CN117538961A - Preparation method and device for realizing infrared seeker - Google Patents
Preparation method and device for realizing infrared seeker Download PDFInfo
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- CN117538961A CN117538961A CN202410028606.XA CN202410028606A CN117538961A CN 117538961 A CN117538961 A CN 117538961A CN 202410028606 A CN202410028606 A CN 202410028606A CN 117538961 A CN117538961 A CN 117538961A
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- 239000000463 material Substances 0.000 claims abstract description 133
- 239000000758 substrate Substances 0.000 claims abstract description 132
- 238000005507 spraying Methods 0.000 claims abstract description 122
- 238000005520 cutting process Methods 0.000 claims abstract description 94
- 238000007747 plating Methods 0.000 claims abstract description 87
- 230000003287 optical effect Effects 0.000 claims abstract description 67
- 238000000034 method Methods 0.000 claims abstract description 40
- 238000002834 transmittance Methods 0.000 claims abstract description 39
- 239000011248 coating agent Substances 0.000 claims abstract description 36
- 238000000576 coating method Methods 0.000 claims abstract description 36
- 238000004806 packaging method and process Methods 0.000 claims abstract description 34
- 238000010276 construction Methods 0.000 claims abstract description 20
- 239000012788 optical film Substances 0.000 claims abstract description 19
- 238000003908 quality control method Methods 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims description 30
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F11/00—Cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F41—WEAPONS
- F41G—WEAPON SIGHTS; AIMING
- F41G3/00—Aiming or laying means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Forests & Forestry (AREA)
- Wood Science & Technology (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to the field of seeker preparation, and provides a preparation method and a device for realizing an infrared seeker, wherein the method comprises the following steps: obtaining a substrate material to be processed, cutting the substrate material into a shape by using preset cutting equipment to obtain a substrate cutting material conforming to the shape of a guide head, connecting a preset electronic lead to the substrate cutting material, spraying an infrared sensitive material to the surface of an electronic substrate element by using preset spraying equipment, calculating the signal to noise ratio of an infrared spraying element, connecting a preset optical lens on the infrared spraying element, identifying an external coating corresponding to a primary guide head, performing optical film plating on the external coating, calculating the light beam transmittance of the plating guide head, performing circuit construction, performing external packaging on the plating guide head by circuit debugging, obtaining a packaging guide head, performing quality control, and generating a control record table and a preparation flow chart. The invention can improve the preparation efficiency of the infrared seeker.
Description
Technical Field
The invention relates to the field of manufacturing of seekers, in particular to a manufacturing method and device of an infrared seeker.
Background
The infrared seeker is a key component of a missile system for guiding missiles, unmanned aerial vehicles and the like, and mainly has the functions of receiving infrared radiation signals from targets, and adjusting the flight track of the missiles according to the signals so as to achieve the purpose of precisely striking the targets.
At present, the preparation method of the infrared seeker mainly relies on the combination of the infrared sensor technology and the target identification and tracking technology, and meanwhile, the preparation process of the infrared seeker also needs to be completed by applying the design and manufacturing technology of the missile control system, however, the preparation efficiency of the infrared seeker is relatively low due to the complexity and the diversity of the preparation process, so that the preparation method and the device of the infrared seeker are needed to improve the preparation efficiency of the infrared seeker.
Disclosure of Invention
The invention provides a preparation method and a device of an infrared seeker, and mainly aims to improve the preparation efficiency of the infrared seeker.
In order to achieve the above object, the present invention provides a method for manufacturing an infrared seeker, comprising:
obtaining a substrate material to be processed, performing shape cutting on the substrate material to be processed by using preset cutting equipment to obtain a substrate cutting material conforming to the shape of a guide head, and connecting a preset electronic wire with the substrate cutting material to obtain an electronic substrate element;
Spraying infrared sensitive materials on the surface of the electronic substrate element by using preset spraying equipment to obtain an infrared spraying element corresponding to the electronic substrate element, calculating an infrared signal-to-noise ratio corresponding to the infrared spraying element, and connecting a preset optical lens on the infrared spraying element based on the infrared signal-to-noise ratio to obtain a primary guide head corresponding to the infrared spraying element;
identifying an outer surface coating corresponding to the primary seeker, performing optical film plating on the outer surface coating to obtain a plated seeker, and calculating the light beam transmittance corresponding to the plated seeker;
based on the light beam transmittance, performing circuit construction on the plating guidance head to obtain an optical circuit corresponding to the plating guidance head, and performing circuit debugging on the optical circuit to obtain a debugging circuit;
and carrying out external packaging on the plating guide head based on the debugging circuit to obtain a packaging guide head, carrying out quality control on the packaging guide head to obtain a control record table corresponding to the packaging guide head, extracting key parameters in the control record table, and generating a preparation flow chart for preparing the infrared guide head based on the key parameters.
Optionally, the obtaining a substrate material to be processed, and performing shape cutting on the substrate material to be processed by using a preset cutting device to obtain a substrate cutting material conforming to the shape of the leader, including:
acquiring a substrate material to be processed corresponding to an infrared seeker based on the construction requirement of the infrared seeker;
setting equipment parameters of the preset cutting equipment based on the construction specification of the infrared seeker;
determining a cutting template corresponding to the infrared seeker based on the equipment parameters;
and cutting the shape of the substrate material to be processed based on the cutting template to obtain the substrate cutting material conforming to the shape of the seeker.
Optionally, the connecting the preset electronic wires with the substrate cutting material to obtain an electronic substrate element includes:
determining an electronic wire corresponding to the base cutting material;
stripping the insulating layer of the electronic wire to obtain a stripped metal wire;
inserting pins into the stripped metal wire and the substrate cutting material, and welding the pins to obtain a connecting substrate element;
and carrying out encapsulation protection on the connecting substrate element to obtain the electronic substrate element.
