CN1178563C - Making process of printed circuit board with solid copper pins for interconnection - Google Patents

Abstract

The present invention discloses a making process of a printed circuit board with a solid copper pin for interconnection. The process comprises the steps: a first layer of copper foil wiring layer is arranged on a base board or an insulation layer, a layer of conductive layer is laid on the copper foil wiring layer, a layer of dry film as a resisting agent for anti-electroplating is laid on a non interconnection position of the copper foil wiring layer, and the interconnection position where interconnection conduction is needed to be established is exposed; afterwards, a conductive layer on the interconnection position is removed by a micro etching mode so as to cause the interconnection position of a wiring layer to be pure copper foil, and a solid copper pin with the required height is electroplated on the interconnection position of the pure copper foil; the dry film is removed after the solid copper pin is formed, and a pure copper solid copper pin is formed on the interconnection position; finally, the other layer of the wiring layer is made on the solid copper pin, and two layers of wiring layers are conducted by the solid copper pin. A multilayer type printed circuit board with more than two layers of wiring layers can be made by the process.

Description

Utilize the manufacture method of the printed circuit board (PCB) of solid copper pins for interconnection

Technical field

The present invention relates to a kind of manufacture method of utilizing the printed circuit board (PCB) of solid copper pin interconnection (cylindrical copper interconnect) conducting, more particularly, relate between a kind of wiring layer more than two-layer or two-layer the manufacture method that solid copper pin interconnects and reaches the printed circuit board (PCB) that conducts is set.

Background technology

The design of various electronic products in recent years day by day is tending towards approaching, light, short and small, cause various electronic components or in order to the printed circuit board (PCB) (PCB of electronic component to be installed, Printed Circuit Board) also miniaturization relatively and lightweight, so the densification of printed circuit board (PCB) requires also to improve day by day.And want to reach the printed circuit board (PCB) of densification, and can utilize the method that in wiring layer, improves distribution density, also can utilize the method that wiring layer is stacked into multilayer and forms the multiple field printed circuit board (PCB).

The method of making the multiple field printed circuit board (PCB) is big to being divided into two kinds of laminated type and lamination types, wherein laminated type is after forming wiring layer respectively on most substrates, interior interlayer in every two-layer substrate sandwiches heat insulating lamina (resin adds the film that glass fibre forms), at last the multilager base plate heating is pressed into multilayer board; Lamination type is to form heat insulating lamina being provided with on the base material of wiring layer, and then forms another wiring layer on heat insulating lamina, is concatenated to form heat insulating lamina and wiring layer so in regular turn, and then is stacked into multilayer board.

The specific contact of part between each wiring layer interconnects but the line design in the multiple field printed circuit board (PCB) must make up and down, and also existing at present multiple different manufacture method reaches the purpose of mutual conduction, form medium holes as the mode of utilizing laser or machine drilling in the mill at the interconnection position, utilize traditional method on medium holes, to form the electrodeposited coating that can conduct again; Lamination type is that printed substrate is solid copper pin to be set at the interconnection position of wiring layer directly be communicated with contact on another wiring layer.Wherein, the mode of utilizing solid copper pin interconnection (cylindrical copper interconnect) conduction mode to establish the electrodeposited coating interconnection than in medium holes is controlled easily, and conduct the efficient height, therefore, the interconnection mode of printed circuit board (PCB) solid copper pin commonly used.At present, the production method of existing multiple solid copper pins for interconnection, comprise: Japan on November 8th, 1994 disclosed spy open " manufacturing of printed circuit board (PCB) " of flat 6-314878 number (application number is 05-127902) (MANUFACTURE OF PRINTEDWIRING BOARD), the Taiwan patent announcement number is " Printed circuit board and manufacturing methods with solid interconnect " of 407447 (application number is 88101991), the Taiwan patent announcement number is the patent of invention of " manufacture method of multi-layered wiring board " of 411748 (application number is 87120091), but the solid copper pin that above-mentioned patent disclosed (cylindrical copper interconnect) all has the non-fine copper metal of one deck at least, as notification number is 407447, in the patent of invention of " Printed circuit board and manufacturing methods " with solid interconnect, it has one deck etching blocking layer (for the tin lead metal) on solid copper pin, day, spy of the present disclosure opened flat 6-314878 number, " manufacturing of printed circuit board (PCB) " and notification number are 411748, in the patent of invention of " manufacture of multi-layered wiring board ", its solid copper pin all has the conductive layer (as nickel gold Ni-Au alloy) of the non-fine copper of one deck; In addition, notification number is that 411748 patent of invention is directly to etch required solid copper pin the equal thickness metallic object copper electroplating layer of solid copper pin uniform thickness (promptly with) from whole, can cross to lose for a long time because of etching period like this and hinder solid copper pin, make that the footpath of solid copper pin is roomy differs for a short time, therefore, solid copper pin in the above-mentioned conventional process can make resistance change and can't reach uniformity, thereby influences the conducting quality of solid copper pin, and then also can influence the quality of printed circuit board (PCB).

