CN117854934A - Chip capacitor base - Google Patents
Chip capacitor base Download PDFInfo
- Publication number
- CN117854934A CN117854934A CN202410255218.5A CN202410255218A CN117854934A CN 117854934 A CN117854934 A CN 117854934A CN 202410255218 A CN202410255218 A CN 202410255218A CN 117854934 A CN117854934 A CN 117854934A
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- Prior art keywords
- jack
- base
- capacitor
- chip capacitor
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000003990 capacitor Substances 0.000 title claims abstract description 136
- 210000001503 joint Anatomy 0.000 claims abstract description 16
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000000805 composite resin Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000011324 bead Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000013011 mating Effects 0.000 claims 4
- 238000000034 method Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 4
- 230000005611 electricity Effects 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- 238000003032 molecular docking Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The technical scheme of the application provides a chip capacitor base. For mounting a chip capacitor; the patch capacitor base comprises a base body, wherein pin jacks communicated with the top surface and the bottom surface of the base body are formed in the base body, and each pin jack comprises a first jack corresponding to an anode pin of the patch capacitor and a second jack corresponding to a cathode pin; the bottom surface of the base body is provided with a conducting strip, the conducting strip comprises a first conducting strip and a second conducting strip, one end of the first conducting strip is in butt joint with the first jack, and one end of the second conducting strip is in butt joint with the second jack; the conductive sheet is used for forming connection with the capacitor pins penetrating through the corresponding pin jacks after the patch capacitor is mounted on the top surface of the patch capacitor base. This application technical scheme adopts cut straightly formula base, when paster condenser and base assembly, reducible processing procedure to the condenser pin promotes production efficiency, and forms the mode that the electricity is connected with the circuit board through the conducting strip more stable.
Description
Technical Field
The application relates to the technical field of capacitor manufacturing, in particular to a chip capacitor base.
Background
The chip capacitor is divided into a chip ceramic capacitor and a chip aluminum electrolytic capacitor, is a capacitance material and has the advantages of small volume, high efficiency, low consumption and the like. The patch aluminum electrolytic capacitor is widely applied to various electronic products with compact structure, small volume and high precision, for example: communication equipment, computers and peripheral accessories, multimedia players, vehicle-mounted industry, security industry, digital products, intelligent home and other consumer electronic products.
The mounting process of the base of the chip aluminum electrolytic capacitor generally comprises the steps of feeding, separating, trimming, cutting and detecting the chip aluminum electrolytic capacitor, and then mounting the base, namely a so-called mounting plate. The purpose is to support and insulate the chip capacitor mounted on the PCB. The existing assembly plate procedure is to flatten the anode and cathode pins of the chip capacitor, insert the pins into the base, and then bend and flatten the pins. Because the existing base design defect of the chip capacitor makes the assembly process not efficient, especially needs to flatten and bend the pin, and the like, the leakage current is easily increased due to insufficient machining precision, and the quality problems such as unstable product quality are easily caused.
Disclosure of Invention
The application provides a chip capacitor base, aims at solving the problem that the assembly between capacitor and base that base design defect leads to among the prior art has the process complicacy, assembly efficiency is not high, product quality is unstable.
To achieve the above object, the present application proposes a chip capacitor base for mounting a chip capacitor; the chip capacitor base includes:
the socket body is provided with a pin jack communicated with the top surface and the bottom surface of the socket body, and the pin jack comprises a first jack corresponding to the positive pin of the patch capacitor and a second jack corresponding to the negative pin; the bottom surface of the base body is provided with a conducting strip, the conducting strip comprises a first conducting strip and a second conducting strip, one end of the first conducting strip is in butt joint with the first jack, and one end of the second conducting strip is in butt joint with the second jack;
the conductive sheet is used for forming connection with the capacitor pins penetrating into the corresponding pin jacks after the patch capacitor is mounted on the top surface of the patch capacitor base.
In some embodiments, a pitch between the first receptacle and the second receptacle is consistent with a pitch between the positive pin and the negative pin.
In some embodiments, conductive metal cylinders are disposed in the first jack and the second jack, the conductive metal cylinders are attached to inner side walls of the first jack and the second jack, and each conductive metal cylinder is connected with the corresponding first conductive sheet and the corresponding second conductive sheet.
In some embodiments, the bottom surface of the base is provided with a die symbol; wherein an anode symbol is provided adjacent to the first jack, a cathode symbol is provided adjacent to the second jack, and the stamper symbol corresponds to the anode symbol and the cathode symbol on the capacitor.
In some embodiments, the first conductive sheet is provided with a first butt joint hole, the first butt joint hole is opposite to the first jack, the second conductive sheet is provided with a second butt joint hole, and the second butt joint hole is opposite to the second jack.
