CN117758237A - Angle adjusting method, adjustable bracket and film processing device thereof - Google Patents
Angle adjusting method, adjustable bracket and film processing device thereof Download PDFInfo
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- CN117758237A CN117758237A CN202211165263.9A CN202211165263A CN117758237A CN 117758237 A CN117758237 A CN 117758237A CN 202211165263 A CN202211165263 A CN 202211165263A CN 117758237 A CN117758237 A CN 117758237A
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- inclination angle
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Abstract
The invention discloses an angle adjusting method, an adjustable bracket and a film processing device thereof, wherein the adjustable bracket comprises: the circumferential adjusting piece is arranged at the outer side of the vacuum reaction cavity of the film processing device and comprises a circumferential sliding groove; the bottom of the fixing bracket is in sliding connection with the circumferential sliding groove, and the fixing bracket can rotate along the circumferential sliding groove in the circumferential direction; the inclination angle adjusting frame, its both ends are connected with the fixed bolster, contain first position and second position on the inclination angle adjusting frame, contain the third position on the fixed bolster, the distance between first position and the third position is greater than the distance between second position and the third position, is provided with temperature sensor and temperature sensor on the inclination angle adjusting frame and can follow the inclination angle adjusting frame and remove. The advantages are that: the adjustable bracket enables the vertical inclination angle and the plane circumference azimuth angle of the temperature sensor to be adjustable during measurement, increases the temperature measuring area range of the temperature sensor, and improves the setting flexibility of the temperature sensor.
Description
Technical Field
The invention relates to the field of semiconductor equipment, in particular to an angle adjusting method, an adjustable bracket and a film processing device thereof.
Background
At present, a semiconductor process piece or a substrate is subjected to micro-processing in a process mode such as plasma etching, physical vapor deposition (Physical Vapor Deposition, PVD for short), chemical vapor deposition (Chemical Vapor Deposition, CVD for short) and the like, for example, a flexible display screen, a flat panel display, a light emitting diode, a solar cell and the like are manufactured. Micromachining fabrication involves a variety of different processes and steps, including chemical vapor deposition processes, atomic layer deposition processes, and the like, which are widely used, and which can deposit a wide variety of materials, including a wide range of insulating materials, most metallic materials, and metallic alloy materials, typically in high vacuum reaction chambers of thin film processing equipment.
With the ever shrinking feature sizes of semiconductor devices and ever increasing device integration, ever increasing demands are placed on the uniformity of thin film processing on the wafer surface. Although the performance of the thin film processing device is greatly improved after multiple updating, the thin film deposition uniformity has a plurality of defects, and particularly, the conventional vapor deposition method and equipment have difficulty in meeting the uniformity requirement of thin film processing along with the increasing of the wafer size.
In the film processing process, the film growth environment of the wafer is very harsh, and various process conditions can influence the uniformity of the film processing on the surface of the wafer, such as the condition of a heating temperature field of the wafer, the flowing direction of reaction gas, the testing accuracy of the reaction temperature and the like, which directly determine the quality of the film processing of the wafer. However, in practical application, temperature measurement in the cavity is often accompanied with the problem that temperature measurement error is larger or temperature measurement is not timely, which may be due to factors such as narrow measurement range of the temperature measuring device caused by narrow space in the cavity, so that temperature measurement and control in the cavity are often complicated, difficult to regulate and control, and uneven heating temperature field in the reaction chamber is easily caused. If the process environment of the reaction area in the reaction chamber is not completely consistent, adverse phenomena such as uneven thickness, uneven components, uneven physical characteristics and the like of the thin film treatment on the surface of the wafer can be caused, so that the yield of the wafer production is reduced. Accordingly, improvements to existing thin film processing apparatus are needed to improve the uniformity of wafer thin film processing.
Disclosure of Invention
The invention aims to provide an angle adjusting method, an adjustable bracket and a film processing device thereof, wherein the adjustable bracket combines a circumferential adjusting piece, a fixed bracket, an inclination angle adjusting frame and the like, so that the vertical inclination angle and the plane circumference angle of a temperature sensor during measurement can be adjusted, the temperature measuring area range of the temperature sensor is enlarged, one temperature sensor can measure hundreds or even thousands of position points, the setting flexibility of the temperature sensor is improved, and the temperature sensor can measure a plurality of positions for verification in the process, so that the accuracy of temperature measurement is further ensured.
In order to achieve the above purpose, the present invention is realized by the following technical scheme:
an adjustable bracket for a temperature sensing assembly of a thin film processing apparatus, comprising:
the circumferential adjusting piece is arranged at the outer side of the vacuum reaction cavity of the film processing device and comprises a circumferential sliding groove;
the bottom of the fixed bracket is in sliding connection with the circumferential sliding groove, and the fixed bracket can rotate along the circumferential sliding groove in the circumferential direction;
the inclination angle adjusting frame is connected with the fixed support at two ends, the inclination angle adjusting frame comprises a first position and a second position, the fixed support comprises a third position, the distance between the first position and the third position is larger than the distance between the second position and the third position, and the inclination angle adjusting frame is provided with a temperature sensor and can move along the inclination angle adjusting frame.
Optionally, the thin film processing device comprises a member transparent to the detection medium of the temperature sensor, and the detection direction of the detection medium of the temperature sensor is perpendicular to the surface of the member transparent to the detection medium on the detection path thereof.
Optionally, the inclination angle adjusting frame is an arc-shaped structure bracket.
Optionally, the arc-shaped structure support is of a concave structure or a convex structure.
Optionally, the central angle range corresponding to the inclination angle adjusting frame is 60-100 degrees.
Optionally, an arc guide is arranged between the temperature sensor and the inclination angle adjusting frame to guide the temperature sensor to move on the inclination angle adjusting frame.
