CN117809969A - Preparation method of small-volume integrated chip inductor - Google Patents
Preparation method of small-volume integrated chip inductor Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 239000000843 powder Substances 0.000 claims abstract description 73
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 40
- 239000006247 magnetic powder Substances 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000003822 epoxy resin Substances 0.000 claims abstract description 22
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 22
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- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 16
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- 238000003756 stirring Methods 0.000 claims abstract description 12
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- 239000005007 epoxy-phenolic resin Substances 0.000 claims abstract description 4
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 7
- 238000001723 curing Methods 0.000 claims description 7
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Abstract
The invention relates to a preparation method of a small-volume integrated chip inductor, which comprises the following steps: s1: and winding the copper wire on a cylinder to obtain the coil. S2: the coil and 2 terminals were welded together to obtain a coil web. S3: adding phosphoric acid into the metal magnetic powder core raw powder, uniformly stirring, acidizing, adding high-temperature glue consisting of epoxy resin and phenolic resin, and uniformly stirring to obtain insulating coated powder. S4: and placing the coil material sheet into a mold cavity, filling powder into the mold cavity, starting a press machine to press the powder, and integrally forming the powder and the coil material sheet to obtain a primary product, wherein the coil material sheet in the primary product is positioned in the powder. S5: and heating and curing the initial product, and bending the terminal until the terminal is attached to the initial product to obtain the inductor. The inductor prepared by the invention can bear large current at the same time under the condition of small volume, can be directly attached to a circuit board, and has the advantages of convenient installation, light weight and small occupied space.
Description
Technical Field
The invention belongs to the technical field of inductors, and particularly relates to a preparation method of a small-volume integrated chip inductor.
Background
As electronic products are being miniaturized and have low power consumption, power supplies are required to be high-frequency, low-voltage, high-current, and small-sized. Power chokes and filters are critical devices in the circuit and are therefore also required to be able to carry high frequencies and large currents.
In the prior art, the power choke and the filter are generally made of ferrite soft magnetic materials. Although the inductor prepared from ferrite soft magnetic material has low power consumption, the saturation magnetic flux density (Bs) is low, and the inductor is easy to saturate when a large current passes through, so that the inductor is difficult to bear the large current. The inductor prepared from the metal magnetic powder core material with high saturation magnetic flux density can bear large current and has the anti-radiation effect, but the inductor prepared from the metal magnetic powder core at present is generally annular, the installation mode is insertion, the occupied space is large, and the development of electronic equipment to the direction of miniaturization and portability is difficult to meet.
Therefore, there is a need to prepare an inductor that can simultaneously satisfy miniaturization and can carry a large current.
Disclosure of Invention
First, the technical problem to be solved
In order to solve the problem that the inductor in the prior art cannot simultaneously meet the requirements of miniaturization and high-current bearing performance, the invention provides a preparation method of a small-volume integrated chip inductor.
(II) technical scheme
In order to achieve the above purpose, the main technical scheme adopted by the invention comprises the following steps:
a preparation method of a small-volume integrated chip inductor comprises the following steps:
s1: winding copper wires on a cylinder to obtain a coil;
s2: welding the coil obtained in the step S1 with 2 terminals to obtain a coil material sheet;
s3: adding phosphoric acid into the metal magnetic powder core raw powder, uniformly stirring, acidizing, then adding high-temperature glue consisting of epoxy resin and phenolic resin, and uniformly stirring to obtain insulating coated powder;
s4: putting the coil material sheet obtained in the step S2 into a mold cavity, filling the powder obtained in the step S3 into the mold cavity, starting a press machine to press the powder, and integrally forming the powder and the coil material sheet to obtain a primary product, wherein the coil material sheet in the primary product is positioned in the powder;
s5: and heating and curing the initial product, and bending the terminal until the terminal is attached to the initial product to obtain the inductor.
In the preparation method as described above, preferably, in step S1, the copper wire is a round copper wire.
In the above preparation method, preferably in step S3, the metal magnetic powder core raw powder is carbonyl iron powder, and the carbonyl iron powder comprises the following chemical components in percentage by mass: fe is more than or equal to 99%, C is less than or equal to 0.08%, and O is less than or equal to 0.92%;
the adding amount of the phosphoric acid accounts for 4-20 per mill of the mass of the metal magnetic powder core raw powder;
the addition amount of the high-temperature adhesive accounts for 5-10% of the mass of the metal magnetic powder core raw powder.
