CN117888093A - Metal plating method and pretreatment process - Google Patents
Metal plating method and pretreatment process Download PDFInfo
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- CN117888093A CN117888093A CN202311746272.1A CN202311746272A CN117888093A CN 117888093 A CN117888093 A CN 117888093A CN 202311746272 A CN202311746272 A CN 202311746272A CN 117888093 A CN117888093 A CN 117888093A
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- metal
- barrel
- sulfuric acid
- acid solution
- plated
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 115
- 239000002184 metal Substances 0.000 title claims abstract description 114
- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000007747 plating Methods 0.000 title claims abstract description 45
- 230000008569 process Effects 0.000 title claims abstract description 24
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 62
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 239000000839 emulsion Substances 0.000 claims abstract description 17
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 17
- 239000000243 solution Substances 0.000 claims description 44
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 24
- 238000001035 drying Methods 0.000 claims description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 239000003638 chemical reducing agent Substances 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 8
- 230000001276 controlling effect Effects 0.000 claims description 8
- 239000012153 distilled water Substances 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 8
- 238000005406 washing Methods 0.000 claims description 8
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 7
- 238000005260 corrosion Methods 0.000 claims description 7
- 230000007797 corrosion Effects 0.000 claims description 7
- 230000009467 reduction Effects 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 5
- 238000002791 soaking Methods 0.000 claims description 5
- 239000003112 inhibitor Substances 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 239000006172 buffering agent Substances 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- 229910052783 alkali metal Inorganic materials 0.000 claims description 2
- 150000001340 alkali metals Chemical class 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 150000002736 metal compounds Chemical class 0.000 claims description 2
- 150000004968 peroxymonosulfuric acids Chemical class 0.000 claims description 2
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 229910052723 transition metal Inorganic materials 0.000 claims description 2
- 150000003624 transition metals Chemical class 0.000 claims description 2
- 230000003139 buffering effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 230000004913 activation Effects 0.000 abstract description 2
- 238000002203 pretreatment Methods 0.000 abstract description 2
- 238000004381 surface treatment Methods 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000006173 Good's buffer Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a metal plating method and a pretreatment process, which comprises the following steps: pretreatment: placing pretreated metal in a sulfuric acid solution barrel to ensure that the metal is completely immersed in a sulfuric acid solution, wherein the concentration of sulfuric acid is controlled to be 100-250 g/L, (II) moving a heating device to the bottom of the sulfuric acid solution barrel, heating the bottom of the sulfuric acid solution barrel by controlling the heating device, and placing the sulfuric acid solution at 50-60 ℃, and (III) placing the metal in the second step in a silicone emulsion barrel, immersing the metal in the silicone emulsion barrel completely, and simultaneously integrally rotating the silicone emulsion barrel, wherein each barrel rotates for two circles every 5min, and the total duration is 30min, and then performing activation treatment, so that the method has the advantages that: the metal plating method and the pretreatment process simplify the traditional pretreatment method, avoid the operation of chemistry and machinery, improve the effect of metal surface treatment and improve the quality of a plating layer.
Description
Technical Field
The invention relates to the technical field of metal materials, in particular to a metal plating method and a pretreatment process.
Background
Metals generally refer to substances which have special luster (namely strong reflection to visible light) and are opaque, ductile, heat-conducting and electric-conducting, the narrow definition of metal concept is simple substances composed of metal elements, pure metals are generally solid at normal temperature, most of the pure metals are excellent conductors of electricity and heat, the density is high, the melting point is high, and when the metals are required to be plated, pretreatment is required to be carried out in advance.
In the field of metal manufacturing and processing, in order to improve the wear resistance, corrosion resistance and aesthetic degree of the metal surface, the metal surface is pretreated, so that the metal is conveniently plated in the later stage, but the traditional plating method has the problems of complex pretreatment process, complex operation difficulty, high monitoring degree of data and unstable quality of metal plating, so that a metal plating method and a pretreatment process which are convenient for solving the problems are provided.
Disclosure of Invention
The invention aims to provide a metal plating method and a pretreatment process, so as to solve the problems of complex pretreatment process, complex operation difficulty, high data monitoring degree and unstable quality of metal plating in the conventional plating method.
In order to achieve the above purpose, the present invention provides the following technical solutions: a metal plating method and a pretreatment process comprise the following steps:
pretreatment: placing the pretreated metal in a sulfuric acid solution barrel to ensure that the whole metal is immersed in the persulfuric acid solution;
secondly, moving the heating device to the bottom of the sulfuric acid solution barrel, and heating the bottom of the sulfuric acid solution barrel by controlling the heating device to enable the sulfuric acid solution to be at 50-60 ℃;
thirdly, putting the metal in the second step into a silicone emulsion barrel, immersing the metal in the second step into the silicone emulsion barrel, and simultaneously rotating the silicone emulsion barrel integrally, wherein each barrel rotates for two circles every 5 minutes for 30 minutes;
taking out the soaked metal to be plated from the interior of a silicone emulsion barrel, then cleaning the metal to be plated through distilled water, and then soaking the metal to be plated in an activated solution;
fifthly, placing the metal to be plated into formaldehyde reducer for reduction treatment, and then taking out the metal after the reduction of the metal to be plated is completed, and washing the metal to be plated by using ionized water until the washing is completed;
step six, combining with electroplating, placing metal in a plating tank containing electroplating liquid on the basis of the completion of cleaning and activating treatment, and adopting a direct current power supply to enable the surface of the metal to form an electroplated layer;
and (seventh) washing the electroplated metal with distilled water, then putting the electroplated metal into a drying device for drying, and then checking the dried electroplated metal.
