CN117906772A - Flexible film temperature sensor and manufacturing method thereof - Google Patents
Flexible film temperature sensor and manufacturing method thereof Download PDFInfo
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- CN117906772A CN117906772A CN202311833200.0A CN202311833200A CN117906772A CN 117906772 A CN117906772 A CN 117906772A CN 202311833200 A CN202311833200 A CN 202311833200A CN 117906772 A CN117906772 A CN 117906772A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000004020 conductor Substances 0.000 claims abstract description 62
- 238000000034 method Methods 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims abstract description 31
- 239000004065 semiconductor Substances 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 119
- 239000010408 film Substances 0.000 claims description 88
- 238000007747 plating Methods 0.000 claims description 31
- 238000009713 electroplating Methods 0.000 claims description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- 238000005530 etching Methods 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 7
- 238000013329 compounding Methods 0.000 claims description 6
- 238000007731 hot pressing Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 238000011161 development Methods 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 5
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 3
- 230000000873 masking effect Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 238000003466 welding Methods 0.000 abstract description 5
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- 206010017076 Fracture Diseases 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 abstract description 3
- 230000036632 reaction speed Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
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- 239000007769 metal material Substances 0.000 description 2
- 206010010214 Compression fracture Diseases 0.000 description 1
- 229910001006 Constantan Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
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- 238000004381 surface treatment Methods 0.000 description 1
- 230000005676 thermoelectric effect Effects 0.000 description 1
- 238000004861 thermometry Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
- H01M10/486—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte for measuring temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention discloses a flexible film temperature sensor and a manufacturing method thereof. The sensor is manufactured by adopting a flexible circuit board process and comprises a conductor layer and an electroplated layer which are positioned between two insulating layers, wherein the conductor layer and the electroplated layer are made of different materials; forming a plurality of adjacent 'several' circuits on the conductor layer and the electroplated layer, wherein the adjacent 'several' circuits are connected end to form a series network, and the head end and the tail end of the series network are led out of the bonding pads to serve as signal output ends; each 'several' type circuit is divided into a left half and a right half, one half is a first structure part compounded by a semiconductor layer and an electroplated layer, the other half is a second structure part only provided with the semiconductor layer, the first structure part and the second structure part are alternately arranged in a series network, and a thermocouple is formed at the joint of each first structure part and each second structure part. The temperature sensor is attached to the heating area, so that the reaction speed is high, and the detection precision is high; the integrated structure has no welding process and no risk of cold joint; there is no risk of fracture of the thermosensitive device.
Description
Technical Field
The invention relates to the field of temperature sensors for new energy battery packs, in particular to a flexible film temperature sensor and a manufacturing method thereof.
Background
The working temperature of the new energy battery pack not only can influence the battery performance, but also is directly related to the safety of the vehicle, and the temperature monitoring of the power battery can be used for verifying the related thermal model of the battery pack and assisting the design of each functional monomer and module in the battery pack; the system can also be used for monitoring a battery management system, and when the temperature of the battery pack exceeds the safety threshold and other variation anomalies, an alarm signal is sent to early warn so as to avoid danger.
Common battery temperature measurement methods include thermocouple wires and NTC or PTN thermistors, but both of these methods suffer from some drawbacks in large scale thermometry applications for battery packs. The thermocouple uses metal wires, so that short circuit in the battery module is possibly caused, and the metal materials are hard, so that inconvenience is brought to installation and use; and the thermistor has the problems of poor welding and risk of compression fracture, and abnormal monitoring is brought.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides the flexible film temperature sensor, which adopts a metal film to form a thermocouple, can be conveniently arranged in a battery module, does not cause short circuit of the battery module, and does not have poor welding and risk of fracture under pressure.
