CN117564542A - Ag-Cu@Pd solder pre-prepared sheet and preparation method and application thereof - Google Patents
Ag-Cu@Pd solder pre-prepared sheet and preparation method and application thereof Download PDFInfo
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- CN117564542A CN117564542A CN202311614432.7A CN202311614432A CN117564542A CN 117564542 A CN117564542 A CN 117564542A CN 202311614432 A CN202311614432 A CN 202311614432A CN 117564542 A CN117564542 A CN 117564542A
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- 229910017944 Ag—Cu Inorganic materials 0.000 title claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 title claims description 26
- 238000002360 preparation method Methods 0.000 title claims description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 56
- 239000002184 metal Substances 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 239000002245 particle Substances 0.000 claims abstract description 47
- 239000011258 core-shell material Substances 0.000 claims abstract description 25
- 239000000945 filler Substances 0.000 claims abstract description 19
- 238000005219 brazing Methods 0.000 claims abstract description 17
- 230000003647 oxidation Effects 0.000 claims abstract description 7
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims description 64
- 238000010438 heat treatment Methods 0.000 claims description 33
- 238000005245 sintering Methods 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- 239000011812 mixed powder Substances 0.000 claims description 9
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- 239000000243 solution Substances 0.000 claims description 7
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 230000005674 electromagnetic induction Effects 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 101150003085 Pdcl gene Proteins 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- -1 palladium ions Chemical class 0.000 claims description 3
- 239000002243 precursor Substances 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 239000002105 nanoparticle Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 13
- 229910045601 alloy Inorganic materials 0.000 abstract description 4
- 239000000956 alloy Substances 0.000 abstract description 4
- 230000001965 increasing effect Effects 0.000 abstract description 4
- 230000005012 migration Effects 0.000 abstract description 4
- 238000013508 migration Methods 0.000 abstract description 4
- 239000003960 organic solvent Substances 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 4
- 230000006698 induction Effects 0.000 description 3
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 238000006479 redox reaction Methods 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical group [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000001272 pressureless sintering Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Powder Metallurgy (AREA)
Abstract
The Ag-Cu@Pd brazing filler metal prefabricated sheet consists of micron Cu@Pd core-shell particles and nano Ag particles, and does not contain other components, wherein the mass percentage of the micron Cu@Pd core-shell particles to the nano Ag particles is 65% -80%, and 20% -35%. According to the invention, the Ag-Cu@Pd brazing filler metal is prepared into the pre-prepared sheet, and the addition of Pd element can obviously improve the high-temperature oxidation resistance of Cu and improve the electromigration and ion migration problems of Ag. In addition, the prefabricated sheet avoids the increase of porosity caused by the volatilization process of the organic solvent, and the alloy quantity is increased to strengthen the welding spots. The prepared sheet is easy to manufacture into a specific shape and size, convenient to pick up and place quickly, and can realize interconnection of chips and substrates under the low-temperature and low-pressure condition, so that the method can play a great advantage in industrialized mass production.
Description
Technical Field
The invention belongs to the technical field of electronic packaging micro-interconnection, and particularly relates to an Ag-Cu@Pd brazing filler metal prefabricated sheet for low-temperature connection and high-temperature service as well as a preparation method and application thereof.
Background
With the development of the application of the third generation power semiconductor silicon carbide (SiC) and gallium nitride (GaN) power devices, the development of high temperature and high pressure resistant power package interconnection materials has become an important subject of research in recent years. The sintered silver paste is the packaging material which is most widely used at present and is sintered at low temperature and is served at high temperature, but the sintered silver paste has the problems of low sintering density, electromigration and difficult realization of large-area sintering. The sintered copper paste also becomes a new research hot spot due to good heat and electrical conductivity, low price and excellent electromigration resistance, but copper is easy to oxidize and the sintering difficulty is higher than that of silver paste. By combining the advantages of silver and copper paste, the copper-silver core-shell composite paste is prepared, and the requirements of improving the migration resistance of silver and enhancing the oxidation resistance of copper can be met.
