CN117855204A - LED display device, display module and display panel - Google Patents
LED display device, display module and display panel Download PDFInfo
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- CN117855204A CN117855204A CN202410015549.1A CN202410015549A CN117855204A CN 117855204 A CN117855204 A CN 117855204A CN 202410015549 A CN202410015549 A CN 202410015549A CN 117855204 A CN117855204 A CN 117855204A
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- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
The invention relates to an LED display device, a display module and a display panel. The LED display device comprises a circuit board, driving IC chips and LED light-emitting chips, wherein the LED light-emitting chips are arranged on the front surface of the circuit board in two rows, the driving IC chips are arranged in the middle of the two rows of the LED light-emitting chips, and the directions of the positive electrodes and the negative electrodes of the LED light-emitting chips are the same. Compared with the prior art, the die bonding can be completed by only one die bonding device, so that die bonding turnover is reduced, and production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to an LED display device, a display module and a display panel.
Background
The LED (Light Emitting Diode, light-emitting diode) display panel realizes the display effect by utilizing the light-emitting principle of the LED, has the advantages of high brightness, low energy consumption, long service life and the like, and has wide application in the fields of televisions, displays, automobile display, stage background and the like.
The LED display panel is generally composed of a plurality of display modules that can be combined and spliced. Referring to fig. 1, an LED display module includes a circuit substrate 1', a driving IC chip 2', and four sets of LED light emitting chips 3', wherein the four sets of LED light emitting chips 3' are arranged on the front surface of the circuit substrate 1' in two rows, and the driving IC chip 2' is arranged in the middle of the four sets of LED light emitting chips 3 '. The driving IC chip 2' is provided with four groups of LED light-emitting chip control pins and four common electrode pins, the four groups of LED light-emitting chip control pins are respectively arranged at four vertex positions of the driving IC chip 2', and the four common electrode pins are arranged in the middle of the driving IC chip 2 '. The anodes of the four groups of LED light-emitting chips 3 'are arranged close to the driving IC chip 2', so that the anodes of the LED light-emitting chips 3 'are electrically connected with LED light-emitting chip control pins corresponding to the driving IC chip 2'. The cathodes of the four groups of LED light emitting chips 3' are electrically connected with the common electrode pins corresponding to the driving IC chip 2', and are arranged far away from the driving IC chip 2 '.
Because the four groups of LED light emitting chips 3 'are arranged on two opposite sides of the driving IC chip 2', the positive electrodes are arranged close to the driving IC chip 2', and two LED light emitting chips 3' are arranged in the positive electrode-negative electrode direction, two die bonding devices are needed, so that the packaging cost is high and the efficiency is low.
Disclosure of Invention
Accordingly, the invention aims to provide an LED display device, a display module and a display panel.
In a first aspect, the present invention provides an LED display device, including a circuit board, a driving IC chip, and LED light emitting chips, where the LED light emitting chips are arranged on the front surface of the circuit board in two rows, the driving IC chip is arranged in the middle of the two rows of the LED light emitting chips, and the directions of the positive electrodes and the negative electrodes of the LED light emitting chips are the same.
Compared with the prior art, the LED display device has the advantages that the directions of the positive electrode and the negative electrode of the LED light-emitting chip are the same, die bonding can be completed by only one die bonding device, die bonding turnover is reduced, and production efficiency is improved.
In one embodiment, the driving IC chip is provided with a chip control pin and a power ground pin, the chip control pin is electrically connected with the first electrode corresponding to the LED light emitting chip, the power ground pin includes a first power ground pin and a second power ground pin, and the first power ground pin and the second power ground pin are electrically connected with the second electrode of the LED light emitting chip.
In one embodiment, the chip control pins are disposed close to the corresponding LED light emitting chips, the first power ground pin and the second power ground pin are disposed close to two rows of the LED light emitting chips, and the first power ground pin and the second power ground pin are electrically connected.
In one embodiment, the back of the circuit board is provided with 2 power ground pins, the 2 power ground pins are respectively located at two opposite sides of the back of the circuit board, and the power ground pins are electrically connected with the power ground pins.
In one embodiment, the driving IC chip is further provided with a power supply pin, and the power supply pin comprises a 3.8V pin and a 2.8V pin; the back of the circuit board is provided with a 3.8V pin and a 2.8V pin, the 3.8V pin is electrically connected with the 3.8V pin, and the 2.8V pin is electrically connected with the 2.8V pin.
In one embodiment, the driving IC chip is further provided with a data input pin and a data output pin, the back surface of the circuit board is provided with a data input pin and a data output pin, the data input pin is electrically connected with the data input pin, and the data output pin is electrically connected with the data output pin.
In one embodiment, the data input pins and the data output pins are longitudinally spaced on opposite sides of the back surface of the circuit board.