The technical proposal is as follows:
The flexible film temperature sensor is manufactured by adopting a flexible circuit board process, and comprises a first insulating layer, a first adhesive layer, a conductor layer, an electroplated layer, a second adhesive layer and a second insulating layer which are sequentially attached, wherein the conductor layer and the electroplated layer are made of metals or alloys with different materials; forming a plurality of adjacent 'several' circuits on the conductor layer and the electroplated layer, wherein the adjacent 'several' circuits are connected end to form a series network, and leading out bonding pads from the head end to the tail end of the series network are used as signal output ends; each 'several' type circuit is divided into a left half and a right half, one half is a first structure part formed by compounding a semiconductor layer and an electroplated layer, the other half is a second structure part only provided with the semiconductor layer, in the series network, the first structure part and the second structure part are alternately arranged, and a thermocouple is formed at the joint of each first structure part and each second structure part.
Further, the shape of the flexible film temperature sensor is in a round-like or square-like structure, the heights of the 'several' -shaped circuits are different, thermocouples at the top of the 'several' -shaped circuits are distributed in the central area of the flexible film temperature sensor in a staggered manner, and thermocouples at the bottom of the 'several' -shaped circuits are located in the edge area of the flexible film temperature sensor.
Further, the electroplated layer is made of copper; the material of the conductor layer is pure nickel or copper-nickel alloy.
Further, the thickness of the plating layer is 10 to 35 μm.
Further, the thickness of the conductor layer is 10 to 70 μm.
Further, the insulating layer is made of a PI insulating film or a PET insulating film.
In order to solve the problems in the prior art, the invention also provides a manufacturing method of the flexible film temperature sensor, so as to realize the manufacturing of the flexible film temperature sensor, and the technical scheme is as follows:
A method for manufacturing a flexible film temperature sensor; the method comprises the following steps:
Step S11: combining the conductor layer material and the adhesive insulating film into a single-sided base material through hot pressing equipment at high temperature and high pressure;
step S12: etching the conductor layer on the single-sided substrate into a plurality of adjacent 'several' -shaped circuits through a silk screen printing, exposure, development and etching combined process, and connecting the adjacent 'several' -shaped circuits end to form a series network; the method comprises the steps that bonding pads are arranged at the head end and the tail end of a series network and serve as signal output ends, and leads are arranged from the head end and the tail end of the series network to the edges of the plates and serve as electroplating leads;
Step S13: pasting an electroplating-resistant dry film on the surface of the conductor layer, dividing each 'several' -shaped circuit into a left half graph and a right half graph, masking the same side of each 'several' -shaped circuit by the dry film, and exposing the other side of each 'several' -shaped circuit and the bonding pad; carrying out surface electroplating on each 'several' -shaped circuit and the area of the bonding pad, which is not covered by the dry film, by an electroplating process, wherein one half of the electroplated 'several' -shaped circuit is formed into a circuit with a semiconductor layer and an electroplated layer in a compounding way, and the other half of the electroplated 'several' -shaped circuit is a circuit with only a conductor layer; after the electroplating is completed, removing the electroplating-resistant dry film to expose the conductor layer and the electroplated layer;
Step S14: and pasting an adhesive insulating film on the exposed surface of the electroplated layer and the conductor layer to insulate and protect the series network.
Further, the single-side width of the circuit area to be electroplated is larger than 0.05mm.
The invention also provides a manufacturing method of the flexible film temperature sensor, which comprises the following steps:
a manufacturing method of a flexible film temperature sensor comprises the following steps:
step S21: combining the conductor layer material and the adhesive insulating film into a single-sided base material through hot pressing equipment at high temperature and high pressure;
Step S22: pasting an electroplating-resistant dry film on the surface of the conductor layer; then forming an electroplated layer formed by a plurality of spaced electroplating areas on the surface of the conductor layer through an electroplating process; removing the electroplating-resistant dry film; exposing the conductor layer and the electroplated layer;
Step S23: etching the electroplated layer and the conductor layer into a plurality of adjacent 'several' -shaped circuits and bonding pads through a silk screen printing, exposure, development and etching combined process, so that each 'several' -shaped circuit is divided into left and right halves, wherein one half is a first structural part formed by compounding the conductor layer and the electroplated layer, and the other half is a second structural part only provided with the conductor layer; the adjacent 'several' -shaped circuits are connected end to end, and the first structure part and the second structure part are alternately arranged to form a series network; the head end and the tail end of the series network are connected to the bonding pad and serve as signal output ends;
step S24: and pasting an insulating film with glue on the exposed surface of the conductor layer and the electroplated layer to insulate and protect the series network.
