CN117777658A - Epoxy resin-based composite insulating material and preparation method and application thereof - Google Patents
Epoxy resin-based composite insulating material and preparation method and application thereof Download PDFInfo
- Publication number
- CN117777658A CN117777658A CN202311791966.7A CN202311791966A CN117777658A CN 117777658 A CN117777658 A CN 117777658A CN 202311791966 A CN202311791966 A CN 202311791966A CN 117777658 A CN117777658 A CN 117777658A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- insulating material
- based composite
- composite insulating
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 148
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 148
- 239000011810 insulating material Substances 0.000 title claims abstract description 76
- 239000002131 composite material Substances 0.000 title claims abstract description 75
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 239000003085 diluting agent Substances 0.000 claims abstract description 38
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 37
- 239000012745 toughening agent Substances 0.000 claims abstract description 36
- 239000002994 raw material Substances 0.000 claims abstract description 19
- 229920001451 polypropylene glycol Polymers 0.000 claims description 37
- 239000011259 mixed solution Substances 0.000 claims description 26
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 24
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 18
- 238000002156 mixing Methods 0.000 claims description 16
- 239000002202 Polyethylene glycol Substances 0.000 claims description 14
- 229920001223 polyethylene glycol Polymers 0.000 claims description 14
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 claims description 12
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 claims description 11
- -1 anhydride compound Chemical class 0.000 claims description 11
- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 claims description 11
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 9
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 7
- 238000011417 postcuring Methods 0.000 claims description 7
- 238000009849 vacuum degassing Methods 0.000 claims description 7
- 125000001931 aliphatic group Chemical group 0.000 claims description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 6
- 239000012774 insulation material Substances 0.000 claims description 4
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 claims description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 3
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 claims description 3
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 7
- 238000005266 casting Methods 0.000 abstract description 4
- 230000002349 favourable effect Effects 0.000 abstract description 4
- 238000012360 testing method Methods 0.000 description 25
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 13
- 238000011056 performance test Methods 0.000 description 13
- 239000000203 mixture Substances 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 10
- 238000003756 stirring Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 230000008595 infiltration Effects 0.000 description 4
- 238000001764 infiltration Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000005303 weighing Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 150000008064 anhydrides Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920000921 polyethylene adipate Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
Landscapes
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides an epoxy resin-based composite insulating material, a preparation method and application thereof, and the epoxy resin-based composite insulating material comprises the following raw materials in parts by weight: 90-110 parts by weight of epoxy resin; 80-90 parts by weight of curing agent; 0.1 to 1 weight portion of accelerator; 13-17 parts of diluent; 3-8 parts of toughening agent. The epoxy resin-based composite insulating material provided by the invention has the advantages of low viscosity, favorable casting and processing of the composite insulating material and good mechanical property and electrical property, and can be used as an insulating material of high-voltage electrical equipment.
Description
Technical Field
The invention relates to the technical field of epoxy resin-based composite insulating materials, in particular to an epoxy resin-based composite insulating material, and a preparation method and application thereof.
Background
With the continuous increase of the power demand in China, the requirements on the grade of transmission voltage and safe and high-quality power supply service are higher and higher, the requirements on the failure times such as power failure and power failure are lower and lower, the importance and difficulty of solving the insulation problem are more obvious, and the electric field homogenization problem of insulation equipment or parts is more prominent. Insulation systems at key locations such as high voltage bushings, cable terminations, large motor stator insulation, etc. are difficult to meet the increasing electrical insulation performance requirements, and therefore, it is desirable to introduce nonlinear composites to improve electric field distribution and increase process flexibility. Epoxy resin is a thermosetting polymer composite material with good adhesion, corrosion resistance, electrical insulation, high strength and other performances, and has very wide application as an insulating material in the fields of high-voltage bushings, cable terminals, large-scale motor stators and the like.
