CN117637537A - Bonding failure regulation and control method, device and equipment for bonding wire equipment and storage medium - Google Patents
Bonding failure regulation and control method, device and equipment for bonding wire equipment and storage medium Download PDFInfo
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Abstract
The application discloses a bonding failure regulation and control method, a device, equipment and a storage medium of bonding wire equipment, wherein the bonding failure regulation and control method of the bonding wire equipment comprises the steps of detecting whether bonding points of the bonding wire equipment fail or not when the bonding wire equipment is detected to perform bonding treatment; if the bonding point of the bonding wire equipment is detected to be invalid, determining an invalidation type; determining a corresponding regulation strategy according to the failure type, and determining a failure reason according to the regulation strategy; and regulating and controlling the bonding of the bonding wire equipment according to the failure reason. According to the technical scheme, the bonding point failure is detected, and the failure reason is automatically detected, so that the bonding point failure is prevented from damaging functions during a semiconductor period.
Description
Technical Field
The present invention relates to the field of bonding wires, and in particular, to a method, an apparatus, a device, and a storage medium for controlling bonding failure of a bonding wire device.
Background
Bonding is an important step in the production of integrated circuits and is the operation of connecting the circuit chip to the leadframe. Bonding wires are tiny wire-in-leads used to electrically link input/output bond sites of an on-chip circuit to inner contact points of a leadframe when the semiconductor device and integrated circuit are assembled. And the quality of the bonding effect directly affects the performance of the integrated circuit. The bonding wire is one of five basic materials in the whole IC packaging material market, is an inner line material with excellent electrical appliance, heat conduction and mechanical properties and excellent chemical stability, and is an important structural material for manufacturing integrated circuits and discrete devices.
In the use process of the semiconductor device, as long as one bonding point is damaged, the semiconductor device is invalid, the semiconductor device is partially lost due to light weight, and the semiconductor device is completely lost due to serious weight. About 1/3 to 1/4 of the intrinsic failure of the semiconductor device is caused by wire bonding, so that it greatly affects the reliability of the semiconductor device for a long period of use.
Disclosure of Invention
The invention aims to provide a bonding failure regulation and control method, a device, equipment and a storage medium of bonding wire equipment, aiming at solving the technical problem of device function damage caused by bonding point failure.
Other features and advantages of the present application will be apparent from the following detailed description, or may be learned in part by the practice of the application.
According to one aspect of the embodiments of the present application, there is provided a bonding failure control method of a bonding wire device, including:
when detecting that bonding wire equipment is in bonding treatment, detecting whether a bonding point of the bonding wire equipment is invalid;
if the bonding point of the bonding wire equipment is detected to be invalid, determining an invalidation type;
determining a corresponding regulation strategy according to the failure type, and determining a failure reason according to the regulation strategy;
and regulating and controlling the bonding of the bonding wire equipment according to the failure reason.
Further, the detecting whether the bonding point of the bonding wire device fails includes:
detecting whether the bonding point is open or not to obtain a first detection result; and
detecting whether the bonding point is corroded or not to obtain a second detection result;
and if any one of the first detection result or the second detection result is characterized as the bonding point failure, determining that the bonding point of the bonding wire equipment fails.
Further, the detecting whether the bonding point is open includes:
Acquiring a first image of a bonding point of the current bonding wire equipment;
performing vibration treatment on bonding points of the bonding wire equipment, and acquiring a second image of the bonding points of the bonding wire equipment in the vibration treatment process and a third image of the bonding points of the bonding wire equipment after the vibration treatment;
and comparing the first image, the second image and the third image with a first reference image respectively, and determining whether the bonding point is open or not based on a comparison result.
Further, the detecting whether the bond point is corroded includes:
acquiring humidity information of a cavity corresponding to the bonding point, and determining a humidity result according to the humidity information; and
acquiring a fourth image of at least one frame of bonding points, and counting white pixel information of the fourth image;
determining whether a humidity phenomenon occurs in the cavity according to the humidity result, and comparing the white pixel information with reference white pixel information of a second reference image;
and if the humidity phenomenon occurs in the cavity and the white pixel information is larger than the reference white pixel information, determining that the bonding point is corroded.
Further, the determining a corresponding regulation strategy according to the failure type includes:
If the failure type is a first failure type, determining that the regulation strategy is a first regulation strategy for a bonding process, wherein the first failure type represents the bonding point open circuit;
and if the failure type is a second failure type, determining the regulation strategy as a second regulation strategy aiming at the bonding point packaging air tightness, wherein the second failure type represents that the bonding point is corroded.
Further, the determining the failure reason according to the regulation strategy includes:
if the regulation strategy is a first regulation strategy, detecting the welding disc flatness parameter, welding time and welding pressure of the bonding equipment;
determining a pad leveling result according to the pad leveling parameter; calculating a welding time range according to the welding time, and matching the welding time with the welding time range to obtain a time matching result; calculating a welding pressure average value according to the welding pressure, and matching the welding pressure average value with a welding pressure threshold value to obtain a pressure matching result;
and determining the failure reason according to the bonding pad leveling result, the time matching result and the pressure matching result.
Further, the determining the failure reason according to the regulation strategy includes:
If the regulation strategy is a second regulation strategy, acquiring a first packaging image before packaging the bonding point and a second packaging image after packaging;
identifying color composition information in the first and second encapsulated images;
and determining the failure reason according to the color composition information.