Preferably, the concentration of the (one) sulfuric acid is controlled to be 100 g/L-250 g/L.
Preferably, the second step is to add corrosion inhibitor and soak the metal in sulfuric acid solution for 2h at the same time when heating sulfuric acid solution for preparation.
Preferably, the metal to be plated after the soaking is taken out from the interior of the silicone emulsion barrel, the metal is put into the interior of the drying preparation, and the internal temperature of the drying device is below 80 ℃.
Preferably, the (IV) activation treatment solution is nitric acid.
Preferably, EDTA is added into the (fifth) formaldehyde reducing agent, and the ratio between the formaldehyde reducing agent and the EDTA is 1: EDTA forms stable water-soluble complexes with alkali metals, rare earth elements and transition metals.
Preferably, the plating solution (six) consists of an aqueous solution containing a plating metal compound, a conductive salt, a buffer, a pH regulator and an additive, wherein the conductive salt is used for increasing the conductivity of the solution, expanding the allowable current density range, and the buffer is used for regulating and controlling the pH value of the solution and has a good buffer effect.
Preferably, the drying time of the (seventh) drying device is set to five minutes, and the temperature of the drying device is set to 100 ℃.
Compared with the prior art, the invention has the beneficial effects that: the metal plating method and the pretreatment process simplify the traditional pretreatment method, avoid the operation of chemistry and machinery, improve the effect of metal surface treatment, prevent the occurrence of data errors, thereby causing hydrogen embrittlement, improving the quality of a plating layer and reducing the plating cost.
Drawings
FIG. 1 is a schematic diagram of experimental data of the present invention
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
A metal plating method and a pretreatment process, the preparation method comprises the following steps:
firstly, placing iron metal with the thickness of 13mm multiplied by 7mm multiplied by 3mm after processing in a sulfuric acid solution barrel, meanwhile, enabling the iron metal to integrally permeate into a sulfuric acid solution, secondly, moving a heating device to the bottom of the sulfuric acid solution barrel, then heating the sulfuric acid solution to 50-60 ℃ by controlling starting of the heating device, adding corrosion inhibitor in the heating process, controlling corrosion of the sulfuric acid solution to the metal to be plated, taking out the metal to be plated after 2h of soaking in the sulfuric acid solution, then cleaning the metal to be plated with water, taking out the metal to be plated, putting the metal to be plated into a silicone emulsion barrel, simultaneously integrally rotating the silicone emulsion barrel, rotating for two circles every 5min, putting the metal to be plated into a drying preparation interior for 30min, and keeping the internal temperature of the drying device below 80 ℃, (IV) washing the metal to be plated by distilled water, then placing the washed metal to be plated into an activated solution which can adopt nitric acid chemical solution to improve the wettability of the metal surface, (V) placing the activated metal to be plated into a formaldehyde reducing agent for reduction treatment, wherein an EDTA acid complexing agent is arranged in the formaldehyde reducing agent, taking out the metal, washing the metal by distilled water, (VI) placing the washed metal to be plated into a plating tank containing plating solution, cleaning and special pre-treating the metal to be plated to serve as a cathode, preparing an anode by using the plating metal, connecting the anode and the cathode of a direct current power supply respectively, and preparing the plating solution from a compound containing the plating metal, conductive salts, a buffering agent, a metal to be plated, the pH regulator and the additive are composed of aqueous solution, after the electric conduction, metal ions in the electroplating solution move to a cathode to form a coating under the action of potential difference, so that the metal is plated, (seventh) after the metal is plated, the electroplated metal is washed by distilled water, then the metal is put into a drying device for drying, the temperature set in the drying device is 100 ℃, then the dried electroplated metal is observed through X-ray diffraction, crystallization is finished on the coating, the surface distribution is uniform and fine, and the situation that cracks and breakage do not appear on the surface coating is caused by an object scratch method, so that the overall quality of the coating is greatly improved on the surface.
Example 2
A metal plating method and a pretreatment process, the preparation method comprises the following steps:
placing metal to be plated in a sulfuric acid solution barrel, moving a heating device to the bottom of the sulfuric acid solution barrel, heating the sulfuric acid solution to 50-60 ℃ by controlling the heating device, adding corrosion inhibitor during heating, controlling corrosion of the sulfuric acid solution to the metal to be plated, soaking the metal in the sulfuric acid solution for 2 hours, taking out the metal, cleaning the metal to be plated with water, taking out the metal, putting the metal into a silicone emulsion barrel, simultaneously integrally rotating the silicone emulsion barrel, rotating for two circles every 5min for 30min, putting the metal to be plated into a drying preparation interior, setting the temperature of the drying device to be below 80 ℃, putting the metal to be plated into a plating tank containing electroplating solution, taking the cleaned and specially pretreated piece to be plated as a cathode, the method comprises the steps of manufacturing an anode by plating metal, connecting two electrodes with the anode and the cathode of a direct current power supply respectively, after electrifying, moving metal ions in an electroplating solution to a cathode to form a plating layer under the action of potential difference, plating the metal, cleaning the plated metal by distilled water after the plating of the metal is finished, then drying the metal in a drying device at 100 ℃, checking the dried plated metal, carrying out traditional plating treatment on a metal substrate, observing the plating layer by X-ray diffraction, wherein the metal plating layer is not crystallized, and the surface is not cracked.
Through assay analysis, the embodiment greatly improves the quality of the plating layer, and is convenient for processing the metal surface.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises an element.
Although the present invention has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present invention.
Claims (8)
1. A metal plating method and a pretreatment process are characterized by comprising the following steps:
pretreatment: placing the pretreated metal in a sulfuric acid solution barrel to ensure that the whole metal is immersed in the persulfuric acid solution;
secondly, moving the heating device to the bottom of the sulfuric acid solution barrel, and heating the bottom of the sulfuric acid solution barrel by controlling the heating device to enable the sulfuric acid solution to be at 50-60 ℃;
thirdly, putting the metal in the second step into a silicone emulsion barrel, immersing the metal in the second step into the silicone emulsion barrel, and simultaneously rotating the silicone emulsion barrel integrally, wherein each barrel rotates for two circles every 5 minutes for 30 minutes;
taking out the soaked metal to be plated from the interior of a silicone emulsion barrel, then cleaning the metal to be plated through distilled water, and then soaking the metal to be plated in an activated solution;
fifthly, placing the metal to be plated into formaldehyde reducer for reduction treatment, and then taking out the metal after the reduction of the metal to be plated is completed, and washing the metal to be plated by using ionized water until the washing is completed;
step six, combining with electroplating, placing metal in a plating tank containing electroplating liquid on the basis of the completion of cleaning and activating treatment, and adopting a direct current power supply to enable the surface of the metal to form an electroplated layer;
and (seventh) washing the electroplated metal with distilled water, then putting the electroplated metal into a drying device for drying, and then checking the dried electroplated metal.
2. The metal plating method and pretreatment process according to claim 1, wherein: the concentration of the sulfuric acid is controlled to be 100 g/L-250 g/L.
3. The metal plating method and pretreatment process according to claim 1, wherein: and (2) during the heating preparation of the sulfuric acid solution, a corrosion inhibitor is required to be added at the same time, and the metal is soaked in the sulfuric acid solution for 2 hours.
4. The metal plating method and pretreatment process according to claim 1, wherein: and (III) taking out the soaked metal to be plated from the interior of the silicone emulsion barrel, putting the metal into a drying preparation interior, and enabling the internal temperature of the drying device to be below 80 ℃.
5. The metal plating method and pretreatment process according to claim 1, wherein: the activating treatment solution (IV) is nitric acid.
6. The metal plating method and pretreatment process according to claim 1, wherein: EDTA is added into the formaldehyde reducing agent, and the ratio of the formaldehyde reducing agent to the EDTA is 1: EDTA forms stable water-soluble complexes with alkali metals, rare earth elements and transition metals.
7. The metal plating method and pretreatment process according to claim 1, wherein: the electroplating solution (six) consists of an aqueous solution containing a plating metal compound, conductive salts, a buffering agent, a pH regulator and an additive, wherein the conductive salts are used for increasing the conductivity of the solution, enlarging the allowable current density range, and the buffering agent is used for regulating and controlling the pH value of the solution and has good buffering effect.
8. The metal plating method and pretreatment process according to claim 1, wherein: the drying time of the (seventh) drying device was set to five minutes, and the temperature of the drying device was set to 100 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311746272.1A CN117888093A (en) | 2023-12-19 | 2023-12-19 | Metal plating method and pretreatment process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311746272.1A CN117888093A (en) | 2023-12-19 | 2023-12-19 | Metal plating method and pretreatment process |
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| Publication Number | Publication Date |
|---|---|
| CN117888093A true CN117888093A (en) | 2024-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311746272.1A Pending CN117888093A (en) | 2023-12-19 | 2023-12-19 | Metal plating method and pretreatment process |
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| Country | Link |
|---|---|
| CN (1) | CN117888093A (en) |
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2023
- 2023-12-19 CN CN202311746272.1A patent/CN117888093A/en active Pending
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