Optionally, the arc-shaped guide piece comprises arc-shaped distributed T-shaped bosses and T-shaped grooves matched with the arc-shaped bosses, and the T-shaped grooves are used for guiding the T-shaped bosses to move inside the T-shaped bosses;
the T-shaped boss is arranged on the temperature sensor, the T-shaped groove is arranged on the inclination angle adjusting frame, or the T-shaped boss is arranged on the inclination angle adjusting frame, and the T-shaped groove is arranged on the temperature sensor.
Optionally, the temperature sensor is connected with the inclination adjusting frame through a connecting shaft, and the connecting shaft fastens and positions the temperature sensor on the inclination adjusting frame through a mechanical fastening device.
Optionally, the temperature sensor is disposed on the inclination adjusting frame through a connecting shaft, and a contact area between the connecting shaft and the inclination adjusting frame comprises an edge angle.
Optionally, the method further comprises:
a connecting member connected to the chamber of the thin film processing apparatus;
the bottom of the telescopic device is connected with the top of the connecting piece;
the observation window structure, its one end with but telescoping device is connected, and its other end is connected with temperature sensor, temperature sensor can be relative observation window structure takes place to rotate, the observation window structure contains transparent structure, transparent structure is perpendicular all the time with the direction of advance of the detection medium that temperature sensor sent.
Optionally, the telescopic device is of a bellows structure.
Optionally, the connecting piece is of flange structure.
Optionally, the connecting piece is connected with the telescopic device through a mechanical fastening device;
the telescopic device is connected with the observation window structure through a mechanical fastening device;
the temperature sensor is connected with the observation window structure through a mechanical fastening device.
Optionally, a thin film processing apparatus comprises,
a vacuum reaction chamber;
the heating devices are arranged outside the vacuum reaction cavity so as to provide heat energy for the vacuum reaction cavity;
the temperature measuring component comprises a temperature sensor and the adjustable bracket.
Optionally, at least a partial region of the vacuum reaction chamber is made of a material permeable to the temperature sensor detection medium.
Optionally, the method further comprises:
and the outer cavity is arranged at the outer side of the vacuum reaction cavity.
Optionally, the circumferential adjusting member is disposed at the top of the outer cavity;
the top wall of the outer cavity is provided with a detection hole, and the connecting piece is connected with the detection hole.
Optionally, a vacuum environment is arranged between the outer cavity and the vacuum reaction cavity;
the surrounding range of the connecting piece, the telescopic device and the observation window structure is a vacuum environment.
Optionally, the temperature sensor is an infrared pyrometer.
Optionally, a method for adjusting a measurement angle of a temperature measurement component of the thin film processing apparatus includes:
the adjusting and fixing bracket rotates along a circumferential chute of the circumferential adjusting piece;
and adjusting the position of the temperature sensor on the inclination angle adjusting frame to adjust the measuring angle of the temperature sensor.
Optionally, the detection direction of the detection medium of the temperature sensor is perpendicular to the top wall of the vacuum reaction cavity.
Compared with the prior art, the invention has at least the following advantages:
according to the angle adjusting method, the adjustable bracket and the film processing device thereof, the circumferential adjusting piece, the fixed bracket and the inclination angle adjusting bracket are combined by the adjustable bracket, so that the vertical inclination angle and the plane circumference angle of the temperature sensor during measurement can be adjusted, the temperature measuring area range of the temperature sensor is enlarged, hundreds or even thousands of position points can be measured by one temperature sensor, and the setting and temperature measuring flexibility of the temperature sensor is improved; meanwhile, the adjustable bracket can adjust the temperature sensor to measure the temperature for multiple times at the same position, so that the temperature measurement repeatability of the temperature measurement position is ensured.
Furthermore, the adjustable bracket can enable the detection direction of the detection medium of the temperature sensor to be perpendicular to a transparent (permeable detection medium) object on the detection path of the detection medium, thereby reducing the influence of other components on the detection effect of the detection medium and improving the temperature measurement accuracy of the temperature sensor.
Drawings
FIG. 1 is a schematic view of a thin film processing apparatus according to the present invention;
FIG. 2 is a top view of the thin film processing apparatus of FIG. 1;
FIG. 3 is a schematic diagram illustrating a method for adjusting a measurement angle of a temperature measuring assembly according to the present invention;
FIG. 4 is a schematic view of another adjustable bracket according to the present invention;
FIG. 5 is a schematic view of another film processing apparatus according to the present invention;
FIG. 6 is a top view of the thin film processing apparatus of FIG. 5;
FIG. 7 is a schematic view of the temperature sensor of FIG. 5 for measuring the temperature of the vacuum chamber;
FIG. 8 is a schematic view of planar circumferential azimuthal adjustment of the temperature sensor of FIG. 5 to measure the temperature of the vacuum chamber;
FIG. 9 is a schematic diagram of planar circumferential azimuth adjustment of a temperature sensor for measuring temperature of a wafer.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, in this document, the terms "comprises," "comprising," "has," "having," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal device. Without further limitation, an element defined by the statement "comprising … …" or "comprising … …" does not exclude the presence of additional elements in a process, method, article or terminal device comprising the element.
It is noted that the drawings are in a very simplified form and utilize non-precise ratios, and are intended to facilitate a convenient, clear, description of the embodiments of the invention.
Example 1
As shown in fig. 1, a thin film processing apparatus (CVD apparatus) according to the present invention includes a vacuum reaction chamber 110, wherein the vacuum reaction chamber 110 is configured to process one or more wafers W, including depositing materials on the upper surface of the wafers W. The vacuum reaction chamber 110 has a top wall 111 at a top end, a bottom wall 112 at a bottom end, and a side wall 113 extending between the top wall 111 and the bottom wall 112. The vacuum reaction chamber 110 includes an inlet opening at one end and an outlet opening (not shown) at the other end, a process gas for deposition flows into an inner space of the vacuum reaction chamber 110 from the inlet opening, a chemical vapor deposition process is performed in a reaction region above the wafer W, and the chamber is discharged from the outlet opening. The vacuum reaction chamber 110 is internally provided with a wafer supporting structure 120, the wafer supporting structure 120 comprises a wafer bearing table 121 and a supporting frame 122, the front surface of the wafer bearing table 121 is used for bearing a wafer W subjected to a chemical vapor deposition process, the supporting frame 122 is arranged below the wafer bearing table 121 and is used for supporting the wafer bearing table 121, and optionally, the supporting frame 122 is made of a nonmetallic material so as to reduce the risk of pollution of the inner space of the chamber. Alternatively, the top and bottom walls 111, 112 are made of an optically transparent or translucent material that is transparent to thermal energy (e.g., a quartz material that is transparent to a particular infrared band).
Further, as shown in fig. 1, the apparatus includes a plurality of heating devices 130 for providing heat energy to the vacuum reaction chamber 110, and each heating device 130 is disposed above the vacuum reaction chamber 110. Alternatively, the heating devices 130 are high intensity tungsten filament lamps having transparent quartz envelope and containing halogen gas such as iodine, which generate full spectrum radiant heat energy that is not significantly absorbed by the top wall 111 made of heat transparent material to ensure that the heat energy generated by each heating device 130 is maximized within the vacuum reaction chamber 110. During the process, the inside of the vacuum reaction chamber 110 of the chemical vapor deposition apparatus is brought to a desired process temperature by the respective heating means 130 so that the process gas supplied into the vacuum reaction chamber 110 is thermally decomposed, thereby depositing a thin film material on the upper surface of the wafer W. Alternatively, the deposited thin film material may be a group III, group IV and/or group V material, or a material comprising a group III, group IV and/or group V dopant. Illustratively, the deposited thin film material may be one or more of gallium arsenide, gallium nitride, or aluminum gallium nitride.
In order to further detect the temperature state of each part in the vacuum reaction chamber 110, the thin film processing device of the invention further comprises a temperature measuring component 140, wherein the temperature measuring component 140 comprises a temperature sensor 144 and an adjustable bracket for bearing the temperature sensor 144, the adjustable bracket is arranged outside the vacuum reaction chamber 110, and the adjustable bracket enables the plane circumference azimuth angle and the vertical inclination angle of the temperature sensor 144 during measurement to be adjustable, so that the temperature sensor 144 can measure the omnibearing temperature of each part in the vacuum reaction chamber 110, and reliable data support is provided for regulating and controlling the process parameters in the process; meanwhile, the adjustable support is disposed outside the vacuum reaction chamber 110, and the temperature sensor 144 performs temperature measurement in a non-contact manner, so that the limited space inside the vacuum reaction chamber 110 is not occupied, and the temperature sensor is not required to be affected by the limitation of the space size inside the vacuum reaction chamber 110 and the process environment.
Specifically, as shown in fig. 1 and 2 in combination, fig. 2 is a top view of the thin film processing apparatus of fig. 1, and an adjustable support for a temperature measurement assembly 140 comprises: a circumferential adjustment member 141, at least one fixing bracket 142, and a tilt adjustment bracket 143. The circumferential adjusting member 141 includes a circumferential chute, which is disposed above the vacuum reaction chamber 110, and optionally, the circumferential adjusting member 141 is fixed above the vacuum reaction chamber 110 by a bracket body. The bottom of the fixing support 142 is slidably connected with the circumferential chute, and the fixing support 142 may perform circumferential rotation along the circumferential chute. The two ends of the tilt angle adjusting frame 143 are connected with the fixing frame 142, the tilt angle adjusting frame 143 includes a first position 1431 and a second position 1432, the fixing frame 142 includes a third position 1421, a vertical distance (H1) between the first position 1431 and the third position 1421 is greater than a vertical distance (H2) between the second position 1432 and the third position 1421, that is, the tilt angle adjusting frame 143 is in a non-planar structure, at least one temperature sensor 144 is disposed on the tilt angle adjusting frame 143, the temperature sensor 144 can move along the tilt angle adjusting frame 143, the temperature sensor 144 sends out a temperature state of detecting media to a predetermined temperature measuring point to detect the predetermined position, and when the temperature sensor 144 moves along the tilt angle adjusting frame 143, the tilt angle of the detecting media sent out by the temperature sensor 144 changes accordingly.
In this embodiment, the inclination angle adjusting frame 143 has a non-planar structure, and at least a partial area of the inclination angle adjusting frame 143 has a relief structure. When the temperature sensor 144 moves on the inclination angle adjusting frame 143, along with the fluctuation of the structure of the inclination angle adjusting frame 143, the moving track of the temperature sensor 144 also fluctuates, and the inclination angle of the detection medium sent by the temperature sensor also changes, so that the angle adjustment of the detection path 145 (temperature measuring line) of the detection medium in the vertical direction is realized; further, the inclination angle adjusting frame 143 where the temperature sensor 144 is located is connected with the fixing frame 142, the fixing frame 142 can rotate circumferentially along the circumferential chute of the circumferential adjusting member 141, and the inclination angle adjusting frame 143 and the temperature sensor 144 carried by the fixing frame can also rotate circumferentially along with the circumferential chute, so that the adjustment of the plane circumferential azimuth angle of the temperature sensor 144 is realized, the 360-degree rotation adjustment of the temperature sensor 144 on the plane is realized, the measurement area range of the temperature sensor 144 is enlarged, the omnibearing angle measurement of the temperature sensor 144 on the vacuum reaction chamber 110 and all parts in the vacuum reaction chamber is realized, and the flexibility of the temperature measurement and the setting of the temperature sensor 144 is improved; meanwhile, the adjustable temperature sensor 144 of the adjustable bracket can measure the temperature for a plurality of times at the same position, so that the repeatability of temperature measurement at the temperature measuring position is ensured.
Further, the thin film processing device comprises a part transparent to the detection medium of the temperature sensor 144, the detection direction of the detection medium of the temperature sensor 144 is perpendicular to the surface of the part transparent to the detection medium on the detection path 145 of the detection medium, so as to reduce the refraction and reflection of the part transparent to the detection medium on the detection path 145 to the detection medium, reduce the loss of the detection medium sent by the temperature sensor 144, and further ensure the accuracy of temperature measurement. At least a part of the area of the vacuum reaction chamber 110 is made of a material that can penetrate through a detection medium of the temperature sensor 144, in an embodiment, the top wall 111 of the vacuum reaction chamber 110 is made of a material that is transparent to the detection medium, the temperature sensor 144 is used for measuring the temperature of the wafer W in the vacuum reaction chamber 110, when the detection path of the detection medium is not perpendicular to the upper surface of the top wall 111, the detection medium inevitably reflects and refracts at the top wall 111, the temperature measurement effect is greatly reduced, and the temperature measurement accuracy is further reduced, and when the detection path 145 of the detection medium is perpendicular to the top wall 111, the loss of the detection medium sent by the temperature sensor 144 on the detection path 145 can be effectively reduced, and the accuracy of the temperature measurement is improved. In practical applications, whether the detection path 145 of the detection medium of the temperature sensor 144 is perpendicular to the surface of the transparent component of the detection medium can be determined by the reflectance of the detection medium, but it is also possible to determine in other manners, which is not limited in the present invention.
In the present embodiment, as shown in fig. 2, the circumferential adjustment member 141 is a planar circumferential fixed adjustment ring, which includes a circular chute. The temperature measuring assembly 140 comprises a pair of fixing brackets 142 arranged in parallel, wherein the fixing brackets 142 are vertical fixing brackets, each fixing bracket comprises a bottom supporting part, and the bottom supporting part is slidably connected with the circular chute of the circumferential adjusting member 141, so that the fixing brackets 142 can rotate 360 degrees along the circular chute, and further adjust the fixing brackets to be at any azimuth angle in the plane circumference. In actual use, the fixing support 142 is driven to rotate along the circular chute of the circumferential adjusting member 141 by a driving device (not shown) so as to adjust the plane circumferential azimuth angle of the temperature sensor 144 carried by the fixing support 142. Further, the circumferential adjustment member 141 and the fixing bracket 142 are both made of a metal material to secure mechanical strength and stability of the adjustable bracket. It should be noted that, the shape of the circumferential adjustment member 141 is not limited to the above, and may be other structures having circumferential sliding grooves, for example, elliptical or square, and the invention is not limited to the shape, as long as the azimuth angle of the fixing bracket 142 along the sliding groove of the circumferential adjustment member 141 can be changed.
As shown in fig. 1, in the present embodiment, the adjustable bracket of the temperature measuring assembly 140 further includes a pair of parallel tilt adjusting brackets 143, where the tilt adjusting brackets 143 are convex arc-shaped structural brackets protruding upwards, and two ends of the arc-shaped structural brackets are respectively connected to two fixing brackets 142. Further, the central angle range corresponding to the arc-shaped structural support is 60 ° to 100 °, in this embodiment, the angle at the left side of the vertical center line of the tilt adjusting frame 143 is defined as negative, the angle at the right side is defined as positive, and the temperature sensor 144 moves on the tilt adjusting frame 143, so that the angle adjustment range of the detection direction of the detection medium relative to the vertical center line of the tilt adjusting frame 143 can be between-35 ℃ and 35 ℃. Of course, the range of the central angle corresponding to the tilt angle adjusting frame 143 is not limited to the above, and the tilt angle adjusting range of the detecting medium of the temperature sensor 144 is not limited to the above, but may be other ranges, which are not limited to the present invention. Alternatively, the tilt frame 143 is made of metal or nonmetal, and has a simple structure and is easy to process. It should be noted that the number and shape of the inclination angle adjusting frames 143 are not limited to the above, and in other embodiments, the number and shape of the inclination angle adjusting frames 143 may be other, so long as the adjustment of the measured inclination angle of the temperature sensor 144 on the inclination angle adjusting frames 143 can be achieved, which is not limited by the present invention. Further, the number of the fixing brackets 142 is not limited to the above, and may be set to other numbers according to practical application requirements, which is not limited in the present invention.
Further, in the present embodiment, the temperature sensor 144 is an infrared pyrometer, which uses the infrared temperature measurement principle to measure the temperature of the object such as the wafer W, the wafer carrier 121, the chamber top wall 111 or the side wall 113 in a non-contact manner through infrared rays which are emitted as a detection medium. When the temperature sensor 144 is used to measure the temperature of the wafer W in the vacuum reaction chamber 110, the top wall 111 of the vacuum reaction chamber 110 is made of a material that is transparent to infrared rays of the infrared pyrometer, and the infrared rays have a wavelength band that is transparent to the top wall 111 but not the wafer W, so as to measure the temperature state of the surface of the wafer W; when the temperature sensor 144 is used to measure the temperature of the ceiling 111 of the vacuum reaction chamber 110, the infrared band of the infrared pyrometer used is not transmitted through the ceiling 111. Of course, the type of the temperature sensor 144 is not limited to the above, but may be any other type of temperature measuring device, which is not limited to the present invention, and in practical application, an appropriate temperature sensor 144 may be used according to practical use requirements. On the other hand, the invention does not limit the number of the temperature sensors 144 arranged on the inclination angle adjusting frame 143, and can be arranged according to actual requirements, and each temperature sensor 144 measures the temperature of the same or different components so as to improve the detection accuracy of the temperature reaction field distribution in the vacuum reaction chamber 100, thereby providing a reliable data base for the regulation and control of process conditions. It should be understood that the present invention is not limited to the number of temperature measuring assemblies 140 disposed above the vacuum reaction chamber 100, and in another embodiment, a plurality of temperature measuring assemblies 140 are disposed at different azimuth positions above the vacuum reaction chamber 100 to realize omnibearing temperature measurement of the vacuum reaction chamber 100 and its internal components.
Optionally, an arc guide is disposed between the temperature sensor 144 and the tilt angle adjusting frame 143 to guide the temperature sensor 144 to move on the tilt angle adjusting frame 143, so as to change the tilt angle and the measurement range during measurement. Further, the arc-shaped guide piece comprises arc-shaped distributed T-shaped bosses and T-shaped grooves matched with the arc-shaped bosses, and the T-shaped grooves are used for guiding the T-shaped bosses to move inside the T-shaped bosses. In this embodiment, the inclination adjusting frame 143 is provided with T-shaped grooves with arc distribution, and the temperature sensor 144 is provided with T-shaped bosses with arc distribution, and the T-shaped bosses are matched with the T-shaped grooves, so that the T-shaped bosses of the temperature sensor 144 move in the T-shaped grooves of the inclination adjusting frame 143. In actual use, the driving device drives the temperature sensor 144 to enable the T-shaped boss to move along the T-shaped groove of the inclination angle adjusting frame 143, so as to change the position of the T-shaped boss on the inclination angle adjusting frame 143, and adjust the inclination angle of the temperature sensor 144. It will be appreciated that in another embodiment, the inclination adjusting frame 143 is provided with T-shaped bosses with arc distribution, and the temperature sensor 144 is provided with T-shaped grooves with arc distribution. Alternatively, the driving means is a stepper motor. It should be noted that the driving device is not limited to the above, but may have other structures, and the present invention is not limited thereto, and of course, the movement of the temperature sensor 144 on the inclination angle adjusting frame 143 and the rotation of the fixing bracket 142 along the circumferential chute of the circumferential adjusting member 141 may also be directly adjusted manually by a worker, and the present invention does not limit the adjusting driving source thereof. Further, a mechanical fastening device may be further provided, and after the movement adjustment of the temperature sensor 144 on the tilt adjustment frame 143 is completed, the temperature sensor 144 and the tilt adjustment frame 143 may be locked and fixed by using the mechanical fastening device, or may be fixed relatively by friction between the two without limiting the present invention.
It is understood that the fixing manner of the temperature sensor 144 is not limited to the above, and may be other fixing manners, as long as the inclination adjustment and fixing of the temperature sensor 144 on the inclination adjustment frame 143 can be achieved. For example, in another embodiment, the tilt adjusting bracket 143 is provided with an arc-shaped through slot, the temperature sensor 144 is provided with a through hole corresponding to the arc-shaped through slot, a connecting shaft passes through the arc-shaped through slot and the through hole to connect the tilt adjusting bracket 143 and the temperature sensor 144, and two ends of the connecting shaft comprise mechanical fastening devices (such as bolt assemblies) so as to lock and fix the temperature sensor 144 and the tilt adjusting bracket 143. In practice, the mechanical fastening means are adjusted so that the temperature sensor 144 can move along the arc-shaped through slot of the inclination adjusting bracket 143, so as to adjust the inclination and the measuring range during the measurement. After the measurement state of the temperature sensor 144 is adjusted to a predetermined state, the mechanical fastening means is adjusted to lock and fix it to the inclination adjustment frame 144 for subsequent temperature measurement. In yet another embodiment, the inclination adjusting frame 143 is provided with an arc-shaped through groove, the temperature sensor 144 is provided with a through hole corresponding to the arc-shaped groove, the connection shaft penetrates through the arc-shaped through groove and the through hole to connect the inclination adjusting frame 143 with the temperature sensor 144, and the contact area of the connection shaft and the arc-shaped through groove contains a plurality of edges and corners, which can prevent the connection shaft from rotating in the arc-shaped groove, so that the temperature sensor 144 can be fixed on the inclination adjusting frame 143 without too many additional mechanical fastening devices. Of course, the groove structure on the inclination angle adjusting frame 143 is not limited to an arc shape, and may be other shapes, as long as the inclination angle adjustment of the temperature sensor 144 can be achieved, which is not limited by the present invention; similarly, the inclination angle adjusting frame 143 may be provided with a plurality of holes distributed at different positions instead of the arc-shaped grooves, so that the connecting shaft passes through the holes and the through holes to lock and fix the holes and the through holes.
Based on the same inventive concept, the invention also discloses a method for adjusting the measurement angle of the temperature measuring component 140 of the thin film processing device, as shown in fig. 3, the method comprises: the adjusting fixing bracket 142 rotates along the circumferential chute of the circumferential adjusting member 141 to adjust the plane circumferential azimuth of the temperature sensor 144; the position of the temperature sensor 144 on the inclination angle adjusting bracket 143 is adjusted to adjust the inclination angle of the temperature sensor 144. It should be noted that, the adjustment sequence of the plane circumference azimuth angle and the inclination angle of the temperature sensor 144 is not limited to the above, and in other embodiments, the inclination angle of the temperature sensor may be adjusted first and then the plane circumference azimuth angle may be adjusted, which is not limited by the present invention. When the plane circumference azimuth angle of the temperature sensor 144 is adjusted, the temperature sensor 144 and the inclination angle adjusting bracket 143 are in a locking and fixing state (the inclination angle is unchanged), and when the inclination angle of the temperature sensor 144 is adjusted, the fixing bracket 142 and the circumferential adjusting member 141 are in a locking and fixing state (the plane circumference azimuth angle is unchanged).
Further, when the temperature sensor 144 is used to measure the temperature state of the wafer W in the vacuum reaction chamber 110, the top wall 111 of the vacuum reaction chamber 110 is made of a material that can be used to detect the medium through the temperature sensor 144. In practical applications, in order to prevent the trace refraction of the top wall 111 to the path of the medium detected by the temperature sensor 144 from causing trace loss of the detecting medium on the detecting path 145, the advancing direction (detecting path) of the detecting medium of the temperature sensor 144 is perpendicular to the top wall 111 of the vacuum reaction chamber 110, so as to reduce the interference of the top wall 111 to the detecting medium of the temperature sensor 144 as little as possible, further ensure that the temperature detected by the temperature sensor 144 is the accurate temperature of the predetermined detecting position, ensure the accuracy of the measured data, further ensure the accurate measurement of the distribution of the temperature field in the cavity, provide reliable data support for the process parameter adjustment in the process, ensure the quality of the wafer W production, and improve the production yield.
It should be noted that, the structure of the adjustable bracket of the temperature measuring assembly 140 in the present invention is not limited to the above, and may be other structures as long as the corresponding functions of the adjustable bracket can be achieved, which is not limited in the present invention. In another embodiment, as shown in fig. 4, the adjustable support of the temperature measuring assembly 140 includes a circumferential adjusting member 141, a pair of fixed supports 142 and an inclination adjusting frame 143, the inclination adjusting frame 143 is provided with a temperature sensor 144, the inclination adjusting frame 143 is a concave arc-shaped structure support, the temperature sensor 144 can move on the inclination adjusting frame 143, and a connection manner between the temperature sensor 144 and the inclination adjusting frame 143 is similar to or the same as that of the embodiment, and will not be described herein. Further, the thin film processing apparatus of the present invention is not limited to the chemical vapor deposition apparatus, but may be other types of thin film processing apparatuses, such as an atomic layer deposition apparatus in another embodiment, and the present invention is not limited to the type thereof.
Example two
Based on the structural characteristics of the thin film processing apparatus according to the first embodiment, some changes are made to the cavity structure and the structure of the temperature measuring assembly 240, and some changes are mainly made to the adjustable support of the temperature measuring assembly 240.
As shown in fig. 5 to 9, in this embodiment, the thin film processing apparatus further includes an outer chamber 250 in addition to the components in the first embodiment, the outer chamber 250 is disposed outside the vacuum reaction chamber 210, and the heating device 230 is located in a space surrounded by the outer chamber 250 and a top wall of the vacuum reaction chamber 210.
Similar or identical to the first embodiment, as shown in fig. 5 and 6, in this embodiment, the temperature measuring assembly 240 includes a temperature sensor 244 and an adjustable bracket, where the adjustable bracket includes a circumferential adjusting member 241, a pair of fixed brackets 242 and a tilt angle adjusting bracket 243, and the circumferential adjusting member 241 is disposed on top of the outer cavity 250. Further, the adjustable support of the temperature measurement assembly 240 further comprises a connector 246, a telescopic device 247, and a viewing window structure 248. The link 246 is connected to the outer chamber 250 of the film handling device and the bottom of the telescopic device 247 is connected to the top of the link 246. One end of the observation window structure 248 is connected with the telescopic device 247, the other end of the observation window structure is connected with the temperature sensor 244, the temperature sensor 244 can rotate relative to the observation window structure 248, the observation window structure 248 comprises a transparent structure, and the transparent structure is always perpendicular to the advancing direction of the detection medium sent by the temperature sensor 244, so as to reduce interference factors of the detection medium on the detection path 245.
In this embodiment, the top wall of the outer cavity 250 is provided with a detection hole, the connecting piece 246 is connected to the detection hole, and the bottom of the connecting piece 246 passes through the detection hole and enters into the space between the vacuum reaction cavity 210 and the outer cavity 250, so as to avoid the influence of the outer cavity 250 on the transmission of the detection medium of the temperature sensor 244. Further, in the process, a vacuum environment is provided between the outer cavity 250 and the vacuum reaction chamber 210, and the bottom of the connecting piece 246 passes through the detection hole on the top wall of the outer cavity 250, so that the vacuum environment is also provided in the surrounding range of the connecting piece 246, the telescopic device 247 and the observation window structure 248, so as to further ensure the vacuum degree between the outer cavity 250 and the vacuum reaction chamber 210 and relieve the bearing pressure of the vacuum reaction chamber 210. It will be appreciated that in other embodiments, an atmospheric pressure environment may be provided between the outer chamber 250 and the vacuum reaction chamber 210.
Optionally, the connecting member 246 has a flange structure; the telescopic device 247 is of a bellows structure. When a vacuum environment is provided between the outer chamber 250 and the vacuum reaction chamber 210, the connecting piece 246 is a CF/KF flange, which is made of metal material, one end of the CF/KF flange without a connecting flange is welded on the detecting hole on the top wall of the outer chamber 250, and one end with a connecting flange is connected with the bellows structure. The bellows structure is made of a metal material, one end of the bellows structure comprises a connecting flange matched with the observation window structure 248 and is further connected with the observation window structure 248, and the other end of the bellows structure is connected with the CF/KF flange. The bellows structure can further ensure good tightness between the outer cavity 250 and the vacuum reaction chamber 210, and meanwhile, when the temperature sensor 244 changes in the azimuth angle and the vertical inclination angle of the plane circumference in any direction through the adjustable bracket, the bellows structure is deformed and adjusted accordingly, and the vacuum degree between the outer cavity 250 and the vacuum reaction chamber 210 is not affected. It will be appreciated that the structure of the connecting member 246 and the telescopic device 247 is not limited to the above, but may be other structures that can achieve the same function, and the present invention is not limited thereto.
In this embodiment, the observation window structure 248 is an infrared window, which includes glass that is only transparent to the detection medium of a specific wavelength of the temperature sensor 244, and is perpendicular to the advancing direction of the detection medium of the temperature sensor 244 to avoid loss of the detection medium, and on the other hand, the glass further ensures tightness of a space surrounded by the observation window structure 248, the telescopic device 247, the connecting piece 246, the outer cavity 250 and the top wall of the vacuum reaction chamber 210, so as to help maintain the vacuum degree of the space. Alternatively, the glass may be CaF 2 Or MgF 2 Or BaF 2 In this embodiment, the glass is made of CaF 2 And (3) preparation. Further, the temperature sensor 244 is connected with the observation window structure 248 through a mechanical fastening device, in this embodiment, the temperature sensor 244 is connected with the observation window structure 248 through a bearing assembly, so that not only can the connection stability of the temperature sensor 244 be ensured, but also the observation window structure 248 can rotate relative to the temperature sensor 244, so that the temperature sensor 244 can also rotate along with the rotation of the fixing support 242 along the circumferential adjusting member 241, and further the change of the azimuth angle of the plane circumference of the fixing support 242 is realized. Of course, the connection mode of the temperature sensor 244 and the observation window structure 248 is not limited to the above, but may be other connection modes, which is not limited by the present invention.
Further, in the present embodiment, the connecting member 246 is connected to the telescopic device 247 by a mechanical fastening device, and the telescopic device 247 is connected to the observation window structure 248 by a mechanical fastening device. Of course, the connection modes of the connecting piece 246, the telescopic device 247, the observation window structure 248 and the like are not limited to the above, and may be other connection modes, which is not limited by the present invention.
Fig. 7 and 8 are schematic diagrams illustrating an example of temperature measurement adjustment of the top wall of the vacuum reaction chamber 210 by the temperature measurement component 240 according to the present embodiment. The inclination angle in the vertical direction thereof can be adjusted by adjusting the position of the temperature sensor 244 on the inclination angle adjusting bracket 243, and as shown in fig. 7, the temperature sensor 244 can be adjusted to move on the inclination angle adjusting bracket 243 in the direction of arrow 260. Further, the fixing support 242 is adjusted to rotate along the circumferential chute of the circumferential adjusting member 241, so that the change of the azimuth angle of the temperature sensor 244 carried by the fixing support 242 on the plane can be further adjusted, as shown in fig. 8, the fixing support 242 can be adjusted according to the direction of arrow 270, and the measuring angle of the temperature sensor 244 can be further changed, so that the omnibearing angle measurement of the vacuum reaction chamber 210 and the internal components thereof can be realized. As shown in fig. 9, in another embodiment, a set of temperature measuring components 240 is additionally disposed above the outer chamber 250 to measure the temperature state of the wafer W in the vacuum reaction chamber 210, and in this embodiment, the advancing direction of the detecting medium of the temperature sensor 244 is perpendicular to the top wall surface of the vacuum reaction chamber 210, so as to reduce the loss of the detecting medium and improve the accuracy of the temperature measurement. In actual measurement, the fixing support 242 can be adjusted according to the direction of arrow 280, so that the measurement angle of the temperature sensor 244 carried by the fixing support in the plane circumferential direction can be changed. Of course, the moving direction of the temperature sensor 244 on the inclination angle adjusting frame 243 and the rotating direction of the fixing support 242 along the circumferential chute are not limited to the above, but may be other directions, and may be adjusted according to the actual process requirements, for example, in a certain embodiment, the rotating direction of the fixing support 242 along the circumferential chute is adjusted to be clockwise.
In addition, other structures and functions of each component of the present embodiment, such as the circumferential adjustment member 241, the fixing bracket 242, and the inclination adjustment bracket 243, are the same as those of the first embodiment, and will not be described herein.
In summary, in the angle adjusting method, the adjustable bracket and the thin film processing device thereof according to the present invention, the adjustable bracket combines the circumferential adjusting member 141, the fixed bracket 142 and the inclination adjusting bracket 143, so that the vertical inclination and the planar circumferential angle of the temperature sensor 144 during measurement can be adjusted, the temperature measuring area range of the temperature sensor 144 is enlarged, one temperature sensor 144 can measure hundreds or even thousands of position points, and the flexibility of setting and measuring the temperature of the temperature sensor 144 is improved; meanwhile, the adjustable temperature sensor 144 of the adjustable bracket can measure the temperature for a plurality of times at the same position, so that the repeatability of temperature measurement at the temperature measuring position is ensured.
Further, the adjustable bracket can make the detection medium of the temperature sensor 144 perpendicular to the transparent (permeable detection medium) object on the detection path 145, so that the influence of other components on the detection effect of the detection medium is reduced, and the temperature measurement accuracy of the temperature sensor is improved.
Further, the adjustable bracket realizes the adjustment of the temperature measuring angle of the temperature sensor 144 to the vacuum reaction chamber 110 and the internal components thereof in the vacuum state, and has simple structure, convenient operation and high repeatability.
While the present invention has been described in detail through the foregoing description of the preferred embodiment, it should be understood that the foregoing description is not to be considered as limiting the invention. Many modifications and substitutions of the present invention will become apparent to those of ordinary skill in the art upon reading the foregoing. Accordingly, the scope of the invention should be limited only by the attached claims.
Claims (21)
1. An adjustable bracket for a temperature sensing assembly of a thin film processing apparatus, comprising:
the circumferential adjusting piece is arranged at the outer side of the vacuum reaction cavity of the film processing device and comprises a circumferential sliding groove;
the bottom of the fixed bracket is in sliding connection with the circumferential sliding groove, and the fixed bracket can rotate along the circumferential sliding groove in the circumferential direction;
the inclination angle adjusting frame is connected with the fixed support at two ends, the inclination angle adjusting frame comprises a first position and a second position, the fixed support comprises a third position, the distance between the first position and the third position is larger than the distance between the second position and the third position, and the inclination angle adjusting frame is provided with a temperature sensor and can move along the inclination angle adjusting frame.
2. The adjustable support of claim 1, wherein the support comprises a plurality of support members,
the thin film processing device comprises a part transparent to the detection medium of the temperature sensor, and the detection direction of the detection medium of the temperature sensor is perpendicular to the surface of the part transparent to the detection medium on the detection path of the temperature sensor.
3. The adjustable support of claim 1, wherein the support comprises a plurality of support members,
the inclination angle adjusting frame is an arc-shaped structure bracket.
4. The adjustable support of claim 3, wherein the support comprises a plurality of support members,
the arc-shaped structure support is of a concave structure or a convex structure.
5. The adjustable support of claim 3, wherein the support comprises a plurality of support members,
the central angle range corresponding to the inclination angle adjusting frame is 60-100 degrees.
6. The adjustable support of claim 3, wherein the support comprises a plurality of support members,
an arc-shaped guide piece is arranged between the temperature sensor and the inclination angle adjusting frame so as to guide the temperature sensor to move on the inclination angle adjusting frame.
7. The adjustable support of claim 6, wherein the support comprises a plurality of support members,
the arc-shaped guide piece comprises T-shaped bosses distributed in an arc shape and T-shaped grooves matched with the T-shaped bosses, and the T-shaped grooves are used for guiding the T-shaped bosses to move in the T-shaped bosses;
the T-shaped boss is arranged on the temperature sensor, the T-shaped groove is arranged on the inclination angle adjusting frame, or the T-shaped boss is arranged on the inclination angle adjusting frame, and the T-shaped groove is arranged on the temperature sensor.
8. The adjustable support of claim 1, wherein the support comprises a plurality of support members,
the temperature sensor is connected with the inclination adjusting frame through a connecting shaft, and the connecting shaft is used for fastening and positioning the temperature sensor on the inclination adjusting frame through a mechanical fastening device.
9. The adjustable support of claim 1, wherein the support comprises a plurality of support members,
the temperature sensor is arranged on the inclination angle adjusting frame through a connecting shaft, and the contact area of the connecting shaft and the inclination angle adjusting frame comprises edges.
10. The adjustable bracket of claim 1, further comprising:
a connecting member connected to the chamber of the thin film processing apparatus;
the bottom of the telescopic device is connected with the top of the connecting piece;
the observation window structure, its one end with but telescoping device is connected, and its other end is connected with temperature sensor, temperature sensor can be relative observation window structure takes place to rotate, the observation window structure contains transparent structure, transparent structure is perpendicular all the time with the direction of advance of the detection medium that temperature sensor sent.
11. The adjustable support of claim 10, wherein the support comprises a plurality of support members,
the telescopic device is of a corrugated pipe structure.
12. The adjustable support of claim 10, wherein the support comprises a plurality of support members,
the connecting piece is of a flange structure.
13. The adjustable support of claim 10, wherein the support comprises a plurality of support members,
the connecting piece is connected with the telescopic device through a mechanical fastening device;
the telescopic device is connected with the observation window structure through a mechanical fastening device;
the temperature sensor is connected with the observation window structure through a mechanical fastening device.
14. A film processing apparatus, comprising,
a vacuum reaction chamber;
the heating devices are arranged outside the vacuum reaction cavity so as to provide heat energy for the vacuum reaction cavity;
a temperature sensing assembly comprising a temperature sensor and an adjustable support according to any one of claims 1 to 13.
15. The thin film processing apparatus according to claim 14, wherein,
at least a partial area of the vacuum reaction chamber is made of a material permeable to a temperature sensor detection medium.
16. The thin film processing apparatus of claim 14, further comprising:
and the outer cavity is arranged at the outer side of the vacuum reaction cavity.
17. The thin film processing apparatus according to claim 16, wherein,
the circumferential adjusting piece is arranged at the top of the outer cavity;
the top wall of the outer cavity is provided with a detection hole, and the connecting piece is connected with the detection hole.
18. The thin film processing apparatus according to claim 16, wherein,
a vacuum environment is arranged between the outer cavity and the vacuum reaction cavity;
the surrounding range of the connecting piece, the telescopic device and the observation window structure is a vacuum environment.
19. The thin film processing apparatus according to claim 14, wherein,
the temperature sensor is an infrared pyrometer.
20. A method for adjusting a measurement angle of a temperature measuring assembly of a thin film processing apparatus according to any one of claims 14 to 19, comprising:
the adjusting and fixing bracket rotates along a circumferential chute of the circumferential adjusting piece;
and adjusting the position of the temperature sensor on the inclination angle adjusting frame to adjust the measuring angle of the temperature sensor.
21. The method for adjusting a measurement angle of a temperature measuring assembly according to claim 20,
the detection direction of the detection medium of the temperature sensor is perpendicular to the top wall of the vacuum reaction cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211165263.9A CN117758237A (en) | 2022-09-23 | 2022-09-23 | Angle adjusting method, adjustable bracket and film processing device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211165263.9A CN117758237A (en) | 2022-09-23 | 2022-09-23 | Angle adjusting method, adjustable bracket and film processing device thereof |
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| Publication Number | Publication Date |
|---|---|
| CN117758237A true CN117758237A (en) | 2024-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211165263.9A Pending CN117758237A (en) | 2022-09-23 | 2022-09-23 | Angle adjusting method, adjustable bracket and film processing device thereof |
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| Country | Link |
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| CN (1) | CN117758237A (en) |
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2022
- 2022-09-23 CN CN202211165263.9A patent/CN117758237A/en active Pending
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