CN117665013A - Microstructure gas detector readout circuit structure and microstructure gas detector - Google Patents
Microstructure gas detector readout circuit structure and microstructure gas detector Download PDFInfo
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- CN117665013A CN117665013A CN202410133602.8A CN202410133602A CN117665013A CN 117665013 A CN117665013 A CN 117665013A CN 202410133602 A CN202410133602 A CN 202410133602A CN 117665013 A CN117665013 A CN 117665013A
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- 239000002184 metal Substances 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000011800 void material Substances 0.000 claims 1
- 238000007405 data analysis Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- HHXNVASVVVNNDG-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(2,3,6-trichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=C(Cl)C(Cl)=C(Cl)C=2Cl)Cl)=C1Cl HHXNVASVVVNNDG-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- JJWKPURADFRFRB-UHFFFAOYSA-N carbonyl sulfide Chemical compound O=C=S JJWKPURADFRFRB-UHFFFAOYSA-N 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Abstract
The invention discloses a microstructure gas detector reading circuit structure and a microstructure gas detector. The microstructure gas detector readout circuit structure comprises at least three core plates, wherein two metal layers are formed on two surfaces of each core plate to form six metal layers, and a Pad layer, a U-dimensional wire connecting layer, a first stratum, a V-dimensional wire connecting layer, a second stratum and a W-dimensional wire connecting layer are sequentially arranged from top to bottom; the Pad layer is provided with a plurality of read pads to form a read Pad array, and gaps are reserved between adjacent read pads; the center of the read Pad is provided with a via hole, the wires of the U-dimensional wire connecting layer, the V-dimensional wire connecting layer and the W-dimensional wire connecting layer are connected with the read Pad via hole to form a Pad read bar of the layer where the wires are positioned, and the wires are positioned at the positions corresponding to gaps among the read pads. The invention can realize the reading scheme of two-dimensional positioning and three-dimensional judgment, can realize multiple case judgment under high counting rate, and improves the quality and efficiency of data analysis.
Description
Technical Field
The invention relates to the technical field of microstructure gas detectors, in particular to a microstructure gas detector reading circuit structure and a microstructure gas detector.
Background
The microstructure gas detector (MPGD, micro-Pattern Gas Detector) has the advantages of high counting rate, flexible reading mode, good position resolution and the like, and plays a very important role in particle detection in the field of high-energy physics.
In the prior art, in order to achieve the result of hundred-micrometer position resolution, in combination with a fast pulse electronic readout system and a gravity center analysis method, the amplifying and readout parts of the microstructure gas detector are separated, so that the readout modes of the microstructure gas detector are various, including surface readout, strip readout, small cell Pad readout and the like, and the strip readout can be divided into whole strip readout, pad-connected strip readout and strip pixel readout. The surface reading is mainly performed by a resistive planar reading method, in which data is read from four corners of a plane, respectively, and then the position is located. This readout method is only suitable for the case of low count rate and low position resolution, but not for the case of higher count rate and high energy particle beam track measurement. The whole reading structure of the whole reading method is one-dimensional (the length of the strip is the same as the effective length of the microstructure gas detector, in millimeter magnitude), and one-dimensional is Pad connection (the spacing of the strip is in micrometer magnitude), so that the principle that the electron beam covers at least three strips under the gravity center reading method is realized. Because the two-dimensional resolution is slightly different due to the asymmetric distribution of the reading design, people slightly improve the two-dimensional resolution, and the two-dimensional reading bar structure symmetric distribution, namely the Pad connected bar reading, is realized by adopting a square Pad design rotated by 45 degrees. The read-out principle of the Pad-connected stripe read-out method is basically the same as that of the whole stripe read-out, but the effective area of the two-dimensional read-out is more easily equal, so that the two-dimensional resolution tends to be consistent, and the detector is more easily provided with the same level of performance (signal-to-noise ratio and distributed capacitance). The gas detector strip pixel readout method can be used as sampling type two-dimensional X-ray imaging, and can also be applied as a time projection room (TPC-Time Projection Chamber). The stripe pixel readout design is also in the order of micrometers in one dimension in order to meet at least three readout principles under the gravity center method; in the other dimension, the effective length of the detector is adapted to the centimeter magnitude, if the dimension is too small, the single strip is easy to be causedThe induced charge is too small, degrading the signal-to-noise ratio. The strip pixel reading can realize multi-point sampling of the track of the particle during the particle crossing, and simultaneously, the reconstruction of the particle track is realized by combining the time, physical information and other limiting conditions in the process. Pad readout has the advantage over area readout and stripe readout that resolution can be improved, resulting in a significant improvement in the resolution of multiple hit cases. Pad readout, however, requires a large number of electronics and for an identical detector, the strip readout board only needs to beRoad electronics, while Pad readout requiresRoad electronics. Excessive electronics are difficult to implement and expensive.
