CN1175716C - Method for making printed circuits and resulting printed circuit - Google Patents
Method for making printed circuits and resulting printed circuit Download PDFInfo
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- CN1175716C CN1175716C CNB961803762A CN96180376A CN1175716C CN 1175716 C CN1175716 C CN 1175716C CN B961803762 A CNB961803762 A CN B961803762A CN 96180376 A CN96180376 A CN 96180376A CN 1175716 C CN1175716 C CN 1175716C
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Abstract
The present invention discloses a method for making printed circuits (21, 31) by a nonconductive film (1) covered by one or a plurality of conductive metal layers (2, 2'), which comprises the working procedure of making various conductive passages (8) by mechanically processing grooves (7) on the conductive layers. The processing is carried out by a sharp cutting tool (5, 10); a plurality of grooves can be cut among the conductive passages without the need of removing any conductive material or the downward cutting of the material; for example, a cutting workbench of a swaging puncher (5) or a control blade (10) can be used for cutting the grooves. The method is suitable for making a multilayer circuit, and is especially suitable for producing flexible printed circuits, joints, inductive coils (23) used in beautiful cards (20, 30), etc.
Description
Technical field
The present invention relates to a kind of method of producing printed circuit.In addition, the invention still further relates to a kind of printed circuit of making according to this method, for example, its circle circle is that the passage by this printed circuit constitutes a kind of inductance coil.
Background technology
In chip card and transponder technology, often wish that with an inductance coil and an electronic circuit for example, an integrated circuit that is installed on the printed circuit board connects.For example, a kind of like this structure has just been described in WO91/19302.Generally, this coil is made around a lead being wrapped in a fuse.This coil manufactures more complicated, and therefore, price is higher.In addition; the problem that connection between this printed circuit and this coil also can bring other to install; and reliability also is a problem, particularly when these elements be to be integrated in one when not having on the chip card of due care to distortion and mechanical stress, more these problems can appear.In addition, when must being integrated in a pocket device, or hope thickness that maintains the standard is in 0.76 millimeter the chip card time, and the thickness of this coil also becomes a problem often.
In order to reduce these difficulties, known have some to install, and its inductance circle circle is that direct conductive channel by this printed circuit constitutes.Generally, the passage of this printed circuit utilizes the manufacturing of photochemical method, and this just needs many expensive operations and uses the material that pollution is arranged.
United States Patent (USP) has illustrated that a kind of is the method for mechanical production printed circuit basically for No. 4555291.In advance, the metallic film with a thin limit cuts into spiral-shaped.In order to make this spiral that cuts out have enough rigidity, different circle circles are not exclusively separated.Then, this screw fixed on the sheet material that an electrically non-conductive material is made, and is devoted oneself to work second cutter sweep, block interconnecting between each circle circle, thereby obtain the circuit of an inductive nature.
This method uses complicated, and needs two different cutting actions especially.The thickness of the metallic film that this cuts out in advance is must be enough big, makes can not produce in the transportation to be out of shape or to be torn to shreds.The width at the width of each circle circle and the interval that cuts out between each circle circle equally must be enough big, be layered in this nonconducting supporting with assurance before, the rigidity minimum of this film.
The known method that also has other to produce printed circuit, they cover the film that synthetic material is made from utilizing a surface conductance layer.Then, utilize two pressing molds that described conductive layer is carried out mechanical stamping, on this surface conductance layer, mark off different conductive channels.For example, French Patent (FRP) FR-2674724 number, British patent GB-1138628 number or U.S. Pat-No. 4356627 have illustrated a kind of so several modification of method.Utilize these process for stamping to be difficult to obtain the very little passage of width.In addition, this synthesis material film must have enough thickness, with the supporting punching press pressure, and even in the zone of being compressed into by this pressing mold, also should keep enough rigidity.