The traditional epoxy resin has high room temperature viscosity, is difficult to fully infiltrate an insulating material during processing, influences the performance of a product, and CN114672137A discloses that two reactive diluents are used in the epoxy resin in a matched mode, so that the viscosity of the epoxy resin is effectively reduced, and the effect of excellent infiltration performance of the resin and fibers is realized. However, it is difficult to satisfy the mechanical properties, electrical properties and processability for high voltage bushings at the same time with the epoxy resin composition provided in the prior art, thereby greatly impeding the application of the epoxy resin material in high voltage electrical equipment. Therefore, development of an epoxy resin composition for high-voltage bushings with excellent comprehensive properties is a technical problem that needs to be solved urgently by those skilled in the art.
Disclosure of Invention
In view of the above, the invention provides an epoxy resin-based composite insulating material, a preparation method and application thereof, and the insulating material provided by the invention effectively reduces the viscosity of epoxy resin and improves the mechanical property and the electrical property of the insulating material through reasonable mixing and collocation among a curing agent, an accelerator, a diluent and a toughening agent.
In order to solve the technical problems in the background technology, the invention adopts the following technical scheme:
in a first aspect, the invention provides an epoxy resin-based composite insulating material, which comprises the following raw materials in parts by weight:
90-110 parts by weight of epoxy resin;
80-90 parts by weight of curing agent;
0.1 to 1 weight portion of accelerator;
13-17 parts of diluent;
3-8 parts by weight of a toughening agent;
wherein the curing agent comprises an anhydride compound and polypropylene glycol; the anhydride compound comprises at least one of hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride and methyl nadic anhydride;
the diluent includes at least one of allyl glycidyl ether and aliphatic glycidyl ether.
Further, in the curing agent, the molar ratio of the acid anhydride compound to the polypropylene glycol is (10 to 15): 1.
further, the aliphatic glycidyl ether includes at least one of 1, 4-butanediol diglycidyl ether, polypropylene glycol diglycidyl ether, and polyethylene glycol monoglycidyl ether.
Further, the epoxy resin includes at least one of bisphenol a type epoxy resin, bisphenol F type epoxy resin, 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate.
Further, the epoxy resin has an epoxy value (equivalent/kg) of not less than 3.
Further, the accelerator comprises at least one of 2,4, 6-tris (dimethylaminomethyl) phenol (DMP-30) and Benzyl Dimethylamine (BDMA).
Further, the toughening agent is carboxyl-terminated polyethylene glycol succinate.
In a second aspect, the present invention provides a method for preparing the epoxy resin-based composite insulating material as described above, the method comprising the steps of:
adding and mixing the epoxy resin, the curing agent, the accelerator, the diluent and the toughening agent in any sequence to obtain a mixed solution;
carrying out vacuum degassing on the mixed solution, pre-curing for 2-4 hours at 80-90 ℃, and then post-curing for 6-12 hours at 100-130 ℃; and cooling to room temperature to obtain the epoxy resin-based composite insulating material.
In a third aspect, the invention provides an application of the epoxy resin-based composite insulating material or the epoxy resin-based composite insulating material prepared by the preparation method in electric equipment.
Further, the electrical equipment includes at least one of a dry transformer, a basin insulator, and a high voltage bushing.
The technical scheme of the invention has the following beneficial effects:
the invention provides an epoxy resin-based composite insulating material, which comprises the following raw materials in parts by weight: 90-110 parts by weight of epoxy resin; 80-90 parts by weight of curing agent; 0.1 to 1 weight portion of accelerator; 13-17 parts of diluent; 3-8 parts of toughening agent.
(1) According to the invention, through optimizing the types of the curing agent, the diluent and the toughening agent and exploring the dosage proportion of the curing agent, the raw materials in the epoxy resin can effectively reduce the viscosity of the epoxy resin, the infiltration of the epoxy resin and the fiber is facilitated, and meanwhile, the strength and the toughness of the epoxy resin are ensured.
(2) According to the invention, through the cooperation of the accelerator and the curing agent, the curing time of the epoxy resin can be effectively shortened, and the internal and external uniformity of the product performance can be improved.
(3) The epoxy resin has higher toughness, adhesive force and corrosion resistance through the optimized toughening agent and proper adding proportion.