According to an aspect of the embodiments of the present application, there is provided a bonding failure control device of a bonding wire apparatus, including:
the detection module is configured to detect whether a bonding point of the bonding wire equipment is invalid when the bonding wire equipment is detected to perform bonding treatment;
the determining module is configured to determine a failure type if the bonding point of the bonding wire equipment is detected to be invalid;
the second determining module is configured to determine a corresponding regulation strategy according to the failure type and determine a failure reason according to the regulation strategy;
and the regulation and control module is configured to regulate and control the bonding of the bonding wire equipment according to the failure reason.
According to an aspect of an embodiment of the present application, there is provided an electronic device including: one or more processors; and the storage device is used for storing one or more programs, and when the one or more programs are executed by the one or more processors, the electronic equipment realizes the bonding failure regulation method of the bonding wire equipment.
According to an aspect of embodiments of the present application, there is provided a computer-readable storage medium having stored thereon computer-readable instructions, which when executed by a processor of a computer, cause the computer to perform a bonding failure regulation method of a bonding wire device as described above.
According to an aspect of embodiments of the present application, there is provided a computer program product or computer program comprising computer instructions stored in a computer readable storage medium. The processor of the computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device performs the bonding failure regulation method of the bonding wire device provided in the above-described various alternative embodiments.
In the technical scheme provided by the embodiment of the application, when bonding wire equipment is detected to perform bonding treatment, whether bonding points of the bonding wire equipment fail or not is detected, after the bonding points of the bonding wire equipment fail, the failure type is determined, and then a corresponding regulation and control strategy is determined according to the failure type, so that failure reasons are determined according to the regulation and control strategy, and finally, bonding of the bonding wire equipment is regulated and controlled according to the reasons. Through the technical scheme that this application provided, realize the detection to the bonding point inefficacy, detect the inefficacy reason simultaneously automatically to targeted regulation and control avoids the bonding point inefficacy and causes the damage of function during the semiconductor.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application. It is apparent that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art. In the drawings:
FIG. 1 is a block diagram of a bond failure regulation system of a bond wire apparatus in accordance with the present application;
FIG. 2 is a flow chart of a method of bond failure regulation of a bonding wire apparatus according to the present application;
FIG. 3 is a flow chart of step S210 in one embodiment of the present application;
FIG. 4 is a flow chart of step S310 in one embodiment of the present application;
FIG. 5 is a flow chart of step S320 in one embodiment of the present application;
FIG. 6 is a flow chart of step S230 in one embodiment of the present application;
FIG. 7 is a flow chart of step S230 in one embodiment of the present application;
FIG. 8 is a flow chart of step S230 in one embodiment of the present application;
FIG. 9 is a block diagram of a bond failure control device of a bonding wire apparatus according to the present application;
fig. 10 shows a schematic diagram of a computer system suitable for use in implementing the electronic device of the embodiments of the present application.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present application as detailed in the accompanying claims.
The block diagrams depicted in the figures are merely functional entities and do not necessarily correspond to physically separate entities. That is, the functional entities may be implemented in software, or in one or more hardware modules or integrated circuits, or in different networks and/or processor devices and/or microcontroller devices.
The flow diagrams depicted in the figures are exemplary only, and do not necessarily include all of the elements and operations/steps, nor must they be performed in the order described. For example, some operations/steps may be decomposed, and some operations/steps may be combined or partially combined, so that the order of actual execution may be changed according to actual situations.
Also to be described is: reference to "a plurality" in this application means two or more than two. "and/or" describes an association relationship of an association object, meaning that there may be three relationships, e.g., a and/or B may represent: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship.
The bonding wire is a micro-wire inner lead for electrically connecting an input/output bonding point of an on-chip circuit and an inner contact point of a lead frame when the semiconductor device and the integrated circuit are assembled. The main types of bonding wires at present are gold wires, silver wires, copper wires, saw-plated copper wires and the like. The bonding wire has higher stability and reliability, and is still favored by the high-end market.
The reasons for bond failure are numerous, some related to the device bonding process and some related to the packaging of the device. Thus, referring to fig. 1, an embodiment of the present application provides a bonding failure control system of a bonding wire device, where the system includes a bonding failure detection module, a bonding process detection module, a bonding air tightness detection module, and a bonding failure feedback module, and related descriptions of the modules are as follows:
the bonding failure detection module is used for detecting whether bonding points fail or not, and comprises a bonding open circuit detection sub-module and a bonding point corrosion detection sub-module, and the related description of each sub-module is as follows:
the main reasons of bonding failure are that the bonding points are open, the bonding points are deformed, the edges are extremely thin and have obvious cracking phenomenon, the bonding points are not firmly pressed, the fusion area between bonding wires and bonding pads is small, and when the bonding points are subjected to mechanical impact force or temperature stress, the bonding points are easily separated from the bonding pads, and the bonding points are open and fail.
When the bonding wire equipment is detected to carry out bonding treatment, a bonding failure detection module is started, and the bonding failure detection module starts a bonding open circuit detection sub-module and a bonding point corrosion detection sub-module. The bonding open circuit detection submodule calls an electromagnetic vibrator, the electromagnetic vibrator vibrates the bonding alloy wire equipment, the phenomenon of open circuit which causes bonding point failure is amplified through the vibration treatment, for example, the bonding point failure is caused by deformation of the bonding point, when the edge is thinned and a crack phenomenon occurs, the cracking phenomenon can be increased through the vibration treatment, and if the bonding point and the lattice are not influenced by the vibration treatment, the open circuit phenomenon is caused. And the bonding open circuit detection sub-module simultaneously calls an industrial high-precision camera cmos camera to acquire images of bonding points of the bonding wire equipment. The bonding open detection sub-module is specifically implemented as follows:
The electromagnetic vibrator starts a weak vibration mode for three minutes, at the same time, the cmos camera is used for shooting images of bonding points of the bonding equipment, the cmos camera records a first image of the bonding points when the electromagnetic vibrator is not started in the weak vibration mode, records a second image of the bonding points after the electromagnetic vibrator is started for 90 seconds, and records a third image of the bonding points after the vibration treatment of the electromagnetic vibrator is finished. And calling a first reference image of the bonding point under normal conditions from the cloud, and comparing the first image, the second image and the third image with the first reference image to obtain a comparison result. The comparison result can be divided into a normal phenomenon, a bonding point fracture phenomenon and a bonding point and bonding pad separation phenomenon, wherein the bonding point fracture phenomenon and the bonding point and bonding pad separation phenomenon can be characterized as bonding point failure, and the comparison result is returned and recorded in a memory.