The method of the production printed circuit that other is known is from covering a synthesis material film with a surface conductance layer, they comprise this superficial layer by this printed circuit of cutting, mark off the operation (referring to German patent DE-No. 3330738 and U.S. Pat-No. 4138924) of the different conductive channels that constitute this printed circuit.Like this, the space between the conductive channel must have enough big width, and this width should adapt with the width of milling cutter at least.Therefore, can not obtain the optimum density of passage.In addition, cutting also can produce smear metal, must remove these smear metals carefully, to prevent issuable short circuit between each passage.When the material of this surface metal-layer, when for example silvery is made, can cause the waste of material by costliness.
German patent DE-No. 2758204 has illustrated a kind of production circuit, the method of the inductance of printed circuit form particularly, it is to mark off the different passages of the circle circle that constitutes this coil by the synthesis material film that covers a surface metal-layer being carried out hot machining.A heated metal point of a knife 3 this surface metal-layer of dashing forward, and make the part fusing of this synthesis material film layer below this metal simultaneously.
This method is specially adapted to produce different types of device, or thickness is not the coil of key factor.This synthesis material film layer 1 must be enough thick, makes this point of a knife 3 can make otch, and in the heated while, can not cut logical fully.In addition, the control of the temperature of this point of a knife is also had any problem, and this metal point of a knife 3 must move very slowly, so that this synthetic material can reach melt temperature.Therefore, this method is not suitable for, and for example, must be integrated on the beautiful card and thickness and cost and all necessary production that keeps the coil of minimum of manufacturing time.
Summary of the invention
For overcoming above-mentioned defective, an object of the present invention is to provide a kind of improved method of producing printed circuit, especially for producing the method that its circle circle is the inductance coil of a kind of chip card of constituting of the conductive channel by this printed circuit.
For achieving the above object, the invention provides a kind of method of producing electronic module, it comprises following operation: on a non-conductive film that is covered with a surface conductance layer, utilize a cutting instrument, described surface conductance layer is carried out machining, mark off the different conductive channel of a printed circuit, cut out the otch that described conductive channel is separated, and do not need to apply side pressure removal electric conducting material or make groove at depth direction by at least one side at conductive channel; At least one electronic component is connected with described conductive channel; At least one screening glass is assemblied on the described printed circuit.
In addition, the surface planarity of the printed circuit that draws of said method is very good.When this printed circuit is integrated on the chip card, can obtain absolute flat outer surface easilier, this will make various possible easier the carrying out of characteristic printing.
The invention still further relates to the printed circuit that utilizes this method to produce, the coil or the joint that particularly utilize this method to produce.In addition, the invention still further relates to and comprise a coil of making in this way, and/or the chip card of a printed circuit of making in this way.
Various scheme of the present invention can also further increase the density of resulting printed circuit and/or the inductance of resulting coil.
Description of drawings
Fig. 1 is suitable for the present invention to use, and is covered with the profile of a non-conductive film of a surface conductance layer;
Fig. 2 is covered with the profile of a non-conductive film of a surface conductance layer for pressing mold with before marking off conductive channel;
Fig. 3 is after marking off this conduction energising, is covered with the profile of a non-conductive film of a surface conductance layer;
Fig. 4 is covered with the profile of a non-conductive film of a surface conductance layer for after marking off this conductive channel on each surface on each surface;
Fig. 5 is covered with the profile of a non-conductive film of a plurality of surface conductance layers for after marking off this conductive channel on a surface;
Fig. 6 is covered with the profile of a non-conductive film of a plurality of surface conductance layers for after marking off this conductive channel on a surface;
Fig. 7 is the end view of the different cutting tool that can use in the method according to the invention;
Fig. 8 is according to of the present invention, on a single surface, comprises the perspective view of a kind of chip card of a printed circuit;
Fig. 9 is according to of the present invention, comprises the perspective view of a kind of chip card of a printed circuit between two block protection sheets;
Figure 10 is before bending, the perspective view of a printed circuit of making according to the scheme of the present invention that comprises a bending operation.
Embodiment
Fig. 1 surface coverage the profile of a film 1 of a surface conductance layer 2.This film 1 is preferably by any non electrically conductive material, and for example, the synthetic material of PVC form or cardboard constitute.According to the difference of application scenario, can select a flexible thin film, or opposite, select a better rigidity substrate.This film 1 also can be made of composite material or multilayer material, for example, comprises synthetic material, cardboard and/or the metal material of many layers.
