CN117548162A - PDMS chip bonding alignment device - Google Patents

PDMS chip bonding alignment device Download PDF

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Publication number
CN117548162A
CN117548162A CN202311784031.6A CN202311784031A CN117548162A CN 117548162 A CN117548162 A CN 117548162A CN 202311784031 A CN202311784031 A CN 202311784031A CN 117548162 A CN117548162 A CN 117548162A
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CN
China
Prior art keywords
chip
pdms
alignment device
bonding alignment
platform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311784031.6A
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Chinese (zh)
Inventor
曹小宝
金建
徐涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JINAN CENTER HOSPITAL
Original Assignee
JINAN CENTER HOSPITAL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JINAN CENTER HOSPITAL filed Critical JINAN CENTER HOSPITAL
Priority to CN202311784031.6A priority Critical patent/CN117548162A/en
Publication of CN117548162A publication Critical patent/CN117548162A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/002—Aligning microparts
    • B81C3/004—Active alignment, i.e. moving the elements in response to the detected position of the elements using internal or external actuators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/02—Adapting objects or devices to another
    • B01L2200/026—Fluid interfacing between devices or objects, e.g. connectors, inlet details
    • B01L2200/027—Fluid interfacing between devices or objects, e.g. connectors, inlet details for microfluidic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/10—Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502753—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by bulk separation arrangements on lab-on-a-chip devices, e.g. for filtration or centrifugation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502761—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip specially adapted for handling suspended solids or molecules independently from the bulk fluid flow, e.g. for trapping or sorting beads, for physically stretching molecules

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Hematology (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The utility model belongs to the field of bonding alignment of PDMS chips, in particular to a bonding alignment device of PDMS chips, which aims at solving the problems that the existing bonding alignment device cannot realize functions of pre-alignment, quick disassembly and the like in the use process, is influenced by bonding efficiency, and is likely to lose a plasma treatment effect due to overlong exposure time after the PDMS chips are subjected to plasma treatment, so that bonding failure is caused.

Description

PDMS chip bonding alignment device
Technical Field
The utility model relates to the technical field of PDMS chip bonding alignment, in particular to a PDMS chip bonding alignment device.
Background
Microfluidic chips utilize micro-or nano-scale channels and structures to control, manipulate and analyze micro-liquid, particulate or biological samples. Among them, PDMS (polydimethylsiloxane) is an important role in the fabrication of microfluidic chips as a transparent, flexible polymer material. PDMS has good elasticity and plasticity, and has lower toxicity and compatibility to cells and biomolecules, so that the PDMS has wide application in the fields of biomedical research, drug screening, cell analysis, gene sequencing, chemical analysis, environmental monitoring and the like. In the process of preparing the microfluidic chip by PDMS, alignment and combination are one of key steps. It ensures precise alignment of structures at different levels to achieve the desired functionality and channel layout. The main method for aligning and bonding the microfluidic chip is an auxiliary alignment method based on vision, and the principle is that the relative positions of alignment marks of the upper chip and the lower chip of PDMS are observed under a microscope, and the alignment of the microstructure is realized by adjusting the clamping devices of the upper chip and the lower chip, however, the traditional bonding alignment device is likely to cause overlong exposure time to lose efficacy after the PDMS chip is subjected to plasma treatment due to time consuming observation and operation steps, so that the bonding strength and success rate are affected. In addition, in order to enhance the bonding chip strength, after the PDMS chips are aligned and bonded, they need to be placed on an oven hot stage for heat treatment. In the process of taking out the chip, the chip is easy to deviate due to inconvenient operation, and the alignment precision is affected.
Patent document CN217921479U discloses a microfluidic chip alignment bonding device, comprising: the upper surface mounting of workstation has two-dimentional displacement platform, through placing down the microfluidic chip at the lower platform upper surface, step motor a drives two splint and is close to each other and carry out the centre gripping location to the microfluidic chip down, correct its skew that produces when placing, step motor d drives two recesses and carries out the centre gripping fixedly to last microfluidic chip and substrate, the bottom lamp accessible transparent glass lower platform carries out the highlight illumination, carry out the naked eye with the split type microscope, can see the pattern on the silicon substrate very clearly under the split type microscope, thereby carry out quick accurate alignment, step motor c starts and drives substrate and last microfluidic chip right-hand movement, the microfluidic chip down is the benchmark, carry out the alignment bonding with the microfluidic chip down, it is quick to aim at, shorten the time that the surface of plasma treatment was exposed in the air, improve chip bonding probability and intensity.
The patent document of publication No. CN205235993U discloses a microfluidic chip alignment bonding device, including supporting component, chip location adjusting component and CCD observation component, chip location adjusting component includes the accurate moving platform of XY theta, the area light source, transparent backup pad and Z axle moving platform, the area light source supports and is fixed in on the accurate moving platform of XY theta, transparent backup pad installs on Z axle moving platform, transparent backup pad is located the area light source directly over and set up with the area light source relatively, the upper surface of area light source and the lower surface of transparent backup pad are used for installing the microfluidic chip respectively, CCD observation component is including installing two the same observation device on supporting component, every observation device includes a CCD camera and an XYZ axle accurate moving platform respectively, the accurate moving platform of XYZ axle is installed on supporting component, the CCD camera is fixed in the accurate moving platform of XYZ axle and is located the top of transparent backup pad. The micro-fluidic chip alignment bonding device solves the problem of error of manually aligning chips.
However, in the use process of the above patent document, the functions of PDMS prealignment, rapid disassembly and the like cannot be realized, and the PDMS chip is affected by the bonding efficiency, and after the PDMS chip is subjected to the plasma treatment, the plasma treatment effect is likely to be lost due to the excessively long exposure time, so that the bonding failure is caused.
Disclosure of Invention
The utility model aims to solve the defects that in the prior art, functions such as pre-alignment and quick disassembly of PDMS cannot be realized in the using process of a bonding alignment device, and bonding efficiency is affected, and a PDMS chip is likely to lose a plasma treatment effect due to overlong exposure time after being subjected to plasma treatment, so that bonding failure is caused.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides a PDMS chip bonding alignment device, includes bottom plate, display and vacuum pump, the top of bottom plate is connected with the little displacement platform of XYR, the top of bottom plate is connected with XY fast-moving platform, be connected with spacing Z axle fine setting frame on the XY fast-moving platform, be connected with industrial camera on the spacing Z axle fine setting frame, industrial camera is connected with coaxial microscope group, be connected with coaxial light source on the coaxial microscope group, be connected with down the connecting plate on the little displacement platform of XYR, be connected with down the chip platform on the connecting plate, be connected with the chip platform on the chip platform down, be connected with the upper bracket on the chip platform, be connected with the chip Z axle mobile station on the upper bracket, be connected with quick detach structure preforming on the quick detach structure preforming, be connected with two quick detach structure hand screw, the display is connected with industrial camera.
Preferably, a top chip glass slide is placed on the top chip stage.
Preferably, a lower chip glass slide is placed on the lower chip table.
Preferably, the lower chip table is connected with two air valve switches.
Preferably, the vacuum pump is connected with two air valve switches.
In the utility model, the PDMS chip bonding alignment device has the beneficial effects that:
1. according to the scheme, the quick-dismantling structure is introduced, so that the pre-alignment step can be conveniently implemented, the bonding time after plasma treatment is reduced, and the success rate is ensured.
2. This scheme is through adopting vacuum adsorption structure, can fix fast and take out the bottom chip.
According to the utility model, by designing the quick-release structure and adopting the pre-alignment step, not only is the bonding process accelerated, but also the bonding power is improved, the operation difficulty is reduced, and the precise, rapid and stable alignment and bonding of the multi-layer PDMS microfluidic chip are realized.
Drawings
Fig. 1 is a schematic diagram of a structure of a PDMS chip bonding alignment device according to the present utility model;
fig. 2 is a schematic structural diagram of a lower chip stage of a PDMS chip bonding alignment device according to the present utility model;
FIG. 3 is a schematic diagram of a structure of a bonding alignment device for PDMS chips according to the present utility model;
fig. 4 is a schematic structural diagram of an upper bracket of a PDMS chip bonding alignment device according to the present utility model;
fig. 5 is a schematic structural diagram of a lower chip slide and an upper chip slide of the PDMS chip bonding alignment device according to the present utility model.
In the figure: 1. a bottom plate; 2. a display; 3. a vacuum pump; 4. an XYR micro-displacement table; 5. an XY fast moving stage; 6. a lower connecting plate; 7. a lower chip stage; 8. a chip mounting table; 9. tabletting with a quick-dismantling structure; 10. the screw is screwed by hand in the quick-release structure; 11. an upper bracket; 12. a chip Z-axis mobile station is arranged; 13. an industrial camera; 14. a coaxial microscope set; 15. a coaxial light source; 16. a Z-axis limiting fine adjustment frame; 17. an air valve switch; 18. downloading a chip glass slide; 19. and (5) mounting a chip glass slide.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Examples
Referring to fig. 1-5, a PDMS chip bonding alignment device includes a bottom plate 1, a display 2 and a vacuum pump 3, wherein the top of the bottom plate 1 is connected with an XYR micro-displacement table 4, the top of the bottom plate 1 is connected with an XY fast moving table 5, the XY fast moving table 5 is connected with a limit Z-axis fine adjustment frame 16, the limit Z-axis fine adjustment frame 16 is connected with an industrial camera 13, the industrial camera 13 is connected with a coaxial microscope group 14, the coaxial microscope group 14 is connected with a coaxial light source 15, the XYR micro-displacement table 4 is connected with a lower connecting plate 6, the lower connecting plate 6 is connected with a lower chip table 7, the lower chip table 7 is connected with an upper chip table 8, the upper chip table 8 is connected with an upper bracket 11, the upper bracket 11 is connected with an upper chip Z-axis moving table 12, the upper bracket 11 is connected with a quick-release structure pressing sheet 9, two quick-release structure manual screws 10 are connected with the industrial camera 13, an upper chip glass slide 19 is placed on the upper chip table 8, a lower chip table 7 is placed with a lower chip table 7, a lower chip table 18 is connected with two air valves 17, and two air valves are connected with the vacuum pump 17.
In this embodiment, when in use, the PDMS chips to be bonded are manufactured, and the upper and lower PDMS chips are placed on the lower chip glass 18 and the upper chip glass 19 respectively, (the slide size used in this patent is 75mm by 25mm by 1.1mm, the maximum size of the PDMS chips should be smaller than this size, and the PDMS chips are placed centering as much as possible so as to be aligned faster), because of the adhesion of the PDMS and the glass itself, the PDMS and the glass are more tightly adhered together under the condition of tearing without external force, the flatness of the bonding surface of the PDMS is ensured due to the flatness of the glass substrate, after the PDMS chips are placed, the lower chip glass 18 is placed in the middle groove of the lower chip stage 7, the two sides of the upper chip glass 19 are adhered with small double-sided adhesive, and then placed in the groove of the upper chip stage 8, the whole chip will not fall down when the upper chip stage 8 is turned upside down due to the adhesion of the double-sided adhesive, the upper chip stage 8 is inserted into a quick-dismantling opening of the upper bracket 11, the upper chip stage 8 is fixed tightly by screwing screws 10 through two quick-dismantling structures, a coaxial microscope group 14, a coaxial light source 15, an industrial camera 13 and a display 2 are started, a limit Z-axis fine-tuning frame 16 and an XY quick-moving stage 5 are manually operated, the upper chip stage 8 is observed through the display 2 until a micro-channel structure or a counter-rotating mark of a lower PDMS chip is clearly displayed, then the upper chip Z-axis moving stage 12 is slowly moved downwards to enable the upper PDMS chip to approach the lower PDMS chip, the display 2 can see the micro-channel structure or the counter-rotating mark on the upper PDMS chip, the position and the rotating angle of the lower PDMS chip are adjusted through the XYR micro-moving stage 4, the upper PDMS chip and the lower PDMS chip are prealigned, then the upper chip stage 8 is taken out through the quick-dismantling structure of the upper bracket 11, the upper chip slide 18 and the lower PDMS chip are placed in a plasma cleaning machine together with the lower chip, oxygen plasma treatment is carried out on the surface needing bonding of PDMS, after the treatment is finished, the chip is taken out, the upper chip table 8 is quickly inserted into a quick-dismantling opening of the upper bracket 11, the upper chip table 8 is tightly fixed by screwing screws 10 through two quick-dismantling structures, a lower chip glass slide 18 and a lower PDMS chip are quickly put back into a middle groove of the lower chip table 7, a vacuum pump 3 and an air valve switch 17 connected with one side of the vacuum pump 3 are started, after a few seconds, the air valve switch 17 is closed, the vacuum state is kept, the lower chip glass slide 18 is tightly attached under vacuum suction, then the XYR micro-displacement table 4 is regulated, the realignment process can be completed in a short time, at the moment, the upper chip Z-axis moving table 12 is slowly moved downwards, and the upper PDMS chip and the lower PDMS chip are contacted, because of the effect of oxygen plasma treatment, the upper and lower PDMS chips are bonded together, then the other side air valve switch 17 is opened to recover the atmospheric pressure in the lower chip stage 7, the upper chip Z-axis moving stage 12 is slowly moved upwards, at this time, the lower chip glass slide 18, the lower PDMS chip, the upper chip glass slide 19 and the upper chip stage 8 are lifted together, then the two quick-release structure hand screws 10 are unscrewed, the upper chip stage 8 and the chips bonded together are taken out, the whole is placed in an oven together, baked for 1 hour at 85 ℃, the adhesive force between the PDMS chips is enhanced, after cooling, the bonded PDMS is peeled off from the upper chip glass slide 19 and the lower chip glass slide 18, and the alignment bonding manufacturing of the microfluidic chip is completed.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims (8)

1. The utility model provides a PDMS chip bonding alignment device, includes bottom plate (1), display (2) and vacuum pump (3), its characterized in that, the top of bottom plate (1) is connected with XYR micro-displacement platform (4), the top of bottom plate (1) is connected with XY fast-moving platform (5), be connected with spacing Z axle fine setting frame (16) on XY fast-moving platform (5), be connected with industrial camera (13) on spacing Z axle fine setting frame (16), industrial camera (13) are connected with coaxial microscope group (14), be connected with coaxial light source (15) on coaxial microscope group (14), be connected with down connecting plate (6) on XYR micro-displacement platform (4), be connected with down chip platform (7) on lower chip platform (7), be connected with on chip platform (8) on last support (11).
2. The PDMS chip bonding alignment apparatus as claimed in claim 1, wherein the upper frame (11) is connected with an upper chip Z-axis moving stage (12).
3. A PDMS chip bonding alignment device according to claim 2, characterized in that the upper chip stage (8) has an upper chip slide (19) placed thereon.
4. A PDMS chip bonding alignment apparatus according to claim 3, characterized in that two gas valve switches (17) are connected to the lower chip stage (7).
5. The PDMS chip bonding alignment device according to claim 4 wherein the upper bracket (11) is connected with a quick release structure pressing piece (9), and the quick release structure pressing piece (9) is connected with two quick release structure hand screws (10).
6. The PDMS chip bonding alignment device according to claim 5, wherein the vacuum pump (3) is connected to two gas valve switches (17).
7. The PDMS chip bonding alignment device according to claim 6, wherein the display (2) is connected to an industrial camera (13).
8. The PDMS chip bonding alignment device according to claim 7, wherein a lower chip slide (18) is placed on the lower chip stage (7).
CN202311784031.6A 2023-12-22 2023-12-22 PDMS chip bonding alignment device Pending CN117548162A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311784031.6A CN117548162A (en) 2023-12-22 2023-12-22 PDMS chip bonding alignment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311784031.6A CN117548162A (en) 2023-12-22 2023-12-22 PDMS chip bonding alignment device

Publications (1)

Publication Number Publication Date
CN117548162A true CN117548162A (en) 2024-02-13

Family

ID=89823332

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311784031.6A Pending CN117548162A (en) 2023-12-22 2023-12-22 PDMS chip bonding alignment device

Country Status (1)

Country Link
CN (1) CN117548162A (en)

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