CN117812844A

CN117812844A - Thermal welding structure and method for electronic component

Info

Publication number: CN117812844A
Application number: CN202311868958.8A
Authority: CN
Inventors: 吴杰翰
Original assignee: Individual
Current assignee: Individual
Priority date: 2023-12-29
Filing date: 2023-12-29
Publication date: 2024-04-02

Abstract

The invention provides a thermal welding structure and a thermal welding method for an electronic element, which improve the structure and the assembly method of a product and avoid a plurality of problems caused by applying an SMT technology. The thermal welding structure of the electronic component comprises a patch electronic component, a metal piece and a base; the patch electronic element is provided with a plurality of metal sheets for electric connection; the metal piece is embedded in the base; the patch electronic element is matched with the upper surface of the base, and a through hole is formed in the lower surface of the base corresponding to the metal sheet; the metal sheet and the metal piece are connected into a whole after being hot melted by laser penetrating into the through hole. When the metal piece and the base are processed, the through hole of the base is processed and molded, then the patch electronic element is pressed on the upper surface of the base so as to enable the metal piece to be tightly attached to the metal piece, and the metal piece and the base are welded at the welding position in a continuous or intermittent line trend by adopting a fish scale welding or intermittent welding technology in the laser welding process.

Description

Thermal welding structure and method for electronic component

Technical Field

The present invention relates to electronic component assembly technology, and more particularly, to a thermal welding structure and method for electronic components.

Background

In the prior art, the assembly of electronic components and circuits typically employs SMT processes, such as: in the mobile phone product, a motor for controlling the lens to stretch and move and a Hall element for sensing the movement distance of the lens are arranged on a motor base; the metal piece can be a circuit board or a pin/metal terminal connected with the circuit board except the insulating base, and the final purpose is to connect the motor, the Hall element and other electronic elements to the circuit.

The prior art has the following defects:

(1) The motor base product has fewer electronic components to be assembled, the equipment cost and the maintenance cost of the SMT technology and the SMT chip mounter are high, and high-end technicians are required to operate the motor base product, so that the labor cost is high;

(2) When soldering tin, the part body (such as an insulating base) is directly subjected to thermal stress of the soldering tin, and hidden danger of heating for a plurality of times is caused, so that the part is possibly deformed, and the quality of a product is difficult to control;

(3) The difference of the soldering tin amount has a larger influence on the soldering result, the excessive solder can cause pressure, so that the part body is broken, and the solder has a small amount, so that the situation of a cavity can exist, and the solder joint is invalid;

(4) After welding, the problem of soldering flux residue exists, adhesion can be caused without cleaning, the realization of the functions of a product is affected, the problem of cleaning agent residue can exist after cleaning by using a cleaning agent, the residue of the cleaning agent on the product can corrode a circuit board, and the quality of the product is seriously affected.

In summary, the assembly of the motor base by the SMT process has certain drawbacks and needs to be improved.

Disclosure of Invention

The invention aims to provide a thermal welding structure and a thermal welding method for an electronic element, which solve the problems in the prior art, improve the product structure and the assembly method and avoid a plurality of problems caused by using an SMT technology.

In order to achieve the above object, one of the solutions of the present invention is:

a heat welding structure of electronic components comprises a patch electronic component, a metal piece and a base; the patch electronic element is provided with a plurality of metal sheets for electric connection; the metal piece is embedded in the base; the patch electronic element is matched with the upper surface of the base, and a through hole is formed in the lower surface of the base at a position corresponding to the metal sheet; the metal sheet and the metal piece are connected into a whole after being hot melted by laser penetrating into the through hole.

The upper surface of base is provided with the confession paster electronic component inlays the constant head tank of establishing, the upper surface of metalwork exposes in the bottom of constant head tank.

The patch electronic element is a hall element.

The metal piece is a metal terminal, one end of the metal piece is used for being connected with the metal sheet, and the other end of the metal piece is led out of the base and then is used for being connected with a circuit board of a product.

The base is made of plastic; the metal piece and the base form an integrated structure through a secondary injection molding process.

And a hollowed-out part is formed at the position of the metal piece corresponding to the through hole and is at least communicated to the lower surface of the metal piece.

Preferably, the hollow part, the metal sheet and the center of the through hole are coaxially arranged.