The composite slurry still has the problems that the porosity is increased due to the discharge of organic gas in the sintering process, and the silver shell is broken in the service stage so that a great deal of oxidation occurs to the copper core, thereby reducing the high-temperature reliability of the sintered joint.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides an interconnection process of Ag-Cu@Pd solder pre-manufactured sheets, and the addition of Pd element can obviously improve the high-temperature oxidation resistance of Cu, improve the electromigration and ion migration of Ag and improve the high-temperature reliability of a welded joint. In addition, the prefabricated sheet is easy to manufacture into a specific shape and size, convenient to pick up and place quickly, avoids the increase of porosity caused by volatilization of organic matters in the traditional slurry sintering process, and shows excellent bonding strength.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the Ag-Cu@Pd brazing filler metal prefabricated sheet consists of micron Cu@Pd core-shell particles and nano Ag particles, wherein the mass percentage of the micron Cu@Pd core-shell particles to the nano Ag particles is 65% -80%, and 20% -35%.
Further, the diameter of the Ag particles is 100-200 nm, and the specific structure of the micron Cu@Pd core-shell particles is as follows: palladium nano particles with the diameter within 10nm are uniformly and completely coated on the surfaces of copper particles with the diameter of 15-25 mu m.
Further, the thickness of the Ag-Cu@Pd solder preform is 120-300 mu m.
Further, the preparation method of the micron Cu@Pd core-shell particle comprises the following steps: precursor Na 2 PdCl 4 Adding the aqueous solution into a dispersion system of the micron Cu particles, slowly dropwise adding a reducing agent solution, attaching palladium ions on the surface of the micron Cu to perform oxidation-reduction reaction to form a micron Cu@Pd core-shell particle solution, and drying to obtain the micron Cu@Pd core-shell particles.
The preparation method of the Ag-Cu@Pd brazing filler metal pre-manufactured sheet comprises the following steps: uniformly mixing the dried nano Ag particles and the micron Cu@Pd core-shell particles to obtain mixed powder; and preparing the mixed powder into Ag-Cu@Pd brazing filler metal pre-prepared tablets by pressurizing or heating and pressurizing.
Further, the applied pressure is 3-10 MPa, and the dwell time is 5-15 min.
Further, the application temperature is 23 to 200 ℃.
The application of the Ag-Cu@Pd brazing filler metal pre-manufactured sheet comprises the following steps:
s1, placing an Ag-Cu@Pd solder preform sheet on the surface of a metal substrate I, and placing a metal substrate II on the surface of the Ag-Cu@Pd solder preform sheet to assemble a sandwich structure of the metal substrate I/solder preform sheet/metal substrate II; the metal materials of the metal substrate I and the metal substrate II comprise a laminated combination of one or more of Cu, ni and Au; the metal materials of the metal substrate I and the metal substrate II in the sandwich structure are the same or different;
and S2, sintering the assembled sample to obtain the interconnection structure.
Further, in S2, the assembled sample is placed in electromagnetic induction heating equipment for rapid sintering, the heating power is 2.2-3.0 KW, the sintering time is 10-90S, and the applied pressure is 0-15 MPa.
Further, in S2, the assembled sample is placed in a hot press, double-side heating is adopted, the acceleration rate is 5-10 ℃/min, the application pressure is 5-15 MPa, the heating temperature is 300-400 ℃, and the heating time is 30-90 min.
Preferably, a layer of Ni is chemically plated on the surface of the Cu substrate to serve as a metal substrate I and a metal substrate II, the thickness of the Ni layer is 3-6 mu m, and an Ag-Cu@Pd solder pre-sheet is placed between the metal substrate I and the metal substrate II to assemble a Cu/Ni/solder pre-sheet/Ni/Cu sandwich structure.
