on the generation rule of the MES system of the FAB on the wafer lot ID. Converting the first wafer ID to the second wafer ID includes: and acquiring a generation rule of the MES system of the FAB on the wafer ID, and converting the first wafer ID into the second wafer ID based on the generation rule of the MES system of the FAB on the wafer ID.

In an embodiment, after converting the first wafer ID into the second wafer ID, a repetition check of the wafer ID is further performed, where the repetition check of the wafer ID includes: acquiring a wafer ID stored in an MES system of the FAB; optionally, the wafer IDs stored in the MES system for obtaining the FAB are all the wafer IDs stored in the MES system for obtaining the FAB; determining whether the wafer ID stored in the MES system of the FAB and the second wafer ID obtained by conversion are repeated; if the wafer ID which is repeated with the second wafer ID obtained by conversion exists in the wafer ID stored in the MES system of the FAB, modifying the generation rule of the wafer ID, and converting the first wafer ID into the second wafer ID again until the second wafer ID obtained by conversion is not repeated with the wafer ID stored in the MES system of the FAB. Therefore, the fact that the second wafer ID obtained finally is repeated with the wafer ID stored in the MES system of the FAB is avoided, and errors are caused.

In one embodiment, after converting the first wafer lot ID to the second wafer lot ID, a further performing a repetition check of the wafer lot ID includes: acquiring a wafer batch ID stored in an MES system of the FAB; optionally, the wafer lot IDs stored in the MES system for obtaining the FAB are all wafer lot IDs stored in the MES system for obtaining the FAB; determining whether the wafer lot ID stored in the MES system of the FAB and the converted second wafer lot ID are repeated; if the wafer lot ID which is repeated with the second wafer lot ID obtained by conversion exists in the wafer lot ID stored in the MES system of the FAB, modifying the generation rule of the wafer lot ID, and converting the first wafer lot ID into the second wafer lot ID again until the second wafer lot ID obtained by conversion is not repeated with the wafer lot ID stored in the MES system of the FAB. Thus, the repetition of the finally obtained second wafer lot ID and the wafer lot ID stored in the MES system of the FAB is avoided, and errors are caused.

In one embodiment, as shown in fig. 4, the wafer lot ID and wafer ID conversion process includes the steps of: the data receiving module transmits the first account material data corresponding to the wafer lot ID to the data conversion module, and the established wafer ID and the generation rule of the wafer lot ID are transmitted to the data conversion module; the data conversion module converts the first wafer ID and the first wafer batch ID in the first account material data into a second wafer ID and a second wafer batch ID based on the generation rule; then automatically grabbing the wafer ID and the wafer lot ID stored in the MES system of the FAB, and checking whether the second wafer ID obtained by conversion is repeated with the grabbed wafer ID and whether the second wafer lot ID obtained by conversion is repeated with the grabbed wafer lot ID; if the wafer ID or the wafer lot ID is repeated, the corresponding generation rule is modified, then the second wafer ID or the second wafer lot ID is regenerated according to the modified generation rule, if the wafer ID or the wafer lot ID is not repeated, the FAB wafer ID and the wafer lot ID are successfully created, the conversion process of the wafer lot ID and the wafer ID is ended, and the result information is transmitted to the wafer offline module.

If the wafer ID and the wafer lot ID use the common generation rule, it is necessary to check whether the second wafer ID obtained by conversion is repeated with the wafer ID or the wafer lot ID obtained by grabbing, and whether the second wafer lot ID obtained by conversion is repeated with the wafer ID or the wafer lot ID obtained by grabbing, if any ID is repeated, the common generation rule is modified, and the second wafer ID and the second wafer lot ID are regenerated according to the modified common generation rule.

The product ID and the final step ID do not carry information such as a running water code, and the corresponding product IDs have the same meaning between the MES system of the FAB and the MES system of the FAB a, and the corresponding final step IDs have the same meaning, except for specific naming, so in an embodiment, the conversion between the product ID and the final step ID is performed based on a preset mapping relationship table. That is, converting the first product ID to the second product ID includes: and converting the first product ID in the first account material data corresponding to the wafer batch ID into a second product ID based on a preset mapping relation table. Converting the first final step ID to the second final step ID includes: and converting the first final step ID in the first account material data corresponding to the wafer batch ID into a second final step ID based on a preset mapping relation table. Based on the conversion of the preset mapping relation table, the conversion of the product ID and the final step ID is simple and is not easy to make mistakes.

Of course, the product ID and the final step ID may be converted in other manners, such as by a set generation rule.

The final contamination level and the photoresist label have a correspondence relationship with the final step ID, and after the final step ID is determined, the final contamination level and the photoresist label can be known. Thus, in one embodiment, there is a final contamination level (hereinafter referred to as a second final contamination level) and a photoresist tag (hereinafter referred to as a second photoresist tag) that can be identified by the MES system that generates the FAB based on the second final step ID. In this embodiment, the second final contamination level and the second photoresist label are generated directly based on the second final step ID without converting the first final contamination level and the first photoresist label in the first ledger data. Of course, in other embodiments, a conversion rule may be set, and the first final contamination level in the first accounting data and the first photoresist label are converted into the second final contamination level and the second photoresist label that can be identified by the MES system of the FAB based on the conversion rule. Wherein the photoresist label indicates the presence or absence of photoresist.

In an embodiment, after generating the second final contamination level and the second photoresist label based on the second final step ID, the steps of: checking whether a second final pollution level and a second photoresist label generated based on the second final step ID and a first final pollution level and a first photoresist label in the first account material data accord with a preset consistency relation, if so, taking the generated second final pollution level and the second photoresist label as final determined final pollution level and photoresist label, and if not, considering that the second final pollution level and the second photoresist label generate errors, and generating alarm information for processing through manual intervention. And verifying whether the second final pollution level and the second photoresist label generated based on the second final step ID and the first final pollution level and the first photoresist label in the first account material data accord with a preset consistency relation or not to ensure that the determined second final pollution level and the second photoresist label can be identified by the MES system of the FAB and correspond to the first final pollution level and the first photoresist label in the first account material data. It will be appreciated that the predetermined consistency relationship in this embodiment means that the generated second final contamination level corresponds to the first final contamination level in the first accounting data, and the generated second photoresist label corresponds to the first photoresist label in the first accounting data.

FIG. 5 is a flowchart showing the product ID, final step ID, final contamination level, and photoresist label switching steps according to one embodiment of the present application, as shown in FIG. 5, comprising the steps of: the method comprises the steps that a first product ID and a first final step ID in first account material data are transmitted to a data conversion module, and a preset mapping relation table established in advance is transmitted to the data conversion module; the data conversion module converts the first product ID and the first final step ID in the first account material data into a second product ID and a second final step ID based on a preset mapping relation table; and generating a final contamination level (second final contamination level) and a photoresist tag (second photoresist tag) recognizable by the MES system of the FAB based on the second final step ID; and then, checking whether the final pollution level and the final pollution level (first final pollution level) and the photoresist label (first photoresist label) in the data of the final material based on the second final step ID meet a preset consistency relation, if so, using the generated final pollution level and the photoresist label as the final determined final pollution level and photoresist label, successfully creating the data, transmitting result information to a wafer offline module, and if not, indicating that information errors exist, generating alarm information, and performing manual intervention.