In one embodiment, the driving IC chip is further provided with a clock input pin and a clock output pin, the back surface of the circuit board is provided with a clock input pin and a clock output pin, the clock input pin is electrically connected with the clock input pin, and the clock output pin is electrically connected with the clock output pin.
In one embodiment, the clock input pins and the clock output pins are longitudinally spaced on opposite sides of the back surface of the circuit board.
In one embodiment, the LED light emitting chips include 2 red light chips, 2 blue light chips and 2 green light chips, the LED light emitting chips are in a two-row six-column arrangement structure, any two adjacent LED light emitting chips are arranged in a staggered manner, and colors of the adjacent LED light emitting chips are different.
In a second aspect, the invention provides an LED display module, which comprises a circuit board and a plurality of the LED display devices, wherein the LED display devices are arranged on the circuit board in an array manner.
In a third aspect, the present invention provides a display panel, including the foregoing LED display module.
Drawings
FIG. 1 is a schematic diagram of a front structure of a prior art LED display device;
fig. 2 is a schematic diagram showing a front structure of an LED display device according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a back structure of an LED display device according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a driving IC chip according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of an LED display module according to an embodiment of the invention;
fig. 6 is a light emitting device multiplexing diagram of an LED display module according to an embodiment of the present invention;
fig. 7 is a schematic diagram of a lamp surface wiring of an LED display module according to an embodiment of the present invention.
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.
In the LED display device in the prior art, there are two positive-negative directions of the red light emitting chip, the green light emitting chip and the blue light emitting chip, so two die bonding devices are required, resulting in high packaging cost and low efficiency. In view of this, the present invention provides an LED display device, which adopts a virtual pixel LED, and designs the pin of the driving IC chip and the pin of the circuit board to make the positive-negative directions of the LED light emitting chips with the same color the same, and the die bonding can be completed by only one die bonding device, thereby reducing die bonding turnover and improving production efficiency.
Embodiments of the present invention will be further described below with reference to the accompanying drawings.
Referring to fig. 2 to 4, the LED display device of the present invention includes a circuit board 1, a driving IC chip 2 and an LED light emitting chip, the driving IC chip 2 and the LED light emitting chip are disposed on the front surface of the circuit board 1, the LED light emitting chips are disposed in two rows, and the driving IC chip 2 is disposed in the middle of the two rows of LED light emitting chips.
Referring to fig. 3, the driving IC chip 2 is provided with a data input pin SDI, a data output pin SDO, a clock input pin CLKI, a clock output pin CLKO, a power ground pin GND, a power supply pin, and a chip control pin. The power ground pin GND includes a first power ground pin and a second power ground pin, the power pins include a 3.8V power pin and a 2.8V power pin, and the chip control pins include a first red light emitting chip control pin r0+, a first green light emitting chip control pin g0+, a first blue light emitting chip control pin b0+, a second red light emitting chip control pin r1+, a second green light emitting chip control pin g1+ and a second blue light emitting chip control pin b1+.
The first red light emitting chip control pin r0+, the data input pin SDI, the first power ground pin, the first green light emitting chip control pin g0+, the 3.8V power pin, the clock input pin CLKI and the first blue light emitting chip control pin b0+ are arranged at intervals in the row direction, and the second blue light emitting chip control pin b1+, the data output pin SDO, the 2.8V power pin, the second power ground pin, the second red light emitting chip control pin r1+, the clock output pin CLKO and the second green light emitting chip control pin g1+ are arranged at intervals in the row direction.
The first red light emitting chip control pin R0+ and the second blue light emitting chip control pin B1+ are arranged at intervals in the column direction, the data input pin SDI and the data output pin SDO are arranged at intervals in the column direction, the first power ground pin GND and the 2.8V power pin GND are arranged at intervals in the column direction, the first green light emitting chip control pin G0+ and the second power ground pin GND are arranged at intervals in the column direction, the 3.8V power pin and the second red light emitting chip control pin R1+ are arranged at intervals in the column direction, the clock input pin CLKI and the clock output pin CLKO are arranged at intervals in the column direction, and the first blue light emitting chip control pin B0+ and the second green light emitting chip control pin G1+ are arranged at intervals in the column direction.
The LED light emitting chips include 2 red light emitting chips, 2 blue light emitting chips, and 2 green light emitting chips, the first red light emitting chip 31, the first green light emitting chip 32, and the first blue light emitting chip 33 are disposed above the driving IC chip 2 at intervals in the row direction, and the second red light emitting chip 34, the second green light emitting chip 35, and the second blue light emitting chip 36 are disposed below the driving IC chip 2 at intervals in the row direction. In the column direction, the second blue light emitting chip 36 is located in the middle of the first red light emitting chip 31 and the first green light emitting chip 32, and the second red light emitting chip 34 is located in the middle of the first green light emitting chip 32 and the first blue light emitting chip 33.