Preferably, a Ni layer is chemically plated on a Cu substrate, an Au layer is plated on the Ni layer to serve as a metal substrate I and a metal substrate II, the thickness of the Ni layer is 3-6 mu m, the thickness of the Au layer is 1-3 mu m, and an Ag-Cu@Pd solder pre-sheet is placed between the metal substrate I and the metal substrate II to assemble a Cu/Ni/Au/solder pre-sheet/Au/Ni/Cu sandwich structure.
Compared with the prior art, the invention has the beneficial effects that:
1. the addition of Pd can improve the electromigration and ion migration problems of Ag, pd and Cu are easy to form a core-shell structure, and the palladium shell is always well connected with the Cu core in the sintering process, so that the problem that the Ag shell cracks and falls off from the surface of the Cu core after hot-pressed sintering of Cu@Ag particles is solved, the high-temperature oxidation resistance of the Cu core is improved, the high-temperature reliability of a sintered joint can be improved, and the high-temperature resistance requirement of a power packaging material is met.
2. The nano Ag can be presintered and contacted with each other to form a prefabricated sheet framework, so that volatilization of organic matters is avoided in the sintering process, the porosity is reduced, and good alloy connection is realized.
3. Pd, ag and Cu can form continuous solid solution, and good interdiffusion can be realized under the conditions of high-frequency induction rapid sintering or hot-press sintering, so that an alloy joint with good performance is obtained.
4. Compared with the traditional soldering paste, the solder pre-prepared sheet is convenient to pick up and place quickly, and the soldering spots can be reinforced by increasing the alloy amount while not increasing the organic solvent.
Drawings
FIG. 1 is a schematic diagram of the structure of a pre-sintered Ag-Cu@Pd solder preform.
Detailed Description
The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings and examples, and it is apparent that the described examples are only some, but not all, of the examples of the invention, and all other examples obtained by those skilled in the art without making any inventive effort are within the scope of the present invention.
Example 1:
the embodiment provides an interconnection process of a nano Ag-micron Cu@Pd brazing filler metal pre-sheet, which adopts a liquid phase reduction method to prepare micron Cu@Pd core-shell particles, and prepares the Ag-Cu@Pd brazing filler metal pre-sheet in a mode of pressurizing in a die. And placing the brazing filler metal prefabricated sheet between the metal substrate I and the metal substrate II, assembling the brazing filler metal prefabricated sheet into a sandwich structure, and performing high-frequency induction rapid sintering. The specific implementation steps are as follows:
step one: the Cu particles with the particle size of 15-25 mu m are subjected to pre-plating treatment to remove oxide films and greasy dirt on the surfaces of the Cu particles, and Cu@Pd core-shell particles are obtained by a liquid phase reduction method, wherein the specific method is as follows: precursor Na 2 PdCl 4 Adding the aqueous solution into the aqueous solution of the micron Cu particles, slowly dropwise adding an ascorbic acid solution, attaching palladium ions on the surface of the micron Cu to perform oxidation-reduction reaction to form a micron Cu@Pd core-shell particle solution, and then drying under vacuum of-1-0.2 MPa to obtain the micron Cu@Pd core-shell particles.
Step two: weighing a certain amount of nano Ag particles, and placing the nano Ag particles and the dried Cu@Pd core-shell particles in a mortar for full grinding to uniformly mix the nano Ag particles and the dried Cu@Pd core-shell particles to obtain mixed powder. The mass percentage of the micron Cu@Pd core-shell particles and the nano Ag particles in the mixed powder is 70 percent to 30 percent, and the total mass is 0.2g. Wherein the grain diameter of the nano Ag particles is 100-200 nm. Placing the mixed powder into a die, applying a pressure of 5MPa, and maintaining the pressure at room temperature for 5min to obtain an Ag-Cu@Pd brazing filler metal prefabricated sheet with an area of 18.84mm 2 The thickness is 200-230 mu m.