Summary of the invention

For this reason, utilizing the manufacture method of the printed circuit board (PCB) of solid copper pins for interconnection among the present invention mainly is in order to solve the problem that manufacture method in the foregoing invention patent can't reach the fine copper solid copper pin.

The printed circuit board (PCB) that utilizes solid copper pins for interconnection among the present invention is according to poly-making of following step:

(1) one deck Copper Foil wiring layer is set on substrate or insulating barrier;

(2) on this Copper Foil wiring layer, lay one deck conductive layer;

(3) lay the dry film of one deck at the non-interconnection position of this Copper Foil wiring layer, and expose the interconnection position that to set up interconnection as anti-plate resistance agent;

(4) remove the conductive layer of interconnection on the position with the microetch mode, and the interconnection position on wiring layer forms pure Copper Foil;

(5) become solid copper pin of plating on the interconnection position of pure Copper Foil, and reaching required height;

(6) remove dry film, on the interconnection position, form the solid copper pin of a fine copper;

(7) on solid copper pin, make another layer wiring layer, utilize solid copper pin to make two-layer wiring layer realize conducting.

Utilize the solid copper pin that manufacture method makes between the printed circuit board (PCB) among the present invention to be the fine copper material, and its in manufacturing process, can not lose and the footpath of moulding copper post wide, thereby can avoid the shortcoming in traditional solid copper pin manufacturing process, and then can improve the performance that conducts of printed circuit board (PCB) effectively.

Description of drawings

Fig. 1 is the poly-program diagram of manufacture method step that utilizes the printed circuit board (PCB) of solid copper pins for interconnection among the present invention.

Embodiment

As shown in Figure 1, utilize the manufacture method step of the printed circuit board (PCB) of solid copper pins for interconnection to gather as follows among the present invention: the first step poly-(A) is with traditional method one deck Copper Foil wiring layer 2 to be set earlier on substrate 1 or insulating barrier; Second step poly-(B) is laid one deck conductive layer 3 on Copper Foil wiring layer 2; The 3rd step poly-(C) is that one deck dry film 4 is laid at non-interconnection position on this Copper Foil wiring layer 2, and this dry film 4 hinders agent as anti-plate, and exposes the interconnection position 5 that need set up interconnection; The 4th step poly-(D) is to utilize the microetch mode to remove conductive layer 3 on the interconnection position 5, makes the interconnection position 5 on the Copper Foil wiring layer 2 become pure Copper Foil; The 5th step poly-(E) is to become solid copper pin 6 of plating on the interconnection position 5 of pure Copper Foil, and reaches required height; The 6th step poly-(F) is after removing dry film 4 and form a fine copper solid copper pin 6 on interconnection position 5, utilize known lamination manufacture method to make second layer wiring layer again, make second layer wiring layer form electrically conducting, thereby utilize this manufacture method can make the multilayer board of two-layer or two-layer above wiring layer by solid copper pin 6 and ground floor wiring layer 2.

Claims (1)

1. a manufacture method of utilizing the printed circuit board (PCB) of solid copper pins for interconnection is characterized in that, may further comprise the steps:

(1) one deck Copper Foil wiring layer is set on substrate or insulating barrier;

(2) on this Copper Foil wiring layer, lay one deck conductive layer;

(3) lay the dry film of one deck at the non-interconnection position of this Copper Foil wiring layer, and expose the interconnection position that to set up interconnection as anti-plate resistance agent;

(4) remove the conductive layer of interconnection on the position with the microetch mode, make the interconnection position on the wiring layer become pure Copper Foil;

(5) electroplate solid copper pin becoming on the interconnection position of pure Copper Foil, and reach required height;

(6) remove dry film, on the interconnection position, form the solid copper pin of a fine copper;

(7) on solid copper pin, make another layer wiring layer, two-layer wiring layer is conducted by means of solid copper pin.