Further, the unilateral spacing between the boundary of the electroplating area and the boundary of the circuit to be formed is larger than 0.05mm.
Further, the single-side width of the circuit area to be electroplated is larger than 0.05mm.
The flexible film temperature sensor has the following beneficial effects:
(1) The device can be attached to a heating area, and has high reaction speed and high detection precision;
(2) The surface is covered by a PI insulating film or a PET insulating film, so that the insulating pressure resistance is high;
(3) The product has a thin structure and small occupied space, and has no leakage short circuit risk;
(4) The product is of an integrated structure, a welding process is not needed, and the risk of cold joint is avoided; there is no risk of fracture of the thermosensitive device.
Drawings
FIG. 1 is one embodiment of a flexible film temperature sensor of the present invention;
FIG. 2 is a schematic diagram of a "few" type circuit of the flexible film temperature sensor of FIG. 1;
FIG. 3 is a schematic diagram of a laminated structure of the flexible thin film temperature sensor of FIG. 1;
FIG. 4 is a schematic illustration of a first embodiment of a process flow of the flexible film temperature sensor of the present invention;
FIG. 5 is a schematic illustration of a laminate of a single-sided substrate;
FIG. 6 is a schematic diagram of the structure after etching of the conductor layer;
FIG. 7 is a schematic illustration of a dry film plating resist;
FIG. 8 is a graph showing the effect of the plating resist dry film applied in the first embodiment;
FIG. 9 is a second embodiment of a process flow of the flexible film temperature sensor of the present invention;
FIG. 10 is a diagram showing the effect of the second embodiment after plating of a dry film resist;
fig. 11 is a use example of the flexible film temperature sensor of the present invention.
Detailed Description
For further illustration of the various embodiments, the invention is provided with the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments and together with the description, serve to explain the principles of the embodiments. With reference to these matters, one of ordinary skill in the art will understand other possible embodiments and advantages of the present invention. The components in the figures are not drawn to scale and like reference numerals are generally used to designate like components.
The invention will now be further described with reference to the drawings and detailed description.
Example 1
As shown in fig. 1 to 3, the present invention provides an embodiment of a flexible thin film temperature sensor. The working principle is based on the thermoelectric effect, i.e. when there is a temperature difference at the junction of two different metallic materials, a potential difference is created. The magnitude of the potential difference is proportional to the temperature difference, and the temperature can be measured indirectly by measuring the potential difference.
In this embodiment, the flexible film temperature sensor includes structural layers such as an insulating layer 1, a glue layer 2, a conductor layer 3, a plating layer 4, a glue layer 5, and an insulating layer 6, which are sequentially attached.
Preferably, the insulating layers 1 and 6 are made of PI insulating films, PET insulating films, or the like.
Preferably, the adhesive layers 2 and 5 are thermosetting adhesives, and are used as back adhesives of insulating films, so that the insulating layers 1 and 6 are attached to and protected from the conductor layers 3 and the electroplated layers 4.
Preferably, the thickness of the conductor layer 3 is 10 to 70 μm.
Preferably, the material of the plating layer 4 is copper, and is attached to the conductor layer 3 by a copper electroplating process.
Preferably, the thickness of the plating layer 4 is 10 to 35. Mu.m.
In this application, it is required that the material of the conductor layer 3 and the material of the plating layer 4 are different to form a connection between different metals, thereby forming a thermocouple. Preferably, the material of the conductor layer 3 is metallic nickel or nickel-copper alloy.
In the present embodiment, the material of the plating layer 4 is copper; the material of the conductor layer 3 is metallic nickel.
A plurality of adjacent "several" type circuits 100 are formed on the conductor layer and the plating layer 4 by plating, etching, etc., and the adjacent "several" type circuits 100 are connected end to form a series network, the end to end of which is connected out of the pads 105, 106 as signal output terminals.
Each "several" type circuit 100 is divided into left and right halves, wherein half is a first structure portion 101 with a nickel surface of copper at the bottom and half is a second structure portion 102 with only a nickel layer and no copper plating layer.
