CN117549327B - Large-stroke wafer carrying robot - Google Patents
Large-stroke wafer carrying robot Download PDFInfo
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- CN117549327B CN117549327B CN202410022657.1A CN202410022657A CN117549327B CN 117549327 B CN117549327 B CN 117549327B CN 202410022657 A CN202410022657 A CN 202410022657A CN 117549327 B CN117549327 B CN 117549327B
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- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000001179 sorption measurement Methods 0.000 claims description 51
- 235000012431 wafers Nutrition 0.000 abstract description 107
- 238000010521 absorption reaction Methods 0.000 abstract description 15
- 238000000034 method Methods 0.000 description 53
- 230000008569 process Effects 0.000 description 49
- 238000005096 rolling process Methods 0.000 description 15
- 230000000694 effects Effects 0.000 description 10
- 230000007704 transition Effects 0.000 description 9
- 238000005452 bending Methods 0.000 description 5
- 230000000087 stabilizing effect Effects 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000005012 migration Effects 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 239000012636 effector Substances 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 210000003437 trachea Anatomy 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a large-stroke wafer carrying robot, which relates to the technical field of wafer carrying, and comprises a carrying assembly and a carrying assembly, wherein the carrying assembly is used for carrying the substrate in a space moving way, the carrying assembly comprises a carrying substrate, one end of the carrying substrate is extended to be provided with carrying rods which are arranged in parallel, an absorption part is sleeved on the carrying rods, the absorption part comprises a first sleeve body, and the carrying rods are sleeved in the first sleeve body; the first cover body side is equipped with the absorption base station, and absorption base station opposite both sides are equipped with the absorption auxiliary table, and the absorption auxiliary table disposes the auxiliary member, and the auxiliary member inside disposes the gas circuit with external intercommunication. The invention aims to provide a large-stroke wafer carrying robot which can carry wafers in large batch with high stability, improve carrying efficiency, enlarge the moving range of the wafers and improve carrying flexibility.
Description
Technical Field
The invention belongs to the technical field of wafer conveying, and particularly relates to a large-stroke wafer conveying robot.
Background
The wafer has the characteristics of thin thickness, light weight, large brittleness, high requirements on environmental cleanliness and the like, and in order to reduce the risk of pollution of the wafer, the wafer is generally stored in and transported through the wafer box. In the conventional technology, the wafer cassettes are generally manually carried in a warehouse, a production shop, or the like, which consumes much labor.
The prior art is named as an invention patent of a wafer carrying robot with a gravity field sensor, and the publication number of the invention patent is US20220395986A1. Techniques and systems for automatically determining and correcting levelness of an end effector of a wafer handling robot may use tilt sensors or gravitational field sensors that may be calibrated for the wafer handling robot, output from the tilt sensors may be used to determine or estimate tilt of the end effector of the wafer handling robot, and to perform corrective positioning to reduce or eliminate tilt, to automatically teach certain positions with reduced tilt, to perform health checks on the robot, to provide feedback to a user, and so forth. But this invention cannot realize the transportation of the wafer or the wafer box with large travel.
Disclosure of Invention
The invention aims to provide a large-stroke wafer carrying robot which can carry wafers in large batch with high stability, improve carrying efficiency, enlarge the moving range of the wafers and improve carrying flexibility.
The technical scheme adopted by the invention for achieving the purpose is as follows:
the large-stroke wafer carrying robot comprises a carrying assembly and a carrying assembly, wherein the carrying assembly is used for carrying the assembly to move in space, the carrying assembly comprises a carrying substrate, one end of the carrying substrate is extended to be provided with carrying rods which are arranged in parallel, the carrying rods are sleeved with absorbing parts, the absorbing parts comprise first sleeve bodies, and the carrying rods are sleeved in the first sleeve bodies; the first cover body side is equipped with the absorption base station, and absorption base station opposite both sides are equipped with the absorption auxiliary table, and the absorption auxiliary table disposes the auxiliary member, and the auxiliary member inside disposes the gas circuit with external intercommunication.
Further, the migration assembly comprises a first movement assembly, a first movement plate is matched with the first movement assembly, a rotating motor is arranged on the first movement plate, a second movement assembly is arranged on the rotating motor, a second movement plate is matched with the second movement assembly, and a substrate is fixedly arranged on one side of the second movement plate; one side of the base plate is provided with at least two telescopic parts, the end parts of the telescopic parts are connected with a carrying base plate, one side of the carrying base plate, which is close to the telescopic parts, is provided with a sliding block, and the base plate is provided with a sliding groove matched with the sliding block.
By adopting the technical scheme, the cooperation of the transporting assembly and the transporting assembly can realize the transportation and the transfer of the batch of wafers in the one-time operation process. In the migration assembly, the first movement assembly, the second movement assembly and the rotating motor are matched to enlarge the transportation range, and the wafer can be transferred in a certain three-dimensional space according to the requirement. In addition, the moving range of the moving assembly is further enlarged by matching the moving substrate with the substrate through the sliding block. Therefore, the degree of freedom in the wafer carrying process can be improved, and the flexibility in the wafer carrying process is greatly improved.
In the transport subassembly, the cooperation of transport base plate and carrier bar can realize carrying or assembling a plurality of wafers simultaneously, can put into the inside of transport box body with a plurality of wafer pile up neatly even to through the cooperation of transport box body and transport subassembly, thereby improve the free quantity of wafer in the handling by a wide margin, improve conveying efficiency.
In addition, the carrier bar cooperates with the adsorbing member, so that the stability of the wafer in the transfer process can be greatly improved. The auxiliary adsorption platform is symmetrically arranged on two sides of the adsorption base, the air channel inside the auxiliary part can be communicated with the external air pump, so that air around the auxiliary adsorption platform can be sucked, namely negative pressure is formed around the auxiliary adsorption platform and the auxiliary adsorption platform, in the process of transferring the wafer by using the carrying assembly, the bottom of the wafer is contacted with the auxiliary adsorption part, the auxiliary part can form a negative pressure environment, the matching stability of the wafer and the carrying rod is improved, the wafer is prevented from falling and misplacement in the transferring process, and the abrasion degree of the wafer is reduced.
According to one embodiment of the invention, the end of the adsorption auxiliary table is provided with an extension plate extending outwards, the extension plate is provided with a mounting hole, and the auxiliary piece is arranged in the mounting hole.
Therefore, the contact area between the adsorption accessory and the wafer can be enlarged by arranging the adsorption auxiliary table and the extension plate, and the stress balance in the wafer conveying process is improved. A plurality of auxiliary parts are symmetrically arranged in the adsorption part in the carrying process, so that the auxiliary parts with small suction force can be utilized to adsorb the wafer or the carrying box body from multiple positions, the levelness of the wafer or the carrying box body in the carrying process is improved, the inclination is prevented, and the bending deformation of the wafer caused by overlarge suction force of the adsorption part can be avoided.
According to one embodiment of the invention, the auxiliary piece comprises an auxiliary cylinder body, wherein the auxiliary cylinder body penetrates through the mounting hole, one end of the auxiliary cylinder body is an open end, the other end of the auxiliary cylinder body is connected with an auxiliary air pipe, one side, far away from the open end, of the auxiliary cylinder body is provided with an assembly disc, and the assembly disc is sleeved on the outer side of the auxiliary air pipe.
The open end of the auxiliary cylinder body is upwards arranged and is used for being matched with the lower surface of the wafer or the carrying box body in the carrying process. An auxiliary air pipe arranged at the other end of the auxiliary cylinder body can be connected with an external air pump to realize the suction of air around the auxiliary piece. The auxiliary air pipe can be connected and fixed by the arrangement of the assembly disc.
According to one embodiment of the invention, the side wall of the auxiliary cylinder is provided with a first through groove.
The first through groove extends along the axial direction of the auxiliary cylinder body. Further, one end of the first through groove is arranged in the middle of the auxiliary cylinder body, and the other end of the first through groove extends to the open end of the auxiliary cylinder body. So, at the in-process of sucking wafer and carrier surrounding gas through auxiliary part, part air current accessible first logical groove gets into the inside of supplementary barrel, namely gets into the inside gas circuit of auxiliary part, so, the inside gas circuit of auxiliary part is avoided in the setting of first logical groove, and then regulates and control the suction of the open end of supplementary barrel, avoids the wafer and the supplementary barrel butt that lead to because of the too big suction of supplementary trachea direction, and then prevents wafer slope or bending deformation.
So, the setting of first logical groove or extension board level are less than the structure setting of absorption auxiliary table for the auxiliary member can not laminate completely with the wafer or the transport box body of top, but through the continuous suction to wafer or transport box body below air current, realizes the bottom of wafer or transport box body and adsorb the upper surface of base station, absorption auxiliary table and laminate completely through negative pressure environment. In this way, the stress area of the wafer or the carrying box body is enlarged in the carrying process, and the stability is improved.