The bonding point failure can be caused by packaging reasons, mainly due to the fact that the moisture content in the cavity of the device is high and corrosive elements are contained, the bonding point is corroded and fails, and the moisture in the cavity of the device is caused by disqualification of the air tightness of the bonding packaging.
The bonding point corrosion detection sub-module calls the humidity sensor and calls the cmos camera to monitor the bonding point, and the specific implementation flow is as follows: the bonding point corrosion detection submodule calls a humidity sensor to monitor the humidity in the cavity of the device in real time, and then judges according to the humidity in the cavity of the device. Under normal conditions, the humidity inside the cavity of the device is close to 0, and if the humidity value appears in the humidity sensor, the humidity sensor indicates that water vapor possibly appears in the cavity of the device, so that the humidity inside the cavity can be divided into a humidity-free phenomenon and a humidity phenomenon according to the humidity inside the cavity. The bonding point corrosion detection submodule simultaneously calls a cmos camera to monitor the internal bonding point, and the cmos camera acquires at least one frame of fourth image of the bonding point, and particularly can acquire three frames of fourth images. And the bonding point corrosion detection sub-module acquires a second reference image of the bonding point which is not corroded under normal conditions from the cloud, compares the acquired three frames of images with the second reference image, specifically counts the white pixel information of the fourth image, compares the white pixel information of the fourth image with the reference white pixel information of the second reference image, and the white pixel information is the number of the white pixels in the image. If the humidity phenomenon occurs in the cavity and the white pixel information of the fourth image is more than the reference white pixel information of the second reference image, judging that the bonding point is corroded and the bonding point is invalid, and returning and recording the result in the memory.
The bonding process is one of the reasons for bonding failure, the bonding tool is very important for bonding, if the bonding tool is damaged or worn, the bonding failure can be directly caused, the welding time and the welding pressure are also one of the important factors for whether the bonding is successful or not, wherein the process mainly causing the bonding failure is a welding process, the main bonding process of the bonding alloy wire adopts hot press welding, and the bonding mode is spherical bonding. Thus, the bonding process detection module is turned on upon detecting a first failure type due to the bond point opening. The bonding process detection module is used for detecting the flatness parameters, the welding time and the welding pressure of the bonding pads.
Before bonding wires are welded, a bonding process detection module calls a cmos camera to shoot, the cmos camera acquires a front image of a bonding pad from the front surface of the bonding pad, acquires a side image of the bonding pad from the side surface, analyzes the flatness of the bonding pad according to the acquired front image of the bonding pad and the side image of the bonding pad, specifically, performs image cutting on the front image of the bonding pad, equally divides the front image of the bonding pad into 4 sub-images, marks the sub-images as a region 1, a region 2, a region 3 and a region 4, and performs gray analysis on pixels of the 4 sub-images, after gray analysis, if the bonding pad part has a convex condition, white pixels of the convex part are more, and if the bonding pad part has a concave condition, black pixels of the concave part are more. The system records this data in memory, with the black pixel of region 1 denoted as X1, the black pixel of region 2 denoted as X2, the black pixel of region 3 denoted as X3, the black pixel of region 4 denoted as X4.
The pad side image is divided into 2 sub-images, namely, a sub-image A and a sub-image B, wherein the sub-image A corresponds to a region 1 and a region 2 of the pad front image, the sub-image B corresponds to a region 3 and a region 4 of the pad front image, the pad thickness analysis is carried out according to the sub-images A and B, the pad thickness represented in the image A is represented as H1, the pad thickness represented in the image B is represented as H2, and the data are recorded in a memory.
And determining that the land leveling result is larger than H2 according to the land leveling parameters H1, H2, X1, X2, X3 and X4, if H1 is smaller than X3, or X1 is smaller than X4, or X2 is smaller than X3, or X2 is smaller than X4, judging that the area 1 and the area 2 in the front image of the land are raised, if H1 is smaller than H2, and X1 is larger than X3, or X1 is larger than X4, or X2 is larger than X3, or X2 is larger than X4, judging that the area 3 and the area 4 in the front image of the land are raised, if H1=H2, and X1, X2, X3 and X4 are equal, judging that the land leveling result is that the land is uneven, otherwise, sending a notification to inform that the land needs to be replaced.
After the bonding process detection module starts bonding, a timer is started to count, after the bonding is finished, the timer is controlled to count, a plurality of bonding processes can be synchronously monitored, and time data recorded by the timer and bonding numbers are recorded in a memory. And (3) calling the time data to calculate a time average value t, comparing the respective time data with the time average value t, and if the value of the time data is in the range of t-10%t to t+10%t, marking the welding time as normal, and if the value of the time data is not in the range of the value, marking the welding time as abnormal.