Preferably, the hollowed-out part is a cylindrical hole or a round table hole formed between the upper surface and the lower surface of the metal piece, or a blind hole or a conical hole formed on the lower surface of the metal piece, or a notch formed on the side edge of the metal piece, and the notch is provided with an inclined plane.

The second solution of the present invention is:

a method of thermal fusion bonding of electronic components, comprising the steps of:

s1, when the metal piece and the base are processed, processing and forming a through hole of the base, wherein the through hole is arranged opposite to a metal sheet of the patch electronic element, so as to form an alignment hole of laser;

s2, the metal sheet of the patch electronic element faces the upper surface of the base, and pressure is applied to the patch electronic element so as to keep the metal sheet tightly attached to the upper surface of the metal piece;

s3, starting a laser, enabling the laser to penetrate through the through hole of the base and then heating and burning the metal piece and the metal sheet, and achieving thermal welding of the metal sheet and the metal piece; and in the laser heating process, a fish scale welding or intermittent welding technology is adopted to weld at welding positions in a continuous or intermittent line trend.

After the technical scheme is adopted, the invention has the following technical effects:

according to the invention, the through holes are formed in the positions corresponding to the metal sheets on the base, so that the existing mature laser welding process can be directly adopted, the metal sheets and the metal pieces are burnt and melted by using laser to pass through the through holes, the hot melting connection of the metal sheets and the metal pieces is realized, the forming efficiency is high, the product quality is reliable, and due to the fact that an SMT process and an SMT chip mounter are not needed, various problems existing in the process can be avoided, and the purposes of reducing the cost, improving the production efficiency, improving the product quality and the like are achieved.

In addition, the fish scale welding or intermittent welding technology is adopted in the laser hot melting connection process, so that the problem that accessories are burnt out due to the fact that laser continuously heats a certain point can be avoided.

Drawings

Fig. 1 is a schematic structural diagram of a patch electronic component and a base according to a first embodiment of the present invention;

FIG. 2 is a cross-sectional view of a first embodiment of the present invention;

FIG. 3 is a schematic illustration of a thermal fusion process according to a first embodiment of the present invention;

fig. 4 is a schematic structural diagram of a patch electronic component and a base according to a second embodiment of the present invention;

FIG. 5 is a cross-sectional view of a second embodiment of the present invention;

FIG. 6 is a schematic illustration of a thermal fusion process according to a second embodiment of the present invention;

fig. 7 is a schematic structural diagram of a patch electronic component and a base according to a third embodiment of the present invention;

FIG. 8 is a cross-sectional view of a third embodiment of the present invention;

FIG. 9 is a schematic illustration of a third embodiment of the present invention;

fig. 10 is a cross-sectional view of a fourth embodiment of the present invention;

FIG. 11 is a cross-sectional view of a fifth embodiment of the present invention;

fig. 12 is a cross-sectional view of a sixth embodiment of the present invention;

fig. 13 is a cross-sectional view of a seventh embodiment of the present invention;

reference numerals illustrate:

1- - -a patch electronic element; 11- - -sheet metal; 2- - -a metal piece; 21- - -a hollowed-out part; 211- -inclined plane; 3- - -a base; 31- - -a through hole; 32- - -a positioning slot.

Detailed Description

In order to further explain the technical scheme of the invention, the invention is explained in detail by specific examples.

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Accordingly, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the embodiments of the present invention, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship conventionally put in place when the inventive product is used, or the orientation or positional relationship conventionally understood by those skilled in the art, is merely for convenience in describing the embodiments of the present invention, and is not intended to indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the embodiments of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed.

In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

Referring to fig. 1 to 6, the invention discloses a thermal welding structure of an electronic component, which comprises a patch electronic component 1, a metal piece 2 and a base 3;

the patch electronic element 1 has a number of metal sheets 11 for electrical connection;

the metal piece 2 is embedded in the base 3;

the patch electronic element 1 is matched with the upper surface of the base 3, and a through hole 31 is arranged on the lower surface of the base 3 corresponding to the position of the metal sheet 11;

the metal sheet 11 and the metal member 2 are integrally connected by laser heat-melting penetrating through the through hole 31.

