CN117598034A

CN117598034A - Circuit board assembly, electronic equipment and bracket

Info

Publication number: CN117598034A
Application number: CN202180100122.6A
Authority: CN
Inventors: 皮宇丹; 吕建标; 龚纯诚; 王广平; 郑见涛
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-10-20
Filing date: 2021-10-20
Publication date: 2024-02-23
Also published as: WO2023065177A1

Abstract

The embodiment of the application provides a circuit board assembly, electronic equipment and bracket, relates to the technical field of chip circuit boards, and is used for solving the problem of low thermal contact reliability between a chip and a radiator due to deformation of the circuit board under the pressure action of the radiator. The circuit board assembly comprises a circuit board, a chip, a radiator and a bracket. The chip is arranged on the circuit board. The heat sink is covered on the chip, and the periphery of the heat sink is fixedly connected to the circuit board. The bracket comprises a horizontal part fixedly connected with the circuit board and a protruding part protruding out of the horizontal part and propping against the bottom of the circuit board. Wherein the circuit board is fixed on the casing of the electronic device, and the bracket is arranged on the casing. The bracket is used for supporting the circuit board assembly.

Description

Circuit board assembly, electronic equipment and bracket

Technical Field

The application relates to the technical field of chip circuit boards, in particular to a circuit board assembly, electronic equipment and a bracket.

Background

Along with the continuous perfection of the chip functions and the continuous increase of demands, the packaging size and the power consumption of the chip are also continuously increased. In the related art, heat dissipation is generally performed by a manner that a heat sink is in contact with a chip. The circuit board area occupied is larger due to the larger package size of the chip. If the rigidity of the circuit board is insufficient, the circuit board is easily deformed by the pressure of the heat sink. Therefore, the reliability of thermal contact between the chip and the radiator cannot be ensured, and the problem of overheating and damage of the chip is easily caused.

Disclosure of Invention

The embodiment of the application provides a circuit board assembly, electronic equipment and a bracket, which are used for solving the problem of low thermal contact reliability between a chip and a radiator due to deformation of the circuit board under the pressure action of the radiator.

In order to achieve the above purpose, the present application adopts the following technical scheme:

embodiments of a first aspect of the present application provide a circuit board assembly including a circuit board, a chip, a heat sink, and a bracket. The chip is arranged on the circuit board. The heat sink is covered on the chip, and the periphery of the heat sink is fixedly connected to the circuit board. The bracket comprises a horizontal part fixedly connected with the circuit board and a protruding part protruding out of the horizontal part and propping against the bottom of the circuit board. In this way, the bracket and the chip are respectively positioned on two opposite sides of the circuit board. Wherein the circuit board is fixed on the casing of the electronic device, and the bracket is arranged on the casing.

From the above, the bracket is arranged on the circuit board assembly, and the bracket is connected with the circuit board through the horizontal part, so that the protruding part of the bracket is propped against the bottom of the circuit board. Thus, on the one hand, after the bracket is connected with the circuit board assembly, the protruding part of the bracket can be abutted with the part of the circuit board, where the chip is arranged, so that the position of the circuit board, where the chip is arranged, can be supported, and further the probability that the circuit board deforms away from the radiator under the pressure action of the radiator (arranged on the side, away from the circuit board, of the chip) can be reduced.

On the other hand, the circuit board can be deformed toward the heat sink by the abutment of the bracket boss. In this way, the chip can be subjected to a pressing force by which the circuit board deforms toward the heat sink, and at the same time, can be subjected to a pressing force by which the heat sink deforms toward the circuit board. Therefore, under the combined action of the extrusion force of the deformation of the circuit board towards the radiator and the extrusion force of the radiator towards the circuit board, the contact surface between the chip and the radiator can keep uniform pressure, so that the reliability of thermal contact between the chip and the radiator is ensured, and the probability of overheat damage of the chip is reduced.

Optionally, the vertical projection of at least a portion of the bump onto the circuit board is within the range of the vertical projection of the chip onto the circuit board. When the area of the protruding part in the bracket is larger than the area of the chip, a part of the protruding part is abutted under the chip. When the area of the protruding part in the bracket is smaller than that of the chip, the whole protruding part is directly abutted under the chip.

Optionally, the bracket includes a pallet and a first support column. The supporting plate is used as a horizontal part and is fixedly connected with the circuit board. The first support column is used as the protruding portion, the first end of the first support column is propped against the bottom of the circuit board, and the second end of the first support column is connected with the supporting plate. The first support post may be one embodiment of a bracket boss. Therefore, after the supporting plate is connected with the circuit board assembly, the first supporting column is abutted with the circuit board, and accordingly the supporting effect on the chip is achieved.

Optionally, the bracket includes a pallet and a first support column. The supporting plate is fixedly connected with the circuit board as a horizontal part, and is provided with a threaded hole. The first support column is as bellying, and the outer wall of first support column is provided with the external screw thread, and the first end of first support column passes screw hole and layer board threaded connection, and bears against circuit board bottom. In this way, the first support column can be in threaded connection with the supporting plate, so that the height of the first support column protruding from the supporting plate can be adjusted.

Optionally, a fixing hole is formed in the shell, a plurality of first pawls are arranged on the hole wall of the fixing hole, and the plurality of first pawls are arranged around the periphery of the hole wall of the fixing hole. The first support column includes a column body and a plurality of second pawls. The outer surface of the column body is provided with external threads, and the first end of the column body abuts against the bottom of the circuit board. The second pawls are located at the second end of the post body, and the second pawls are disposed around a circumference of the outer surface of the post body. Wherein the first plurality of pawls are engaged with the second plurality of pawls. The meshing of a plurality of first pawls and a plurality of second pawls can realize the unidirectional rotation function of the column body to prevent reverse rotation of the first support column under the action of pressure.

Optionally, the pallet includes a base plate and a rim. The first end of the first support column is propped against the bottom of the circuit board, and the second end of the first support column is connected with the bottom plate. The frame is arranged between the bottom plate and the circuit board, the first surface of the frame is connected with the bottom plate, and the second surface of the frame is propped against the bottom of the circuit board. The frame is arranged around one circle of the first support column and forms an avoidance space with the bottom plate, and the avoidance space is used for avoiding electronic devices on the circuit board. The supporting plate formed by the bottom plate and the frame can provide auxiliary support for the circuit board in the edge area of the chip. Meanwhile, the arrangement of the frame can avoid electronic devices on the circuit board assembly, so that the electrical design requirement of the circuit board assembly can be met.