Optionally, the spraying the infrared sensitive material onto the surface of the electronic substrate element by using a preset spraying device to obtain an infrared spraying element corresponding to the electronic substrate element includes:
identifying a surface environment of the electronic substrate component;
determining spraying points corresponding to the electronic substrate element based on the surface environment;
and spraying the infrared sensitive material on the spraying point by using preset spraying equipment to obtain an infrared spraying element corresponding to the electronic substrate element.
Optionally, the calculating the infrared signal-to-noise ratio corresponding to the infrared spraying element includes:
calculating the infrared signal-to-noise ratio corresponding to the infrared spraying element by using the following formula:
；
wherein,the method is characterized in that the method comprises the steps of indicating the corresponding infrared signal-to-noise ratio of the infrared spraying element, pi represents the signal power of the ith infrared spraying element, gi represents the signal gain of the ith infrared spraying element, ai represents the signal amplifier gain of the ith infrared spraying element, ni represents the noise power of the ith infrared spraying element, bi represents the background noise power of the ith infrared spraying element, and i represents the index of the infrared spraying element.
Optionally, based on the infrared signal-to-noise ratio, connecting a preset optical lens to the infrared spraying element to obtain a primary guide head corresponding to the infrared spraying element, including:
Identifying a signal ratio in the infrared signal-to-noise ratio;
positioning a proper position corresponding to the infrared spraying element based on the signal ratio;
and installing a preset optical lens at the proper position, and performing optical fine adjustment on the optical lens to obtain the primary seeker corresponding to the infrared spraying element.
Optionally, the identifying the primary seeker corresponds to an outer surface coating, and performing optical film plating on the outer surface coating to obtain a plated seeker, including:
determining a material property of the primary seeker;
identifying an exterior coating corresponding to the primary seeker based on the material attribute;
and performing optical film plating on the outer surface coating by using preset plating equipment to obtain a plating seeker corresponding to the primary seeker.
Optionally, the calculating the beam transmittance corresponding to the plating guidance head includes:
calculating the light beam transmittance corresponding to the plating guide head by using the following formula:
；
wherein T represents the light beam transmittance corresponding to the plating guidance head,representing the refractive index of the seeker material, i representing the index of the material corresponding to the different parts of the seeker material, n representing the total number of different parts of the seeker material,/ >Represents the attenuation coefficient of the ith material in the seeker,/>Indicating the scattering coefficient of the material in the seeker, +.>Indicating the degree of loss in beam transmission in the plating leader,/for the beam>Representing the reflection coefficient of the ith material in the leader.
Optionally, the performing circuit construction on the plating guidance head based on the light beam transmittance to obtain an optical circuit corresponding to the plating guidance head includes:
determining a performance target corresponding to the plating guidance head based on the light beam transmittance;
analyzing an optical element corresponding to the plating guidance head based on the performance target;
based on the optical element, carrying out circuit linking on the plating guide head to obtain a linked circuit;
and after the parameters of the link circuit are adjusted, the circuit construction is carried out on the plating guide head, so that an optical circuit corresponding to the plating guide head is obtained.
In order to solve the above problems, the present invention also provides a device for preparing an infrared seeker, the device comprising:
the substrate cutting module is used for obtaining a substrate material to be processed, performing shape cutting on the substrate material to be processed by using preset cutting equipment to obtain a substrate cutting material conforming to the shape of the guide head, and connecting a preset electronic wire with the substrate cutting material to obtain an electronic substrate element;
The signal-to-noise ratio calculation module is used for spraying infrared sensitive materials on the surface of the electronic substrate element by using preset spraying equipment to obtain an infrared spraying element corresponding to the electronic substrate element, calculating the infrared signal-to-noise ratio corresponding to the infrared spraying element, and connecting a preset optical lens on the infrared spraying element based on the infrared signal-to-noise ratio to obtain a primary guide head corresponding to the infrared spraying element;
the transmittance calculating module is used for identifying the outer surface coating corresponding to the primary guide head, performing optical film plating on the outer surface coating to obtain a plated guide head, and calculating the light beam transmittance corresponding to the plated guide head;
the circuit debugging module is used for constructing a circuit for the plating guide head based on the light beam transmittance to obtain an optical circuit corresponding to the plating guide head, and carrying out circuit debugging on the optical circuit to obtain a debugging circuit;
the flow chart generating module is used for carrying out external packaging on the plating guide head based on the debugging circuit to obtain a packaging guide head, carrying out quality control on the packaging guide head to obtain a control record table corresponding to the packaging guide head, extracting key parameters in the control record table, and generating a preparation flow chart for preparing the infrared guide head based on the key parameters.
The invention obtains the substrate material to be processed, cuts the shape of the substrate material to be processed by utilizing the preset cutting equipment to obtain the substrate cutting material conforming to the shape of the seeker, can furthest utilize raw materials, reduce waste and loss, simultaneously reduce errors and risks of manual operation, and reduce production cost. Therefore, the preparation method and the device of the infrared seeker can improve the preparation efficiency of the infrared seeker.
Drawings
FIG. 1 is a schematic flow chart of a method for manufacturing an infrared guide head according to an embodiment of the present invention;
fig. 2 is a schematic block diagram of a device for manufacturing an infrared guide head according to an embodiment of the present invention;
fig. 3 is a schematic diagram of an internal structure of an electronic device according to a method for manufacturing an infrared guide according to an embodiment of the present invention.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The embodiment of the application provides a preparation method of an infrared seeker. The execution main body of the preparation method of the infrared seeker comprises, but is not limited to, at least one of a server side, a terminal and the like which can be configured to execute the method provided by the embodiment of the application. In other words, the method for preparing the infrared seeker can be performed by software or hardware installed in a terminal device or a server device, wherein the software can be a blockchain platform. The service end includes but is not limited to: a single server, a server cluster, a cloud server or a cloud server cluster, and the like. The server may be an independent server, or may be a cloud server that provides cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (Content Delivery Network, CDN), and basic cloud computing services such as big data and artificial intelligence platforms.
Referring to fig. 1, a flow chart of a method for manufacturing an infrared guide head according to an embodiment of the invention is shown. In this embodiment, the method for preparing the infrared seeker includes:
s1, obtaining a substrate material to be processed, performing shape cutting on the substrate material to be processed by using preset cutting equipment to obtain a substrate cutting material conforming to the shape of a seeker, and connecting a preset electronic wire with the substrate cutting material to obtain an electronic substrate element.
According to the invention, the substrate material to be processed is obtained, and is subjected to shape cutting by using the preset cutting equipment, so that the substrate cutting material conforming to the shape of the guide head is obtained, the raw materials can be utilized to the maximum extent, the waste and loss are reduced, meanwhile, the errors and risks of manual operation are reduced, and the production cost is reduced.
Wherein the substrate material to be treated refers to a starting material for manufacturing the seeker, including but not limited to: metal, plastic, composite materials, etc.; the substrate cutting material is a material which is obtained after shape cutting and is completely matched with the shape of the guide head.
As an embodiment of the present invention, the obtaining a substrate material to be processed, and performing shape cutting on the substrate material to be processed by using a preset cutting device to obtain a substrate cutting material conforming to a shape of a leader, includes: acquiring a substrate material to be processed corresponding to an infrared seeker based on the construction requirement of the infrared seeker; setting equipment parameters of the preset cutting equipment based on the construction specification of the infrared seeker; determining a cutting template corresponding to the infrared seeker based on the equipment parameters; and cutting the shape of the substrate material to be processed based on the cutting template to obtain the substrate cutting material conforming to the shape of the seeker.
Wherein, the construction requirement refers to the specific requirement of the infrared seeker on the base material, including the requirements of heat conduction performance, mechanical strength, high temperature resistance and the like; the construction specification refers to the size, shape and other relevant specifications of the infrared seeker; the equipment parameters refer to various parameter settings of preset cutting equipment; the cutting template refers to a template for guiding cutting equipment to accurately cut.
Further, the build requirements may be obtained by building an analytical tool implementation, such as: SEM, TGA, etc.; the build specification may be obtained by an aided design tool, such as: CAD, CAM, etc.; the device parameters may be obtained by simulation and emulation tool implementations, such as: ANSYS, COMSOL Multiphysics, etc.; the cutting templates may be obtained by automatic cutting tools, such as: laser cutting machine, plasma cutting machine, water jet cutting machine, etc.
According to the invention, the preset electronic lead is connected with the substrate cutting material to obtain the electronic substrate element, so that the stability, the reliability, the electric conduction performance and the mechanical strength can be improved, the heat conduction performance is optimized, the manufacturing and the assembly are convenient, and the integral performance and the reliability of the electronic element are enhanced.
Wherein, the electronic wire refers to a conductive material for transmitting current or signals, such as: metal wires such as copper wires, aluminum wires, etc.; the electronic base element refers to the underlying structure or support material of the electronic device.
As an embodiment of the present invention, the connecting the preset electronic wires to the substrate cutting material to obtain the electronic substrate component includes: determining an electronic wire corresponding to the base cutting material; stripping the insulating layer of the electronic wire to obtain a stripped metal wire; inserting pins into the stripped metal wire and the substrate cutting material, and welding the pins to obtain a connecting substrate element; and carrying out encapsulation protection on the connecting substrate element to obtain the electronic substrate element.
Wherein the electronic wire refers to a wire for transmitting current or signals; the stripping of the metal wire means that the insulation layer of the electronic wire is removed; the connection base member refers to a member in which the peeled metal wire is inserted and soldered to a base cutting material.
Further, the electronic wire may be obtained by a cutting tool, such as: cutting blades, cutting tools, and the like; the stripped metal wire can be obtained by a wire stripping tool, such as: tools such as wire stripper; the connection base element may be obtained by automated equipment, such as: welding robot, automatic pin machine, etc.
S2, spraying infrared sensitive materials on the surface of the electronic substrate element by using preset spraying equipment to obtain an infrared spraying element corresponding to the electronic substrate element, calculating an infrared signal-to-noise ratio corresponding to the infrared spraying element, and connecting a preset optical lens on the infrared spraying element based on the infrared signal-to-noise ratio to obtain a primary guide head corresponding to the infrared spraying element.
According to the invention, the infrared sensitive material is sprayed on the surface of the electronic substrate element by using the preset spraying equipment, so that the infrared spraying element corresponding to the electronic substrate element is obtained, the infrared sensing capability can be improved, the application range of functions can be expanded, the element performance can be improved, the manufacturing cost can be reduced, and the electronic substrate element has the advantages of flexibility, customization and the like.
Wherein, infrared sensitive material refers to the material that has the sensitivity to infrared light signal ability, includes: photosensitive semiconductor materials, heat-sensitive materials, infrared luminescent materials, infrared absorption materials, infrared sensitive polymers and the like; the infrared spraying element is an element with infrared induction capability formed after the infrared sensitive material is sprayed on the surface of the electronic substrate element through spraying equipment.