In conclusion, the epoxy resin-based composite insulating material provided by the invention has the advantages of low viscosity, favorable casting and processing of the composite insulating material and good mechanical property and electrical property, and can be used as an insulating material of high-voltage electrical equipment.
Detailed Description
For a further understanding of the present invention, preferred embodiments of the invention are described below in conjunction with the examples, but it is to be understood that these descriptions are merely intended to illustrate further the features and advantages of the invention and are not limiting of the invention.
In a first aspect, the invention provides an epoxy resin-based composite insulating material, which comprises the following raw materials in parts by weight:
90-110 parts by weight of epoxy resin;
80-90 parts by weight of curing agent;
0.1 to 1 weight portion of accelerator;
13-17 parts of diluent;
3-8 parts by weight of a toughening agent;
wherein the curing agent comprises an anhydride compound and polypropylene glycol; the anhydride compound comprises at least one of hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride and methyl nadic anhydride; further, in the curing agent, the molar ratio of the acid anhydride compound to the polypropylene glycol is (10 to 15): 1. both the acid anhydride compound and the polypropylene glycol in the present invention are commercially available. Taking methyltetrahydrophthalic anhydride (MTHPA) as an example, the reactive groups of the hardener component react with the epoxy groups of the epoxy resin component when curing the epoxy resin composition, i.e., the anhydride reactive groups of methyltetrahydrophthalic anhydride (MTHPA) and the hydroxyl groups of polypropylene glycol (PPG) can react with the epoxy groups of the epoxy resin component. In addition, the hydroxyl groups of PPG can react with the reactive groups of MTHPA.
According to some embodiments of the invention, the diluent is a glycidyl terminated compound.
According to some embodiments of the invention, the diluent comprises at least one of allyl glycidyl ether and aliphatic glycidyl ether. Further, the aliphatic glycidyl ether includes at least one of 1, 4-butanediol diglycidyl ether, polypropylene glycol diglycidyl ether, and polyethylene glycol monoglycidyl ether. Preferably, the diluent in the present invention is a combination of allyl glycidyl ether and 1,4 butanediol diglycidyl ether. The diluent in the invention reduces the viscosity and the viscosity of the epoxy resin through dissolution and diffusion, and improves the fluidity and the processability of the epoxy resin, thereby being easier to apply. And it was found in the present invention that the effect of using two diluents simultaneously is superior to that of using one diluent alone.
According to some embodiments of the invention, the epoxy resin comprises at least one of bisphenol a type epoxy resin, bisphenol F type epoxy resin, 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate.
According to some embodiments of the invention, the epoxy resin has an epoxy value (equivalent weight/kg) of at least 3, preferably an epoxy resin having an epoxy value of 3-6. The epoxy value of the epoxy resin has important influence on reactivity, curing speed, heat resistance, flexibility, hardness and the like, so that the selection of proper epoxy equivalent is important to the material performance. For the composition system provided in the present invention, epoxy resins having an epoxy value of 3 to 6 are preferred.
According to some embodiments of the invention, the accelerator comprises at least one of 2,4, 6-tris (dimethylaminomethyl) phenol (DMP-30), benzyl Dimethylamine (BDMA).
According to some embodiments of the invention, the toughening agent is carboxyl terminated polyethylene glycol succinate. Epoxy resins are relatively brittle after curing, and often require the addition of a toughening agent to improve the brittleness and low toughness of the epoxy resin. Principle of: the modified polyurethane resin can be well compatible with a matrix, participates in the curing process, leads the crosslinked structure to be like a flexible chain segment, does not generate a split-phase structure, and effectively improves the toughness.
