CN117699460B - Pick-up device for chip FT test - Google Patents
Pick-up device for chip FT test Download PDFInfo
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- CN117699460B CN117699460B CN202311780968.6A CN202311780968A CN117699460B CN 117699460 B CN117699460 B CN 117699460B CN 202311780968 A CN202311780968 A CN 202311780968A CN 117699460 B CN117699460 B CN 117699460B
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- 238000012360 testing method Methods 0.000 title claims abstract description 33
- 238000006073 displacement reaction Methods 0.000 claims abstract description 132
- 238000001179 sorption measurement Methods 0.000 claims description 31
- 238000000605 extraction Methods 0.000 claims description 22
- 238000007789 sealing Methods 0.000 claims description 15
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 10
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 10
- 241001330002 Bambuseae Species 0.000 claims description 10
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 10
- 239000011425 bamboo Substances 0.000 claims description 10
- 230000000712 assembly Effects 0.000 claims description 8
- 238000000429 assembly Methods 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 5
- 238000005265 energy consumption Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000013256 coordination polymer Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
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Abstract
The invention relates to a pickup device for chip FT test, which comprises a mounting frame and a plurality of vacuum suction nozzles, wherein a fixing cylinder is fixed on the mounting frame, a fixing disc with three electric telescopic rods is fixed on the fixing cylinder, a displacement disc is rotationally connected to the lower side surface of the fixing disc, a plurality of vacuum suction components communicated and fixed with the vacuum suction nozzles are arranged on the displacement disc, the vacuum suction components are communicated with the displacement disc, the vacuum suction components can rotate to the lower part of the electric telescopic rods, and the electric telescopic rods can push the vacuum suction components to suck and exhaust so as to realize the control of the suction fixation of the vacuum suction nozzles and chips; the invention has the advantage of reducing energy consumption.
Description
Technical Field
The invention belongs to the technical field of chip FT testing, and particularly relates to a pickup device for chip FT testing.
Background
The test of the chip is generally divided into a CP test and an FT test; the CP test is a test for the chip in the design stage, and is a test for the semi-finished product of the chip; the FT test is a test for the finished product of the chip by testing the packaging sheet after the integrated circuit chip is packaged into the finished product from the wafer so as to ensure the performance and quality of the finished product.
When the chip FT is tested, the chip to be tested needs to be transferred to the testing equipment in a vacuum adsorption mode, after the test is completed, the chip is moved to other equipment, but when the vacuum adsorption is carried out in the existing vacuum adsorption mode, air is required to be continuously extracted through the vacuumizing equipment, so that the stability of the vacuum adsorption is ensured, the air cannot be extracted in the picking process, and the whole energy consumption is increased.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a pickup device for chip FT test with reduced energy consumption.
The technical scheme of the invention is as follows:
The utility model provides a chip FT test is with pick-up device, includes mounting bracket and a plurality of vacuum suction nozzle, and the mounting bracket is fixed with a fixed section of thick bamboo, a fixed disk that has three electric telescopic handle is fixed to a fixed section of thick bamboo, the fixed disk downside rotates and is connected with the displacement dish, be provided with a plurality of vacuum adsorption components fixed with vacuum suction nozzle intercommunication displacement dish on the displacement dish, vacuum adsorption component can rotate to the below of electric telescopic handle and electric telescopic handle scalable promotion vacuum adsorption component inhales and exhausts to realize the fixed control of vacuum suction nozzle and chip's absorption;
The displacement disc is provided with a rotary drum which is rotationally connected inside the fixed drum, an external thread drum is connected inside the rotary drum through threads, the external thread drum is connected with a reset motor which can be adjusted in a lifting mode on the upper side face of the mounting frame, the rotary drum is connected with a driving assembly positioned on the mounting frame, the displacement disc is provided with a vacuum cavity communicated with the vacuum adsorption assembly, the lower part of the inner side of the vacuum cavity is in one-way conduction with an extraction cavity formed in the displacement disc, air in the extraction cavity cannot enter the vacuum cavity, a piston disc capable of moving up and down is arranged in the extraction cavity, the upper side face of the piston disc is fixed with the bottom of the external thread drum, the bottom and the top of the external thread drum are provided with exhaust holes, and the bottom of the extraction cavity is in one-way conduction with the lower side face of the displacement disc, so that the air in the lower part of the piston disc can be discharged;
The vacuum cavity is dynamically sealed with a negative pressure component positioned on the fixed cylinder.
Further, vacuum adsorption subassembly is including fixing the guide cylinder on the displacement dish and sealing the displacement bucket of grafting in the guide cylinder, the output shaft of electric telescopic handle passes the fixed disk and contradicts on the displacement bucket, displacement bucket lower extreme passes the displacement dish and extends to the below of displacement dish, the guide slot has been seted up to the guide cylinder, the displacement bucket is provided with the arch that is located the guide slot, and displacement bucket elasticity peg graft at the displacement dish, when displacement bucket moves up or moves down, protruding sliding along the guide slot to drive displacement bucket rotation, the guide cylinder has seted up with exhaust hole and suction hole, exhaust contact hole and suction contact hole have been seted up to the displacement bucket, exhaust hole and displacement dish lateral surface intercommunication, suction hole and vacuum chamber intercommunication, wherein when displacement bucket moves down to the half of maximum length that moves down, exhaust hole and exhaust contact hole move and communication, when displacement bucket moves down to the maximum length, suction contact hole and suction hole intercommunication when displacement bucket moves up, contact hole, suction hole and suction nozzle are not fixed at the suction nozzle down, the displacement intercommunication.
Further, the guide way includes at least a set of upper guide portion and the lower guide portion of upper guide portion intercommunication, the upper side of upper guide portion upper end and lower guide portion upper end intercommunication part is upper limit portion, the downside of lower guide portion lower extreme and upper guide portion lower extreme intercommunication part is lower limit portion, the another side of upper guide portion and lower guide portion intercommunication part is the corner, the corner all is located lower limit portion or the anticlockwise one side of upper limit portion, the arch can be followed upper guide portion, lower guide portion, upper limit portion, lower limit portion and corner and removed.
Further, the displacement barrel circumference side is provided with the lower clamping ring that can reciprocate in the displacement dish, lower clamping ring below is provided with the spacing ring that is located the displacement dish, the spacing ring is provided with the spring that contradicts with lower clamping ring.
Further, the unidirectional rotation subassembly that is located the displacement dish is provided with to the spacing ring below, unidirectional rotation direction of unidirectional rotation subassembly is clockwise, displacement bucket circumference side is vertical to be provided with the deflector of grafting on unidirectional rotation subassembly.
Further, the mounting bracket top is provided with the lifter plate, the lifter plate downside is fixed with a plurality of telescopic links, the lifter plate bottom is fixed with spacing subassembly, reset motor fixes on the lifter plate and reset motor's output shaft passes the lifter plate and connects at the external screw thread section of thick bamboo, the external screw thread section of thick bamboo rotates to be connected on the lifter plate, spacing subassembly side can interlock external screw thread section of thick bamboo to restrict external screw thread section of thick bamboo rotation.
Further, the upper end of the external thread cylinder stretches out of the rotary cylinder, the limiting assembly comprises a limiting telescopic rod fixed on the lifting plate and an engaging plate arranged on an output shaft of the limiting telescopic rod, the engaging plate is provided with limiting teeth, and the external thread cylinder is provided with engaging teeth engaged with the limiting teeth.
Further, the rotary drum upper end passes the mounting bracket and extends to the top of mounting bracket, and drive assembly is including fixing the driving motor on the mounting bracket and set up in driving motor epaxial drive gear, be provided with on the rotary drum with drive gear driven gear.
Further, the negative pressure assembly comprises a vacuum pump positioned on the fixed cylinder, a pressurizing ring positioned on the fixed disk and a rotary sealing ring positioned on the displacement disk, wherein the pressurizing ring is communicated with the vacuum pump, the pressurizing ring is dynamically sealed with the rotary sealing ring, and a third one-way valve communicated with the vacuum cavity is arranged in the rotary sealing ring.
Further, the fixed cylinder and the fixed disk are provided with pressurizing channels which are communicated, the pressurizing channels are communicated with the vacuum pump and the pressurizing ring, the displacement disk is provided with vacuum annular holes and exhaust annular holes which are vertically distributed, the vacuum annular holes and the exhaust annular holes are respectively communicated with the outer side surfaces of the vacuum cavity and the displacement disk, the guide cylinder passes through the vacuum annular holes and the exhaust annular holes in a sealing mode, and the air suction holes and the exhaust holes are respectively located in the vacuum annular holes and the exhaust annular holes.
Compared with the prior art, the invention has the beneficial effects that:
1. According to the invention, the displacement of the vacuum suction nozzle is regulated by realizing the rotary driving of the displacement disc through the driving component, and the piston gradually moves upwards and sucks air in the vacuum cavity when the displacement disc rotates through the limit of the external thread cylinder and the piston, so that the vacuum cavity can provide enough suction force for the vacuum suction nozzle, and extra electric energy is not required to be consumed, thereby reducing energy consumption;
2. The invention adopts the electric telescopic rod to realize the control of the suction and the exhaust of the vacuum suction assembly, is convenient for the control of the suction and the separation of the vacuum suction nozzle and the chip, and is convenient for pickup.
In summary, the invention has the advantage of reduced energy consumption.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic view showing the bottom structure of the displacement tray of FIG. 1 according to the present invention;
FIG. 3 is an enlarged schematic view of the portion A of FIG. 1 according to the present invention;
FIG. 4 is an enlarged schematic view of the portion B of FIG. 1 according to the present invention;
FIG. 5 is an enlarged schematic view of the portion C of FIG. 1 according to the present invention;
FIG. 6 is a schematic cross-sectional view of the guide cylinder of FIG. 1 according to the present invention;
fig. 7 is a schematic view illustrating a structure of the displacement barrel of fig. 1 according to the present invention.
In the figure, 1, a displacement disc, 101, a rotary seal ring, 102, a third one-way valve, 2, an extraction chamber, 3, a piston disc, 4, a first one-way valve, 5, a vacuum suction nozzle, 51, a limit ring, 52, a displacement barrel, 521, a guide plate, 522, an exhaust contact hole, 523, an intake contact hole, 524, a protrusion, 53, a one-way rotation assembly, 54, a spring, 55, a lower pressure ring, 56, an exhaust ring hole, 57, a vacuum ring hole, 58, a guide cylinder, 59, an upper guide part, 50, a lower limit part, 501, a corner part, 502, an exhaust hole, 503, an intake hole, 504, an upper limit part, 505, a lower guide part, 6, a second one-way valve, 7, a vacuum chamber, 9, an electric telescopic rod, 10, an external screw cylinder, 11, a rotary cylinder, 111, a driven gear, 12, a vacuum pump, 13, a mounting bracket, 14, a limit assembly, 141, a snap plate, 142, a limit telescopic rod, 15, a reset motor, 16, a lifting plate, 17, a telescopic rod, 18, a pressurizing channel, 19, a fixed cylinder, 20, a motor, a fixed cylinder, 201, a pressurizing ring, a driving ring, 21, a driving ring, a driving gear, a 231.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1-7, a pickup device for chip FT test comprises a mounting frame 13 and a plurality of vacuum suction nozzles 5, the number of the vacuum suction nozzles 5 is a multiple of three, a fixing cylinder 19 is fixed on the mounting frame 13, the fixing cylinder 19 fixes a fixing disc 20 with three electric telescopic rods 9, the fixing disc 20 and the fixing cylinder 19 are coaxially arranged, the three electric telescopic rods 9 are annularly fixed on the upper side surface of the fixing disc 20 by taking the axis of the fixing disc 20 as the center of a circle, the lower side surface of the fixing disc 20 is rotationally connected with a displacement disc 1, a plurality of vacuum adsorption assemblies communicated and fixed with the vacuum suction nozzles 5 are arranged on the displacement disc 1, the vacuum adsorption assemblies are communicated with the outer side surface of the displacement disc 1, the vacuum adsorption assemblies can rotate to the lower side of the electric telescopic rods 9, and the electric telescopic rods 9 can telescopically push the vacuum adsorption assemblies to suck and exhaust so as to realize the control of the adsorption fixation of the vacuum suction nozzles 5 and chips;
The displacement disc 1 is fixedly provided with a rotary drum 11, the rotary drum 11 passes through a fixed disc 20 and is rotationally connected inside a fixed drum 19, an external thread drum 10 is connected inside the rotary drum 11 through threads, the external thread drum 10 is provided with an exhaust channel 22, the external thread drum 10 is connected with a reset motor 15 which can be adjusted in a lifting manner on the upper side surface of a mounting frame 13, the rotary drum 11 is connected with a driving component positioned on the mounting frame 13, the displacement disc 1 is provided with a vacuum cavity 7 communicated with a vacuum adsorption component, the lower part of the inner side of the vacuum cavity 7 is in one-way conduction with an extraction cavity 2 arranged on the displacement disc 1, the vacuum cavity 7 and the extraction cavity 2 are in one-way conduction through a second one-way valve 6, air in the extraction cavity 2 cannot enter the vacuum cavity 7, a piston disc 3 capable of moving up and down is arranged in the extraction cavity 2, the upper side surface of the piston disc 3 is fixedly arranged with the bottom of the external thread drum 10, the bottom and the top of the external thread drum 10 are both provided with an air outlet hole 21, the exhaust channel 22 is communicated with the air outlet hole 21, the bottom of the extraction cavity 2 is in one-way conducted with the lower side surface of the displacement disc 1, the extraction cavity 2 and the displacement disc 1 are in one-way conducted by a first one-way valve 4, so that the air can be discharged out of the air below the piston disc 3;
The vacuum cavity 7 is dynamically sealed with a negative pressure component positioned on the fixed cylinder 19;
When the vacuum suction device is used, the negative pressure component extracts air in the vacuum cavity 7 to enable the vacuum cavity 7 to be in a negative pressure state, the driving component drives the displacement disc 1 to rotate through the rotary drum 11, at the moment, the external thread drum 10 and the piston disc 3 do not rotate, the piston disc 3 gradually moves upwards through the threaded connection of the external thread drum 10 and the rotary drum 11, at the moment, the air pressure of the extraction cavity 2 below the piston disc 3 gradually decreases until the air pressure of the extraction cavity 2 below the piston disc 3 is lower than the air pressure of the vacuum cavity 7, and then the air in the vacuum cavity 7 enters the extraction cavity 2 to ensure that the air pressure of the vacuum cavity 7 can enable the vacuum suction nozzle 5 to adsorb chips;
when the chip is required to be adsorbed, the displacement disc 1 drives the vacuum adsorption component and the vacuum suction nozzle 5 to move to the upper part of the chip, at the moment, the electric telescopic rod 9 stretches out to drive the vacuum adsorption component to be in an air suction state, the vacuum adsorption component adsorbs the chip through the vacuum suction nozzle 5, then the electric telescopic rod 9 resets, the vacuum adsorption component drives the chip to move upwards through the vacuum suction nozzle 5, the displacement disc 1 displaces, when the chip displaces to the upper part of the test equipment, the output shaft of the electric telescopic rod 9 stretches out to drive the vacuum adsorption component to process an air discharge state, at the moment, the chip falls onto the test equipment to carry out the test, and after the test is finished, the output shaft of the electric telescopic rod 9 is continuously controlled, so that the vacuum adsorption component is in the air suction state to suck the chip;
When the piston disc 3 moves to the uppermost part of the extraction cavity 2, the reset motor 15 drives the external thread cylinder 10 to rotate, wherein the rotation speed of the external thread cylinder 10 is higher than that of the displacement disc 1, so that the piston disc 3 can move downwards to the bottom of the extraction cavity 2, and air in the extraction cavity 2 is discharged from the first one-way valve 4;
the chip to be tested is transferred to the lower part of the vacuum suction nozzle 5 through a conveyor belt, so that the vacuum suction nozzle 5 can adsorb the chip, and the mounting frame 13 can be horizontally and vertically adjusted through the electric sliding rail and the like, so that the vacuum suction nozzle 5 can adsorb the chip and move the chip to the upper part of the testing equipment;
Preferably, the negative pressure generated by the upward movement of the piston disc 3 is less than or equal to the air pressure discharged by the vacuum adsorption assembly, so that the air pressure of the vacuum cavity 7 is unchanged or gradually increased, and then the negative pressure assembly can reduce the air pressure of the vacuum cavity 7 according to the pressure of the vacuum cavity 7.
In this embodiment, as shown in fig. 1, 3,6 and 7, the vacuum adsorption assembly includes a guide cylinder 58 fixed on the displacement disc 1 and a displacement barrel 52 inserted in the guide cylinder 58 in a sealing manner, and the sealing manner is the prior art, so the details are not repeated, the fixed disc 20 is provided with a hole for the electric telescopic rod 9 to pass through, the output shaft of the electric telescopic rod 9 passes through the hole on the fixed disc 20 and abuts against the displacement barrel 52, the lower side surface of the displacement disc 1 is provided with a hole for the displacement barrel 52 to pass through, the lower end of the displacement barrel 52 passes through the hole at the bottom of the displacement disc 1 and extends to the lower side of the displacement disc 1, the guide cylinder 58 is provided with a guide groove, the displacement barrel 52 is fixed with a protrusion 524 positioned in the guide groove, the displacement barrel 52 is elastically inserted in the displacement disc 1, when the displacement barrel 52 moves up or moves down, the bulge 524 slides along the guide groove to drive the displacement barrel 52 to rotate, the guide barrel 58 is provided with the exhaust hole 502 and the air suction hole 503, the displacement barrel 52 is provided with the exhaust contact hole 522 and the air suction contact hole 523, the exhaust hole 502 is communicated with the outer side surface of the displacement disk 1, the air suction hole 503 is communicated with the vacuum cavity 7, wherein when the displacement barrel 52 moves down to half of the maximum downward movement length, the exhaust hole 502 is in displacement correspondence and communication with the exhaust contact hole 522, when the displacement barrel 52 moves down to the maximum downward movement length, the air suction contact hole 523 is communicated with the air suction hole 503, and when the displacement barrel 52 moves up, the air suction contact hole 523, the air suction hole 503, the air exhaust hole 502 and the air suction contact hole 522 are not communicated, and the vacuum suction nozzle 5 is fixedly communicated at the lower end of the displacement barrel 52;
When the chip is required to be sucked, the electric telescopic rod 9 stretches out and pushes the displacement barrel 52 to move downwards to half of the maximum downwards moving length, at the moment, the exhaust hole 502 is communicated with the exhaust contact hole 522, air in the displacement barrel 52 is exhausted from the exhaust hole 502, the vacuum suction nozzle 5 is not used for sucking the chip, when the chip is required to be sucked by the vacuum suction nozzle 5, the electric telescopic rod 9 pushes the displacement barrel 52 to move downwards to the maximum downwards moving distance, at the moment, the suction hole 503 is communicated with the suction contact hole 523, the air in the displacement barrel 52 is sucked into the vacuum chamber 7, at the moment, the vacuum suction nozzle 5 is used for sucking the chip, after the vacuum suction nozzle 5 sucks the chip, the electric telescopic rod 9 is reset, at the moment, the displacement barrel 52 moves upwards, and the suction contact hole 523 and the exhaust contact hole 522 on the displacement barrel 52 can be communicated with the suction hole 503 or the exhaust hole 502 when the chip is required to be controlled to move downwards, and can not be communicated with the suction hole 503 or the exhaust hole 502 when the chip is upwards moved upwards, so that the suction is ensured to be sucked.
In this embodiment, as shown in fig. 6, the guide groove includes at least one set of upper guide parts 59 and lower guide parts 505 communicated with the upper guide parts 59, in this embodiment, two sets of upper guide parts 59 and lower guide parts 505 are staggered and communicated, as shown in fig. 6, the communicating part of the upper guide parts 59 and the lower guide parts 505 is a V-shaped corner, the V-shaped corner includes an upper side surface and a lower side surface, the upper side surface of the upper end communicating part of the upper guide parts 59 and the upper end communicating part of the lower guide parts 505 is an upper limit part 504, the lower side surface of the lower end communicating part of the lower guide parts 505 and the lower end communicating part of the upper guide parts 59 is a lower limit part 50, the other side surface of the communicating part of the upper guide parts 59 and the lower guide parts 505 is a corner part 501, the corner parts 501 are all located on the counterclockwise side of the lower limit part 50 or the upper limit part 504, and the protrusion 524 can move along the upper guide parts 59, the lower guide parts 505, the upper limit part 504, the lower limit part 50 and the corner part 501;
When the electric telescopic rod 9 pushes the displacement barrel 52 to move downwards, the bulge 524 moves along the lower guide part 505, in the moving process, the bulge 524 drives the displacement barrel 52 to rotate, and when the bulge 524 moves downwards to the lower limit part 50, the electric telescopic rod 9 moves upwards, at the moment, the displacement barrel 52 moves upwards elastically and drives the bulge 524 to abut on the corner part 501, and because the corner part 501 is positioned on the anticlockwise side of the lower limit part 50 or the upper limit part 504, the bottom of the bulge 524 moves on the clockwise side of the corner part 501 and continues to move along the upper guide part 59, and when the bulge 524 moves upwards to the upper limit part 504, the bulge 524 also abuts on the clockwise side of the corner part 501 and continues to move along the lower guide part 505 when the displacement barrel 52 moves downwards again, so that the displacement barrel 52 moves upwards and downwards.
In this embodiment, as shown in fig. 3 and 7, a lower pressing ring 55 capable of moving up and down on the displacement disc 1 is fixed on the circumferential side surface of the displacement barrel 52, a limiting ring 51 fixed on the displacement disc 1 is arranged below the lower pressing ring 55, and a spring 54 abutting against the lower pressing ring 55 is arranged on the limiting ring 51;
in use, the spring 54 realizes the elastic reset of the displacement barrel 52, and ensures the use.