Alternatively, in the case where the bracket includes a pallet and a first support column, the pallet is fixedly connected as a horizontal portion with the circuit board. The first support column is as bellying, and the first end of first support column is propped against the circuit board bottom, and the second end of first support column is connected with the layer board. The supporting plate further comprises a reinforcing rib, and the reinforcing rib is connected between the first supporting column and the frame. The arrangement of the reinforcing ribs improves the structural stability between the first support column and the supporting plate, and increases the rigidity of the bracket, so that the supporting effect of the bracket on the circuit board is enhanced.

Optionally, a first avoidance hole is formed at one end, facing the circuit board, of the first support column, and the first avoidance hole is used for avoiding an electronic device on the circuit board. The first hole of dodging's setting can avoid first support column to cause the interference to the electronic device on the circuit board subassembly, has guaranteed the normal work of circuit board subassembly.

Optionally, the bracket is a sheet-like structure. The protruding portion of the bracket comprises an arch-shaped supporting cover, and the horizontal portion is arranged around the periphery of the arch-shaped supporting cover. The arched bracket cover bulges towards the bottom of the circuit board relative to the horizontal part and is propped against the bottom of the circuit board. The arched deck raised portion may serve as another embodiment of the bracket boss. Therefore, after the arched supporting cover is connected with the circuit board assembly, the raised part of the arched supporting cover is abutted with the circuit board, and the function of supporting the circuit board assembly can be realized.

Optionally, the carrier comprises a plurality of tabs distributed annularly. The support piece is provided with a first end and a second end which are oppositely arranged, and the first ends of the support pieces are connected and propped against the bottom of the circuit board. A gap is arranged between the second ends of the two adjacent brackets. The arched supporting cover adopts a plurality of mutually separated supporting sheet structural forms, so that the bent arched supporting cover also has certain elastic force, and is convenient for connection between the arched supporting cover and the circuit board. When the arched supporting cover is connected with the circuit board assembly, the circuit board deforms towards the radiator under the action of bending stress of the arched supporting cover, so that the chip can keep uniform pressure with the radiator.

Optionally, the boss further comprises a second support post. The first end of the second support column is connected with the arched supporting cover, and the second end of the second support column is propped against the bottom of the circuit board. Therefore, after the arched supporting cover is connected with the circuit board assembly, the second supporting column can be abutted with the circuit board, so that the supporting effect on the circuit board assembly is enhanced.

Optionally, a second avoidance hole is formed in one surface, facing the circuit board, of the arched support cover, and the second avoidance hole is used for avoiding electronic devices on the circuit board. The setting in hole is dodged to the second can avoid arch to hold in the palm to the electronic device on the circuit board subassembly and cause the interference, has guaranteed the normal work of circuit board subassembly.

Optionally, the height of the protrusion protruding from the horizontal portion is 100 micrometers-2 millimeters, and the direction of the height of the protrusion is perpendicular to the board surface of the circuit board. The bump height of the bump of the carrier can be set between 100 micrometers and 2 millimeters depending on the package size of the different chips. In this way, the larger the package size of the chip, the higher the bump height of the bump portion of the bracket is set, and the better the pressure between the chip and the heat sink can be ensured.

Optionally, the circuit board is provided with a plurality of through holes, and the plurality of through holes are distributed on the periphery of the chip. The horizontal part of the bracket is provided with a connecting hole, and the connecting hole corresponds to the position of the through hole. The circuit board assembly further comprises a plurality of studs, each stud is arranged on the radiator and penetrates through the connecting hole and the through hole, and the radiator is fixedly connected with the circuit board through the studs. At this time, the radiator, the circuit board and the bracket are fixedly connected through studs, and the chip is tightly pressed between the radiator and the circuit board.

A second aspect of the present application provides an electronic device comprising a housing and a circuit board assembly of any of the embodiments of the first aspect. When the circuit board assembly is used in an electronic device, the circuit board assembly has the same technical effects as those provided in the foregoing embodiment, and will not be described herein again.

Optionally, the housing comprises a housing body and at least one partition. The housing body has a mounting cavity. At least one baffle sets up in the casing body, and separates into two at least sub-installation chambeies with the installation chamber, and the circuit board subassembly is installed in sub-installation intracavity. Wherein, circuit board fixed connection is on the baffle, and the bracket sets up between circuit board and baffle. In this way, a plurality of circuit board assemblies may be disposed within the housing of the electronic device, each of which may be individually mounted on the partition, thereby increasing the number of circuit board assemblies that may be disposed within the electronic device.

Embodiments of a third aspect of the present application provide a bracket disposed between a circuit board and a housing of an electronic device. The bracket comprises a horizontal part fixedly connected with the circuit board and a protruding part protruding out of the horizontal part and propping against the bottom of the circuit board. The bracket has the same technical effects as the bracket in the circuit board assembly provided in the foregoing embodiment, and will not be described herein.

Optionally, the electronic device further includes a chip disposed on the circuit board. The vertical projection of at least a portion of the boss on the circuit board is within the range of the vertical projection of the chip on the circuit board. When the area of the protruding part in the bracket is larger than the area of the chip, a part of the protruding part is abutted under the chip. When the area of the protruding part in the bracket is smaller than that of the chip, the whole protruding part is directly abutted under the chip.

Drawings

FIG. 1 is a schematic diagram of a related art circuit board assembly;

fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of another electronic device according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of still another electronic device according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present disclosure;

FIG. 6 is a schematic diagram of the chip in FIG. 5;

FIG. 7 is a schematic cross-sectional view of the bracket and circuit board of FIG. 5;

FIG. 8 is a schematic top view of the bracket of FIG. 7;

fig. 9 is a schematic structural diagram of another circuit board assembly according to an embodiment of the present disclosure;

FIG. 10 is a schematic view of the first support column of FIG. 9 connected to the base plate;

FIG. 11 is a schematic view of an embodiment of the cap and spacer of FIG. 10;

FIG. 12 is a schematic view of another embodiment of the cap and spacer of FIG. 10;

FIG. 13 is another schematic view of the first support column of FIG. 9 connected to the base plate;

FIG. 14 is a schematic view of an embodiment of the first support column of FIG. 10;

FIG. 15 is a schematic view of another embodiment of the first support column of FIG. 10;

FIG. 16 is a schematic view of a further embodiment of the first support column of FIG. 10;

fig. 17 is a schematic structural diagram of still another circuit board assembly according to an embodiment of the present disclosure;

fig. 18 is a schematic top view of a bracket according to an embodiment of the present disclosure;

FIG. 19 is a schematic top view of another bracket according to an embodiment of the present disclosure;

FIG. 20 is a schematic top view of a further bracket provided in an embodiment of the present application;