Step three: and (5) treating the metal substrate. The metal substrate I and the metal substrate II are copper substrates, the copper substrates are polished by 1000# sand paper and 2000# sand paper to remove surface oxidation films, absolute ethyl alcohol and dilute hydrochloric acid are used for further treating surface greasy dirt and oxidation films, and the absolute ethyl alcohol is cleaned and then placed in a vacuum drying oven with the pressure of-1 to 0.2MPa for preservation.
Step four: and placing the prefabricated sheet. And placing a solder pre-sheet on the copper substrate, placing a copper substrate on the upper surface of the solder pre-sheet, and assembling the sample into a Cu/pre-sheet/Cu sandwich structure.
Step five: high frequency induction rapid sintering. The assembled sandwich structure is rapidly sintered by using a heating coil of electromagnetic induction heating equipment, a pulse heating mode is adopted, the power of the connecting process is 2.4KW, the sintering pressure is 5MPa, and the heating time is 40s, so that the interconnection structure is obtained.
The interconnection structure was subjected to cross-sectional profile, and its cross-sectional microstructure characteristics were observed using SEM, with copper substrates on both sides, and a solder preform as an intermediate layer, which was well connected to the substrate, as shown in fig. 1.
Example 2:
this embodiment differs from embodiment 1 in that: and in the second step, the obtained Ag-Cu@Pd mixed powder is placed in a die, heated to 160 ℃, and simultaneously subjected to pressure of 5MPa, and maintained for 5 minutes, wherein nano Ag is subjected to presintering, so that an Ag-Cu@Pd solder prespecified sheet is obtained.
Example 3:
this embodiment differs from embodiment 1 in that: in the second step, the total mass of the mixed powder is 0.15g.
Example 4:
this embodiment differs from embodiment 1 in that: and fourthly, plating a layer of Ni on the copper substrate as a metal substrate I and a metal substrate II, wherein the thickness of the Ni layer is 3-6 mu m, and placing an Ag-Cu@Pd brazing filler metal prefabricated sheet between the metal substrate I and the metal substrate II to assemble a Cu/Ni/brazing filler metal prefabricated sheet/Ni/Cu sandwich structure.
Example 5:
this embodiment differs from embodiment 1 in that: and fourthly, plating a layer of Ni on the copper substrate, and plating a layer of Au on the Ni layer to serve as a metal substrate I and a metal substrate II, wherein the thickness of the Ni layer is 3-6 mu m, the thickness of the Au layer is 1-3 mu m, and an Ag-Cu@Pd solder pre-sheet is placed between the metal substrate I and the metal substrate II to assemble a Cu/Ni/Au/solder pre-sheet/Au/Ni/Cu sandwich structure.
Example 6:
this embodiment differs from embodiment 1 in that: and fifthly, heating by using electromagnetic induction equipment, wherein the heating power is 2.2KW, the sintering pressure is 5MPa, and the heating time is 40s.
Example 7:
this embodiment differs from embodiment 1 in that: in the fifth step, the heating power is 2.8KW, the sintering pressure is 5MPa, and the heating time is 40s.
Example 8:
this embodiment differs from embodiment 1 in that: in the fifth step, the heating power is 2.4KW, the sintering pressure is 5MPa, and the heating time is 55s.
Example 9:
this embodiment differs from embodiment 1 in that: and fifthly, heating power is 2.4KW, and the pressureless sintering is carried out, wherein the heating time is 40s.
Example 10:
this embodiment differs from embodiment 1 in that: and fifthly, placing the sample assembled into the sandwich structure into a hot press by adopting a hot press sintering method, and adopting double-side heating, wherein the heating rate is 5 ℃/min, the application pressure is 5MPa, the heating temperature is 350 ℃, and the heating time is 60min.
Example 11:
this embodiment differs from embodiment 4 in that: in the fifth step, the heating power is 2.8KW, the sintering pressure is 10MPa, and the heating time is 40s.