According to one embodiment of the invention, the side wall of the auxiliary cylinder body is provided with a splicing hole in a surrounding mode, the splicing hole is provided with a splicing block in a matched mode, and one side of the splicing block is exposed in the auxiliary cylinder body; the opposite sides of the plug blocks are provided with plug plates, namely the plug plates are arranged in the auxiliary cylinder, the plug plates are arranged on the inner side of the auxiliary cylinder, and the plug plates are obliquely arranged towards the axis of the auxiliary cylinder.
Specifically, a plurality of plug boards disposed on the same plug block are arranged along the axial direction of the auxiliary cylinder, and the plug boards can swing up and down. Therefore, the arrangement of the plug board can control the flow area and fluency of the air flow entering the auxiliary cylinder, so that the air suction effect of the auxiliary piece can be regulated and controlled.
According to the embodiment of the invention, the carrying rod is arranged in a hollow mode, the carrying rod is connected with an air pump, the middle part of the adsorption base station is provided with a first air hole, the two adsorption auxiliary stations are provided with second air holes, the carrying rod is provided with a third air hole, and the first air hole and the second air hole are respectively matched with the third air hole.
Thus, the adsorption effect in the carrying process can be realized through the connection of the carrying rod and the air pump. By utilizing the cooperation of the carrying rod and the auxiliary piece, the wafer or the carrying box body is adsorbed from multiple sites, and the adsorption stability is improved.
Further, the auxiliary air pipe is far away from one end of the auxiliary cylinder body and can be connected with the carrying rod, and the auxiliary air pipe can be directly connected with the air pump.
Compared with the prior art, the invention has the following beneficial effects:
1. the carrying assembly and the transferring assembly are matched, so that the wafer can be transferred in a certain three-dimensional space according to the requirement, and the degree of freedom and the flexibility in the wafer carrying process are improved; the carrying rod in the carrying assembly is matched with the adsorbing piece, so that the carrying efficiency can be greatly improved, and the stability in the carrying process is ensured;
2. the extending plate in the absorption part is matched with the auxiliary part, small-force absorption is carried out on the wafer or the carrying box body from multiple points, the levelness of the wafer or the carrying box body in the carrying process is improved, and inclination is prevented; the bending deformation of the wafer caused by the overlarge suction force of the suction piece can be avoided; the suction effect of the auxiliary piece can realize the flow of the gas around the carrying rod, thereby being beneficial to improving the mixing of the gas around the wafer or the carrying box body in the carrying process;
3. the auxiliary cylinder body is provided with the plug-in blocks and the plug-in plates, and the suction effect of the auxiliary parts is beneficial to realizing the flow of gas around the carrying rod and improving the mixing of the gas around the wafer or the carrying box body in the carrying process.
Drawings
FIG. 1 is a schematic view of a large-stroke wafer handling robot;
FIG. 2 is a schematic diagram of the cooperation of the handling assembly and the second moving assembly;
FIG. 3 is a schematic perspective view of a handling assembly;
FIG. 4 is a schematic perspective view of an adsorbent;
FIG. 5 is a schematic perspective view of an accessory;
FIG. 6 is a schematic perspective view of a stabilization assembly;
fig. 7 is a schematic perspective view of a rolling member.
Reference numerals: the transfer unit 1, the first transfer unit 11, the first transfer plate 12, the rotating motor 13, the second transfer unit 14, the second transfer plate 15, the base plate 16, the expansion member 17, the chute 18, the transfer unit 2, the transfer base plate 21, the transfer lever 22, the slider 23, the adsorbing member 3, the first sleeve 31, the adsorbing base plate 32, the first air hole 321, the adsorbing sub-table 33, the second air hole 331, the extending plate 34, the mounting hole 35, the auxiliary member 4, the auxiliary cylinder 41, the open end 42, the auxiliary air pipe 43, the mounting plate 44, the first through groove 45, the plugging hole 46, the plugging block 47, the plugging plate 48, the stabilizing unit 5, the transition plate 51, the first rod body 52, the second rod body 53, the first plate body 54, the second plate body 55, the first extending plate 56, the second extending plate 57, the spring 58, the rolling member 6, the rotating base 61, the rotating shaft 62, the rotating plate 63, and the ball 64.
Detailed Description
The technical scheme of the invention is further described in detail below with reference to the specific embodiments and the attached drawings:
example 1:
as shown in fig. 1-5, the device comprises a transporting assembly 1 and a transporting assembly 2, wherein the transporting assembly 1 is used for the transporting assembly 2 to move in space, the transporting assembly 2 comprises a transporting substrate 21, one end of the transporting substrate 21 is extended and provided with a transporting rod 22 which is arranged in parallel, the transporting rod 22 is sleeved with an absorbing member 3, the absorbing member 3 comprises a first sleeve 31, and the transporting rod 22 is sleeved in the first sleeve 31; the first sleeve 31 is provided with an adsorption base 32 on the side, adsorption auxiliary bases 33 are arranged on two opposite sides of the adsorption base 32, auxiliary members 4 are arranged on the adsorption auxiliary bases 33, and air passages communicated with the outside are arranged in the auxiliary members 4.
Specifically, the migration component 1 includes a first moving component 11, a first moving board 12 is cooperatively disposed on the first moving component 11, and the first moving component 11 is used for moving the first moving board 12 along a first direction; the first moving plate 12 is provided with a rotating motor 13, the rotating motor 13 is provided with a second moving assembly 14, the second moving assembly is provided with a second moving plate 15 in a matched manner, and the second moving assembly 14 is used for moving the second moving plate 15 along a second direction; a base plate 16 is fixedly arranged on one side of the second moving plate 15; the substrate 16 is provided with at least two telescopic members 17 on one side, the end parts of the telescopic members 17 are connected with a conveying substrate 21, a sliding block 23 is arranged on one side, close to the telescopic members 17, of the conveying substrate 21, and a sliding groove 18 matched with the sliding block 23 is formed in the substrate 16.
The cooperation of the transporting assembly 1 and the transporting assembly 2 can realize the transportation and the transfer of the batch wafers in one-time operation process. In the transfer module 1, the first transfer module 11, the second transfer module 14, and the rotating motor 13 cooperate to expand the transfer range, and the wafer can be transferred in a predetermined three-dimensional space as needed. Specifically, under the driving action of the first moving component 11, the first moving plate 12 can drive the rotating motor 13 and the second moving component 14 to move back and forth along the first direction; the rotating motor 13 may also drive the second moving assembly 14 to rotate, and the second moving assembly 14 drives the second moving plate 15 and the carrying assembly 2 matched with the second moving plate to reciprocate along the second direction. Generally, the first direction is set in the horizontal direction, the second direction is set in the vertical direction, and the telescopic member 17 may be set to operate in the horizontal direction. The moving range of the transporting unit 2 is further widened by the substrate 21 being transported by the slider 23 in cooperation with the substrate 16. Therefore, the degree of freedom in the wafer carrying process can be improved, and the flexibility in the wafer carrying process is greatly improved.
In the handling assembly 2, the cooperation of the handling substrate 21 and the handling rod 22 can realize carrying or assembling a plurality of wafers simultaneously, and even a plurality of wafers can be piled up and put into the interior of the handling box body, and the number of the wafer monomers in one handling process is greatly increased and the handling efficiency is improved through the cooperation of the handling box body and the handling assembly 2.
In addition, the carrier bar 22 is matched with the adsorbing member 3, so that the stability of the wafer in the transfer process can be greatly improved. The first sleeve 31 of the adsorbing member 3 is sleeved outside the carrying rod 22, and the stability of the adsorbing member 3 is improved by the fixed cooperation of the carrying rod 22 and the first sleeve 31. In order to avoid the sliding of the adsorbing member 3 in the process of carrying the wafer, the first sleeve 31 can be further reinforced by using screws and limiting rings. The adsorption auxiliary table 33 is symmetrically arranged on two sides of the adsorption base table 32, and the air channel inside the auxiliary piece 4 can be communicated with an external air pump, so that air around the adsorption auxiliary table 33 can be pumped, namely negative pressure is formed around the adsorption auxiliary table 33 and the adsorption base table 32, in this way, the bottom of a wafer is contacted with the adsorption piece 3 in the process of transferring the wafer by using the transfer assembly 2, the auxiliary piece 4 can form a negative pressure environment, the matching stability of the wafer and the transfer rod 22 is improved, dropping and dislocation of the wafer in the transfer process is avoided, and the abrasion degree of the wafer is reduced. The carrying rod 22 cooperates with the adsorbing member 3 to carry the wafer in a large batch with high stability, and is suitable for different wafer specifications, for example, when carrying the wafer through a carrying box body with a large volume, the carrying box body is adsorbed through a plurality of adsorbing members 3.
The end of the suction sub-stage 33 is provided with an outwardly extending extension plate 34, the extension plate 34 is provided with a mounting hole 35, and the auxiliary member 4 is provided inside the mounting hole 35. The upper surface of the extension plate 34 is lower than the upper surface of the suction sub-stage 33. The upper surface of the suction base 32 and the upper surface of the suction sub-stage 33 are set at the same level. In this way, a gap is formed between the auxiliary member 4 and the bottom of the wafer or the carrying box body in the process of carrying the wafer, so that the gas path inside the auxiliary member 4 is helpful to adsorb the carried wafer or the bottom of the carrying box body.
Therefore, the contact area between the suction member 3 and the wafer can be enlarged by arranging the suction sub-stage 33 and the extension plate 34, and the stress balance in the wafer conveying process can be improved. In the carrying process, a plurality of auxiliary pieces 4 are symmetrically arranged in the adsorbing piece 3, so that the plurality of auxiliary pieces 4 with smaller suction force can be utilized to adsorb the wafer or the carrying box body from multiple positions, the levelness of the wafer or the carrying box body in the carrying process is improved, the inclination is prevented, and the bending deformation of the wafer caused by overlarge suction force of the adsorbing piece 3 can be avoided. Specifically, the matching structure of the extension plate 34 and the auxiliary piece 4 enhances the adsorption strength to the bottom of the wafer box during carrying, avoids the displacement of the wafer or the carrying box body and the carrying rod 22, and can solve the problem that the adsorption degree of the adsorption base 32 in the carrying box body and the adsorption piece 3 is not high or the two sides of the adsorption base 32 are inclined, namely, ensure that the surface of the carrying box body and the surface of the adsorption base 32 are completely attached, thereby avoiding the tilting of the edge of the carrying box body due to ineffective adsorption, namely, avoiding the problem that the carrying box body is inclined horizontally, and preventing the wafers loaded in the carrying box body from mutually collision and abrasion due to sliding. In addition, the adsorption force of a single site in the transfer process is weakened, the adsorption effect is improved, and particularly, the bending deformation of the wafer caused by overlarge suction force of the adsorption piece 3 can be avoided in the process of directly carrying the wafer.
The auxiliary member 4 comprises an auxiliary cylinder 41, wherein the auxiliary cylinder 41 penetrates through the mounting hole 35, one end of the auxiliary cylinder 41 is an open end 42, the other end of the auxiliary cylinder 41 is connected with an auxiliary air pipe 43, one side, far away from the open end 42, of the auxiliary cylinder 41 is provided with an assembly disc 44, and the assembly disc 44 is sleeved on the outer side of the auxiliary air pipe 43.
The open end 42 of the auxiliary cylinder 41 is disposed upwardly for engagement with the lower surface of the wafer or carrier cassette during the carrier process. An auxiliary air pipe 43 arranged at the other end of the auxiliary cylinder 41 can be connected with an external air pump to realize the suction of the air around the auxiliary piece 4. The mounting plate 44 is provided to enable connection and fixation of the auxiliary air duct 43.
Further, the open end 42 of the auxiliary cylinder 41 is provided with an extension ring, and the extension ring is made of elastic materials such as silica gel and rubber, so that buffering can be formed in the process of contacting with a wafer, the protection effect on the wafer is improved, and abrasion is prevented. The extension ring also helps to achieve the limit, and the outer diameter of the extension ring is set larger than the inner diameter of the mounting hole 35, so that the auxiliary cylinder 41 can be prevented from falling out of the mounting hole 35. On the other hand, the arrangement of the extension ring is also beneficial to improving the structural stability of the auxiliary cylinder 41, and avoiding the deformation of the auxiliary cylinder 41 in the process of sucking gas, thereby ensuring the balance of the adsorption force and ensuring the stability of the stress of the wafer.
The side wall of the auxiliary cylinder 41 is provided with a first through groove 45, and the first through groove 45 extends in the axial direction of the auxiliary cylinder 41. Further, one end of the first through groove 45 is provided in the middle of the auxiliary cylinder 41, and the other end extends to the open end 42 of the auxiliary cylinder 41. So, in the process of sucking the wafer and the gas around the carrying rod 22 through the auxiliary piece 4, part of the air flow can enter the auxiliary cylinder 41 through the first through groove 45, namely enters the air passage inside the auxiliary piece 4, and the first through groove 45 can prevent the air passage inside the auxiliary piece 4 from being blocked, further regulate and control the suction force of the open end 42 of the auxiliary cylinder 41, prevent the wafer from being abutted against the auxiliary cylinder 41 due to overlarge suction force in the direction of the auxiliary air pipe 43, and further prevent the wafer from being inclined or bent.
Further, the upper surface of the extension plate 34 is lower than the upper surface of the suction sub-stage 33. In this way, a gap is formed between the auxiliary member 4 and the bottom of the wafer or the carrying box body in the process of carrying the wafer, so that the gas path inside the auxiliary member 4 is helpful to adsorb the carried wafer or the bottom of the carrying box body. Further, the upper surface of the suction base 32 and the upper surface of the suction sub-stage 33 are set at the same level.
In this way, the first through groove 45 or the extending plate 34 is lower than the adsorption auxiliary table 33 in level, so that the auxiliary piece 4 can not be completely attached to the wafer or the carrying box above, but can be completely attached to the upper surfaces of the adsorption base table 32 and the adsorption auxiliary table 33 by continuously sucking the air flow below the wafer or the carrying box under negative pressure. In this way, the stress area of the wafer or the carrying box body is enlarged in the carrying process, and the stability is improved. In addition, the air around the carrying rod 22 can flow through the suction effect of the auxiliary member 4, so that the mixing of the air around the wafer or the carrying box body can be improved in the carrying process, and the temperature regulation of the air around the wafer or the carrying box body can be realized in the process of carrying the wafer or the carrying box body from one area to the other area, and the influence of temperature difference is reduced.
The side wall of the auxiliary cylinder 41 is provided with a plug hole 46 in a surrounding manner, the plug hole 46 is provided with a plug block 47 in a matching manner, and one side of the plug block 47 is exposed in the auxiliary cylinder 41; the plug-in block 47 is provided with a plug-in plate 48 on the opposite side, that is to say the plug-in plate 48 is arranged inside the auxiliary cylinder 41, and the plug-in plate 48 is arranged obliquely toward the axis of the auxiliary cylinder 41.
Specifically, a plurality of the plug plates 48 provided on the same plug block 47 are arranged in the axial direction of the auxiliary cylinder 41, and the plug plates 48 can swing up and down. Accordingly, the flow area and smoothness of the air flow entering the auxiliary cylinder 41 can be controlled by the provision of the plug plate 48, and the air suction effect of the auxiliary member 4 can be controlled.
Furthermore, in other embodiments, the carrying bar 22 may be provided in a hollow structure, and the carrying bar 22 is connected to the air pump, so that an end of the auxiliary air pipe 43 remote from the auxiliary cylinder 41 may be connected to the carrying bar 22, and the auxiliary air pipe 43 may be directly connected to the air pump. The middle part of the adsorption base station 32 is provided with a first air hole 321, the two adsorption auxiliary stations 33 are provided with second air holes 331, the carrying rod 22 is provided with a third air hole, and the first air hole 321, the second air hole 331 and the third air hole are matched. Thus, the adsorption effect in the carrying process can be realized through the connection of the carrying rod 22 and the air pump. By matching the carrier bar 22 with the auxiliary member 4, the wafer or the carrier cassette is adsorbed from multiple sites, thereby improving the adsorption stability.
Example 2:
as shown in fig. 6 and 7, the large-stroke wafer handling robot according to another embodiment of the present invention is different from example 1 in that,
the first moving assembly 11 includes a fixed base having a slide rail extending in a first direction, and a first moving plate 12 slidably engaged with the slide rail. The front and back sides of the moving direction of the first moving plate 12 are respectively provided with a stabilizing component 5 for ensuring the stability of the moving process of the first moving plate 12, so that the first moving plate 12 can be prevented from being blocked or dead during the operation process.
Specifically, the stabilizing assembly 5 includes a transition piece, the transition piece includes a transition plate 51 that is disposed opposite to each other, a first rod 52 and a second rod 53 are disposed on upper and lower sides of the transition plate 51 in a rotating manner, and the first rod 52 is elastically connected to a side wall of the second rod 53 from a side wall. One end of the first rod body 52 far away from the transition plate 51 is rotatably connected with a first plate body 54, one end of the second rod body 53 far away from the transition plate 51 is rotatably connected with a second plate body 55, the first plate body 54 is fixedly connected with the first movable plate 12, and the second plate body 55 is fixedly connected with the rolling piece 6.
The ends of the first rod body 52 and the second rod body 53, which are far away from each other, are respectively provided with a first extension plate 56 and a second extension plate 57, a spring 58 is arranged between the first extension plate 56 and the second extension plate 57, the other ends of the two first rod bodies 52 are respectively connected with a first plate body 54 in a rotating way, the first plate bodies 54 are fixedly connected with the first movable plate 12, the other ends of the two second rod bodies 53 are respectively connected with a second plate body 55 in a rotating way, the second plate bodies 55 are fixedly connected with rolling elements 6, and the rolling elements 6 are in rolling fit with the fixed base.
Further, a plurality of first rod bodies 52 are disposed at the upper end of the transition plate 51, and a plurality of second rod bodies 53 are disposed at the lower end thereof. The plurality of first rod bodies 52 are simultaneously in rotational engagement with the first plate body 54, and the plurality of second rod bodies 53 are simultaneously in rotational engagement with the second plate body 55. Wherein, a first extension plate 56 is arranged on the side wall of one first rod body 52, a second extension plate 57 is arranged on the side wall of one second rod body 53, and a spring 58 is connected between the first extension plate 56 and the second extension plate 57.
The rolling element 6 comprises a rotary base body 61, a cavity is arranged on one side, far away from the second plate body 55, of the rotary base body 61, a rotary shaft 62 is coaxially arranged in the cavity, a rotary plate 63 is arranged in the cavity in a surrounding mode, one end of the rotary plate 63 is connected with the rotary shaft 62, and the other end of the rotary plate is in butt joint with the inner side wall of the rotary base body 61. The rolling plate 63 is provided with balls 64, and the balls 64 are connected with the upper surface of the fixed base in a rolling manner.
The first movable plate 12 is in the in-process that slides, and the stable subassembly 5 that both sides set up can remove together with first movable plate 12 in step, ensures the stationarity that first movable plate 12 removed and ensures that first movable plate 12 removed the in-process be the horizontality, avoids first movable plate 12 relative slide rail card to die. The spring 58 between the first rod 52 and the second rod 53 and the balls 64 in the rolling member 6 can achieve a buffering effect during the operation of the first moving plate 12. In the starting and braking stage of the first moving plate 12 moving along the sliding rail in the first direction under the action of the driving component, at the instant of abrupt change of the driving force, the transition piece absorbs the impact force received by the first moving plate 12, and the absorption and storage of the vibration energy are realized through the rotation of the first rod body 52 and the second rod body 53 and the elastic deformation of the spring 58, and then the energy is gradually released through the elastic deformation of the spring 58, so that the stability of the first moving plate 12 in the starting and braking stage is improved. The arrangement of the balls 64 reduces frictional resistance during the reciprocating movement of the first moving plate 12 along the slide rail, and also provides a cushioning and stabilizing effect by the relative sliding movement between the rolling member 6 and the fixed base during the start-up or braking phase of the first moving plate 12.
In addition, the rolling elements 6 are arranged to limit the travel of the first moving plate 12, so that the first moving plate 12 can be prevented from falling off the sliding rail, and an anti-collision buffer effect can be achieved in the moving process of the first moving plate 12. In the process of collision between the first moving plate 12 and other parts on the fixed base, the stabilizing assemblies 5 arranged on two sides of the first moving plate 12 firstly receive collision impact and rapidly respond through sliding of the sliding piece along the fixed base, and can slide towards the direction close to the first moving plate 12, in the process, the second rod 53 and the first rod 52 are driven to rotate, so that the springs 58 are caused to deform, the influence of impact force on the first moving plate 12 in the collision process is reduced, the running stability of the moving assembly 1 is improved, and the stability of wafers or carrying boxes in the carrying process is further ensured.
Further, a supporting ring is coaxially disposed in the cavity, the supporting ring is disposed on the inner side of the rotating plate 63, and the rotating plate 63 has a certain elasticity. That is, the rotating plate 63 is disposed below the support ring during operation. In this way, in the process that the first moving plate 12 is prevented from operating normally by the smaller foreign matters appearing on the upper surface of the fixed base, the smaller foreign matters can enter the inside of the rolling member 6 and press the rotating plate 63 to be elastically deformed. The arrangement of the supporting ring can avoid the failure of the rotating plate 63 caused by excessive deformation, improve the stability of the space structure of the rolling element 6, prevent the unbalance of the stress of the rolling element 6 and ensure the stability in the sliding process.
While the foregoing embodiments have been described in detail in connection with the embodiments of the invention, it should be understood that the foregoing embodiments are merely illustrative of the invention and are not intended to limit the invention, and any modifications, additions, substitutions and the like made within the principles of the invention are intended to be included within the scope of the invention.
Claims (4)
1. The large-stroke wafer carrying robot comprises a carrying assembly (1) and a carrying assembly (2), wherein the carrying assembly (1) is used for carrying the assembly (2) to move in space, and is characterized in that the carrying assembly (2) comprises a carrying substrate (21), carrying rods (22) which are arranged in parallel are arranged at one end of the carrying substrate (21) in an extending mode, the carrying rods (22) are sleeved with adsorbing pieces (3), the adsorbing pieces (3) comprise first sleeve bodies (31), and the carrying rods (22) are sleeved in the first sleeve bodies (31); an adsorption base table (32) is arranged on the side of the first sleeve body (31), adsorption auxiliary tables (33) are arranged on two opposite sides of the adsorption base table (32), auxiliary pieces (4) are arranged on the adsorption auxiliary tables (33), and air paths communicated with the outside are arranged in the auxiliary pieces (4); the adsorption auxiliary table (33) is provided with an extension plate (34) in an extending mode, and the upper surface of the extension plate (34) is lower than the upper surface of the adsorption auxiliary table (33); the extension plate (34) is provided with a mounting hole (35), and the auxiliary piece (4) is arranged in the mounting hole (35); the auxiliary piece (4) comprises an auxiliary cylinder body (41), the auxiliary cylinder body (41) penetrates through the mounting hole (35), one end of the auxiliary cylinder body (41) is an open end (42), and the open end (42) is provided with an extension ring in an extending mode; an auxiliary air pipe (43) is connected to the other end of the auxiliary cylinder body (41), an assembly disc (44) is arranged on one side, away from the open end (42), of the auxiliary cylinder body (41), and the assembly disc (44) is sleeved on the outer side of the auxiliary air pipe (43);
the conveying assembly (1) comprises a first moving assembly (11), a first moving plate (12) is matched with the first moving assembly (11), a rotating motor (13) is arranged on the first moving plate (12), a second moving assembly (14) is arranged on the rotating motor (13), a second moving plate (15) is matched with the second moving assembly (14), and a base plate (16) is fixedly arranged on one side of the second moving plate (15);
the flexible piece (17) that is equipped with at least two in base plate (16) one side, flexible piece (17) end connection transport base plate (21), transport base plate (21) are close to flexible piece (17) one side and are equipped with sliding block (23), be equipped with on base plate (16) with sliding block (23) matched with spout (18).
2. The large-stroke wafer handling robot according to claim 1, wherein the side wall of the auxiliary cylinder (41) is provided with a first through slot (45).
3. The large-stroke wafer handling robot according to claim 1, wherein a plugging hole (46) is formed in the wall of the auxiliary cylinder (41) in a surrounding manner, a plugging block (47) is arranged in the plugging hole (46) in a matched manner, a plugging plate (48) is arranged on the opposite side of the plugging block (47), the plugging plate (48) is arranged on the inner side of the auxiliary cylinder (41) and the plugging plate (48) is obliquely arranged towards the axis of the auxiliary cylinder (41).
4. The large-stroke wafer handling robot according to claim 1, wherein the handling rod (22) is hollow, the handling rod (22) is connected with an air pump, a first air hole (321) is formed in the middle of the adsorption base (32), second air holes (331) are formed in the two adsorption auxiliary tables (33), a third air hole is formed in the handling rod (22), and the first air hole (321) and the second air hole (331) are respectively matched with the third air hole.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410022657.1A CN117549327B (en) | 2024-01-08 | 2024-01-08 | Large-stroke wafer carrying robot |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410022657.1A CN117549327B (en) | 2024-01-08 | 2024-01-08 | Large-stroke wafer carrying robot |
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| CN117549327A CN117549327A (en) | 2024-02-13 |
| CN117549327B true CN117549327B (en) | 2024-04-02 |
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| CN210064476U (en) * | 2019-03-29 | 2020-02-14 | 东莞市银泰玻璃有限公司 | Glass sucker structure |
| CN110834348A (en) * | 2019-11-12 | 2020-02-25 | 徐州普瑞赛思物联网科技有限公司 | High-speed intelligent robot that goes up unloading |
| CN210820751U (en) * | 2019-10-23 | 2020-06-23 | 惠州市佳音诺信科技有限公司 | Material taking device for injection molding machine |
| CN112614802A (en) * | 2021-03-08 | 2021-04-06 | 杭州众硅电子科技有限公司 | Manipulator and method for transporting wafer by CMP (chemical mechanical polishing) cleaning unit |
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2024
- 2024-01-08 CN CN202410022657.1A patent/CN117549327B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06124995A (en) * | 1992-10-13 | 1994-05-06 | Anelva Corp | Wafer conveying robot |
| JP2015196241A (en) * | 2014-04-02 | 2015-11-09 | ロボスター・カンパニー・リミテッド | Conveyance robot equipped with eight robot arm |
| CN106040534A (en) * | 2016-07-29 | 2016-10-26 | 意力(广州)电子科技有限公司 | Automatic glue sealing device with fully-automatic linear mechanical hand |
| CN210064476U (en) * | 2019-03-29 | 2020-02-14 | 东莞市银泰玻璃有限公司 | Glass sucker structure |
| CN210820751U (en) * | 2019-10-23 | 2020-06-23 | 惠州市佳音诺信科技有限公司 | Material taking device for injection molding machine |
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| CN112614802A (en) * | 2021-03-08 | 2021-04-06 | 杭州众硅电子科技有限公司 | Manipulator and method for transporting wafer by CMP (chemical mechanical polishing) cleaning unit |
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| CN117549327A (en) | 2024-02-13 |
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