FIG. 21 is an exploded view of a further circuit board assembly according to the embodiments of the present application;

fig. 22 is a schematic diagram of an assembled structure of a circuit board assembly according to another embodiment of the present disclosure;

FIG. 23 is a schematic view of an embodiment of the arched deck of FIG. 21;

FIG. 24 is a schematic view of another embodiment of the arched deck of FIG. 21;

FIG. 25 is a schematic view of a further embodiment of the arched deck of FIG. 21;

FIG. 26 is a schematic cross-sectional view of the arched deck of FIG. 25;

FIG. 27 is another cross-sectional schematic view of the arched deck of FIG. 25;

FIG. 28 is a schematic view of a further cross-sectional configuration of the arched deck of FIG. 25;

FIG. 29 is a further schematic cross-sectional view of the arched deck of FIG. 25;

FIG. 30 is a schematic view of a further embodiment of the arched deck of FIG. 21;

fig. 31 is a schematic structural view of another embodiment of an arched deck.

Detailed Description

The following description of the technical solutions in the embodiments of the present application will be made with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments.

Hereinafter, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. Furthermore, the term "plurality" in this application means two or more.

Furthermore, in this application, directional terms "upper", "lower", and "horizontal" are defined with respect to the orientation in which the components are schematically disposed in the drawings, and it should be understood that these directional terms are relative terms, which are used for description and clarity with respect thereto, and which may be changed accordingly in accordance with the change in the orientation in which the components are disposed in the drawings.

In the present application, unless explicitly specified and limited otherwise, the term "coupled" is to be construed broadly, and for example, "coupled" may be either fixedly coupled, detachably coupled, or integrally formed; can be directly connected or indirectly connected through an intermediate medium.

In the related art, as shown in fig. 1, a circuit board assembly includes a circuit board, a heat sink, and a chip. The chip is connected to the surface of the circuit board. The radiator is abutted to the upper surface of the chip and is connected with the circuit board through the screw rod, so that the chip is pressed on the board surface of the circuit board. The chip generates heat during operation, and the heat is transferred to the heat sink through thermal contact (abutment) of the heat sink with the chip, and finally dissipated through the heat sink.

With the increasing size of the chip package, on the one hand, the area of the circuit board in which the chip portion is provided increases, and if the rigidity of the circuit board is insufficient, the circuit board is liable to bend downward as shown in fig. 1, that is, bending deformation of the circuit board in a direction away from the heat sink (hereinafter referred to as smiling face deformation). After smiling face deformation is generated on the circuit board, uneven pressure between the radiator and the chip contact surface can be caused, and heat dissipation of the chip is not facilitated.

On the other hand, the heat dissipation area required for the chip increases due to the increase in the chip package size. This may also increase the volume of the heat sink, resulting in excessive pressure exerted by the heat sink on the circuit board, as well as causing smiling face deformation of the circuit board.

In addition, as the power consumption of the chip is continuously increased, the demand of the chip for heat dissipation is also increasing. If the reliability of the thermal contact between the heat spreader and the chip is reduced, it may also cause a problem that the chip is damaged due to overheating. Therefore, the structure of the circuit board assembly needs to be designed to improve the problem of uneven pressure between the heat sink and the chip.

In view of the above problems, an embodiment of the present application provides an electronic device 01 as shown in fig. 2, where the electronic device 01 has a circuit board assembly 200 that is not easy to deform the smiling face. The electronic device 01 may be a server, a router, a desktop computer, a notebook computer, a base station, or an electronic box. For convenience of explanation, the following examples are all illustrated with the electronic device 01 as a server. The specific type of the electronic apparatus 01 is not particularly limited in this application.

Specifically, as shown in fig. 2, the electronic device 01 may include a housing 10 and a circuit board assembly 200. The housing 10 may include a housing body 100, a plurality of (e.g., four) screw seats 110, a plurality of (e.g., four) screw caps 120, and a partition 130, among others. The housing body 100 is provided with a mounting cavity therein, and four screw seats 110 are provided in the mounting cavity of the housing 10 and located on the housing body 100, and the circuit board assembly 200 is supported on a plurality of (e.g., four) screw seats 110. The screw cap 120 is screwed with the screw base 110 to fix the circuit board assembly 200 to the screw base 110. Of course, the number of screw bases 110 and nuts 120 may be two, three or more depending on the shape of the circuit board assembly 200, and the specific shape of the circuit board assembly 200 and the specific number of screw bases 110 and nuts 120 are not particularly limited in this application.

In some embodiments, as shown in fig. 2, the spacer 130 may be disposed below the circuit board assembly 200. In this case, the spacer 130 may be used to support the circuit board assembly 200. Of course, the partition 130 may be a part of the housing body 100. At this time, the circuit board assembly 200 may be directly mounted on the housing body 100. For example, as shown in fig. 3, a screw hole 140 may be formed in a side wall of the housing body 100. The screw cap 120 is directly mounted and fixed on the side wall of the housing body 100 by screwing with the screw hole 140, so that the screw seat 110 and the partition 130 as shown in fig. 2 can be omitted.

In addition, the electronic device 01 may further include one or more washers (not shown), which may be disposed at the screw holes 140. Not only can the circuit board assembly 200 be buffered and damped, but also a proper distance can be kept between the circuit board assembly 200 and the side wall of the housing body 100, which is beneficial to heat dissipation of the circuit board assembly 200. The circuit board assembly 200 may be mounted on any side wall in the housing body 100, and the mounting position and the mounting manner of the circuit board assembly 200 in the housing body 100 are not particularly limited in this application.

In other embodiments, as shown in fig. 4, a greater number of circuit board assemblies 200 may also be disposed within the housing body 100. For example, the partition 130 may be further connected to the sidewall of the housing body 100 by a screw connection or a socket connection, etc., so as to divide the installation cavity of the housing body 100 into two sub-installation cavities. One set of circuit board assemblies 200 may be mounted at the bottom of the case body 100, and another set of circuit board assemblies 200 may be mounted on the partition 130. Of course, a plurality of partitions 130 may be disposed in the housing body 100, so that the housing body 100 is divided into a plurality of sub-mounting cavities, and the specific number of the circuit board assemblies 200 and the partitions 130 is not particularly limited in this application.

The above embodiment is exemplified by using the electronic device 01 as a server. In other embodiments, the electronic device 01 may be a router, a desktop computer, a notebook computer, a base station, or an electronic box. These electronic devices 01 can be mounted with the circuit board assembly 200 which is not easily deformed by smiling face. The following embodiments will describe the circuit board assembly 200 in detail.