In the preparation method, preferably, in the step S3, the mass ratio of the epoxy resin to the phenolic resin in the high-temperature glue is 2.5:1-4:1.
In the above preparation method, preferably, in step S4, the pressing pressure of the press machine to the powder is 6-10T/cm 2 The pressing time is 4s-8s.
In the above-described production method, preferably, in step S5, the outer diameter of the coil web is 15% or less of the narrower one of the length and the width of the inductor product;
the height of the coil web is 18% and less of the height of the inductor product.
In the preparation method as described above, preferably, in step S5, the primary product is heat-cured by stepwise heating, wherein the initial heat-curing temperature is 80 ℃, the final heat-curing temperature is 160 ℃, each stepwise heating is 20 ℃, and heat-curing is performed for 1 hour at each stepwise temperature, respectively.
In the above-described production method, preferably, in step S5, after completion of the heat curing, the preliminary product is further surface-coated with an epoxy resin paint before the terminals are led out.
The inductor prepared in step S5 preferably has an inductance of 0.1uH to 10uH according to the preparation method described above.
(III) beneficial effects
The beneficial effects of the invention are as follows:
firstly, the inductor is prepared from the metal magnetic powder core material, so that the problems of low magnetic flux density and electromagnetic radiation of the material are overcome, and the prepared inductor can bear large current and has small power loss at high frequency.
Secondly, the powder particles of the metal magnetic powder core material are subjected to acidification treatment through phosphoric acid, so that high-temperature glue can be better attached to the surfaces of the powder particles, the coating performance of insulating substances is improved, subsequent compression molding is facilitated, the molding effect is improved, and the inductance loss of an inductor product can be reduced.
Thirdly, the high-temperature glue composed of the epoxy resin and the phenolic resin is used for coating the metal magnetic powder core powder, the epoxy resin in the high-temperature glue has good powder bonding capability, the phenolic resin has good temperature resistance, the electromagnetic performance of the product can be kept, the inductor product has high mechanical strength and electromagnetic performance through the combination of the epoxy resin and the phenolic resin, the inductor product has good high-temperature resistance, and the service life of the inductor product at high temperature is obviously prolonged.
Fourth, the coil material sheet is arranged in the metal magnetic powder core powder, and the prepared inductor is small in size, can be directly attached to a circuit board, is convenient to install, is light in weight and small in occupied space, and provides possibility for the development of electronic equipment in the miniaturized and lightweight directions.
Drawings
FIG. 1a is a top view of a coil of the present invention (where D is the inner diameter of the coil and D is the outer diameter of the coil);
FIG. 1b is a front view of a coil of the present invention (where H is the height of the coil);
FIG. 2 is a schematic view of a coil material sheet according to the present invention;
FIG. 3 is a schematic view of an insulation coated powder prepared according to the present invention;
FIG. 4 is a schematic diagram of the structure of a preform obtained by compression molding of a powder material and a coil material sheet according to the present invention;
FIG. 5 is a schematic view showing a structure of a terminal with a part cut out from a blank in the present invention;
FIG. 6 is a schematic diagram of a structure of an inductor product made in accordance with the present invention;
FIG. 7 is a schematic diagram of an inductor product according to the present invention at another angle;
FIGS. 8 a-8 d are schematic views illustrating the process of integrally forming the powder material and the coil material sheet in step S4;
fig. 9 is a physical diagram of the inductor product prepared in example 1;
fig. 10 is a physical diagram of the inductor product prepared in example 2.
[ reference numerals description ]
1: a coil;
2: a terminal;
3: and (5) pressing the metal magnetic powder core.
Detailed Description
The invention will be better explained by the following detailed description of the embodiments with reference to the drawings.
The invention provides a preparation method of a small-volume integrated chip inductor, which comprises the following steps:
s1: copper wire is wound on a cylinder of a certain size, resulting in a coil 1 of a certain number of turns, height, inner diameter and outer diameter as shown in fig. 1a and 1 b.