The data table corresponding to the first accounting data and the second accounting data is shown in fig. 6, in which items (item), wafer Lot ID (Lot ID), product ID (Product ID), wafer ID (Wafer ID), final step ID (Final step ID) of FAB a, final contamination level of FAB a (Final Contamination level), final step ID (To step ID) readable by the FAB MES after the first accounting data translation, final contamination level readable by the FAB MES after the first accounting data translation (To Contamination level), photoresist tag (PR flag), and Wafer back-etching (Wafer T7 code) of the FAB are listed as examples. The wafer back-etching code is an identity mark arranged on the back surface of the wafer, and the wafer back-etching code is not required to be converted in practice. It will be appreciated that the first accounting data and the second accounting data may also include other data, such as wafer lot ID, wafer ID, product ID, final step ID, final contamination level, photoresist label, wafer back-side lithography, etc., as examples only.

In step S340, when the wafer offline instruction is received, a wafer lot ID corresponding to the offline wafer lot ID in the wafer offline instruction is determined, a corresponding virtual wafer box ID is determined based on the first mapping relationship and the offline wafer lot ID corresponding to the offline wafer lot ID, and all wafer lot IDs corresponding to the determined virtual wafer box ID based on the first mapping relationship are used as target offline wafer lot IDs.

The wafer offline instruction may be an manually input operation instruction, which includes an offline wafer lot ID that needs to be offline. The offline lot ID corresponds to one or more of the total lot IDs obtained in step S310. After determining the wafer lot ID corresponding to the offline wafer lot ID, the virtual wafer box ID corresponding to the offline wafer lot ID may be determined according to the first mapping relationship between the wafer lot ID and the virtual wafer box ID.

The wafer offline instruction may include all wafer lot IDs corresponding to the same virtual wafer box ID, or may include only one or some wafer lot IDs corresponding to the virtual wafer box ID, in this embodiment, all wafer lot IDs corresponding to the determined virtual wafer box ID are taken as target offline wafer lot IDs to perform wafer offline, so that all wafer lots in the same first wafer box can be automatically offline, without manually checking whether there is an unrelieved wafer lot in the first wafer box again, and performing the offline of all wafer lots in the first wafer box for a second time, thereby reducing manual participation and improving overall wafer flow efficiency.

In step S350, second accounting data corresponding to the target offline lot ID is determined, a second mapping relationship between the target offline lot ID and the second wafer cassette is constructed based on the target offline lot ID and the second accounting data corresponding to the target offline lot ID, and the target offline lot ID and the second mapping relationship are output to the manufacturing execution system (i.e., the MES system of the FAB), so that the manufacturing execution system can control the execution device to transfer the target offline lot corresponding to the target offline lot ID to the corresponding second wafer cassette based on the second mapping relationship and execute the processing procedure based on the second accounting data corresponding to the target offline lot ID.

The second account data corresponding to the target offline lot ID is determined, and as described above, the target offline lot ID is one or more lot IDs among all the lot IDs acquired in step S310, and the items of the second account data include the lot ID items, so that the corresponding second account data can be determined after the target offline lot ID is acquired.

The method comprises the steps of constructing a second mapping relation between the target offline wafer lot ID and a second wafer cassette based on second account material data corresponding to the target offline wafer lot ID and the target offline wafer lot ID, and determining a final pollution level and constructing the mapping relation, wherein the final pollution level determining step is as follows: determining a final pollution level corresponding to the target offline wafer lot ID based on the second account data corresponding to the target offline wafer lot ID; the mapping relation construction step is as follows: and constructing a second mapping relation between the target offline wafer lot ID and the second wafer cassette based on the final pollution level corresponding to the target offline wafer lot ID.

As described in the foregoing step S330, the second accounting data includes the final contamination level, and in the final contamination level determining step, the final contamination level corresponding to the target offline lot ID is determined based on the second accounting data corresponding to the target offline lot ID.

Wafer lots of different final contamination levels need to be transferred to a second wafer cassette of a different type to avoid contamination of the wafers. In the mapping relation construction step, a second mapping relation between the target offline wafer lot ID and the second wafer cassette is constructed based on the final pollution level corresponding to the target offline wafer lot ID and the class of the second wafer cassette. Wherein a second cassette corresponds to only one lot, and a lot also corresponds to only one second cassette. Illustratively, the second mapping relationship is: the wafer lot with the final contamination level a corresponds to a class a second wafer cassette, the wafer lot with the final contamination level B corresponds to a class B second wafer cassette, the wafer lot with the final contamination level C corresponds to a class C second wafer cassette, and so on.

Outputting the target offline wafer lot ID and the second mapping relationship to the manufacturing execution system, that is, generating the wafer lot transfer work order, after the MES system of the FAB receives the input wafer lot transfer work order, controlling the execution device based on the second mapping relationship in the wafer lot transfer work order, for example sorter, to transfer the target offline wafer lot corresponding to the target offline wafer lot ID in the wafer lot transfer work order to the corresponding second wafer box, and executing the processing procedure based on the second account data corresponding to the target offline wafer lot ID in the wafer lot transfer work order, for example, performing the processing procedure next to the final step corresponding to the second final step ID in the second account data.

In one embodiment, as shown in fig. 7, the offline process of the target offline wafer lot ID includes the steps of: the wafer offline module receives a first mapping relation between the virtual wafer cassette ID and the wafer lot ID and the input offline wafer lot ID; the wafer offline module determines a virtual wafer cassette ID corresponding to the offline wafer lot ID according to the first mapping relation, and takes all wafer lot IDs corresponding to the determined virtual wafer cassette ID as target offline wafer lot IDs; determining second account material data corresponding to the target offline wafer lot ID; constructing a second mapping relation between the target offline wafer lot ID and a second wafer cassette based on the target offline wafer lot ID and second accounting data corresponding to the target offline wafer lot ID; outputting the target offline wafer lot ID and the second mapping relationship to the MES system of the FAB.

In summary, the present application firstly creates a virtual wafer box ID for the acquired wafer lot ID of the wafer lot in the first wafer box, and automatically converts the first accounting data corresponding to the wafer lot ID into the second accounting data, because the virtual wafer box ID has the first mapping relationship with the wafer lot ID of the wafer lot in the first wafer box, when a wafer offline instruction is received, the virtual wafer box ID corresponding to the wafer lot ID corresponding to the offline wafer lot ID in the wafer offline instruction can be determined, and the determined virtual wafer box ID is used as the target offline wafer lot ID based on all wafer lot IDs corresponding to the first mapping relationship, and the second mapping relationship between the target offline wafer lot ID and the second wafer box is constructed according to the second accounting data corresponding to the target offline wafer lot ID, and the second mapping relationship and the target offline wafer lot ID are output to the manufacturing execution system, so that the manufacturing execution system can control the execution device to transfer the wafer lot ID corresponding to the wafer lot corresponding to the target offline wafer lot based on the second mapping relationship and the target offline wafer lot ID and execute the processing procedure. The account data conversion step and the wafer offline step both reduce manual participation, can improve the overall wafer-feeding efficiency, reduce human errors, simultaneously realize the automatic offline of all wafer batches in the same first wafer box in the offline step, and further reduce manual participation and improve the overall wafer-feeding efficiency without manually checking whether the wafer batches which are not offline exist in the first wafer box again and performing the offline of all wafer batches in the first wafer box for the second time.

It should be noted that, in the above embodiment, steps S310 to S350 are not only performed in the order shown in fig. 3, but in some embodiments, the order of performing steps may be exchanged, for example, step S330 is performed first, step S320 is performed, or steps S320 and S330 are performed simultaneously.