The present application also provides a circuit board assembly 200, as shown in fig. 5, the circuit board assembly 200 may include a circuit board 210, a chip 220, a carrier 230, and a heat sink 240. The chips 220 may be stacked on the board surface of one side of the circuit board 210, the carrier 230 may be stacked on the board surface of the other side of the circuit board 210, and the chips 220 are electrically connected with the circuit board 210. The heat spreader 240 covers the upper surface of the chip 220.

As shown in fig. 5, in this embodiment, the side of the heat sink 240 is the upper side, and the side of the circuit board 210 is the lower side. That is, the bracket 230, the circuit board 210, the chip 220, and the heat sink 240 are stacked in this order from bottom to top. As described above, the circuit board assembly 200 may be directly mounted on the side wall of the housing body 100 or may be mounted on the partition 130 in the housing body 100 according to the different structures of the electronic device 01. This application is not particularly limited.

To enhance the heat dissipation performance of the chip 220, the circuit board assembly 200 may further include a first heat conductive adhesive 250. A first heat-conductive adhesive 250 is applied between the chip 220 and the heat sink 240 for transferring heat of the chip 220 to the heat sink 240. The first heat-conducting glue 250 may be a heat-conducting silica gel or a silicone grease, and the material of the first heat-conducting glue 250 is not particularly limited in this application.

On this basis, as shown in fig. 5, the heat sink 240 may include four screws 241 (the other two are shielded by the illustrated screws 241). The screw 241 penetrates the heat sink 240, the circuit board 210, the bracket 230, and the partition 130 in this order. Wherein, screw holes matched with the screw rods 241 can be formed on the partition plate 130, so that the screw rods 241 are in threaded connection with the screw holes. Nuts may be provided under the partition 130, and the screw 241 may be screwed with the nuts, so that the heat sink 240, the circuit board 210, the bracket 230, and the partition 130 may be pressed against each other.

In order to increase the pressing force of the heat spreader 240 against the chip 220, as shown in fig. 5, an elastic member 242 may be further disposed between the heat spreader 240 and the screw 241. The resilient member 242 includes, but is not limited to, a spring, a leaf spring, or a resilient washer. The elastic member 242 is compressed by the pressure of the screw 241 and pushes the heat sink 240 toward the chip 220, thereby compressing the heat sink 240 and the chip 220.

The circuit board 210 may be a printed circuit board (Printed Circuit Board, PCB). The radiator 240 may be an air-cooled radiator or a liquid-cooled radiator. The connection mode between the heat sink 240 and the circuit board 210 may also be a fixing clip connection mode, and the specific structure of the circuit board 210, the type of the heat sink 240, and the connection mode are not limited in this application.

In some implementations, as illustrated in fig. 6, the chip 220 may include a die 221, a substrate 222, and a package cover 223. The bottom of die 221 has a plurality of pads 224 and the bottom of substrate 222 has a plurality of pins 225. The solder joint 224 is electrically connected with the etched circuit on the substrate 222 through a conductor such as a gold wire, and the package cover 223 and the substrate 222 can be fixedly connected through an insulating material such as epoxy resin or colloid, so that the die 221 is packaged in a space enclosed by the substrate 222 and the package cover 223. The plurality of pins 225 may be in a Ball Grid Array and soldered to the circuit board 210 (shown in fig. 5), i.e., the chip 220 may employ Ball Grid Array (BGA) technology.

In addition, the chip 220 may further include a second heat conductive adhesive 226. A second heat-conductive glue 226 may be applied between the die 221 and the package cover 223 for transferring heat of the die 221 to the package cover 223. The heat of the chip 220 is transferred from the package cover 223 to the heat sink 240 through the first heat conductive adhesive 250 (shown in fig. 5) for heat dissipation. The second heat-conducting adhesive 226 may be a heat-conducting silica gel or a silicone grease, and the material of the second heat-conducting adhesive 226 is not particularly limited in this application.

In other embodiments, the plurality of pins 225 of the chip 220 may also be in a grid array. Meanwhile, the pins 225 may be pins or pins. When the pins 225 are pins, then the chip 220 employs Land Grid Array (LGA) technology. When the pins 225 are pins, the chip 220 employs Pin Grid Array Packaging (PGA). The package structure of the chip 220 is not particularly limited in this application.

The above embodiments are presented in terms of the overall structure of the circuit board assembly 200. If the circuit board 210 generates smiling face deformation, the chip 220 may also generate microbending deformation along with the circuit board 210. At this time, the pressure of the heat spreader 240 on the chip 220 is uneven, so that the reliability of the contact between the first heat conductive adhesive 250, the package cover 223, the second heat conductive adhesive 226 and the die 221 is reduced, which is not beneficial to the heat conduction of the die 221. The bracket 230 is a main component to solve the smiling face deformation of the circuit board assembly 200. The bracket 230 in the circuit board assembly 200 will be described in detail below.

Example one

The bracket 230 provided in this example, as shown in fig. 7, may include a first support column 231 and a pallet 23. The first support columns 231 may be coupled to the plate surface of the pallet 23 and protrude from the surface of the pallet 23. At this time, the supporting plate 23 may be used as the horizontal portion 02 of the bracket 230, and the supporting plate 23 may be fixedly connected to the circuit board 210 by a connection method such as a screw, a stud, or a paste. The first support column 231 may serve as a boss 03 of the bracket 230, and a first end of the first support column 231 may be abutted against the bottom of the circuit board 210. The second end of the first support column 231 may be fixedly connected to the pallet 23 by welding or bonding.

If the cross-sectional area of the first end of the first support column 231 is smaller than the vertical projection area of the chip 220 on the circuit board 210, the first end of the first support column 231 may all lean against the bottom of the circuit board 210 under the chip 220. If the first end of the first support post 231 has a cross-sectional area larger than the vertical projection area of the chip 220 on the circuit board 210, the first end of the first support post 231 may partially lean against the bottom of the circuit board 210 under the chip 220. For example, the first end of the first support column 231 may be provided in a hemispherical or stepped structure or the like. Thus, the first end of the first supporting column 231 is abutted against the bottom of the circuit board 210, and is located in the vertical projection area of the chip 220 on the circuit board 210. Wherein the cross section is parallel to the board surface of the circuit board 210.