In this embodiment, as shown in fig. 3 and 7, a unidirectional rotation component 53 on the fixed displacement disc 1 is disposed below the limiting ring 51, the unidirectional rotation component 53 may specifically adopt a ratchet pawl structure, the unidirectional rotation direction of the unidirectional rotation component 53 is clockwise, a slot is vertically formed on the ratchet pawl, and a guide plate 521 inserted in the slot of the unidirectional rotation component 53 is vertically fixed on the circumferential side of the displacement barrel 52;
in use, the displacement barrel 52 can only rotate clockwise through the ratchet and pawl structure, so that the displacement barrel 52 is prevented from moving upwards to reset along the lower guide part 505 after the displacement barrel 52 is pressed.
In this embodiment, as shown in fig. 1 and 5, a lifting plate 16 is disposed above the mounting frame 13, a plurality of telescopic rods 17 are fixed on the lower side surface of the lifting plate 16, a limiting component 14 is fixed on the bottom of the lifting plate 16, a reset motor 15 is fixed on the lifting plate 16, an output shaft of the reset motor 15 penetrates through the lifting plate 16 and is connected to the external thread cylinder 10, the external thread cylinder 10 is rotatably connected to the lifting plate 16, and the side surface of the limiting component 14 can engage with the external thread cylinder 10 to limit the rotation of the external thread cylinder 10;
When the lifting device is used, the rotation of the external thread cylinder 10 is secondarily limited through the limiting assembly 14, the external thread cylinder 10 is prevented from rotating along with the rotary cylinder 11, lifting adjustment of the mounting frame 13 is realized through the cooperation of the telescopic rod 17 and the lifting plate 16, and the use is guaranteed.
In this embodiment, as shown in fig. 5, the upper end of the external thread cylinder 10 extends out of the rotary cylinder 11, the limiting component 14 includes a limiting telescopic rod 142 fixed on the lifting plate 16 and a snapping plate 141 fixed on an output shaft of the limiting telescopic rod 142, the snapping plate 141 is integrally formed with limiting teeth, and the external thread cylinder 10 is integrally formed with snapping teeth snapped with the limiting teeth;
When in use, the rotation limit of the external thread cylinder 10 is realized through the cooperation of the biting plate 141 and the limit telescopic rod 142, and after the external thread cylinder 10 needs to be rotated and reset, the limit telescopic rod 142 drives the biting plate 141 not to be meshed with the external thread cylinder 10, so that the external thread cylinder 10 can rotate.
In this embodiment, as shown in fig. 1 and 5, the upper end of the rotary cylinder 11 extends above the mounting frame 13 through the mounting frame 13, the driving assembly includes a driving motor 23 fixed on the mounting frame 13, and a transmission gear 231 fixed on the rotation shaft of the driving motor 23, and a driven gear 111 driven by the transmission gear 231 is fixed on the rotary cylinder 11;
When in use, the driving motor 23 drives the transmission gear 231 to rotate, the transmission gear 231 drives the rotary drum 11 through the driven gear 111, and the rotary drum 11 drives the displacement disc 1 to rotate, so that the normal rotation of the displacement disc 1 is ensured.
In this embodiment, as shown in fig. 1 and 4, the negative pressure assembly includes a vacuum pump 12 located on a fixed cylinder 19, a pressurizing ring 201 fixed on a fixed disk 20, and a rotating sealing ring 101 fixed on a displacement disk 1, the pressurizing ring 201 is communicated with the vacuum pump 12, the pressurizing ring 201 is dynamically sealed with the rotating sealing ring 101, a through hole is formed in the rotating sealing ring 101, and a third one-way valve 102 communicated with the vacuum cavity 7 is fixed in the through hole;
When the vacuum pump 12 is used, the vacuum pump 12 is used for realizing air extraction of the vacuum cavity 7, so that the vacuum cavity 7 is always under negative pressure, and the third one-way valve 102 is used for preventing air from entering the vacuum cavity 7 from the vacuum pump 12 when the vacuum pump 12 is not in operation, so that the negative pressure of the vacuum cavity 7 is ensured.
In this embodiment, as shown in fig. 1 and 4, the fixed cylinder 19 and the fixed disk 20 are both provided with a pressurizing channel 18 which is communicated with each other, the pressurizing channel 18 is communicated with the vacuum pump 12 and the pressurizing ring 201, the displacement disk 1 is provided with a vacuum ring hole 57 and an exhaust ring hole 56 which are vertically arranged, the vacuum ring hole 57 and the exhaust ring hole 56 are respectively communicated with the vacuum cavity 7 and the outer side surface of the displacement disk 1, the displacement disk 1 is provided with a mounting hole which is communicated with the vacuum ring hole 57 and the exhaust ring hole 56, the guide cylinder 58 is inserted in the mounting hole and sealed by sealant, and the air suction hole 503 and the exhaust hole 502 are respectively positioned in the vacuum ring hole 57 and the exhaust ring hole 56;
When in use, the vacuum cavity 7 is communicated with the fixed cylinder 19 through the vacuum ring hole 57, the adsorption of the vacuum suction nozzle 5 is ensured, the communication between the vacuum suction nozzle 5 and the outer side of the displacement disc 1 is realized through discarding the ring hole, and the exhaust of the vacuum suction nozzle 5 is ensured.
Although the present invention has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present invention.
Claims (9)
1. The utility model provides a chip FT test is with pick-up device, includes mounting bracket and a plurality of vacuum suction nozzle, its characterized in that: the mounting frame is fixed with a fixed cylinder, the fixed cylinder is fixedly provided with a fixed disc with three electric telescopic rods, the lower side surface of the fixed disc is rotationally connected with a displacement disc, a plurality of vacuum adsorption assemblies which are fixedly communicated with the vacuum suction nozzle are arranged on the displacement disc, the vacuum adsorption assemblies are communicated with the displacement disc, the vacuum adsorption assemblies can rotate to the lower part of the electric telescopic rods, and the electric telescopic rods can stretch and push the vacuum adsorption assemblies to suck and exhaust so as to realize the control of the adsorption fixation of the vacuum suction nozzle and the chip;
The displacement disc is provided with a rotary drum which is rotationally connected inside the fixed drum, an external thread drum is connected inside the rotary drum through threads, the external thread drum is connected with a reset motor which can be adjusted in a lifting mode on the upper side face of the mounting frame, the rotary drum is connected with a driving assembly positioned on the mounting frame, the displacement disc is provided with a vacuum cavity communicated with the vacuum adsorption assembly, the lower part of the inner side of the vacuum cavity is in one-way conduction with an extraction cavity formed in the displacement disc, air in the extraction cavity cannot enter the vacuum cavity, a piston disc capable of moving up and down is arranged in the extraction cavity, the upper side face of the piston disc is fixed with the bottom of the external thread drum, the bottom and the top of the external thread drum are provided with air outlet holes, and the bottom of the extraction cavity is in one-way conduction with the lower side face of the displacement disc, so that the air in the lower part of the piston disc can be discharged;
the vacuum cavity is dynamically sealed with a negative pressure component positioned on the fixed cylinder;
The vacuum adsorption subassembly is including fixing the guide cylinder on the displacement dish and sealing the displacement bucket of grafting in the guide cylinder, the output shaft of electric telescopic handle passes the fixed disk and contradicts on the displacement bucket, displacement bucket lower extreme passes the displacement dish and extends to the below of displacement dish, the guide slot has been seted up to the guide cylinder, the displacement bucket is provided with the arch that is located the guide slot, and displacement bucket elasticity is pegged graft at the displacement dish, when displacement bucket moves up or moves down, protruding sliding along the guide slot to drive the displacement bucket and rotate, the guide cylinder has seted up with exhaust hole and suction hole, exhaust contact hole and suction contact hole have been seted up to the displacement bucket, the exhaust hole communicates with the displacement dish lateral surface, suction hole and vacuum chamber intercommunication, wherein when displacement bucket moves down to the half of maximum length that moves down, exhaust contact hole and suction hole intercommunication when displacement bucket moves up, contact hole, suction hole and suction nozzle are not fixed in the suction nozzle down, the displacement is moved.
2. The pickup device for chip FT test according to claim 1, characterized in that: the guide groove comprises at least one group of upper guide parts and lower guide parts communicated with the upper guide parts, the upper side surfaces of the upper end and the upper end communication parts of the upper guide parts are upper limit parts, the lower side surfaces of the lower end and the lower end communication parts of the upper guide parts are lower limit parts, the other side surfaces of the upper guide parts and the lower guide parts are corner parts, the corner parts are positioned on the anticlockwise sides of the lower limit parts or the upper limit parts, and the bulges can move along the upper guide parts, the lower guide parts, the upper limit parts, the lower limit parts and the corner parts.
3. A pick-up device for chip FT test as claimed in claim 2, characterized in that: the displacement barrel circumference side is provided with the lower clamping ring that can reciprocate in the displacement dish, lower clamping ring below is provided with the spacing ring that is located the displacement dish, the spacing ring is provided with the spring that contradicts with lower clamping ring.
4. A pick-up device for chip FT test as set forth in claim 3, wherein: the one-way rotating assembly is arranged below the limiting ring and positioned on the displacement disc, the one-way rotating direction of the one-way rotating assembly is clockwise, and the guide plate inserted on the one-way rotating assembly is vertically arranged on the circumferential side surface of the displacement barrel.