In some embodiments, after step S320, the method further includes a step of writing the virtual pod ID to the first pod, the step of writing the virtual pod ID to the first pod including: writing the virtual wafer box ID to a first wafer box corresponding to the virtual wafer box ID. Wherein the virtual pod ID written to the first pod can be read by the MES system of the FAB. Therefore, before the MES system of the FAB can be configured to transfer the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer box, the virtual wafer box ID of the first wafer box is read first, if the read virtual wafer box ID is consistent with the virtual wafer box ID corresponding to the target offline wafer lot ID, the control execution equipment is executed to transfer the target offline wafer lot corresponding to the target offline wafer lot ID from the first wafer box to the corresponding second wafer box, and if the read virtual wafer box ID is inconsistent with the virtual wafer box ID corresponding to the target offline wafer lot ID, an alarm can be given to ensure that the wafer lot in the correct first wafer box is transferred.

Optionally, writing the virtual wafer box ID to the first wafer box corresponding to the virtual wafer box ID, so as to store the virtual wafer box ID into an electronic element in the first wafer box, where the information stored in the electronic element can be read by the MES system of the FAB, and the electronic element is, for example, an RFID electronic tag; or generating an identification code based on the virtual wafer box ID, and attaching the identification code to the first wafer box corresponding to the virtual wafer box ID.

In some embodiments, after step S320, the method further includes a step of sending the virtual pod ID, where the step of sending the virtual pod ID includes: the virtual pod ID is sent to the FAB's warehouse system to cause the FAB's warehouse system to determine a physical deposit location corresponding to the deposit address code. Therefore, when the FAB warehouse receives the first wafer box, the physical storage position of the first wafer box can be determined directly based on the storage address code in the virtual wafer box ID, and the first wafer box is stored to the physical storage position without redefining the physical storage position of the first wafer box.

Further, after the target offline lot ID is determined, the target offline lot ID is further transmitted to the warehouse system of the FAB, so that the warehouse system of the FAB searches for the virtual wafer box ID corresponding to the target offline lot ID, and determines the physical storage position of the first wafer box corresponding to the target offline lot ID in the warehouse of the FAB based on the virtual wafer box ID, so as to further take out the first wafer box corresponding to the target offline lot ID from the warehouse of the FAB, without manually searching for the first wafer box corresponding to the target offline lot ID in the warehouse of the FAB.

In some embodiments, after step S350, the wafer shipment step further includes: when a wafer shipment instruction is received, determining shipment wafer lot IDs in the wafer shipment instruction, the number of wafers in shipment lot wafers corresponding to the shipment wafer lot IDs and final pollution level data corresponding to the shipment wafer lot IDs; and determining a batch combination scheme with the least number of third wafer cassettes according to a pollution matching rule based on the shipment wafer batch ID, the number of wafers in the shipment wafer batch corresponding to the shipment wafer batch ID and final pollution level data corresponding to the shipment wafer batch ID, constructing a fourth mapping relation between the shipment wafer batch ID and the third wafer cassettes based on the batch combination scheme, and outputting the shipment wafer batch ID and the fourth mapping relation to a manufacturing execution system so that the manufacturing execution system can control execution equipment to transmit the shipment wafer batch corresponding to the shipment wafer batch ID to the corresponding third wafer cassettes based on the fourth mapping relation. The final pollution level data corresponding to the different shipment wafer lot IDs in the same lot combination in the determined lot combination scheme are matched, so that the mutual pollution among the wafer lots is avoided.

The wafer shipment instruction may be a manually input operation instruction, which includes a shipment wafer lot ID that needs to be shipped. The shipment lot ID may be selected from one or some of the target offline lot IDs in the step S350, that is, the lot ID obtained in the step S310, and of course, the shipment lot ID may be a lot ID other than the target offline lot ID in the step S350.

The third wafer cassettes may be FOSBs, each of the third wafer cassettes may store 1-25 wafers, and wafers of a same wafer lot may only be stored in the same third wafer cassette, according to the shipment wafer lot ID, the number of wafers in the shipment wafer lot corresponding to the shipment wafer lot ID, the number of wafers that each of the third wafer cassettes may store, and the determined lot combination scheme with the minimum number of third wafer cassettes, a fourth mapping relationship between the shipment wafer lot ID and the third wafer cassette may be constructed, and further output the shipment wafer lot ID and the fourth mapping relationship to the MES system of the FAB, and the MES system of the FAB may automatically control the executing device to transfer the shipment wafer lot corresponding to the shipment wafer lot ID to the corresponding third wafer cassette based on the shipment wafer lot ID and the fourth mapping relationship, so as to implement automatic shipment of the wafers, and reduce labor.

Fig. 8 shows an embodiment of a wafer Lot combination scheme determination, where (a) in fig. 8 shows the shipment Lot ID (Lot ID), the number of wafers (WaferQty) corresponding to the shipment Lot ID, and the final contamination level (Contaminationlevel), and (b) in fig. 8 shows the contamination matching rule, where the shipment Lot with the same final contamination level matches, that is, the shipment Lot stored in the same third wafer cassette can be combined to avoid the mutual contamination between the wafer lots, some of the shipment lots with different final contamination levels match, that is, the shipment Lot with the final contamination level a can be combined to avoid the mutual contamination between the wafer lots, that is, the shipment Lot with the final contamination level E matches the shipment Lot with the final contamination level D, and (C) in fig. 8 shows the combination scheme of the determined Lot with the minimum number of third wafer cassettes. In the embodiment shown in fig. 8, the shipment lot ID PP00001, PP00002, PP00003 corresponds to a third wafer cassette, the shipment lot ID PP00004 corresponds to a third wafer cassette, the shipment lot ID PP00005 corresponds to a third wafer cassette, the shipment lot ID PP00006, PP00007 corresponds to a third wafer cassette, the shipment lot ID PP00008 corresponds to a third wafer cassette, and finally, 8 wafer lots are combined into 5 third wafer cassettes. In addition, the problem that too much human resources are consumed in a manual discharging mode is avoided without manual participation, and wafer pollution caused by putting wafer batches of different pollution levels which are not suitable to be placed together into the same third wafer box due to manual errors is avoided.

In one embodiment, further, after determining the lot combination scheme with the least number of third cassettes, before transferring the shipment lot corresponding to the shipment lot ID to the corresponding third cassettes, the lot combination scheme determination step further includes: generating a batch combination scheme confirmation window; when receiving the batch combination scheme confirmation information input in the batch combination scheme confirmation window, executing the step of constructing a fourth mapping relation between the shipment wafer batch ID and the third wafer cassette based on the batch combination scheme and outputting the fourth mapping relation to the manufacturing execution system; and when receiving the batch combination scheme changing instruction input in the batch combination scheme confirmation window, changing the batch combination scheme based on the batch combination scheme changing instruction, and executing or re-executing the batch combination scheme based on the changed batch combination scheme, constructing a fourth mapping relation between the shipment wafer batch ID and the third wafer cassette, and outputting the fourth mapping relation to the manufacturing execution system.

In some embodiments, the step of directly executing the fourth mapping relationship between the lot ID of the shipment wafer and the third wafer cassette based on the lot combination scheme may be performed without receiving the lot combination scheme confirmation information, and the step of outputting the fourth mapping relationship to the manufacturing execution system after receiving the lot combination scheme confirmation information, or even directly constructing the fourth mapping relationship and outputting the fourth mapping relationship to the manufacturing execution system, generating the trigger command after receiving the lot combination scheme confirmation information, and configuring the manufacturing execution system to execute the step of transmitting the shipment wafer lot to the corresponding third wafer cassette after receiving the trigger command.

