CN117744216A - Three-dimensional cell board model assembly method and system - Google Patents
Three-dimensional cell board model assembly method and system Download PDFInfo
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Abstract
The invention discloses a three-dimensional cell plate model assembly method and a system, relates to the technical field of cell plate model assembly, and effectively improves the accuracy of a three-dimensional cell plate model assembly result. According to the invention, through collecting a plurality of wall structure images of each floor and collecting accessory images of each unit plate accessory, a wall three-dimensional wire frame model corresponding to a wall is built according to the wall structure images, a plurality of plate-type unit plate three-dimensional image models are built according to accessory images and an inventor technology, the wall three-dimensional wire frame model and the unit plate three-dimensional image model are converted into two-dimensional image models, different point cloud distribution conditions are further divided on the wall two-dimensional wire frame model, the unit plate three-dimensional image model is assembled to the wall three-dimensional wire frame model according to the point cloud distribution conditions, corresponding gap areas are counted, and an optimal assembly method is further generated.
Description
Technical Field
The invention relates to the technical field of assembling of unit plates, in particular to a method and a system for assembling a three-dimensional unit plate model.
Background
The three-dimensional unit plate curtain wall model assembly means that the curtain wall design is modeled in a three-dimensional unit plate mode and assembled, and the assembly model can more intuitively display the structure and the appearance of the curtain wall, and is beneficial to designers and constructors to better understand and implement a curtain wall system. Through the assembly of the three-dimensional unitized plate curtain wall model, the arrangement, connection and installation of curtain wall components can be carried out in a computer simulation environment, so that potential design problems are found and solved in advance, and errors and cost in the construction process are reduced.
The existing three-dimensional cell plate model assembly technology has the following defects:
non-standardized problem: curtain wall systems for each building project are unique and therefore may encounter non-standardized components and connections during the model assembly process, which requires additional effort to address.
Error problem: component conflicts that can occur during the three-dimensional cell panel design stage, or conflicts between curtain wall systems and other building components, can lead to errors in the specific construction, unnecessary repair costs,
therefore, it is a difficulty in the prior art how to improve the accuracy of the simulation assembly result of the three-dimensional unit panels while solving the nonstandard problem among the three-dimensional unit panel models of the curtain walls of various types, and therefore, the three-dimensional unit panel model assembly method and system are provided.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide a three-dimensional cell board model assembly method and a system.
In order to achieve the above object, the present invention provides the following technical solutions:
a method of assembling a three-dimensional cell panel model, comprising the steps of:
s1, setting a cloud computing platform, and acquiring a plurality of wall structure images of each floor from a plurality of angles through a laser camera;
s2, establishing a plurality of local wall wire frame models according to wall structure images of the same floor wall at different angles, and further carrying out characteristic connection on the local wall wire frame models at different angles to obtain wall three-dimensional wire frame models of corresponding walls;
s3, collecting accessory images of accessories of each unit board, and further establishing a plurality of board type unit board three-dimensional image models through an inventor technology;
s4, converting the wall body three-dimensional wire frame model and the unit plate three-dimensional image model into two-dimensional image models, and dividing different point cloud distribution conditions on the wall body two-dimensional wire frame model according to different types of unit plate two-dimensional image models;
s5, mapping the distribution condition of the point cloud on the three-dimensional wire frame model of the wall body, and assembling the three-dimensional image model of the unit plate to the three-dimensional wire frame model of the wall body according to the distribution condition of the point cloud;
s6, counting the gap areas of the unit plate three-dimensional image models of all the plate types assembled to the wall three-dimensional wire frame model, and further generating an optimal assembly method.
Further, the process for acquiring the wall structure image comprises the following steps:
and a plurality of laser cameras are respectively arranged at the edge positions of the four walls of each floor, the laser cameras transmit laser signals to the edge positions of the walls from different angles, if the laser cameras do not receive laser reflection signals, the laser cameras adjust the incidence angles of the laser signals until the laser reflection signals are received, each laser camera generates corresponding laser reflection signal spectrums according to the laser reflection signals, and a plurality of wall structure images of the same wall are generated according to the laser reflection signal spectrums.
Further, the cloud computing platform is provided with a data processing unit and an inventor unit;
the data processing unit is used for generating a corresponding wall structure image according to the laser reflection signal frequency spectrum, and further generating a corresponding wall three-dimensional model according to the wall structure image;
and the inventor unit is used for generating a plurality of unit board three-dimensional image models according to the accessory image.