This surface conductance layer 2 can use a kind of known method to be added on this film 1, and, for example, can pass through soldered, or utilize bonding agent 4 to remain on this film.This bonding agent 4 for example, can be the bonding agent of hot curing or the bonding agent of cold curing, also can be without bonding agent 4, and use a kind of two-sided adhesive sheet or a kind of film of heat bonding.This layer 2 is by corresponding metal, copper for example, and aluminium, silver-colored or a kind of electrical conductivity alloy is made.
In a kind of scheme of the present invention, this surface conductance layer 2 is to utilize glue to stick on the sheet metal, rather than sticks on the nonconducting film.Like this, the insulation between the conductive channel (seeing following) only guarantees that by this layer bonding agent 4 this layer bonding agent 4 plays non-conductive film.In this case, this layer bonding agent 4 must be complete electric insulation.
Fig. 2 is illustrated in and marks off before the conductive channel, the profile of a pressing mold 5 on a nonconducting top surface.This pressing mold 5 has the surface 6 of the sharp edges that contacts with this superficial layer 2 on this synthesis material film 1.
Utilize a device that does not illustrate, this pressing mold 5 is descended, its pressure is enough to make the contact surface 6 of this sharp edges to be bored a hole on this surface metal-layer 2 and cuts this superficial layer.The profile on surface 6 is made enough sharp, like this, do not need as in method for milling, remove electric conducting material, do not need as at the process for stamping described in British patent GB-1138628 number yet, make groove at depth direction, this pressing mold can cut out tiny otch on this superficial layer 2.Here, according to the present invention, this metal material is by surface 6 cuttings.
Fig. 3 is illustrated in and marks off after the conductive channel 8, has covered the profile of a non-conductive film 1 of a metal level 2.As can be seen from the figure, the degree of depth of this otch 7 is enough to pass this metal level 2 just, this presumable bond layer 4, and may be tangent with this nonconducting synthetic material layer 1.In a scheme of the present invention, 7 at this otch passes completely through this surface metal-layer, and the bottom of this otch is near this bond layer 4.Like this,, this synthesis material film 1 can be made a little less than need such, can obtain minimum thickness by the border between the processing conductive channel 8.
In order to optimize the density of the conductive channel 8 on this printed circuit, the width of this otch 7 should be tiny as far as possible.Particularly, if this substrate 1 is flexible, then its width must be enough, to avoid taking place conductive channel 8 risk of short-circuits.
Suitably conductive channel 8 is arranged in, spirality for example can easily draw its circle circle and be the inductance element that the conductive channel by this printed circuit constitutes.Then, carry out traditional manufacturing procedure that some replenish again, for example drilling and soldering promptly can be fixed on various discrete elements on the printed circuit of making like this.
Fig. 4 is illustrated in and marks off on each surface after the conductive channel 8, is covered with the profile of a non-conductive film 1 of a surface conductance layer 2 on each surface.Determine this otch 7 of each lip-deep passage 8, be preferably in one single operation and make.In order to accomplish this point, can will closely be clamped between two pressing mold (not shown)s at this non-conductive film 1 that all is covered with a conductive layer 2 on each surface, the edge on the surface 6 that contacts with this metal surface of each pressing mold is all made sharp.Yet, also can in two operations, on these two surfaces, make otch 7, finish another surperficial otch of doing again afterwards on a surface.
Because the method according to this invention can be used for the very little non-conductive film 1 of thickness, therefore, it is by being superimposed upon the capacity cell that each lip-deep this metal passage constitutes that this scheme of the present invention can be made two flat board very simply.These elements for example can combine with inductance element, the LC resonant circuit that the formation capacity is little.If must reduce two capacitive coupling between the lip-deep passage, then should be chosen on two surfaces the conductive channel pattern that overlap joint is minimum.