The positive electrodes of the first red light emitting chip 31, the first green light emitting chip 32, and the first blue light emitting chip 33 are disposed on the side away from the driving IC chip 2, and the positive electrodes of the second red light emitting chip 34, the second green light emitting chip 35, and the second blue light emitting chip 36 are disposed on the side close to the driving IC chip 2, as compared with the corresponding negative electrodes. Therefore, the directions of the positive electrode and the negative electrode of the LED light-emitting chip are the same, die bonding can be completed by only one die bonding device, die bonding turnover is reduced, and production efficiency is improved.
For convenience of wiring, the LED light emitting chip and the corresponding chip control pin are provided on the same side of the driving IC chip 2. The positive pole of the LED light-emitting chip is electrically connected with the chip control pin. Specifically, the first red light lead 111 is located between the first red light emitting chip 31 and the first green light emitting chip 32, and connects the positive electrode of the first red light emitting chip 31 and the first red light emitting chip control pin r0+. The first green light lead 112 is located between the first green light emitting chip 32 and the first blue light emitting chip 33, and connects the positive electrode of the first green light emitting chip 32 with the first green light emitting chip control pin g0+. The first blue lead 113 is located between the first green light emitting chip 32 and the first blue light emitting chip 33, and connects the positive electrode of the first blue light emitting chip 33 with the first blue light emitting chip control pin b0+. Since the anodes of the second red light emitting chip 34, the second green light emitting chip 35 and the second blue light emitting chip 36 are disposed at the side close to the driving IC chip 2, the anodes of the second red light emitting chip 34, the second green light emitting chip 35 and the second blue light emitting chip 36 are directly electrically connected to the corresponding chip control pins. That is, the positive electrode of the second red light emitting chip 34 is electrically connected to the second red light emitting chip control pin r1+, the positive electrode of the second green light emitting chip 35 is electrically connected to the second green light emitting chip control pin g1+, and the positive electrode of the second blue light emitting chip 36 is electrically connected to the second blue light emitting chip control pin b1+.
The negative pole of LED luminescence chip is connected with power ground pin GND electricity. Specifically, the first negative electrode lead 114 connects the negative electrode of the first green light emitting chip 32 with the first power ground pin. One end of the second negative electrode lead 115 is connected to the second power ground pin, and the other end is connected to the negative electrode of the first red light emitting chip 31, the first power ground pin, and the negative electrode of the first blue light emitting chip 33, respectively. One end of the third negative electrode lead 116 is connected to the second power ground pin, and the other end is connected to the negative electrodes of the second red light emitting chip 34, the second green light emitting chip 35 and the second blue light emitting chip 36, respectively. That is, the cathodes of the first red light emitting chip 31, the first green light emitting chip 32, the first blue light emitting chip 33, the second red light emitting chip 34, the second green light emitting chip 35, and the second blue light emitting chip 36 are all electrically connected to 2 power ground pins GND.
Referring to fig. 4, the back surface of the circuit board 1 is provided with a data input pin SDI, a data output pin SDO, a clock input pin CLKI, a clock output pin CLKO, a power supply pin and a power supply ground pin GND. Wherein, the power pin includes 3.8V power pin and 2.8V power pin, and power ground pin GND includes first power ground pin and second power ground pin. The first power supply ground pin GND, the data input pin SDI, the clock input pin CLKI and the 3.8V power supply pin are arranged at intervals in the row direction, the 2.8V power supply pin, the data output pin SDO, the clock output pin CLKO and the second power supply ground pin GND are arranged at intervals in the row direction, the first power supply ground pin GND and the 2.8V power supply pin are arranged at intervals in the column direction, the data input pin SDI and the data output pin SDO are arranged at intervals in the column direction, the clock input pin CLKI and the clock output pin CLKO are arranged at intervals in the column direction, and the 3.8V power supply pin GND and the second power supply ground pin GND are arranged at intervals in the column direction.
The data input pin SDI is electrically connected with the data input pin SDI, the data output pin SDO is electrically connected with the data output pin SDO, the clock input pin CLKI is electrically connected with the clock input pin CLKI, the clock output pin CKLO is electrically connected with the clock output pin CLKI, the 3.8V power supply pin is electrically connected with the 3.8V power supply pin, and the 2.8V power supply pin is electrically connected with the 2.8V power supply pin. The first power ground pin is electrically connected to the second negative lead 115, and the second power ground pin is electrically connected to the third negative lead 116.
Referring to fig. 5, the invention further provides an LED display module, which includes a circuit board and a plurality of LED display devices, wherein the plurality of LED display devices are arranged in an array on the circuit board.