In the series network, the first structure part 101 and the second structure part 102 are arranged at intervals, and the left and right sides of each 'several' -shaped circuit 100 are connected by metals of different materials, namely, one thermocouple 104 is formed. The adjacent "several" type circuits 100 are also connected by metal of different materials, forming a thermocouple 103.
The flexible film temperature sensor is internally provided with the thermopile formed by connecting a plurality of thermocouples in series, each thermocouple outputs thermoelectric voltage, and the thermoelectric voltages are mutually overlapped to form higher voltage output, so that the measurement accuracy can be improved.
Preferably, the shape of the flexible film temperature sensor is similar to a circle (a circle, an ellipse, etc.) or a square (a square, a rectangle, etc.), and the heights of the "several" type circuits 100 are different, so that thermocouples 104 on the top of each "several" type circuit 100 are gathered in the middle of the flexible film temperature sensor and distributed in a staggered manner so as to be attached to a heating area (such as the middle of the cathode of a columnar battery) of a heating device, thereby forming a plurality of temperature measuring points; thermocouples 104 at the bottom of each "table" type circuit 100 are located at the edge of the flexible thin film temperature sensor and at the normal temperature area of the heat generating device, forming a plurality of temperature measuring points.
Example 2
As shown in fig. 4-8, the present embodiment provides a method for manufacturing a flexible thin film temperature sensor, which includes sequentially performing the processes of preparing a substrate, etching, partially plating, and attaching an insulating film, and the following steps:
In this embodiment, the plating process adopts a copper plating process, and the material of the conductor layer 3 is metallic nickel.
Step S11: the conductor layer material and the adhesive insulating film are combined into a single-sided base material by hot pressing equipment at high temperature and high pressure, as shown in fig. 5. The insulating film material is preferably a polymer material such as PI polyimide or PET (polyester film).
Step S12: the conductor layer is etched into a plurality of adjacent 'several' type circuits 301 through the combined processes of screen printing, exposure, development, etching and the like, as shown in fig. 6, and the adjacent 'several' type circuits 301 are connected end to form a series network, bonding pads 305 and 306 are arranged at the head end and the tail end of the series network to serve as signal output ends, and leads 307 and 308 are arranged from the head end and the tail end of the series network to the board edge to serve as electroplating leads of the subsequent electroplating process.
Step S13: a plating-resistant dry film 7 (shown in fig. 7) is attached to the surface of the circuit, and a local area to be plated of the conductor layer3 is provided. As shown in fig. 8, the plating resist dry film 7 divides the "several" type circuit 301 into left and right half patterns along the center thereof, and covers the same side of each "several" type circuit 301 with the dry film, and exposes the pads 305 and 306 on the other side and the lead-out end of each "several" type circuit 301. In order to avoid the plating resist dry film 7 from being pressed to the circuit to be plated, the single-side distance of the dry film from the circuit area to be plated is preferably greater than 0.05mm. The wires 307, 308 are powered up, and copper plating is performed on the surface of each of the 'several' -shaped circuits 301 and the bonding pads 305, 306 without covering the dry film area, so that the 'several' -shaped circuits 100 after copper plating form a first structural part 101 with a nickel bottom and a copper surface, and a second structural part 102 with a nickel layer only and without copper plating, wherein the thickness of the copper plating is preferably 10-35 mu m, and metal connection of different materials on the left and right sides is formed, so that a thermocouple is formed. After the plating is completed, the plating resist dry film is removed, leaving the conductor layer3 and the plating layer4 exposed.
Step S14: and (3) pasting a PI insulating film with glue on the exposed surface of the conductor layer 3 and the electroplated layer 4 to insulate and protect the series network, so as to realize surface insulation.
After the insulation protection process is completed, conventional surface treatment and molding processes are generally required to finally finish the flexible film temperature sensor, which will not be described in detail herein.