Aiming at the technical problems recorded in the background technology of the invention, the invention provides an epoxy resin-based composite insulating material for electrical equipment. The low viscosity of the epoxy resin is favorable for casting and processing the composite insulating material, but the epoxy resin material with low viscosity is difficult to maintain the mechanical and electrical properties and still can meet the high requirements of high-voltage electrical equipment, so the invention provides the epoxy resin-based composite insulating material with good mechanical and electrical properties. Specifically, the epoxy resin-based composite insulating material is obtained through optimization of at least the following aspects:
(1) The curing agent, the diluent and the toughening agent are preferably selected in reasonable proportion, and the processing technology is adopted, so that the viscosity of the epoxy resin can be effectively reduced, the infiltration of the epoxy resin and the fiber is facilitated, the difficulty of the epoxy resin processing technology (the problems of high viscosity, difficulty in rapid, effective and good infiltration of the fiber, and poor performance after curing in the prior art) is reduced, and the strength and the toughness of the epoxy resin are ensured.
(2) The reasonable matching of the optimized curing agent and the accelerator can effectively shorten the curing time of the epoxy resin and improve the internal and external uniformity of the product performance.
(3) According to the epoxy resin-based composite insulating material, the epoxy resin has higher toughness, adhesive force and corrosion resistance through the preferable toughening agent and proper adding proportion.
The epoxy resin-based composite insulating material provided by the invention has the advantages of low viscosity, favorable casting and processing of the composite insulating material and good mechanical property and electrical property, and can be used as an insulating material of high-voltage electrical equipment.
In a second aspect, the present invention provides a method for preparing the epoxy resin-based composite insulating material as described above, the method comprising the steps of: adding and mixing the epoxy resin, the curing agent, the accelerator, the diluent and the toughening agent in any sequence to obtain a mixed solution; carrying out vacuum degassing on the mixed solution, pre-curing for 2-4 hours at 80-90 ℃, and then post-curing for 6-12 hours at 100-130 ℃; and cooling to room temperature to obtain the epoxy resin-based composite insulating material.
According to some embodiments of the present invention, the preparation method of the epoxy resin-based composite insulating material specifically includes the following steps:
(1) Weighing the epoxy resin, the curing agent, the accelerator, the diluent and the toughening agent for standby;
(2) Mixing the epoxy resin, the curing agent, the accelerator, the diluent and the toughening agent in any required sequence to obtain a mixed solution; preferably, mixing and stirring the epoxy resin and the curing agent for 10-20 minutes at 50-70 ℃, adding the accelerator, the diluent and the toughening agent, and continuing mixing and stirring for 20-30 minutes at 50-70 ℃;
(3) Vacuum degassing the mixed solution in the step (2) for 20-40 minutes, injecting the mixed solution into a die, pre-curing the mixed solution for 2-4 hours at 80-90 ℃, and post-curing the mixed solution for 10-12 hours at 100-130 ℃; and cooling the die to room temperature to obtain the epoxy resin-based high-electric composite insulating material.
In a third aspect, the invention provides an application of the epoxy resin-based composite insulating material or the epoxy resin-based composite insulating material prepared by the preparation method in electric equipment.
According to some embodiments of the invention, the electrical equipment includes at least one of a dry transformer, a basin insulator, and a high voltage bushing.
The invention provides an epoxy resin-based composite insulating material for electrical equipment and a preparation method thereof. The invention solves the technical problem of insufficient mechanical properties of the low-viscosity epoxy resin, and the epoxy resin performance after curing can be applied to electrical equipment such as high-voltage bushings, cable terminals, large-scale motor stators and the like.
The invention is further illustrated by the following examples.
Example 1
Raw materials:
the weight portion of the adhesive comprises:
epoxy resin: 100 parts of bisphenol A type epoxy resin;
curing agent: 80 parts of a mixture of methyltetrahydrophthalic anhydride and polypropylene glycol, wherein the molar ratio of methyltetrahydrophthalic anhydride to polypropylene glycol (PPG) is 12:1;
a diluent: 5 parts of allyl glycidyl ether and 10 parts of 1, 4-butanediol diglycidyl ether;
and (3) an accelerator: 0.5 part of 2,4, 6-tris (dimethylaminomethyl) phenol (DMP-30);
toughening agent: 5 parts of carboxyl end-capped polyethylene glycol succinate.
In this example, an epoxy resin based composite insulation material was prepared using the following method:
(1) Weighing the epoxy resin, the curing agent, the accelerator, the diluent and the toughening agent for standby;
(2) Mixing and stirring the epoxy resin and the curing agent for 20 minutes at 60 ℃, then adding the accelerator, the diluent and the toughening agent, and continuing mixing and stirring for 30 minutes at 60 ℃; mixing to obtain a mixed solution;
(3) Vacuum degassing the mixed solution in the step (2) for 30 minutes, injecting the mixed solution into a mold, pre-curing the mixed solution for 3 hours at 90 ℃, and post-curing the mixed solution for 12 hours at 120 ℃; and cooling the die to room temperature to obtain the epoxy resin-based composite insulating material.
The prepared epoxy resin-based composite insulating material was subjected to a related performance test, and the test results are shown in table 1.
Example 2
Raw materials:
the weight portion of the adhesive comprises:
epoxy resin: 100 parts of bisphenol A type epoxy resin;
curing agent: 90 parts of a mixture of methyltetrahydrophthalic anhydride and polypropylene glycol; wherein the molar ratio of methyltetrahydrophthalic anhydride to polypropylene glycol (PPG) is 12:1;
a diluent: 5 parts of allyl glycidyl ether and 10 parts of 1, 4-butanediol diglycidyl ether;
and (3) an accelerator: 0.5 part of 2,4, 6-tris (dimethylaminomethyl) phenol (DMP-30);
toughening agent: 5 parts of carboxyl end-capped polyethylene glycol succinate.
In this example, an epoxy resin-based composite insulating material was prepared using the same method as in example 1.
The prepared epoxy resin-based composite insulating material was subjected to a related performance test, and the test results are shown in table 1.
Example 3
Raw materials:
the weight portion of the adhesive comprises:
epoxy resin: 100 parts of bisphenol A type epoxy resin;
curing agent: 80 parts of a mixture of methyltetrahydrophthalic anhydride and polypropylene glycol; wherein the molar ratio of methyltetrahydrophthalic anhydride to polypropylene glycol (PPG) is 12:1;
a diluent: 3 parts of allyl glycidyl ether and 12 parts of 1, 4-butanediol diglycidyl ether;
and (3) an accelerator: 0.5 part of 2,4, 6-tris (dimethylaminomethyl) phenol (DMP-30);
toughening agent: 5 parts of carboxyl end-capped polyethylene glycol succinate.
In this example, an epoxy resin-based composite insulating material was prepared using the same method as in example 1.
The prepared epoxy resin-based composite insulating material was subjected to a related performance test, and the test results are shown in table 1.
Example 4
Raw materials:
the weight portion of the adhesive comprises:
epoxy resin: 100 parts of bisphenol A type epoxy resin;
curing agent: 80 parts of a mixture of methyltetrahydrophthalic anhydride and polypropylene glycol; wherein the molar ratio of methyltetrahydrophthalic anhydride to polypropylene glycol (PPG) is 12:1;
a diluent: 5 parts of allyl glycidyl ether and 10 parts of 1, 4-butanediol diglycidyl ether;
and (3) an accelerator: 0.5 part of 2,4, 6-tris (dimethylaminomethyl) phenol (DMP-30);
toughening agent: 8 parts of carboxyl end-capped polyethylene glycol succinate.
In this example, an epoxy resin-based composite insulating material was prepared using the same method as in example 1.
The prepared epoxy resin-based composite insulating material was subjected to a related performance test, and the test results are shown in table 1.
Example 5
Raw materials:
the weight portion of the adhesive comprises:
epoxy resin: 100 parts of bisphenol A type epoxy resin;
curing agent: 80 parts of a mixture of methyltetrahydrophthalic anhydride and polypropylene glycol; wherein the molar ratio of methyltetrahydrophthalic anhydride to polypropylene glycol (PPG) is 12:1;
a diluent: 5 parts of allyl glycidyl ether and 10 parts of 1, 4-butanediol diglycidyl ether;
and (3) an accelerator: 1 part of 2,4, 6-tris (dimethylaminomethyl) phenol (DMP-30);
toughening agent: 8 parts of carboxyl end-capped polyethylene glycol succinate.
In this example, an epoxy resin-based composite insulating material was prepared using the same method as in example 1.
The prepared epoxy resin-based composite insulating material was subjected to a related performance test, and the test results are shown in table 1.
Example 6
Raw materials:
the weight portion of the adhesive comprises:
epoxy resin: 100 parts of bisphenol A type epoxy resin;
curing agent: 80 parts of a mixture of methyltetrahydrophthalic anhydride and polypropylene glycol; wherein the molar ratio of methyltetrahydrophthalic anhydride to polypropylene glycol (PPG) is 12:1;
a diluent: 15 parts of allyl glycidyl ether;
and (3) an accelerator: 1 part of 2,4, 6-tris (dimethylaminomethyl) phenol (DMP-30);
toughening agent: 8 parts of carboxyl end-capped polyethylene glycol succinate.
In this example, an epoxy resin-based composite insulating material was prepared using the same method as in example 1.
The prepared epoxy resin-based composite insulating material was subjected to a related performance test, and the test results are shown in table 1.
Example 7
Raw materials:
the weight portion of the adhesive comprises:
epoxy resin: 100 parts of bisphenol A type epoxy resin;
curing agent: 80 parts of a mixture of methyltetrahydrophthalic anhydride and polypropylene glycol; wherein the molar ratio of methyltetrahydrophthalic anhydride to polypropylene glycol (PPG) is 12:1;
a diluent: 5 parts of allyl glycidyl ether and 10 parts of 1, 4-butanediol diglycidyl ether;
and (3) an accelerator: 0.5 part of Benzyl Dimethylamine (BDMA);
toughening agent: 8 parts of carboxyl end-capped polyethylene glycol succinate.
In this example, an epoxy resin-based composite insulating material was prepared using the same method as in example 1.
The prepared epoxy resin-based composite insulating material was subjected to a related performance test, and the test results are shown in table 1.
Example 8
Raw materials:
the weight portion of the adhesive comprises:
epoxy resin: 100 parts of bisphenol A type epoxy resin;
curing agent: 80 parts of a mixture of methyltetrahydrophthalic anhydride and polypropylene glycol; wherein the molar ratio of methyltetrahydrophthalic anhydride to polypropylene glycol (PPG) is 12:1;
a diluent: 5 parts of allyl glycidyl ether and 10 parts of 1, 4-butanediol diglycidyl ether;
and (3) an accelerator: 0.1 part of 2,4, 6-tris (dimethylaminomethyl) phenol (DMP-30);
toughening agent: 8 parts of carboxyl end-capped polyethylene glycol succinate.
In this example, an epoxy resin-based composite insulating material was prepared using the same method as in example 1.
The prepared epoxy resin-based composite insulating material was subjected to a related performance test, and the test results are shown in table 1.
Example 9
Raw materials: as in example 1.
In this example, an epoxy resin based composite insulation material was prepared using the following method:
(1) Weighing the epoxy resin, the curing agent, the accelerator, the diluent and the toughening agent for standby;
(2) Mixing and stirring the epoxy resin and the curing agent for 20 minutes at 60 ℃, then adding the accelerator, the diluent and the toughening agent, and continuing mixing and stirring for 30 minutes at 60 ℃; mixing to obtain a mixed solution;
(3) Vacuum degassing the mixed solution in the step (2) for 30 minutes, injecting the mixed solution into a mold, pre-curing the mixed solution for 4 hours at 80 ℃, and post-curing the mixed solution for 12 hours at 100 ℃; and cooling the die to room temperature to obtain the epoxy resin-based composite insulating material.
The prepared epoxy resin-based composite insulating material was subjected to a related performance test, and the test results are shown in table 1.
Example 10
Raw materials: as in example 1.
In this example, an epoxy resin based composite insulation material was prepared using the following method:
(1) Weighing the epoxy resin, the curing agent, the accelerator, the diluent and the toughening agent for standby;
(2) Mixing and stirring the epoxy resin and the curing agent for 20 minutes at 60 ℃, then adding the accelerator, the diluent and the toughening agent, and continuing mixing and stirring for 30 minutes at 60 ℃; mixing to obtain a mixed solution;
(3) Vacuum degassing the mixed solution in the step (2) for 30 minutes, injecting the mixed solution into a mold, pre-curing the mixed solution for 2 hours at 90 ℃, and post-curing the mixed solution for 12 hours at 130 ℃; and cooling the die to room temperature to obtain the epoxy resin-based composite insulating material.
The prepared epoxy resin-based composite insulating material was subjected to a related performance test, and the test results are shown in table 1.
Comparative example 1
The raw materials used in this comparative example were substantially the same as those in example 5, the only difference being that: no toughening agent was added in this comparative example.
In this comparative example, an epoxy resin-based composite insulating material was prepared in the same manner as in example 1.
The prepared epoxy resin-based composite insulating material was subjected to a related performance test, and the test results are shown in table 1.
Comparative example 2
The raw materials used in this comparative example were substantially the same as those in example 5, the only difference being that: the toughening agent in this comparative example uses 8 parts of carboxyl terminated polyethylene adipate.
In this comparative example, an epoxy resin-based composite insulating material was prepared in the same manner as in example 1.
The prepared epoxy resin-based composite insulating material was subjected to a related performance test, and the test results are shown in table 1.
Comparative example 3
The raw materials used in this comparative example were substantially the same as those in example 5, the only difference being that: no diluent was added in this comparative example.
In this comparative example, an epoxy resin-based composite insulating material was prepared in the same manner as in example 1.
The prepared epoxy resin-based composite insulating material was subjected to a related performance test, and the test results are shown in table 1.
And (3) testing:
the epoxy resin-based composite insulating materials prepared in examples 1 to 10 and comparative examples 1 to 4 were subjected to the following test, and the test results are shown in table 1.
(1) Tensile strength test: the test is carried out by referring to the test method recorded in the national standard GB/T531-1999;
(2) Elongation at break test: testing by referring to a testing method described in the national standard GB/T528-2009;
(3) Breakdown strength test: the test is carried out by referring to the test method recorded in the national standard GB/T1695-2005;
(4) Dielectric constant test: the test was performed with reference to the test method described in the national standard GB/T1693-2007.
TABLE 1
While the foregoing is directed to the preferred embodiments of the present invention, it will be appreciated by those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present invention, and such modifications and adaptations are intended to be comprehended within the scope of the present invention.
Claims (10)
1. The epoxy resin-based composite insulating material is characterized by comprising the following raw materials in parts by weight:
90-110 parts by weight of epoxy resin;
80-90 parts by weight of curing agent;
0.1 to 1 weight portion of accelerator;
13-17 parts of diluent;
3-8 parts by weight of a toughening agent;
wherein the curing agent comprises an anhydride compound and polypropylene glycol; the anhydride compound comprises at least one of hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride and methyl nadic anhydride;
the diluent includes at least one of allyl glycidyl ether and aliphatic glycidyl ether.
2. The epoxy resin-based composite insulating material according to claim 1, wherein in the curing agent, the molar ratio of the acid anhydride compound to the polypropylene glycol is (10 to 15): 1.
3. the epoxy resin based composite insulating material according to claim 1, wherein the aliphatic glycidyl ether comprises at least one of 1,4 butanediol diglycidyl ether, polypropylene glycol diglycidyl ether, and polyethylene glycol monoglycidyl ether.
4. The epoxy resin-based composite insulating material according to claim 1, wherein the epoxy resin comprises at least one of bisphenol a type epoxy resin, bisphenol F type epoxy resin, 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate.
5. The epoxy resin-based composite insulating material according to claim 4, wherein the epoxy resin has an epoxy value (equivalent/kg) of not less than 3.
6. The epoxy resin based composite insulation material of claim 1, wherein the accelerator comprises at least one of 2,4, 6-tris (dimethylaminomethyl) phenol (DMP-30), benzyl Dimethylamine (BDMA).