Optionally, when the batch combination scheme change request is received, displaying the batch combination scheme with the least number of third cassettes based on the batch combination scheme change request, and when the batch combination scheme change information based on the batch combination scheme with the least number of third cassettes is received, modifying the batch combination scheme with the least number of third cassettes based on the batch combination scheme change information to obtain a modified batch combination scheme; or when receiving the batch combination scheme changing request, displaying a batch combination scheme input window, and taking the batch combination scheme input by the batch combination scheme input window as a changed batch combination scheme. It can be understood that the step of re-executing the lot combination scheme based on the changed lot combination scheme to construct a fourth mapping relationship between the lot ID of the shipment wafer and the third wafer cassette and output the fourth mapping relationship to the manufacturing execution system refers to the step of executing the fourth mapping relationship between the lot ID of the shipment wafer and the third wafer cassette according to the changed lot combination scheme and outputting the fourth mapping relationship to the manufacturing execution system after the fourth mapping relationship between the lot ID of the shipment wafer and the third wafer cassette has been constructed. It is understood that the technical scheme of inputting the lot combination scheme confirmation or modification information in the lot combination scheme confirmation window before the manufacturing execution system of the FAB controls the execution apparatus to transfer the shipment lot corresponding to the shipment lot ID to the corresponding third wafer cassette based on the fourth mapping relationship is within the scope of the present application. By setting the batch combination scheme confirmation window, personalized requirements can be better met.

In one embodiment, as shown in fig. 9, the wafer shipment step includes: step S910, the wafer shipment module obtains the input shipment wafer lot ID, the number of wafers in the shipment wafer lot corresponding to each shipment wafer lot ID, and the final contamination level corresponding to the shipment wafer lot ID; step S920, the wafer shipment module obtains pollution matching rules set in advance; step S930, determining a lot combination scheme using the least number of third wafer cassettes based on the shipment lot IDs, the number of wafers in the shipment lot corresponding to each shipment lot ID, the final contamination level data corresponding to the shipment lot ID, and the contamination matching rule; step S940, generating a batch combination scheme confirmation window, receiving input batch combination scheme confirmation information or batch combination scheme changing instructions, obtaining a confirmed batch combination scheme based on the confirmation information or changing the batch combination scheme based on the batch combination scheme changing instructions so as to obtain a changed batch combination scheme; step S950, according to the confirmed or changed batch combination scheme, a fourth mapping relation between the shipment wafer batch ID and the third wafer cassette is constructed, and a wafer transfer work order containing the shipment wafer batch ID and the fourth mapping relation is created; in step S960, the wafer transfer work order is output to the MES system of the FAB, so that the MES system of the FAB can transfer the shipment wafer lot corresponding to the shipment wafer lot ID to the corresponding third wafer cassette based on the wafer transfer work order.

It should be noted that, in the above embodiment, the steps S910 to S960 are not only performed in the order shown in fig. 9, and in some embodiments, the order of performing some steps may be exchanged, for example, step S920 is performed first, step S910 is performed subsequently, or steps S910 and S920 are performed simultaneously.

Referring to fig. 10, the present embodiment provides a wafer cross-factory flow apparatus 1000, where the wafer cross-factory flow apparatus 1000 mainly includes a data receiving module 1001, a data converting module 1002, and a wafer offline module 1003. Optionally, a wafer shipment module 1004 is also included.

The data receiving module 1001 is configured to obtain a lot ID of a lot in the first wafer cassette and create a virtual wafer cassette ID, where the virtual wafer cassette ID has a first mapping relationship with the lot ID of the lot in the first wafer cassette.

In one embodiment, the data receiving module 1001 is configured to send the virtual pod ID to the warehouse system to cause the warehouse system to determine a physical storage location corresponding to the storage address code to store the first pod to the physical storage location within the warehouse corresponding to the storage address code.

The data conversion module 1002 is configured to convert the first accounting data corresponding to the wafer lot ID into the second accounting data.

In an embodiment, the data conversion module 1002 may obtain a generation rule of the wafer lot ID and the wafer ID by the manufacturing execution system, where the data conversion module 1002 is configured to convert, based on the generation rule, a first wafer ID in the first accounting data corresponding to the wafer lot ID into the second wafer ID, and convert the first wafer lot ID in the first accounting data corresponding to the wafer lot ID into the second wafer lot ID.

In an embodiment, the data conversion module 1002 is configured to obtain the wafer ID and the wafer lot ID stored in the manufacturing execution system after converting the first wafer ID in the first accounting data corresponding to the wafer lot ID into the second wafer ID and converting the first wafer lot ID in the first accounting data corresponding to the wafer lot ID into the second wafer lot ID; determining whether the stored wafer ID and the second wafer ID are repeated, and whether the stored wafer lot ID and the second wafer lot ID are repeated; if the stored wafer ID has the wafer ID which is repeated with the second wafer ID, modifying the generation rule, and converting the first wafer ID in the first account material data into the second wafer ID again until the stored wafer ID does not have the wafer ID which is repeated with the second wafer ID; if the stored wafer lot ID has the wafer lot ID which is repeated with the second wafer lot ID, modifying the generation rule, and converting the first wafer lot ID in the first account material data into the second wafer lot ID again until the stored wafer lot ID has no wafer lot ID which is repeated with the second wafer lot ID.

In an embodiment, the data conversion module 1002 is configured to convert a first product ID in the first accounting data corresponding to the wafer lot ID into a second product ID based on a preset mapping relationship table, and convert a first final step ID in the first accounting data corresponding to the wafer lot ID into a second final step ID.

In one embodiment, the data conversion module 1002 is configured to generate a second final contamination level and a second photoresist label based on the second final step ID; verifying whether the final pollution level and the photoresist label generated based on the second final step ID meet a preset consistency relation with the first final pollution level and the first photoresist label in the first account material data; if the consistency relation does not accord with the preset consistency relation, generating alarm information.

The wafer offline module 1003 is configured to determine, when receiving a wafer offline instruction, a wafer lot ID corresponding to an offline wafer lot ID in the wafer offline instruction, determine a corresponding virtual wafer box ID based on a first mapping relationship and the wafer lot ID corresponding to the offline wafer lot ID, take all wafer lots corresponding to the determined virtual wafer box ID based on the first mapping relationship as target offline wafer lot IDs, determine second account material data corresponding to the target offline wafer lot ID, construct a second mapping relationship between the target offline wafer lot ID and the second wafer box based on the second account material data corresponding to the target offline wafer lot ID and the target offline wafer lot ID, and output the target offline wafer lot ID and the second mapping relationship to the manufacturing execution system, so that the manufacturing execution system can control the execution device to transfer the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer box based on the second mapping relationship and execute the processing procedure based on the second account material data corresponding to the target offline wafer lot ID.

In one embodiment, the wafer offline module 1003 is configured to determine a final contamination level corresponding to the target offline wafer lot ID based on the second accounting data corresponding to the target offline wafer lot ID; and constructing a second mapping relation between the target offline wafer lot ID and the second wafer cassette based on the final pollution level corresponding to the target offline wafer lot ID.

In one embodiment, the wafer offline module 1003 is configured to transmit the target offline lot ID to the warehouse system, so that the warehouse system searches for a virtual wafer cassette ID corresponding to the target offline lot ID, and determines a physical storage location of the first wafer cassette in the warehouse corresponding to the target offline lot ID based on the virtual wafer cassette ID.

In an embodiment, the wafer shipment module 1004 is configured to determine, when a wafer shipment instruction is received, a shipment wafer lot ID in the wafer shipment instruction, a number of wafers in a shipment wafer lot corresponding to the shipment wafer lot ID, and final contamination level data corresponding to the shipment wafer lot ID, and determine, according to a contamination matching rule, a lot combination scheme with a minimum number of third wafer cassettes based on the shipment wafer lot ID, the number of wafers in the shipment wafer lot corresponding to the shipment wafer lot ID, and the final contamination level data corresponding to the shipment wafer lot ID; and based on a batch combination scheme with the least number of the third wafer cassettes, a fourth mapping relation between the shipment wafer batch ID and the third wafer cassettes is constructed, and the shipment wafer batch ID and the fourth mapping relation are output to a manufacturing execution system, so that the manufacturing execution system can control the execution equipment to transmit the shipment wafer batch corresponding to the shipment wafer batch ID to the corresponding third wafer cassettes based on the shipment wafer batch ID and the fourth mapping relation. The final pollution level data corresponding to the different shipment wafer lot IDs in the same lot combination in the determined lot combination scheme are matched, so that the mutual pollution among the wafer lots is avoided.

In one embodiment, the wafer shipment module 1004 is configured to generate a lot combination plan confirmation window after determining the lot combination plan with the least number of third cassettes and before transferring the shipment wafer lot corresponding to the shipment wafer lot ID to the corresponding third cassette; when receiving the batch combination scheme confirmation information input in the batch combination scheme confirmation window, executing the step of constructing a fourth mapping relation; and when receiving the batch combination scheme changing instruction input in the batch combination scheme confirmation window, changing the batch combination scheme based on the batch combination scheme changing instruction, executing or re-executing the batch combination scheme based on the changed batch combination scheme, constructing a fourth mapping relation and outputting the fourth mapping relation to the manufacturing execution system.

In an embodiment, the wafer cross-factory wafer apparatus 1000 may further include an ID writing module, where the ID writing module is configured to write the virtual wafer cassette ID to the corresponding first wafer cassette. Wherein the virtual pod ID written to the first pod can be read by the manufacturing execution system.

The implementation process of the functions and actions of each module in the wafer cross-factory flow apparatus 1000 is specifically shown in the implementation process of the corresponding steps in the wafer cross-factory flow method, and will not be described herein again.

Referring to fig. 11, the present embodiment provides an electronic device 1100, where the electronic device 1100 includes one or more processors 1101 and a memory 1102, and the memory 1102 is configured to store one or more programs, and when the one or more programs are executed by the one or more processors 1101, the electronic device 1100 implements a wafer cross-factory flow method of the present application.

FIG. 12 is a block diagram of a computer system for implementing some embodiments of the application, it should be noted that the computer system shown in FIG. 12 is merely an example and should not be construed as limiting the functionality or scope of use of embodiments of the application.

As shown in fig. 12, the computer system 1200 includes a CPU (Central Processing Unit ) 1201, which can perform various appropriate actions and processes, such as performing the wafer cross-factory streaming method in the above-described embodiment, according to a program stored in a ROM (Read-Only Memory) 1202 or a program loaded from a storage portion 1208 into a RAM (Random Access Memory ) 1203. In the RAM 1203, various programs and data required for the system operation are also stored. The CPU 1201, ROM 1202, and RAM 1203 are connected to each other through a bus 1204. An I/O (Input/Output) interface 1205 is also connected to bus 1204.

The following components are connected to the I/O interface 1205: an input section 1206 including a keyboard, a mouse, and the like; an output portion 1207 including a CRT (Cathode Ray Tube), an LCD (Liquid CRYSTAL DISPLAY), and the like, and a speaker, and the like; a storage section 1208 including a hard disk or the like; and a communication section 1209 including a network interface card such as a LAN (Local Area Network ) card, a modem, or the like. The communication section 1209 performs communication processing via a network such as the internet. The drive 1210 is also connected to the I/O interface 1205 as needed. A removable medium 1211 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, or the like is installed as needed on the drive 1210 so that a computer program read out therefrom is installed into the storage section 1208 as needed.

In particular, according to embodiments of the present application, the processes described above with reference to flowcharts may be implemented as computer software programs. For example, embodiments of the present application include a computer program product comprising a computer program embodied on a computer readable medium, the computer program comprising a computer program for performing all or a portion of the steps shown in the flow chart of a wafer cross-factory flow method. In such an embodiment, the computer program can be downloaded and installed from a network via the communication portion 1209, and/or installed from the removable media 1211. When executed by a Central Processing Unit (CPU) 1201, performs the various functions defined in the system of the present application.

It should be noted that, the computer readable medium shown in the embodiments of the present application may be a computer readable signal medium or a computer readable storage medium, or any combination of the two. The computer readable storage medium can be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or a combination of any of the foregoing. More specific examples of the computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-Only Memory (ROM), an erasable programmable read-Only Memory (Erasable Programmable Read Only Memory, EPROM), a flash Memory, an optical fiber, a portable compact disc read-Only Memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. In the present application, however, a computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, with a computer-readable computer program embodied therein. Such a propagated data signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination of the foregoing. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. A computer program embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wired, etc., or any suitable combination of the foregoing.

The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. Where each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams or flowchart illustration, and combinations of blocks in the block diagrams or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

The units involved in the embodiments of the present application may be implemented by software, or may be implemented by hardware, and the described units may also be provided in a processor. Wherein the names of the units do not constitute a limitation of the units themselves in some cases.

As another aspect, the present application also provides a computer-readable medium that may be contained in the electronic device described in the above embodiment; or may exist alone without being incorporated into the electronic device. The computer-readable medium carries one or more programs which, when executed by one of the electronic devices, cause the electronic device to implement the methods of the above-described embodiments.

It should be noted that although in the above detailed description several modules or units of a device for action execution are mentioned, such a division is not mandatory. Indeed, the features and functions of two or more modules or units described above may be embodied in one module or unit in accordance with embodiments of the application. Conversely, the features and functions of one module or unit described above may be further divided into a plurality of modules or units to be embodied.

From the above description of embodiments, those skilled in the art will readily appreciate that the example embodiments described herein may be implemented in software, or may be implemented in software in combination with the necessary hardware. Thus, the technical solution according to the embodiments of the present application may be embodied in the form of a software product, which may be stored in a non-volatile storage medium (may be a CD-ROM, a U-disk, a mobile hard disk, etc.) or on a network, and includes several instructions to cause a computing device (may be a personal computer, a server, a touch terminal, or a network device, etc.) to perform the method according to the embodiments of the present application.

Referring next to fig. 13, fig. 13 is a flowchart illustrating a wafer cross-factory flow method according to another embodiment of the present application, and as shown in fig. 13, the wafer cross-factory flow method according to the embodiment at least includes steps S1310 to S1360, which are described in detail below.

In step S1310, a lot ID of the lot in the first cassette is obtained.

In step S1320, a virtual cassette ID is created, the virtual cassette ID having a first mapping relationship with the lot ID of the lot within the first cassette.

In step S1330, the first accounting data corresponding to the wafer lot ID is converted into the second accounting data.

In step S1340, when the wafer offline instruction is received, a wafer lot ID corresponding to the offline wafer lot ID in the wafer offline instruction is determined, a corresponding virtual wafer box ID is determined based on the first mapping relationship and the wafer lot ID corresponding to the offline wafer lot ID, and all wafer lot IDs corresponding to the determined virtual wafer box ID based on the first mapping relationship are used as target offline wafer lot IDs.