Fig. 5 is illustrated in and has divided after the conductive channel, is covered with the profile of a non-conductive film of a plurality of surface conductance layers therein on surface.In this example, this non-conductive film 1 is covered by ground floor bonding agent 4 first fixing metallic films 2.Second metallic film 2 ' is fixed on this first film 2 by second layer bonding agent 4 '.This second layer bonding agent 4 ' also is that the insulator between 2 ' works as these two metal levels 2.If necessary, also can between these two metal levels, insert an additional insulating barrier, for example an additional synthetic material layer.Certainly, also can superpose more than the metal level of two metal levels 2,2 ', one is layered on another layer.
In this scheme of the present invention, the cutting tool 5 that is used for that this conductive channel 8 is separated is designed to cut out enough dark otch, so that in single operation, can pass all metal levels 2,2 ' etc.Like this, the pattern that is made of the conductive channel 8 that waits at different conductive layer 2,2 ' is identical.By going up in position, for example utilize the hole of spray metal, this different layer is connected to each other, the structure that draws like this can obtain the circuit of big inductance.
Certainly produce the multilayer circuit that on different layers, has different patterns.Fig. 6 is illustrated on its upper surface, is covered with four surface conductance layers 2,2 ', 2 ", 2 , and with bonding agent 4,4 ', 4 ", the example of 4 insulation and a nonconducting film 1 interfixing.Here, the degree of depth of this otch 7 that is processed in a single operation by this cutting tool changes, some otch 7 " can pass the layer of the spray metal of all stacks; other otch 7 then only by should above one deck 2 ; have some otch 7 ' can pass a plurality of layer 2 again; 2 ", but can not pass all layers.Like this, can on different layers, realize the different layouts of passage.
Have only some special, conductive channel on its metal level 2 below is to go up the circuit that constitutes by one or more passages are placed superincumbent layer side by side, can on plural layers, process otch and obtain by in a single operation.In order to be able on each layer, the layout of its conductive channel is this fully freely multilayer circuit, must consider the operation that a plurality of orders are carried out in advance:
First lower floor of one or more spray metals is layered on the nonconducting film;
Process otch, on this ground floor or a plurality of ground floor, mark off conductive channel;
Top spray metal is gathered into folds layer by layer;
Process otch, on this upper strata or a plurality of upper strata, mark off conductive channel.
Certainly, the person skilled in the art should understand, and can freely above-mentioned several schemes synthesis be got up.For example, can obtain on each surface, covering the circuit of a plurality of surface conductance layers.
As mentioned above, utilize to have to contact, have the pressing mold of the contact surface of sharp edges to process otch 7,7 ', 7 with this surface conductance layer ", be very efficiently, but need to make in advance the pressing mold that has border pattern between the conductive channel.Therefore, this method only is applicable to the printed circuit of making in enormous quantities or medium batch.In addition, for the otch that guarantees this metal level is smooth, the cutting surface of necessary often replacing or this pressing mold of sharpening.
Be specially adapted in the scheme that small lot or sample make this otch 7,7 ', 7 a kind of " for example can utilize and cut at the known a kind of common cutting workbench in bonding film field of cutting for propaganda or other movable usefulness.In this case, on a computer, utilize the border pattern between each conductive layer of design of software corresponding in advance, be stored in the electronic memory then.Then, the order of utilizing this design to go to be controlled at a blade 10 on this cutting workbench again moves.
Some cutwork platform can be in the direction of this blade of quadrant inner control, and/or the reciprocating motion of this blade.As a result, the shape of this blade 10 for example can be selected from several schemes of Fig. 7 and according to this metal layer thickness that will cut.This blade should be enough sharp, so that do not need to remove electric conducting material, or need not make groove at depth direction, promptly can cut this superficial layer.The width of this blade is minimum, therefore can keep the width maximum of conductive channel 8.The depth of cut of this blade should can be passed this surface metal-layer just, and can not weaken this non-conductive layer 1 too much.Like this, the thickness of this non-conductive layer 1 should reach minimum.If in order to produce the different multilayer circuit (Fig. 6) of pattern on different layers, and need the otch of change in depth, then must when the degree of depth changes each time, all change this blade.Can also use the cutting workbench of the blade grip slipper that has a plurality of blades of equipping different depth, or the device of this blade penetration degree of depth of may command is set.