Further, the process for establishing the local wall wire frame model comprises the following steps:
the cloud computing platform divides each wall structure image into a plurality of image areas, and sets an associated traction pointer and a serial number for all pixels in the image areas;
circularly matching the image areas in the different wall structure images, and when the pixels in the image areas of the different wall structure images are the same, numbering the associated traction pointer records of the two pixels;
when the pixels in the image areas of the different wall structure images are different, no operation is performed;
after the cycle matching is finished, counting pixel matching conditions in each image area, and setting the same and unique feature labels for the pixels with association relations according to the pixel matching conditions;
and establishing a plurality of local wall wire frame models according to each wall structure image, and setting the same characteristic labels at the corresponding positions of the local wall wire frame models according to the characteristic labels carried by pixels in the corresponding wall structure images.
Further, the building process of the wall three-dimensional wire frame model comprises the following steps:
and (3) mutually matching all the local wall wire frame models according to the carried characteristic labels, carrying out characteristic connection on each local wall wire frame model according to the matching result, and overlapping and covering the area between the two characteristic connection positions to obtain the wall three-dimensional wire frame model.
Further, the building process of the cell plate three-dimensional image model comprises the following steps:
collecting accessory images of various angles of each unit board accessory through a camera, wherein the unit board accessory comprises a riveting device, a unit board frame, a guide rail device and a gap adjusting device;
the inventor unit is provided with a two-dimensional plane, and the accessory images of all the unit board accessories are sent to the two-dimensional plane, so that the outline images of the corresponding unit board accessories are drawn according to the accessory images;
and converting the contour image of each unit board fitting into a corresponding fitting three-dimensional model, and then combining and splicing the fitting three-dimensional models by using an inventor unit to obtain a plurality of unit board three-dimensional image models.
Further, the process for obtaining the distribution condition of the point cloud includes:
when the wall body of the building is in a rectangular shape, mapping the three-dimensional wire frame model of the wall body and the three-dimensional image models of all the unit plates on the two-dimensional rectangular coordinate system, and further obtaining the two-dimensional image models of the unit plates and the two-dimensional wire frame model of the wall body;
according to the two-dimensional image model of the unit plate of different types, under the condition of guaranteeing the integrity of the two-dimensional image model, the two-dimensional wire frame model of the wall body is paved, and the area incapable of being paved is marked as a gap area;
dividing a plurality of unit areas in the two-dimensional wall wire frame model by using the area occupied by each unit plate two-dimensional image model in the two-dimensional wall wire frame model, and scaling down the two-dimensional wall wire frame model by using the unit areas as the scaling ratio so as to generate corresponding point cloud distribution conditions;
when the wall body of the building is arc-shaped or hemispherical, dividing a plurality of parallel interface lines on the surface of the three-dimensional image wire frame model of the wall body to obtain radian values of the interface lines, and carrying out gradient scaling reduction on the two-dimensional wire frame model of the arc-shaped wall body according to the radian value gradient difference between the adjacent interface lines;
for a semicircular wall body, dividing the corresponding wall body three-dimensional wire frame model into two wall body three-dimensional wire frame models with the same size from the top, and further simultaneously carrying out gradient scaling reduction on the corresponding two wall body two-dimensional wire frame models according to the radian value gradient difference between adjacent interface lines;
scaling down the three-dimensional image model of the unit plate in an arc shape or a hemispherical shape by adopting the same method for dividing the three-dimensional image wire frame model of the wall body in an arc shape or a hemispherical shape;
and further obtaining the point cloud distribution condition of the two-dimensional images of each unit plate on the arc or hemispherical wall three-dimensional image wire frame model.