Referring to fig. 6, the array-arranged LED display device forms a virtual pixel arrangement structure, which includes a plurality of array-arranged LED light emitting chips. Because any three adjacent different-color light emitting chips form a pixel unit, the multiplexing times of the LED light emitting chips are three times, and the number and the pixel density of the display pixels are effectively improved under the condition that the number of the LED light emitting chips is the same, so that the display effect is finer.
Referring to fig. 7, since the LED light emitting chip and the driving IC chip of the LED display device are integrated in one package, the LED display module is only required to connect the data signal line, the clock signal line, and the power line, and connect these leads to the connector. The LED display module is simple in wiring and can effectively reduce the cost of the module board by only needing one layer of data signal wire, clock signal wire and power supply connecting wire and connecting the data signal wire, the clock signal wire and the power supply connecting wire to the connector.
The invention also provides an LED display panel which comprises a plurality of LED display modules.
Compared with the prior art, the LED display device has the advantages that the directions of the positive electrode and the negative electrode of the LED light-emitting chip are the same, die bonding can be completed by only one die bonding device, die bonding turnover is reduced, and production efficiency is improved. In addition, the invention integrates a plurality of LED light emitting chips and the driving IC chip into one package body, reduces the packaging process flow, reduces the packaging cost and improves the reliability of the LED display device. In addition, the invention realizes static driving, has high brightness, no moire phenomenon and good display effect.
The present invention may have various modified embodiments, for example, the positions of the LED light emitting chips of different colors may be changed as long as the color of any one LED light emitting chip is different from the color of the adjacent LED light emitting chip.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.
Claims (12)
1. The LED display device is characterized by comprising a circuit board, a driving IC chip and LED light-emitting chips, wherein the LED light-emitting chips are arranged on the front surface of the circuit board in two rows, the driving IC chip is arranged in the middle of the two rows of the LED light-emitting chips, and the directions of the positive electrodes and the negative electrodes of the LED light-emitting chips are the same.
2. The LED display device of claim 1, wherein the driving IC chip is provided with a chip control pin and a power ground pin, the chip control pin being electrically connected to a first electrode of the corresponding LED light emitting chip, the power ground pin including a first power ground pin and a second power ground pin, the first power ground pin and the second power ground pin being electrically connected to a second electrode of the LED light emitting chip.
3. The LED display device of claim 2, wherein the chip control pins are disposed proximate to the corresponding LED light emitting chips, the first and second power ground pins are disposed proximate to two rows of LED light emitting chips, respectively, and the first and second power ground pins are electrically connected.
4. The LED display device of claim 3, wherein the back surface of the circuit board is provided with 2 power ground pins, the 2 power ground pins are respectively located at two opposite sides of the back surface of the circuit board, and the power ground pins are electrically connected with the power ground pins.
5. The LED display device of claim 3, wherein the driving IC chip is further provided with power supply pins including 3.8V pins and 2.8V pins; the back of the circuit board is provided with a 3.8V pin and a 2.8V pin, the 3.8V pin is electrically connected with the 3.8V pin, and the 2.8V pin is electrically connected with the 2.8V pin.
6. The LED display device of claim 3, wherein the driving IC chip is further provided with a data input pin and a data output pin, the back surface of the wiring board is provided with a data input pin and a data output pin, the data input pin is electrically connected with the data input pin, and the data output pin is electrically connected with the data output pin.
7. The LED display device of claim 6, wherein the data input pins and the data output pins are longitudinally spaced on opposite sides of the back surface of the circuit board.
8. The LED display device of claim 3, wherein the driver IC chip is further provided with a clock input pin and a clock output pin, the back surface of the wiring board is provided with a clock input pin and a clock output pin, the clock input pin is electrically connected to the clock input pin, and the clock output pin is electrically connected to the clock output pin.
9. The LED display device of claim 8, wherein the clock input pins and clock output pins are longitudinally spaced on opposite sides of the back surface of the circuit board.
10. The LED display device of any one of claims 1 to 9, wherein the LED light emitting chips comprise 2 red light chips, 2 blue light chips and 2 green light chips, the LED light emitting chips are in a two-row six-column arrangement, any two adjacent LED light emitting chips are arranged in a staggered manner, and the adjacent LED light emitting chips are different in color.
11. An LED display module comprising a circuit board and a plurality of LED display devices according to any one of claims 1 to 10, wherein the LED display devices are arranged in an array on the circuit board.
12. A display panel comprising the LED display module of claim 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410015549.1A CN117855204A (en) | 2024-01-03 | 2024-01-03 | LED display device, display module and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410015549.1A CN117855204A (en) | 2024-01-03 | 2024-01-03 | LED display device, display module and display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117855204A true CN117855204A (en) | 2024-04-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410015549.1A Pending CN117855204A (en) | 2024-01-03 | 2024-01-03 | LED display device, display module and display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117855204A (en) |
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2024
- 2024-01-03 CN CN202410015549.1A patent/CN117855204A/en active Pending
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