When under the situation of this printed circuit distortion, this otch once more mutually near the time, fill flexible different with this substrate 1 according to this otch 7 wide, have the danger of electric contact between the adjacent conductive passage 8.If desired, any synthetic material or thermoplastic can be inserted or be melted in this otch 7, guaranteeing in all cases, conductive channel is spaced-apart electric.
The present invention is specially adapted to make width and weight can reduce to minimum printed circuit.For example, for the printed circuit that is used on the chip card, this method is more satisfactory.Fig. 8 represents the example according to a chip card 20 of the present invention.
According to the present invention this chip card by with Fig. 3, the printed circuit 21 on the single surface that a scheme in Fig. 5 or the scheme shown in Figure 6 adapts constitutes, it has a top screening glass or ornament 22.The lower surface of not making this sheet material 21 of passage can print equally.This printed circuit 21 is by formations such as the enough big substrate 1 of rigidity and one or more surface conductance layers 2,2 '.According to above-mentioned method, on this conductive layer, process otch 7, to form a spiral conductive channel 8, like this, can constitute an inductance element 23.The circle number of turns of this inductance element is selected according to the number of turn of desirable inductance size.Because processing method of the present invention can process the otch 7 of width minimum between circle circle 8, therefore, can hold maximum circle circles on a given surface, so just can obtain big inductance.In order to increase inductance more, can select to wait the circuit of forming according to the example of Fig. 5 or Fig. 6 by several conductive layers 2,2 '.
In this example, in the part of the bottom sheet material 21 that is not occupied, for the inside at this inductance element 23 is provided with a mounting yoke 24 by conductive channel 8.In this mounting yoke 24, fixing an integrated circuit 25, and it is connected with the two ends of this inductance element 23.Can be directly the interior face portion of this integrated circuit 25 and this inductance element 23 be coupled together.On the other hand, a bridge 26 by on this circle circle 8 can couple together the exterior portion of this integrated circuit and this inductance element.This bridge 26, for example, can by this above conductive channel 8 or below the wire of a simple soldering constitute.When printed circuit is made of several conductive layers, can also utilize the layer 2,2 ' of this a spray metal layer in waiting to be used as this bridge 26.At last, before this conductive layer 2 is stacked, this bridge can be integrated in this substrate 1.
Different according to desirable application scenario and the remaining space that is had on this card can be integrated in other element except this integrated circuit 25 and this inductance element 23 on this printed circuit 21.For example, can place an energy-storage travelling wave tube (not shown) on this printed circuit, this energy-storage travelling wave tube can utilize this inductance element 23, charges once more from the outside.These other elements preferably are connected to each other, and the conductive channel by utilizing said method to process on this surface conductance layer or a plurality of conductive layer 2, are connected with 25 with element 23.
The personnel that are skilled in technique will find, opposite with the method for most of known prior arts, utilize the method according to this invention, the surface irregularity that manufacturing conductive channel 8 is produced on this printed circuit is significantly few, and this surface irregularity can also be compensated by bonding agent.Therefore, this top screening glass 22 can be installed with comparalive ease, and obtain an absolute flat outer surface.
If necessary, the mounting yoke 24 of this integrated circuit 25 in this bottom sheet material 21 can be corresponding with the corresponding mounting yoke in the top screening glass 22.Can also not need this mounting yoke 24 in this bottom sheet material 21, and use a darker corresponding mounting yoke in this top screening glass 22.In a scheme of the present invention; this top screening glass 22 and/or bottom sheet material 21 all have a window; rather than a mounting yoke, so that this integrated circuit 25 is revealed in the outside of this card, the attachment plug of this integrated circuit 25 or contact then are connected with this integrated circuit 25.
Fig. 9 represents second example according to a chip card 30 of the present invention.
