CN117727674B - Semiconductor packaging device with heat dissipation device - Google Patents
Semiconductor packaging device with heat dissipation device Download PDFInfo
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- CN117727674B CN117727674B CN202410172050.1A CN202410172050A CN117727674B CN 117727674 B CN117727674 B CN 117727674B CN 202410172050 A CN202410172050 A CN 202410172050A CN 117727674 B CN117727674 B CN 117727674B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 56
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 9
- 230000007246 mechanism Effects 0.000 claims abstract description 67
- 230000005540 biological transmission Effects 0.000 claims abstract description 61
- 238000001816 cooling Methods 0.000 claims abstract description 46
- 238000007648 laser printing Methods 0.000 claims abstract description 34
- 239000000110 cooling liquid Substances 0.000 claims abstract description 28
- 238000004140 cleaning Methods 0.000 claims abstract description 17
- 238000012545 processing Methods 0.000 claims abstract description 16
- 238000007639 printing Methods 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims description 51
- 230000005484 gravity Effects 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 2
- 239000012535 impurity Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 230000002035 prolonged effect Effects 0.000 claims 1
- 238000004064 recycling Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 3
- 239000002826 coolant Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of semiconductor chip packaging, in particular to a semiconductor packaging device with a heat dissipation device, which comprises a base, an intermittent transmission mechanism, a blanking mechanism, a cooling mechanism and a laser printing mechanism, wherein the intermittent transmission mechanism, the blanking mechanism, the cooling mechanism and the laser printing mechanism are all arranged on the base, and the cooling mechanism is connected with the intermittent transmission mechanism. The invention utilizes the driving of a motor to realize that the semiconductor chips in the chip storage box drop onto the processing table one by one, the cleaning cylinder is driven to blow and clean the semiconductor chips to improve the printing quality, the clamping piece is driven to clamp and intermittently transmit the semiconductor chips so as to facilitate the printing operation of the laser printing device, and the cooling liquid in the cooling device box is driven to reciprocally enter the cooling pipe to cool and dissipate heat of the motor, so that the motor is prevented from being damaged.
Description
Technical Field
The invention relates to the technical field of semiconductor chip packaging, in particular to a semiconductor packaging device with a heat dissipation device.
Background
Semiconductor chips are semiconductor devices that are manufactured by etching and wiring on a semiconductor sheet and that can realize a certain function. Not only silicon chips, but also semiconductor materials such as gallium arsenide and germanium are common.
The packaging process of the semiconductor chip comprises back thinning, wafer cutting, wafer mounting, wire bonding, plastic packaging, laser printing, rib cutting forming, finished product testing and the like, wherein the laser printing is to print marks, commodity information and the like on the plastic packaging surface by utilizing a laser printing technology, but the conventional laser printing system needs to be matched with an additional conveying belt device and manually blanking, so that the laser printing system is complex in structure and wastes manpower and material resources.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide a semiconductor packaging device with a heat dissipation device, and the invention is realized by adopting the following technical scheme:
The utility model provides a semiconductor packaging device with heat abstractor, includes base, intermittent type nature transmission mechanism, unloading mechanism, cooling mechanism and laser printing mechanism, and intermittent type nature transmission mechanism, unloading mechanism, cooling mechanism and laser printing mechanism all locate on the base, and cooling mechanism and intermittent type nature transmission mechanism are connected.
Advantageously, the intermittent transmission mechanism comprises a processing table, a motor, an elliptical member, a transmission bar, a first slider, a second slider and two clamping mechanisms;
The processing platform and the motor are fixedly connected to the base respectively, the oval piece is fixedly connected to the base output shaft, one end of the transmission bar is rotationally connected with the oval piece, the other end of the transmission bar is rotationally connected with the first sliding block, the first sliding block is slidably connected to the base, the second sliding rail is fixedly connected to the top wall of the first sliding block, the clamping mechanism comprises a second sliding block, a transmission rod, a third sliding block and a fourth sliding block, the second sliding block is slidably connected to the second sliding rail, the transmission rod is fixedly connected to the top wall of the second sliding block, more than two clamping pieces are fixedly connected to the transmission rod, the third sliding block and the fourth sliding block are slidably connected to the transmission rod respectively, and the first sliding block and the second sliding block are slidably connected to the base respectively.
The cooling mechanism comprises a heat radiator box and a cooling pipe, wherein the heat radiator box is fixedly connected to a base, a liquid storage cavity and a transmission cavity are formed in the heat radiator box, the top wall of the transmission cavity is communicated with the top wall of the heat radiator box through a first connecting channel, a liquid return groove is formed in the top wall of the heat radiator box, the bottom wall of the liquid return groove is communicated with the top wall of the liquid storage cavity through a second connecting channel, a connecting strip is slidably connected to the side wall of the transmission cavity, the upper end of the connecting strip extends into the liquid storage cavity, a liquid pushing plate is fixedly connected to the upper end of the connecting strip, a first wedge block is fixedly connected to the lower end of the connecting strip, a sliding sheet is slidably connected to the bottom wall of the transmission cavity, a second wedge block and an extension rod are fixedly connected to the upper end of the sliding sheet, the upper end of the extension rod extends to the upper side of the heat radiator box through the first connecting channel, a valve is rotatably connected to the top wall of the cavity, the valve is connected to the top wall of the liquid storage cavity through a second elastic piece, the valve is located below the second connecting channel, the cooling pipe is fixedly connected to the liquid storage cavity, and the cooling pipe is wound on the cooling pipe is communicated with the cooling pipe.
The base is characterized in that the top wall of the base is fixedly connected with a third sliding rail, a fourth sliding rail and a first sliding rail, the third sliding block is connected to the third sliding rail in a sliding mode, the fourth sliding block is connected to the fourth sliding rail in a sliding mode, and the first sliding block is connected to the first sliding rail in a sliding mode.
The blanking mechanism comprises a chip storage box fixedly connected to the top wall of the base, a storage cavity is formed in the chip storage box, the side wall of the storage cavity is communicated with the bottom wall of the chip storage box through a discharging channel, more than two semiconductor chips are stacked in the storage cavity, a push rod is slidably connected to the chip storage box, one end of the push rod extends out of the chip storage box, a connecting piece is fixedly connected to the push rod, the connecting piece is connected with the outer side wall of the chip storage box through a first elastic piece, a cleaning barrel is fixedly connected to the rear wall of the chip storage box, an air producing cavity is formed in the cleaning barrel and is communicated with the right wall of the cleaning barrel, a piston is fixedly connected to the air producing cavity, a piston rod is fixedly connected to the piston rod, the piston rod and the connecting piece are fixedly connected to each other, an air outlet pipe communicated with the air producing cavity is fixedly connected to the cleaning barrel, and a guide pipe is fixedly connected to the air outlet pipe.
Advantageously, the chip storage box is fixedly connected to the top wall of the base through a connecting column.
Advantageously, the laser printing mechanism comprises a support and a laser printing device, wherein the support is fixedly connected to the top wall of the base, and the laser printing device is fixedly connected to the support.
The collecting box is characterized in that the top wall of the base is fixedly connected with a guide plate, the side wall of the base is detachably connected with the collecting box, and the guide plate extends to the upper portion of the collecting box.
The invention has the following beneficial effects:
the invention utilizes the driving of a motor to realize that the semiconductor chips in the chip storage box drop onto the processing table one by one, the cleaning cylinder is driven to blow and clean the semiconductor chips to improve the printing quality, the clamping piece is driven to clamp and intermittently transmit the semiconductor chips so as to facilitate the printing operation of the laser printing device, and the cooling liquid in the cooling device box is driven to reciprocally enter the cooling pipe to cool and dissipate heat of the motor, so that the motor is prevented from being damaged.
Drawings
The invention will be further described with reference to the accompanying drawings, in which embodiments do not constitute any limitation of the invention, and other drawings can be obtained by one of ordinary skill in the art without inventive effort from the following drawings.
Fig. 1 is a schematic structural view of a semiconductor package apparatus with a heat sink according to the present invention;
FIG. 2 is a top view of the intermittent transport mechanism of FIG. 1 according to the present invention;
FIG. 3 is an enlarged view of the invention at A in FIG. 1;
FIG. 4 is an enlarged view of the invention at B in FIG. 1;
FIG. 5 is a schematic view of the internal structure of the cleaning cartridge of FIG. 3 according to the present invention;
FIG. 6 is an enlarged view of the valve of FIG. 4 in accordance with the present invention;
fig. 7 is a perspective view of the first rotating rod and eccentric of fig. 1 in accordance with the present invention.
Reference numerals: 1. a base; 2. a processing table; 3. a motor; 4. an elliptical member; 5. a transmission bar; 6. a first slider; 7. a second slider; 8. a transmission rod; 9. a third slider; 10. a fourth slider; 11. a second slide rail; 12. a third slide rail; 13. a fourth slide rail; 14. a first slide rail; 15. a clamping member; 16. a bracket; 17. a laser printing device; 18. a first rotating lever; 19. an eccentric wheel; 20. a chip storage box; 21. a storage chamber; 22. a discharge channel; 23. a push rod; 24. a connecting sheet; 25. a first elastic member; 26. a cleaning cylinder; 27. an air generating cavity; 28. a piston rod; 29. a piston; 30. an air outlet pipe; 31. a guide tube; 32. a connecting column; 33. a semiconductor chip; 34. a heat sink case; 35. a liquid storage cavity; 36. a transmission cavity; 37. a first connection channel; 38. a liquid return tank; 39. a second connection channel; 40. a cooling tube; 41. a liquid pushing plate; 42. a connecting strip; 43. a first wedge block; 44. a second wedge block; 45. a sliding sheet; 46. an extension rod; 47. a stress block; 48. a valve; 49. a second elastic member; 50. a guide plate; 51. and (5) collecting a box.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the azimuth or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," "fourth," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, connected via an intermediary, or connected by communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
As shown in fig. 1-7, a semiconductor packaging device with a heat dissipating device includes a base 1, an intermittent transmission mechanism, a blanking mechanism, a cooling mechanism and a laser printing mechanism, wherein the intermittent transmission mechanism, the blanking mechanism, the cooling mechanism and the laser printing mechanism are all arranged on the base 1, and the cooling mechanism is connected with the intermittent transmission mechanism.
Embodiment one:
The blanking mechanism may enable the semiconductor chips 33 to drop down to the intermittent transmission mechanism one by one, the intermittent transmission mechanism performs intermittent transmission on the semiconductor chips 33 one by one, so that the semiconductor chips 33 are transmitted to the laser printing mechanism one by one to perform laser printing, and the cooling mechanism may perform heat dissipation on the intermittent transmission mechanism, for example, heat dissipation on a driving component in the intermittent transmission mechanism, so as to prevent the intermittent transmission mechanism from being damaged.
According to an alternative embodiment of the present invention, the intermittent transmission mechanism includes a processing table 2, a motor 3, an elliptical member 4, a driving bar 5, a first sliding block 6, a second sliding rail 11, and two clamping mechanisms, where the processing table 2 and the motor 3 are respectively and fixedly connected to the base 1, the elliptical member 4 is fixedly connected to an output shaft of the base 1, one end of the driving bar 5 is rotationally connected to the elliptical member 4, the other end of the driving bar 5 is rotationally connected to the first sliding block 6, the first sliding block 6 is slidingly connected to the base 1, the second sliding rail 11 is fixedly connected to a top wall of the first sliding block 6, the clamping mechanism includes a second sliding block 7, a driving rod 8, a third sliding block 9, and a fourth sliding block 10, the second sliding block 7 is slidingly connected to the second sliding rail 11, the driving rod 8 is fixedly connected to a top wall of the second sliding block 7, two or more clamping members 15 are fixedly connected to the driving rod 8, and the third sliding block 9 and the fourth sliding block 10 are respectively slidingly connected to the driving rod 8, and the first sliding block 6 and the second sliding rail 11 are respectively slidingly connected to the base 1.
According to an alternative embodiment of the present invention, the top wall of the elliptical member 4 is fixedly connected with the first rotating rod 18, the upper end of the first rotating rod 18 is fixedly connected with the eccentric wheel 19, the cooling mechanism comprises a heat dissipating device box 34 and a cooling tube 40, the heat dissipating device box 34 is fixedly connected to the base 1, the heat dissipating device box 34 is provided with a liquid storage cavity 35 and a transmission cavity 36, the top wall of the transmission cavity 36 is communicated with the top wall of the heat dissipating device box 34 through a first connecting channel 37, the top wall of the heat dissipating device box 34 is provided with a liquid return groove 38, the bottom wall of the liquid return groove 38 is communicated with the top wall of the liquid storage cavity 35 through a second connecting channel 39, the side wall of the transmission cavity 36 is slidably connected with a connecting strip 42, the upper end of the connecting strip 42 extends into the liquid storage cavity 35, the upper end of the connecting strip 42 is fixedly connected with a liquid pushing plate 41, the lower end of the connecting strip 42 is fixedly connected with a first wedge block 43, the bottom wall of the transmission cavity 36 is slidably connected with a sliding sheet 45, the top wall of the sliding sheet 45 is fixedly connected with a second wedge block 44 and an extension rod 46, the upper end of the extension rod 46 extends to the upper side of the heat dissipating device box 34 through the first connecting channel 37, the liquid storage cavity 47 is fixedly connected with the upper end of the liquid storage cavity 47, the upper end of the extension rod 47 is fixedly connected with the valve 35 is connected with the valve 35, the upper end of the cooling tube 40 is fixedly connected with the upper end of the cooling tube 40, and is fixedly connected with the upper end of the cooling tube 40 is connected with the upper end of the cooling tube 35, and is connected with the cooling tube 40.
According to an alternative embodiment of the present invention, the top wall of the base 1 is fixedly connected with a third sliding rail 12, a fourth sliding rail 13 and a first sliding rail 14, the third sliding block 9 is slidably connected to the third sliding rail 12, the fourth sliding block 10 is slidably connected to the fourth sliding rail 13, and the first sliding block 6 is slidably connected to the first sliding rail 14.
According to an alternative embodiment of the present invention, the discharging mechanism includes a chip storage tank 20, the chip storage tank 20 is fixedly connected to the top wall of the base 1, a storage cavity 21 is formed on the chip storage tank 20, a side wall of the storage cavity 21 is communicated with the bottom wall of the chip storage tank 20 through a discharging channel 22, more than two semiconductor chips 33 are stacked in the storage cavity 21, a push rod 23 is slidably connected to the chip storage tank 20, one end of the push rod 23 extends out of the chip storage tank 20, a connecting piece 24 is fixedly connected to the push rod 23, the connecting piece 24 is connected to the outer side wall of the chip storage tank 20 through a first elastic member 25, a cleaning barrel 26 is fixedly connected to the rear wall of the chip storage tank 20, a gas producing cavity 27 is formed in the cleaning barrel 26, the gas producing cavity 27 is communicated with the right wall of the cleaning barrel 26, a piston 29 is fixedly connected to the piston 29, a piston rod 28 is fixedly connected to the piston rod 24, a gas outlet pipe 30 communicated with the gas producing cavity 27 is fixedly connected to the cleaning barrel 26, and a guiding pipe 31 is fixedly connected to the gas outlet pipe 30.
In an alternative embodiment of the present invention, the chip storage box 20 is fixedly connected to the top wall of the base 1 through a connecting post 32.
In an alternative embodiment of the present invention, the laser printing mechanism includes a bracket 16 and a laser printing device 17, the bracket 16 is fixedly connected to the top wall of the base 1, and the laser printing device 17 is fixedly connected to the bracket 16.
In an alternative embodiment of the present invention, a guide plate 50 is fixedly connected to the top wall of the base 1, a collecting box 51 is detachably connected to the side wall of the base 1, and the guide plate 50 extends above the collecting box 51. The removable connection of the collection tank 51 facilitates the user's replacement of the collection tank 51 that is full.
Embodiment two: more than two semiconductor chips 33 are stacked in the storage cavity 21, the motor 3 is started, the output shaft of the motor 3 controls the elliptical member 4, the first rotating rod 18 and the eccentric wheel 19 to rotate, the eccentric wheel 19 rotates to push the push rod 23 to overcome the elastic force of the first elastic member 25 and move left, so that the lowest semiconductor chip 33 in the storage cavity 21 is pushed to enter the discharge channel 22, then the semiconductor chip 33 falls to the top wall of the processing table 2 in the discharge channel 22 under the action of self gravity, meanwhile, the connecting piece 24 moves left to drive the piston rod 28 and the piston 29 to move left, so that air in the air generating cavity 27 is compressed and sprayed out from the air outlet pipe 30 and the guide pipe 31 to other semiconductor chips 33 on the top wall of the processing table 2, dust impurities on the semiconductor chip 33 are blown away, the printing quality is prevented from being influenced, and the elliptical member 4 rotates to drive the transmission bar 5 to enable the first sliding block 6 to reciprocate back and forth along the first sliding rail 14;
The movement track of the second sliding block 7, the second sliding rail 11 and the clamping piece 15 is that one transmission rod 8 moves towards the other transmission rod 8, namely, the two transmission rods 8 are close to each other, then the two transmission rods 8 move left at the same time, and then the two transmission rods 8 move right to reset at the same time when being far away from each other;
finally, the above actions are repeated to circulate, so that the plurality of semiconductor chips 33 on the top wall of the processing table 2 are clamped, transported to the left for a certain distance and the clamped reciprocating operation is released by the plurality of clamping pieces 15, so that the semiconductor chips 33 are transported to the lower part of the laser printing device 17 one by one to be subjected to laser printing, each semiconductor chip 33 stays below the laser printing device 17 for a certain time so as to be convenient for printing, the printed information comprises manufacturer information, device codes and the like, and finally, the leftmost semiconductor chip 33 is clamped and transported to the guide plate 50 by the two clamping pieces 15, and the leftmost semiconductor chip 33 falls into the collecting box 51 along the guide plate 50 to be stored.
When the eccentric wheel 19 rotates, the stress block 47 is pushed to move right, so that the extension rod 46, the sliding vane 45 and the second wedge block 44 are driven to move right, the second wedge block 44 and the first wedge block 43 are pushed to move upwards after being propped against each other, the connecting strip 42 and the liquid pushing plate 41 are driven to move upwards, the cooling liquid can generate thrust to the valve 48 to keep blocking the second connecting channel 39, the cooling liquid in the liquid storage cavity 35 is pushed into the cooling pipe 40 by the liquid pushing plate 41, the flowing cooling liquid dissipates heat to the motor 3, the cooling liquid in the cooling pipe 40 falls into the liquid return groove 38, when the eccentric wheel 19 is separated from and propped against the stress block 47, the liquid pushing plate 41, the connecting strip 42 and the first wedge block 43 move downwards under the action of gravity of the cooling liquid in the liquid storage cavity 35 under the self gravity, so as to push the second wedge block 44, the sliding vane 45, the extension rod 46 and the stress block 47 move leftwards to reset, the valve 48 loses the cooling liquid thrust in the liquid storage cavity 35, the valve 48 pushes the valve 48 to push the cooling liquid in the liquid return groove 38 under the action of gravity of the cooling liquid in the liquid return groove 38, the elastic force of the cooling liquid to push the valve 48 to rotate the second motor 49 under the action of the liquid return groove 38, the elastic force of the cooling liquid in the liquid return groove 38 is overcome the elastic force of the cooling liquid, the motor is prevented from moving upwards by the motor 3 repeatedly, the cooling liquid in the liquid return groove 3 is caused by the principle of the cooling liquid is prevented from being repeatedly damaged, and the cooling liquid in the liquid circulation groove 3, and the cooling liquid is cooled by the cooling liquid after the cooling liquid is cooled in the liquid circulation groove 3.
The radiator tank 34 may be made of a material having good heat conductivity so as to facilitate the heat radiation of the coolant, so that the coolant maintains a good heat radiation effect on the motor 3.
The first elastic member 25 may be a spring and the second elastic member 49 may be a torsion spring.
The embodiment utilizes the driving of one motor 3 to automatically drop the semiconductor chips 33 in the chip storage box 20 one by one onto the processing table 2, drives the cleaning cylinder 26 to blow and clean the semiconductor chips 33 to improve the printing quality, drives the clamping piece 15 to clamp and intermittently transmit the semiconductor chips 33 so as to facilitate the printing operation of the laser printing device 17, drives the cooling liquid in the cooling device box 34 to reciprocate into the cooling tube 40 to cool and dissipate heat of the motor 3, prevents the motor 3 from being damaged.
The components, modules, mechanisms and devices of the invention, which do not describe the structure in detail, are all common standard components or components known to those skilled in the art, and the structure and principle thereof are all known to those skilled in the art through technical manuals or through routine experimental methods.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention.
Claims (5)
1. The semiconductor packaging device with the heat dissipation device is characterized by comprising a base (1), an intermittent transmission mechanism, a blanking mechanism, a cooling mechanism and a laser printing mechanism, wherein the intermittent transmission mechanism, the blanking mechanism, the cooling mechanism and the laser printing mechanism are all arranged on the base (1), and the cooling mechanism is connected with the intermittent transmission mechanism;
The intermittent transmission mechanism comprises a processing table (2), a motor (3), an elliptical piece (4), a transmission bar (5), a first sliding block (6), a second sliding rail (11) and two clamping mechanisms, wherein the processing table (2) and the motor (3) are fixedly connected to the base (1) respectively, the elliptical piece (4) is fixedly connected to an output shaft of the base (1), one end of the transmission bar (5) is rotationally connected with the elliptical piece (4), the other end of the transmission bar (5) is rotationally connected with the first sliding block (6), the first sliding block (6) is slidably connected to the base (1), the second sliding rail (11) is fixedly connected to the top wall of the first sliding block (6), the clamping mechanisms comprise a second sliding block (7), a transmission rod (8), a third sliding block (9) and a fourth sliding block (10), the second sliding block (7) is slidably connected to the second sliding rail (11), the transmission rod (8) is fixedly connected to the top wall of the second sliding block (7), more than two clamping pieces (15) are fixedly connected to the transmission rod (8), and the third sliding block (9) and the fourth sliding block (10) are respectively connected to the first sliding block (11) and the second sliding block (11).
The top wall of the elliptical piece (4) is fixedly connected with a first rotating rod (18), the upper end of the first rotating rod (18) is fixedly connected with an eccentric wheel (19), the cooling mechanism comprises a heat dissipating device box (34) and a cooling pipe (40), the heat dissipating device box (34) is fixedly connected to the base (1), a liquid storage cavity (35) and a transmission cavity (36) are formed in the heat dissipating device box (34), and the top wall of the transmission cavity (36) is communicated with the top wall of the heat dissipating device box (34) through a first connecting channel (37); a liquid return groove (38) is formed in the top wall of the heat dissipating device box (34), the bottom wall of the liquid return groove (38) is communicated with the top wall of the liquid storage cavity (35) through a second connecting channel (39), a connecting strip (42) is connected to the side wall of the transmission cavity (36) in a sliding mode, the upper end of the connecting strip (42) extends into the liquid storage cavity (35), a liquid pushing plate (41) is fixedly connected to the upper end of the connecting strip (42), a first wedge-shaped block (43) is fixedly connected to the lower end of the connecting strip (42), a sliding vane (45) is fixedly connected to the bottom wall of the transmission cavity (36), a second wedge-shaped block (44) and an extension rod (46) are fixedly connected to the top wall of the sliding vane (45), the upper end of the extension rod (46) penetrates through the first connecting channel (37) to extend to the upper side of the heat dissipating device box (34), a stress block (47) is fixedly connected to the upper end of the extension rod (46), a valve (48) is rotatably connected to the top wall of the liquid storage cavity (35), the valve (48) is fixedly connected to the top wall of the liquid storage cavity (35) through a second elastic piece (49) and the top wall of the liquid storage cavity (35), the valve (48) is located below the second connecting channel (39), a cooling pipe (40) is fixedly connected to the upper cooling device (40) to the upper cooling pipe (40) and the cooling pipe (40) is fixedly connected to the cooling pipe (3), one end of the cooling pipe (40) extends to the upper part of the liquid return groove (38);
The blanking mechanism comprises a chip storage box (20), the chip storage box (20) is fixedly connected to the top wall of the base (1), a storage cavity (21) is formed in the chip storage box (20), and the side wall of the storage cavity (21) is communicated with the bottom wall of the chip storage box (20) through a discharging channel (22);
the storage cavity (21) stacks more than two semiconductor chips (33), a push rod (23) is connected to the chip storage box (20) in a sliding manner, one end of the push rod (23) extends out of the chip storage box (20), a connecting sheet (24) is fixedly connected to the push rod (23), the connecting sheet (24) is connected with the outer side wall of the chip storage box (20) through a first elastic piece (25), a cleaning cylinder (26) is fixedly connected to the rear wall of the chip storage box (20), an air generating cavity (27) is formed in the cleaning cylinder (26), the air generating cavity (27) is communicated with the right wall of the cleaning cylinder (26), a piston (29) is connected to the air generating cavity (27) in a sliding manner, a piston rod (28) is fixedly connected to the piston (29), the piston rod (28) is fixedly connected with the connecting sheet (24), an air outlet pipe (30) communicated with the air generating cavity (27) is fixedly connected to the cleaning cylinder (26), and a guide pipe (31) is fixedly connected to the air outlet pipe (30).
The method comprises the steps that more than two semiconductor chips (33) are stacked in a storage cavity (21), a motor (3) is started, an output shaft of the motor (3) controls an elliptical part (4), a first rotating rod (18) and an eccentric wheel (19) to rotate, the eccentric wheel (19) rotates to push a push rod (23) to move left against the elastic force of a first elastic part (25), so that the lowest semiconductor chip (33) in the storage cavity (21) is pushed to enter a discharge channel (22), then the semiconductor chip (33) falls in the discharge channel (22) to the top wall of a processing table (2) under the action of self gravity, meanwhile, a connecting piece (24) moves left to drive a piston rod (28) and a piston (29) to move left, air in a gas generating cavity (27) is compressed to be sprayed onto other semiconductor chips (33) on the top wall of the processing table (2) from the air outlet pipe (30) and a guide pipe (31), impurities on the semiconductor chips (33) are blown away, and the elliptical part (4) rotates to drive a transmission bar (5) to enable a first sliding block (6) to reciprocate back and forth along a first sliding rail (14);
One of the transmission rods (8) moves towards the other transmission rod (8), namely, the two transmission rods (8) are close to each other, then the two transmission rods (8) move left at the same time, and then the two transmission rods (8) move right and reset at the same time of being far away from each other;
Finally, repeating the above actions for circulation, so that the plurality of semiconductor chips (33) on the top wall of the processing table (2) are clamped, transported leftwards for a certain distance and subjected to the reciprocating operation of unclamping, so that the semiconductor chips (33) are transported to the lower part of the laser printing device (17) one by one for laser printing, each semiconductor chip (33) stays below the laser printing device (17) for a period of time for printing, finally, the leftmost semiconductor chip (33) is clamped and transported to the guide plate (50) by the two clamping pieces (15), and the leftmost semiconductor chip (33) falls into the collecting box (51) along the guide plate (50) for storage;
When the eccentric wheel (19) rotates, the stress block (47) is pushed to move right so as to drive the extension rod (46), the sliding vane (45) and the second wedge block (44) to move right, so that the second wedge block (44) and the first wedge block (43) are propped against and then push the first wedge block (43) to move upwards, so that the connecting strip (42) and the liquid pushing plate (41) are driven to move upwards, the cooling liquid generates thrust to the valve (48) to keep blocking the second connecting channel (39), the cooling liquid in the liquid storage cavity (35) is pushed into the cooling pipe (40) by the liquid pushing plate (41), the flowing cooling liquid dissipates heat to the motor (3), the cooling liquid in the cooling pipe (40) falls into the liquid return groove (38), and when the eccentric wheel (19) is separated from and propped against the stress block (47), the liquid pushing plate (41), the connecting strip (42), the first wedge block (43) move downwards under the action of gravity of the cooling liquid in the cavity (35) to reset, so that the second wedge block (44), the sliding vane (45) and the cooling liquid in the cavity (35) are pushed by gravity, the elastic force of the cooling liquid in the liquid return groove (48) is overcome, so that the cooling liquid in the liquid return groove (38) enters the liquid storage cavity (35) for recycling, and when the eccentric wheel (19) pushes the stress block (47) to move right next time, the cooling and heat dissipation of the motor (3) are repeated by utilizing the principle, so that the motor (3) is prevented from being overheated and damaged, and the service life is prolonged.
2. The semiconductor packaging device with the heat dissipating device according to claim 1, wherein a third slide rail (12), a fourth slide rail (13) and a first slide rail (14) are fixedly connected to the top wall of the base (1), the third slide block (9) is slidably connected to the third slide rail (12), the fourth slide block (10) is slidably connected to the fourth slide rail (13), and the first slide block (6) is slidably connected to the first slide rail (14).
3. The semiconductor package apparatus with the heat sink according to claim 2, wherein the chip storage box (20) is fixedly connected to the top wall of the base (1) through a connecting column (32).
4. The semiconductor packaging device with the heat sink device according to claim 1, wherein the laser printing mechanism comprises a bracket (16) and a laser printing device (17), the bracket (16) is fixedly connected to the top wall of the base (1), and the laser printing device (17) is fixedly connected to the bracket (16).
5. A semiconductor package with a heat sink according to any one of claims 1-4, wherein the top wall of the base (1) is fixedly connected with a guide plate (50), the side wall of the base (1) is detachably connected with a collecting box (51), and the guide plate (50) extends to above the collecting box (51).
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