Further, the generating process of the optimal assembly method comprises the following steps:
according to the point cloud distribution conditions of the three-dimensional image models of the unit plates of all types, the corresponding three-dimensional image models of the unit plates are called and mapped on the three-dimensional wire frame model of the wall body, and then the adjacent three-dimensional image models of the unit plates are connected according to the riveting device in the three-dimensional image models of the unit plates;
the gap areas are adjusted through the guide rail device in the unit plate three-dimensional image model, so that the gap areas with the same area size exist among the unit plate three-dimensional image models, the gap adjusting device in the unit plate three-dimensional image model is called to stretch each riveting device, the unit plate three-dimensional image models are stretched towards the gap areas, and the area of the gap areas is further reduced;
after the three-dimensional image model of each unit plate is stretched, integrating the gap areas through a guide rail device, and selecting different unit plate frames to stretch and fill according to the gap areas and the gap shapes until the gap areas are 0 or cannot be filled;
and counting the gap areas filled by the three-dimensional image models of the unit plates of all types, and selecting the condition that the gap area is 0 and the number of the three-dimensional image models of the unit plates is minimum as the optimal assembly method.
Further, an assembly system of the three-dimensional cell board model assembly method is provided with a data acquisition module, a three-dimensional model establishment module and an assembly method generation module;
the data acquisition module is used for acquiring a plurality of wall structure images of each floor and accessory images of accessories of each unit board;
the three-dimensional model building module is used for building a wall body three-dimensional wire frame model corresponding to the wall body according to the wall body structure image and building a plurality of plate-type unit plate three-dimensional image models according to the accessory image and the inventor technology;
the assembly method generating module is used for converting the wall body three-dimensional wire frame model and the unit plate three-dimensional image model into a two-dimensional image model, further dividing different point cloud distribution conditions on the wall body two-dimensional wire frame model, assembling the unit plate three-dimensional image model to the wall body three-dimensional wire frame model according to the point cloud distribution conditions, counting corresponding gap areas, and further generating the optimal assembly method.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, through collecting a plurality of wall structure images of each floor and accessory images of each unit plate accessory, a wall three-dimensional wire frame model corresponding to the wall is built according to the wall structure images, and a plurality of plate-type unit plate three-dimensional image models are built according to accessory images and an inventor technology, so that the accuracy of wall and unit plate data is ensured, and the problem of nonstandard among curtain wall three-dimensional unit plate models of different types is solved to a certain extent.
2. According to the invention, the unit plate three-dimensional image model and the wall three-dimensional wire frame model are subjected to two-dimensional processing, the two are subjected to mapping processing to generate corresponding point cloud distribution conditions, then the unit plate three-dimensional image model and the wall three-dimensional wire frame model are correspondingly paved according to the point cloud distribution conditions, and the unit plate three-dimensional image model is subjected to stretching processing according to the paving conditions, so that the accuracy of the three-dimensional unit plate simulation assembly result is effectively improved.
Drawings
For a clearer description of embodiments of the present application or of the solutions of the prior art, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments described in the present invention, and that other drawings may be obtained according to these drawings for a person skilled in the art.
FIG. 1 is a flow chart of the method of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, based on the examples herein, which are within the scope of the invention as defined by the claims, will be within the scope of the invention as defined by the claims.
Example 1,
As shown in fig. 1, a three-dimensional cell plate model assembling method includes the steps of:
s1, setting a cloud computing platform, and acquiring a plurality of wall structure images of each floor from a plurality of angles through a laser camera;
s2, establishing a plurality of local wall wire frame models according to wall structure images of the same floor wall at different angles, and further carrying out characteristic connection on the local wall wire frame models at different angles to obtain wall three-dimensional wire frame models of corresponding walls;
s3, collecting accessory images of accessories of each unit board, and further establishing a plurality of board type unit board three-dimensional image models through an inventor technology;
s4, converting the wall body three-dimensional wire frame model and the unit plate three-dimensional image model into two-dimensional image models, and dividing different point cloud distribution conditions on the wall body two-dimensional wire frame model according to different types of unit plate two-dimensional image models;
s5, mapping the distribution condition of the point cloud on the three-dimensional wire frame model of the wall body, and assembling the three-dimensional image model of the unit plate to the three-dimensional wire frame model of the wall body according to the distribution condition of the point cloud;
s6, counting the gap areas of the unit plate three-dimensional image models of all the plate types assembled to the wall three-dimensional wire frame model, and further generating an optimal assembly method.
EXAMPLE 2,
This embodiment is a further limitation of embodiment 1, said step S1 being implemented by:
setting H laser cameras at the edge positions of four walls of each floor respectively, and then sending laser signals to the edge positions of the walls from different angles by all the laser cameras, wherein if the laser cameras do not receive laser reflection signals, the laser cameras adjust the incidence angles of the laser signals until the laser reflection signals are received;
the limiting area signal column is arranged at the edge of the wall body and used for limiting the laser shooting angle of the laser camera so as to reduce useless adjustment operation of the laser camera, wherein the distance from the limiting area signal column to the edge position represents the thickness h of the wall body;
each laser camera generates a corresponding laser reflection signal spectrum according to the received laser reflection signal;
setting a cloud computing platform, wherein the cloud computing platform is provided with a data processing unit and an inventor unit;
the data processing unit is used for generating a corresponding wall structure image according to the laser reflection signal frequency spectrum, and further generating a corresponding wall three-dimensional model according to the wall structure image;
the inventor unit is used for generating a plurality of unit board three-dimensional image models according to the accessory image;
each laser camera sends the laser reflection signal spectrum to the cloud computing platform, and then the cloud computing platform generates H wall structure images of the same wall according to the laser reflection signal spectrum, wherein H is a natural number larger than 0.
EXAMPLE 3,
This embodiment is a further limitation of embodiment 1, said step S2 being implemented by:
because the laser reflection signals corresponding to the H wall structure images of the same wall are obtained under different angles, the partial relevance among the H wall structure images is further realized;
the cloud computing platform divides each wall structure image into a image areas, sets associated traction pointers for all pixels in the image areas, and sets a number A for each image area 1，1，1 、A 1,1，2 、……、A H，a，k Wherein A is H，a，k A represents a kth pixel in an a-th image area of an H wall structure image, a is a natural number greater than 100, and k is a natural number greater than 0;
circularly matching image areas in different wall structure images of the same wall, and when pixels in the image areas of the different wall structure images are the same, numbering associated traction pointer records of the two pixels;
when the pixels in the image areas of the different wall structure images are different, no operation is performed;
after the cycle matching is finished, the cloud computing platform calculates pixel matching conditions in each image area, and if the image areas of two different wall structure images are respectively provided with the associated traction pointer records of more than 20 continuous pixels, the same and unique feature labels are simultaneously set for the pixels with the association relationship in the two image areas;
further, a plurality of local wall wire frame models are established according to each wall structure image, and the same feature labels are arranged at the corresponding positions of the local wall wire frame models according to the feature labels carried by pixels in the corresponding wall structure images;
and (3) mutually matching all the local wall wire frame models according to the carried characteristic labels, carrying out characteristic connection on each local wall wire frame model according to the matching result, and overlapping and covering the area between the two characteristic connection positions to further obtain the wall three-dimensional wire frame model of the corresponding floor wall.
EXAMPLE 4,
This embodiment is a further limitation of embodiment 1, said step S3 being implemented by:
collecting accessory images of various angles of each unit board accessory through a camera;
the unit board fittings are divided into a riveting device, a unit board frame, a guide rail device and a gap adjusting device;
the riveting device comprises a telescopic fixed rod, a movable rod and a connecting shaft body;
the unit board frame comprises right-angle unit boards, round unit boards and 45-degree oblique angle unit boards, and the unit boards are provided with telescopic frame supports capable of being assembled, so that the unit boards can be telescopic in a certain range;
the guide rail device comprises a pulley type guide rail and a gear type guide rail;
the gap adjusting device comprises a pressure sensor, a spring and an elastic net;
further, the cloud computing platform sends the accessory images of the accessories of the unit boards to the inventor unit;
the inventor unit is provided with a two-dimensional plane, and the accessory images of all the unit board accessories are sent to the two-dimensional plane, so that the outline images of the corresponding unit board accessories are drawn according to the accessory images, and the connecting holes of all the unit board accessories are marked in the outline images;
converting the outline image of each unit plate fitting into a corresponding fitting three-dimensional model by using a Array, pattern, mirror drawing tool and the like, and marking the length parameters such as thickness, length and the like and the diameter length of each connecting hole on the fitting three-dimensional model;
and then the inventor unit performs combination and splicing on the three-dimensional models of all accessories to obtain P unit plate three-dimensional image models, wherein P is a natural number larger than 0.
EXAMPLE 5,
This embodiment is a further limitation of embodiment 1, said step S4 being implemented by:
when the wall body of the building is rectangular, a two-dimensional rectangular coordinate system is established, and a three-dimensional wire frame model of the wall body and three-dimensional image models of all the unit plates are mapped on the two-dimensional rectangular coordinate system, so that a two-dimensional image model of the unit plates and a two-dimensional wire frame model of the wall body are obtained;
mapping each type of unit plate two-dimensional image model on a wall body two-dimensional wire frame model respectively, so that the wall body two-dimensional wire frame model is paved as much as possible under the condition of ensuring the integrity of the unit plate two-dimensional image models, and gap areas are marked on areas which cannot be paved;
dividing a plurality of unit areas in the two-dimensional wall wire frame model by using the area occupied by each unit board two-dimensional image model in the two-dimensional wall wire frame model, and scaling down the two-dimensional wall wire frame model by using the unit areas as the scaling ratio so as to generate corresponding point cloud distribution conditions according to the distribution conditions of each unit board two-dimensional image model on the two-dimensional wall wire frame model;
when the wall body of the building is arc-shaped or hemispherical, a plurality of parallel interface lines are divided on the surface of the three-dimensional image wire frame model of the wall body, the radian value of each interface line is obtained, and then the arc-shaped two-dimensional wire frame model of the wall body is subjected to gradient scaling according to the radian value gradient difference between the adjacent interface lines;
for a semicircular wall body, dividing the corresponding wall body three-dimensional wire frame model into two wall body three-dimensional wire frame models with the same size from the top, and further simultaneously carrying out gradient scaling reduction on the corresponding two wall body two-dimensional wire frame models according to the radian value gradient difference between adjacent interface lines;
scaling down the three-dimensional image model of the unit plate in an arc shape or a hemispherical shape by adopting the same method for dividing the three-dimensional image wire frame model of the wall body in an arc shape or a hemispherical shape;
and further obtaining the point cloud distribution condition of the two-dimensional images of each unit plate on the arc or hemispherical wall three-dimensional image wire frame model.
EXAMPLE 6,
This embodiment is a further limitation of embodiment 1, said step S5 being implemented by:
according to the point cloud distribution conditions of the three-dimensional image models of the unit plates of all types, the corresponding three-dimensional image models of the unit plates are called and mapped on the three-dimensional wire frame model of the wall body, and then the adjacent three-dimensional image models of the unit plates are connected according to the riveting device in the three-dimensional image models of the unit plates;
for a marked gap area in the wall body three-dimensional image wire frame model, adjusting the gap area through a guide rail device in the unit plate three-dimensional image model, so that the gap areas with the same area size exist among the unit plate three-dimensional image models, and taking springs in a gap adjusting device in the unit plate three-dimensional image model to stretch each riveting device, so that the unit plate three-dimensional image models are stretched to the gap areas, and the area of the gap areas is reduced;
setting a pressure threshold value, and calling a pressure sensor in a gap adjusting device by a cloud computing platform to simulate and measure the pressure of a stretched spring in the stretching process of the three-dimensional image model of each unit board;
when the spring pressure is less than the pressure threshold, the spring can be stretched continuously;
when the spring pressure is greater than or equal to the pressure threshold, the tension spring is stopped, and the spring position is fixed through the elastic net.
EXAMPLE 7,
This embodiment is a further limitation of embodiment 1, said step S6 being implemented by:
after the three-dimensional image model of each unit plate is stretched, integrating the gap area through a guide rail device, and selecting a right-angle unit plate, a round unit plate or a 45-degree oblique angle unit plate for telescopic filling according to the gap area and the gap shape until the gap area is 0 or cannot be filled;
counting the gap areas filled by the three-dimensional image models of the unit plates of all types, and selecting the condition that the gap area is 0 and the number of the three-dimensional image models of the unit plates is minimum as an optimal assembly method;
the optimal assembly method comprises a wall body three-dimensional wire frame model with unit plate three-dimensional image models, and the number and the size of the unit plate three-dimensional image models of various types are marked.
The invention also discloses an assembly system of the three-dimensional cell board model assembly method, which is provided with a data acquisition module, a three-dimensional model building module and an assembly method generating module;
the data acquisition module is used for acquiring a plurality of wall structure images of each floor and accessory images of accessories of each unit board;
the three-dimensional model building module is used for building a wall body three-dimensional wire frame model corresponding to the wall body according to the wall body structure image and building a plurality of plate-type unit plate three-dimensional image models according to the accessory image and the inventor technology;
the assembly method generating module is used for converting the wall body three-dimensional wire frame model and the unit plate three-dimensional image model into a two-dimensional image model, further dividing different point cloud distribution conditions on the wall body two-dimensional wire frame model, assembling the unit plate three-dimensional image model to the wall body three-dimensional wire frame model according to the point cloud distribution conditions, counting corresponding gap areas, and further generating the optimal assembly method.
The above embodiments are only for illustrating the technical method of the present invention and not for limiting the same, and it should be understood by those skilled in the art that the technical method of the present invention may be modified or substituted without departing from the spirit and scope of the technical method of the present invention.
Claims (9)
1. A method of assembling a three-dimensional cell panel model, comprising the steps of:
s1, setting a cloud computing platform, and acquiring a plurality of wall structure images of each floor from a plurality of angles through a laser camera;
s2, establishing a plurality of local wall wire frame models according to wall structure images of the same floor wall at different angles, and further carrying out characteristic connection on the local wall wire frame models at different angles to obtain wall three-dimensional wire frame models of corresponding walls;
s3, collecting accessory images of accessories of each unit board, and further establishing a plurality of board type unit board three-dimensional image models through an inventor technology;
s4, converting the wall body three-dimensional wire frame model and the unit plate three-dimensional image model into two-dimensional image models, and dividing different point cloud distribution conditions on the wall body two-dimensional wire frame model according to different types of unit plate two-dimensional image models;
s5, mapping the distribution condition of the point cloud on the three-dimensional wire frame model of the wall body, and assembling the three-dimensional image model of the unit plate to the three-dimensional wire frame model of the wall body according to the distribution condition of the point cloud;
s6, counting the gap areas of the unit plate three-dimensional image models of all the plate types assembled to the wall three-dimensional wire frame model, and further generating an optimal assembly method.
2. The method for assembling a three-dimensional cellular board according to claim 1, wherein the process of acquiring the wall structure image comprises:
and arranging a plurality of laser cameras at the edge positions of the wall body, transmitting laser signals from different angles to the edge positions of the wall body by the laser cameras, adjusting the incidence angle of the laser signals by the laser cameras until the laser reflected signals are received if the laser reflected signals are not received by the laser cameras, generating corresponding laser reflected signal spectrums by the laser cameras according to the laser reflected signals, and generating a plurality of wall body structural images of the same wall body according to the laser reflected signal spectrums.
3. The three-dimensional cell board model assembly method according to claim 2, wherein the cloud computing platform is provided with a data processing unit and an inventor unit;
the data processing unit is used for generating a corresponding wall structure image according to the laser reflection signal frequency spectrum, and further generating a corresponding wall three-dimensional model according to the wall structure image;
and the inventor unit is used for generating a plurality of unit board three-dimensional image models according to the accessory image.
4. A method of assembling a three-dimensional cellular board model according to claim 3, wherein the process of building the local wall wire frame model comprises:
the cloud computing platform divides each wall structure image into a plurality of image areas, and sets an associated traction pointer and a serial number for all pixels in the image areas;
circularly matching the image areas in the different wall structure images, and when the pixels in the image areas of the different wall structure images are the same, numbering the associated traction pointer records of the two pixels;
when the pixels in the image areas of the different wall structure images are different, no operation is performed;
after the cycle matching is finished, counting pixel matching conditions in each image area, and setting the same and unique feature labels for the pixels with association relations according to the pixel matching conditions;
and establishing a plurality of local wall wire frame models according to each wall structure image, and setting the same characteristic labels at the corresponding positions of the local wall wire frame models according to the characteristic labels carried by pixels in the corresponding wall structure images.
5. The method for assembling the three-dimensional cellular board model according to claim 4, wherein the process for building the three-dimensional cellular board model of the wall body comprises the following steps:
and (3) mutually matching all the local wall wire frame models according to the carried characteristic labels, carrying out characteristic connection on each local wall wire frame model according to the matching result, and overlapping and covering the area between the two characteristic connection positions to obtain the wall three-dimensional wire frame model.
6. The method for assembling a three-dimensional cell plate model according to claim 1, wherein the process for building the cell plate three-dimensional image model comprises:
collecting accessory images of various angles of each unit board accessory through a camera, wherein the unit board accessory comprises a riveting device, a unit board frame, a guide rail device and a gap adjusting device;
the inventor unit is provided with a two-dimensional plane, and the accessory images of all the unit board accessories are sent to the two-dimensional plane, so that the outline images of the corresponding unit board accessories are drawn according to the accessory images;
and converting the contour image of each unit board fitting into a corresponding fitting three-dimensional model, and then combining and splicing the fitting three-dimensional models by using an inventor unit to obtain a plurality of unit board three-dimensional image models.
7. The method for assembling a three-dimensional cell plate according to claim 6, wherein the process of obtaining the distribution of the point cloud comprises:
when the wall body of the building is in a rectangular shape, mapping the three-dimensional wire frame model of the wall body and the three-dimensional image models of all the unit plates on the two-dimensional rectangular coordinate system, and further obtaining the two-dimensional image models of the unit plates and the two-dimensional wire frame model of the wall body;
spreading two-dimensional wire frame models of the wall body on two-dimensional image models of unit plates of different types, and marking areas which cannot be spread as gap areas;
dividing a plurality of unit areas in the two-dimensional wall wire frame model by using the area occupied by each unit plate two-dimensional image model in the two-dimensional wall wire frame model, and scaling down the two-dimensional wall wire frame model by using the unit areas as the scaling ratio so as to generate corresponding point cloud distribution conditions;
when the wall body of the building is arc-shaped or hemispherical, dividing a plurality of parallel interface lines on the surface of the three-dimensional image wire frame model of the wall body to obtain radian values of the interface lines, and carrying out gradient scaling reduction on the two-dimensional wire frame model of the arc-shaped wall body according to the radian value gradient difference between the adjacent interface lines;
for a semicircular wall body, dividing the corresponding wall body three-dimensional wire frame model into two wall body three-dimensional wire frame models with the same size from the top, and further simultaneously carrying out gradient scaling reduction on the corresponding two wall body two-dimensional wire frame models according to the radian value gradient difference between adjacent interface lines;
scaling down the three-dimensional image model of the unit plate in an arc shape or a hemispherical shape by adopting the same method for dividing the three-dimensional image wire frame model of the wall body in an arc shape or a hemispherical shape;
repeating the steps to obtain the point cloud distribution condition of the two-dimensional images of each unit plate on the arc or hemispherical wall three-dimensional image wire frame model.
8. The method for assembling a three-dimensional cell board model according to claim 7, wherein the generation process of the optimal assembling method comprises the following steps:
according to the point cloud distribution conditions of the three-dimensional image models of the unit plates of all types, the corresponding three-dimensional image models of the unit plates are called and mapped on the three-dimensional wire frame model of the wall body, and the adjacent three-dimensional image models of the unit plates are connected through a riveting device in the three-dimensional image models of the unit plates;
the gap areas are adjusted through the guide rail device in the unit plate three-dimensional image model, so that the gap areas with the same area size exist among the unit plate three-dimensional image models, the gap adjusting device in the unit plate three-dimensional image model is called to stretch each riveting device, the unit plate three-dimensional image models are stretched towards the gap areas, and the area of the gap areas is further reduced;
after the three-dimensional image model of each unit plate is stretched, integrating the gap areas through a guide rail device, and selecting different unit plate frames to stretch and fill according to the gap areas and the gap shapes until the gap areas are 0 or cannot be filled;
and counting the gap areas filled by the three-dimensional image models of the unit plates of all types, and selecting the condition that the gap area is 0 and the number of the three-dimensional image models of the unit plates is minimum as the optimal assembly method.
9. The assembly system of the three-dimensional cell board model assembly method according to any one of claims 1 to 8, wherein the assembly system is provided with a data acquisition module, a three-dimensional model building module, and an assembly method generation module;
the data acquisition module is used for acquiring a plurality of wall structure images of each floor and accessory images of accessories of each unit board;
the three-dimensional model building module is used for building a wall body three-dimensional wire frame model corresponding to the wall body according to the wall body structure image and building a plurality of plate-type unit plate three-dimensional image models according to the accessory image and the inventor technology;
the assembly method generating module is used for converting the wall body three-dimensional wire frame model and the unit plate three-dimensional image model into a two-dimensional image model, further dividing different point cloud distribution conditions on the wall body two-dimensional wire frame model, assembling the unit plate three-dimensional image model to the wall body three-dimensional wire frame model according to the point cloud distribution conditions, counting corresponding gap areas, and further generating the optimal assembly method.
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