In this example, this card is installed in the printed circuit 31 that this time screening glass 27 and goes up between the screening glass 22 by one and constitutes, for example, and according to a circuitron of the example of Fig. 4.This screening glass 22 and 27 can utilize any known method, for example is installed on this printed circuit 31 with glue is sticking, then, can print.In this scheme, though this printed circuit 31 if necessary, can comprise many conductive layers, preferably the thickness minimum of this printed circuit 31 on each surface.This time screening glass 27 and should on the screening glass 22, be respectively equipped with the mounting yoke 28 and 29 of this integrated circuit 25.Certainly, according to the difference of operating position, also can use a single mounting yoke 28 or 29, and/or replace at least one mounting yoke 28 or 29 with a window, making can be from the outside of this card, near this integrated circuit 25, or near the contact that is connected with this integrated circuit 25.
Obviously, the scheme of Fig. 9 is also applicable to the printed circuit 21 of single face.
According to the present invention, can use some other that printed circuit is installed in method on the chip card.For example, can use the certain methods (, the text of introducing this patent is for reference) that in patent application WO94/22111, proposes here, or a kind of method in the method for the various prior arts described in this application.
Figure 10 represents to be in the printed circuit according to the middle fabrication stage of the method for a scheme of the present invention.In this printed circuit, the exterior portion 26 of integrated circuit 25 and this electric induction spare 23 is easy to be connected.This scheme can be used for, and for example, the safety label that the protection commodity are used also can be used for chip card or other device.Can be on a flexible substrate 1, for example, in the supporting of a cardboard, utilize above-mentioned method to process to comprise the printed circuit of the part of inductance element 23 forms.23 of this inductance elements occupy all surfaces only about half of of this substrate 1.An end in two ends 26 of this inductance element 23, this sheet material 21 another half on extend.This end for example, can constitute with exterior portion soldering this inductance element 23 wire together separately by one.In this scheme, this end 26 can utilize above-mentioned method, processes by cutting in this surface conductance layer 2.The remainder of this surface duct 2 on half of this sheet material 21 can be removed, and only stays this end 26.
In a zone that is not occupied of this sheet material 21, (in this example, be inside), an electronics or electric component 25 are installed at this inductance element 23 by conductive channel.This element 25 can for, for example, an integrated circuit or a fuse.This element 25 utilizes a zone of conductive contact 51, is connected with the interior face portion of this inductance element 23.In addition, this element 25 also is connected with the twoth of conductive contact 52 zone, so that being connected of the end 26 of foundation and this inductance element 23.
After processing the conductive channel that constitutes coil and element 25 be installed, this sheet material 21 occupied by conductive channel half cover by an insulating barrier (not shown).In order to accomplish this point, this inductance element 23 can be used, and for example, one deck insulating varnish or an insulating adhesive sheet cover.Yet this zone of contact 52 covers without insulating barrier.
Then, along a folding axis 53 folding coming, making above-mentioned two, half is overlapping with this sheet material 21 itself.Like this, the end 26 of this inductance element 23 with contact on this zone of contact 52 is electric.Therefore, can be very simply exterior portion and this element 25 of this inductance element 23 be coupled together.For example, can paste by glue, half that two of this sheet material 21 are folding is fastened to each other.
The method according to this invention can also be applicable to fully produces flexible printed circuit.Sort circuit can be used for for example making flexible plug and socket connector.In addition, this method is applicable to any situation that needs to obtain the lip-deep passage maximal density of printed circuit fully.
The person skilled in the art knows that this method can also combine use with any other known printed wiring board, its manufacturing method.All right, for example, make such card: its a part of conductive channel is to utilize electrochemical method to obtain, or separate, and remaining conductive channel utilizes the described method processing of claims.
The person skilled in the art should know, though the present invention in this manual, still uses term " printed circuit " as usual specifically at circuit of producing without the printing process of ordinary meaning and card.
Claims (14)
1. method of producing electronic module, it comprises following operation:
On a non-conductive film that is covered with a surface conductance layer, utilize a cutting instrument, described surface conductance layer is carried out machining, mark off the different conductive channel of a printed circuit, cut out the otch that described conductive channel is separated, and do not need to apply side pressure removal electric conducting material or make groove at depth direction by at least one side at conductive channel;
At least one electronic component is connected with described conductive channel;
At least one screening glass is assemblied on the described printed circuit.