In some embodiments, the conductive sheet and the conductive metal can are made of a material including one of gold, silver, and copper.
In some embodiments, the top periphery of the base is provided with a plurality of positioning pieces, the height of the plurality of positioning pieces is not higher than two thirds of the mounted chip capacitor, and the plurality of positioning pieces enclose a capacitor mounting area.
In some embodiments, the positioning member comprises a positioning block or a positioning post.
In some embodiments, a jack boss is formed in the capacitor mounting area, and the height of the jack boss is higher than the height of the sealing curled edge in the patch capacitor than the plane of the rubber plug; the pin jack is formed on the jack boss.
In some embodiments, the base is in a shape of a non-regular-edge octagon and is formed by injection molding of insulating and temperature-resistant composite resin.
The technical scheme of the application provides a patch capacitor base which is used for installing a patch capacitor; the patch capacitor base comprises a base body, wherein pin jacks communicated with the top surface and the bottom surface of the base body are formed in the base body, and each pin jack comprises a first jack corresponding to an anode pin of the patch capacitor and a second jack corresponding to a cathode pin; the bottom surface of the base body is provided with a conducting strip, the conducting strip comprises a first conducting strip and a second conducting strip, one end of the first conducting strip is in butt joint with the first jack, and one end of the second conducting strip is in butt joint with the second jack; the conductive sheet is used for forming connection with the capacitor pins penetrating through the corresponding pin jacks after the patch capacitor is mounted on the top surface of the patch capacitor base. According to the technical scheme, the direct-inserting type seat body is adopted, the pins of the patch type capacitor can be respectively inserted into the pin jacks through the first jacks corresponding to the anode pins of the capacitor and the second jacks corresponding to the cathode pins of the capacitor, the first conductive sheets and the second conductive sheets are respectively arranged on the bottom surface of the seat body corresponding to the first jacks and the second jacks, two pins of the patch type capacitor can be further connected with the corresponding conductive sheets respectively, and further the patch type capacitor is electrically connected with a circuit board through the conductive sheets. According to the technical scheme, when the chip capacitor is mounted on the base, the traditional processing procedure of pins of the capacitor is reduced, the production efficiency is improved, and the mode of forming electric connection with the circuit board through the conducting strip is more stable.
Drawings
For a clearer description of embodiments of the present application or of the solutions of the prior art, the drawings that are required to be used in the description of the embodiments or of the prior art will be briefly described, it being apparent that the drawings in the description below are only some embodiments of the present application, and that other drawings may be obtained, without inventive effort, by a person skilled in the art from these drawings, in which:
FIG. 1 is a schematic top plan view of a chip capacitor base according to an embodiment of the present disclosure;
FIG. 2 is a schematic top view of a bottom surface of a chip capacitor base according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram of the bottom of a patch capacitor housing;
wherein: 100-a chip capacitor base; 10-a base; 20-pin jacks; 210-a first jack; 220-a second jack; 30-conducting strips; 310-a first conductive sheet; 320-a second conductive sheet; 40-a conductive metal cylinder; 50-positioning pieces; 60-capacitor mounting area; 70-socket boss.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are merely used to explain the relative positional relationship, movement, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is correspondingly changed.
It will also be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Furthermore, the descriptions of "first," "second," and the like, herein are for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be regarded as not exist and not within the protection scope of the present application.
Referring to fig. 1 and 2, the present application proposes a chip capacitor base 100 for mounting a chip capacitor; the patch capacitor base 100 comprises a base body 10, wherein a pin jack 20 communicated with the top surface and the bottom surface of the base body 10 is formed in the base body 10, and the pin jack 20 comprises a first jack 210 corresponding to an anode pin of the patch capacitor and a second jack 220 corresponding to a cathode pin; the bottom surface of the base body 10 is provided with a conductive sheet 30, the conductive sheet 30 comprises a first conductive sheet 310 and a second conductive sheet 320, one end of the first conductive sheet 310 is in butt joint with the first jack 210, and one end of the second conductive sheet 320 is in butt joint with the second jack 220; the conductive sheet 30 is used for forming connection with the capacitor pins penetrating into the corresponding pin jacks 20 after the chip capacitor is mounted on the top surface of the chip capacitor base 100.
It will be appreciated that the chip capacitor base 100 is a component for supporting and fixing the chip capacitor, and in the electronic device, the chip capacitor is connected to a circuit board or other parts of the electronic device through the chip capacitor base 100 to realize an electrical function thereof.