S2: the coil 1 obtained in the step S1 and 2 copper terminals 2 are welded together by a welder to obtain a coil web shown as 2.
S3: adding phosphoric acid into the raw powder of the metal magnetic powder core material, uniformly stirring, acidizing the metal magnetic powder core powder particles by the phosphoric acid, then adding high-temperature glue consisting of epoxy resin and phenolic resin, and uniformly stirring to obtain the powder material which is subjected to insulation coating and shown in figure 3.
S4: and (3) placing the coil material sheet obtained in the step (S2) into a mold cavity, filling the insulating coated powder obtained in the step (S3) into the mold cavity, and starting a press machine to press the powder, so that the powder and the coil material sheet are integrally formed, and the initial product shown in fig. 4 is obtained. Wherein coil material sheets in the initial product are positioned in the pressed metal magnetic powder core 3, and terminals 2 are exposed at two sides of the initial product.
S5: and heating and curing the initial product, coating the surface of the initial product through epoxy resin paint and the like after curing, cutting the terminals 2 exposed at two ends of the side surface of the product to obtain the structure shown in fig. 5, and bending the cut terminals 2 to enable the terminals 2 to be in contact with and tightly adhere to the bottom surface of the pressed metal magnetic powder core, so that the product can be smoothly adhered to a circuit board when in use, and the inductor product shown in fig. 6 and 7 is obtained.
Preferably, in step S1, the copper wire used for winding the coil 1 is a round copper wire more suitable for manufacturing a small-volume inductor. In this step, the resistance r=ρl/S of the copper wire, where ρ is the resistivity of copper (17mΩ·mm 2 I is the length (m) of the copper wire, S is the cross-sectional area (mm) of the copper wire 2 ) R is a direct current resistor (mΩ). The cross-sectional area of the copper wire can be determined by the rated direct current. Since the volume of the patch inductor is limited, the inductance thereof is proportional to the square of the number of turns of the coil 1, and the direct current resistance is approximately proportional to the number of turns of the coil 1. Therefore, the correlation of the parameters can be considered in the design process, and the optimal design of the coil 1 can be found through simulation design and experimental verification, wherein the coil 1 meets the requirements while ensuring the performance to reach the standard, and the size of the inductor is prevented from being influenced excessively.
In step S1, the inner diameter d of the coil may be in the range of 1.4-1.9mm, the number of turns of the coil may be in the range of 1.5-15.5, and the radius of the round copper wire may be in the range of 0.16-0.3 mm.
In step S2, when the coil 1 is welded to the terminal 2, the welding spot should not be too large, so as to avoid exposing the terminal 2 in the subsequent press forming process, and the reliability of the welding spot cannot be ensured. Meanwhile, welding spots in the welding process cannot be too small, the welding strength of the coil 1 and the terminal 2 cannot reach the standard due to the fact that the welding spots are too small, and the reliability of the welding spots is affected.
In step S3, the metal magnetic powder core raw powder may be carbonyl iron powder, wherein the carbonyl iron powder comprises the following chemical elements in percentage by mass: fe is more than or equal to 99%, C is less than or equal to 0.08%, and O is less than or equal to 0.92%. In the metal magnetic powder core raw powder, 10% of particles with the particle size of less than 2.8-3.6 mu m, 50% of particles with the particle size of less than 4.0-5.2 mu m and 90% of particles with the particle size of less than 6.8-9.2 mu m.
The addition of the phosphoric acid accounts for 4-20 per mill of the mass of the metal magnetic powder core raw powder, and the phosphoric acid is used for acidizing the powder particles of carbonyl iron powder so as to ensure that insulating substances can be better attached to the surfaces of the powder particles, improve the coating performance of the high-temperature glue on the metal magnetic powder core raw powder and be beneficial to improving the molding effect of products in the subsequent compression molding process. In addition, the acidification of the metal magnetic powder core raw powder by phosphoric acid can further reduce the inductance loss of the inductor product. In addition, the proportion of phosphoric acid in the mass of the metal magnetic powder core raw material directly influences the performance of the metal magnetic powder core raw material, and further influences the performance of the inductor. If the addition amount of phosphoric acid exceeds 20 per mill, the microscopic morphology of the metal magnetic powder core raw material powder particles is easily damaged, and the coating effect of the high-temperature adhesive is affected, so that the molding of powder is affected. If the addition amount of phosphoric acid is less than 4 per mill, the magnetic permeability of the insulating coated powder is too high, so that the powder with low magnetic permeability cannot be prepared, and the requirement of the inductor product with low magnetic permeability cannot be met.