Through the scheme, the through holes 31 are formed in the base 3 at positions corresponding to the metal sheets 11, so that the existing mature laser welding process can be directly adopted, the metal sheets 11 and the metal pieces 2 are burnt and melted by using laser through the through holes 31, the hot melting connection of the metal sheets 11 and the metal pieces 2 is realized, the forming efficiency is high, the product quality is reliable, and due to the fact that an SMT process and an SMT chip mounter are not needed, a plurality of problems existing in the hot melting connection can be avoided, and the purposes of reducing cost, improving production efficiency, improving product quality and the like are achieved.

In some embodiments of the present invention, the hollow portion 21 is formed at the position of the metal piece 2 corresponding to the through hole 31, and the hollow portion 21 is at least connected to the lower surface of the metal piece 2, that is, the hollow portion 21 is at least a blind hole, so that the thickness of the metal piece 2 at the position can be reduced, so that the laser can more easily break down and burn the metal piece 2 to make it thermally welded with the metal piece 11; further, it may be a through hole provided in the metal member 2 in the first embodiment described below, or a notch provided in the edge of the metal member 2 in the second embodiment described below.

Referring to fig. 1 to 3, a first embodiment of the present invention is shown.

In the first embodiment, the patch electronic element 1 is a hall element, and is applied to a motor base of a mobile phone to detect a telescopic movement distance of a lens.

In the first embodiment, the metal member 2 is a metal terminal, one end of which is used for connecting with the metal sheet 11, and the other end of which can be led out of the base 3 and then used for connecting with a circuit board of a product. The shape of the metal terminal can be designed according to the requirements of products.

Further, metal sheets 11 are provided at four corners of the chip electronic component 1; correspondingly, the number of the metal pieces 2 is four.

In the first embodiment, the base 3 is made of plastic, so as to achieve the purpose of insulation; the metal piece 2 and the base 3 form an integrated structure through a secondary injection molding process, and the structure is stable and the strength is high.

In the first embodiment, the upper surface of the base 3 is provided with the positioning groove 32 for embedding the chip electronic component 1, the upper surface of the metal part 2 is exposed at the bottom of the positioning groove 32, and the positioning groove 32 can realize rapid positioning and placement of the chip electronic component 1 on the base 3, which is beneficial to improving the production efficiency.

Referring to fig. 4 to 6, a second embodiment of the present invention is shown.

Most of the technical means of the second embodiment are the same as those of the first embodiment, and the main difference between the two is that the metal piece 2 of the second embodiment is provided with the hollowed-out portion 21, and the thickness of the metal piece 2 is reduced at the position where the hollowed-out portion 21 is provided, so that the laser can break down the metal piece 2 and burn the metal sheet 11 more quickly. In the second embodiment, the hollowed-out portion 21 is a cylindrical hole formed between the upper and lower surfaces of the metal member 2, and the forming may be performed by a stamping process or the like.

Further, the centers of the hollow-out part 21, the metal sheet 11 and the through hole 31 are coaxially arranged to ensure that laser passes through the through hole 31 and the hollow-out part 21 and then irradiates to the center of the metal sheet 11, and the final hot-melt connection effect is better.

Referring to fig. 7-9, a third embodiment of the present invention is shown.

Most of the technical means in the third embodiment are the same as those in the second embodiment, and the main difference between the two is the shape and position of the hollowed-out portion 21. In the third embodiment, the hollow portion 21 is a notch (or called a concave edge) formed on the side of the metal member 2.

Referring to fig. 10, a fourth embodiment of the present invention is shown.

Most of the technical means in the fourth embodiment are the same as those in the second embodiment, and the main difference between the two is the shape of the hollowed-out portion 21. In the fourth embodiment, the hollow portion 21 is a blind hole formed on the lower surface of the metal member 2.

Referring to fig. 11, a fifth embodiment of the present invention is shown.

Most of the technical means in the fifth embodiment are the same as those in the second embodiment, and the main difference between the two is the shape of the hollowed-out portion 21. In the fifth embodiment, the hollow portion 21 is a tapered hole formed on the lower surface of the metal piece 2, and the tip of the tapered hole is close to the upper surface of the metal piece 2, so as to reduce the blocking of the laser as much as possible, so that the laser passes through the metal piece 2 faster to burn the metal piece 11, and the metal material around the taper Kong Jianduan is burned and connected with the metal piece 11, so that the connection is firmer.