Example 12:
this embodiment differs from embodiment 5 in that: in the fifth step, the heating power is 2.4KW, the sintering pressure is 10MPa, and the heating time is 60s.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (10)
1. An Ag-Cu@Pd brazing filler metal pre-manufactured sheet is characterized in that: the Ag-Cu@Pd brazing filler metal pre-manufactured sheet consists of micron Cu@Pd core-shell particles and nano Ag particles, wherein the mass percentage of the micron Cu@Pd core-shell particles to the nano Ag particles is 65% -80%, and 20% -35%.
2. The Ag-cu@pd filler metal preform as defined in claim 1, wherein: the diameter of the Ag particles is 100-200 nm, and the specific structure of the micron Cu@Pd core-shell particles is as follows: palladium nano particles with the diameter within 10nm are uniformly and completely coated on the surfaces of copper particles with the diameter of 15-25 mu m.
3. The Ag-cu@pd filler metal preform as defined in claim 1, wherein: the thickness of the Ag-Cu@Pd solder preform is 120-300 mu m.
4. The Ag-cu@pd solder preform of claim 1 wherein said micrometer
The preparation method of the Cu@Pd core-shell particle comprises the following steps: precursor Na 2 PdCl 4 Adding the aqueous solution into a dispersion system of the micron Cu particles, slowly dripping a reducing agent solution, and attaching palladium ions on the micron Cu surface to generate oxidation reductionReacting to form a micron Cu@Pd core-shell particle solution, and drying to obtain the micron
Cu@Pd core-shell particles.
5. A method for producing the Ag-cu@pd solder preform as claimed in any one of claims 1 to 4, comprising the steps of: uniformly mixing the dried nano Ag particles and the micron Cu@Pd core-shell particles to obtain mixed powder; and preparing the mixed powder into Ag-Cu@Pd brazing filler metal pre-prepared tablets by pressurizing or heating and pressurizing.
6. The method of manufacturing according to claim 5, wherein: the applied pressure is 3-10 MPa, and the pressure maintaining time is 5-15 min.
7. The method of manufacturing according to claim 5, wherein: the application temperature is 23-200 ℃.
8. Use of a pre-sheet of Ag-cu@pd solder according to any one of claims 1-4, comprising the steps of:
s1, placing an Ag-Cu@Pd solder preform sheet on the surface of a metal substrate I, and placing a metal substrate II on the surface of the Ag-Cu@Pd solder preform sheet to assemble a sandwich structure of the metal substrate I/solder preform sheet/metal substrate II; the metal materials of the metal substrate I and the metal substrate II comprise a laminated combination of one or more of Cu, ni and Au; the metal materials of the metal substrate I and the metal substrate II in the sandwich structure are the same or different;
and S2, sintering the assembled sample to obtain the interconnection structure.
9. The use according to claim 8, characterized in that: and S2, placing the assembled sample in electromagnetic induction heating equipment for rapid sintering, wherein the heating power is 2.2-3.0 KW, the sintering time is 10-90S, and the applied pressure is 0-15 MPa.
10. The use according to claim 8, characterized in that: and S2, placing the assembled sample in a hot press, and heating at the speed of 5-10 ℃/min at the two sides, the pressure of 5-15 MPa, the heating temperature of 300-400 ℃ and the heating time of 30-90 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311614432.7A CN117564542A (en) | 2023-11-29 | 2023-11-29 | Ag-Cu@Pd solder pre-prepared sheet and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311614432.7A CN117564542A (en) | 2023-11-29 | 2023-11-29 | Ag-Cu@Pd solder pre-prepared sheet and preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117564542A true CN117564542A (en) | 2024-02-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311614432.7A Pending CN117564542A (en) | 2023-11-29 | 2023-11-29 | Ag-Cu@Pd solder pre-prepared sheet and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117564542A (en) |
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- 2023-11-29 CN CN202311614432.7A patent/CN117564542A/en active Pending
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