Example 3
As shown in fig. 9 and 10, this embodiment provides a method for manufacturing a flexible thin film temperature sensor, which includes sequentially performing processes of preparing a substrate, partially plating, etching, and attaching an insulating film, wherein the processes of preparing a substrate and attaching an insulating film are the same as those of embodiment 2, and the steps of partially plating and etching are sequentially exchanged, and specifically described as follows:
Step S21: the conductor layer material and the rubberized PI insulating film are combined into a single-sided base material through hot pressing equipment at high temperature and high pressure, wherein the conductor layer material is preferably non-pure copper materials such as constantan, copper-nickel alloy, pure nickel and other metal foils.
Step S22: attaching an electroplating-resistant dry film 7 on the surface of the conductor layer 3; a plurality of inter-phase copper regions 401, 405, 506 are then formed on the conductor layer 3 by partial plating with a copper plating process, as shown in fig. 10. The thickness of the electroplated copper is preferably 10 to 35 μm. To ensure the integrity of the final etched circuit, the single-sided spacing between the boundary of each copper region and the boundary of the circuit to be formed is preferably greater than 0.05mm.
Step S23: etching the conductor layer 3 and the electroplated layer 4 into a plurality of adjacent 'several' -shaped circuits 100 and bonding pads 105 and 106 through a combination process of printing, exposing, developing, etching and the like, wherein the etched 'several' -shaped circuits 100 form a circuit of which half is a first structure part 101 with a nickel surface as copper at the bottom and half is a second structure part 102 with a nickel layer only and no copper plating layer; and adjacent 'several' circuits are connected end to form a series network, and the bonding pads 105 and 106 are led out from the end to end and serve as signal output ends.
Each of the 'several' type circuits forms a metal connection of different materials on the left and right sides, i.e. forms a thermocouple.
Step S24: and (3) pasting a PI insulating film with glue on the exposed surface of the conductor layer 3 and the electroplated layer 4 to insulate and protect the series network, and finally realizing surface insulation. A thermopile formed by connecting a plurality of thermocouples in series therein, each thermocouple outputs a thermoelectric voltage, and these thermoelectric voltages are superimposed on each other.
The using method of the flexible film temperature sensor comprises the following steps:
As shown in fig. 11, one end of the thermocouple of the flexible film temperature sensor is provided with heat conducting glue, and is attached to the monitoring heating area, and the other end is placed in the normal temperature area, when the heating area and the normal temperature area generate temperature difference, a thermoelectromotive force is formed, and as the thermoelectromotive force and the temperature difference are in linear relation, the temperature difference at two ends can be confirmed by measuring the voltage of the output end, and the temperature of the heating area can be calculated by adding the temperature difference to the temperature of the normal temperature area.
In summary, the flexible film temperature sensor has the following advantages:
(1) The device can be attached to a heating area, and has high reaction speed and high detection precision;
(2) The surface is covered by a PI insulating film or a PET insulating film, so that the insulating pressure resistance is high;
(3) The product has a thin structure and small occupied space, and has no leakage short circuit risk;
(4) The product is of an integrated structure, a welding process is not needed, and the risk of cold joint is avoided; there is no risk of fracture of the thermosensitive device.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A flexible film temperature sensor, characterized by: the flexible circuit board is manufactured by adopting a flexible circuit board process, and comprises a first insulating layer, a first adhesive layer, a conductor layer, an electroplated layer, a second adhesive layer and a second insulating layer which are sequentially attached, wherein the conductor layer and the electroplated layer are made of metals or alloys with different materials; forming a plurality of adjacent 'several' circuits on the conductor layer and the electroplated layer, wherein the adjacent 'several' circuits are connected end to form a series network, and leading out bonding pads from the head end to the tail end of the series network are used as signal output ends; each 'several' type circuit is divided into a left half and a right half, one half is a first structure part formed by compounding a semiconductor layer and an electroplated layer, the other half is a second structure part only provided with the semiconductor layer, in the series network, the first structure part and the second structure part are alternately arranged, and a thermocouple is formed at the joint of each first structure part and each second structure part.
2. The flexible film temperature sensor of claim 1, wherein: the shape of the flexible film temperature sensor is in a round-like or square-like structure, the heights of the 'several' -shaped circuits are different, thermocouples at the top of the 'several' -shaped circuits are distributed in the central area of the flexible film temperature sensor in a staggered manner, and thermocouples at the bottom of the 'several' -shaped circuits are located in the edge area of the flexible film temperature sensor.