The current microstructure gas reading structure mainly adopts a two-dimensional strip reading method. However, due to the self-structure limitation of the two-dimensional bar reading, under the condition of multiple hits at a high counting rate, two or more case judgment and selection cannot be realized within the triggering time window of the same data acquisition. As the total count rate increases, the number of hits increases significantly, but in current case processing techniques, only such cases can be discarded. As shown in FIG. 1, four sets of position data are obtained simultaneously when two instances are driven into the position shown in FIG. 1 within an electronic read gate widthFour sets of paired data can be obtained:at this time, it will not be possible to determine whether the incident positions are A and B or C and D. In this case, the present case processing can be only performed by discarding.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a microstructure gas detector reading circuit structure and a microstructure gas detector. The micro-structure gas detector reading circuit structure is a three-dimensional reading circuit, and the three-dimensional reading circuit is combined with the micro-structure gas detector, so that a reading scheme of two-dimensional positioning and three-dimensional judgment can be realized, and multiple case judgment can be realized under high counting rate, thereby improving the quality and efficiency of data analysis.
The invention aims to provide a microstructure gas detector readout circuit structure which is a three-dimensional readout circuit structure and comprises at least three core plates, wherein two metal layers are formed on two surfaces of each core plate to form six metal layers, and the six metal layers are a Pad layer, a U-dimensional wire connecting layer, a first stratum, a V-dimensional wire connecting layer, a second stratum and a W-dimensional wire connecting layer in sequence from top to bottom; the Pad layer is provided with a plurality of read pads to form a read Pad array, and gaps are reserved between adjacent read pads; the center of the read Pad is provided with a via hole, the U-dimensional wire connecting layer, the V-dimensional wire connecting layer and the W-dimensional wire connecting layer are respectively provided with a layer of wires, the wires of each layer are connected with the via hole of the read Pad to form a Pad read strip of the layer, and the wires are positioned at the positions corresponding to gaps among the read pads.
Optionally, in the top view, among the three Pad readout strips in three dimensions under a single instance, the angle between adjacent Pad readout strips is。
Optionally, the number of Pad read bars responding in each dimension in a single instance isStrips, and are arranged parallel to each other.
Optionally, the shape of the read Pad is a regular hexagon, and the side length of the read Pad of the regular hexagon is 0.231mm.
Optionally, the gap spacing between adjacent read pads is 0.1mm, and the line width of the conductive line is set to be 0.1mm.
Optionally, the via hole in the middle of the read Pad is a circular via hole, and the diameter of the circular via hole is 0.2mm.
Optionally, the gap spacing between the via hole and the wire is 0.1mm.
Alternatively, the stripe-to-stripe center-to-center distance of the Pad readout stripe for each dimension is 0.75mm.
Optionally, copper is plated on the inner wall of the via hole, epoxy resin is filled in the via hole with copper on the inner wall, copper is plated on the surface of the epoxy resin again, and the surface of the read Pad is leveled with the surface of the PCB by grinding.
It is a further object of the present invention to provide a microstructured gas detector comprising a readout circuit structure of said microstructured gas detector.
The microstructure gas detector reading circuit structure is a three-dimensional Pad connecting bar reading structure, can realize a reading scheme of two-dimensional positioning and three-dimensional judgment, solves the problem that two-dimensional reading cannot simultaneously judge and select multiple hit cases, further improves the counting rate requirement which can be met by the microstructure gas detector, and effectively improves the case rate by effectively judging and selecting the multiple hit cases under the condition that the existing acquisition system is not changed.