5. The pickup device for chip FT test of claim 4 wherein: the mounting bracket top is provided with the lifter plate, the lifter plate downside is fixed with a plurality of telescopic links, the lifter plate bottom is fixed with spacing subassembly, reset motor fixes on the lifter plate and reset motor's output shaft passes the lifter plate and connects at the external screw thread section of thick bamboo, the external screw thread section of thick bamboo rotates to be connected on the lifter plate, spacing subassembly side can interlock external screw thread section of thick bamboo to restrict external screw thread section of thick bamboo rotation.
6. The pickup device for chip FT test of claim 5 wherein: the upper end of the external thread cylinder extends out of the rotary cylinder, the limiting assembly comprises a limiting telescopic rod fixed on the lifting plate and an engaging plate arranged on an output shaft of the limiting telescopic rod, the engaging plate is provided with limiting teeth, and the external thread cylinder is provided with engaging teeth engaged with the limiting teeth.
7. The pickup device for chip FT test of claim 6 wherein: the rotary drum upper end passes the mounting bracket and extends to the top of mounting bracket, and drive assembly is including fixing the driving motor on the mounting bracket and set up in driving motor epaxial transmission gear, be provided with on the rotary drum with transmission gear driven gear.
8. The pickup device for chip FT test of claim 7 wherein: the negative pressure assembly comprises a vacuum pump positioned on the fixed cylinder, a pressurizing ring positioned on the fixed disk and a rotary sealing ring positioned on the displacement disk, wherein the pressurizing ring is communicated with the vacuum pump, the pressurizing ring is dynamically sealed with the rotary sealing ring, and a third one-way valve communicated with the vacuum cavity is arranged in the rotary sealing ring.
9. The pickup device for chip FT test of claim 8 wherein: the fixed cylinder and the fixed disk are respectively provided with a pressurizing channel which is communicated with each other, the pressurizing channels are communicated with the vacuum pump and the pressurizing ring, the displacement disk is provided with a vacuum annular hole and an exhaust annular hole which are vertically distributed, the vacuum annular hole and the exhaust annular hole are respectively communicated with the outer side surfaces of the vacuum cavity and the displacement disk, the guide cylinder passes through the vacuum annular hole and the exhaust annular hole in a sealing mode, and the air suction hole and the exhaust hole are respectively positioned in the vacuum annular hole and the exhaust annular hole.
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| CN202311780968.6A CN117699460B (en) | 2023-12-21 | 2023-12-21 | Pick-up device for chip FT test |
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| CN202311780968.6A CN117699460B (en) | 2023-12-21 | 2023-12-21 | Pick-up device for chip FT test |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111268345A (en) * | 2020-04-03 | 2020-06-12 | 河海大学常州校区 | Sucking disc grabbing device bleeds |
| CN213678844U (en) * | 2020-09-11 | 2021-07-13 | 天津振辉印刷设备有限公司 | Unloader of heat transfer machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0878884A (en) * | 1994-08-31 | 1996-03-22 | Toshiba Corp | Electronic parts vacuum-clamping nozzle |
| US6979032B2 (en) * | 2002-11-15 | 2005-12-27 | Fmc Technologies, Inc. | Vacuum pick-up head with vacuum supply valve |
| CN211768859U (en) * | 2020-03-03 | 2020-10-27 | 昆山龙腾光电股份有限公司 | Clamping device |
| CN218123375U (en) * | 2022-01-26 | 2022-12-23 | 江西维易尔半导体设备有限公司 | Wafer sucking disc for gluing developing machine |
| CN114933167A (en) * | 2022-04-27 | 2022-08-23 | 泉州兰姆达仪器设备有限公司 | Ejector pin mechanism of laser chip testing and sorting machine and working method thereof |
| CN218776617U (en) * | 2022-12-16 | 2023-03-31 | 西北农林科技大学 | Mechanical arm grabbing mechanism |
| CN116555736B (en) * | 2023-04-06 | 2023-11-14 | 中润新能源(徐州)有限公司 | Silicon wafer taking and placing device for graphite boat equipment |
| CN220179358U (en) * | 2023-07-03 | 2023-12-15 | 四川省华景光电科技有限公司 | Feeding and discharging mechanical arm for mobile phone glass display |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111268345A (en) * | 2020-04-03 | 2020-06-12 | 河海大学常州校区 | Sucking disc grabbing device bleeds |
| CN213678844U (en) * | 2020-09-11 | 2021-07-13 | 天津振辉印刷设备有限公司 | Unloader of heat transfer machine |
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