When the chip capacitor is installed, pins of the chip capacitor are inserted into corresponding pin jacks 20 and then correspondingly connected with the conductive plates 30 arranged on the bottom surface of the chip capacitor in a welding mode or the like, wherein positive pins are connected with the first conductive plates 310, negative pins are connected with the second conductive plates 320, and the chip capacitor is further connected to a circuit board through the conductive plates 30.
A specific assembly of a chip capacitor and a chip capacitor base 100 includes: the singulated and aged capacitors are loaded into a loading tray, the capacitors to be assembled to the base are transferred directly to the assembly device, and the pin receptacles 20 are aligned and the assembly of the capacitors is completed using CCD imaging vision techniques in the machine vision system. The basic principle is as follows: the image light beam shot by the lens is focused on the photoconductive target thereof by the camera tube, and the target surface is scanned by the electron beam, so that a voltage output proportional to the luminous flux of each point of the target surface can be generated in time sequence. The output voltage value of the CCD array is determined by the size of the luminous flux projected onto the diode, so that the position of the pin inserted into the pin jack 20 is determined, and the accuracy of the pin inserted into the pin jack can reach 0.01mm. After the double pins are inserted into the corresponding pin jacks 20 on the base, the CCD machine vision equipment aligns the round holes on the bottom surface of the base with the laser head, the laser welding function is started, and the pin ends are welded with the conductive sheets 30 on the base on the bottom surface, so that the assembly process of the whole capacitor on the base is completed.
Therefore, based on the chip capacitor base 100 that this application provided, when carrying out the installation of chip capacitor, need not to carry out traditional flattening and bending process to the capacitor pin, save operating procedure, promote production efficiency, and assembly accuracy is high, improves product quality's stability greatly.
Referring to fig. 1, the base 10 is in a shape of a non-regular-edge octagon and is formed by injection molding of insulating and heat-resistant composite resin. In one embodiment, the seat 10 is a seat structure formed by opening circular arcs at four corners inwards on the basis of a rectangular plate. When the material is prepared from the insulating and temperature-resistant composite resin, good insulation protection can be provided based on the insulating and temperature-resistant composite resin, normal operation and safe use of the capacitor are ensured, the insulating and temperature-resistant composite resin has good processing performance, can adapt to various complex shape and size requirements, has lower cost, and can improve the mechanical stability and heat dissipation performance of the capacitor.
Referring to fig. 1, in some embodiments, a plurality of positioning members 50 are disposed on the top periphery of the base 10, the height of the plurality of positioning members 50 is not higher than two thirds of the mounted chip capacitor, and the plurality of positioning members 50 enclose a capacitor mounting area 60.
Typically, the chip capacitor is cylindrical, and therefore, the plurality of spacers 50 enclose a capacitor mounting area 60 that forms a circle. Wherein, the height of the positioning piece 50 is not higher than two thirds of the height of the mounted chip capacitor, which can reduce the waste of the base material under the condition of ensuring the stable mounting of the chip capacitor. For example, when the mounted chip capacitor has a height of 9mm, the height of the positioning member 50 may be 6mm.
Further, the positioning member 50 includes a positioning block or a positioning post. The positioning block can be an arc groove which is provided with a side wall attached to the capacitor, so that a plurality of positioning blocks form a capacitor installation area 60 based on the surrounding of the arc groove; when the positioning member 50 is a positioning post, a circle may be drawn by cutting a line based on the positioning post, thereby forming the capacitor mounting area 60. The number of the positioning blocks and the positioning columns is at least four, and the number of the positioning blocks and the positioning columns is not limited.
Referring to fig. 1, in some embodiments, a jack boss 70 is formed in the capacitor mounting region 60, and the height of the jack boss 70 is the height of the seal bead in the chip capacitor above the plane of the rubber plug; the pin jack 20 is formed on the jack boss 70.
It can be appreciated that after the jack boss 70 is provided, the chip capacitor is just on a plane after being assembled on the chip capacitor base 10, so as to prevent the chip capacitor from being raised to shake, and improve the stability of the chip capacitor. Because the height of the seal bead of the aluminum shell of the capacitor is 1-3 mm larger than the plane of the rubber plug, the height of the jack boss 70 is also in the range of 1-3 mm.
Wherein the jack boss 70 is formed at the center of the capacitor mounting area 60, and further, the set pin jack 20 is located at the center of the jack boss 70, and the pitch between the first jack 210 and the second jack 220 is identical to the pitch between the positive and negative pins of the chip capacitor. Thus, the position corresponding relation is established, and the interval between the positive electrode pin and the negative electrode pin does not need to be adjusted when the chip capacitor is assembled on the base.
Referring to fig. 2, in some embodiments, the first jack 210 and the second jack 220 are each provided with a conductive metal cylinder 40, the conductive metal cylinders 40 are attached to inner sidewalls of the first jack 210 and the second jack 220, and each conductive metal cylinder 40 is connected to a corresponding first conductive sheet 310 and a corresponding second conductive sheet 320.
In this embodiment, since the conductive metal tube 40 disposed in the pin jack 20 is connected with the conductive sheet 30, the contact area between the conductive sheet 30 and the pins of the chip capacitor can be increased, the resistance and impedance can be reduced, and the connection between the conductive sheet 30 and the pins of the chip capacitor can be easily established after the soldering operation is performed.
In some embodiments, the conductive sheet 30 and the conductive metal can 40 are made of one of gold, silver and copper, and have good electrical conductivity.
Referring to fig. 2, in some embodiments, a first docking hole (not shown) is formed in the first conductive sheet 310, the first docking hole is disposed opposite to the first jack 210, and a second docking hole (not shown) is formed in the second conductive sheet 320, the second docking hole is disposed opposite to the second jack 220.
Wherein, set up the butt joint hole respectively on two conducting strips 30, help the paster condenser installation back, its pin extends to in the butt joint hole, and then conveniently realize the welding between the pin of paster condenser and the conducting strip 30.
It should be noted that, before the chip capacitor is mounted on the chip capacitor base 100, the pins of the chip capacitor need to be cut, and the length of the pins of the chip capacitor is equal to the sum of the depth of the pin jack 20 and the thickness of the conductive sheet 30, that is, the ends of the pins of the chip capacitor are just flush with the conductive sheet 30 after the chip capacitor is mounted.
In some embodiments, the bottom surface of the base 10 is provided with a compression molded symbol (not shown in the drawings); wherein a positive sign is provided adjacent to the first receptacle 210, a negative sign is provided adjacent to the second receptacle 220, and the compression molded sign corresponds to the positive sign on the capacitor. Thus, the positive electrode and the negative electrode are conveniently distinguished, and corresponding assembly is carried out. The anode and cathode labels on the bottom of the capacitor aluminum case corresponding to the anode and cathode on the bottom of the chip capacitor base 100 are printed on the chip capacitor case as shown in fig. 3: the black part represents the negative of the pin, the colorless part represents the positive of the pin, the middle number 47 represents the nominal capacity (microfarads), and 35V represents the nominal voltage.
In summary, the present application provides a chip capacitor base 100 that can be used for mounting a chip capacitor. Pins of the patch capacitor pass through the pin jacks 20 and are connected with the conductive sheets 30 on the bottom surface, and then the conductive sheets 30 are connected with the circuit board. Make under the circumstances based on patch capacitor base 100 that this application provided, reduce the processing procedure when patch capacitor and base are installed, promote production efficiency, and finally form the electricity between more stable conducting strip 30 and the circuit board and be connected.
The foregoing description of the preferred embodiments and examples of the present application should not be construed as limiting the scope of the present application, but rather as utilizing equivalent structural changes made in the description and drawings of the present application or directly/indirectly applied to other related technical fields under the concept of being integral with the present application.
Claims (10)
1. A chip capacitor base for mounting a chip capacitor; the chip capacitor base is characterized by comprising:
the socket body is provided with a pin jack communicated with the top surface and the bottom surface of the socket body, and the pin jack comprises a first jack corresponding to the positive pin of the patch capacitor and a second jack corresponding to the negative pin; the bottom surface of the base body is provided with a conducting strip, the conducting strip comprises a first conducting strip and a second conducting strip, one end of the first conducting strip is in butt joint with the first jack, and one end of the second conducting strip is in butt joint with the second jack;
the conductive sheet is used for forming connection with the capacitor pins penetrating into the corresponding pin jacks after the patch capacitor is mounted on the top surface of the patch capacitor base.
2. The chip capacitor base of claim 1, wherein a pitch between the first and second receptacles is consistent with a pitch between the positive and negative pins.
3. The chip capacitor base of claim 2, wherein conductive metal cylinders are disposed in the first jack and the second jack, the conductive metal cylinders are attached to inner sidewalls of the first jack and the second jack, and each conductive metal cylinder is connected to the corresponding first conductive piece and the corresponding second conductive piece.
4. A chip capacitor base according to claim 3, wherein the bottom surface of the base is provided with a die symbol; wherein an anode symbol is provided adjacent to the first jack, a cathode symbol is provided adjacent to the second jack, and the stamper symbol corresponds to the anode symbol and the cathode symbol on the capacitor.
5. The chip capacitor base of claim 1, wherein the first conductive sheet has a first mating hole formed therein, the first mating hole is disposed opposite to the first jack, the second conductive sheet has a second mating hole formed therein, and the second mating hole is disposed opposite to the second jack.
6. The chip capacitor base of claim 5, wherein the conductive sheet and the conductive metal can are made of a material comprising one of gold, silver, and copper.
7. The chip capacitor base of claim 1, wherein a top periphery of the base is provided with a plurality of positioning members, a height of the plurality of positioning members is not higher than two thirds of the mounted chip capacitor, and the plurality of positioning members enclose a capacitor mounting area.
8. The chip capacitor base of claim 7, wherein the positioning member comprises a positioning block or a positioning post.
9. The chip capacitor base of claim 7, wherein a receptacle boss is formed in the capacitor mounting area, the receptacle boss having a height above a plane of the plug for the seal bead in the chip capacitor; the pin jack is formed on the jack boss.
10. The chip capacitor base of claim 1, wherein said base is in the shape of a non-regular-sided octagon and is formed by injection molding an insulating, temperature-resistant composite resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410255218.5A CN117854934A (en) | 2024-03-06 | 2024-03-06 | Chip capacitor base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410255218.5A CN117854934A (en) | 2024-03-06 | 2024-03-06 | Chip capacitor base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117854934A true CN117854934A (en) | 2024-04-09 |
Family
ID=90548423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410255218.5A Pending CN117854934A (en) | 2024-03-06 | 2024-03-06 | Chip capacitor base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117854934A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02231704A (en) * | 1989-03-03 | 1990-09-13 | Toyo Commun Equip Co Ltd | Electrode structure of surface mounted electronic part |
| JP2002025871A (en) * | 2000-07-11 | 2002-01-25 | Matsushita Electric Ind Co Ltd | Chip-type aluminum electrolytic capacitor |
| EP2169695A1 (en) * | 2008-09-26 | 2010-03-31 | Epcos Ag | Condenser with a condenser holder and fitting assembly |
| US20100296228A1 (en) * | 2009-05-20 | 2010-11-25 | Gemme Electronics Co., Ltd. | Electrolytic capacitor |
| CN203232801U (en) * | 2013-03-18 | 2013-10-09 | 南通新联电子有限公司 | Super-thin capacitor base seat |
| US20220238283A1 (en) * | 2019-06-06 | 2022-07-28 | Nippon Chemi-Con Corporation | Capacitor and method for producing same, and capacitor-mounting method |
| CN115565779A (en) * | 2021-07-02 | 2023-01-03 | 丰宾电子（深圳）有限公司 | Soldering-assisting type capacitor seat board |
| CN219066637U (en) * | 2022-12-09 | 2023-05-23 | 南通通成电子有限公司 | Plug-in type aluminum electrolytic capacitor |
| CN116469679A (en) * | 2023-03-17 | 2023-07-21 | 珠海格力新元电子有限公司 | Anti-vibration mounting structure of patch aluminum electrolytic capacitor and welding method thereof |
-
2024
- 2024-03-06 CN CN202410255218.5A patent/CN117854934A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02231704A (en) * | 1989-03-03 | 1990-09-13 | Toyo Commun Equip Co Ltd | Electrode structure of surface mounted electronic part |
| JP2002025871A (en) * | 2000-07-11 | 2002-01-25 | Matsushita Electric Ind Co Ltd | Chip-type aluminum electrolytic capacitor |
| EP2169695A1 (en) * | 2008-09-26 | 2010-03-31 | Epcos Ag | Condenser with a condenser holder and fitting assembly |
| US20100296228A1 (en) * | 2009-05-20 | 2010-11-25 | Gemme Electronics Co., Ltd. | Electrolytic capacitor |
| CN203232801U (en) * | 2013-03-18 | 2013-10-09 | 南通新联电子有限公司 | Super-thin capacitor base seat |
| US20220238283A1 (en) * | 2019-06-06 | 2022-07-28 | Nippon Chemi-Con Corporation | Capacitor and method for producing same, and capacitor-mounting method |
| CN115565779A (en) * | 2021-07-02 | 2023-01-03 | 丰宾电子（深圳）有限公司 | Soldering-assisting type capacitor seat board |
| CN219066637U (en) * | 2022-12-09 | 2023-05-23 | 南通通成电子有限公司 | Plug-in type aluminum electrolytic capacitor |
| CN116469679A (en) * | 2023-03-17 | 2023-07-21 | 珠海格力新元电子有限公司 | Anti-vibration mounting structure of patch aluminum electrolytic capacitor and welding method thereof |
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