Drawings
FIG. 1 is a schematic diagram of a prior art microstructure gas detector readout circuit for multiple hit positioning.
Fig. 2 is a schematic diagram of a three-dimensional position judgment principle of a microstructure gas detector readout circuit structure according to the present invention.
Fig. 3 is a 3D schematic diagram of the microstructure gas detector readout circuit structure of the invention.
FIG. 4 is a schematic diagram of a read Pad and wire layout for a microstructure gas detector read circuit structure of the present invention.
Fig. 5 is a schematic diagram of the wiring arrangement of the readout circuit structure of the microstructure gas detector of the present invention.
Fig. 6 is a schematic diagram of the dimensions of the readout circuit structure Pad and the lead arrangement of the microstructure gas detector of the present invention.
Fig. 7 is a schematic diagram of a detector constructed of the microstructure gas detector readout circuit structure of the present invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and the specific examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The reading circuit of the microstructure gas detector is improved based on two-dimensional Pad connecting strip reading, position judgment is carried out by adding position information of one dimension, and two-dimensional positioning and three-dimensional judgment are realized, so that a plurality of hit cases are not abandoned like two-dimensional strip reading, and too many electronic paths are not introduced like simple Pad reading, the counting rate and the position resolution of the detector are improved, the detection performance of the microstructure gas detector is improved, and the effective case rate and the position resolution of the microstructure gas detector are further improved.
In order to solve the problem of misjudgment of positions under multiple cases in FIG. 1, the invention improves the reading of two-dimensional Pad connecting strips, adds one dimension on the premise of two dimensions, judges and selects the incident positions of particles under multiple hit cases by using the position information of a third dimension as shown in FIG. 2, thereby realizing two-dimensional positioning and three-dimensional judgment, and simultaneously obtains six groups of position data when two cases are driven into the positions shown in FIG. 2 in one electronic reading gate width as shown in FIG. 2Two sets of paired data are obtained:at this time, the incident positions are determined to be A and B.
Based on this, the microstructure gas detector readout circuit structure designed and provided in the embodiment of the present invention, as shown in fig. 3, is a three-dimensional readout circuit structure, and includes at least three core boards, such as a first core board 70, a second core board 80, and a third core board 90, where two metal layers are formed on the upper and lower surfaces of each core board, so as to form six metal layers, and the six metal layers are sequentially a Pad layer 10, a U-dimensional wire connection layer 20, a first stratum 30, a V-dimensional wire connection layer 40, a second stratum 50, and a W-dimensional wire connection layer 60 from top to bottom; wherein, the Pad layer is provided with a plurality of read pads 120 to form a read Pad array, and gaps are reserved between adjacent read pads; the center of the read Pad is provided with a via hole, the U-dimensional wire connecting layer, the V-dimensional wire connecting layer and the W-dimensional wire connecting layer are respectively provided with a layer of wires 130, the wires 130 of each layer are connected with the via holes of the read Pad 120 to form Pad read strips of the layer, and the wires are positioned at positions corresponding to gaps among the read pads, as shown in fig. 4.
In this application, since the wires connecting the read Pad are placed on different layers (wires of the same dimension are on the same board layer), the connection between the wires and the read Pad needs to be achieved through the via hole. To reduce interference, a layer of ground (gnd) is placed between each two conductor layers to reduce line-to-line crosstalk, i.e., the first ground 40 and the second ground 50, which requires at least a six-layer structure, i.e., pad layers, U-dimensional conductor connection layers, ground layers, V-dimensional conductor connection layers, ground layers, W-dimensional conductor connection layers, respectively, from the first layer to the sixth layer.
Further, the first core board and the second core board are combined through the first Prepreg layer 100, and the second core board and the third core board are combined through the second Prepreg layer 110, so that the microstructure gas detector readout circuit structure of the invention is finally formed, as shown in fig. 3.
Optionally, in the top view, among the three Pad readout strips in three dimensions under a single instance, the angle between adjacent Pad readout strips isAs shown in fig. 5, the angles between the U-dimensional wire 131 and the V-dimensional wire 133, and between the V-dimensional wire 133 and the W-dimensional wire 132, and between the U-dimensional wire 131 and the W-dimensional wire 132 are 120 degrees.
Optionally, the number of Pad read bars responding in each dimension in a single instance isStrips and are arranged in parallel with each other, more preferably, the number of Pad readout strips responsive in each dimension in the single instance is 3, and the 3 Pad readout strips are arranged in parallel. In the application, the diameter of the via hole is selected to be 0.2mm, the bonding pad spacing is 0.1mm, and the safety spacing is 0.1mm, so that for strip reading, the single dimension can be realized in the processing technologyThe strip period (pitch) of the read-out strip is at least 0.5mm in size and is typically of the size of the electron flood widthWithin the range, therefore, it is preferable that the number n of responsive readout bars isIn the range of bars.
Optionally, in a more preferred example, in the present application, the size of the whole readout circuit structure of the designed microstructure gas detector is 50mm×50mm, the number of three-dimensional paths of u and V, W is 88 paths, 88 paths and 66 paths, respectively, the shape of the readout Pad is a regular hexagon, the side length of the readout Pad of the regular hexagon is 0.231mm, as shown in fig. 6, optionally, the gap spacing between adjacent readout pads is 0.1mm, and the line width of the wire is set to be 0.1mm. Optionally, the via hole in the middle of the read Pad is a circular via hole, and the diameter of the circular via hole is 0.2mm; optionally, the gap spacing between the via hole and the wire is 0.1mm. Alternatively, the stripe-to-stripe center-to-stripe spacing (i.e., stripe period pitch) of the Pad readout stripe for each dimension is 0.75mm.
In this application, in order to make the read-out pads with the same dimension be connected to form a strip, a via hole, preferably a circular hole, needs to be drilled in the middle of each read-out Pad, and the via holes are connected by wires, so that the read-out strips are formed in series.
In one embodiment, the inner wall of the via hole is plated with copper 122, the via hole after the inner wall is plated with copper is filled with epoxy resin 121, the surface of the epoxy resin is plated with copper again, and the surface of the read Pad is leveled with the surface of the PCB board by a grinding process, as shown in fig. 6. In the treatment process of the via hole, a layer of copper is plated on the cylindrical surface of the hole wall of the via hole by adopting a chemical deposition method, so that copper foils which need to be communicated in the middle layers can be connected. In this design, the via is used to connect the top Pad and the wires in the middle layers, so the hole in the middle of the via needs to be treated to avoid reducing the effective measurement area of the top Pad. Here, the present application adopts a method of "resin plugging, gold plating planarization treatment" to minimize the adverse factors brought by the via holes. After the processing of the via hole (after the copper plating of the hole wall of the via hole), epoxy resin is filled in the hole, and finally copper plating is performed on the surface of the resin, and the PCB plated with copper is subjected to plate grinding and leveling treatment.
Because the shrinkage change of the resin is small, the binding force with the hole wall is good. The end effect is that the hole is still conductive and the surface is free of dents, not affecting the measurement.
The micro-structure gas detector can be a gas electron multiplier (Gaseous Electron Multiplie, GEM) or a micro-grid structure gas detector (Micromesh Gaseous Structure, micromeGAS), and the micro-structure gas detector readout circuit can be a gas electron multiplier readout circuit or a micro-grid structure gas detector readout circuit.
It is a further object of the present invention to provide a microstructured gas detector comprising the microstructured gas detector readout circuit structure 500.
The structure of the microstructure gas detector to which the microstructure gas detector readout circuit structure 500 is applied will be described below using an electron multiplier as an example. In the gas electron multiplier, the microstructure gas detector readout circuitry is arranged below the three-layer cascade GEM film of the gas electron multiplier, and the effective readout surface of the microstructure gas detector readout circuitry is smaller than the area of the three-layer cascade GEM film.