As an embodiment of the present invention, the spraying the infrared sensitive material onto the surface of the electronic substrate element by using a preset spraying device to obtain an infrared spraying element corresponding to the electronic substrate element includes: identifying a surface environment of the electronic substrate component; determining spraying points corresponding to the electronic substrate element based on the surface environment; and spraying the infrared sensitive material on the spraying point by using preset spraying equipment to obtain an infrared spraying element corresponding to the electronic substrate element.
Wherein the surface environment refers to the external environment condition of the electronic substrate element; the spraying point position refers to determining a specific position or area for spraying infrared sensitive materials on the electronic substrate element.
Further, the surface environment may be obtained by mathematical models and algorithmic implementations, such as: a surface fitting algorithm, a plane fitting algorithm and the like; the spray points may be obtained by an optimization algorithm that may take into account a number of factors, such as: coating uniformity, coverage, process feasibility, etc.
As an embodiment of the present invention, the calculating the ir snr corresponding to the ir spraying element includes:
Calculating the infrared signal-to-noise ratio corresponding to the infrared spraying element by using the following formula:
；
wherein,the method is characterized in that the method comprises the steps of indicating the corresponding infrared signal-to-noise ratio of the infrared spraying element, pi represents the signal power of the ith infrared spraying element, gi represents the signal gain of the ith infrared spraying element, ai represents the signal amplifier gain of the ith infrared spraying element, ni represents the noise power of the ith infrared spraying element, bi represents the background noise power of the ith infrared spraying element, and i represents the index of the infrared spraying element.
Based on the infrared signal-to-noise ratio, the invention connects the preset optical lens on the infrared spraying element to obtain the primary guide head corresponding to the infrared spraying element, which can improve the performance, enhance the sensing capability, expand the working distance and reduce the noise interference, thereby providing benefits for the primary guide head corresponding to the infrared spraying element.
Wherein the infrared signal-to-noise ratio refers to a ratio between the infrared radiation signal and background noise; the primary guide head refers to a device or assembly formed on the infrared spray element by connecting an optical lens.
As an embodiment of the present invention, the connecting a preset optical lens to the infrared spray coating element based on the infrared signal-to-noise ratio to obtain a primary guide head corresponding to the infrared spray coating element includes: identifying a signal ratio in the infrared signal-to-noise ratio; positioning a proper position corresponding to the infrared spraying element based on the signal ratio; and installing a preset optical lens at the proper position, and performing optical fine adjustment on the optical lens to obtain the primary seeker corresponding to the infrared spraying element.
Wherein the signal ratio is the relative magnitude of the intensity of the infrared radiation signal and background noise; the proper position refers to the position of the infrared spray element in the optical path to maximize the acquisition effect of the infrared radiation signal.
Further, the signal ratio may be obtained by a deep learning algorithm implementation, such as: convolutional neural networks, etc.; the appropriate location may be obtained by a simulated optimization algorithm implementation, such as: genetic algorithm, particle swarm algorithm, and the like.
S3, identifying the outer surface coating corresponding to the primary guide head, performing optical film plating on the outer surface coating to obtain a plated guide head, and calculating the light beam transmittance corresponding to the plated guide head.
According to the invention, the optical film plating is carried out on the outer surface coating by identifying the corresponding outer surface coating of the primary seeker, so that the plated seeker is obtained, the optical performance of the primary seeker can be improved, the outer surface coating is protected, the sensing function is enhanced, and the accuracy and the stability are improved.
Wherein the exterior coating is a layer of material covering the primary introducer surface; the plating guide head refers to a guide head after the optical film is plated on the surface of the primary guide head.
As one embodiment of the present invention, the identifying the primary guide head corresponds to an outer surface coating, and performing optical film plating on the outer surface coating to obtain a plated guide head, including: determining a material property of the primary seeker; identifying an exterior coating corresponding to the primary seeker based on the material attribute; and performing optical film plating on the outer surface coating by using preset plating equipment to obtain a plating seeker corresponding to the primary seeker.
Wherein, the material property refers to the material property corresponding to the primary seeker, and the material property comprises: hardness, transparency, refractive index, surface flatness, chemical stability, abrasion resistance, etc.; the optical film refers to one or more films deposited on the exterior coating.
Further, the texture attributes may be obtained by a texture analysis tool, such as: tools such as an X-ray diffractometer, an energy spectrometer, a mass spectrometer and the like; the optical film may be obtained by film design software implementation, such as: filmStar DESIGN, TFcalc, etc.
As one embodiment of the present invention, the calculating the beam transmittance corresponding to the plating guidance head includes:
Calculating the light beam transmittance corresponding to the plating guide head by using the following formula:
；
wherein T represents the light beam transmittance corresponding to the plating guidance head,representing the refractive index of the seeker material, i representing the index of the material corresponding to the different parts of the seeker material, n representing the total number of different parts of the seeker material,/>Represents the attenuation coefficient of the ith material in the seeker,/>Indicating the scattering coefficient of the material in the seeker, +.>Indicating the degree of loss in beam transmission in the plating leader,/for the beam>Representing the reflection coefficient of the ith material in the leader.
S4, based on the light beam transmittance, constructing a circuit of the plating guide head to obtain an optical circuit corresponding to the plating guide head, and performing circuit debugging on the optical circuit to obtain a debugging circuit.
The invention builds the circuit of the plating guide head based on the light beam transmittance to obtain the optical circuit corresponding to the plating guide head, can optimize the light beam transmittance of the plating guide head, and can improve the performance of energy transmission, signal transmission or other optical applications by improving the transmission efficiency of the optical circuit.
Wherein the optical circuit refers to an electronic circuit for controlling, manipulating and processing the transmission and conversion of optical signals.
As an embodiment of the present invention, the performing circuit construction on the plating guidance head based on the light beam transmittance to obtain an optical circuit corresponding to the plating guidance head includes: determining a performance target corresponding to the plating guidance head based on the light beam transmittance; analyzing an optical element corresponding to the plating guidance head based on the performance target; based on the optical element, carrying out circuit linking on the plating guide head to obtain a linked circuit; and after the parameters of the link circuit are adjusted, the circuit construction is carried out on the plating guide head, so that an optical circuit corresponding to the plating guide head is obtained.
Wherein, the performance target refers to a specific performance index that the plating leader should achieve in an optical circuit, such as: high transmittance, low loss, accurate focusing, etc.; the optical element refers to various optical elements that need to be used in the circuit building process, such as: lenses, mirrors, optical fibers, polarizers, etc.; the link circuit refers to a circuit for connecting and assembling the optical elements in a certain manner.
Further, the performance objective may be achieved by a beam delivery model, such as: such as: zemax, code V, FRED, etc.; the optical element may be obtained by an optical simulation tool, such as: COMSOL Multiphysics, lumical, etc.; the link circuit may be obtained by a circuit simulation tool implementation, such as; LTspice, PSpice, etc.
According to the method, the optical circuit is subjected to circuit debugging to obtain a debugging circuit, so that problems and faults existing in the circuit can be found in time, and possible fault sources can be identified and corresponding repair measures can be taken by observing circuit output, measuring circuit parameters or using a monitoring instrument.
Wherein the debug circuitry refers to optical circuitry that is tested, optimized, and troubleshooted, optionally, the debug circuitry may be obtained by tuning methods such as: mechanical tuning, temperature control, etc.
S5, based on the debugging circuit, carrying out external packaging on the plating guide head to obtain a packaging guide head, carrying out quality control on the packaging guide head to obtain a control record table corresponding to the packaging guide head, extracting key parameters in the control record table, and generating a preparation flow chart for preparing the infrared guide head based on the key parameters.
The invention is based on the debugging circuit to carry out external encapsulation on the plating seeker to obtain the encapsulation seeker, which can provide the benefits of protection, simplified installation, improved thermal management, convenient debugging and maintenance, is beneficial to ensuring the stability, reliability and performance of the seeker, and provides convenience and flexibility for wider application.
The package seeker is obtained after the original seeker is subjected to physical package treatment, and optionally, the package seeker can be obtained through a package design tool, for example: aldium Designer, cadence, etc.
The invention carries out quality control on the encapsulation seeker to obtain the control record table corresponding to the encapsulation seeker, extracts the key parameters in the control record table, can discover and solve the problems in the production process in time, ensures that the quality of the encapsulation seeker meets the requirements, extracts the key parameters to help identify potential quality problems, and takes corresponding correction and improvement measures.
The control record table is used for recording and tracking related information tables in the production process of the product; the key parameters refer to parameters which have important influences on the quality, performance or reliability of the product in the production process of the product.
Alternatively, the control record table may be obtained by an automated control tool implementation, such as: tools such as PLC, SCADA and the like; the key parameters can be obtained by a DMAIC method of six sigma.
The invention generates the preparation flow chart of the infrared seeker preparation based on the key parameters, can improve the production efficiency, ensure the product quality, and provide guidance and basis for quality control and continuous improvement.
The preparation flow chart refers to a flow chart which is designed by solving steps and operations in the preparation process and combining related technological processes and quality control requirements, and optionally, the preparation flow chart can be obtained through a flow chart drawing tool, such as: microsoft Visio, lucidChart, draw.
The invention obtains the substrate material to be processed, cuts the shape of the substrate material to be processed by utilizing the preset cutting equipment to obtain the substrate cutting material conforming to the shape of the seeker, can furthest utilize raw materials, reduce waste and loss, simultaneously reduce errors and risks of manual operation, and reduce production cost. Therefore, the preparation method and the device for the infrared seeker provided by the invention are used for improving the preparation efficiency of the infrared seeker.
Fig. 2 is a functional block diagram of an apparatus for manufacturing an infrared guide according to an embodiment of the present invention.
The preparation device 200 of the infrared seeker can be installed in electronic equipment. Depending on the functions implemented, the apparatus 200 for preparing an infrared guide head may include a substrate cutting module 201, a signal-to-noise ratio calculating module 202, a transmittance calculating module 203, a circuit debugging module 204, and a flowchart generating module 205. The module of the invention, which may also be referred to as a unit, refers to a series of computer program segments, which are stored in the memory of the electronic device, capable of being executed by the processor of the electronic device and of performing a fixed function.
In the present embodiment, the functions concerning the respective modules/units are as follows:
the substrate cutting module 201 is configured to obtain a substrate material to be processed, perform shape cutting on the substrate material to be processed by using a preset cutting device to obtain a substrate cutting material conforming to a shape of a guide head, and connect a preset electronic wire with the substrate cutting material to obtain an electronic substrate element;
the signal-to-noise ratio calculating module 202 is configured to spray an infrared sensitive material onto the surface of the electronic substrate element by using a preset spraying device, obtain an infrared spray coating element corresponding to the electronic substrate element, calculate an infrared signal-to-noise ratio corresponding to the infrared spray coating element, and connect a preset optical lens to the infrared spray coating element based on the infrared signal-to-noise ratio, so as to obtain a primary guide head corresponding to the infrared spray coating element;
The transmittance calculating module 203 is configured to identify that the primary guide head corresponds to an outer surface coating, perform optical film plating on the outer surface coating to obtain a plated guide head, and calculate a beam transmittance corresponding to the plated guide head;
the circuit debugging module 204 is configured to perform circuit construction on the plating guidance head based on the light beam transmittance to obtain an optical circuit corresponding to the plating guidance head, and perform circuit debugging on the optical circuit to obtain a debug circuit;
the flowchart generating module 205 is configured to perform external packaging on the plating guide head based on the debug circuit to obtain a packaging guide head, perform quality control on the packaging guide head to obtain a control record table corresponding to the packaging guide head, extract key parameters in the control record table, and generate a preparation flowchart for preparing the infrared guide head based on the key parameters.
In detail, each module in the apparatus 200 for manufacturing an infrared guide head according to the embodiment of the present invention adopts the same technical means as the method for manufacturing an infrared guide head according to the attached drawings, and can produce the same technical effects, which are not described herein.
Fig. 3 is a schematic structural diagram of an electronic device for implementing a method for manufacturing an infrared seeker according to the present invention.
The electronic device may comprise a processor 30, a memory 31, a communication bus 32 and a communication interface 33, and may further comprise a computer program stored in the memory 31 and executable on the processor 30, such as an artificial intelligence based engineering safety supervisor.
The processor 30 may be formed by an integrated circuit in some embodiments, for example, a single packaged integrated circuit, or may be formed by a plurality of integrated circuits packaged with the same function or different functions, including one or more central processing units (Central Processing unit, CPU), a microprocessor, a digital processing chip, a graphics processor, a combination of various control chips, and so on. The processor 30 is a Control Unit (Control Unit) of the electronic device, connects various components of the entire electronic device using various interfaces and lines, executes or executes programs or modules (e.g., an artificial intelligence-based engineering safety supervision program, etc.) stored in the memory 31, and invokes data stored in the memory 31 to perform various functions of the electronic device and process the data.
The memory 31 includes at least one type of readable storage medium including flash memory, a removable hard disk, a multimedia card, a card memory (e.g., SD or DX memory, etc.), a magnetic memory, a magnetic disk, an optical disk, etc. The memory 31 may in some embodiments be an internal storage unit of the electronic device, such as a mobile hard disk of the electronic device. The memory 31 may also be an external storage device of the electronic device in other embodiments, for example, a plug-in mobile hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card) or the like, which are provided on the electronic device. Further, the memory 31 may also include both an internal storage unit and an external storage device of the electronic device. The memory 31 may be used not only for storing application software installed in an electronic device and various types of data, such as codes of a database-configured connection program, but also for temporarily storing data that has been output or is to be output.
The communication bus 32 may be a peripheral component interconnect standard (peripheral component interconnect, PCI) bus, or an extended industry standard architecture (extended industry standard architecture, EISA) bus, among others. The bus may be classified as an address bus, a data bus, a control bus, etc. The bus is arranged to enable a connection communication between the memory 31 and at least one processor 30 or the like.
The communication interface 33 is used for communication between the electronic device 3 and other devices, including a network interface and a user interface. Optionally, the network interface may include a wired interface and/or a wireless interface (e.g., WI-FI interface, bluetooth interface, etc.), typically used to establish a communication connection between the electronic device and other electronic devices. The user interface may be a Display (Display), an input unit such as a Keyboard (Keyboard), or alternatively a standard wired interface, a wireless interface. Alternatively, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, an OLED (Organic Light-Emitting Diode) touch, or the like. The display may also be referred to as a display screen or display unit, as appropriate, for displaying information processed in the electronic device and for displaying a visual user interface.
Fig. 3 shows only an electronic device with components, and it will be understood by those skilled in the art that the structure shown in fig. 3 is not limiting of the electronic device and may include fewer or more components than shown, or may combine certain components, or a different arrangement of components.
For example, although not shown, the electronic device may further include a power source (such as a battery) for supplying power to the respective components, and preferably, the power source may be logically connected to the at least one processor 30 through a power management device, so that functions of charge management, discharge management, power consumption management, and the like are implemented through the power management device. The power supply may also include one or more of any of a direct current or alternating current power supply, recharging device, power failure detection circuit, power converter or inverter, power status indicator, etc. The electronic device may further include various sensors, bluetooth modules, wi-Fi modules, etc., which are not described herein.
It should be understood that the embodiments described are for illustrative purposes only and are not limited in scope by this configuration.
The database-configured connection program stored in the memory 31 in the electronic device is a combination of a plurality of computer programs, which, when run in the processor 30, can implement:
obtaining a substrate material to be processed, performing shape cutting on the substrate material to be processed by using preset cutting equipment to obtain a substrate cutting material conforming to the shape of a guide head, and connecting a preset electronic wire with the substrate cutting material to obtain an electronic substrate element;
Spraying infrared sensitive materials on the surface of the electronic substrate element by using preset spraying equipment to obtain an infrared spraying element corresponding to the electronic substrate element, calculating an infrared signal-to-noise ratio corresponding to the infrared spraying element, and connecting a preset optical lens on the infrared spraying element based on the infrared signal-to-noise ratio to obtain a primary guide head corresponding to the infrared spraying element;
identifying an outer surface coating corresponding to the primary seeker, performing optical film plating on the outer surface coating to obtain a plated seeker, and calculating the light beam transmittance corresponding to the plated seeker;
based on the light beam transmittance, performing circuit construction on the plating guidance head to obtain an optical circuit corresponding to the plating guidance head, and performing circuit debugging on the optical circuit to obtain a debugging circuit;
and carrying out external packaging on the plating guide head based on the debugging circuit to obtain a packaging guide head, carrying out quality control on the packaging guide head to obtain a control record table corresponding to the packaging guide head, extracting key parameters in the control record table, and generating a preparation flow chart for preparing the infrared guide head based on the key parameters.
In particular, the specific implementation method of the processor 30 on the computer program may refer to the description of the relevant steps in the corresponding embodiment of fig. 1, which is not repeated herein.
Further, the electronic device integrated modules/units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a non-volatile computer readable storage medium. The storage medium may be volatile or nonvolatile. For example, the computer readable medium may include: any entity or device capable of carrying the computer program code, a recording medium, a U disk, a removable hard disk, a magnetic disk, an optical disk, a computer Memory, a Read-Only Memory (ROM).
The present invention also provides a storage medium storing a computer program which, when executed by a processor of an electronic device, can implement:
obtaining a substrate material to be processed, performing shape cutting on the substrate material to be processed by using preset cutting equipment to obtain a substrate cutting material conforming to the shape of a guide head, and connecting a preset electronic wire with the substrate cutting material to obtain an electronic substrate element;
Spraying infrared sensitive materials on the surface of the electronic substrate element by using preset spraying equipment to obtain an infrared spraying element corresponding to the electronic substrate element, calculating an infrared signal-to-noise ratio corresponding to the infrared spraying element, and connecting a preset optical lens on the infrared spraying element based on the infrared signal-to-noise ratio to obtain a primary guide head corresponding to the infrared spraying element;
identifying an outer surface coating corresponding to the primary seeker, performing optical film plating on the outer surface coating to obtain a plated seeker, and calculating the light beam transmittance corresponding to the plated seeker;
based on the light beam transmittance, performing circuit construction on the plating guidance head to obtain an optical circuit corresponding to the plating guidance head, and performing circuit debugging on the optical circuit to obtain a debugging circuit;
and carrying out external packaging on the plating guide head based on the debugging circuit to obtain a packaging guide head, carrying out quality control on the packaging guide head to obtain a control record table corresponding to the packaging guide head, extracting key parameters in the control record table, and generating a preparation flow chart for preparing the infrared guide head based on the key parameters.
In the several embodiments provided in the present invention, it should be understood that the disclosed apparatus, device and method may be implemented in other manners. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the modules is merely a logical function division, and there may be other manners of division when actually implemented.
The modules described as separate components may or may not be physically separate, and components shown as modules may or may not be physical units, may be located in one place, or may be distributed over multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional module in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units can be realized in a form of hardware or a form of hardware and a form of software functional modules.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.
The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference signs in the claims shall not be construed as limiting the claim concerned.
It should be noted that in this document, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is only a specific embodiment of the invention to enable those skilled in the art to understand or practice the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A method of making an infrared seeker, the method comprising:
obtaining a substrate material to be processed, performing shape cutting on the substrate material to be processed by using preset cutting equipment to obtain a substrate cutting material conforming to the shape of a guide head, and connecting a preset electronic wire with the substrate cutting material to obtain an electronic substrate element;
spraying infrared sensitive materials on the surface of the electronic substrate element by using preset spraying equipment to obtain an infrared spraying element corresponding to the electronic substrate element, calculating an infrared signal-to-noise ratio corresponding to the infrared spraying element, and connecting a preset optical lens on the infrared spraying element based on the infrared signal-to-noise ratio to obtain a primary guide head corresponding to the infrared spraying element;
Identifying an outer surface coating corresponding to the primary seeker, performing optical film plating on the outer surface coating to obtain a plated seeker, and calculating the light beam transmittance corresponding to the plated seeker;
based on the light beam transmittance, performing circuit construction on the plating guidance head to obtain an optical circuit corresponding to the plating guidance head, and performing circuit debugging on the optical circuit to obtain a debugging circuit;
and carrying out external packaging on the plating guide head based on the debugging circuit to obtain a packaging guide head, carrying out quality control on the packaging guide head to obtain a control record table corresponding to the packaging guide head, extracting key parameters in the control record table, and generating a preparation flow chart for preparing the infrared guide head based on the key parameters.
2. The method for preparing an infrared seeker according to claim 1, wherein the step of obtaining the substrate material to be processed, and performing shape cutting on the substrate material to be processed by using a preset cutting device to obtain a substrate cutting material conforming to the shape of the seeker, comprises the steps of:
acquiring a substrate material to be processed corresponding to an infrared seeker based on the construction requirement of the infrared seeker;
Setting equipment parameters of the preset cutting equipment based on the construction specification of the infrared seeker;
determining a cutting template corresponding to the infrared seeker based on the equipment parameters;
and cutting the shape of the substrate material to be processed based on the cutting template to obtain the substrate cutting material conforming to the shape of the seeker.
3. The method for manufacturing an infrared leader according to claim 1, wherein the connecting the preset electronic wire to the base cutting material to obtain the electronic base component comprises:
determining an electronic wire corresponding to the base cutting material;
stripping the insulating layer of the electronic wire to obtain a stripped metal wire;
inserting pins into the stripped metal wire and the substrate cutting material, and welding the pins to obtain a connecting substrate element;
and carrying out encapsulation protection on the connecting substrate element to obtain the electronic substrate element.
4. The method for manufacturing an infrared guide head according to claim 1, wherein the spraying the infrared sensitive material onto the surface of the electronic substrate element by using a preset spraying device to obtain an infrared spraying element corresponding to the electronic substrate element comprises:
Identifying a surface environment of the electronic substrate component;
determining spraying points corresponding to the electronic substrate element based on the surface environment;
and spraying the infrared sensitive material on the spraying point by using preset spraying equipment to obtain an infrared spraying element corresponding to the electronic substrate element.
5. The method for manufacturing an infrared seeker according to claim 1, wherein the calculating the infrared signal-to-noise ratio corresponding to the infrared spray element includes:
calculating the infrared signal-to-noise ratio corresponding to the infrared spraying element by using the following formula:
；
wherein,the method is characterized in that the method comprises the steps of indicating the corresponding infrared signal-to-noise ratio of the infrared spraying element, pi represents the signal power of the ith infrared spraying element, gi represents the signal gain of the ith infrared spraying element, ai represents the signal amplifier gain of the ith infrared spraying element, ni represents the noise power of the ith infrared spraying element, bi represents the background noise power of the ith infrared spraying element, and i represents the index of the infrared spraying element.
6. The method for manufacturing an infrared guide head according to claim 1, wherein the connecting a preset optical lens to the infrared spray coating element based on the infrared signal-to-noise ratio to obtain the primary guide head corresponding to the infrared spray coating element comprises:
Identifying a signal ratio in the infrared signal-to-noise ratio;
positioning a proper position corresponding to the infrared spraying element based on the signal ratio;
and installing a preset optical lens at the proper position, and performing optical fine adjustment on the optical lens to obtain the primary seeker corresponding to the infrared spraying element.
7. The method of manufacturing an infrared seeker of claim 1, wherein said identifying the outer surface coating of the primary seeker, and performing optical film plating on the outer surface coating to obtain a plated seeker, comprises:
determining a material property of the primary seeker;
identifying an exterior coating corresponding to the primary seeker based on the material attribute;
and performing optical film plating on the outer surface coating by using preset plating equipment to obtain a plating seeker corresponding to the primary seeker.
8. The method for manufacturing an infrared seeker according to claim 1, wherein the calculating the beam transmittance corresponding to the plating seeker includes:
calculating the light beam transmittance corresponding to the plating guide head by using the following formula:
；
wherein T represents the light beam transmittance corresponding to the plating guidance head, Representing the index of refraction of the seeker material, i representing the index of the material corresponding to the different portions of the seeker material, n representing the total number of different portions of the seeker material,represents the attenuation coefficient of the ith material in the seeker,/>Indicating the scattering coefficient of the material in the seeker, +.>Indicating the degree of loss in beam transmission in the plating leader,/for the beam>Representing the reflection coefficient of the ith material in the leader.
9. The method for manufacturing an infrared seeker according to claim 1, wherein the performing circuit construction on the plating seeker based on the light beam transmittance to obtain an optical circuit corresponding to the plating seeker comprises:
determining a performance target corresponding to the plating guidance head based on the light beam transmittance;
analyzing an optical element corresponding to the plating guidance head based on the performance target;
based on the optical element, carrying out circuit linking on the plating guide head to obtain a linked circuit;
and after the parameters of the link circuit are adjusted, the circuit construction is carried out on the plating guide head, so that an optical circuit corresponding to the plating guide head is obtained.
10. An apparatus for preparing an infrared leader, characterized in that it is used to perform a method for preparing an infrared leader according to any of claims 1 to 9, said apparatus comprising:
The substrate cutting module is used for obtaining a substrate material to be processed, performing shape cutting on the substrate material to be processed by using preset cutting equipment to obtain a substrate cutting material conforming to the shape of the guide head, and connecting a preset electronic wire with the substrate cutting material to obtain an electronic substrate element;
the signal-to-noise ratio calculation module is used for spraying infrared sensitive materials on the surface of the electronic substrate element by using preset spraying equipment to obtain an infrared spraying element corresponding to the electronic substrate element, calculating the infrared signal-to-noise ratio corresponding to the infrared spraying element, and connecting a preset optical lens on the infrared spraying element based on the infrared signal-to-noise ratio to obtain a primary guide head corresponding to the infrared spraying element;
the transmittance calculating module is used for identifying the outer surface coating corresponding to the primary guide head, performing optical film plating on the outer surface coating to obtain a plated guide head, and calculating the light beam transmittance corresponding to the plated guide head;
the circuit debugging module is used for constructing a circuit for the plating guide head based on the light beam transmittance to obtain an optical circuit corresponding to the plating guide head, and carrying out circuit debugging on the optical circuit to obtain a debugging circuit;
The flow chart generating module is used for carrying out external packaging on the plating guide head based on the debugging circuit to obtain a packaging guide head, carrying out quality control on the packaging guide head to obtain a control record table corresponding to the packaging guide head, extracting key parameters in the control record table, and generating a preparation flow chart for preparing the infrared guide head based on the key parameters.
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| EP0882941A1 (en) * | 1997-06-07 | 1998-12-09 | Bodenseewerk Gerätetechnik GmbH | Infrared seeker head for homing missile |
| JPH11126913A (en) * | 1997-10-21 | 1999-05-11 | Citizen Electronics Co Ltd | Infrared-ray data communication module and its manufacturing method |
| ES2311180T3 (en) * | 2004-12-29 | 2009-02-01 | Ministerio De Defensa | METHOD FOR PROCESSING POLYCRYSTAL LEAD SELENIUR INFRARED DETECTORS. |
| CN202255445U (en) * | 2011-09-22 | 2012-05-30 | 中国航天科工集团第三研究院第八三五八研究所 | Laser semi-active infrared compound seeker testing device |
| CN112394430A (en) * | 2020-12-18 | 2021-02-23 | 湖南华南光电(集团)有限责任公司 | General low-cost large-view-field laser seeker optical system |
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2024
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0882941A1 (en) * | 1997-06-07 | 1998-12-09 | Bodenseewerk Gerätetechnik GmbH | Infrared seeker head for homing missile |
| JPH11126913A (en) * | 1997-10-21 | 1999-05-11 | Citizen Electronics Co Ltd | Infrared-ray data communication module and its manufacturing method |
| ES2311180T3 (en) * | 2004-12-29 | 2009-02-01 | Ministerio De Defensa | METHOD FOR PROCESSING POLYCRYSTAL LEAD SELENIUR INFRARED DETECTORS. |
| CN202255445U (en) * | 2011-09-22 | 2012-05-30 | 中国航天科工集团第三研究院第八三五八研究所 | Laser semi-active infrared compound seeker testing device |
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