As shown in fig. 7, the bottom of the circuit board 210 is typically provided with electronics 212, such as capacitors or resistors. To be able to avoid the electronics 212, the tray 23 may comprise a rim 232 and a bottom plate 233. Referring also to fig. 8, a first end of the first support column 231 is abutted against the bottom of the circuit board 210, and a second end of the first support column 231 may be connected to the bottom plate 233. A first side of the bezel 232 may be coupled to the bottom plate 233 and a second side of the bezel 233 may also rest against the bottom of the circuit board 210. The first end of the first support column 231 may protrude from the second surface of the frame 232, that is, the height of the first support column 231 exceeds the thickness of the frame 232, and the frame 232 is disposed around a circumference of the first support column 231.

Thus, as shown in fig. 7, the frame 232 and the bottom plate 233 enclose a groove structure, and the groove structure has an avoidance space, so that the electronic device 212 such as a capacitor or a resistor at the bottom of the circuit board 210 can be avoided. The thickness of the bezel 232 may be adapted according to different size dimensions of the electronic device 212. For example, when the height of the electronic device 212 is larger, the thickness of the frame 232 may be increased to increase the depth of the avoidance space for avoiding the electronic device 212. Of course, the frame 232 may not be required when the electronic device 212 is not present at the bottom of the circuit board 210.

In addition, the bezel 232 and the bottom plate 233 may be provided as a separate structure. In assembly, the frame 232 and the bottom plate 233 are stacked, and then connected to the bottom of the circuit board 210 by a connector such as a screw or a stud. At this time, the bezel 232 of an appropriate thickness may be selected according to the size of the electronic device 212. Of course, the frame 232 and the bottom plate 233 may be integrally connected by welding or the like. Depending on the configuration of the circuit board assembly 200, the first support posts 231 may be 100 micrometers-2 millimeters above the upper surface of the bezel 232. For example, the first support posts 231 may be 500 micrometers above the upper surface of the bezel 232.

The area of the supporting plate 23 may be larger than that of the chip 220, and the frame 232 may surround the periphery of the chip 220 perpendicularly projected on the circuit board 210 for supporting the circuit board 210 under the chip 220. The first support column 231 may be located directly under the chip 220 and is abutted against the circuit board 210. Thus, the carrier 230 can effectively support the circuit board 210 around and below the chip 220.

In addition, as shown in fig. 7, a connection hole a may be formed in the supporting plate 23, and the connection hole a penetrates the frame 232 and the bottom plate 233. The circuit board 210 may be provided with through holes 211 corresponding to the positions of the connection holes a. A screw 241 (shown in fig. 5) penetrates the through-hole 211 and the connection hole a, thereby connecting the bracket 230 with the circuit board 210. For example, as shown in fig. 8, four connection holes a may be respectively opened at four corners of the pallet 23. The specific number and the opening positions of the connection holes a and the through holes 211 are not particularly limited according to the different structures of the supporting plate 23 and the circuit board 210.

When the bracket 230 is connected to the circuit board 210, the end of the first support column 231 higher than the frame 232 faces the circuit board 210, and the first support column 231 abuts against the circuit board 210 directly under the chip 220. Among them, the first support post 231 is preferably brought into contact with the chip 220 directly under the die 221, so that the pressure uniformity of the die 221 having a large heat generation amount can be directly improved. When the bracket 230 is connected to the circuit board 210, the circuit board 210 under the chip 220 is deformed by the abutting action of the first supporting column 231.

When the bracket 230 deforms the circuit board 210, the circuit board 210 has a pressing force on the chip 220, so that the chip 220 is pressed against the bottom of the heat sink 240. Meanwhile, since the heat sink 240 is connected to the circuit board 210 through the screw 241, the heat sink 240 also has a pressing force on the chip 220. The chip 220 is pressed and fixed under the co-extrusion action of the heat sink 240 and the circuit board 210, so that on one hand, the deformation of the chip 220 is avoided, and good contact between the chip 220 and the circuit board 210 is ensured. On the other hand, the chip 220 is always kept to be tightly attached to the heat sink 240 with uniform pressure, so that the heat dissipation efficiency of the chip 220 is ensured, thereby being beneficial to reducing the probability of overheat damage of the chip 220.

For circuit board assemblies 200 of different structures, in order to adjust the protruding height of the first support column 231 relative to the frame 232, as shown in fig. 9, for example, a threaded hole 2331 may be formed on the bottom plate 233. If the partition plate 130 is provided below the bottom plate 233, the partition plate 130 may be provided with a fixing hole 131, and the screw hole 2331 may be communicated with the fixing hole 131. Wherein the threaded hole 2331 may be located directly below the chip 220.

On this basis, as shown in fig. 10, the first support column 231 may include a column body 2311 and a cap 2312. External threads 2313 may be provided on the outer wall of the column body 2311 so that the first support column 231 can be screw-coupled with a screw hole 2331 (shown in fig. 9) on the bottom plate 233 through the external threads 2313. Wherein, cap 2312 is located below bottom plate 233, and cap 2312 may be embedded in fixing hole 131 (shown in fig. 9).

It is understood that the first support column 231 may not be provided with the cap 2312, and the function of adjusting the height of the protrusion of the first support column 231 is not affected. However, the provision of the cap 2312 can facilitate the user's application of a screwing force to the post body 2311, thereby facilitating the user's adjustment operation.

In mounting the circuit board assembly 200, a user may first adjust the height of the protrusions of the first support columns 231 in place and then attach the bracket 230 to the circuit board 210. The user may also connect the bracket 230 with the circuit board 210 first, and then adjust the protrusion height of the first support column 231 by screwing. According to the different installation scenes of the circuit board assembly 200, there is no limitation in the sequence of steps between the adjustment of the protrusion height of the first support column 231 and the connection of the circuit board assembly 200.

In some embodiments, to prevent counter-rotation of the first support post 231 under pressure. As shown in fig. 11, a first pawl 132 may be provided at the wall of the fixing hole 131 of the partition 130. Meanwhile, a plurality of second pawls 23121 may be provided annularly along the outer wall circumference of cap 2312. The first pawl 132 cooperates with the second pawl 23121 to enable the cap 2312 to rotate unidirectionally within the fixing hole 131, thereby functioning to prevent the first support column 231 from rotating reversely and preventing the retraction of the first support column 231 (shown in fig. 10).

Of course, as shown in fig. 12, a plurality of first pawls 132 may be provided on the wall of the fixing hole 131, and the plurality of first pawls 132 may be circumferentially provided along the wall of the fixing hole 131. The plurality of second pawls 23121 on cap 2312 are engaged with the plurality of first pawls 132 in fixing hole 131, respectively, and also enable one-way rotation of cap 2312 in fixing hole 131. The number of first pawls 132 is not particularly limited in this application.