In general, in a gas electron multiplier, the effective readout area of the readout board (PCB board) of the readout circuit structure is slightly smaller than the effective area of the electron multiplier 600 in order to obtain a relatively uniform electric field strength. Referring to fig. 7, in the present application, since the effective readout board area of the microstructured gas detector readout circuit structure 500 is 50mm×50mm, a gas electron multiplier having an effective area of 60mm×60mm is selected for use therewith.
Referring to fig. 7, in use, in order to obtain electronic signals, three-dimensional wires of the three-dimensional microstructure gas detector readout circuit structure need to be led out and connected to a preamplifier respectively to amplify and output signals, so that a socket 400 is mounted on a circuit board to adjust and plan the wires, and the wires are led out from the Pad readout portion.
Referring to fig. 7, three layers of cascaded GEM films and three-dimensional microstructured gas detector readout circuitry are required to be placed in a circular metal can 300 during measurement to shield electromagnetic noise, cosmic ray interference, and the like. Accordingly, the plurality of sockets 400 having no direct effect on the probe electrons are all distributed to the outside of the circular metal cap 300.
Referring to fig. 7, in order to fix the metal cover 300, a plurality of mounting holes 310 are symmetrically arranged, a plurality of sockets are symmetrically arranged on the outer side of the circular metal cover, and mounting holes 210 are distributed on four corners of the PCB 200 of the micro-structure gas detector readout circuit structure for fixing the PCB 200.
While the fundamental and principal features of the invention and advantages of the invention have been shown and described, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but may be embodied in other specific forms without departing from the spirit or essential characteristics thereof;
the present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (10)
1. The micro-structure gas detector reading circuit structure is characterized by comprising at least three core plates, wherein two metal layers are formed on two surfaces of each core plate to form six metal layers, and the six metal layers are a Pad layer, a U-dimensional wire connecting layer, a first stratum, a V-dimensional wire connecting layer, a second stratum and a W-dimensional wire connecting layer from top to bottom in sequence; the Pad layer is provided with a plurality of read pads to form a read Pad array, and gaps are reserved between adjacent read pads; the center of the read Pad is provided with a via hole, the U-dimensional wire connecting layer, the V-dimensional wire connecting layer and the W-dimensional wire connecting layer are respectively provided with a layer of wires, the wires of each layer are connected with the via hole of the read Pad to form a Pad read strip of the layer, and the wires are positioned at the positions corresponding to gaps among the read pads.
2. The microstructure gas detector readout circuit structure of claim 1, wherein in a top view, in three Pad readout strips in three dimensions in a single instance, the angle between adjacent Pad readout strips is。
3. The microstructure gas detector readout circuit structure of claim 1, wherein the number of Pad readout strips responding in each dimension in a single instance isStrips, and are arranged parallel to each other.
4. The microstructure gas detector readout circuit structure of claim 1, wherein the readout Pad is in the shape of a regular hexagon, and the side length of the readout Pad of the regular hexagon is 0.231mm.
5. The microstructure gas detector readout circuit structure of claim 4, wherein a gap spacing between adjacent readout pads is 0.1mm, and a line width of the conductive line is set to 0.1mm.
6. The microstructure gas detector readout circuit structure of claim 5, wherein the via holes in the middle of the readout Pad are circular via holes, and the diameter of the circular via holes is 0.2mm.
7. The microstructure gas detector readout circuit structure of claim 6, wherein a void spacing between the via and the wire is 0.1mm.
8. The microstructure gas detector readout circuit structure of claim 7, wherein the stripe-to-stripe center-to-center distance of the Pad readout stripe for each dimension is 0.75mm.
9. The microstructure gas detector readout circuit structure of claim 1, wherein the inner walls of the via holes are plated with copper, the inner wall plated copper via holes are filled with epoxy resin, the surface of the epoxy resin is plated with copper again, and the surface of the readout Pad is leveled with the surface of the PCB board by a grinding process.
10. A microstructured gas detector comprising a microstructured gas detector readout circuit arrangement according to any of the claims 1-9.
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| CN202410133602.8A CN117665013A (en) | 2024-01-31 | 2024-01-31 | Microstructure gas detector readout circuit structure and microstructure gas detector |
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