In step S1350, second accounting data corresponding to the target offline wafer lot ID is determined, a second mapping relationship between the target offline wafer lot ID and the second wafer cassette is constructed based on the target offline wafer lot ID and the second accounting data corresponding to the target offline wafer lot ID, and the target offline wafer lot ID and the second mapping relationship are output to the manufacturing execution system.

The steps S1310 to S1350 may correspond to the descriptions in the steps S310 to S350, and are not described herein.

In step S1360, the configuration manufacturing execution system controls the execution device to transfer the target offline lot corresponding to the target offline lot ID to the corresponding second wafer cassette based on the second mapping relationship and execute the processing procedure based on the second accounting data corresponding to the target offline lot ID.

The steps S1310 to S1350 may be performed by an electronic device, for example, the electronic device 1100 in the foregoing embodiment. In step S1360, the performing device may be any device capable of performing wafer transfer and performing a processing procedure, for example, the performing device includes a robot and a computer system, and the robot is controlled by the computer system to transfer the target offline lot corresponding to the target offline lot ID to the corresponding second wafer cassette, and further perform the processing procedure based on the second accounting data corresponding to the target offline lot ID. Optionally, the computer system may also automatically verify the physical account information during the wafer offline process.

In an embodiment, in the process that the manufacturing execution system controls the execution device to transmit the target offline lot corresponding to the target offline lot ID to the corresponding second wafer cassette based on the second mapping relationship, the relevant information of the target offline lot corresponding to the target offline lot ID in the first wafer cassette is verified. In detail, in step S1360, the manufacturing execution system is configured to verify the first information of the target offline wafer lot corresponding to the target offline wafer lot ID in the first wafer cassette based on the second accounting data corresponding to the target offline wafer lot ID; and if the verification result is that the first information of the target offline wafer lot corresponding to the target offline wafer lot ID in the first wafer box is wrong, controlling the execution equipment to stop transmitting the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer box and generating an alarm signal, and if the verification result is that the first information of the target offline wafer lot corresponding to the target offline wafer lot ID in the first wafer box is correct, controlling the execution equipment to transmit the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer box based on the second mapping relation.

In this embodiment, in the wafer offline process, the execution device is utilized to automatically verify the material account information, that is, the first information, without manually performing material account information verification after completing the transfer of the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer cassette, thereby reducing manual participation, being not easy to make mistakes, and having high wafer flow efficiency.

In an embodiment, the first information includes at least one of a placement position of the target offline lot corresponding to the target offline lot ID in the first wafer box, a number of wafers included in the target offline lot corresponding to the target offline lot ID, and a wafer back etching code of each wafer in the target offline lot corresponding to the target offline lot ID; if any one of the information is wrong, the verification result is that the first information of the target offline wafer lot corresponding to the target offline wafer lot ID in the first wafer box is wrong, and if the information is not wrong, the verification result is that the first information of the target offline wafer lot corresponding to the target offline wafer lot ID in the first wafer box is correct.

The first information includes, for example, a placement position of the target offline lot corresponding to the target offline lot ID in the first wafer box, a number of wafers included in the target offline lot corresponding to the target offline lot ID, and a wafer back etching code of each wafer in the target offline lot corresponding to the target offline lot ID, where the second account data corresponding to the target offline lot ID includes the placement position, the number of wafers, and the wafer back etching code. The execution device can judge whether the placement position, the number of wafers and the wafer back etching code are wrong or not.

In one embodiment, as shown in fig. 14, the wafer offline step (corresponding to the steps S1340 to S1360) includes: step S1410, transmitting the second accounting data corresponding to the wafer lot ID, the virtual wafer cassette ID, and the offline wafer lot ID to the wafer offline module; step S1420, the wafer offline module determines a virtual wafer cassette ID corresponding to the offline wafer lot ID, and takes all wafer lot IDs corresponding to the virtual wafer cassette ID as target offline wafer lot IDs; step S1430, constructing a second mapping relation between the target offline wafer lot ID and the second wafer cassette, and generating a transmission work order containing the target offline wafer lot ID and the second mapping relation; step S1440, transmitting the transmission work order to the MES system of the FAB to call the corresponding second wafer box to the transmission machine, controlling the execution equipment to transmit the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer box, checking the placement position of the wafer lot in the first wafer box, the number of wafers, the wafer back etching and other material accounts in the transmission process, if the checking result is consistent, entering step S1450, and completing the wafer transmission of the target offline wafer lot through step S1450; if the verification result is inconsistent, the step S1460 is performed, the wafer transmission is stopped, and an alarm signal is sent to remind related personnel.

The executing device may be provided with an induction device, and the induction device is used for sensing whether the corresponding position in the first wafer box has wafers or not, and checking the placement position of the wafer lot in the first wafer box and the number of the wafers; the execution equipment can be provided with a code reading device, the code reading device is used for reading the wafer back etching code on the wafer, and whether the wafer back etching code is consistent with the expected wafer back etching code is checked.

In some embodiments, the first information may only include a placement position of the target offline lot corresponding to the target offline lot ID in the first box and the number of wafers included in the target offline lot corresponding to the target offline lot ID, or a placement position of the target offline lot in the first box and a wafer back etching code of each wafer in the target offline lot corresponding to the target offline lot ID, or a number of wafers included in the target offline lot corresponding to the target offline lot ID and a wafer back etching code of each wafer in the target offline lot corresponding to the target offline lot ID.

In some embodiments, the first information may further include other information, such as a total number of wafers in the first wafer cassette, at this time, the virtual wafer cassette ID is further transmitted to the MES system of the FAB, and the MES system of the FAB is configured to verify the total number of wafers in the first wafer cassette corresponding to the virtual wafer cassette ID corresponding to the target offline lot ID; if the total number of the wafers is wrong, controlling the execution equipment to stop transmitting the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer box and generating an alarm signal; and otherwise, controlling the execution equipment to transmit the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer cassette based on the second mapping relation.

In one embodiment, after step S1320, the virtual pod ID is further sent to the warehouse system of the FAB and the warehouse system is configured to determine a physical storage location corresponding to the storage address code based on the virtual pod ID to store the first pod to the physical storage location within the warehouse corresponding to the storage address code. Therefore, when the FAB warehouse receives the first wafer box, the physical storage position of the first wafer box can be determined directly based on the storage address code in the virtual wafer box ID, and the first wafer box is stored to the physical storage position without redefining the physical storage position of the first wafer box.

Fig. 15 is a flowchart illustrating a wafer loading step according to an embodiment of the present application, and as shown in fig. 15, the wafer loading step includes: step S1510, scanning codes by a code scanning device in a warehouse of the FAB to read two-dimensional codes on the outer package of the first wafer box, confirming the wafer lot ID of the wafer lot corresponding to the first wafer box, recording the wafer lot ID of the wafer lot in the same first wafer box, and transmitting data to a data receiving module; step S1520, the data receiving module automatically classifies the wafer lot ID of the wafer lot in the same first wafer cassette into a virtual wafer cassette ID when scanning the code, and creates a storage address in the FAB warehouse according to the virtual wafer cassette ID; step S1530, the warehouse places the first wafer box at the corresponding physical storage position according to the storage address created by the data receiving module, and confirms that the storage is completed at the data receiving module; in step S1540, the data receiving module transmits the received data packet storing the accounting data related to the processing of the wafer lot in the FAB a in the first wafer box to the ERP of the FAB, and simultaneously transmits the first accounting data corresponding to the wafer lot to the data converting module for accounting data conversion.

