CN117460368A - Display device and mobile terminal - Google Patents
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- CN117460368A CN117460368A CN202311347949.4A CN202311347949A CN117460368A CN 117460368 A CN117460368 A CN 117460368A CN 202311347949 A CN202311347949 A CN 202311347949A CN 117460368 A CN117460368 A CN 117460368A
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- heat dissipation
- circuit board
- printed circuit
- driving chip
- display device
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Abstract
The application provides a display device and mobile terminal, the display device includes a display panel, a supporting part and a circuit board assembly, a heat dissipation groove is formed in a printed circuit board, the heat dissipation groove is located at one side of the printed circuit board close to the supporting part, the heat dissipation groove penetrates through the printed circuit board along a first direction, and air is filled in the heat dissipation groove, so that heat released by the circuit board assembly can be transferred into the heat dissipation groove to form heat dissipation airflow to be released to the outside, and damage of organic materials irradiating the display panel due to the burning problem of a driving chip after long-time working is avoided; meanwhile, the heat conductivity coefficient of the air is smaller than that of the printed circuit board, and after the heat dissipation groove is filled with the air, the heat exchange speed between the printed circuit board and the display panel is reduced, so that heat generated by the driving chip can be discharged in time, and the reliability of the circuit board assembly is improved.
Description
Technical Field
The application relates to the technical field of display, in particular to a display device and a mobile terminal.
Background
At present, with the development of electronic technology, electronic devices such as mobile phones and tablet computers have become an indispensable part of daily life and work of people, and the requirements of users on the appearance design of display panels are higher and higher; in the organic light emitting diode (Organic Light Emitting Diode, OLED) technology, in order to increase the screen ratio and reduce the size of the bezel, a terminal bending technology (pad bending) is generally used, which is to bend the protruding end of the flexible substrate of the display device to the back of the display, and then bind a flexible circuit board, a chip and a printed circuit board to the back of the flexible substrate, thereby realizing the narrow bezel of the non-display area.
In the existing display device, the driving chip can generate a burn-out problem after working for a long time, so that potential safety hazards exist in organic materials of the display panel at the connecting position of the driving chip, and the display abnormal problem of yellowing of the display screen is caused.
Disclosure of Invention
The embodiment of the invention provides a display device and a mobile terminal, which are used for relieving the defects in the related art.
In order to achieve the above functions, the technical solution provided in the embodiments of the present application is as follows:
a display device, comprising:
the display panel comprises a plane part, a binding part arranged opposite to the plane part and a bending part connected between the plane part and the binding part;
a support portion disposed between the planar portion and the binding portion;
the circuit board assembly is positioned at one side of the supporting part far away from the plane part, the circuit board assembly is connected with the binding part, the circuit board assembly comprises a printed circuit board and a driving chip, the printed circuit board is arranged corresponding to the plane part, the printed circuit board is fixedly connected with one side of the supporting part far away from the plane part, and the driving chip is arranged at one side of the printed circuit board far away from the supporting part;
the printed circuit board is provided with a heat dissipation groove, the heat dissipation groove is positioned on one side, close to the supporting part, of the printed circuit board, the heat dissipation groove penetrates through the printed circuit board along a first direction, air is filled in the heat dissipation groove, and the first direction is perpendicular to the light emitting direction of the display panel.
In the display device provided by the embodiment of the application, the printed circuit board comprises a plurality of interlayer substrates and a plurality of metal layers, wherein the interlayer substrates and the metal layers are sequentially overlapped along a second direction, and the second direction is parallel to the light emitting direction of the display panel;
and the heat dissipation grooves penetrate through at least two layers of the interlayer substrates in the second direction.
In the display device provided by the embodiment of the application, in the second direction, one metal layer is located at one side of the heat dissipation groove, and the supporting portion is located at the other side of the heat dissipation groove.
In the display device provided by the embodiment of the application, the printed circuit board is provided with a plurality of through holes, the through holes correspond to the driving chip, the through holes penetrate through the printed circuit board, and the through holes are communicated with the heat dissipation grooves.
In the display device provided by the embodiment of the application, the display device comprises a plurality of bonding pads, wherein the bonding pads are positioned between the driving chip and the printed circuit board, and the driving chip is connected with the printed circuit board through the bonding pads;
the through holes are in one-to-one correspondence with the bonding pads, penetrate through the printed circuit board and expose part of the bonding pads.
In the display device provided by the embodiment of the application, the display device further comprises a heat dissipation assembly, and the heat dissipation assembly is attached to the surface of one side, far away from the printed circuit board, of the driving chip;
the front projection area of the heat dissipation assembly on the printed circuit board is larger than or equal to the front projection area of the driving chip on the printed circuit board.
In the display device provided by the embodiment of the application, the heat dissipation assembly includes a heat dissipation glue, a heat dissipation layer and a plurality of heat dissipation fins, the heat dissipation layer is connected with the driving chip through the heat dissipation glue, and the plurality of heat dissipation fins are arranged on one side of the heat dissipation layer far away from the driving chip;
the orthographic projection area of the heat dissipation layer on the printed circuit board is larger than or equal to the orthographic projection area of the driving chip on the printed circuit board, and orthographic projections of the plurality of heat dissipation fins on the heat dissipation layer are located in the heat dissipation layer.
In the display device provided by the embodiment of the application, the heat dissipation layer comprises a groove, the groove is located on one side, close to the driving chip, of the heat dissipation layer, the driving chip is arranged in the groove, and the heat dissipation glue is arranged between the inner wall of the groove and the driving chip.
In the display device provided in the embodiment of the present application, the display device further includes:
the first backboard is arranged on one side of the plane part, which is close to the binding part;
the second backboard is arranged on one side of the binding part close to the plane part;
the heat dissipation part is positioned at one side of the first backboard far away from the plane part;
the connecting part is positioned at one side of the second backboard, which is close to the heat dissipation part;
the flexible circuit board is positioned at one side of the binding part far away from the plane part, one end of the flexible circuit board is connected with the binding part, and the other end of the flexible circuit board is connected with the printed circuit board;
the support portion is located at one side of the heat dissipation portion away from the first backboard, the printed circuit board is located at one side of the support portion away from the heat dissipation portion, and the heat dissipation groove is located between the printed circuit board and the support portion.
The embodiment of the application provides a mobile terminal, which comprises a terminal main body and any one of the display devices, wherein the terminal main body and the display devices are combined into a whole.
The beneficial effects of the embodiment of the application are that: the embodiment of the application provides a display device and a mobile terminal, wherein a radiating groove is formed in a printed circuit board, the radiating groove is positioned on one side, close to a supporting part, of the printed circuit board, the radiating groove penetrates through the printed circuit board along a first direction, and air is filled in the radiating groove, so that heat released by a circuit board assembly can be transferred into the radiating groove to form radiating airflow to be released outside, and damage to organic materials irradiating into a display panel due to the fact that a driving chip generates scalding after long-time working is avoided; meanwhile, the heat conductivity coefficient of the air is smaller than that of the printed circuit board, and after the heat dissipation groove is filled with the air, the heat exchange speed between the printed circuit board and the display panel is reduced, so that heat generated by the driving chip can be timely discharged, and the reliability of the circuit board assembly is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a display device according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present disclosure;
FIG. 3 is a partial top view of a circuit board assembly provided in an embodiment of the present application;
FIG. 4 is a perspective view of a heat sink according to an embodiment of the present disclosure;
FIG. 5 is a side view of a heat sink provided in an embodiment of the present application;
FIG. 6 is a cross-sectional view of a heat sink according to an embodiment of the present disclosure;
fig. 7 is a schematic diagram of a second structure of a circuit board assembly according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The embodiment of the application provides a display device and a mobile terminal. The following will describe in detail. The following description of the embodiments is not intended to limit the preferred embodiments.
Fig. 1 is a schematic structural diagram of a display device according to an embodiment of the disclosure.
The present embodiment provides a display device 1, the display device 1 includes a display panel 10, a supporting portion 20, and a circuit board assembly 30, the display panel 10 includes a planar portion 11, a binding portion 13 disposed opposite to the planar portion 11, and a bending portion 12 connected between the planar portion 11 and the binding portion 13; the supporting portion 20 is disposed between the flat portion 11 and the binding portion 13; the circuit board assembly 30 is located the supporting part 20 is kept away from the one side of plane part 11, the circuit board assembly 30 with bind portion 13 and be connected, the circuit board assembly 30 includes printed circuit board 31 (printed circuitboard, PCB) and driving chip 32, printed circuit board 31 corresponds plane part 11 sets up, just printed circuit board 31 with the supporting part 20 is kept away from one side fixed connection of plane part 11, driving chip 32 set up in printed circuit board 31 is kept away from one side of supporting part 20.
Specifically, in this embodiment, the display device 1 further includes a first back plate 41, a heat dissipation portion 50, a connection portion 60, and a second back plate 42, where the first back plate 41 is disposed on a side of the planar portion 11 near the binding portion 13, the second back plate 42 is disposed on a side of the binding portion 13 near the planar portion 11, the heat dissipation portion 50 is disposed on a side of the first back plate 41 far from the planar portion 11, the connection portion 60 is disposed on a side of the second back plate 42 near the heat dissipation portion 50, the support portion 20 is disposed between the heat dissipation portion 50 and the connection portion 60, and the printed circuit board 31 is disposed on a side of the support portion 20 far from the heat dissipation portion 50.
The first back plate 41 may be connected with the planar portion 11 through a pressure-sensitive adhesive, so that in the film bending and adhering process, the deformation of the first back plate 41, the supporting portion 20 and the heat dissipation portion 50 due to the film compression of the display panel 10 is reduced, and the imprint of the display panel 10 is reduced.
The material of the supporting portion 20 includes, but is not limited to, a metal material or a plastic material, and the material of the supporting portion 20 is preferably one of an aluminum alloy, a stainless steel (SUS), an injection-molded copper sheet, a copper pillar or a thermoplastic polymer structure material (ABS), wherein when the material of the supporting portion 20 is a metal material, the supporting portion has a good heat conduction effect on the basis of having a strong supporting performance, so that heat generated by the display panel 10 is dissipated; the heat dissipation portion 50 is attached to a side of the support portion 20 near the display panel 10, the shape of the heat dissipation portion 50 is matched with that of the support portion 20, and the heat dissipation portion 50 includes, but is not limited to, a metal copper layer, a pressure sensitive adhesive layer, a white emulsion layer, a foam rubber layer, and a heat dissipation film layer, which are sequentially far away from the support portion 20.
The circuit board assembly 30 further includes a flexible circuit board 34, the flexible circuit board 34 is located at a side of the binding portion 13 away from the planar portion 11, one end of the flexible circuit board 34 is connected with the binding portion 13, and the other end of the flexible circuit board 34 is connected with the printed circuit board 31.
Further, in the present embodiment, a heat dissipation groove 31B is formed in the printed circuit board 31, the heat dissipation groove 31B is located at a side of the printed circuit board 31 close to the supporting portion 20, the heat dissipation groove 31B penetrates through the printed circuit board 31 along a first direction, and air is filled in the heat dissipation groove 31B, and the first direction is perpendicular to the light emitting direction of the display panel 10; the heat dissipation groove 31B is located between the printed circuit board 31 and the supporting portion 20, and the specific direction of the first direction is not limited in this embodiment, as long as the first direction is perpendicular to the light emitting direction of the display panel 10.
It should be noted that, in order to increase the screen ratio and reduce the size of the frame, a terminal bending technology (pad bending) is generally adopted in the prior art, and the protruding end of the flexible substrate 81 of the display device 1 is bent to the back of the display, and then the flexible circuit board, the driving chip and the printed circuit board are bound to the back of the flexible substrate 81, so as to realize the narrow frame of the non-display area; the driving chip can generate a burn-out problem after working for a long time, so that potential safety hazards exist in organic materials of the display panel at the connecting position of the driving chip, and the display screen has a yellowing display abnormal problem.
It can be appreciated that in this embodiment, the driving chip 32 is disposed on a side of the printed circuit board 31 away from the supporting portion 20, so that heat generated by the driving chip 32 is conducted to the printed circuit board 31, wherein a heat dissipation groove 31B is formed on the printed circuit board 31, the heat dissipation groove 31B is located on a side of the printed circuit board 31 close to the supporting portion 20, the heat dissipation groove 31B penetrates through the printed circuit board 31 along the first direction, and air is filled in the heat dissipation groove 31B, and the first direction is perpendicular to the light emitting direction of the display panel 10, so that heat released by the driving chip 32 can be transferred into the heat dissipation groove 31B to form a heat dissipation airflow to be released to the outside, thereby avoiding damage to the organic material of the display panel 10 due to a problem that the driving chip 32 is scalded after long-time operation; meanwhile, since the thermal conductivity of air is smaller than that of the printed circuit board 31, after the heat dissipation groove 31B is filled with air, the heat exchange speed between the printed circuit board 31 and the display panel 10 is reduced, so that the heat generated by the driving chip 32 can be timely discharged, and the reliability of the circuit board assembly 30 is improved.
Further, please refer to fig. 1 and 2; fig. 2 is a schematic diagram of a first structure of a circuit board assembly according to an embodiment of the present application.
In this embodiment, the printed circuit board 31 includes a multi-layered interlayer substrate 311 and a multi-layered metal layer 312, and the multi-layered interlayer substrate 311 and the multi-layered metal layer 312 are sequentially overlapped along a second direction Y, where the second direction Y is parallel to the light emitting direction of the display panel 10; in the second direction Y, the heat dissipation grooves 31B penetrate at least two layers of the interlayer substrate 311.
Specifically, in the second direction Y, one of the metal layers 312 is located at one side of the heat dissipation groove 31B, and the support portion 20 is located at the other side of the heat dissipation groove 31B; the material of the metal layer 312 includes, but is not limited to, tin (Sn), copper (Cu), chromium (Cr), palladium (Pd), nickel (Ni), gold (Au), aluminum (Al), or an alloy of the foregoing metal materials, and the material of the interlayer substrate 311 includes, but is not limited to, one or a combination of two or more of phenolic resin, glass fiber, and epoxy resin.
It can be appreciated that in this embodiment, the heat dissipation groove 31B is disposed in the second direction Y to penetrate through at least two layers of the interlayer substrates 311, and one metal layer 312 is disposed on one side of the heat dissipation groove 31B, and the supporting portion 20 is disposed on the other side of the heat dissipation groove 31B, so that the heat generated by the driving chip 32 can be released to the outside of the printed circuit board 31 through the heat dissipation groove 31B in time due to the fact that the material of the metal layer 312 and the material of the supporting portion 20 are both metal materials, and the heat conductivity coefficient of the metal materials is greater than that of air, and the heat dissipation groove 31B penetrates through the printed circuit board 31 in the first direction, so that after the heat dissipation groove 31B is filled with air, the heat exchange speed between the printed circuit board 31 and the display panel 10 is reduced, and the heat generated by the driving chip 32 can be released to the outside of the printed circuit board 31 in time, thereby avoiding the influence on the operation efficiency of the components due to the excessive temperature.
It should be noted that, in this embodiment, the number of layers of the metal layer 312 and the number of layers of the interlayer substrate 311 are not limited in particular; meanwhile, in this embodiment, the technical solution of the present application is illustrated by taking the second direction as the Y direction as an example.
Further, please refer to fig. 1, fig. 2 and fig. 3; fig. 3 is a partial top view of a circuit board assembly according to an embodiment of the present disclosure; in this embodiment, the printed circuit board 31 is provided with a plurality of through holes 31A, the plurality of through holes 31A are disposed corresponding to the driving chip 32, the through holes 31A penetrate through the printed circuit board 31, and the through holes 31A are communicated with the heat dissipation grooves 31B.
Specifically, the display device 1 includes a plurality of pads 35, the pads 35 being disposed around a Ground (GND), and the plurality of pads 35 being located between the driving chip 32 and the printed circuit board 31, the driving chip 32 being connected to the printed circuit board 31 through the plurality of pads 35; wherein, the plurality of through holes 31A are in one-to-one correspondence with the plurality of pads 35, and the through holes 31A penetrate through the printed circuit board 31 and expose a part of the pads 35.
Preferably, one of the metal layers 312 is fixedly connected to a plurality of the pads 35, and the material of the pads 35 includes, but is not limited to, a metal material including tin (Sn), copper (Cu), chromium (Cr), palladium (Pd), nickel (Ni), gold (Au), aluminum (Al), or an alloy of the above metal materials; it can be appreciated that in this embodiment, the plurality of through holes 31A and the bonding pads 35 are disposed on the printed circuit board 31, the through holes 31A and the bonding pads 35 provide a heat dissipation path for heat on the driving chip 32, and the metal material has good thermal conductivity, so that the heat generated by the driving chip 32 is effectively absorbed and released, so that the heat of the driving chip 32 can be effectively conducted to the printed circuit board 31, and the heat dissipation airflow is formed by the air in the heat dissipation groove 31B and released to the outside of the printed circuit board 31, thereby achieving a good heat dissipation effect of the circuit board device.
Further, please refer to fig. 1, fig. 2, fig. 4, fig. 5 and fig. 6; fig. 4 is a perspective view of a heat dissipation element according to an embodiment of the present application; FIG. 5 is a side view of a heat sink provided in an embodiment of the present application; fig. 6 is a cross-sectional view of a heat sink according to an embodiment of the present disclosure.
In this embodiment, the display device 1 further includes a heat dissipation assembly 33, where the heat dissipation assembly 33 is attached to a surface of the driving chip 32 on a side far away from the printed circuit board 31; wherein, the front projection area of the heat dissipation component 33 on the printed circuit board 31 is greater than or equal to the front projection area of the driving chip 32 on the printed circuit board 31.
It can be appreciated that in this embodiment, the heat dissipation component 33 is disposed on the side of the driving chip 32 away from the printed circuit board 31, the heat dissipation component 33 provides a heat dissipation path for heat on the driving chip 32, and the orthographic projection area of the heat dissipation component 33 on the printed circuit board 31 is greater than or equal to the orthographic projection area of the driving chip 32 on the printed circuit board 31, so as to further enhance the heat release effect on the driving chip 32.
Specifically, in the present embodiment, the heat dissipation assembly 33 includes a heat dissipation glue 331, a heat dissipation layer 332, and a plurality of heat dissipation fins 333, the heat dissipation layer 332 is connected to the driving chip 32 through the heat dissipation glue 331, and the plurality of heat dissipation fins 333 are disposed on a side of the heat dissipation layer 332 away from the driving chip 32; the front projection area of the heat dissipation layer 332 on the printed circuit board 31 is greater than or equal to the front projection area of the driving chip 32 on the printed circuit board 31, and the front projections of the plurality of heat dissipation fins 333 on the heat dissipation layer 332 are located in the heat dissipation layer 332.
Wherein the heat dissipation glue 331 covers a side of the driving chip 32 near the heat dissipation layer 332, the heat dissipation glue 331 is connected to the entire surface of the driving chip 32, and the material of the heat dissipation layer 332 includes, but is not limited to, a metal material including tin (Sn), copper (Cu), chromium (Cr), palladium (Pd), nickel (Ni), gold (Au), aluminum (Al), or an alloy of the above metal materials; it will be appreciated that, since the metal material has good thermal conductivity, the heat generated by the driving chip 32 is effectively absorbed and released, so that the heat of the driving chip 32 can be effectively transferred to the heat dissipation assembly 33.
Meanwhile, in this embodiment, the plurality of heat dissipating fins 333 are disposed on the side of the heat dissipating layer 332 away from the driving chip 32, so as to further increase the contact area between the heat dissipating component 33 and air, and further increase the heat dissipating area of the heat dissipating component 33, so as to improve the heat dissipating efficiency; preferably, the plurality of heat dissipating fins 333 are arranged on the heat dissipating layer 332 in a staggered manner, so that the direction of the heat dissipating airflow in the heat dissipating assembly 33 is changed, and the heat dissipating airflow is disturbed, thereby prolonging the flowing time of the heat dissipating airflow in the plurality of heat dissipating fins 333 and further improving the heat dissipating efficiency.
Further, the heat dissipation layer 332 and the plurality of heat dissipation fins 333 may be integrally formed; preferably, the front projection area of the heat dissipation layer 332 on the printed circuit board 31 is equal to the front projection area of the driving chip 32 on the printed circuit board 31, and the plurality of heat dissipation fins 333 are formed by extruding or cutting the heat dissipation layer 332; it can be appreciated that, in this embodiment, by setting the orthographic projection area of the heat dissipation layer 332 on the printed circuit board 31 to be equal to the orthographic projection area of the driving chip 32 on the printed circuit board 31, the heat dissipation layer 332 and the plurality of heat dissipation fins 333 may be integrally formed, so as to reduce the weight of the heat dissipation component 33, and improve the reliability of connection between the heat dissipation component 33 and the driving chip 32.
Note that, in this embodiment, the molding method of the heat dissipating fin 333 and the area of the heat dissipating member are not particularly limited; for example, in another embodiment, fig. 7 is a schematic diagram of a second structure of a circuit board assembly according to an embodiment of the present application; the heat dissipation layer 332 includes a groove 332A, the groove 332A is located at a side of the heat dissipation layer 332 close to the driving chip 32, the driving chip 32 is disposed in the groove 332A, and the heat dissipation adhesive 331 is disposed between an inner wall of the groove 332A and the driving chip 32; by arranging the driving chip 32 in the groove 332A, the heat dissipation layer 332 is disposed around the driving chip 32, so as to increase the heat dissipation area of the heat dissipation component 33, so as to improve the heat dissipation efficiency, and further improve the reliability and the service life of the driving chip 32.
Further, the display device 1 further includes a functional film layer 70 and a packaging structure 80, where the functional film layer 70 and the packaging structure 80 are sequentially disposed on a light-emitting side of the planar portion 11, the functional film layer 70 includes, but is not limited to, a polarizer located on a light-emitting side of the display panel 10, a front projection of the functional film layer 70 in a direction perpendicular to the display panel 10 completely covers the planar portion 11, a shape of the packaging structure 80 matches a shape of the functional film layer 70 and can be attached to a side, away from the display panel 10, of the functional film layer 70 by an adhesive layer, the packaging structure 80 includes, but is not limited to, a flexible substrate 81 and a flexible Cover plate 82 sequentially away from a body of the display panel 10, the flexible substrate 81 is located between the functional film layer 70 and the flexible Cover plate 82, wherein a material of the flexible substrate 81 includes, but is not limited to, one of Cover Glass (CW) and Ultra-Thin Glass (PW) and a flexible Cover Plate (PW) includes, but is not limited to, a combination of a flexible film (PW and a Cover plate) of a flexible film (Optically Clear AdhesiveOCA and a Cover plate); further, the material of the cover material protective film includes, but is not limited to, one of polyethylene terephthalate (polyethylene glycol terephthalate, PET) and transparent polyimide (Colorless Polyimide, CPI).
The film structure of the functional film layer 70 and the film structure of the packaging structure 80 are not particularly limited, for example, in an embodiment, the packaging structure 80 further includes a reworkable protection film (Circulating Protective Film, CPF) disposed on a side of the flexible cover plate 82 away from the flexible substrate 81, and the reworkable protection film is attached to a side of the flexible cover plate 82 away from the display panel 10, so that when the reworkable protection film is scratched during use, a repair point can be removed for replacement, thereby avoiding long-term appearance defects caused by scratches.
The present embodiment provides a mobile terminal, which includes a terminal body and the display device described in any one of the foregoing embodiments, where the terminal body and the display device are combined into a single body.
It will be appreciated that the display device has been described in detail in the above embodiments and will not be repeated here.
When the mobile terminal is specifically applied, the mobile terminal can be a display screen of a smart phone, a tablet personal computer, a notebook computer, a smart bracelet, a smart watch, smart glasses, a smart helmet, a desktop computer, a smart television or a digital camera and the like, and even can be applied to an electronic device with a flexible display screen.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
The foregoing has described in detail a display device and a mobile terminal provided by embodiments of the present application, and specific examples have been applied to illustrate the principles and embodiments of the present application, where the foregoing description of the embodiments is only for helping to understand the method and core ideas of the present application; meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.
Claims (10)
1. A display device, comprising:
the display panel comprises a plane part, a binding part arranged opposite to the plane part and a bending part connected between the plane part and the binding part;
a support portion disposed between the planar portion and the binding portion;
the circuit board assembly is positioned at one side of the supporting part far away from the plane part, the circuit board assembly is connected with the binding part, the circuit board assembly comprises a printed circuit board and a driving chip, the printed circuit board is arranged corresponding to the plane part, the printed circuit board is fixedly connected with one side of the supporting part far away from the plane part, and the driving chip is arranged at one side of the printed circuit board far away from the supporting part;
the printed circuit board is provided with a heat dissipation groove, the heat dissipation groove is positioned on one side, close to the supporting part, of the printed circuit board, the heat dissipation groove penetrates through the printed circuit board along a first direction, air is filled in the heat dissipation groove, and the first direction is perpendicular to the light emitting direction of the display panel.
2. The display device according to claim 1, wherein the printed circuit board comprises a plurality of interlayer substrates and a plurality of metal layers, the plurality of interlayer substrates and the plurality of metal layers being sequentially overlapped along a second direction, the second direction being parallel to a light emitting direction of the display panel;
and the heat dissipation grooves penetrate through at least two layers of the interlayer substrates in the second direction.
3. The display device according to claim 2, wherein in the second direction, one of the metal layers is located at one side of the heat sink, and the supporting portion is located at the other side of the heat sink.
4. The display device according to claim 1, wherein the printed circuit board is provided with a plurality of through holes, the plurality of through holes are provided corresponding to the driving chips, the through holes penetrate through the printed circuit board, and the through holes are communicated with the heat dissipation grooves.
5. The display device according to claim 4, wherein the display device includes a plurality of pads, a plurality of the pads being located between the driving chip and the printed circuit board, the driving chip being connected to the printed circuit board through the plurality of the pads;
the through holes are in one-to-one correspondence with the bonding pads, penetrate through the printed circuit board and expose part of the bonding pads.
6. The display device according to any one of claims 1 to 5, further comprising a heat dissipation member attached to a surface of the driving chip on a side away from the printed circuit board;
the front projection area of the heat dissipation assembly on the printed circuit board is larger than or equal to the front projection area of the driving chip on the printed circuit board.
7. The display device according to claim 6, wherein the heat dissipation assembly comprises a heat dissipation glue, a heat dissipation layer, and a plurality of heat dissipation fins, the heat dissipation layer is connected with the driving chip through the heat dissipation glue, and the plurality of heat dissipation fins are disposed on a side of the heat dissipation layer away from the driving chip;
the orthographic projection area of the heat dissipation layer on the printed circuit board is larger than or equal to the orthographic projection area of the driving chip on the printed circuit board, and orthographic projections of the plurality of heat dissipation fins on the heat dissipation layer are located in the heat dissipation layer.
8. The display device of claim 7, wherein the heat dissipation layer comprises a groove, the groove is located on a side of the heat dissipation layer close to the driving chip, the driving chip is disposed in the groove, and the heat dissipation adhesive is disposed between an inner wall of the groove and the driving chip.
9. The display device according to claim 1, characterized in that the display device further comprises:
the first backboard is arranged on one side of the plane part, which is close to the binding part;
the second backboard is arranged on one side of the binding part close to the plane part;
the heat dissipation part is positioned at one side of the first backboard far away from the plane part;
the connecting part is positioned at one side of the second backboard, which is close to the heat dissipation part;
the flexible circuit board is positioned at one side of the binding part far away from the plane part, one end of the flexible circuit board is connected with the binding part, and the other end of the flexible circuit board is connected with the printed circuit board;
the support portion is located at one side of the heat dissipation portion away from the first backboard, the printed circuit board is located at one side of the support portion away from the heat dissipation portion, and the heat dissipation groove is located between the printed circuit board and the support portion.
10. A mobile terminal comprising a terminal body and a display device according to any one of claims 1 to 9, the terminal body being integral with the display device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311347949.4A CN117460368A (en) | 2023-10-16 | 2023-10-16 | Display device and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311347949.4A CN117460368A (en) | 2023-10-16 | 2023-10-16 | Display device and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117460368A true CN117460368A (en) | 2024-01-26 |
Family
ID=89579058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311347949.4A Pending CN117460368A (en) | 2023-10-16 | 2023-10-16 | Display device and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117460368A (en) |
-
2023
- 2023-10-16 CN CN202311347949.4A patent/CN117460368A/en active Pending
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