After the bonding process detection module starts bonding, a piezoresistive pressure sensor is started to monitor pressure change in the bonding process, and the piezoresistive pressure sensor monitors pressure between a pressure head and a bonding wire to be tested. The specific implementation process is as follows: when the pressure head descends, the piezoresistance pressure sensor records the current pressure value Y1, the solder balls are locked at the center of the end part, the bonding wire forms a first connection point on the bonding pad under the action of pressure and temperature, meanwhile, the piezoresistance pressure sensor records the current pressure value Y2, the pressure head starts to ascend, the pressure head starts to move to a second bonding point to form an arc shape, the piezoresistance pressure sensor records the current pressure value Y3, the bonding wire forms a second connection point on the bonding pad under the action of pressure and temperature, the piezoresistance pressure sensor records the current pressure value Y4, the pressure head ascends to a certain position, the tail wire is sent out, the pressure head clamps the lead wire, the tail wire is broken, the piezoresistance pressure sensor records the current pressure value Y5, the pressure head ignites an arc to form the solder balls, and the next bonding cycle is entered. And calling the 5 pressure values to calculate a pressure average value Y, comparing the pressure average value Y with a welding pressure threshold value set by the pressure head, and if the pressure average value is smaller than the pressure threshold value, marking the pressure as too small, and if the pressure average value is larger than the pressure threshold value, marking the pressure as too large.
The packaging air tightness of the bonding point greatly influences the bonding performance, if water vapor in the cavity of the device corrodes metal, the water vapor is further burnt out and fused under the action of electric stress, and an open circuit phenomenon is caused, so that the situation of bonding failure is caused, and the packaging air tightness of the bonding point is very important. Thus, the bond hermeticity detection module is activated upon a second failure type based on bond point failure caused by the bond point being corroded.
And when the bonding air tightness detection module is used for packaging the bonding points by the bonding wires, calling the cmo camera to monitor the packaging process of the bonding points. And calling the cmos camera to acquire a first encapsulated image before encapsulation, calling the cmos camera again to acquire a second encapsulated image after encapsulation is completed, acquiring color composition information of the first encapsulated image and the second encapsulated image based on image identification, and performing image analysis according to the color composition information of the first encapsulated image and the second encapsulated image. The bonding wire is generally encapsulated by a metal, has a corresponding color, is generally copper metal because of lower cost of copper-gold wires, is red at normal temperature, and has a corresponding color, such as yellow when bonding wires are bonding alloy wires. Thus, the bond points in the first package image before packaging are yellow pixels, while the positions in the second package image where the package is complete are not yellow pixels, should be red pixels. And according to the color composition information of the first packaging image and the second packaging image, preliminarily judging whether the packaging tightness of the bonding points is good or not, storing the result in a memory, calling a tightness detector to detect the packaging tightness of the bonding points after the preliminary judgment is finished, judging whether the packaging tightness is good or bad according to the image analysis result, and re-packaging the materials with bad tightness by the system.
And the bonding failure feedback module acquires the data in the bonding failure detection module, the bonding process detection module and the bonding air tightness detection module from the memory, completes statistics and display of the data, and feeds back the statistics data.
Fig. 2 is a flow chart illustrating a bond failure regulation method of a bond wire apparatus, according to an exemplary embodiment. The method can be applied to the system shown in fig. 1, and is specifically executed by a bonding failure control system of bonding wire equipment in the environment of the embodiment shown in fig. 1.
As shown in fig. 2, in an exemplary embodiment, the bonding failure control method of the bonding wire device may include steps S210 to S240, which are described in detail as follows:
step S210, when detecting that bonding wire equipment is in bonding treatment, detecting whether a bonding point of the bonding wire equipment is invalid.
In the embodiment of the application, when the bonding wire device is detected to perform bonding processing, whether the bonding point formed by the bonding wire device is invalid or not is detected.
Step S220, if the bonding point failure of the bonding wire device is detected, determining a failure type.
In the embodiment of the application, after the bonding point failure of the bonding wire device is detected, the failure type is determined, wherein the failure type comprises a first failure type based on the bonding point open circuit and a second failure type based on the bonding point corroded.
Step S230, corresponding regulation strategies are determined according to the failure types, and failure reasons are determined according to the regulation strategies.
In the embodiment of the application, different failure types have different regulation and control strategies, corresponding regulation and control strategies are determined according to the determined failure types, and the failure reasons are determined according to the regulation and control strategies without any need. The quality of the bonding process is one of reasons for bonding failure, a bonding tool is very important for bonding, and meanwhile, the welding time and the welding pressure are also one of important factors for whether bonding is successful or not, and the corresponding failure reasons are determined according to the regulation strategy without the need of the bonding.
And step S240, regulating and controlling the bonding of the bonding wire equipment according to the failure reason.
In the embodiment of the application, the bonding of the bonding wire device is regulated and controlled according to the failure reason, if the failure reason is caused by the bonding tool, the bonding tool is correspondingly regulated and controlled.
In the embodiment of the application, when bonding wire equipment is detected to perform bonding treatment, whether bonding points of the bonding wire equipment fail or not is detected, after the bonding points of the bonding wire equipment fail, the failure type is determined, and then a corresponding regulation and control strategy is determined according to the failure type, so that failure reasons are determined according to the regulation and control strategy, and finally, bonding of the bonding wire equipment is regulated and controlled according to the reasons. Through the technical scheme that this application provided, realize the detection to the bonding point inefficacy, detect the inefficacy reason simultaneously automatically to targeted regulation and control avoids the bonding point inefficacy and causes the damage of function during the semiconductor.
In an exemplary embodiment of the present application, please refer to fig. 3, in step S210, the detecting whether the bonding point of the bonding wire device is invalid includes steps S310 to S330, which are described in detail as follows:
step S310, detecting whether the bonding point is open, to obtain a first detection result.
In this embodiment, the bonding failure may be a situation that the bonding point has an open circuit, so that whether the bonding point is open circuit is detected, and a first detection result is obtained, where the first detection result includes a normal bonding point and a bonding point failure, and the bonding point failure may be caused by a breakage of the bonding point or a separation of the bonding point and the bonding pad.
Step S320, detecting whether the bonding point is corroded, to obtain a second detection result.
In this embodiment, the bonding point is corroded, which is also one of the reasons for bonding point failure, so when detecting whether the bonding point fails, it is detected whether the bonding point is corroded, and a second detection result is obtained, where the second detection result also includes that the bonding point is normal and the bonding point fails.
Step S330, if either the first detection result or the second detection result is characterized as a bond point failure, determining that the bond point of the bonding wire device fails.
In this embodiment of the present application, whether the bonding point fails is determined according to the first detection result and the second detection result, and specifically, when any one of the first detection result and the second detection result is the bonding point failure, the bonding point failure may be determined.
In an exemplary embodiment of the present application, please refer to fig. 4, in step S310, the detecting whether the bonding point is open includes steps S410 to S430, which are described in detail as follows:
step S410, acquiring a first image of a bonding point of the current bonding wire device.
In the embodiment of the application, a first image of a bonding point of a bonding wire device at a current moment is acquired.
And step S420, performing vibration processing on the bonding points of the bonding wire equipment, and acquiring a second image of the bonding points of the bonding wire equipment in the vibration processing process and a third image of the bonding points of the bonding wire equipment after the vibration processing.
In this embodiment of the application, vibration treatment is carried out to the bond point of bonding wire equipment, and vibration treatment can be carried out through electromagnetic vibrator, and electromagnetic vibrator opens weak vibration mode, and the start time can be set to 3 minutes, realizes the vibration treatment to the bond point. Meanwhile, a second image of the bonding point of the bonding wire device in the vibration processing process is acquired, specifically, the second image can be acquired after the electromagnetic vibrator 90s is started, and the second image can also be acquired at any time during the starting of the vibration processing. And finally, acquiring a third image of the bonding point of the bonding wire equipment after the vibration treatment.
And step S430, comparing the first image, the second image and the third image with a first reference image respectively, and determining whether the bonding point is open or not based on the comparison result.
In the embodiment of the application, whether the bonding point is open or not is detected according to the first image, the second image and the third image, specifically, the first reference image of the bonding point under the normal condition is called from the cloud, and the first image, the second image and the third image are respectively compared with the first reference image to obtain a comparison result. The comparison result can be divided into a normal phenomenon, a bonding point fracture phenomenon and a bonding point and bonding pad separation phenomenon, wherein the bonding point fracture phenomenon and the bonding point and bonding pad separation phenomenon can be characterized as bonding point failure (namely bonding point open circuit), and the normal phenomenon indicates that the bonding point is normal.
In an exemplary embodiment of the present application, referring to fig. 5, in step S320, the detecting whether the bonding point is corroded includes steps S510 to S540, which are described in detail as follows:
step S510, acquiring humidity information of the cavity corresponding to the bonding point, and determining a humidity result according to the humidity information.
In this embodiment of the application, acquire the humidity information of the cavity that the bond point corresponds through humidity sensor, go to confirm humidity result according to humidity information, the inside humidity of cavity of specific device is close 0, if humidity sensor appears humidity numerical value, then indicate that the cavity of device probably appears steam, the humidity result of this moment is humidity phenomenon.
Step S520, acquiring a fourth image of at least one frame of the bonding point, and counting white pixel information of the fourth image.
In this embodiment of the present application, a fourth image of at least one frame bonding point is obtained, and white pixel information of the fourth image is counted.
And step S530, determining whether humidity phenomenon occurs in the cavity according to the humidity result, and comparing the white pixel information with the reference white pixel information of the second reference image.
In this embodiment of the present application, if the humidity result represents that other values other than 0 appear in the humidity information obtained based on the humidity sensor, the humidity phenomenon in the cavity may be determined, otherwise, the humidity phenomenon is not present. And comparing the white pixel information of the fourth image with the reference white pixel information of the second reference image, wherein the white pixel information is the number of white pixels in the image.
Step S540, if the humidity phenomenon occurs in the cavity and the white pixel information is greater than the reference white pixel information, determining that the bonding point is corroded.
In the embodiment of the application, whether the bonding point is corroded is comprehensively determined according to the humidity result and the white pixel information. Specifically, if the humidity phenomenon occurs in the cavity and the white pixel information of the fourth image is more than the white pixel information of the second reference image, it is determined that the bonding point is corroded, and it is determined that the bonding point is invalid, otherwise, the bonding point is normal.
In an exemplary embodiment of the present application, please refer to fig. 6, in step S230, the determining the corresponding regulation policy according to the failure type includes steps S610 to S620, which are described in detail below:
in step S610, if the failure type is a first failure type, the regulation policy is determined to be a first regulation policy for the bonding process, where the first failure type characterizes the open circuit of the bonding point.
In this embodiment, if the failure type is a first failure type based on a bond point open circuit, determining that the regulation policy is a first regulation policy for a bonding process, where the bonding process includes a pad flatness parameter, a bonding time, and a bonding pressure.
Step S620, if the failure type is a second failure type, determining that the regulation policy is a second regulation policy for sealing the bonding point, where the second failure type indicates that the bonding point is corroded.
In the embodiment of the application, if the failure type is a second failure type based on corrosion of the bonding point, determining the regulation strategy as a second regulation strategy for sealing the bonding point.
In an exemplary embodiment of the present application, please refer to fig. 7, the determining the failure cause according to the regulation policy in step S230 includes steps S710 to S730, which are described in detail below:
In step S710, if the regulation policy is the first regulation policy, the pad flatness parameter, the welding time and the welding pressure of the bonding device are detected.
In this embodiment, when the regulation policy is the first regulation policy, specific detection of the pad flatness parameter, the welding time and the welding pressure of the bonding device may refer to the foregoing description of the bonding failure detection module, and will not be described herein.
Step S720, determining a pad leveling result according to the pad leveling parameter; calculating a welding time range according to the welding time, and matching the welding time with the welding time range to obtain a time matching result; and calculating a welding pressure average value according to the welding pressure, and matching the welding pressure average value with a welding pressure threshold value to obtain a pressure matching result.
In this embodiment, as described above, the pad front image and the pad side image of the pad are obtained, the pad front image is divided into 4 sub-images, which are denoted as area 1, area 2, area 3 and area 4, and the pixel composition of these 4 sub-images is subjected to gray-scale analysis. The black pixel of the region 1 is denoted as X1, the black pixel of the region 2 is denoted as X2, the black pixel of the region 3 is denoted as X3, and the black pixel of the region 4 is denoted as X4.
The pad side image was equally divided into 2 sub-images, designated as sub-image a and sub-image B, pad thickness analysis was performed based on the sub-images a and B, the pad thickness represented in image a was designated as H1, and the pad thickness represented in image B was designated as H2.
Determining a pad leveling result according to the pad leveling parameters H1, H2, X1, X2, X3 and X4, if H1 is larger than H2 and X1 is smaller than X3, or X1 is smaller than X4, or X2 is smaller than X3, or X2 is smaller than X4, judging that the area 1 and the area 2 in the front image of the pad are raised, if H1 is smaller than H2 and X1 is larger than X3, or X1 is larger than X4, or X2 is larger than X3, or X2 is larger than X4, judging that the area 3 and the area 4 in the front image of the pad are raised, if H1 = H2, and X1, X2, X3 and X4 are equal, judging that the pad leveling result is pad leveling, otherwise, judging that the pad leveling result is pad leveling.
And taking the time data recorded by the timer as welding time, calculating a time average value t according to the welding time, calculating t-10%t to t+10%t as a welding time range, and matching each welding time with the welding time range to obtain a time matching result, wherein the time matching result comprises two results that the welding time is in the welding time range and the welding time is not in the welding time range.
And taking the obtained pressure values Y1-Y5 as welding pressure, calculating a pressure average value Y of the five pressure values, and matching the pressure average value with a welding pressure threshold value to obtain a pressure matching result, wherein the pressure matching result comprises two results of matching the pressure average value with the welding pressure threshold value and not matching the pressure average value with the welding pressure threshold value.
And step S730, determining the pad flatness parameter of the failure reason according to the pad flatness result, the time matching result and the pressure matching result.
In the embodiment of the application, the failure reason is determined according to the bonding pad leveling result, the time matching result and the pressure matching result. Specifically, if the pad leveling result is characterized as uneven, it can be determined that the failure cause is generated based on the pad, and the pad can be replaced during regulation. Or if the time matching result is characterized as not being in the welding time range, determining that the failure reason is generated based on the welding time, and checking and adjusting the welding time during regulation and control. Or if the pressure matching result is characterized as that the pressure average value is not matched with the welding pressure threshold value, the failure cause can be determined to be generated based on the welding pressure, and the welding pressure can be checked and adjusted during regulation and control.
In an exemplary embodiment of the present application, please refer to fig. 8, the determining the failure cause according to the regulation policy in step S230 includes steps S810 to S830, which are described in detail below:
step S810, if the regulation policy is the second regulation policy, acquiring a first package image before the bonding point is packaged and a second package image after the bonding point is packaged.
In the embodiment of the present application, if the regulation policy is the second regulation policy, a first package image before bonding point packaging and a second package image after packaging are obtained.
Step S820, identifying color composition information in the first package image and the second package image.
In the embodiment of the application, color composition information in the first package image and the second package image is identified.
And step S830, determining the failure reason according to the color composition information.
In this embodiment of the present application, the failure cause is determined according to the color composition information, for example, when copper is used for packaging, and when a bonding wire is a bonding alloy wire, a yellow pixel is formed at a bonding point in a first packaging image before packaging, and a red pixel is formed at the position where the yellow pixel does not appear in a second packaging image after packaging. And determining the failure reason according to the color composition information. The bonding air tightness detection module can be specifically referred to the previous description, and the description is omitted here.
In an exemplary embodiment of the present application, referring to fig. 9, fig. 9 is a bond failure control device of a bonding wire apparatus according to an exemplary embodiment, including:
a detection module 910, configured to detect, when it is detected that the bonding wire device is performing a bonding process, whether a bonding point of the bonding wire device is invalid;
a first determining module 920 configured to determine a failure type if a bond point failure of the bond wire device is detected;
a second determining module 930, configured to determine a corresponding regulation policy according to the failure type, and determine a failure cause according to the regulation policy;
and a regulating module 940 configured to regulate the bonding of the bonding wire device according to the failure cause.
In one exemplary embodiment of the present application, the detection module 910 includes:
the first detection submodule is configured to detect whether the bonding point is open or not to obtain a first detection result; and
the second detection submodule is configured to detect whether the bonding points are corroded or not to obtain a second detection result;
and the first determining submodule is configured to determine that the bonding point of the bonding wire equipment is invalid if any one of the first detection result or the second detection result is characterized as the bonding point is invalid.
In one exemplary embodiment of the present application, a first detection sub-module includes:
a first obtaining unit configured to obtain a first image of a bonding point of the current bonding wire device;
the vibration processing unit is configured to perform vibration processing on the bonding points of the bonding wire equipment, and acquire a second image of the bonding points of the bonding wire equipment in the vibration processing process and a third image of the bonding points of the bonding wire equipment after the vibration processing;
and the comparison unit is configured to compare the first image, the second image and the third image with a first reference image respectively and determine whether the bonding point is open or not based on a comparison result.
In one exemplary embodiment of the present application, the second detection sub-module includes:
the second acquisition unit is configured to acquire the humidity information of the cavity corresponding to the bonding point and determine a humidity result according to the humidity information; and
a third obtaining unit, configured to obtain a fourth image of at least one frame of the bonding point, and count white pixel information of the fourth image;
a first determining unit configured to determine whether a humidity phenomenon occurs in the cavity according to the humidity result, and compare the white pixel information with reference white pixel information of a second reference image;
And the second determining unit is configured to determine that the bonding point is corroded if the humidity phenomenon occurs in the cavity and the white pixel information is larger than the reference white pixel information.
In an exemplary embodiment of the present application, the second determining module 930 includes:
a second determining sub-module configured to determine the regulation strategy as a first regulation strategy for a bonding process if the failure type is a first failure type, the first failure type characterizing the bond point open;
and a third determining sub-module configured to determine the regulation strategy as a second regulation strategy for bond point package tightness if the failure type is a second failure type, the second failure type being indicative of the bond point being corroded.
In an exemplary embodiment of the present application, the second determining module 930 includes:
the third detection submodule is configured to detect the welding disc flatness parameter, the welding time and the welding pressure of the bonding equipment if the regulation strategy is the first regulation strategy;
a fourth determining submodule configured to determine a pad leveling result according to the pad leveling parameter; calculating a welding time range according to the welding time, and matching the welding time with the welding time range to obtain a time matching result; calculating a welding pressure average value according to the welding pressure, and matching the welding pressure average value with a welding pressure threshold value to obtain a pressure matching result;
And a fifth determination submodule configured to determine the failure cause according to the pad leveling result, the time matching result and the pressure matching result.
In an exemplary embodiment of the present application, the second determining module 930 includes:
the obtaining submodule is configured to obtain a first packaging image before packaging the bonding point and a second packaging image after packaging if the regulation strategy is a second regulation strategy;
an identification sub-module configured to identify color composition information in the first and second package images;
a sixth determination submodule configured to determine the failure cause according to the color composition information.
It should be noted that, the apparatus provided in the foregoing embodiments and the method provided in the foregoing embodiments belong to the same concept, and the specific manner in which each module and unit perform the operation has been described in detail in the method embodiments, which is not repeated herein.
The embodiment of the application also provides electronic equipment, which comprises: one or more processors; and the storage device is used for storing one or more programs, and when the one or more programs are executed by the one or more processors, the electronic equipment realizes the bonding failure regulation method of the bonding wire equipment provided in each embodiment.
Fig. 10 shows a schematic diagram of a computer system suitable for use in implementing the electronic device of the embodiments of the present application.
It should be noted that, the computer system 1000 of the electronic device shown in fig. 10 is only an example, and should not impose any limitation on the functions and the application scope of the embodiments of the present application.
As shown in fig. 10, the computer system 1000 includes a central processing unit (Central Processing Unit, CPU) 1001 that can perform various appropriate actions and processes, such as performing the method described in the above embodiment, according to a program stored in a Read-Only Memory (ROM) 1002 or a program loaded from a storage section 1008 into a random access Memory (Random Access Memory, RAM) 1003. In the RAM 1003, various programs and data required for system operation are also stored. The CPU 1001, ROM 1002, and RAM 1003 are connected to each other by a bus 1004. An Input/Output (I/O) interface 1005 is also connected to bus 1004.
The following components are connected to the I/O interface 1005: an input section 1006 including a keyboard, a mouse, and the like; an output portion 1007 including a Cathode Ray Tube (CRT), a liquid crystal display (Liquid Crystal Display, LCD), and a speaker; a storage portion 1008 including a hard disk or the like; and a communication section 1009 including a network interface card such as a LAN (Local Area Network ) card, a modem, or the like. The communication section 1009 performs communication processing via a network such as the internet. The drive 1010 is also connected to the I/O interface 1005 as needed. A removable medium 1011, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, or the like, is installed on the drive 1010 as needed, so that a computer program read out therefrom is installed into the storage section 1008 as needed.
In particular, according to embodiments of the present application, the processes described above with reference to flowcharts may be implemented as computer software programs. For example, embodiments of the present application include a computer program product comprising a computer program embodied on a computer readable medium, the computer program comprising a computer program for performing the method shown in the flowchart. In such an embodiment, the computer program may be downloaded and installed from a network via the communication portion 1009, and/or installed from the removable medium 1011. When executed by a Central Processing Unit (CPU) 1001, the computer program performs various functions defined in the system of the present application.
It should be noted that, the computer readable medium shown in the embodiments of the present application may be a computer readable signal medium or a computer readable storage medium, or any combination of the two. The computer readable storage medium may be, for example, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of the computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-Only Memory (ROM), an erasable programmable read-Only Memory (Erasable Programmable Read Only Memory, EPROM), flash Memory, an optical fiber, a portable compact disc read-Only Memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. In the present application, however, a computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, with a computer-readable computer program embodied therein. Such a propagated data signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination of the foregoing. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. A computer program embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wired, etc., or any suitable combination of the foregoing.
The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. Where each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams or flowchart illustration, and combinations of blocks in the block diagrams or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
The units involved in the embodiments of the present application may be implemented by means of software, or may be implemented by means of hardware, and the described units may also be provided in a processor. Wherein the names of the units do not constitute a limitation of the units themselves in some cases.
Another aspect of the present application also provides a computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements a method as described above. The computer-readable storage medium may be included in the electronic device described in the above embodiment or may exist alone without being incorporated in the electronic device.
Another aspect of the present application also provides a computer program product or computer program comprising computer instructions stored in a computer readable storage medium. The processor of the computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device performs the methods provided in the above-described respective embodiments.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (10)
1. The bonding failure control method of the bonding wire equipment is characterized by comprising the following steps of:
when detecting that bonding wire equipment is in bonding treatment, detecting whether a bonding point of the bonding wire equipment is invalid;
if the bonding point of the bonding wire equipment is detected to be invalid, determining an invalidation type;
determining a corresponding regulation strategy according to the failure type, and determining a failure reason according to the regulation strategy;
and regulating and controlling the bonding of the bonding wire equipment according to the failure reason.
2. The bonding failure regulation method of a bonding wire device according to claim 1, wherein the detecting whether the bonding point of the bonding wire device fails comprises:
detecting whether the bonding point is open or not to obtain a first detection result; and
detecting whether the bonding point is corroded or not to obtain a second detection result;
and if any one of the first detection result or the second detection result is characterized as the bonding point failure, determining that the bonding point of the bonding wire equipment fails.
3. The bonding failure control method of the bonding wire device according to claim 2, wherein the detecting whether the bonding point is open comprises:
acquiring a first image of a bonding point of the current bonding wire equipment;
Performing vibration treatment on bonding points of the bonding wire equipment, and acquiring a second image of the bonding points of the bonding wire equipment in the vibration treatment process and a third image of the bonding points of the bonding wire equipment after the vibration treatment;
and comparing the first image, the second image and the third image with a first reference image respectively, and determining whether the bonding point is open or not based on a comparison result.
4. The bonding failure control method of a bonding wire apparatus according to claim 2, wherein the detecting whether the bonding point is corroded comprises:
acquiring humidity information of a cavity corresponding to the bonding point, and determining a humidity result according to the humidity information; and
acquiring a fourth image of at least one frame of bonding points, and counting white pixel information of the fourth image;
determining whether a humidity phenomenon occurs in the cavity according to the humidity result, and comparing the white pixel information with reference white pixel information of a second reference image;
and if the humidity phenomenon occurs in the cavity and the white pixel information is larger than the reference white pixel information, determining that the bonding point is corroded.
5. The bonding failure regulation method of a bonding wire device according to claim 1, wherein the determining a corresponding regulation strategy according to the failure type comprises:
if the failure type is a first failure type, determining that the regulation strategy is a first regulation strategy for a bonding process, wherein the first failure type represents the bonding point open circuit;
and if the failure type is a second failure type, determining the regulation strategy as a second regulation strategy aiming at the bonding point packaging air tightness, wherein the second failure type represents that the bonding point is corroded.
6. The bonding failure regulation method of a bonding wire apparatus according to claim 5, wherein the determining the failure cause according to the regulation policy comprises:
if the regulation strategy is a first regulation strategy, detecting the welding disc flatness parameter, welding time and welding pressure of the bonding equipment;
determining a pad leveling result according to the pad leveling parameter; calculating a welding time range according to the welding time, and matching the welding time with the welding time range to obtain a time matching result; calculating a welding pressure average value according to the welding pressure, and matching the welding pressure average value with a welding pressure threshold value to obtain a pressure matching result;
And determining the failure reason according to the bonding pad leveling result, the time matching result and the pressure matching result.
7. The bonding failure regulation method of a bonding wire apparatus according to claim 5, wherein the determining the failure cause according to the regulation policy comprises:
if the regulation strategy is a second regulation strategy, acquiring a first packaging image before packaging the bonding point and a second packaging image after packaging;
identifying color composition information in the first and second encapsulated images;
and determining the failure reason according to the color composition information.
8. A bonding failure control device of a bonding wire apparatus, comprising:
the detection module is configured to detect whether a bonding point of the bonding wire equipment is invalid when the bonding wire equipment is detected to perform bonding treatment;
the first determining module is configured to determine a failure type if the bonding point of the bonding wire equipment is detected to be invalid;
the second determining module is configured to determine a corresponding regulation strategy according to the failure type and determine a failure reason according to the regulation strategy;
and the regulation and control module is configured to regulate and control the bonding of the bonding wire equipment according to the failure reason.
9. An electronic device, comprising:
one or more processors;
storage means for storing one or more programs that, when executed by the one or more processors, cause the electronic device to implement the bond failure regulation method of the bond wire device of any one of claims 1 to 7.
10. A computer-readable storage medium having stored thereon computer-readable instructions that, when executed by a processor of a computer, cause the computer to perform the bonding failure regulation method of the bonding wire apparatus of any one of claims 1 to 7.
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| CN202311531380.7A CN117637537A (en) | 2023-11-15 | 2023-11-15 | Bonding failure regulation and control method, device and equipment for bonding wire equipment and storage medium |
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| CN202311531380.7A CN117637537A (en) | 2023-11-15 | 2023-11-15 | Bonding failure regulation and control method, device and equipment for bonding wire equipment and storage medium |
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