The addition amount of the high-temperature adhesive accounts for 5-10% of the mass of the metal magnetic powder core raw powder, and preferably the mass ratio of the epoxy resin to the phenolic resin in the high-temperature adhesive is 2.5:1-4:1. According to the invention, the high-temperature glue is used as an insulating material to coat the metal magnetic powder core raw powder, the epoxy resin in the high-temperature glue has good powder bonding capability, the phenolic resin has good temperature resistance, and the inductor product can have higher mechanical strength and electromagnetic performance at the same time and has good temperature resistance by combining the epoxy resin and the phenolic resin and adjusting the ratio of the epoxy resin to the phenolic resin within the range of 2.5:1-4:1.
In step S4, as shown in fig. 8a, during the pressing, the coil material sheet is first placed into the cavity of the mold, then the upper mold is pressed as shown in fig. 8b, then the powder is scraped as shown in fig. 8c, and then the press molding is performed as shown in fig. 8 d. The pressing pressure of the press machine to the powder is 6-10T/cm 2 The pressing time is 4s-8s. In the pressing process, the position of the coil material sheet in the product needs to be strictly controlled, and the coil 1 is ensured to be infinitely close to the center of the product, so that the consistency of the performance, the appearance consistency, the temperature rise characteristic and the like of the inductor product are ensured. In the pressing process, the invention preferably adopts a bidirectional pressing mode to press and shape the product. The bidirectional pressing can avoid the up-and-down displacement of the coil 1, reduce the friction force between the powder and the coil 1 by controlling the up-and-down force, ensure the minimum stress of the coil 1, avoid the inter-turn damage of the coil 1 and ensure the processing quality of small-volume products. After the pressing is completed, the coil 1 is positioned inside the molded powder, the terminals 2 on two sides are exposed out of the metal powder, and the heights of the two terminals 2 are the same.
In step S5, the outer diameter D of the coil web accounts for 15% or less of the narrower one of the length and width of the inductor product. The height H of the coil web is 18% and less of the height of the inductor product. The minimum size of the inductor product prepared by the method can reach 4mm multiplied by 1.2mm, and the inductor product can be designed and selected according to actual needs, so that the development of miniaturization and portability of the inductor is realized.
Preferably, in step S5, the heat curing can further enhance the mechanical properties and stability of the product, and the present invention heat cures the initial product by stepwise heating, wherein the initial heat curing temperature is 80 ℃, the final heat curing temperature is 160 ℃, each stepwise heating is 20 ℃, and each stepwise heating is performed for 1h at each stepwise temperature, i.e. each heating is performed for 1h at 80 ℃, 100 ℃, 120 ℃, 140 ℃ and 160 ℃, respectively. Because the coil 1 in the inductor structure is copper wire, the powder is mainly made of metal magnetic powder core materials, and the expansion coefficients of the coil 1 and the powder are different, the invention cures in a stepped slow heating mode to form a temperature gradient, so that the product is ensured not to crack when the high-temperature glue used for coating the powder achieves the optimal effect.
After the heating and curing are finished in the step S5, before the terminal 2 is led out, the surface of the initial product is also required to be coated by epoxy resin paint, so that the moisture resistance of the product is improved.
The inductance of the inductor prepared by the preparation method can be between 0.1uH and 10uH, and the inductance loss can be reduced to about 15 percent, and compared with the prior art, the inductance loss is obviously improved by about 30 percent. In addition, the mechanical property of the inductor product prepared by the method is obviously improved, the inductor product is not cracked after long-time use at high temperature, and the service life of the inductor product is obviously longer than that of the existing inductor product.
Example 1
The embodiment provides a preparation method of a small-volume integrated chip inductor, which comprises the following steps:
s1: copper wire having a diameter of 0.3mm was wound around a cylinder having a diameter of 1.6mm to obtain a coil having a number of turns of 1.5 and an inner diameter of 1.6 mm.