To adjust the protrusion height of the first support column 231, the retraction of the first support column 231 is prevented. As another embodiment, as shown in fig. 13, a one-way tooth 2314 may be further provided on the outer wall of the first support column 231. The one-way tooth 2314 may include a beveled surface 23141 and a straight surface 23142. Wherein the inclined surface 23141 is inclined downward in a direction away from the outer wall of the first support column 231. A plurality of unidirectional teeth 2314 may be provided at an outer wall of the first support column 231 in an axial direction of the first support column 231. Meanwhile, a unidirectional hole adapted to the outer diameter of the first support column 231 is formed in the bottom plate 233, and a plurality of tooth holes adapted to the unidirectional teeth 2314 are formed in the wall of the unidirectional hole.

In this way, the height of the protrusion of the first support column 231 can be adjusted by adjusting the engagement between the plurality of one-way teeth 2314 and the tooth holes. Meanwhile, the straight surface 23142 of the one-way tooth 2314 can prevent the retraction of the first support column 231, thereby realizing the function of one-way movement of the first support column 231. Of course, if the plurality of unidirectional teeth 2314 are arranged in a spiral distribution, the first support column 231 can be unidirectionally moved toward the circuit board 210 by plugging or screwing. At the same time, the device is retracted by reverse screwing.

The bracket 230 in this example may be directly provided as a part of the housing body 100. For example, the bottom plate 233 of the bracket 230 may be integrally formed with the housing body 100, the first support column 231 and the frame 232 are directly disposed on the housing body 100, and the first support column 231 and the frame 232 are disposed toward the mounting cavity of the housing body 100. At this time, the circuit board 210 may be directly mounted on the first support column 231 of the housing body 100, and the problem of low thermal contact reliability between the chip 220 and the heat sink 240 can be solved.

As shown in fig. 14, since the circuit board 210 may be designed with electronic devices 212 such as capacitors and resistors on the side of the bracket 230, it is necessary to keep the first support posts 231 away from the electronic devices 212. In some embodiments, the first support columns 231 may be arranged in a solid cylindrical configuration when the electronic devices 212 are more discrete. Of course, the first support columns 231 may be configured in a solid square column structure, so that the electronic devices 212 are distributed on the outer periphery of the first support columns 231. The cross-sectional shape of the first support column 231 is not particularly limited in this application.

When the electronic devices 212 are gathered, as shown in fig. 15, a first avoidance hole 2315 may be further provided on the first support column 231. For example, the first avoidance holes 2315 may be configured as a hollow square column structure or the first avoidance holes 2315 may be configured as a hollow cylinder structure as shown in fig. 16 according to different distribution shapes of the electronic devices 212. So that the electronic devices 212 can be distributed inside and around the first support columns 231. Of course, if the height of the electronic device 212 protruding out of the circuit board 210 is not large, the first avoidance hole 2315 may be set to be a blind hole opened toward the circuit board 210, so that the first support column 231 can avoid the electronic device 212.

It should be noted that, the opening manner of the first avoiding hole 2315 and the structural form of the first supporting column 231 may be overlapped with each other. For example, as shown in fig. 17, the first support column 231 having the first avoidance hole 2315 may be screw-coupled with the bottom plate 233 as in the previous embodiment, thereby realizing the function of adjusting the protrusion height of the first support column 231.

In addition, the first support column 231 having the first escape hole 2315 is also applicable to a case where a plurality of one-way teeth 2314 are provided on the outer wall of the first support column 231. That is, the first support column 231 having the first escape hole 2315 may be connected to the bottom plate 233 through the one-way teeth 2314, in addition to being connected to the bottom plate 233 through a screw.

In order to increase the rigidity of the pallet 23, the stability of the first support column 231 to support the circuit board 210 is enhanced. In some embodiments, when the electronic devices 212 distributed on the circuit board 210 are relatively concentrated around the first support columns 231, as shown in fig. 18, the area of the frame 232 may be properly enlarged toward the first support columns 231, thereby functioning to enhance the overall rigidity of the pallet 23. At this time, the electronic device 212 (shown in fig. 16) is retracted through the portion where the frame 232 is not provided.

In other embodiments, the first support column 231 is fixedly coupled to the bottom plate 233. When the electronic devices 212 on the circuit board 210 are distributed on two sides with respect to the first support columns 231, as shown in fig. 19, a reinforcing rib 2321 may be further connected between the frame 232 and the first support columns 231, so as to increase the stability of the first support columns 231. Wherein the stiffener 2321 may be disposed at a location where no electronic devices 212 (shown in fig. 16) are distributed. Of course, three, four or more reinforcing bars 2321 may be further connected between the rim 232 and the first support column 231. The ribs 2321 may also be disposed between the opposing or adjacently disposed rims 232. For example, the plurality of reinforcing ribs 2321 may be disposed in a crossing manner or may be disposed in parallel. The specific number and arrangement of the reinforcing bars 2321 are not particularly limited in this application.

In other embodiments, when the height of the electronic device 212 protruding from the circuit board 210 is greater, as shown in fig. 20, a hollowed-out hole 2332 may be further formed on the bottom plate 233 to avoid the electronic device 212 (shown in fig. 16). Of course, the number of the hollow holes 2332 may be two, three or more. When the number of the hollow holes 2332 is plural, the hollow holes 2332 may be symmetrically disposed or asymmetrically disposed. The specific number and location of the openings 2332 are not particularly limited.

If the circuit board 210 is not provided with the electronic device 212 on the side of the bracket 230, the supporting plate 23 may be directly designed as a single-layer flat plate structure. At this time, the rigidity of the pallet 23 may be adjusted by the thickness of a single flat plate. The frame 232 is not required to be arranged, the hollowed-out holes 2332 are not required to be formed in the bottom plate 233, the reinforcing ribs 2321 are not required to be arranged, and therefore the structure of the bracket 230 is simplified, and the manufacturing difficulty of the bracket 230 is greatly reduced.

Example two

The bracket 230 of the above example achieves a rigid support effect for the circuit board 210 by the structural manner in which the supporting plate 23 is combined with the first supporting column 231. As another embodiment, the bracket 230 may also be designed as a prefabricated component, thereby achieving a flexible support for the circuit board 210. The bracket 230 will be described in detail below.

As another embodiment, as shown in fig. 21, the bracket 230 may be designed in a pre-bent structure. The bracket 230 may include a horizontal portion 02 and a convex portion 03 in a ridge shape. When the bracket 230 is connected to the circuit board 210, as shown in fig. 22, the bracket 230 is bent and deformed together with the circuit board 210, and thus the circuit board 20 is deformed to cry.