7. The epoxy resin-based composite insulating material of claim 1, wherein the toughening agent is carboxyl-terminated polyethylene glycol succinate.
8. The method for preparing an epoxy resin-based composite insulating material according to any one of claims 1 to 7, characterized in that the method comprises the steps of:
adding and mixing the epoxy resin, the curing agent, the accelerator, the diluent and the toughening agent in any sequence to obtain a mixed solution;
carrying out vacuum degassing on the mixed solution, pre-curing for 2-4 hours at 80-90 ℃, and then post-curing for 6-12 hours at 100-130 ℃; and cooling to room temperature to obtain the epoxy resin-based composite insulating material.
9. The use of the epoxy resin-based composite insulating material according to any one of claims 1 to 7 or the epoxy resin-based composite insulating material prepared by the preparation method according to claim 8 in electric equipment.
10. The use of claim 9, wherein the electrical equipment comprises at least one of a dry transformer, a basin insulator, and a high voltage bushing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311791966.7A CN117777658A (en) | 2023-12-25 | 2023-12-25 | Epoxy resin-based composite insulating material and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311791966.7A CN117777658A (en) | 2023-12-25 | 2023-12-25 | Epoxy resin-based composite insulating material and preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117777658A true CN117777658A (en) | 2024-03-29 |
Family
ID=90388587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311791966.7A Pending CN117777658A (en) | 2023-12-25 | 2023-12-25 | Epoxy resin-based composite insulating material and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117777658A (en) |
-
2023
- 2023-12-25 CN CN202311791966.7A patent/CN117777658A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110511536B (en) | Epoxy resin composition and preparation method thereof | |
| JP2786330B2 (en) | Superconducting magnet coil and curable resin composition used for the magnet coil | |
| CN106750341B (en) | Toughened modified epoxy anhydride impregnating resin and preparation method and application thereof | |
| CN110218414A (en) | A kind of composition epoxy resin and its preparation method and application | |
| EP3430630A1 (en) | A process for the preparation of insulation systems for electrical engineering, the articles obtained therefrom and the use thereof | |
| CN115058099B (en) | Epoxy resin composition with two-phase sea-island structure, composite material and preparation method of epoxy resin composition | |
| CN113897027A (en) | High-toughness and high-heat-resistance alicyclic epoxy resin and preparation method thereof | |
| WO2013123648A1 (en) | Curable epoxy composition with milled glass fiber | |
| CN117777658A (en) | Epoxy resin-based composite insulating material and preparation method and application thereof | |
| CA1333837C (en) | Low viscosity epoxy resin compositions | |
| CN113402853B (en) | Double-component epoxy resin composition and preparation method thereof | |
| CN113214602A (en) | Insulating resin composite material, high-voltage insulating sleeve and preparation method and application thereof | |
| US3716598A (en) | Hardenable epoxy resin compositions | |
| CN112898931A (en) | High-temperature epoxy resin potting material for preventing cold and hot alternating cracking after curing and use method thereof | |
| CN104245837B (en) | Curable compositions | |
| CN100551971C (en) | Solvent-free resin applied to vacuum pressure impregnation process of high-voltage motor | |
| CN108219379A (en) | A kind of integrated circuit plate modified epoxy and preparation method thereof | |
| JPS629248B2 (en) | ||
| KR102224020B1 (en) | Exoxy resin composition having low shrinkage and low viscosity for heavy electricals and its making method | |
| CN114702787B (en) | Super-high voltage resistant insulating resin suitable for vacuum suction injection molding and preparation method thereof | |
| CN114517000B (en) | Epoxy resin for electrical castable and preparation method and application thereof | |
| CN116515253B (en) | Epoxy resin curing agent, epoxy resin composition, glass fiber reinforced plastic pavement panel and preparation method thereof | |
| CN117467244A (en) | Epoxy resin material for pultrusion process and preparation method and application thereof | |
| CN117417620A (en) | Pultrusion resin composite material and preparation method and application thereof | |
| CN116285226A (en) | Epoxy resin composition with low-temperature conductivity activation energy, preparation method and application |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |