CN117753819A - Automobile hardware stamping die nitrogen spring air pressure monitoring system - Google Patents
Automobile hardware stamping die nitrogen spring air pressure monitoring system Download PDFInfo
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 title claims abstract description 74
- 238000012544 monitoring process Methods 0.000 title claims abstract description 38
- 229910052757 nitrogen Inorganic materials 0.000 title claims abstract description 37
- 238000004080 punching Methods 0.000 claims abstract description 9
- 238000006243 chemical reaction Methods 0.000 claims description 25
- QVFWZNCVPCJQOP-UHFFFAOYSA-N chloralodol Chemical compound CC(O)(C)CC(C)OC(O)C(Cl)(Cl)Cl QVFWZNCVPCJQOP-UHFFFAOYSA-N 0.000 claims description 24
- 230000006870 function Effects 0.000 claims description 6
- 238000007405 data analysis Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 3
- 230000002159 abnormal effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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Abstract
The embodiment of the invention discloses a nitrogen spring air pressure monitoring system of an automobile hardware stamping die, which comprises an air pressure acquisition gateway and at least one set of air pressure acquisition device, wherein the air pressure acquisition device comprises an upper die air pressure acquisition device and a lower die air pressure acquisition device; wherein: the upper die air pressure acquisition device is used for acquiring upper die air pressure data, die stamping frequency data and battery electric quantity data and transmitting the data to the lower die air pressure acquisition device; the lower die air pressure acquisition device is used for acquiring acquisition device data and transmitting the acquisition device data to the air pressure acquisition gateway, wherein the acquisition device data comprises pressure data, punching times data and battery power data acquired by the whole die; the air pressure acquisition gateway is used for transmitting data of the acquisition device to the background server, and the system can monitor the air pressure condition of the stamping die at any time and any place, reduce product defect loss caused by abnormal air pressure and reduce inspection labor cost.
Description
Technical Field
The invention relates to the technical field of air pressure monitoring, in particular to a nitrogen spring air pressure monitoring system of an automobile hardware stamping die.
Background
Many positions on the stamping die of the automobile hardware shell are provided with pressing force by a nitrogen spring. When the nitrogen spring has nitrogen leakage and insufficient pressure, the forming quality of the part is caused to be problematic, and the loss is significant.
At present, a mechanical barometer is adopted for monitoring the air pressure of the nitrogen spring, and whether the air pressure is normal is detected in a manual inspection mode. The mode needs manual work to carry out inspection and monitoring frequently to the upper die and the lower die of the die, and the inspection is not timely enough, so that the labor cost and the maintenance cost are high.
Disclosure of Invention
The invention mainly aims to provide a nitrogen spring air pressure monitoring system for an automobile hardware stamping die, which can monitor the air pressure of an upper die and a lower die of the automobile hardware stamping die in real time.
In order to achieve the above purpose, a first aspect of the present application provides a nitrogen spring air pressure monitoring system for an automotive hardware stamping die, the system comprises an air pressure collecting gateway and at least one set of air pressure collecting device, and the air pressure collecting device comprises an upper die air pressure collecting device and a lower die air pressure collecting device; wherein:
the upper die air pressure acquisition device is used for acquiring upper die air pressure data, die stamping frequency data and battery electric quantity data and transmitting the data to the lower die air pressure acquisition device;
the lower die air pressure acquisition device is used for acquiring acquisition device data and transmitting the acquisition device data to the air pressure acquisition gateway, wherein the acquisition device data comprises pressure data, punching times data and battery power data acquired by the whole die;
and the air pressure acquisition gateway is used for transmitting the data of the acquisition device to a background server.
In an optional embodiment, the upper die pressure collecting device includes a first single chip microcomputer, a first pressure conversion ADC chip, a gyroscope, a first bluetooth module, and a first charge management chip, where:
the first pressure conversion ADC chip is used for amplifying and AD converting a voltage signal generated by the upper die air pressure sensor and transmitting the converted pressure data to the first singlechip;
the first singlechip is used for transmitting the converted pressure data to the lower die air pressure acquisition device through the first Bluetooth module;
and the gyroscope is used for collecting the stamping frequency data of the die, communicating with the first singlechip and finally transmitting the data to the lower die air pressure collecting device through the first Bluetooth module.
In an alternative implementation mode, the first singlechip is an STM32G070RBT6 singlechip;
the first pressure conversion ADC chip adopts a single-channel 24-bit pressure conversion ADC TM7711;
the gyroscope adopts ADXL37;
the first bluetooth module adopts SKB376;
the first charge management chip employs SGM41513.
In an optional embodiment, the lower die air pressure acquisition device includes a second single chip microcomputer, a second pressure conversion ADC chip, a second bluetooth module, a first Lora module, and a second charging management chip, wherein:
the second pressure conversion ADC chip is used for the first pressure conversion ADC chip, amplifying and AD converting a voltage signal generated by the lower die air pressure sensor, and transmitting the converted pressure data to the second singlechip;
the second singlechip is used for receiving pressure data and die stamping frequency data from the upper die pressure acquisition device through the second Bluetooth module;
the second singlechip is also used for transmitting the data of the acquisition device to the air pressure acquisition gateway through the first Lora module.
In an alternative embodiment, the lower die air pressure acquisition device adopts two power supply modes of a built-in battery and 24V;
when the lower die air pressure acquisition device works, the 24V direct power supply is adopted;
and when the whole die does not work, the built-in battery is used for supplying power to monitor the nitrogen pressure.
In an alternative embodiment, the air pressure acquisition gateway is further configured to transmit the acquisition device data to a site control system via an ethernet protocol; the field control system is used for realizing pressure real-time alarm.
In an alternative embodiment, the air pressure acquisition gateway comprises a power management unit, a field industrial Profinet protocol single chip, a second Lora module, and an ethernet transceiver;
the power management unit, the second Lora module and the Ethernet transceiver are respectively connected with the field industrial Profinet protocol single chip; wherein:
the second Lora module is used for receiving the acquisition device data from the lower die air pressure acquisition device;
the field industrial Profinet protocol single chip is used for supporting the air pressure acquisition gateway to communicate with the field control system through the Profinet protocol;
the Ethernet transceiver is used for supporting the air pressure acquisition gateway to communicate with the background server.
In an alternative embodiment, the field industrial Profinet protocol single chip employs NetX90;
the second Lora module adopts L-LRNDM34-77TN4;
the ethernet transceiver employs W5500.
In an alternative embodiment the system further comprises a client;
the client is used for monitoring the acquisition device data provided by the background server in real time.
Optionally, the client is further configured to monitor, on a background, the platform, display a real-time trend based on the data of the acquisition device, and perform functions of data comparison, data analysis, and statistics report.
The application provides a nitrogen spring air pressure monitoring system of an automobile hardware stamping die, wherein the system comprises an air pressure acquisition gateway and at least one set of air pressure acquisition device, and the air pressure acquisition device comprises an upper die air pressure acquisition device and a lower die air pressure acquisition device; wherein: the upper die air pressure acquisition device is used for acquiring upper die air pressure data, die stamping frequency data and battery electric quantity data and transmitting the data to the lower die air pressure acquisition device; the lower die air pressure acquisition device is used for acquiring acquisition device data and transmitting the acquisition device data to the air pressure acquisition gateway, wherein the acquisition device data comprises pressure data, punching times data and battery power data acquired by the whole die; the air pressure acquisition gateway is used for transmitting the data of the acquisition device to a background server; the service life of the die can be counted through the stamping times of the stamping die, and the service life condition of the die can be fed back in time; through the data that the backstage server provided, the user can be convenient at any time and any place monitor nitrogen spring atmospheric pressure condition at the customer end platform, reduces the product defect loss that appears because atmospheric pressure is unusual, reduces the human cost of patrolling and examining.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Wherein:
fig. 1 is a schematic structural diagram of a nitrogen spring air pressure monitoring system of an automotive hardware stamping die according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of an upper die air pressure acquisition device according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a lower die air pressure acquisition device according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of an air pressure acquisition gateway according to an embodiment of the present application.
Detailed Description
In order to make the present application solution better understood by those skilled in the art, the following description will clearly and completely describe the technical solution in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The terms first, second and the like in the description and in the claims of the present application and in the above-described figures, are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
The Bluetooth (BT) technology referred to in the embodiments of the present application is a global standard for wireless data and voice communication, which is a special short-range wireless technology connection for establishing a communication environment for fixed and mobile devices based on a low-cost short-range wireless connection.
The embodiment of the application relates to a programmable logic controller (Programmable Logic Controller, PLC), which is a digital operation controller with a microprocessor and used for automatic control, and can load control instructions into a memory at any time for storage and execution.
The Profinet referred to in the embodiments of the present application is a real-time ethernet protocol developed by the international automation association (IA) with the aim of providing high performance, real-time and reliability to meet the requirements of industrial automation applications.
The Universal Asynchronous Receiver Transmitter (UART) referred to in the embodiments of the present application is a universal serial data bus for asynchronous communications. The bus communicates bi-directionally, enabling full duplex transmission and reception. In embedded designs, UARTs are used to communicate with PCs, including with monitor debuggers and other devices such as EEPROMs.
Embodiments of the present application are described below with reference to the accompanying drawings in the embodiments of the present application.
The nitrogen spring air pressure monitoring system of the automobile hardware stamping die mainly comprises an air pressure acquisition gateway and at least one set of air pressure acquisition device, wherein the air pressure acquisition device comprises an upper die air pressure acquisition device and a lower die air pressure acquisition device; wherein:
the upper die air pressure acquisition device is used for acquiring upper die air pressure data, die stamping frequency data and battery electric quantity data and transmitting the data to the lower die air pressure acquisition device;
the lower die air pressure acquisition device is used for acquiring acquisition device data and transmitting the acquisition device data to the air pressure acquisition gateway, wherein the acquisition device data comprises pressure data, punching times data and battery power data acquired by the whole die;
the air pressure acquisition gateway is used for transmitting the data of the acquisition device to a background server.
In an alternative embodiment, the system further comprises a client;
the client is used for monitoring the acquisition device data provided by the background server in real time.
The client can inquire and browse the data of the acquisition device through the background monitoring platform, the background monitoring platform displays the real-time trend of the data, and the functions of data comparison, data analysis, statistical report and the like are performed, and the embodiment of the application is not limited.
Referring to fig. 1, a schematic structural diagram of a nitrogen spring air pressure monitoring system of an automotive hardware stamping die provided in an embodiment of the present application is shown in fig. 1, where the nitrogen spring air pressure monitoring system of the automotive hardware stamping die includes an air pressure collecting gateway, and N sets of air pressure collecting devices (only 3 sets of air pressure collecting devices are shown in fig. 1, namely, numbers 001, 002 and 00N), each set of air pressure collecting device includes an upper die air pressure collecting device and a lower die air pressure collecting device, and bluetooth communication is allowed between the upper die air pressure collecting device and the lower die air pressure collecting device; the lower die air pressure acquisition device and the air pressure acquisition gateway can communicate through Lora.
The nitrogen spring air pressure monitoring system of the automobile hardware stamping die can communicate with a field PLC control system through a switch, so that a real-time alarm function is realized; and the cloud server (background server) is communicated, and data can be monitored in real time through the client.
Specifically, the upper die air pressure acquisition device transmits upper die air pressure data, die stamping frequency data and battery power data to the lower die air pressure acquisition device through Bluetooth;
the lower die air pressure acquisition device can transmit acquisition device data to the air pressure acquisition gateway through the Lora; namely, the lower die air pressure acquisition device acquires lower die air pressure data and battery electric quantity data, and pressure data (comprising upper die air pressure data and lower die air pressure data), punching frequency data (upper die punching frequency data and lower die punching frequency data) and battery electric quantity data (upper die battery electric quantity data and lower die battery electric quantity data) of the whole set of die are transmitted to the air pressure acquisition gateway.
The air pressure acquisition gateway can transmit the data of the acquisition device to a background server through an MQTT Ethernet protocol, and the client can monitor the data such as air pressure and the like in real time through a PC or mobile phone applet; meanwhile, the air pressure acquisition gateway can also transmit the data of the acquisition device to the field PLC control system through an industrial Profinet Ethernet protocol, and trigger the field alarm system to realize the real-time alarm of the pressure threshold.
Alternatively, the whole air pressure acquisition gateway can be connected with a plurality of sets (such as 2000 sets) of air pressure acquisition devices according to the requirement.
The upper die air pressure acquisition device in the application is described in detail first.
In an optional embodiment, the upper die pressure collecting device includes a first single chip microcomputer, a first pressure conversion ADC chip, a gyroscope, a first bluetooth module, and a first charging management chip, where:
the first pressure conversion ADC chip is used for amplifying and AD converting a voltage signal generated by the upper die air pressure sensor and transmitting the converted pressure data to the first singlechip;
the first singlechip is used for transmitting the converted pressure data to the lower die air pressure acquisition device through the first Bluetooth module;
and the gyroscope is used for collecting the stamping frequency data of the die, communicating with the first singlechip and finally transmitting the data to the lower die air pressure collecting device through the first Bluetooth module.
In an alternative implementation manner, the first singlechip is an STM32G070RBT6 singlechip;
the first pressure conversion ADC chip adopts a single-channel 24-bit pressure conversion ADC TM7711;
the gyroscope adopts ADXL37;
the first bluetooth module adopts SKB376;
the first charge management chip uses SGM41513.
For example, fig. 2 is a schematic structural diagram of an upper die air pressure collecting device according to an embodiment of the present application. As shown in FIG. 2, the upper die air pressure acquisition device mainly comprises an STM32G070RBT6 single-chip microcomputer, a 3-piece single-channel 24-bit pressure conversion ADC TM7711, a gyroscope ADXL37, a Bluetooth module SKB376 and a charging management chip SGM41513.
Specifically, the weak voltage signal generated by the pressure sensor is amplified by a TM7711 internal 128 multiplication beneficial amplifier, AD conversion is performed, original data are transmitted to the singlechip through the two-line serial port, and the singlechip transmits the converted pressure data to the lower die air pressure acquisition device through Bluetooth.
The gyroscope is responsible for collecting stamping times of the dies (upper die and lower die), is communicated with the singlechip through the I2C, and finally transmits data to the lower die air pressure collecting device through Bluetooth.
In practical application, because the upper die air pressure acquisition device is very difficult to adopt wired power supply, the whole upper die acquisition device can adopt 30000mAh lithium battery power supply, can continuously work for 3 months, and a 24V interface is a charging and power supply interface.
The lower die air pressure acquisition device in the application is described in detail below.
In an optional embodiment, the lower die air pressure collecting device includes a second single chip microcomputer, a second pressure conversion ADC chip, a second bluetooth module, a first Lora module, and a second charging management chip, where:
the second pressure conversion ADC chip is used for the first pressure conversion ADC chip, amplifying and AD converting a voltage signal generated by the lower die air pressure sensor, and transmitting the converted pressure data to the second singlechip;
the second singlechip is used for receiving pressure data and die stamping frequency data from the upper die pressure acquisition device through the second Bluetooth module;
the second singlechip is also used for transmitting the data of the acquisition device to the air pressure acquisition gateway through the first Lora module.
In an alternative embodiment, the lower die air pressure acquisition device adopts two power supply modes of a built-in battery and 24V;
when the lower die air pressure acquisition device works, the 24V direct power supply is adopted;
when the whole die is not in operation, the built-in battery is used for supplying power to monitor the nitrogen pressure.
For example, please refer to fig. 3, which is a schematic structural diagram of a lower die air pressure collecting device according to an embodiment of the present application. As shown in FIG. 3, the lower die pressure acquisition device consists of an STM32G070RBT6 single-chip microcomputer, 3 single-channel 24-bit pressure conversion ADC (analog to digital converter) TM7711, a Bluetooth module SKB369, a Lora module L-LRNWB25-75TN4 and a charging management chip SGM41513.
Specifically, weak voltage signals generated by the pressure sensor are amplified by a TM7711 internal 128 multiplication beneficial amplifier, AD conversion is carried out, and then original data are transmitted to the singlechip through a two-wire serial port; meanwhile, the upper die air pressure data and the punching times data are also transmitted to the lower die singlechip through Bluetooth, and the data (acquisition device data) acquired by the whole set of air pressure acquisition device can be transmitted to the air pressure acquisition gateway through lora.
The lower die pressure acquisition device can adopt two power supply modes of a built-in lithium battery and 24V. When the lower die pressure acquisition device works, 24V is adopted for direct power supply, and when the whole die does not work, the nitrogen pressure also needs to be monitored, and a built-in battery is adopted for power supply. The online and offline simultaneous monitoring of the nitrogen pressure of the die is realized.
The air pressure acquisition gateway is specifically described below.
In an alternative embodiment, the air pressure acquisition gateway is further configured to transmit the data of the acquisition device to a site control system through an ethernet protocol; the on-site control system is used for realizing pressure real-time alarm.
Further optionally, the air pressure acquisition gateway comprises a power management unit, a field industrial Profinet protocol single chip, a second Lora module and an ethernet transceiver;
the power management unit, the second Lora module and the Ethernet transceiver are respectively connected with the field industrial Profinet protocol single chip; wherein:
the second Lora module is used for receiving the acquisition device data from the lower die air pressure acquisition device;
the field industrial Profinet protocol single chip is used for supporting the air pressure acquisition gateway to communicate with the field control system through the Profinet protocol;
the Ethernet transceiver is used for supporting the air pressure acquisition gateway to communicate with the background server.
In an alternative embodiment, the field industrial Profinet protocol single chip described above employs NetX90;
the second Lora module adopts L-LRNDM34-77TN4;
the ethernet transceiver described above employs W5500.
For example, fig. 4 is a schematic structural diagram of an air pressure acquisition gateway according to an embodiment of the present application. As shown in fig. 4, the air pressure acquisition gateway mainly comprises a power management PMU, a field industrial Profinet protocol single chip NetX90, a lida Lora module L-LRNDM34-77TN4, and an ethernet transceiver W5500. In fig. 4, a surge protection circuit is also connected before the PMU.
Wherein NetX90 is composed of-M4, 100MHz and xPIC,100MHz two cores. />The M4 kernel is responsible for user related application processing and the xPIC kernel is responsible for Profinet related protocol processing. In order to be capable of communicating with a field PLC control system (Profinet protocol) and connecting with a cloud platform server (MQTT protocol), a W5500 Ethernet transceiver is independently hung.
Pressure data, die stamping times data and battery power data acquired by the upper die and the lower die are transmitted to the air pressure acquisition gateway through the Lora. The air pressure acquisition gateway can communicate with the on-site PLC control system through a Profinet protocol and transmit pressure data so as to realize pressure real-time alarm; the air pressure acquisition gateway can also communicate with the cloud server through an MQTT protocol and transmit data such as pressure, die stamping times and battery electric quantity, so that the data can be monitored in real time through a background monitoring platform at a client side, and a user can select each function to realize data display, statistics, analysis and the like.
According to the nitrogen spring air pressure monitoring system for the automobile hardware stamping die, the air pressure condition of the stamping die can be monitored anytime and anywhere, product defect loss caused by abnormal air pressure is reduced, and a user can monitor through a client. The system is provided with a cloud back-end monitoring system, and through the monitoring system, the nitrogen pressure value and alarm data of each stamping die can be displayed in real time, so that the monitoring and management of the nitrogen pressure of the whole automobile stamping die workshop are facilitated; the system has the functions of stamping times and service life statistics of the stamping die, and can timely feed back the service life condition of the die.
The system can be in butt joint with a field control PLC system, the field PLC control system can read the air pressure data of the nitrogen device in real time, and an original alarm system is used for alarming, so that personnel inspection is reduced.
The system also realizes on-line and off-line simultaneous monitoring of the nitrogen pressure of the die.
Those skilled in the art will appreciate that implementing all or part of the above-described embodiments of the system may be accomplished by computer programs stored on a non-volatile computer readable storage medium, which when executed, may include data acquisition and processing procedures as described in the above-described embodiments. Any reference to memory, storage, database, or other medium used in the various embodiments provided herein may include non-volatile and/or volatile memory. The nonvolatile memory can include Read Only Memory (ROM), programmable ROM (PROM), electrically Programmable ROM (EPROM), electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double Data Rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous Link DRAM (SLDRAM), memory bus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), among others.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the present application. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.
Claims (10)
1. The nitrogen spring air pressure monitoring system of the automobile hardware stamping die is characterized by comprising an air pressure acquisition gateway and at least one set of air pressure acquisition device, wherein the air pressure acquisition device comprises an upper die air pressure acquisition device and a lower die air pressure acquisition device; wherein:
the upper die air pressure acquisition device is used for acquiring upper die air pressure data, die stamping frequency data and battery electric quantity data and transmitting the data to the lower die air pressure acquisition device;
the lower die air pressure acquisition device is used for acquiring acquisition device data and transmitting the acquisition device data to the air pressure acquisition gateway, wherein the acquisition device data comprises pressure data, punching times data and battery power data acquired by the whole die;
and the air pressure acquisition gateway is used for transmitting the data of the acquisition device to a background server.
2. The automotive hardware stamping die nitrogen spring air pressure monitoring system of claim 1, wherein the upper die pressure acquisition device comprises a first single chip microcomputer, a first pressure conversion ADC chip, a gyroscope, a first bluetooth module, and a first charge management chip, wherein:
the first pressure conversion ADC chip is used for amplifying and AD converting a voltage signal generated by the upper die air pressure sensor and transmitting the converted pressure data to the first singlechip;
the first singlechip is used for transmitting the converted pressure data to the lower die air pressure acquisition device through the first Bluetooth module;
and the gyroscope is used for collecting the stamping frequency data of the die, communicating with the first singlechip and finally transmitting the data to the lower die air pressure collecting device through the first Bluetooth module.
3. The nitrogen spring air pressure monitoring system of the automobile hardware stamping die of claim 2, wherein the first singlechip is an STM32G070RBT6 singlechip;
the first pressure conversion ADC chip adopts a single-channel 24-bit pressure conversion ADC TM7711;
the gyroscope adopts ADXL37;
the first bluetooth module adopts SKB376;
the first charge management chip employs SGM41513.
4. The automotive hardware stamping die nitrogen spring air pressure monitoring system of claim 1, wherein the lower die air pressure acquisition device comprises a second single chip microcomputer, a second pressure conversion ADC chip, a second bluetooth module, a first Lora module and a second charge management chip, wherein:
the second pressure conversion ADC chip is used for the first pressure conversion ADC chip, amplifying and AD converting a voltage signal generated by the lower die air pressure sensor, and transmitting the converted pressure data to the second singlechip;
the second singlechip is used for receiving pressure data and die stamping frequency data from the upper die pressure acquisition device through the second Bluetooth module;
the second singlechip is also used for transmitting the data of the acquisition device to the air pressure acquisition gateway through the first Lora module.
5. The nitrogen spring air pressure monitoring system of the automobile hardware stamping die of claim 4, wherein the lower die air pressure acquisition device adopts two power supply modes of a built-in battery and 24V;
when the lower die air pressure acquisition device works, the 24V direct power supply is adopted;
and when the whole die does not work, the built-in battery is used for supplying power to monitor the nitrogen pressure.
6. The nitrogen spring air pressure monitoring system of the automobile hardware stamping die of claim 1, wherein the air pressure acquisition gateway is further used for transmitting the acquisition device data to a field control system through an ethernet protocol; the field control system is used for realizing pressure real-time alarm.
7. The automotive hardware stamping die nitrogen spring air pressure monitoring system of claim 6, wherein the air pressure acquisition gateway comprises a power management unit, a field industrial Profinet protocol single chip, a second Lora module, and an ethernet transceiver;
the power management unit, the second Lora module and the Ethernet transceiver are respectively connected with the field industrial Profinet protocol single chip; wherein:
the second Lora module is used for receiving the acquisition device data from the lower die air pressure acquisition device;
the field industrial Profinet protocol single chip is used for supporting the air pressure acquisition gateway to communicate with the field control system through the Profinet protocol;
the Ethernet transceiver is used for supporting the air pressure acquisition gateway to communicate with the background server.
8. The nitrogen spring air pressure monitoring system of the automobile hardware stamping die of claim 7, wherein the field industrial Profinet protocol single chip adopts NetX90;
the second Lora module adopts L-LRNDM34-77TN4;
the ethernet transceiver employs W5500.
9. The automotive hardware stamping die nitrogen spring air pressure monitoring system of claim 1, further comprising a client;
the client is used for monitoring the acquisition device data provided by the background server in real time.
10. The nitrogen spring air pressure monitoring system of the automobile hardware stamping die of claim 8, wherein the client is further used for displaying real-time trends based on the data of the acquisition device and performing data comparison, data analysis and statistics report functions on a background monitoring platform.
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| US20180015681A1 (en) * | 2016-07-12 | 2018-01-18 | Toyota Motor Engineering & Manufacturing North America, Inc. | Voltage signal adaptor for machine press communication |
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| CN116929629A (en) * | 2023-05-15 | 2023-10-24 | 凯同精密工业(昆山)有限公司 | Distributed nitrogen spring wireless pressure monitoring system |
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| CN111229907A (en) * | 2020-02-20 | 2020-06-05 | 上汽大众汽车有限公司 | Intelligent detection system for performance of press machine |
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| CN115958115A (en) * | 2022-11-21 | 2023-04-14 | 苏州福丰联合电子有限公司 | Punch forming die and forming process |
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| CN117753819B (en) | 2024-06-21 |
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