Referring to fig. 12, a sixth embodiment of the present invention is shown.

Most of the technical means in the sixth embodiment are the same as those in the second embodiment, and the main difference between the two is the shape of the hollowed-out portion 21. In the sixth embodiment, the hollow portion 21 is a circular truncated cone hole formed between the upper and lower surfaces of the metal member 2, that is, the hollow portion 21 penetrates the upper and lower surfaces of the metal member 2, and the aperture of the hollow portion 21 gradually increases along the upper surface of the metal member 2 toward the lower surface, so that the technical effect similar to the conical hole of the fifth embodiment can be achieved, and since the circular truncated cone hole directly penetrates the upper surface of the metal member 2, the laser can easily penetrate the metal member 2 to directly burn the metal sheet 11.

Referring to fig. 13, a seventh embodiment of the present invention is shown.

Most of the technical means in the sixth embodiment are the same as those in the third embodiment, and the main difference between the two is the shape of the hollowed-out portion 21. In the seventh embodiment, the hollow portion 21 is a notch formed on the side of the metal piece 2, and the notch is provided with an inclined surface 211, and the inclined surface 211 makes the position of the hollow portion 21 thinner, so that the hollow portion 21 can be broken down by laser more easily, and is connected with the metal sheet 11 by hot melting after being melted by laser, so that the connection is more firm.

The invention also discloses a thermal welding method of the electronic element, which comprises the following steps:

(1) When the metal piece 2 and the base 3 are processed, the through hole 31 of the base 3 is processed and molded, and the through hole 31 is arranged opposite to the metal sheet 11 of the patch electronic element 1 to form an alignment hole of laser;

(2) The metal sheet 11 of the patch electronic element 1 faces the upper surface of the base 3, the patch electronic element 1 is placed into the positioning groove 32 of the base 3, and pressure is applied to the patch electronic element 1 to keep the metal sheet 11 tightly attached to the upper surface of the metal piece 2;

(3) Starting a laser, enabling the laser to penetrate through the through hole 31 of the base 3 and then heating and burning the metal piece 2 and the metal piece 11, and realizing the thermal welding of the metal piece 11 and the metal piece 2; in the laser heating process, a fish scale welding or intermittent welding technology is adopted to weld at a welding position in a continuous or intermittent line trend, so that the problem that accessories are burnt out due to the fact that laser continuously heats a certain point is avoided.

The above examples and drawings are not intended to limit the form or form of the present invention, and any suitable variations or modifications thereof by those skilled in the art should be construed as not departing from the scope of the present invention.

Claims

1. A thermal fusion structure of an electronic component, characterized in that:

comprises a patch electronic element, a metal piece and a base;

the patch electronic element is provided with a plurality of metal sheets for electric connection;

the metal piece is embedded in the base;

the patch electronic element is matched with the upper surface of the base, and a through hole is formed in the lower surface of the base at a position corresponding to the metal sheet;

the metal sheet and the metal piece are connected into a whole after being hot melted by laser penetrating into the through hole.

2. The thermal fusion bonding structure of electronic components according to claim 1, wherein:

3. The thermal fusion bonding structure of electronic components according to claim 1, wherein:

the patch electronic element is a hall element.

4. The thermal fusion bonding structure of electronic components according to claim 1, wherein:

5. The thermal fusion bonding structure of electronic components according to claim 1, wherein:

6. A heat fusion-bonding structure of an electronic component according to any one of claims 1 to 5, characterized in that:

7. The thermal fusion bonding structure of electronic components according to claim 6, wherein:

the centers of the hollowed-out part, the metal sheet and the through hole are coaxially arranged.

8. The thermal fusion bonding structure of electronic components according to claim 6, wherein:

the hollowed-out part is a cylindrical hole or a round table hole formed between the upper surface and the lower surface of the metal piece, or a blind hole or a conical hole formed on the lower surface of the metal piece.

9. The thermal fusion bonding structure of electronic components according to claim 6, wherein:

the hollowed-out part is a notch formed on the side edge of the metal piece.

10. A heat fusion method of electronic components for assembling the heat fusion structure of electronic components according to any one of claims 1 to 9, characterized by comprising the steps of: