CN117514811A - Horizontal compressor controller and control method thereof - Google Patents

Abstract

The invention discloses a horizontal compressor controller and a control method thereof, wherein the controller is arranged on a rear shell of a horizontal compressor, and the rear shell is contacted with an air suction side of the horizontal compressor; the controller comprises a PCB, a control chip, a flat heat pipe and a refrigerating sheet, wherein the control chip is electrically connected with the PCB and is contacted with the rear shell; the flat heat pipe extends between the control chip and the PCB along a first direction to sequentially form a first area, a second area and a third area; the refrigerating sheet arranged on the inner wall of the rear shell is contacted with the first area, the control chip is contacted with the third area, and a gap is reserved between the second area and the rear shell; the refrigerating sheet is electrically connected with the PCB, the cold end is connected with the flat heat pipe, and the hot end is connected with the rear shell. The filter and the application method thereof enable the control chip to dissipate heat passively and actively, thereby greatly improving the heat dissipation effect of the control chip; the middle part of the flat heat pipe is suspended, so that direct contact between a cold source and a heat source is avoided, the heat transfer effect of the flat heat pipe is improved, and the heat dissipation of the control chip is enhanced.

Description

Horizontal compressor controller and control method thereof

Technical Field

The invention relates to the field of refrigeration, in particular to a horizontal compressor controller and a control method thereof.

Background

The variable frequency controller of the scroll compressor has higher chip heating value under partial working conditions, when the heat dissipation capacity of the controller chip is lower than the heat dissipation capacity of the controller chip, the controller chip gradually entering an overheat or overtemperature state can limit the operation of the compressor, and even the compressor controller chip is damaged when serious.

In the prior art, the controller chip conducts heat to the low-temperature area side of the low-pressure cavity of the compressor through heat conduction silicone grease to realize heat dissipation. However, the design belongs to passive heat dissipation, and under partial working conditions, the chip can be overheated due to poor heat dissipation.

In view of the above-mentioned drawbacks, the present invention provides a new horizontal compressor controller and a control method thereof.

Disclosure of Invention

The invention aims to provide a horizontal compressor controller and a control method thereof, which improve heat dissipation of a horizontal compressor controller chip.

The invention solves the technical problems by the following technical proposal:

the invention provides a horizontal compressor controller, which is arranged on a rear shell of a horizontal compressor, wherein the rear shell is in surface contact with the air suction side of the horizontal compressor;

the controller comprises a PCB, a control chip, a flat heat pipe and a refrigerating sheet, wherein the control chip is electrically connected with the PCB at one side of the PCB and forms surface contact with the rear shell;

the flat heat pipe is positioned between the control chip and the PCB and extends along a first direction, and a first area, a second area and a third area are formed on the side surface facing the rear shell in sequence; the refrigerating sheet arranged on the inner wall of the rear shell is in surface contact with the first area, the control chip is in surface contact with the third area, and a gap is reserved between the second area and the rear shell;

the refrigerating sheet is electrically connected with the PCB and used for conducting heat of the control chip to the rear shell when the refrigerating sheet is electrified; the refrigerating sheet comprises a hot end and a cold end, the cold end of the refrigerating sheet is connected with the flat heat pipe, and the hot end of the refrigerating sheet is connected with the rear shell.

In the technical scheme, the control chip performs passive heat dissipation through surface contact with the rear shell, and also realizes active heat dissipation through the Peltier effect generated after the flat heat pipe is electrified by the connection of the refrigerating piece, so that the heat dissipation effect of the control chip is greatly improved; meanwhile, the part of the flat heat pipe, which is connected with the control chip and the refrigerating sheet, is suspended, so that direct contact between a cold source and a heat source is avoided, the heat transfer effect of the flat heat pipe is improved, and the heat dissipation of the control chip is enhanced.

Preferably, a first heat conducting layer is coated between the control chip and the rear shell.

In the technical scheme, the first heat conduction layer eliminates air between the control chip and the rear shell, so that the control chip can conduct heat to the rear shell fully.

Preferably, a second heat conducting layer is coated between the flat heat pipe and the control chip.

In the technical scheme, the second heat conduction layer eliminates air between the control chip and the flat heat pipe, so that the control chip can conduct heat to the flat heat pipe fully.

Preferably, a third heat conduction layer is coated between the refrigerating sheet and the flat heat pipe, and a fourth heat conduction layer is coated between the refrigerating sheet and the rear shell.

In the technical scheme, the third heat conduction layer eliminates air between the refrigerating sheet and the flat heat pipe, and the fourth heat conduction layer eliminates air between the refrigerating sheet and the rear shell, so that heat can be conducted from the flat heat pipe to the rear shell through the refrigerating sheet without affecting the temperature of the refrigerating sheet, and the heat dissipation efficiency is improved.

Preferably, the control chip is connected with the PCB board through a plurality of pins, the flat heat pipe is located in the middle of the control chip, and the plurality of pins are disposed on two sides of the control chip parallel to the flat heat pipe.

In the technical scheme, the flat heat pipe and the pins are not interfered with each other, so that the control chip works completely and normally.

Preferably, the control chip is connected with the PCB board through a plurality of pins, at least one through hole is formed in the flat heat pipe, and the pins penetrate through the through hole.

In the technical scheme, in order to adapt to the design of a control chip, the flat heat pipe is provided with the through holes for giving the pins to give way, so that liquid in the flat heat pipe can circulate normally, and the pins can be connected with the PCB normally.

Preferably, the refrigerating sheet is located above the control chip, and the first direction is a gravity direction.

In the technical scheme, liquid in the flat heat pipe connecting the refrigerating sheet and the control chip is heated to flow from one end of the control chip to one end of the refrigerating sheet in a gaseous state, and becomes liquid after being cooled by heat release at one end of the refrigerating sheet, and naturally flows back to one end of the control chip under the action of gravity without external driving.

Preferably, the flat heat pipe extends from one side of the cooling fin to the opposite side.

In the technical scheme, the contact area between the flat heat pipe and the refrigerating sheet is large, and heat is uniformly transferred to each part of the refrigerating sheet.

Preferably, a plurality of bosses are formed on the inner wall of the rear case, and the control chip and the refrigerating sheet are respectively connected with different bosses.

In the technical scheme, the control chip and the refrigerating sheet are used as a heat source and a cold source and are not in direct contact, so that the heat transfer effect of the flat heat pipe is improved, and the heat dissipation of the control chip is enhanced.

The invention also provides a control method of the horizontal compressor controller, which is applied to the horizontal compressor controller;

when the temperature of the control chip is increased to a first preset temperature of the control chip, the PCB starts to supply weak direct current to the refrigerating sheet, and the refrigerating sheet starts to cool;

when the temperature of the control chip is reduced to the second preset temperature of the control chip, the PCB stops supplying weak direct current to the refrigerating sheet, and the refrigerating sheet stops reducing the temperature.

In the technical scheme, when the heat dissipation of the control chip is normal, the refrigerating sheet does not work, active heat dissipation is not carried out, and only when the temperature of the control chip is too high, the refrigerating sheet starts to work, so that the damage of the control chip caused by too high temperature is avoided, and the heat dissipation energy consumption is reduced.

On the basis of conforming to the common knowledge in the field, the above preferred conditions can be arbitrarily combined to obtain the preferred examples of the invention.

The invention has the positive progress effects that:

according to the horizontal compressor controller and the control method thereof, the control chip performs passive heat dissipation through surface contact with the rear shell, and active heat dissipation is realized through the Peltier effect generated after the flat heat pipe is electrified by the connection of the refrigerating piece, so that the heat dissipation effect of the control chip is greatly improved; meanwhile, the part of the flat heat pipe, which is connected with the control chip and the refrigerating sheet, is suspended, so that direct contact between a cold source and a heat source is avoided, the heat transfer effect of the flat heat pipe is improved, and the heat dissipation of the control chip is enhanced.

Drawings

Fig. 1 is a schematic side view of a horizontal compressor controller according to an embodiment of the present invention.

Fig. 2 is a schematic diagram of a cooling fin and a flat heat pipe of a horizontal compressor controller according to an embodiment of the present invention.

Reference numerals illustrate:

a rear case 1, a boss 11;

a PCB 2;

a control chip 3, pins 31;

a flat heat pipe 4, a first region 41, a second region 42, and a third region 43;

a refrigerating sheet 5, a hot end 51, a cold end 52;

a first heat conductive layer 6;

a second heat conductive layer 7;

a third heat conductive layer 8;

and a fourth heat conductive layer 9.

Detailed Description

The invention is further illustrated by means of the following examples, which are not intended to limit the scope of the invention.

Referring to fig. 1 and 2, reference is made to a schematic diagram of an embodiment of the horizontal compressor controller of the present invention. The horizontal compressor controller is arranged on a rear shell 1 of the horizontal compressor, and the rear shell 1 is in surface contact with the suction side of the horizontal compressor; the controller comprises a PCB (printed circuit board) 2, a control chip 3, a flat heat pipe 4 and a refrigerating sheet 5, wherein the control chip 3 is electrically connected with the PCB 2 at one side of the PCB 2 and forms surface contact with the rear shell 1; the flat heat pipe 4 is located between the control chip 3 and the PCB board 2 and extends in a first direction, and a first region 41, a second region 42, and a third region 43 are sequentially formed on a side surface facing the rear case 1; the refrigerating sheet 5 mounted on the inner wall of the rear shell 1 is in surface contact with the first area 41, the control chip 3 is in surface contact with the third area 43, and a gap is reserved between the second area 42 and the rear shell 1; the refrigerating sheet 5 is electrically connected with the PCB 2 and is used for conducting heat of the control chip 3 to the rear shell 1 when the power is on; the refrigerating plate 5 comprises a hot end 51 and a cold end 52, the cold end 52 of the refrigerating plate 5 is connected with the flat heat pipe 4, and the hot end 51 of the refrigerating plate 5 is connected with the rear shell 1. The control chip 3 performs passive heat dissipation through surface contact with the rear shell 1, and also realizes active heat dissipation through the Peltier effect generated after the refrigeration piece 5 is electrified through the connection of the flat heat pipe 4 and the refrigeration piece 5, so that the heat dissipation effect of the control chip 3 is greatly improved; meanwhile, the part of the flat heat pipe 4 connected with the control chip 3 and the refrigerating sheet 5 is suspended, so that direct contact between a cold source and a heat source is avoided, the heat transfer effect of the flat heat pipe 4 is improved, and the heat dissipation of the control chip 3 is enhanced.

The refrigerating sheet 5 is a TEC semiconductor refrigerating sheet, and the size of the refrigerating sheet can be varied from 2mm x 2mm to 62mm x 62mm according to requirements. In this embodiment, the cooling fin 5 has a length of 20mm, a width of 16mm, and a thickness of 4mm.

The flat heat pipe 4 is composed of a pipe shell, a liquid suction core and an end cover, the pipe is pumped into negative pressure and then filled with a proper amount of working liquid, the liquid suction core capillary porous material which is closely attached to the inner wall of the pipe is filled with the liquid and then sealed, and the second area can be set as a heat insulation section. The negative pressure value was 1.3X (10 ^-1 ～10 ^-4 ) In Pa, the heat conductivity of the flat heat pipe 4 is in the range of 10000 to 100000 (W/m.K). Flat plateThe size of the flat heat pipe 4 can be adjusted according to the requirement, but the thickness is not less than 2mm. In this embodiment, the flat heat pipe 4 has a length of 50mm, a width of 12mm, and a thickness of 3.5mm.

In the present embodiment, a first heat conductive layer 6 is applied between the control chip 3 and the rear case 1. The first heat conductive layer 6 excludes air between the control chip 3 and the rear case 1 so that the control chip 3 can sufficiently conduct heat to the rear case 1.

A second heat-conducting layer 7 is applied between the flat heat pipe 4 and the control chip 3. The second heat conduction layer 7 eliminates air between the control chip 3 and the flat heat pipe 4, so that the control chip 3 can conduct heat to the flat heat pipe 4 sufficiently.

A third heat conduction layer 8 is coated between the refrigerating sheet 5 and the flat heat pipe 4, and a fourth heat conduction layer 9 is coated between the refrigerating sheet 5 and the rear shell 1. The third heat conduction layer 8 eliminates the air between the refrigerating sheet 5 and the flat heat pipe 4, and the fourth heat conduction layer 9 eliminates the air between the refrigerating sheet 5 and the rear shell 1, so that the heat can be conducted from the flat heat pipe 4 to the rear shell 1 through the refrigerating sheet 5 without affecting the temperature of the refrigerating sheet 5, and the heat dissipation efficiency is improved.

The materials of the first heat conduction layer 6, the second heat conduction layer 7, the third heat conduction layer 8 and the fourth heat conduction layer 9 are heat conduction silicone grease.

The control chip 3 is connected with the PCB 2 through a plurality of pins 31, the flat heat pipe 4 is positioned in the middle of the control chip 3, and the plurality of pins 31 are arranged on two sides of the control chip 3 parallel to the flat heat pipe 4. The flat heat pipe 4 and the pins 31 are not interfered with each other, so that the control chip 3 works completely and normally. In this embodiment, the width of the control chip 3 is 20mm, the thickness is 6mm, and the length of the pins 31 extending out of the control chip 3 is 5mm.

In other embodiments, the pins 31 may be disposed in the middle of the control chip 3, where at least one through hole is formed on the flat heat pipe 4, and the pins 31 penetrate through the through hole. In order to adapt to the design of the control chip 3, the flat heat pipe 4 is provided with a through hole to give way to the pins 31, so that the liquid in the flat heat pipe 4 can circulate normally, and the pins 31 can be connected with the PCB 2 normally.

In this embodiment, the cooling plate 5 is located above the control chip 3, and the first direction is the gravity direction. The liquid in the flat heat pipe 4 connecting the refrigerating sheet 5 and the control chip 3 is heated to flow from one end of the control chip 3 to one end of the refrigerating sheet 5 in a gaseous state, and is changed into a liquid state after being cooled by heat release at one end of the refrigerating sheet 5, and naturally flows back to one end of the control chip 3 under the action of gravity without external driving.

In other embodiments, the cooling plate 5 may be located below the control chip 3 if necessary, provided that a capillary structure is provided in the flat heat pipe 4.

In this embodiment, the flat heat pipe 4 extends from one side of the cooling fin 5 to the opposite side. The contact area between the flat heat pipe 4 and the refrigerating sheet 5 is large, and heat is uniformly transferred to each part of the refrigerating sheet 5.

A plurality of bosses 11 are formed on the inner wall of the rear case 1, and the control chip 3 and the refrigerating sheet 5 are respectively connected with different bosses 11. The control chip 3 and the refrigerating sheet 5 are used as a heat source and a cold source, are not in direct contact, so that the heat transfer effect of the flat heat pipe 4 is improved, and the heat dissipation of the control chip 3 is enhanced.

The invention also provides a control method of the horizontal compressor controller, which is applied to the horizontal compressor controller; when the temperature of the control chip 3 rises to the first preset temperature of the control chip 3, the PCB 2 starts to supply weak direct current to the refrigerating sheet 5, and the refrigerating sheet 5 starts to cool; when the temperature of the control chip 3 is reduced to the second preset temperature of the control chip 3, the PCB 2 stops supplying weak direct current to the refrigerating sheet 5, and the refrigerating sheet 5 stops reducing the temperature. In this embodiment, the protection temperature of the control chip 3 is 110 ℃, the first preset temperature is 100 ℃, the second preset temperature is 60 ℃, and the voltage of the weak direct current is 12V. When the heat dissipation of the control chip 3 is normal, the refrigerating sheet 5 does not work, active heat dissipation is not carried out, and only when the temperature of the control chip 3 is too high, the refrigerating sheet 5 starts to work, so that the damage of the control chip 3 caused by too high temperature is avoided, and the heat dissipation energy consumption is reduced.

In other embodiments, the first preset temperature, the second preset temperature, and the voltage of the weak dc current may be set to other values as desired.

While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that this is by way of example only, and the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the principles and spirit of the invention, but such changes and modifications fall within the scope of the invention.

Claims (10)

1. A horizontal compressor controller, wherein the controller is mounted on a rear shell of the horizontal compressor, and the rear shell is in surface contact with a suction side of the horizontal compressor;

the controller comprises a PCB, a control chip, a flat heat pipe and a refrigerating sheet, wherein the control chip is electrically connected with the PCB at one side of the PCB and forms surface contact with the rear shell;

the flat heat pipe is positioned between the control chip and the PCB and extends along a first direction, and a first area, a second area and a third area are formed on the side surface facing the rear shell in sequence; the refrigerating sheet arranged on the inner wall of the rear shell is in surface contact with the first area, the control chip is in surface contact with the third area, and a gap is reserved between the second area and the rear shell;

the refrigerating sheet is electrically connected with the PCB and used for conducting heat of the control chip to the rear shell when the refrigerating sheet is electrified; the refrigerating sheet comprises a hot end and a cold end, the cold end of the refrigerating sheet is connected with the flat heat pipe, and the hot end of the refrigerating sheet is connected with the rear shell.

2. The controller of claim 1, wherein a first thermally conductive layer is applied between the control chip and the rear housing.

3. The controller of claim 1, wherein a second thermally conductive layer is applied between the flat heat pipe and the control chip.

4. The controller of claim 1 wherein a third thermally conductive layer is applied between the cooling fin and the flat heat pipe and a fourth thermally conductive layer is applied between the cooling fin and the rear housing.

5. The controller of claim 1, wherein the control chip is connected to the PCB board by a plurality of pins, the flat heat pipe is located in a middle portion of the control chip, and the plurality of pins are disposed on two sides of the control chip parallel to the flat heat pipe.

6. The controller of claim 1 wherein the control chip is connected to the PCB via a plurality of pins, the flat heat pipe having at least one through hole formed therein, the pins extending through the through hole.

7. The controller of claim 1, wherein the cooling fin is located above the control chip, and the first direction is a direction of gravity.

8. The controller of claim 1 wherein the flat heat pipe extends from one side of the cooling fin to an opposite side.

9. The controller of claim 1, wherein a plurality of bosses are formed on an inner wall of the rear case, and the control chip and the cooling fin are respectively connected to different ones of the bosses.

10. A control method of a horizontal compressor controller, characterized by being applied to the horizontal compressor controller according to any one of claims 1 to 9;

when the temperature of the control chip is increased to a first preset temperature of the control chip, the PCB starts to supply weak direct current to the refrigerating sheet, and the refrigerating sheet starts to cool;

when the temperature of the control chip is reduced to the second preset temperature of the control chip, the PCB stops supplying weak direct current to the refrigerating sheet, and the refrigerating sheet stops reducing the temperature.