The present embodiment not only can ensure effective support of the circuit board 210 by converting deformation of the bracket 230 into bending stress, but also can improve reliability of thermal contact between the heat spreader 240 and the chip 220. And the circuit board 210 is bent and deformed together with the bracket 230, without the need for manual adjustment of the projection height of the bracket 230, so that the entire circuit board assembly 200 tends to be self-adapting.

In some embodiments, the bracket 230 may be designed as an arched bracket cover 260 as shown in fig. 23. The arched deck 260 may include four annularly distributed tabs 261. Each of the trays 261 is generally fan-shaped and each of the trays 261 has oppositely disposed first and second ends 2611, 2612. The first end 2611 refers to an end where two straight edges of the fan-shaped supporting piece 261 converge, and the second end 2612 refers to an end where an arc edge of the fan-shaped supporting piece 261 is located. In addition, the first end 2611 is arched relative to the second end 2612.

On this basis, as shown in fig. 23, the first ends 2611 of the four blades 261 are connected so that the whole arched bracket 260 takes a circular planar shape and takes an arched cover shape with a raised middle portion. The second ends 2612 of two adjacent brackets 261 have a gap 262 therebetween, and the gap 262 can provide a deformation space when the arched bracket cover 260 is bent, so that the bracket 230 has a certain elastic force and can generate elastic deformation. Wherein the connected and raised first ends 2611 form a boss 03 (shown in fig. 21) for abutting against the circuit board 210 (shown in fig. 22), or a portion of the first ends 2611 are located within the boss 03.

The protrusion 03 in this example refers to a portion of the bracket 230 that protrudes. The protruding portion 03 may be the first ends 2611 of all of the supporting pieces 261, or may be the first ends 2611 of part of the supporting pieces 261. That is, the protruding portion 03 is a portion of the bracket 230 that is configured to abut against the circuit board 210 and deform the circuit board 210 to cry.

It is understood that the gaps 262 between the second ends 2612 of the four blades 261 are not required. At this time, the entire arched deck 260 is a rigid member that is not deformable. The rigid arched deck 260 also deforms the circuit board 210 crying, and the rigid arched deck 260 deforms the circuit board 210 crying, similar to the first support post 231 in the example one in which the support plate 23 is combined with the first support post 231.

Further, as shown in fig. 23, a connection piece 263 is further connected to the second end 2612 of each of the brackets 261, and the connection piece 263 is connected to a side remote from the first end 2611. At this time, the connection piece 263 may serve as the horizontal portion 02 of the arch-shaped cap 260. Each connecting piece 263 is provided with a connecting hole b so that the arched bracket cover 260 can be connected with the circuit board 210 (shown in fig. 22) through the connecting hole b. Wherein the positions of the connection holes b correspond to the positions of the through holes on the circuit board 210. The manner in which the arched deck 260 is connected to the circuit board 210 can be referred to the previous embodiments, and will not be described herein.

It will be appreciated that the number of tabs 261 in arched deck 260 may be two, three or more, and that the particular number of tabs 261 is not particularly limited in this application. In addition, each of the tabs 261 may be configured in a generally triangular shape as shown in fig. 24, such that the overall arched deck 260 has a square or rectangular planar shape. The specific shape of the blade 261 is not particularly limited in this application.

The bracket 230 in this example may be directly provided as a part of the housing body 100. For example, the supporting piece 261 in the bracket 230 may be integrally formed with the housing body 100, the arched supporting cover 260 is directly disposed on the housing body 100, and the arched supporting cover 260 is disposed towards the mounting cavity of the housing body 100. At this time, the circuit board 210 may be directly mounted on the arched cover 260 of the housing body 100, and the problem of low thermal contact reliability between the chip 220 and the heat sink 240 can be solved.

To avoid the electronics 212 on the circuit board 210. In some embodiments, as shown in fig. 25, a second relief hole 265 may be provided in the arched deck 260. As shown in fig. 26, the middle portion of the arched bracket 260 is raised, and the arched bracket 260 has an abutment surface 26 facing to the side of the circuit board 210 (shown in fig. 22), and the second avoidance hole 265 may be opened on the abutment surface 26 to avoid the electronic device 212 on the circuit board 210.

When the height of the electronic device 212 protruding from the circuit board 210 is small and the thickness of the arched cover 260 is large, the second avoiding hole 265 may be designed as a blind hole structure as shown in fig. 26. Alternatively, when the height of the electronic device 212 protruding from the circuit board 210 is large and the thickness of the arched bracket 260 is small, the second avoiding hole 265 may be designed as a via structure as shown in fig. 27.

On this basis, if the arched deck 260 is not bent enough to deform the circuit board 210 due to the limited material, the arched deck 260 may further include a second support post 266 as shown in fig. 28. One end of the second support column 266 is connected to the abutment surface 26 of the arched bracket 260, and the other end of the second support column 266 is adapted to abut against the circuit board 210. The second support post 266 may be disposed on either the blind via structure as shown in fig. 28 or the via structure as shown in fig. 29.

The second support column 266 may be a solid square column, a solid cylinder, a hollow square column, or a hollow cylinder. In addition, the second support post 266 may be threaded or unidirectionally engaged with the arched deck 260. That is, the structural form and the connection manner of the second support column 266 may refer to the structural form and the connection manner of the first support column 231 in example one, and will not be described herein.

In other embodiments, as shown in fig. 30, the structural form, the arrangement position and the arrangement manner of the second avoidance holes 265 and the second support columns 266 are also applicable to the case where the arched bracket cover 260 has a square or rectangular planar shape, which will not be described herein.

It should be noted that, the arched bracket cover 260 according to the present embodiment is not limited to the structure formed by connecting the plurality of brackets 261. As another embodiment, as shown in fig. 31, the arched bracket cover 260 may be designed as an arched bridge.

When the arc bridge is connected to the circuit board 210, the arc top of the arc bridge may be directed toward the board surface of the circuit board 210. When the arc bridge is connected to the circuit board 210, the arc bridge can also bend and deform together with the circuit board 210, so that the circuit board 20 can generate crying face deformation.

It will be appreciated that two, three or more arc-shaped bridges may be stacked such that the arc tops of the arc-shaped bridges overlap and the arc-shaped bridges intersect each other, thereby enabling the circuit board 210 to be effectively supported at different positions. Of course, a plurality of arc bridges may be parallel to each other to support different portions of the circuit board 210.