S2: and welding the coil and 2 copper terminals together by a welding machine to obtain a coil material sheet.
S3: adding 6 parts of phosphoric acid into 1000 parts of raw powder of metal magnetic powder core material, uniformly stirring, then adding high-temperature glue consisting of 40 parts of epoxy resin and 15 parts of phenolic resin, and uniformly stirring to obtain insulating coated powder. The raw powder, phosphoric acid and epoxy resin of the metal magnetic powder core material in each embodiment and the comparative example are all in parts by weight of phenolic resin.
S4: placing the coil material sheet into a mold cavity, filling the insulating coated powder into the mold cavity, starting a press machine at 6T/cm 2 Pressing the powder for 8s under the pressure of (2) to obtain the primary product formed by the powder and the coil material sheet integrally.
S5: the initial products are heated and cured for 1h at the temperature of 80 ℃, 100 ℃, 120 ℃, 140 ℃ and 160 ℃ respectively.
S6: and after the heating and curing are finished, coating a layer of epoxy resin paint on the surface of the initial product, cutting the exposed two terminals, and bending to ensure that the terminals are in contact with and compress the bottom surface of the formed metal magnetic powder core, thus obtaining the inductor product.
Example 2
The embodiment provides a preparation method of a small-volume integrated chip inductor, which comprises the following steps:
s1: copper wire having a diameter of 0.3mm was wound around a cylinder having a diameter of 1.6mm to obtain a coil having a number of turns of 1.5 and an inner diameter of 1.6 mm.
S2: and welding the coil and 2 copper terminals together by a welding machine to obtain a coil material sheet.
S3: adding 10 parts of phosphoric acid into 1000 parts of raw powder of metal magnetic powder core material, uniformly stirring, then adding high-temperature glue consisting of 40 parts of epoxy resin and 15 parts of phenolic resin, and uniformly stirring to obtain insulating coated powder.
S4: placing the coil material sheet into a mold cavity, filling the insulating coated powder into the mold cavity, starting a press machine at 6T/cm 2 Pressing the powder for 8s under the pressure of (2) to obtain the primary product formed by the powder and the coil material sheet integrally.
S5: the initial products are heated and cured for 1h at the temperature of 80 ℃, 100 ℃, 120 ℃, 140 ℃ and 160 ℃ respectively.
S6: and after the heating and curing are finished, coating a layer of epoxy resin paint on the surface of the initial product, cutting the exposed two terminals, and bending to ensure that the terminals are in contact with and compress the bottom surface of the formed metal magnetic powder core, thus obtaining the inductor product.
Example 3
This example provides a method for manufacturing a small-volume integrally formed chip inductor, which is different from example 1 in that the number of turns of the coil is 2.5.
Example 4
This example provides a method for manufacturing a small-volume integrally formed chip inductor, which is different from example 1 in that the copper wire has a radius of 0.28mm, the coil has an inner diameter of 1.4mm, and the number of turns is 4.5.
Example 5
This example provides a method for manufacturing a small-volume integrally formed chip inductor, which is different from example 2 in that the copper wire radius is 0.23mm, the coil inner diameter is 1.6mm, and the number of turns is 7.5.
Example 6
This example provides a method for manufacturing a small-volume integrally formed chip inductor, which is different from example 2 in that the copper wire has a radius of 0.20mm, the coil has an inner diameter of 1.9mm, and the number of turns is 9.5.
Example 7
This example provides a method for manufacturing a small-volume integrally formed chip inductor, which is different from example 2 in that the copper wire radius is 0.16mm, the coil inner diameter is 1.4mm, and the number of turns is 15.5.
Table 1 coil detail parameters of examples 1-7
Comparative example 1
The difference between this comparative example and example 1 is that the phosphoric acid addition amount is 2 parts.
Comparative example 2
This comparative example provides a method for manufacturing an inductor, which is different from example 1 in that phosphoric acid is not added in step S3, and the insulating coating material does not use a high temperature glue, but a single component epoxy resin.
Inductance tests were performed on the inductors prepared in example 1, example 2 and comparative example 1, and specific data are shown in table 2.