2. the method for claim 1, it is characterized by, described non-conductive film is covered by a plurality of mutual insulatings, the surface conductance layer that is superimposed, and the described otch that this conductive channel is separated that processes passes a plurality of surface conductance layers that are superimposed.
3. the method for claim 1, it is characterized by, each surface of described non-conductive film is all covered by one or more surface conductance layers that are superimposed, and by process otch on described conductive layer, can mark off different conductive channels on each surface.
4. the method for claim 1 is characterized by, and described cutting tool is a pressing mold, and this pressing mold has the surface that contacts with this surface conductance layer.
5. the method for claim 1 is characterized by, and described cutting tool is a knife or a blade, and it can sequentially cut out the otch that this conductive channel is separated according to being stored in a pattern in the electronic memory in advance.
6. the method for claim 1 is characterized by, and it also comprises one on described film, processes the operation that at least one holds the mounting yoke of an electronic component that is connected with described conductive channel.
7. the method for claim 1, it is characterized by, it also comprises the operation of an insulating barrier cover part of usefulness conductive channel, with one along a folding axis, folding described non-conductive film, so that between the part of this conductive channel that is not covered, form the operation of at least one electric bridge by described insulating barrier.
8. the method for claim 1 is characterized by, and described at least one screening glass utilizes glue to stick on the described printed circuit.
9. the method for claim 1 is characterized by, and it comprises that one is inserted a kind of material in the described otch, to guarantee the electric operation separately that goes up of different conductive channels.
10. method as claimed in claim 8 is characterized by, and described at least one screening glass utilizes hot sticky subsides method to be assemblied on the described printed circuit.
11. the method for claim 1; it is characterized by; it comprises an operation of preparing a window on described at least one screening glass, and this window can allow from approaching described at least one electronic component in the outside of electronic module, or near the contact that is connected with described electronic component.
12. chip card, it comprises an electronic module, this electronic module comprises at least one electronic component, it is characterized by, described electronic module comprises a printed circuit, this printed circuit is made of the conductive channel on non-conductive film, and described conductive channel is divided by cutting tool and do not needed to remove electric conducting material, and described electronic component is connected with described conductive channel.
13. chip card as claimed in claim 12; it is characterized by; described printed circuit is for only having a kind of circuit of conductive channel on first surface, described surface is covered by a screening glass, and the surface of this printed circuit relative with described surface is an outer surface of described chip card.
14. chip card as claimed in claim 12 is characterized by, described printed circuit is for all there being a kind of circuit of conductive channel on two surfaces, and this circuit is installed in a following screening glass and one and goes up between the screening glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB961803762A CN1175716C (en) | 1996-07-18 | 1996-07-18 | Method for making printed circuits and resulting printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB961803762A CN1175716C (en) | 1996-07-18 | 1996-07-18 | Method for making printed circuits and resulting printed circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1224566A CN1224566A (en) | 1999-07-28 |
| CN1175716C true CN1175716C (en) | 2004-11-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB961803762A Expired - Lifetime CN1175716C (en) | 1996-07-18 | 1996-07-18 | Method for making printed circuits and resulting printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1175716C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110136911A (en) * | 2018-02-02 | 2019-08-16 | 盈成科技有限公司 | Loop construction and preparation method thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102299134A (en) * | 2011-07-22 | 2011-12-28 | 华东师范大学 | On-chip integrated inductor internally inserted with dummy metal arrays |
| EP3020256B1 (en) * | 2013-07-10 | 2019-02-27 | Gemalto SA | Electronic module with adhesive dielectric film and method for manufacturing same |
-
1996
- 1996-07-18 CN CNB961803762A patent/CN1175716C/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110136911A (en) * | 2018-02-02 | 2019-08-16 | 盈成科技有限公司 | Loop construction and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1224566A (en) | 1999-07-28 |
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