The first wafer box may be provided with a plurality of wafers of the wafer lot, and the two-dimensional code on the outer package of the first wafer box can only be read through the code scanning device, so that the wafer lot can be confirmed to be put in storage, but the wafer lots are in the first wafer box, no actual record and data exist, and when the wafers are put off line, the wafer lots in the first wafer box are always unknown, manual inspection is needed, and time is consumed. The data receiving module of the embodiment constructs the virtual wafer box ID, and automatically corresponds the wafer lot ID of the wafer lot in the same first wafer box to one virtual wafer box ID when scanning the code, so that the whole data of the wafer lot ID in one first wafer box can be recorded and in a warehouse system, and the warehouse can conveniently find the appointed first wafer box when the wafer is offline. When the subsequent wafers are offline, all the wafers in the first wafer box can be automatically offline, and meanwhile, engineers can be informed of other wafer batches which need to be offline simultaneously.

In an embodiment, after determining the target offline lot ID, the target offline lot ID is further transmitted to the warehouse system, and the warehouse system is configured to search for a virtual wafer box ID corresponding to the target offline lot ID, and determine a physical storage position of the first wafer box corresponding to the target offline lot ID in the warehouse based on the virtual wafer box ID, so as to further take out the first wafer box corresponding to the target offline lot ID from the warehouse of the FAB, without manually searching for the first wafer box corresponding to the target offline lot ID in the warehouse of the FAB.

Fig. 16 is a flowchart illustrating a wafer ex-warehouse step according to an embodiment of the present application, and as shown in fig. 16, the wafer ex-warehouse step includes: step S1610, receiving an offline wafer lot ID input to the wafer offline module; step S1620, the wafer offline module transmits the offline wafer lot ID, the corresponding virtual wafer cassette ID and the storage address to the warehouse system; step S1630, the warehouse system finds the corresponding first wafer box according to the storage address, and uses the code scanning device to scan the code to read the two-dimensional code on the outer package of the first wafer box, and after confirming the information, the warehouse system hands over the first wafer box to MFG (Manufacturing department) personnel; step S1640, the MFG personnel scans the two-dimensional code on the outer package of the first wafer box again by using the code scanning device to confirm that the information is correct; in step S1650, the data receiving module changes the status of the offline wafer lot ID from the warehouse storage status to the offline production status, and transmits status information to the ERP of the FAB.

The warehouse system stores the virtual wafer cassette ID, and the mapping relationship between the offline wafer lot ID and the virtual wafer cassette ID can be used to obtain the virtual wafer cassette ID and the corresponding storage address of the first wafer cassette, and in the embodiment shown in fig. 16, the wafer offline module transmits the offline wafer lot ID, the corresponding virtual wafer cassette ID and the storage address to the warehouse system; the virtual wafer box ID and the storage address information are checked and confirmed to be correct. Of course, in other embodiments, in step S1620, the wafer offline module may only transfer the offline wafer lot ID to the warehouse system.

In an embodiment, after step S1320, the method further includes: writing the virtual wafer box ID to the corresponding first wafer box, wherein the virtual wafer box ID written to the first wafer box can be read by an MES system of the FAB; when outputting the target offline wafer lot ID and the second mapping relation to the MES system of the FAB, outputting the virtual wafer cassette ID corresponding to the target offline wafer lot ID to the MES system of the FAB; and the MES system of the FAB is configured to read the virtual wafer box ID of the first wafer box before the execution equipment is controlled to transmit the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer box based on the second mapping relation, and then execute the execution equipment to transmit the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer box based on the second mapping relation if the read virtual wafer box ID is consistent with the virtual wafer box ID corresponding to the target offline wafer lot ID, and can give an alarm if the read virtual wafer box ID is inconsistent with the virtual wafer box ID corresponding to the target offline wafer lot ID, so that the transmission of the correct wafer lot in the first wafer box can be ensured.

In the foregoing embodiment, the accounting data conversion step and the wafer offline step both reduce manual participation, so that overall wafer flow efficiency can be improved, and human errors are reduced, and simultaneously, in the offline step, automatic offline of all wafer lots in the same first wafer box is realized, without manually checking whether offline wafer lots exist in the first wafer box again, and performing offline of all wafer lots in the first wafer box for the second time, so that manual participation is further reduced, and overall wafer flow efficiency is improved.

The overall flow of the wafer cross-factory method of the present application is described below:

The first wafer box provided to the FAB reads the two-dimensional code on the outer package at the warehouse scanning code to obtain the wafer lot ID of the wafer lot in the first wafer box and record, and all the wafer lot IDs corresponding to the same first wafer box are transmitted to the data receiving module. The data receiving module creates a virtual wafer cassette ID and binds all wafer lot IDs corresponding to the same first wafer cassette, and transmits the virtual wafer cassette ID to the warehouse system. And the warehouse system stores the first wafer box to the corresponding physical storage position according to the storage address code in the virtual wafer box ID and confirms that the storage is completed. The FAB also receives a data packet transmitted by the FAB A, wherein the data packet comprises wafer lot IDs and first account material data corresponding to the wafer lot IDs, the data receiving module receives the data packet, and after the receiving warehouse system confirms that the first wafer boxes are stored, the data receiving module transmits the wafer lot IDs and the first account material data corresponding to each wafer lot ID to the data conversion module. The data conversion module converts the first account data into second account data which can be identified by the MES system of the FAB, and transmits the second account data to the wafer offline module. When the wafer is required to be offline, the offline wafer lot ID required to be offline is manually input into the wafer offline module, the wafer offline module transmits the offline wafer lot ID to the warehouse system, the warehouse system finds the corresponding virtual wafer box ID according to the offline wafer lot ID, so that the physical storage position of the first wafer box corresponding to the offline wafer lot ID is found, the first wafer box is taken out, the code scanning confirmation is given to the MFG personnel, the MFG personnel scans the code again to confirm the code again, the outer package of the first wafer box is disassembled, the corresponding virtual wafer box ID is written to the first wafer box, and then the virtual wafer box ID is put to a preset temporary storage position on a factory line to wait for offline. Meanwhile, the wafer offline module finds a corresponding virtual wafer cassette ID according to the offline wafer cassette ID, determines second account data of all wafer cassettes IDs corresponding to the virtual wafer cassette ID (i.e., target offline wafer cassette IDs), obtains a final pollution level of each target offline wafer cassette ID, distributes the second wafer cassette according to the final pollution level, creates a transmission work order containing a mapping relation between the target offline wafer cassette ID and the second wafer cassette, outputs the transmission work order to the MES system of the FAB, and simultaneously transmits the second account data corresponding to the target offline wafer cassette ID to the MES system of the FAB. When receiving a manual triggering goods taking instruction, the MES system of the FAB controls the execution equipment to move to a preset temporary storage position to prepare a first wafer box, reads a virtual wafer box ID in the first wafer box in the preset temporary storage position, takes the first wafer box if the read virtual wafer box ID is confirmed to be consistent with the virtual wafer box ID in the transmission work order, transmits the target offline wafer box ID to a corresponding second wafer box according to the mapping relation between the target offline wafer box ID and the second wafer box in the transmission work order, realizes wafer offline, and generates an alarm signal if the read virtual wafer box ID is inconsistent with the virtual wafer box ID in the transmission work order. When the wafers are required to be delivered, the wafer delivery module calculates a wafer batch combination scheme with the least number of third wafer boxes, after confirming the batch combination scheme, the batch combination scheme is output to an MES system, the MES system enables the execution equipment to transmit the delivery wafer batch corresponding to the delivery wafer batch ID to the corresponding third wafer boxes based on the batch combination scheme, and finally, billing data of each delivery wafer batch in the FAB is generated, so that the whole process from factory entering to factory leaving of the wafers is completed.

Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

Claims

1. The wafer cross-factory wafer flow method is characterized by comprising the following steps of:

acquiring a wafer lot ID of a wafer lot in the first wafer cassette;

Creating a virtual wafer cassette ID, wherein the virtual wafer cassette ID has a first mapping relation with a wafer lot ID of a wafer lot in the first wafer cassette, the virtual wafer cassette ID comprises a plurality of code bits, the plurality of code bits comprise a first wafer cassette code and a storage address code, and the storage address code has a third mapping relation with a physical storage position of the first wafer cassette in a warehouse when the first wafer cassette is stored in the warehouse;

Converting the first account data corresponding to the wafer lot ID into second account data; and sending the virtual wafer cassette ID to a warehouse system, so that the warehouse system determines a physical storage position corresponding to the storage address code, and stores the first wafer cassette to the physical storage position corresponding to the storage address code in a warehouse;

Transmitting the target offline wafer lot ID to the warehouse system, so that the warehouse system searches a virtual wafer box ID corresponding to the target offline wafer lot ID, and determines the physical storage position of the first wafer box in the warehouse, corresponding to the target offline wafer lot ID, based on the virtual wafer box ID; and

2. The wafer cross-factory flow method of claim 1, wherein the plurality of code bits further comprise an incoming factory number and a lot number identification, wherein the incoming factory number represents a wafer factory providing the first wafer cassette, and wherein the lot number identification represents a lot number of wafers within the first wafer cassette.

3. The wafer cross-factory flow method of claim 1, wherein after creating the virtual cassette ID, the method further comprises:

4. The wafer cross-factory flow method of claim 1, wherein the converting the first accounting data corresponding to the wafer lot ID to the second accounting data comprises:

acquiring generation rules of the manufacturing execution system on wafer batch ID and wafer ID;

5. The wafer cross-factory flow method of claim 4, wherein after converting a first wafer lot ID in the first accounting data corresponding to the wafer lot ID to a second wafer ID and converting a first wafer lot ID in the first accounting data corresponding to the wafer lot ID to a second wafer lot ID, the method further comprises the steps of:

s1.3, if the wafer ID which is repeated with the second wafer ID exists in the stored wafer IDs, modifying the generation rule, converting the first wafer ID in the first account material data into the second wafer ID again,

6. The wafer cross-factory flow method of claim 4, wherein the converting the first accounting data corresponding to the wafer lot ID to second accounting data further comprises:

7. The wafer cross-factory flow method of claim 6, wherein the converting the first accounting data corresponding to the wafer lot ID to second accounting data further comprises:

8. The wafer cross-factory wafer process of claim 1, wherein the constructing a second mapping relationship between the target offline lot ID and a second wafer cassette based on the target offline lot ID and second accounting data corresponding to the target offline lot ID comprises:

9. The wafer cross-factory flow method according to any one of claims 1 to 8, further comprising the steps of:

10. The wafer cross-factory wafer handling method of claim 9, wherein after determining a lot combination recipe that uses a minimum number of third cassettes, before transferring the outgoing wafer lot corresponding to the outgoing wafer lot ID to the corresponding third cassette, the method further comprises:

Generating a batch combination scheme confirmation window;

11. The wafer cross-factory wafer flow method is characterized by comprising the following steps of:

acquiring a wafer lot ID of a wafer lot in the first wafer cassette;

converting the first account data corresponding to the wafer lot ID into second account data; and sending the virtual wafer cassette ID to a warehouse system, and configuring the warehouse system to determine a physical storage position corresponding to the storage address code based on the virtual wafer cassette ID so as to store the first wafer cassette to the physical storage position corresponding to the storage address code in a warehouse;

Transmitting the target offline wafer lot ID to the warehouse system, configuring the warehouse system to find a virtual wafer box ID corresponding to the target offline wafer lot ID, and determining the physical storage position of the first wafer box in the warehouse corresponding to the target offline wafer lot ID based on the virtual wafer box ID; and

12. The wafer cross-factory wafer handling method of claim 11, wherein the configuring the manufacturing execution system to control an execution device to transfer the target offline lot corresponding to the target offline lot ID to a corresponding second wafer cassette based on the second mapping relationship comprises:

13. The wafer cross-factory wafer method according to claim 12, wherein the first information includes at least one of a placement position of a target offline wafer lot corresponding to the target offline wafer lot ID within the first wafer cassette, a number of wafers included in the target offline wafer lot corresponding to the target offline wafer lot ID, and a wafer back-etching code of each wafer in the target offline wafer lot corresponding to the target offline wafer lot ID;

14. The wafer cross-factory flow method of claim 11, wherein after creating the virtual cassette ID, the method further comprises:

And before the execution equipment is controlled to transmit the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer cassette based on the second mapping relation, the manufacturing execution system is configured to read the virtual wafer cassette ID written to the first wafer cassette first, and if the virtual wafer cassette ID written to the first wafer cassette is consistent with the virtual wafer cassette ID corresponding to the target offline wafer lot ID, the step of transmitting the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer cassette based on the second mapping relation is executed.

15. A wafer cross-factory wafer handling apparatus, comprising:

The data receiving module is used for obtaining the wafer lot ID of the wafer lot in the first wafer box and creating a virtual wafer box ID, wherein the virtual wafer box ID has a first mapping relation with the wafer lot ID of the wafer lot in the first wafer box, the virtual wafer box ID comprises a plurality of code bits, the plurality of code bits comprise a first wafer box code and a storage address code, and the storage address code has a third mapping relation with the physical storage position of the first wafer box in a warehouse when the first wafer box is stored in the warehouse; the data receiving module is further configured to send the virtual wafer cassette ID to a warehouse system, so that the warehouse system determines a physical storage location corresponding to the storage address code, and stores the first wafer cassette to a physical storage location corresponding to the storage address code in a warehouse;

The wafer offline module is configured to determine, when a wafer offline instruction is received, the wafer lot ID corresponding to an offline wafer lot ID in the wafer offline instruction, determine a corresponding virtual wafer box ID based on the first mapping relationship and the wafer lot ID corresponding to the offline wafer lot ID, take all of the determined virtual wafer box IDs as target offline wafer lot IDs based on all of the wafer lot IDs corresponding to the first mapping relationship, and transmit the target offline wafer lot IDs to the warehouse system, so that the warehouse system searches for the virtual wafer box ID corresponding to the target offline wafer lot ID, and determine a physical storage position of the first wafer box corresponding to the target offline wafer lot ID in a warehouse based on the virtual wafer box ID; and determining second account material data corresponding to the target offline wafer lot ID, constructing a second mapping relation between the target offline wafer lot ID and a second wafer cassette based on the target offline wafer lot ID and the second account material data corresponding to the target offline wafer lot ID, and outputting the target offline wafer lot ID and the second mapping relation to a manufacturing execution system, so that the manufacturing execution system can control execution equipment to transmit the target offline wafer lot corresponding to the target offline wafer lot ID to the corresponding second wafer cassette based on the second mapping relation and execute a processing procedure based on the second account material data corresponding to the target offline wafer lot ID.

16. An electronic device, comprising:

one or more processors;

A memory for storing one or more computer programs that, when executed by the one or more processors, cause the processors to implement the wafer cross-factory flow method of any one of claims 1-10.

17. A computer readable storage medium storing computer readable instructions which, when executed by a processor of a computer, cause the computer to perform the wafer cross-factory flow method of any one of claims 1 to 10.