TABLE 2 inductance value data of the products prepared in examples 1-2 and comparative example 1
As is clear from table 2, the amount of phosphoric acid added in comparative example 1 was too small, and the inductance of the same-size product was too high to satisfy the inductor product demand of low magnetic permeability, compared with examples 1 and 2.
The inductor products prepared in example 1 and examples 3 to 7 were tested to obtain test data shown in table 3.
TABLE 3 Performance data for each of the products of example 1, examples 2-7
As can be seen from Table 3, the inductance measurement results of the inductor products with different sizes prepared in example 1 and examples 3-7 can meet the range of the index requirement, and the DC resistance does not exceed the maximum value of the index requirement, so that the inductor product has better performance.
In addition, the inductors of examples 1 to 7 and the inductor of comparative example 1 were also subjected to an inductance loss test and a service life test at high temperature.
Through practical detection, under the same conditions, the inductance loss of the inductors prepared in examples 1-7 is not more than 15%, while the inductance loss of comparative example 2 is close to 30%.
On the other hand, the inductors prepared in examples 1-7 and comparative example 2 were used at a high temperature of 125 ℃ at the same time, and after the inductor in comparative example 2 was cracked and scrapped, the mechanical properties of the inductors in examples 1-7 were still good, and the inductors could be used continuously, with a longer life than that of comparative example 2.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that alterations, modifications, substitutions and variations may be made in the above embodiments by those skilled in the art within the scope of the invention.
Claims (9)
1. The preparation method of the small-volume integrated chip inductor is characterized by comprising the following steps of:
s1: winding copper wires on a cylinder to obtain a coil;
s2: welding the coil obtained in the step S1 with 2 terminals to obtain a coil material sheet;
s3: adding phosphoric acid into the metal magnetic powder core raw powder, uniformly stirring, acidizing, then adding high-temperature glue consisting of epoxy resin and phenolic resin, and uniformly stirring to obtain insulating coated powder;
s4: putting the coil material sheet obtained in the step S2 into a mold cavity, filling the powder obtained in the step S3 into the mold cavity, starting a press machine to press the powder, and integrally forming the powder and the coil material sheet to obtain a primary product, wherein the coil material sheet in the primary product is positioned in the powder;
s5: and heating and curing the initial product, and bending the terminal until the terminal is attached to the initial product to obtain the inductor.
2. The method according to claim 1, wherein in step S1, the copper wire is a round copper wire.
3. The preparation method according to claim 1, wherein in step S3, the metal magnetic powder core raw powder is carbonyl iron powder, and the carbonyl iron powder comprises the following chemical components in percentage by mass: fe is more than or equal to 99%, C is less than or equal to 0.08%, and O is less than or equal to 0.92%;
the adding amount of the phosphoric acid accounts for 4-20 per mill of the mass of the metal magnetic powder core raw powder;
the addition amount of the high-temperature adhesive accounts for 5-10% of the mass of the metal magnetic powder core raw powder.
4. The method according to claim 1, wherein in step S3, the mass ratio of epoxy resin to phenolic resin in the high temperature glue is 2.5:1-4:1.
5. The method according to claim 1, wherein in step S4, the powder is pressed by a press machineThe pressure is 6-10T/cm 2 The pressing time is 4s-8s.
6. The manufacturing method according to claim 1, wherein in step S5, the outer diameter of the coil web is 15% or less of the narrower one of the length and the width of the inductor product;
the height of the coil web is 18% and less of the height of the inductor product.
7. The production method according to claim 1, wherein in step S5, the primary product is heat-cured by stepwise heating, wherein the initial heat-curing temperature is 80 ℃, the final heat-curing temperature is 160 ℃, each stepwise heating is 20 ℃, and each stepwise heating is separately performed for 1 hour.
8. The method according to claim 1, wherein in step S5, the surface of the preliminary product is further coated with an epoxy paint after the completion of the heat curing and before the terminals are led out.
9. The method of claim 1, wherein the inductor produced in step S5 has an inductance of 0.1uH to 10uH.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410005559.7A CN117809969A (en) | 2024-01-03 | 2024-01-03 | Preparation method of small-volume integrated chip inductor |
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