The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

A circuit board assembly, comprising:

a circuit board;

the chip is arranged on the circuit board;

a heat sink covering the chip, and having a periphery fixedly connected to the circuit board; the method comprises the steps of,

the bracket comprises a horizontal part fixedly connected with the circuit board and a protruding part protruding out of the horizontal part and propping against the bottom of the circuit board;

Wherein the circuit board is fixed on a housing of the electronic device, and the bracket is provided on the housing.
The circuit board assembly of claim 1, wherein the perpendicular projection of at least a portion of the boss onto the circuit board is within the range of the perpendicular projection of the chip onto the circuit board.
The circuit board assembly of claim 1 or 2, wherein the bracket comprises:

the supporting plate is used as the horizontal part and is fixedly connected with the circuit board; the method comprises the steps of,

the first support column is used as the protruding part, the first end of the first support column is propped against the bottom of the circuit board, and the second end of the first support column is connected with the supporting plate.
The circuit board assembly of claim 1 or 2, wherein the bracket comprises:

the supporting plate is used as the horizontal part and is fixedly connected with the circuit board, and is provided with a threaded hole; the method comprises the steps of,

the first support column is used as the protruding portion, external threads are arranged on the outer wall of the first support column, and the first end of the first support column penetrates through the threaded hole to be in threaded connection with the supporting plate and abuts against the bottom of the circuit board.
The circuit board assembly according to claim 4, wherein a fixing hole is formed in the shell, a plurality of first pawls are arranged on the hole wall of the fixing hole, and the plurality of first pawls are arranged around the hole wall of the fixing hole in a circle;

the first support column includes:

the outer surface of the column body is provided with the external threads, and the first end of the column body is propped against the bottom of the circuit board; the method comprises the steps of,

the second pawls are positioned at the second end of the column body and are arranged around the periphery of the outer surface of the column body;

wherein a plurality of the first pawls are engaged with a plurality of the second pawls.
The circuit board assembly of any one of claims 3 to 5, wherein the carrier comprises:

the first end of the first support column is propped against the bottom of the circuit board, and the second end of the first support column is connected with the bottom plate; the method comprises the steps of,

the frame is arranged between the bottom plate and the circuit board, a first surface of the frame is connected with the bottom plate, and a second surface of the frame is propped against the bottom of the circuit board;

the frame surrounds one circle of the first support column, and forms an avoidance space with the bottom plate, and the avoidance space is used for avoiding electronic devices on the circuit board.
The circuit board assembly of claim 6, wherein, in the case where the bracket includes a pallet and a first support column, wherein the pallet is fixedly connected with the circuit board as the horizontal portion; the first support column is used as the protruding part, the first end of the first support column is propped against the bottom of the circuit board, and the second end of the first support column is connected with the supporting plate;

the pallet further comprises:

and the reinforcing rib is connected between the first support column and the frame.
The circuit board assembly according to any one of claims 3 to 7, wherein,

the first support column is towards one end of the circuit board is provided with a first avoidance hole, and the first avoidance hole is used for avoiding electronic devices on the circuit board.
The circuit board assembly of claim 1 or 2, wherein the carrier is a sheet-like structure; the convex part of the bracket comprises an arch-shaped supporting cover, and the horizontal part is arranged around the periphery of the arch-shaped supporting cover; the arched bracket cover is raised towards the bottom of the circuit board relative to the horizontal part and is propped against the bottom of the circuit board.
The circuit board assembly of claim 9, wherein the carrier comprises a plurality of blades distributed annularly;

The support sheet is provided with a first end and a second end which are oppositely arranged, and the first ends of the support sheets are connected and propped against the bottom of the circuit board; a gap is arranged between the second ends of two adjacent brackets.
The circuit board assembly of claim 9, wherein the boss further comprises a second support post;

the first end of the second support column is connected with the arched supporting cover, and the second end of the second support column is propped against the bottom of the circuit board.
The circuit board assembly of claim 9, wherein the circuit board assembly further comprises a plurality of circuit boards,

the arch holds in the palm the lid towards the one side of circuit board has been seted up the second and has been dodged the hole, the second dodges the hole and be used for dodging electronic device on the circuit board.
The circuit board assembly according to any one of claims 1 to 12, wherein the protruding height of the protruding portion protruding from the horizontal portion is 100 μm to 2 mm, and the direction of the protruding height is perpendicular to the board surface of the circuit board.
The circuit board assembly according to any one of claims 1 to 12, wherein the circuit board is provided with a plurality of through holes distributed on the periphery of the chip;

The horizontal part of the bracket is provided with a connecting hole, and the connecting hole corresponds to the position of the through hole;

the circuit board assembly further comprises a plurality of studs, each stud is arranged on the radiator and penetrates through the connecting hole and the through hole, and the radiator is fixedly connected with the circuit board through the studs.
An electronic device, comprising:

a housing; the method comprises the steps of,

the circuit board assembly of any one of claims 1 to 14 mounted within the housing.
The electronic device of claim 15, wherein the housing comprises:

the shell body is provided with an installation cavity; the method comprises the steps of,

at least one partition plate arranged in the housing body and dividing the mounting cavity into at least two sub-mounting cavities, wherein the circuit board assembly is mounted in the sub-mounting cavities;

the circuit board is fixedly connected to the partition board, and the bracket is arranged between the circuit board and the partition board.
A bracket, which is characterized in that the bracket is arranged between a circuit board and a shell of an electronic device; the bracket comprises a horizontal part fixedly connected with the circuit board and a protruding part protruding out of the horizontal part and propping against the bottom of the circuit board.
The cradle of claim 17, wherein the electronic device further comprises a chip disposed on the circuit board;

and the vertical projection of at least one part of the convex part on the circuit board is positioned in the range of the vertical projection of the chip on the circuit board.
A carrier in accordance with claim 17 or 18, characterized in that the carrier comprises:

the supporting plate is used as the horizontal part and is fixedly connected with the circuit board; the method comprises the steps of,

the first support column is used as the protruding part, the first end of the first support column is propped against the bottom of the circuit board, and the second end of the first support column is connected with the supporting plate.
A carrier in accordance with claim 17 or 18, characterized in that the carrier comprises:

the supporting plate is used as the horizontal part and is fixedly connected with the circuit board, and is provided with a threaded hole; the method comprises the steps of,

the first support column is used as the protruding portion, external threads are arranged on the outer wall of the first support column, and the first end of the first support column penetrates through the threaded hole to be in threaded connection with the supporting plate and abuts against the bottom of the circuit board.
A carrier according to claim 17 or 18, wherein the carrier is of sheet-like construction; the convex part of the bracket comprises an arch-shaped supporting cover, and the horizontal part is arranged around the periphery of the arch-shaped supporting cover; the arched bracket cover is raised towards the bottom of the circuit board relative to the horizontal part and is propped against the bottom of the circuit board.