3. The flexible film temperature sensor of claim 1, wherein: the electroplated layer is made of copper; the material of the conductor layer is pure nickel or copper-nickel alloy.
4. The flexible film temperature sensor of claim 1, wherein: the thickness of the electroplated layer is 10-35 mu m.
5. The flexible film temperature sensor of claim 1, wherein: the thickness of the conductor layer is 10-70 mu m.
6. The flexible film temperature sensor of claim 1, wherein: the insulating layer is made of PI insulating film or PET insulating film.
7. The manufacturing method of the flexible film temperature sensor is characterized by comprising the following steps of:
Step S11: combining the conductor layer material and the adhesive insulating film into a single-sided base material through hot pressing equipment at high temperature and high pressure;
step S12: etching the conductor layer on the single-sided substrate into a plurality of adjacent 'several' -shaped circuits through a silk screen printing, exposure, development and etching combined process, and connecting the adjacent 'several' -shaped circuits end to form a series network; the method comprises the steps that bonding pads are arranged at the head end and the tail end of a series network and serve as signal output ends, and leads are arranged from the head end and the tail end of the series network to the edges of the plates and serve as electroplating leads;
Step S13: pasting an electroplating-resistant dry film on the surface of the conductor layer, dividing each 'several' -shaped circuit into a left half graph and a right half graph, masking the same side of each 'several' -shaped circuit by the dry film, and exposing the other side of each 'several' -shaped circuit and the bonding pad; carrying out surface electroplating on the dry film area which is not covered by each 'several' -shaped circuit and the bonding pad by an electroplating process, wherein one half of the electroplated 'several' -shaped circuit is formed into a circuit with a semiconductor layer and an electroplated layer in a compounding way, and the other half of the electroplated 'several' -shaped circuit is a circuit with only a conductor layer; after the electroplating is completed, removing the electroplating-resistant dry film to expose the conductor layer and the electroplated layer;
Step S14: and pasting an adhesive insulating film on the exposed surface of the electroplated layer and the conductor layer to insulate and protect the series network.
8. The method for manufacturing a flexible thin film temperature sensor according to claim 7, wherein the single-side distance width of the circuit area to be electroplated is greater than 0.05mm.
9. The manufacturing method of the flexible film temperature sensor is characterized by comprising the following steps of:
step S21: combining the conductor layer material and the adhesive insulating film into a single-sided base material through hot pressing equipment at high temperature and high pressure;
Step S22: pasting an electroplating-resistant dry film on the surface of the conductor layer; then forming an electroplated layer formed by a plurality of spaced electroplating areas on the surface of the conductor layer through an electroplating process; removing the electroplating-resistant dry film; exposing the conductor layer and the electroplated layer;
Step S23: etching the electroplated layer and the conductor layer into a plurality of adjacent 'several' -shaped circuits and bonding pads through a silk screen printing, exposure, development and etching combined process, so that each 'several' -shaped circuit is divided into left and right halves, wherein one half is a first structural part formed by compounding the conductor layer and the electroplated layer, and the other half is a second structural part only provided with the conductor layer; the adjacent 'several' -shaped circuits are connected end to end, and the first structure part and the second structure part are alternately arranged to form a series network; the head end and the tail end of the series network are connected to the bonding pad and serve as signal output ends;
step S24: and pasting an insulating film with glue on the exposed surface of the conductor layer and the electroplated layer to insulate and protect the series network.
10. The method of claim 9, wherein the single-sided spacing between the boundary of the plating area and the boundary of the circuit to be formed is greater than 0.05mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311833200.0A CN117906772A (en) | 2023-12-28 | 2023-12-28 | Flexible film temperature sensor and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311833200.0A CN117906772A (en) | 2023-12-28 | 2023-12-28 | Flexible film temperature sensor and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN117906772A true CN117906772A (en) | 2024-04-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311833200.0A Pending CN117906772A (en) | 2023-12-28 | 2023-12-28 | Flexible film temperature sensor and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN117906772A (en) |
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- 2023-12-28 CN CN202311833200.0A patent/CN117906772A/en active Pending
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